JP2001102797A - Electronic component mounting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a transfer distance of an electronic component by mounting head from being increased depending on the position of a component-supply unit for supplying electronic components. SOLUTION: A component recognition camera 12 is disposed on an X- movement mount table 8. Then, the table 8 is moved to position the recognition camera 12 to a place nearest to a component-supply unit 4 for supplying the component. An electronic component is taken out by an installation head 9 and is recognized by the camera 12 then and is mounted on a substrate 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus in which a mounting head takes out an electronic component from a component supply unit and mounts the electronic component on a printed circuit board.

[0002]

2. Description of the Related Art An example of an electronic component mounting apparatus in which a mounting head takes out an electronic component from a component supply unit and mounts the electronic component on a printed circuit board will be described with reference to FIGS. According to this electronic component mounting apparatus, the component supply unit 80 is provided with the component supply unit 81, and the recognition camera 82 for recognizing the position of the electronic component taken out from the component supply unit 81 to the mounting head is provided by the component supply unit. 80 was fixed to the fixed base. The printed circuit board 85 transported by the transport conveyor 84 is also placed on the fixed table, and the mounting head takes out the electronic component from one component supply unit 81, and moves the mounting head itself to move the component onto the recognition camera 82. Is moved to a predetermined position on the printed circuit board 85.

[0003]

However, in the above-mentioned prior art, as shown in FIG. 5, when the component is taken out from the component supply unit 81 close to the recognition camera 82 and when the component is taken out from the component supply unit 81 far from the recognition camera 82, the moving distance is small. In contrast, when a component is taken out from the component supply unit 81 far from the camera 82, the mounting tact time is reduced by moving along a long path.

SUMMARY OF THE INVENTION It is an object of the present invention to prevent the mounting head from transporting the electronic component depending on the position of the component supply unit that supplies the electronic component.

[0005]

According to the present invention, there is provided an electronic component mounting apparatus in which a mounting head takes out an electronic component from a component supply unit and mounts the electronic component on a printed circuit board. And a component recognizing device for recognizing the position of the electronic component held by the mounting head on the table.

With this configuration, the printed circuit board and the component recognition device can be moved to the vicinity of the component supply unit from which the electronic component is to be taken out.

In the present invention, preferably, the component recognition device is provided on the component supply section side of the printed circuit board of the board mounting table, at an intermediate position in the direction of disposing the component supply unit on the printed circuit board. It is.

[0008] With this configuration, the moving path of the mounting head from the component recognition device to the substrate can be shortened.

The present invention preferably further comprises a transport device for transporting the printed circuit board in the direction in which the component supply unit is provided.

With this configuration, when the substrate is received from the transfer device, the substrate mounting table is moved to the receiving position,
In addition, the table can be moved to the transfer position to the transfer device when transferring to the transfer device.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described with reference to the drawings.

In the electronic component mounting apparatus shown in FIG. 1, a component supply unit 2 is provided on a base, and a printed board 3 is placed at a position different from the component supply unit 2. The substrate 3 is transported to the transport conveyor 6 and positioned on the X-movement placing table 8. Further, the substrate 3 on the table 8 is
Will be transferred above. The component supply unit 4 has component supply units 4 arranged side by side. The X-movement placing table 8 moves in the X direction, which is the direction in which the component supply unit 4 is disposed, in the direction in which the substrate 3 is transported.

Each of the component supply units 4 usually stores a large number of electronic components (not shown) of the same type and supplies the components to a predetermined supply position. Since they are stored, a large number of component supply units 4 collectively supply many types of components. The supply positions of the component supply units 4 are arranged on a straight line extending in the X direction in a state where the component supply units 4 are attached to the component supply unit 2, and are indicated by black circles.
The electronic components supplied by the component supply unit 4 are picked up by the mounting head 9 moving in the X and Y directions at the supply position and the printed circuit board 3
It is transported to the upper mounting position.

On the X-movement mounting table 8, a pair of chutes 1 for receiving and mounting the substrate 3 from the conveyor 6
1 is provided.
The component recognition camera 12 is fixed to the side. The printed board 3 is placed at the center of the chute 11 in the X direction, and the camera 12 is also fixed at the center of the chute 11 in the X direction.

The operation of the above configuration will be described below.

First, when the printed circuit board 3 is transferred from the upstream device by the transfer conveyor 6, the mounting table 8 moves to the transfer conveyor 6 side in the X direction in accordance with the transfer, and receives the substrate 3 from the transfer conveyor 6. . Further, the printed circuit board 3 is transported on the chute 11 and is positioned and fixed at the center of the chute 11 in the X direction. After receiving the substrate 3, the mounting table 8 moves to the side of the conveyor 7, and the component recognition camera 1 is located at the position closest to the component supply unit 4 that supplies the electronic components to be taken out first by the mounting head 9.
2 moves to stop. However, normally, since the component supply unit 4 for supplying the component to be taken out first is located at the left end in FIG. 1, the recognition camera 12 is stopped so as to be at the position closest to the unit 4 at the left end. further,
If the movable range to the left of the table 8 is the position shown in FIG. 2, after all, the table 8 does not move after the substrate 3 is received.

Next, the mounting head 9 picks up in accordance with mounting data in which the XY coordinate position of the substrate 3 to be mounted, the rotation angle position around the vertical axis, and the type of component to be mounted are specified for each mounting order (not shown). The electronic component to be sucked is sucked from the component supply unit 4 at the left end as shown in FIG.

Next, the mounting head 9 is mounted on the component recognition camera 12.
It is recognized with respect to the XY directions and the rotation angle how much the electronic component is moved up and held with respect to the mounting head 9.

Next, the mounting head 9 moves to mount the electronic component on the printed board 3 at the mounting position indicated by the mounting data. At this time, the table 8 may not move, and only the mounting head 9 may move in the X and Y directions to stop the electronic component at the position indicated by the mounting data. However, only the table 8 moves in the X direction. Alternatively, both the table 8 and the mounting head 9 may be moved and positioned.
However, when the table 8 moves, the recognition camera 12
Therefore, the table 8 must be moved after the imaging of the electronic component is completed. In addition, the mounting head 9 itself is rotated by a rotation driving mechanism (not shown) mounted on each head 9 to correct the positional deviation of the rotation angle of the electronic component sucked to the mounting head 9 before mounting the component.

Next, the mounting head 9 moves toward the unit 4 for supplying the next component to be taken out. Usually, it moves toward the second unit 4 from the left end. In order to shorten the moving distance at this time, it is preferable to move only the table 8 when mounting the first component to position the component in the X direction.

The table 8 has a camera 12 from the left.
It is moved to the shortest position by the second unit 4, but if it moves outside the movable range as shown in FIG. 2, it stops at the position shown in FIG.

In this way, the mounting of the electronic component on the printed circuit board 3 is continued. For example, when the electronic component is supplied from the central supply unit 4 as shown in FIG. The center of the camera 12 and the component pick-up position of the unit 4 are aligned in the X direction so as to be the shortest in the supply unit 4, the components are picked up, the mounting head 9 is moved only in the Y direction, and the electronic components are positioned on the camera 12. And perform imaging.

Next, a component recognition process is performed, and only the mounting head 9 or the table 8 is moved so that the electronic component is positioned at the position specified in the mounting data, and the electronic component is mounted.

Next, electronic components are taken out from the supply unit 4 on the right side and are mounted on the board 3.

Next, when the last component indicated by the mounting data is mounted on the board 3, the printed board 3 is transferred from the table 8 to the transport conveyor 7, and the table 8 transfers the printed board 3 to the transport conveyor 7. To the position where it can be transferred to the conveyor 7 side.

However, if the position of the table 8 when the last electronic component is mounted is such a position, the substrate 3 is transferred as it is.

In the present embodiment, the recognition camera 12 is moved so as to be closest to the supply unit 4 from which components are to be taken out. The position in the direction may be positioned at the position closest to the supply unit 4 from which components are to be removed from the beginning. Even in this case, since the camera 12 is fixed on the table 8 (and at the center), the moving distance to the camera 12 is not too long.

[0028]

As described above, according to the present invention, there is provided a printed circuit board mounting table which moves in the direction in which the component supply unit of the component supply unit is disposed, and the electronic component held by the mounting head on the table. Is provided, the printed circuit board and the component recognition device can be moved to the vicinity of the component supply unit from which the electronic component is to be taken out.

Further, according to the present invention, the substrate placing table can be moved to the receiving position when the substrate is received from the transfer device, and the table can be moved to the transfer position to the transfer device when the substrate is transferred to the transfer device. In addition, the transfer time of the printed circuit board can be shortened.

[Brief description of the drawings]

FIG. 1 is a plan view showing an electronic component mounting apparatus.

FIG. 2 is a plan view showing a movement path of a mounting head of the electronic component mounting apparatus.

FIG. 3 is a plan view showing a movement path of a mounting head of the electronic component mounting apparatus.

FIG. 4 is a plan view showing a conventional electronic component mounting apparatus.

FIG. 5 is a plan view showing a movement path of a mounting head of an electronic component mounting apparatus according to the related art.

[Explanation of symbols]

2 Component Supply Unit 3 Printed Circuit Board 4 Component Supply Unit 6 Transport Conveyor (Transport Device) 7 Transport Conveyor (Transport Device) 8 X Movement Placement Table (Printed Circuit Board Placement Table) 9 Mounting Head 12 Component Recognition Camera (Component Recognition Device)

Claims (3)

[Claims] 1. An electronic component mounting apparatus in which a mounting head takes out an electronic component from a component supply unit and mounts the electronic component on a printed circuit board. The electronic component mounting apparatus mounts the printed circuit board and moves at least in a direction in which the component supply unit of the component supply unit is arranged. An electronic component mounting apparatus, comprising: a printed circuit board mounting table; and a component recognition device for recognizing a position of an electronic component held by the mounting head on the table. 2. The apparatus according to claim 1, wherein the component recognition device is provided on the component supply unit side of the printed circuit board of the table and at an intermediate position in a direction in which the component supply unit of the printed circuit board is arranged. An electronic component mounting device according to claim 1. 3. The electronic component mounting device according to claim 1, further comprising a transport device that transports the printed circuit board in a direction in which the component supply unit is disposed.