JPH1168395A - Surface mounter - Google Patents

Abstract

PROBLEM TO BE SOLVED: To effectively suppress a size of a head unit of a surface mounter having a plurality of nozzles on the head unit and capable of checking the suction of a component by an optical detection means. SOLUTION: A plurality of heads 20a to 20d are set in a row in X-axis direction on a head unit and each laser unit 30 is correspondingly set to these 20a to 20d. Each laser unit 30 is set with its laser generator and detector aligned in a row in X-axis direction and the adjacent laser units are alternately offset up and down. Every head 20a to 20d and laser unit 30 are arranged so that the distance among 20a to 20d is made extremely small to an extent of the parallel beam of each laser unit 30 without being blocked by the head 20a to 20d, and every adjacent heads 20a to 20d are alternately offset up and down.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mounter, and more particularly, to an optical detecting means which comprises a plurality of heads each having a suction nozzle in a head unit and detects a suction state of a component based on detection of a projection. The present invention relates to a surface mounter provided.

[0002]

2. Description of the Related Art Heretofore, a print head in which a head having a suction nozzle is mounted on a movable head unit and a small electronic component such as an IC is sucked and positioned from a tape feeder or the like of a component supply unit. A surface mounter (hereinafter simply referred to as a mounter) which is transferred onto a substrate and mounted on a predetermined position on a printed circuit board is generally known. Recently, light is applied to a sucked component to irradiate the component. An apparatus has been developed which is provided with an optical detection means for detecting a projection, and based on the detection of the projection, checks a suction state of a component, for example, a shift or a tilt of a suction position with respect to a head, and corrects a mounting position. I have.

In particular, there has been proposed a mounting machine in which an optical detection means is mounted on the above-mentioned head unit, and the state of suction of components is checked by utilizing the movement period of the head unit from component suction to mounting. In this mounting machine, an irradiating section and a light receiving section are arranged at opposing positions sandwiching a space through which the suction nozzle passes, and a parallel light beam is emitted from the irradiating section to the sucked component, and the light receiving section receives the parallel light. By detecting the projection width of the component, the suction state of the component can be checked.

[0004]

By the way, in the mounting machine in which the optical detecting means is mounted on the head unit as described above, in recent years, a plurality of heads have been mounted on the head unit. In the mounting machine described above, it is required to check the suction state of the component sucked by each head in a short time while the head unit is moving.

For this reason, the optical detecting means is configured to simultaneously project the components adsorbed on the respective heads.
In general, as shown in FIG. 10, an optical detection unit including an irradiation unit 51 and a light receiving unit 52 that can irradiate and receive a wide parallel light beam 53 over the direction in which each head 50 is arranged, Alternatively, as shown in FIG. 11, an irradiating unit 51 and a light receiving unit 52 for the parallel light beam 53 are provided for each head 50, and an optical detecting unit in which these are arranged in a line in the head arrangement direction is configured. I have.

However, in the conventional configurations shown in these figures, if the size of the components to be sucked increases, there is a possibility that the adjacent components interfere with each other and the suction state of both components cannot be checked at the same time. Therefore, it is necessary to set the interval between the heads wide in advance, assuming a component of the maximum size to be mounted. Therefore, there is a problem that it is easy to promote an increase in the size of the head unit, specifically, an increase in the head arrangement direction. However, such an increase in the size of the head unit greatly affects the inertia during the movement of the head unit, and is a negative factor for speeding up mounting processing and the like.

SUMMARY OF THE INVENTION In view of the above circumstances, the present invention provides a head unit having a plurality of heads each having a suction nozzle, and detects the suction state of a component sucked by each suction nozzle by an optical detecting means mounted on the head unit. It is an object of the present invention to provide a surface mounter configured to be checked, which can effectively suppress an increase in the size of a head unit.

[0008]

In order to achieve the above object, the present invention provides a head unit in which a plurality of heads having nozzles for picking up parts are mounted in a line, and a light irradiation part and a light receiving part are provided. A surface mounter having an optical detection means for examining a component suction state based on detection of a projection of the component sucked by the nozzle, wherein the optical detection means corresponds to each head. Consisting of a plurality of unit detecting means having a light irradiating unit and a light receiving unit, each unit detecting means is arranged so that the light irradiation and light receiving directions of each unit detecting means are in the same direction, and at least one unit detecting means is provided. The means is vertically offset with respect to the unit detecting means adjacent thereto, and the interval between the heads is set such that the unit detecting means partially overlaps the unit detecting means adjacent thereto.

According to this device, since the intervals between the heads are set so that at least one set of adjacent unit detecting means overlaps in the head disposing direction, a comparison is made with a conventional device of this type. Thus, it is possible to suppress an increase in the size of the head unit in the head disposition direction by an amount corresponding to the overlap of the unit detection means. Moreover, since the unit detecting means are vertically offset from each other as described above, even if the parts are sized to interfere with each other when they are arranged on the same plane, the suction state of these parts is simultaneously checked by each unit detecting means. be able to.

[0010] In particular, in the above-mentioned surface mounting machine, if the unit detecting means are alternately arranged so as to vertically overlap each other, it is possible to more effectively suppress an increase in the size of the head unit in the head disposing direction. It is possible to minimize the vertical size of the head unit. Further, it is easy to make the structure of the lifting mechanism of each head common.

[0011]

Embodiments of the present invention will be described with reference to the drawings.

FIGS. 1 and 2 show an example of a surface mounter according to the present invention. As shown in FIG. 1, a conveyor 2 for transporting a printed board is disposed on a base 1 of a surface mounter (hereinafter, abbreviated as a mounter), and a printed board 3 is transported on the conveyor 2. Is stopped at the mounting work position.

On the front and rear sides of the conveyor 2, component supply units 4 are provided. Each component supply unit 4 includes:
Each of the tape feeders 4a has a plurality of rows of tape feeders 4a, and each of the tape feeders 4 accommodates small pieces of components such as ICs, transistors, and capacitors at predetermined intervals so that the held tape is led out from the reel. ,
A ratchet type feeding mechanism is provided at the tape feed-out end, and the tape is fed out intermittently as components are picked up by the head unit 5 described later.

Above the base 1, a head unit 5 for mounting components is mounted.
Can move in the X-axis direction (the direction of the conveyor 2) and the Y-axis direction (the direction orthogonal to the X-axis on a horizontal plane).

That is, a pair of fixed rails 7 extending in the Y-axis direction and a ball screw shaft 8 driven to rotate by a Y-axis servomotor 9 are disposed on the base 1. A head unit support member 11 is disposed on the support member 11, and a nut portion 12 provided on the support member 11 is screwed to the ball screw shaft 8. A guide member 13 extending in the X-axis direction and a ball screw shaft 14 driven by an X-axis servomotor 15 are disposed on the support member 11 so that the head unit 5 can move on the guide member 13. A nut portion (not shown) provided in the head unit 5 is screwed to the ball screw shaft 14. The ball screw shaft 8 is rotated by the operation of the Y-axis servo motor 9 to move the support member 11 in the Y-axis direction, and the ball screw shaft 14 is rotated by the operation of the X-axis servo motor 15, thereby causing the head unit to rotate. 5 moves in the X-axis direction with respect to the support member 11.

As shown in FIG. 3, the head unit 5
Are provided with a plurality of heads, and in the illustrated example, four heads 20a to 20d are arranged in a line in the X-axis direction.

Each of the heads 20a to 20d is capable of moving up and down and rotating with respect to the frame of the head unit 5, and although not shown in detail, lifting and lowering driving means using a Z-axis servo motor 24 as a driving source. And an R-axis servo motor 26 as a drive source. Further, each of the heads 20a-20
At the lower end of d, a nozzle 21 for picking up components is provided.
Is supplied with a negative pressure, and the components are sucked by the suction force of the negative pressure.

The head unit 5 is further provided with a laser unit 30 (unit detecting means) for detecting the suction state of the component sucked by each nozzle 21 based on the projection, corresponding to each of the heads 20a to 20d. ing.

As shown in FIG. 4, the laser unit 30 has a laser generator 31a (irradiation unit) and a detector 31b (a laser unit) which face each other across a space through which the nozzle 21 of each of the heads 20a to 20d moves up and down. A light receiving section), and irradiates the attracted component with the parallel light beam 32 to detect the projection of the component.

Here, the arrangement of the laser units 30 and the heads 20a to 20d will be described in more detail. As shown in FIG. 3 and FIG. The laser units 30 adjacent to each other are alternately offset vertically. In the illustrated example, the laser unit 30 corresponding to the heads 20a and 20c and the laser unit 30 corresponding to the heads 20b and 20d are relatively vertically offset.

The heads 20a to 20d are set so that the distance between the heads 20a to 20d is as small as possible within a range where the parallel rays of the laser units 30 are not blocked by the heads 20a to 20d. By arranging the laser units 30 in response to this, the adjacent heads 20a to 20d are alternately arranged vertically. At this time, the plurality of heads 20a to 20a
d so that the components can be simultaneously sucked from the component supply unit 4 by taking into account the arrangement of the tape feeders 4a.
Arrangements such as 0a to 20d are set. In FIG. 5, the laser units 30 located on the upper side (that is, the laser units 30 corresponding to the heads 20a and 20c) are hatched for easy understanding of the positional relationship between the laser units 30.

According to the mounting machine configured as described above,
At the time of mounting, each head 20a to 20 of the head unit 5 is mounted.
After the component is sucked from the component suction unit 4 by d, as shown in FIG. 6, each suction component is raised to a height position corresponding to each laser unit 30 so as to be located between the laser generation unit 31a and the detector 31b. Correspondingly, the projection of each component can be detected by each laser unit 30 to simultaneously check the suction state of each component. In particular, by performing such detection of the projection during the movement of the head unit 5, that is, during the movement of the head unit 5 to the mounting position after the components are sucked, the mounting efficiency can be increased.

Further, due to the structure of the head unit 5, as described above, the adjacent laser units 30 are alternately vertically offset, and the adjacent laser units 30 are offset.
Since the intervals between the heads 20a to 20d are set so that the intervals between the heads 20a to 20d are as narrow as possible to the extent that they overlap, the head unit 5 has a plurality of heads 20a to 20d and Laser unit 3
Despite the configuration in which the head unit 5 is mounted, there is a feature that the enlargement of the head unit 5 in the X-axis direction can be effectively suppressed as compared with a conventional mounting machine of this type.

That is, in a conventional mounter of this type (the apparatus shown in FIG. 10) in which a head unit is provided with a plurality of heads and a laser unit corresponding to the heads, when the target components become large, the components interfere with each other, and May not be able to be detected simultaneously. Therefore, when the size of the target component is increased, it is necessary to set the head interval to be wider according to the size, and it is easy to promote the increase in the size of the head unit in the X-axis direction.

However, according to the mounting machine of the above embodiment,
As described above, even if the interval between the heads 20a to 20d is set as small as possible so that the adjacent laser units 30 overlap each other, the adjacent laser units 30 are alternately vertically offset. For example, FIG.
As shown in FIG. 7, even if components are sized to interfere with each other when they are arranged on the same plane, the suction state of each component can be checked by the laser unit 30 at the same time. for that reason,
Compared with a conventional mounting machine of this type, the size of the head unit 5 in the X-axis direction can be suppressed by the overlap of the laser unit 30.

Incidentally, the head unit 5 as described above is used.
In the configuration shown in FIG. 7, in the case shown in FIG.
If the order of mounting the components is set to be unlimited, the components may interfere with each other and fall off. For example, a component that detects projection by the laser unit 30 located on the upper side (for example, a component that is attracted to the head 20a) and a component that detects projection by the laser unit 30 that is located on the lower side (for example, is attracted to the head 20b). If the components are mounted before the components, the components may interfere with each other when the head is moved up and down, and may fall off. Similarly, there is also a problem of interference between components when picking up components. Therefore, in the mounting machine, it is necessary to control the mounting operation so as to avoid such interference between the components when the components are sucked and mounted.

FIG. 8 is a flowchart showing an example of such a suction mounting operation. The suction mounting operation will be described below. The component recognition (determination of the suction failure and the detection of the displacement of the suction position) is performed using the laser unit 30 between the suction and the mounting, but the component recognition processing itself is conventionally known, and thus the description thereof is omitted.

In this flow, first, the head unit 5
Is moved to the first component suction position (n = 1) of the component supply unit 4 to suck components (steps S1 to S3). The suction of the components is performed by the heads 20a and 20 corresponding to the laser unit 30 disposed above the laser unit 30.
c (hereinafter referred to as upper heads 20a and 20c). At this time, if possible, the heads 20a, 20c
Alternatively, parts are simultaneously sucked by the heads 20b and 20d.

When the picking up of the component at the picking position is completed, it is determined whether or not there is another component to be picked up (step S4). The component is moved to the component suction position (n + 1) (step S5), and the component is similarly sucked.

Next, it is determined whether or not there is a component to be mounted, that is, whether or not a component to be mounted on the head unit 5 is sucked (step S6). If there is a mounted component, an initial set of the mounting order m (step S7)
After that, it is determined whether or not the preset mounting order of the m-th head is the upper heads 20a and 20b (step S8).

If the head is not the upper head, the head unit 5 is moved to the target position (step S9), and the components adsorbed on the head are mounted on the printed circuit board 3 and the operation proceeds to step S7. The process proceeds (step S10). On the other hand, if the head is the upper head in step S8, it is determined whether or not the suction component interferes with another unmounted component (step S11).
If there is no interference, the process moves to step S9 to mount the component. If the components interfere with each other in step S11, the process proceeds to step S12.

Then, in step S12, data relating to the number of heads is incremented, and the data (m
+1) exceeds the number of heads (step S).
13) If not, return to step S8; otherwise, return to step S6.

When the mounting of all the components adsorbed on the heads 20a to 20d is completed (NO in step S6), the process returns to the start.

According to such a mounting operation, it is possible to reliably prevent interference between components when the components are sucked and mounted by the heads 20a to 20d, while adopting the configuration of the head unit 5 as described above. it can.

The mounting machine of the above embodiment is an example of the surface mounting machine according to the present invention, and its specific configuration can be changed as appropriate without departing from the gist of the present invention.

For example, in the above embodiment, each head 20
a to 20d are alternately vertically offset in the X-axis direction. However, as shown in FIG. 9, the head disposed on the right side (the right side in FIG. 9) is always offset downward. Each of 20a to 20d may be arranged stepwise. In short, if the adjacent heads are arranged vertically offset, the specific arrangement is appropriately selected in consideration of the specific configuration such as the vertical stroke of the head unit 5 and the heads 20a to 20d. What should I do?

However, according to the structure as shown in FIG. 3, since there is no significant difference in the up-and-down stroke of each of the heads 20a to 20d when sucking and mounting components, a common mechanism is used as the up-and-down mechanism of the heads 20a to 20d. In addition, there is an advantage that the size of the head unit 5 in the vertical direction can be suppressed as compared with the configuration shown in FIG.

Further, in addition to the configuration in which all the laser units 30 are vertically offset from each other as in the above-described embodiment, some of the laser units 30 are arranged to be offset. For example, the heads 20a to 20c May be arranged side by side at the same height as in the related art, and the laser unit 30 corresponding to the remaining head 20d may be offset vertically with respect to the other laser units 30.

[0039]

As described above, the present invention relates to a surface mounter having a plurality of heads mounted on a head unit and an optical detection means for detecting a projection of a component adsorbed on each head. The optical detecting means is constituted by a plurality of unit detecting means having a light irradiating part and a light receiving part corresponding to each head, and each unit is so arranged that the light irradiating and light receiving directions of each unit detecting means are in the same direction. Along with disposing the detecting means, at least one unit detecting means is vertically offset with respect to the unit detecting means adjacent thereto,
Since the spacing between the heads is set so that the unit detecting means partially overlaps with the unit detecting means adjacent thereto, the heads are compared with the conventional surface mounter of this type by an amount corresponding to the overlapping of the unit detecting means. An increase in the size of the head unit in the disposition direction can be suppressed.

In particular, in this surface mounter, if each unit detecting means is arranged so that each unit detecting means alternately vertically overlaps, it is more effective to increase the size of the head unit in the head disposing direction. And the size of the head unit in the vertical direction can be minimized. Further, it is easy to make the structure of the lifting mechanism of each head common.

[Brief description of the drawings]

FIG. 1 is a schematic plan view showing an example of a surface mounter to which the present invention is applied.

FIG. 2 is a schematic front view of the same.

FIG. 3 is a front view showing a configuration of a head unit.

FIG. 4 is a schematic plan view showing a configuration of a laser unit.

FIG. 5 is a schematic plan view showing a positional relationship between each head and a laser unit in the head unit.

FIG. 6 is a main part front view of the head unit, showing an example of a state where the sucked component is arranged at a predetermined projection detection position of the laser unit.

FIG. 7 is a front view of a main part of a head unit showing another example of a state where the sucked component is arranged at a predetermined projection detection position of the laser unit.

FIG. 8 is a flowchart illustrating an example of a mounting operation.

FIG. 9 is a schematic front view showing another arrangement example of the laser unit.

FIG. 10 is a schematic plan view showing a relationship between a head and a laser unit in a conventional apparatus.

FIG. 11 is a schematic plan view showing a relationship between a head and a laser unit in a conventional apparatus.

[Explanation of symbols]

 Reference Signs List 5 head unit 20a to 20d head 21 nozzle 24 R-axis servo motor 26 Z-axis servo motor 30 laser unit 31a irradiation unit 31b detector

Claims (2)

[Claims] 1. A head unit having a plurality of heads having nozzles for picking up components, mounted in a line, and having a light irradiating unit and a light receiving unit. In a surface mounter equipped with optical detection means for checking a component suction state based on detection, the optical detection means is constituted by a plurality of unit detection means having a light irradiation part and a light reception part corresponding to each head. Each unit detecting means is arranged so that the direction of light irradiation and light receiving of each unit detecting means is the same direction, and at least one unit detecting means is vertically offset with respect to the unit detecting means adjacent thereto. A surface mounter characterized in that an interval between heads is set such that the unit detecting means partially overlaps with a unit detecting means adjacent thereto. 2. The surface mounter according to claim 1, wherein the unit detection means are arranged so as to be alternately vertically overlapped.