JP4056649B2 - Electronic component mounting apparatus and mounting method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting apparatus and mounting method for mounting an electronic component on a substrate.
[0002]
[Prior art]
In an electronic component mounting apparatus, a large number of parts feeders such as a tape feeder are provided, and in these parts feeders, a plurality of types of electronic components are supplied to a pickup position by a transfer head. When the production target product is switched, the parts feeders are rearranged and exchanged with other parts feeders.
[0003]
[Problems to be solved by the invention]
Arrangement operations such as rearrangement and replacement of the parts feeders have been performed according to feeder arrangement data created in advance prior to the conventional product type switching. This feeder arrangement data indicates the relationship between the type of electronic component stored in each part feeder and the part feeder arrangement. For this reason, in the parts feeder arrangement work, the operator needs to install the specified parts feeder at the specified position of the supply unit in accordance with the feeder arrangement data created in advance. It took time and effort. When there is an arrangement mistake in the arrangement work, there is a problem that an adsorption error or a mounting error may occur.
[0004]
SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component mounting apparatus and mounting method that can easily arrange parts feeders and reduce suction errors and mounting errors.
[0005]
[Means for Solving the Problems]
The electronic component mounting apparatus according to claim 1 is an electronic component mounting apparatus that picks up an electronic component by a transfer head from a parts feeder arranged in parallel in a supply unit of the electronic component and mounts the electronic component on a substrate. A mounting data storage unit that stores the type of electronic component mounted on the substrate to be mounted and mounting data that is mounting coordinate data, and a type of electronic component that is provided in the part feeder and stored in the part feeder Component data storage means, a data reading section for reading the type of electronic component stored in the parts feeder from the part data storage means by mounting the parts feeder on the supply section, and the read electronic component automatically generating feeder arrangement data types in random order associated with the mounting position of the part feeders mounted on the supply unit That the feeder arrangement data generating unit, and a feeder arrangement data storage section for storing the generated layout data, mounting operation sequence by the transfer head is created based on the mounting data and the feeder arrangement data.
[0006]
The electronic component mounting method according to claim 2 is a mounting method of an electronic component that picks up an electronic component by a transfer head from a parts feeder arranged in parallel in a supply unit of the electronic component and mounts the electronic component on a substrate. Electronic data stored in the parts feeder by storing part data representing the type of electronic parts stored in the parts feeder in the parts data storage means provided in the parts feeder and mounting the parts feeder on the supply unit The type of the component is read from the component data storage means, and feeder arrangement data representing the relationship between the type of the read electronic component and the mounting position of the parts feeder mounted on the supply unit in any order is generated, and this feeder arrangement Data and the type of electronic component mounted on the board to be mounted, and mounting data that is mounting coordinate data Carry out the implementation work on the basis of made the mounting operation sequence.
[0007]
According to the present invention, parts data representing the types of electronic parts stored in the parts feeder are stored in each parts feeder, and the feeder data is automatically generated by reading the parts data. It can be mounted at an arbitrary position, and the efficiency of arrangement work and the prevention of problems due to arrangement mistakes are realized.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a block diagram showing the configuration of a control system of the electronic component mounting apparatus, and FIG. 3 is a flowchart of the electronic component mounting method. It is.
[0009]
First, the structure of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 1, a transport path 2 is disposed at the center of the base 1. The conveyance path 2 conveys the board 3 and positions the board 3 at the electronic component mounting position. On both sides of the conveyance path 2, electronic component supply units 4 are provided. The supply unit 4 is provided with a large number of tape feeders 5 which are parts feeders. The tape feeder 5 supplies chips as electronic components to the pickup position 5a. These tape feeders 5 are individually provided with a storage device 5b. As will be described later, each tape feeder stores feeder data such as a chip type and a learning value of a chip position shift amount unique to each tape feeder at the pickup position 5a. ing. Therefore, the storage device 5b of the tape feeder 5 is a component data storage means.
[0010]
A Y-axis table 8A and a slide guide 8B are arranged in parallel on both ends of the upper surface of the base 1, and an X-axis table 7 is installed on the Y-axis table 8A and the slide guide 8B. A transfer head 6 is mounted on the X-axis table 7, and the transfer head 6 moves horizontally by driving the X-axis table 7 and the Y-axis table 8 A, and picks up a chip from the pickup position 5 a of the tape feeder 5. And mounted on the substrate 3. During the operation from the pickup to the mounting, the chip picked up and held by the nozzle of the transfer head 6 by vacuum suction is imaged from below by the camera 9, and the amount of positional deviation with respect to the nozzle of the transfer head 6 is detected. The
[0011]
Next, the control system will be described with reference to FIG. In FIG. 2, a CPU 10 is an overall control unit, and performs operation control and calculation of each unit described below according to various programs stored in the program storage unit 11. The program storage unit 11 stores programs necessary for various operations and processes. The mounting data storage unit 12 stores mounting data such as the type of chip mounted on the substrate 3 to be mounted and mounting coordinate data. The feeder arrangement data storage unit 13 stores feeder arrangement data that associates the types of chips stored in the tape feeder 5 mounted in the supply unit with the arrangement position of the tape feeder 5 in the supply unit 4. The learned value storage unit 14 stores, for each tape feeder, a learned value of the amount of misalignment that occurs when a chip is picked up from each tape feeder 5, that is, the amount of misalignment of the chip unique to each tape feeder 5.
[0012]
The feeder arrangement data generation unit 15 automatically generates feeder arrangement data by associating the chip type data read from each tape feeder 5 with the mounting position of each tape feeder. The generated feeder arrangement data is stored in the feeder arrangement data storage unit 13.
[0013]
The learning value calculator 16 is a chip unique to each tape feeder at the pickup position based on the positional deviation amount data obtained by recognizing the image picked up by the camera 9 with the chip picked up from each tape feeder 5. The learning value of the amount of positional deviation is calculated. The learned value obtained here is stored in the learned value storage unit 14 as data for each tape feeder 5.
[0014]
The motor drive unit 17 drives the X-axis motor 18, the Y-axis motor 19, and the head Z-axis motor 20 provided on the X-axis table 7, the Y-axis table 8 A, and the vertical movement table (not shown) of the transfer head 6. To do. The image recognition unit 21 detects the position of the chip held by the nozzle of the transfer head 6 by performing image processing on the image data captured by the camera 9, and calculates the relative positional deviation amount of the chip with respect to the nozzle. Ask.
[0015]
The data writing unit 22 and the data reading unit 23 write data to the storage device 5b provided in the tape feeder 5 attached to the supply unit 4 and read data from the storage device 5b. The feeder data written / read here is the above-described chip type data and learned value data of the amount of chip position deviation at the pickup position.
[0016]
The electronic component mounting apparatus is configured as described above, and the operation will be described along the flow of FIG. First, in the mounting operation, a setup change operation accompanying the product type change is performed, and the supply unit 4 rearranges the tape feeder 5 (ST1). At the time of this rearrangement, each tape feeder is mounted based only on data indicating the chip type necessary for mounting on the mounting target board. That is, the operator does not need to consider the mounting position in the supply unit 4 of the tape feeder that stores the chip type, and it is only necessary to mount the tape feeder in any order.
[0017]
By mounting the tape feeder, from the storage device 5b of each tape feeder 5, the data reading unit 23 causes the feeder data of each tape feeder, that is, the chip type stored in the tape feeder and the pick-up position of the tape feeder. The learning value of the specific positional deviation amount is read (ST2). The read chip type data is sent to the feeder arrangement data generation unit 15, where the feeder arrangement data is automatically generated (ST3). Thereby, each tape feeder 5 in the supply unit 4 is associated with the chip type, and a mounting operation sequence by the transfer head 6 is created by the CPU 10 based on the feeder arrangement data and the mounting data described above.
[0018]
Next, the mounting operation is started according to the created mounting operation sequence (ST4). At the start of the mounting operation, the position of the transfer head 6 at the time of pickup is corrected based on the learning value read from each tape feeder 5, and the chip picked up from the tape feeder 5 for each mounting operation is further captured by the camera 9. Recognizing and detecting the amount of misalignment of the chip relative to the nozzle (ST5). Then, based on the position shift detection result, the learning value of the position shift amount is updated. That is, the learning value storage unit 14 always stores the updated learning value, and the position correction at the time of pickup is performed based on the learning value.
[0019]
If a part break occurs during the mounting operation (ST7), the learning value at that time is stored by the data writing unit 22 in the storage device 5b of the tape feeder 5 where the part break occurs (ST8). Thereby, the tape feeder 5 always stores the latest learning value. Then, the tape feeder 5 whose parts are cut is replaced with a new tape feeder 5. Thereafter, returning to ST2, the feeder data is read from the new tape feeder 5, and the same processing as described above is performed.
[0020]
Further, while the mounting is continued without causing any parts to be cut off, it is determined whether or not the scheduled mounting operation is completed (ST10). If the mounting is continued, the process returns to ST5 and the same mounting operation is continued. If the mounting is completed, the learning value at that time is stored in each tape feeder 5 of the supply unit 4 to update the learning value (ST11), and then the mounting operation is terminated. As a result, the tape feeder 5 always stores the updated learning value, and when the mounting operation is resumed next time, even when the tape feeder 5 is mounted on another mounting apparatus, the learning value unique to each tape feeder is stored. Can be read by the mounting apparatus. As a result, the mounting device can correct the position at the time of pick-up using this learning value, which greatly reduces problems such as pick-up mistakes caused by position shifts that occurred when switching the product type in the conventional mounting device. Can be reduced.
[0021]
【The invention's effect】
According to the present invention, the part data representing the type of electronic part stored in the parts feeder is stored in each part feeder, and the feeder arrangement data is automatically generated by reading this part data. In the feeder arrangement work, the operator only needs to mount the parts feeder at an arbitrary position, so that the efficiency of the arrangement work and errors due to arrangement mistakes can be eliminated.
[Brief description of the drawings]
FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 2 is a block diagram showing a configuration of a control system of an electronic component mounting apparatus according to an embodiment of the present invention. Flow diagram of electronic component mounting method according to one embodiment of the present invention
3 Substrate 4 Supply unit 5 Tape feeder 5b Storage device 6 Transfer head 9 Camera 10 CPU
13 Feeder Arrangement Data Storage Unit 15 Feeder Arrangement Data Generation Unit 22 Data Writing Unit 23 Data Reading Unit

Claims (2)

An electronic component mounting apparatus that picks up an electronic component from a parts feeder arranged in parallel in a supply unit of the electronic component by a transfer head and mounts the electronic component on a substrate, the electronic component being mounted on the substrate to be mounted A mounting data storage unit that stores mounting data that is type and mounting coordinate data, a component data storage unit that is provided in the parts feeder and stores the type of electronic component stored in the parts feeder, and the parts feeder A data reading unit that reads from the component data storage means the types of electronic components stored in the parts feeder by being mounted on the supply unit, and parts that are mounted on the supply unit in any order. Feeder arrangement data generation unit that automatically generates feeder arrangement data in association with feeder mounting positions, and generation And a feeder arrangement data storage section for storing configuration data, apparatus for mounting an electronic component, characterized in that mounting operation sequence by the transfer head is created based on the mounting data and the feeder arrangement data. An electronic component mounting method for picking up an electronic component from a parts feeder arranged in parallel in a supply unit of the electronic component by a transfer head and mounting the electronic component on a substrate, the component data storage means provided in the part feeder By storing component data representing the type of electronic component stored in the part feeder and mounting the part feeder on the supply unit, the type of electronic component stored in the part feeder is read from the component data storage unit. The feeder arrangement data representing the relationship between the read electronic component type and the attachment position of the parts feeder attached to the supply unit in any order is generated, and the feeder arrangement data and the mounting target board are mounted. Based on electronic component type and mounting operation sequence created by mounting data, which is mounting coordinate data Mounting method of electronic components and performs mounting operation Te.

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