JP2767414B2 - Chip component mounting device - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip for mounting a chip-shaped electronic component (hereinafter referred to as a chip component) such as an IC, a resistor, and a capacitor on a printed circuit board. The present invention relates to a component mounting device. 2. Description of the Related Art As a mounting apparatus of this type, conventionally, a work station is formed on a conveyor on which a printed circuit board is transported, and the work station moves at high speed in a XY direction on a horizontal plane parallel to the conveyor. 2. Description of the Related Art There is known a head support member provided with a work head for sucking a chip component supplied from a component supply unit and transferring the chip component to a predetermined position on a printed circuit board. No. 61-118719). [0003] By the way, in the work of mounting electronic parts by such a mounting device, various parts widely distributed on a printed circuit board are each provided with an appropriate one of various types of parts. It is necessary to attach.
For this purpose, the work head needs to pick up a required chip component from a centrally arranged component supply device and move the chip component to a desired location on the printed circuit board.
In order to improve the work efficiency of the mounting work, it is conceivable to increase the moving speed of the work head, but at the same time, it is naturally necessary to maintain the positioning accuracy of the chip component at a predetermined level or more. However, in order to improve the working efficiency by increasing the moving speed of the working head in this way, in order to maintain the positioning accuracy of the chip component, a highly rigid head supporting member or moving the working head is performed at high speed. Therefore, it is necessary to use a drive motor having a large output, and it is necessary to use these as a whole structure. As a result, the device itself becomes large. The present invention has been made in view of the above circumstances, and provides a chip component mounting apparatus that can improve work efficiency without resorting to a technique of increasing the moving speed of a work head using a motor having a large output. Aim. [0004] Means taken to solve the above problems include a substrate transport path formed on a base, a component supply unit located on the side of the substrate transport path, A head unit having a work head for picking up parts, provided above the base so as to be movable on the X and Y planes, and a driving unit for driving the head unit;
Picking up chip components from the component supply unit by the work head of the head unit in a state where the printed board is stopped in a predetermined board installation area on the board transport path,
Assuming a chip component mounting device that mounts the chip components on a printed circuit board, the following elements (a) to (b)
(D). (A) First and second fixed rails provided parallel to each other across the substrate transport path, and a first head support member which is guided and supported at both ends by the first and second fixed rails so as to be able to travel. A second head support member guided and supported at both ends on the first and second fixed rails so as to be able to travel, a first drive unit for driving the first head support member, (B) a first head unit provided on the first head support member, and a second drive means provided on the second head support member. (2) the moving ranges of these head units are set so as to have a common work area in a range including the substrate installation area, and (c) the component supply units are provided on both sides of the substrate transport path;
The work head of the first head unit picks up a chip component from one of the component supply units on both sides and mounts it on a printed circuit board, and the work head of the second head unit receives the chip component from the other of the component supply units on both sides. (D) The working heads of the first head unit and the second head unit are arranged outside each other with respect to each head supporting member. That you are. According to this structure, after the printed circuit board transported by the substrate transport path is stopped in the substrate installation area, the component picked up from the component supply unit by the working head of the head unit. Is repeatedly mounted on the printed circuit board, so that components are mounted at predetermined positions on the printed circuit board. In this case, the provision of the first and second head units that are individually driven enables the removal of components from the component supply units provided on both sides of the substrate transport path and the mounting of components on the printed circuit board. The printing is performed simultaneously by the head units or in parallel with a certain time lag. In particular, since the two head units have a common work area in a range including the substrate installation area, one print is performed. The work by each of the head units is performed on the board in parallel, and the mounting of a plurality of chip components on the printed board is performed efficiently. It is not necessary to use a motor having a particularly large output to increase the moving speed of the working head, and the magnitude of the force generated in the apparatus is kept relatively small, so that the rigidity of the base, the feeder, etc. The need for enhancement is reduced. An embodiment of the present invention will be described with reference to the drawings. In the drawing, a conveyor 12 as a transport path is horizontally set on an upper surface of a base 11 in the chip component mounting apparatus 10. The work head 1 of the chip component mounting apparatus 10 is provided on the conveyor path of the conveyor 12.
3 is a work station 14 for mounting chip components
Are formed. A printed board 15 is transported onto the conveyor 12 from one side (the right side in FIG. 1), and the transport of the printed board 15 by the conveyor 12 is temporarily stopped at a predetermined position in the work station 14. At the time of work, this work station 14
The printed circuit board is held at a predetermined position in the inside. The work station 14 has a rectangular shape, and its longitudinal direction coincides with the X-axis direction which is the transfer direction of the conveyor 12. On both sides of the work station 14 in the Y-axis direction (a direction orthogonal to the conveyor 12), component supply units 16 to be described later are arranged along the long sides of the work station 14. On both sides of the work station in the X-axis direction, a first fixed rail 17 and a feeding device 18 and a second fixed rail 17 and a feeding device 18 as support members in the Y-axis direction are installed over the conveyor 12. Have been. Each feed device 18 is composed of a ball screw device, and its screw shaft (feed screw) 21 is rotationally driven by a first and a second drive means (drive motor) 19 via a toothed belt 20, thereby to be described later. The first and second head support members 22 are driven in the Y-axis direction. Above the base 11, two head supporting members 22 for supporting the working head 13 movably in the X-axis direction are provided. This head support member 22
Is as follows. That is, the head support member 22 includes a linear frame 23, a guide rail 24 fixed on the frame 23, and a feeder (feed screw) 2 installed in parallel with the guide rail 24.
The work rails 13 are vertically supported on the guide rails 24 via mounting plates 26. These work heads 13 are moved up and down by a command signal of a CPU (not shown) to perform necessary work at the time of picking up each required chip component and at the time of placing work on a printed circuit board. A head unit is constituted by these work heads 13, a mechanism for elevating and lowering these work heads, and the mounting plate 26, and first and second head units U 1 and U 2 are respectively supported by first and second head support members 22. I have. The above first and second
The feed device 1 is provided on one end side of the head support member 22 of the
8 (the feeder of the first head support member is also referred to as a first feeder, and the feeder of the second head support member is also referred to as a second feeder). This meshes with each feed screw 21 installed in parallel with the first and second fixed rails 17, and connects each feed screw 21 with first and second drive means (drive motor) 19.
, The feed in the Y-axis direction is given to the entire head support member 22. Head units U1, U2 supported by the first and second head support members 22
The mounting plate 26 is supported by the guide rail 24, and the feed screw 25 arranged in parallel with the guide rail 24 meshes with the female thread of a ball screw device fixedly provided on the mounting plate 26. And the servo motor 2
8 can be moved in the X-axis direction by the rotation of the feed screw 25. Therefore, three working heads 1
3, the first and second head units U1 and U2
The head support member 22 can move in the direction of the fixed rail 17 (Y-axis direction) and the head support member 22 can move in the direction of the guide rail 24 (X-axis direction). Two-dimensional movement within the work area is performed. On the other hand, the component supply unit 16 installed on the base 11 is provided with various types of chip components in a form in which, for example, chip components having a rectangular parallelepiped shape are stored at regular intervals on a supply tape 29 wound on a reel. Although not shown, a ratchet-type feed mechanism for intermittently feeding the supply tape 29 is incorporated at the feed end of the supply tape 29, and a projection provided on the working head 13 presses the feed mechanism. Thereby, the pick-up operation of the chip component by the operation head 13 is enabled. In the drawing, reference numeral 31 denotes a suction nozzle, which is connected to a vacuum pump (not shown). Reference numeral 32 denotes a correction arm.
The suction position of the chip component sucked by the correction is corrected. By the way, the first and second head support members 22 are supported by the first and second fixed rails 17 at both ends in a state where they are arranged to extend in the X-axis direction in parallel with each other in a symmetrical posture. , Can be independently moved in the Y-axis direction. The head units U1 and U2 supported by the respective head support members 22 are arranged outside the head support members 22 in the Y-axis direction, that is, on the side opposite to the side facing the space sandwiched between the two head support members 22. . These head support members 22 are individually driven by the two feeding devices 18. The ball screw devices as these feeding devices 18 are provided with first and
The second fixed rail 17 is disposed on both outer sides. This is because, in order to move and position these head support members 22 with high precision, reducing the distance a between the feed screw 21 and the fixed rail 17 as shown in FIG. This is because the bending moment due to the applied feed driving force is reduced, which is preferable. Also,
In order to maintain high positioning accuracy by the head support member 22 against this feed driving force, it is preferable to increase the interval b between the slide bearing 33 of the head support member 22 and the fixed rail 17. According to the arrangement of this embodiment, even if the distance between the feed screw 21 and the fixed rail 17 is narrowed and the distance between the slide bearings 33 is increased, two heads are mounted on the same set of fixed rails 17. Since the support members 22 are provided, the positioning accuracy of the two head support members 22 can be maintained satisfactorily, and the approach distance between the two head support members 22 can be reduced. It is possible to expand the work space. The head support member 22 of this embodiment
In the feed device 18, the screw shaft 21 and the drive means (drive motor) 19 are interlocked via the toothed belt 20, so that the Y axis of the work station 14 is divided by the size of the device in the Y axis direction. In the case where the screw shaft 21 is arranged along the fixed rail 17, it is possible to avoid the limitation due to the outer shape of the driving motor 19 and to install the screw shaft 21 close to the fixing shaft 17. It is possible to reduce the overall rigidity to be achieved. Further, when the work heads 13 are arranged outside the head support members 22 in the Y-axis direction as described above, the maintenance of the work heads 13 of the respective head support members 22 can be performed from the outside,
Serviceability can be improved. Further, when the chip component mounting apparatus is to be automatically operated, it is necessary to teach the work, and the work position can be easily seen at the time of the teaching work. With respect to the movement of the two head support members 22 in the Y-axis direction, as described below, the number of pulses generated by a detector provided in the drive motor 19 is detected, and the gap between the two head support members 22 is changed every 20 msec. In order to avoid collision and interference between the two head support members 22. Therefore, this mounting device 1
0 of each head unit U at the work station 14
As shown in FIG. 5, the work areas 1 and 2 are dedicated to the component supply units 16 arranged on the respective head support members 22 side and the printed circuit board 15 stopped on the conveyor 12.
The upper portion overlaps as a common operating area for both head support members 22. 5A shows the working area of the working head 13 of the first head unit U1 supported by the first head support member 22 drawn as the near side in FIG. 1, and FIG. 5B shows the second working area. 5 shows a work area of the work head 13 of the second head unit U2 supported by the head support member 22. That is, the working head 13 of the first head unit U1 picks up the chip component from the supply tape 29 of the component supply unit 16 installed on the first head support member side, and sets the chip component over the entire area on the printed circuit board 15; Working head 13 of second head unit U2
Is the component supply unit 16 installed on the second head support member side.
Similarly, chip components are set for the entire area on the printed circuit board 15. Then, the above operations by the head units U1 and U2 are performed simultaneously or in parallel with a certain time lag, so that chip components can be efficiently mounted on one printed circuit board. Next, in order to move the two head support members 22 without causing collision and interference with each other, this embodiment employs a well-known technique to employ a CPU (not shown).
Programming and the like are performed so as to be controlled and appropriate operations are performed. In this embodiment, it is intended to completely avoid collision and interference between these two head support members 22 by causing the CPU to perform the following tasks. The operation of this task will be described below with reference to the flowchart of FIG. This task is started at the same time as the power of the mounting device 10 is turned on.
The following task is repeated every 20 msec by the timer in the UP. For this reason, the task described below functions regardless of whether the operation of the chip component mounting apparatus is performed in the manual mode or the automatic mode. However, collision of the head support member, occurrence of interference, and the like are prevented. First, a task is started based on a command signal of the timer as described above. Step 1 The positions of the two head support members 22 in the Y-axis direction (indicated as Y1 and Y2 in FIG. 6) and their changes are detected to determine whether the two head support members 22 are approaching. Since a pulse generator is provided in the drive motor 19 of both head support members 22, the difference between the number of pulses from the encoder portion is detected and the CPU compares the number of pulses with a predetermined amount. And if this judgment is YES,
Proceed to step 2, and if NO, end this task. Step 2 When it is determined that both head support members 22 are approaching,
The position at which both head support members 22 can be smoothly decelerated and stopped is calculated. Step 3 Next, the stop position interval between the two head support members 22 calculated in Step 2 is calculated. Step 4 Then, the interval obtained in Step 3 is compared with a preset minimum interval between the two head support members 22 (preferably, it is preferable that the interval can be set so as to be changeable). Predict the potential of If YES (when there is a possibility of collision), the process proceeds to step 5, and if NO (when there is no possibility of collision), this task ends. Step 5 If it is determined in step 4 that there is a possibility of collision or the like, the two head supporting members 22 and the respective working heads 13 of these head supporting members 22 (in this embodiment, the mounting plate 26 is used instead). (This is also possible.) The movement is braked, these are decelerated and stopped, and a collision or the like is avoided to end this task. In this case, a warning may be issued by a buzzer or the like at the same time as this operation. As described above, the present invention relates to a substrate transport path formed on a base, a component supply unit located on a side of the substrate transport path, and a work head for component pickup. A head unit provided above the base so as to be movable on the X and Y planes, and driving means for driving the head unit, and a predetermined substrate installation area on the substrate transport path. A chip component mounting device that picks up a chip component from the component supply unit by the work head of the head unit with the printed circuit board stopped therein and mounts the chip component on the printed circuit board; A first and a second fixed rail parallel to each other provided across the substrate transport path, a first head support member guided and supported at both ends so as to be able to run on the first and the second fixed rail, A second head support member which is guided and supported at both ends by the first and second fixed rails so as to be able to travel, a first drive means for driving the first head support member, (B) a first head unit provided on the first head support member and a second drive means provided on the second head support member. (C) the component supply units are provided on both sides of the substrate transport path, and the head supply units are provided on both sides of the substrate transport path so that the head units have a common working area in a range including the substrate installation area.
The work head of the first head unit picks up a chip component from one of the component supply units on both sides and mounts it on a printed circuit board, and the work head of the second head unit receives the chip component from the other of the component supply units on both sides. By setting the chip components to be picked up and mounted on the printed circuit board, the component mounting by the first and second head units can be performed on one printed circuit board located in the board installation area. Work can be performed in parallel. Therefore, it is possible to improve the efficiency of component mounting work on one printed circuit board without using a motor having a particularly large output to increase the moving speed of the work head. In addition, since the working efficiency is improved without using a motor having a particularly large output, the force generated in the apparatus can be made relatively small, and the head supporting member by the driving means (driving motor) can be used. Since the effect of the driving torque of the base is suppressed, the size of the base, the feeder, and the like is suppressed. That is, with such a configuration, the work efficiency of the chip component mounting device can be significantly improved while the device is relatively small. (D) Since the working heads of the first head unit and the second head unit are arranged outside each other with respect to each head support member, each work head is located outside the head support member in the Y-axis direction. , The maintenance work can be performed from the outside, and the workability can be improved. Further, when the chip component mounting apparatus is to be automatically operated, it is necessary to teach the work, but this has a unique effect that the work position during the teaching work is easy to see. Further, according to the above (a) to (d), the required chip components can be completely sorted into the component supply units on both sides of the substrate transfer path without complicating and increasing the size of the mechanism of the chip component mounting apparatus. Therefore, the number of types of components can be dramatically increased, and the first head unit and the second head unit can share the work of mounting different types of chip components, respectively. , Work efficiency can be improved.

BRIEF DESCRIPTION OF THE DRAWINGS The drawings relate to an embodiment of the present invention, and FIG. 1 is a plan view of a chip component mounting apparatus with a cover removed. FIG. 2 is a front view thereof. FIG. 3 is a side view thereof. FIG. 4 is an explanatory diagram of a driving system of a head supporting member in a plan view. FIG. 5 is an explanatory diagram of a work area of both head support members in a work station. FIG. 6 is a flowchart of a task for avoiding a collision of a head support member of the chip component mounting apparatus. [Description of Reference Numerals] 10: Chip component mounting apparatus 11: Base 13, Working head 14, Working station 17, Fixed rail (first fixed rail, second fixed rail) 18, 25: feed device 19: drive motor (first drive unit, second drive unit) 22: head support member (first head support member, second head support member) 24 ... Guide rail U ₁ ... First head unit U ₂ ... Second head unit

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H05K 13/04

Claims (1)

(57) [Claims] It has a substrate transport path formed on the base, a component supply unit located on the side of the substrate transport path, and a work head for component pickup, and moves on the X, Y plane above the base. A head unit provided so as to be able to be provided, and a driving means for driving the head unit, and a work board of the head unit in a state where the printed board is stopped in a predetermined board installation area on the board transport path. In a chip component mounting apparatus that picks up chip components from the component supply unit and mounts the chip components on a printed circuit board, the chip component mounting device includes first and second fixed rails provided parallel to each other and provided across a board transfer path. And a first head support member which is guided and supported at both ends on the first and second fixed rails, and further guides and supports at both ends so as to be able to travel on the first and second fixed rails. A second driving means for driving the second head supporting member, a first driving means for driving the first head supporting member, and a second driving means for driving the second head supporting member. The first head unit provided on the head support member and the second head unit provided on the second head support member have a common work area in a range including the substrate installation area. The component supply units are provided on both sides of the substrate transport path, and the work head of the first head unit picks up chip components from one of the component supply units on both sides and mounts the chip components on a printed circuit board. The work head of the second head unit is set so that the chip component is picked up from the other of the component supply units on both sides and mounted on a printed circuit board. Chip component mounting device, characterized in that the working head of the second head unit is positioned outside each other for each head support member.