JP2938556B2 - Component mounting equipment - Google Patents

Component mounting equipment

Info

Publication number
JP2938556B2
JP2938556B2 JP2303618A JP30361890A JP2938556B2 JP 2938556 B2 JP2938556 B2 JP 2938556B2 JP 2303618 A JP2303618 A JP 2303618A JP 30361890 A JP30361890 A JP 30361890A JP 2938556 B2 JP2938556 B2 JP 2938556B2
Authority
JP
Japan
Prior art keywords
component
mounting
component supply
components
component mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2303618A
Other languages
Japanese (ja)
Other versions
JPH04176198A (en
Inventor
幸一 森田
親 小西
理 疋田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2303618A priority Critical patent/JP2938556B2/en
Publication of JPH04176198A publication Critical patent/JPH04176198A/en
Application granted granted Critical
Publication of JP2938556B2 publication Critical patent/JP2938556B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Supply And Installment Of Electrical Components (AREA)

Description

【発明の詳細な説明】 産業上の利用分野 本発明は電子部品等の各種部品を回路基板等に実装す
る部品実装装置に関するものである。
Description: TECHNICAL FIELD The present invention relates to a component mounting apparatus for mounting various components such as electronic components on a circuit board or the like.

従来の技術 電子部品を基板に装着する電子部品装着機として、第
6図に示すように、複数の装着ヘッド21を周囲に設けた
回転体を鉛直軸心回りに間歇的に旋回させるようにした
装着手段20を設け、部品供給部22の所定の部品供給位置
Aで部品を取出し、部品装着位置Bで基板23に装着する
ようにした旋回方式の部品実装装置が、高速実装の可能
な部品実装装置として従来から知られている。この部品
実装装置の部品供給部22は、装着ヘッド21の旋回経路の
後部における停止位置を部品供給位置Aとし、この部品
供給位置Aにおいて旋回経路に対して接線方向(X方
向)に移動可能な可動台24を設け、この可動台24上にそ
の移動方向(X方向)に並列させて多数の部品供給ユニ
ット25を搭載し、任意の部品供給ユニット25を部品供給
位置Aに対応位置させ得るように構成されている。又、
装着ヘッド21の旋回経路の前部における停止位置を部品
装着位置Bとし、この部品装着位置Bに水平方向の互い
に直交する2方向(X方向及びY方向)に移動可能なXY
テーブル26を配設し、その上に基板23を固定するように
構成されている。又、部品供給位置Aから部品装着位置
Bに至る間の装着ヘッド21の停止位置に部品の位置を認
識するように、CCD認識カメラ28と一対の反射鏡29a、29
bから成る認識手段27が配設されている。
2. Description of the Related Art As an electronic component mounting machine for mounting an electronic component on a substrate, as shown in FIG. 6, a rotating body provided with a plurality of mounting heads 21 is intermittently rotated around a vertical axis. A component mounting device of a revolving type, in which a mounting means 20 is provided, a component is taken out at a predetermined component supply position A of a component supply part 22 and mounted on a substrate 23 at a component mounting position B, is a component mounting device capable of high-speed mounting. It is conventionally known as an apparatus. The component supply unit 22 of the component mounting apparatus sets a stop position at the rear part of the turning path of the mounting head 21 as a component supply position A, and can move in the component supply position A in a tangential direction (X direction) with respect to the turning path. A movable base 24 is provided, and a large number of component supply units 25 are mounted on the movable base 24 in parallel in the moving direction (X direction) so that any component supply unit 25 can be positioned corresponding to the component supply position A. Is configured. or,
The stop position of the mounting head 21 at the front of the turning path is a component mounting position B, and the component mounting position B can move in two horizontal directions (X direction and Y direction) orthogonal to each other.
A table 26 is provided, and the substrate 23 is fixed thereon. Further, the CCD recognition camera 28 and the pair of reflecting mirrors 29a, 29a are arranged so that the position of the component is recognized at the stop position of the mounting head 21 from the component supply position A to the component mounting position B.
Recognition means 27 consisting of b is provided.

ところが、第6図に示すような部品実装装置では、1
台の部品実装装置で一度に1枚の基板23にしか部品を装
着できず、装着速度の高速化を図っても一定以上に実装
能率を高めることは困難であるという問題があった。
However, in the component mounting apparatus as shown in FIG.
There is a problem that components can be mounted on only one substrate 23 at a time by one component mounting apparatus, and it is difficult to increase the mounting efficiency beyond a certain level even if the mounting speed is increased.

そこで、第7図に示すように、互いに同期して動作す
る複数の装着手段30a、30bを併設するとともに、部品供
給部32の可動台34上に各装着手段30a、30bにそれぞれ対
応させて多数の部品供給ユニット25を同一の配列で搭載
し、また共通のXYテーブル36上には各装着手段30a、30b
に対応させて複数の基板23a、23bを固定し、複数の基板
23a、23bに対して一度に並行して部品を装着するように
した部品実装装置が提案されている。
Therefore, as shown in FIG. 7, a plurality of mounting means 30a and 30b operating in synchronization with each other are provided in parallel, and a plurality of mounting means 30a and 30b are provided on the movable base 34 of the component supply unit 32 in correspondence with the mounting means 30a and 30b, respectively. Are mounted in the same arrangement, and the mounting means 30a and 30b are mounted on a common XY table 36.
A plurality of substrates 23a and 23b are fixed in accordance with
There has been proposed a component mounting apparatus in which components are simultaneously mounted on 23a and 23b at once.

発明が解決しようとする課題 ところが,第7図に示すような部品実装装置において
は,各装着手段30a,30bにてそれぞれの部品供給位置A
で部品を取り出す際に部品の相対位置が互いに多少ずれ
るのを避けることはできず,一方,基板23a,23bは共通
のXYテーブル36上に固定されているので,基板23a,23b
に精度よく部品を装着するには,装着ヘッド21にて部品
を保持した状態で位置規正手段にて機械的に部品の保持
位置を規正するしかない。そのため,装着ヘッド21に複
雑な位置規正手段を設ける必要があり,構成が複雑にな
ってコスト高になるとともに装着ヘッドの重量が増加し
て高速実装に悪影響を与え,さらに位置規正手段による
位置規正が不可能な形状の部品の実装には適用できない
という問題があった。
Problems to be Solved by the Invention However, in the component mounting apparatus as shown in FIG. 7, each of the mounting means 30a and 30b has its own component supply position A.
It is unavoidable that the relative positions of the components are slightly deviated from each other when the components are taken out, while the substrates 23a and 23b are fixed on the common XY table 36, so that the substrates 23a and 23b
In order to mount the component with high accuracy, the only way to fix the component holding position mechanically by the position setting means while the component is held by the mounting head 21 is. Therefore, it is necessary to provide a complicated positioning means in the mounting head 21, which complicates the configuration, increases the cost, increases the weight of the mounting head, adversely affects high-speed mounting, and furthermore, determines the positioning by the positioning means. However, there is a problem that the method cannot be applied to the mounting of a component having a shape that is impossible.

さらに,第7図に示すような部品実装装置において
は,各装着手段30a,30bにてそれぞれの部品供給位置A
で所望の部品を取り出すために,基板23a,23b上に実装
する部品の種類が増加に対応するためには,必然的に部
品供給部32の可動台34を大きくせざるを得ず,可動台34
の巨大化・重量化を招き,高速動作を行わせることが困
難となるという問題もあった。
Further, in the component mounting apparatus as shown in FIG. 7, each of the mounting means 30a and 30b has its own component supply position A.
In order to take out the desired components in order to cope with the increase in the types of components mounted on the substrates 23a and 23b, the movable table 34 of the component supply unit 32 must necessarily be enlarged. 34
There is also a problem that it becomes large and heavy, and it is difficult to perform high-speed operation.

課題を解決するための手段 本発明の部品実装装置は,上記目的を達成するため
に,互いに同期して動作する複数の装着手段を併設し,
各装着手段は垂直軸心周りに間欠回転可能な回転体の周
囲に複数の装着ヘッドを配設し,前記各回転体を間欠回
転することにより,前記各装着ヘッドにより所定の各装
着手段毎の部品供給位置にて部品供給部の部品取出位置
から各々部品を取り出した後,各装着手段毎の所定の部
品装着位置において位置決め手段により位置決めされた
被装着部材上に部品を装着する部品実装装置であって,
前記部品供給部は,同種類の部品を有した部品供給装置
を複数個載置した複数の移動体からなり,かつ個々の移
動体は一定平面上を各々が独立して任意の方向に,前記
各部品供給位置に対して所望の部品を搭載した各部品供
給装置が位置決めされるよう移動可能に構成され,前記
位置決め手段は,被装着物を保持可能な複数の移動体か
らなり,個々の移動体は一定平面上を各々が独立して任
意の方向に移動可能で,かつ保持した各被装着物を前記
各部品装着位置に対して同時に位置決めするよう構成し
たことを特徴とするものである。
Means for Solving the Problems In order to achieve the above object, the component mounting apparatus of the present invention is provided with a plurality of mounting means operating in synchronization with each other,
Each mounting means is provided with a plurality of mounting heads around a rotating body which is intermittently rotatable around a vertical axis, and by intermittently rotating each of the rotating bodies, each mounting head is provided with a predetermined mounting means. A component mounting apparatus that picks up components from a component unloading position of a component supply unit at a component supply position and then mounts the component on a member to be mounted positioned by a positioning unit at a predetermined component mounting position for each mounting unit. So,
The component supply unit includes a plurality of moving bodies on which a plurality of component supply devices having components of the same type are mounted, and each of the moving bodies is independent of each other on a predetermined plane in any direction. Each component supply device on which a desired component is mounted is movable so as to be positioned with respect to each component supply position, and the positioning means includes a plurality of moving bodies capable of holding the object to be mounted. Each of the bodies is independently movable in an arbitrary direction on a predetermined plane, and is configured to simultaneously position the held objects to be mounted on the respective component mounting positions.

作用 本発明の部品実装装置によると、互いに同期して動作
する複数の装着手段を併設しているので能率的に部品実
装を行うことができ,かつ各装着手段にてそれぞれの部
品供給位置で部品を保持する際にその保持位置に相対的
な位置ずれを生じても,部品供給位置と部品装着位置の
間で部品位置を認識し,それに基づいて位置決め手段に
おける各移動体の位置を個々に調整することにより,各
移動体上に固定した複数の被装着部材に対して精度よく
部品を装着することができる。さらに,総使用部品種類
数が増加しても,従来の装置の如く部品供給部の拡大を
抑えることができ,設備全体の省スペース化をはかるこ
とができ,また複数の部品供給装置を個別に移動させる
ことで,個々の部品供給装置を軽量化して高速移動動作
を可能とすることができるものである。
According to the component mounting apparatus of the present invention, a plurality of mounting means operating in synchronization with each other are provided in parallel, so that the component mounting can be efficiently performed, and the mounting is performed at each component supply position by each mounting means. Even if a relative misalignment occurs in the holding position when holding the component, the component position is recognized between the component supply position and the component mounting position, and the position of each moving body in the positioning means is individually adjusted based on that. By doing so, components can be accurately mounted on the plurality of mounted members fixed on each moving body. Furthermore, even if the total number of parts used increases, it is possible to suppress the expansion of the parts supply unit as in the conventional equipment, to save the space of the entire equipment, and to separately operate multiple parts supply devices. By moving, the individual component supply devices can be reduced in weight and high-speed moving operation can be performed.

実施例 以下,本発明の一実施例を第1図〜第5図に基づいて
説明する。
Embodiment Hereinafter, an embodiment of the present invention will be described with reference to FIGS.

第1図において、1は部品実装機であり、その後部に
部品供給部2が配設されている。この部品供給部2に
は、一定の移動平面を構成する案内プレート3と、この
案内プレート3上を各々が独立して任意の経路を通って
移動可能でかつ任意の位置に位置決め可能な複数の移動
体4と、各移動体4上にそれぞれ第3図に示すように並
列して搭載された複数の部品供給ユニット5にて構成さ
れている。
In FIG. 1, reference numeral 1 denotes a component mounter, and a component supply unit 2 is provided behind the component mounter. The component supply unit 2 includes a guide plate 3 forming a fixed moving plane, and a plurality of guide plates 3 each of which can independently move on the guide plate 3 through an arbitrary path and can be positioned at an arbitrary position. The moving body 4 includes a plurality of component supply units 5 mounted in parallel on each moving body 4 as shown in FIG.

部品供給ユニット5には、多数の部品を一列状に保持
したテープ状部品集合体を巻回したリール6が装着され
ており、テープ状部品集合体をリール6から逐次繰り出
してその部品を一端部に設けた部品取出位置5aに順次送
出し可能に構成されている。
The component supply unit 5 is equipped with a reel 6 on which a tape-like component assembly holding a large number of components in a line is wound, and the tape-like component assembly is sequentially fed from the reel 6 and the component is placed at one end. The parts can be sequentially sent out to the component take-out position 5a provided at the position.

部品供給部2の前部には一対の旋回型の部品装着手段
7a、7bが並列して配設されている。この部品装着手段7
a、7bは垂直軸心回りに間歇回転可能な回転体の周囲に
複数の装着ヘッド8を等間隔に配設し、回転体を装着ヘ
ッド8の配置間隔で間歇回転させるように構成されてい
る。そして、各装着ヘッド8の後部停止位置が部品供給
ユニット5の部品取出位置5aから部品を取り出す部品供
給位置Aに、前部の停止位置が部品装着位置Bに設定さ
れている。
A pair of revolving component mounting means is provided at the front of the component supply unit 2.
7a and 7b are arranged in parallel. This component mounting means 7
a and 7b are configured so that a plurality of mounting heads 8 are arranged at equal intervals around a rotating body that can rotate intermittently around a vertical axis, and the rotating bodies are rotated intermittently at the arrangement intervals of the mounting heads 8. . The rear stop position of each mounting head 8 is set to a component supply position A for extracting a component from the component extraction position 5a of the component supply unit 5, and the front stop position is set to a component mounting position B.

これら部品装着手段7a、7bの前部に、部品を装着すべ
き回路基板9の位置決め手段10が配設されている。この
位置決め手段10は、一対の回路基板9a、9bを各部品装着
ユニット7a、7bに対応させて固定するとともにこれら回
路基板9a、9bの任意の位置を部品装着位置Bに対応さ
せ、さらに互いに独立して位置調整可能に構成されてい
る。即ち、第2図に示すように、案内プレート11上を各
々が独立して移動可能でかつ任意の位置に位置決め可能
な一対の移動体12a、12bが設けられ、その上に回路基板
9a、9bを固定するように構成されている。13は回路基板
9を位置決め手段10に供給する供給手段、14は部品装着
後の回路基板9を排出する排出手段である。
In front of these component mounting means 7a and 7b, a positioning means 10 for a circuit board 9 on which components are to be mounted is provided. The positioning means 10 fixes the pair of circuit boards 9a and 9b in correspondence with the respective component mounting units 7a and 7b, and also allows an arbitrary position of the circuit boards 9a and 9b to correspond to the component mounting position B, and is independent of each other. The position is adjustable. That is, as shown in FIG. 2, a pair of moving bodies 12a and 12b, each of which can move independently on the guide plate 11 and can be positioned at an arbitrary position, are provided, and a circuit board is provided thereon.
It is configured to fix 9a and 9b. Reference numeral 13 denotes supply means for supplying the circuit board 9 to the positioning means 10, and reference numeral 14 denotes discharge means for discharging the circuit board 9 after mounting components.

案内プレート3と移動体4及び案内プレート11と移動
体12a、12bの移動原理は、リニアモータの移動原理を2
次元に展開したものであり、第4図、第5図に示すよう
に、案内プレート3、11は磁性体から成るプレート15の
表面にマトリックス状に無数の突部16を突設した構成さ
れており、移動体4、12a、12bには、前後方向と左右方
向にそれぞれ一対の電磁石17a、17b、18a、18bが並列し
て配設され、かつそれらの磁極が突部16に対して所定の
隙間を介して対向している。尚、案内プレート3、11の
突部16間の隙間は合成樹脂19等が充填されて表面は平滑
面に形成されており、この案内プレート3、11の表面と
移動体4、12a、12bの下面の間に高圧エアを噴出させる
ことによりそれらの間に一定の隙間を形成した状態で移
動体4、12a、12bが移動自在に支持されている。また、
各電磁石17a、17b、18a、18bは、それらの一対の磁極が
突部16のピッチに対して半ピッチ分位相がずれるように
形成され、かつ同一方向の電磁石17aと17b、及び18aと1
8bは互いに4分の1ピッチ位相をずらせて配置されてい
る。かくして、電磁石17a、17b又は18a、18bを交互に作
動させることによって突部16の4分の1ピッチづつ前後
方向又は左右方向に移動体4を移動させ、所定位置に位
置決めすることができる。
The principle of movement of the guide plate 3 and the moving body 4 and the principle of movement of the guide plate 11 and the moving bodies 12a and 12b are based on the principle of movement of the linear motor.
As shown in FIGS. 4 and 5, the guide plates 3 and 11 are formed by projecting a myriad of projections 16 in a matrix on the surface of a plate 15 made of a magnetic material. A pair of electromagnets 17a, 17b, 18a, 18b are arranged in the moving body 4, 12a, 12b in the front-rear direction and the left-right direction, respectively, and the magnetic poles thereof They face each other via a gap. The gap between the projections 16 of the guide plates 3 and 11 is filled with a synthetic resin 19 or the like to form a smooth surface, and the surfaces of the guide plates 3 and 11 and the moving bodies 4, 12a and 12b are The moving bodies 4, 12a, and 12b are movably supported in such a manner that high-pressure air is ejected between the lower surfaces to form a fixed gap therebetween. Also,
Each of the electromagnets 17a, 17b, 18a, 18b is formed such that the pair of magnetic poles is shifted in phase by a half pitch with respect to the pitch of the projection 16, and the electromagnets 17a and 17b, and 18a and 1 in the same direction.
8b are shifted from each other by a quarter pitch phase. In this way, by alternately operating the electromagnets 17a, 17b or 18a, 18b, the moving body 4 can be moved in the front-rear direction or the left-right direction by a quarter pitch of the protrusion 16 and positioned at a predetermined position.

以上の構成において、部品を実装する際には、回路基
板9の品種に対応する所要の複数の部品供給ユニット25
を搭載された一対の移動体4をそれぞれ部品装着手段7
a、7bの後部の供給動作位置に位置させ、搭載されてい
る部品供給ユニット25のいずれかを部品供給位置Aに対
応位置させ得るようにしておく。この状態から供給動作
位置にある一対の移動体4を部品の装着順序に合わせて
左右方向に移動させることによって、装着すべき部品を
保持した部品供給ユニット5を順次部品供給位置Aに対
応位置させる。部品供給位置Aに供給された部品は、部
品装着手段7a、7bの装着ヘッド8にて順次取り出され、
各移動体12a、12b上に固定されて位置決めされている一
対の回路基板9a、9b上に同時に装着される。
In the above configuration, when components are mounted, a plurality of component supply units 25 corresponding to the type of the circuit board 9 are required.
A pair of moving bodies 4 each having
a, 7b is located at the rear supply operation position so that any of the mounted component supply units 25 can be positioned corresponding to the component supply position A. From this state, by moving the pair of moving bodies 4 at the supply operation position in the left-right direction in accordance with the component mounting order, the component supply units 5 holding the components to be mounted are sequentially positioned corresponding to the component supply position A. . The components supplied to the component supply position A are sequentially taken out by the mounting heads 8 of the component mounting means 7a and 7b,
They are simultaneously mounted on a pair of circuit boards 9a and 9b fixed and positioned on each of the moving bodies 12a and 12b.

この一連の部品装着動作において、各部品装着手段7
a、7bがそれぞれの部品供給位置Aで部品を取り出す際
に部品の相対的な保持位置が互いにずれることは避けら
れないが、その場合にも部品供給位置Aと部品装着位置
Bの間の装着ヘッド8の停止位置を部品認識位置Cとし
てここで適宜認識手段にて部品の保持位置を認識し、そ
の位置認識に基づいて図示しない制御部にて位置決め手
段10における各移動体12a、12bの位置を調整することに
よって回路基板9a、9bに対して精度よく部品を装着する
ことができる。
In this series of component mounting operations, each component mounting means 7
When the parts a and 7b take out the parts at the respective part supply positions A, it is inevitable that the relative holding positions of the parts are shifted from each other. The stop position of the head 8 is set as the component recognition position C, and the holding position of the component is recognized by the recognition unit as appropriate. Based on the position recognition, the position of each of the moving bodies 12a and 12b in the positioning unit 10 is controlled by a control unit (not shown). By adjusting the values, components can be accurately mounted on the circuit boards 9a and 9b.

また、部品供給部2において、各部品供給ユニット5
の部品供給位置Aに対する停止位置に左右方向又は前後
方向に誤差が生じている場合には、各移動体4の停止位
置を図示しない制御部にて必要な方向に対して調整する
ことにより、部品供給位置Aに対して部品供給ユニット
5の停止位置を完全に一致させることができる。
In the component supply unit 2, each component supply unit 5
If there is an error in the left-right direction or the front-back direction of the stop position with respect to the component supply position A, the control unit (not shown) adjusts the stop position of each moving body 4 in a necessary direction, thereby The stop position of the component supply unit 5 can completely match the supply position A.

又、いずれかの部品供給ユニット5に部品切れが生じ
た場合には、その部品供給ユニット5が搭載されている
移動体4を待機位置に退避移動させると同時に同じ部品
供給ユニット5を搭載されている待機中の移動体4を供
給動作位置に移動させて入換を行うことによって部品装
着動作を再開する。その際、各移動体4は互いに独立し
て任意の移動経路を通って移動できるので、移動体4の
入換を速やかに行うことができる。かくして、部品装着
動作を短時間の中断だけで継続することができ、部品実
装の生産性を高く維持できる。又、回路基板9の品種切
り換えの場合にも、同様の入換動作にて速やかに対応す
ることができる。
In the case where any one of the component supply units 5 has run out of components, the mobile unit 4 on which the component supply unit 5 is mounted is retracted to the standby position and the same component supply unit 5 is mounted at the same time. The component mounting operation is restarted by moving the waiting mobile unit 4 to the supply operation position and performing the replacement. At this time, the moving bodies 4 can move independently of each other through an arbitrary moving route, so that the moving bodies 4 can be quickly replaced. Thus, the component mounting operation can be continued with only a short interruption, and the productivity of component mounting can be maintained high. Further, even when the type of the circuit board 9 is changed, it is possible to promptly respond by the same replacement operation.

更に、移動体4の入換動作に複雑な動作が必要でな
く、入換動作を短時間で行えるので、移動体4の数が多
くても入換えに長時間を要することがなく、頻繁に多数
の品種切換えを行うような多品種少量生産の部品実装ラ
インに適用することによって大きな効果を上げることが
できる。
Further, since the switching operation of the mobile unit 4 does not require a complicated operation and the switching operation can be performed in a short time, even if the number of the mobile units 4 is large, the switching operation does not require a long time and is frequently performed. A great effect can be obtained by applying the present invention to a component mounting line for multi-product small-quantity production in which a large number of products are switched.

上記実施例では部品供給部2として、案内テーブル3
上に複数の移動体4を配置した例を示したが、本発明は
従来と同様にガイドフレームに沿って一方向に移動する
可動台を用いたものにも適用できる。
In the above embodiment, the guide table 3 is used as the component supply unit 2.
Although the example in which the plurality of moving bodies 4 are arranged has been described above, the present invention can also be applied to a moving body using a movable base that moves in one direction along a guide frame as in the related art.

さらに、上記実施例では移動体4、12a、12bと案内テ
ーブル3、11の間に高圧エアを吹き出し、移動体4、12
a、12bを浮上させて移動自在に支持した例を示したが、
磁気浮上させるようにしてもよい。
Further, in the above embodiment, high-pressure air is blown out between the moving bodies 4, 12a, 12b and the guide tables 3, 11, and the moving bodies 4, 12a,
Although an example was shown in which a and 12b were floated and supported movably,
You may make it magnetically levitate.

発明の効果 本発明の部品実装装置によれば、互いに同期して動作
する複数の装着手段を併設しているので能率的に部品実
装を行うことができ,かつ各装着手段にてそれぞれの部
品供給位置で部品を保持する際にその保持位置に相対的
な位置ずれを生じても,部品供給位置と部品装着位置の
間で部品位置を認識し,それに基づいて位置決め手段に
おける各移動体の位置を個々に調整することにより,各
移動体上に固定した複数の被装着部材に対して精度よく
部品を装着することができ,装着手段に機械的な部品の
位置規正手段等を設ける必要もないので,構成が簡単・
軽量となり,高速実装を実現できるとともに部品の種類
の制約も受けない。さらに,総使用部品種類数が増加し
ても,従来の装置の如く部品供給部の拡大を抑えること
ができ,設備全体の省スペース化をはかることができ、
また複数の部品供給装置を個別に移動させることで,個
々の部品供給装置を軽量化して高速移動動作を可能とす
ることができるものである。
EFFECTS OF THE INVENTION According to the component mounting apparatus of the present invention, since a plurality of mounting means operating in synchronization with each other are provided in parallel, component mounting can be performed efficiently, and each mounting means supplies each component. Even if a relative displacement occurs in the holding position when holding the component at the position, the component position is recognized between the component supply position and the component mounting position, and the position of each moving body in the positioning means is determined based on the recognized position. By individually adjusting the components, components can be accurately mounted on a plurality of mounted members fixed on each moving body, and there is no need to provide a mechanical component positioning means or the like in the mounting means. , Simple configuration
Lightweight, high-speed mounting is possible, and there is no restriction on the type of components. Furthermore, even if the total number of parts used increases, the expansion of the parts supply unit can be suppressed as in the conventional equipment, and the space of the entire equipment can be saved.
In addition, by moving a plurality of component supply devices individually, the weight of each component supply device can be reduced and a high-speed movement operation can be performed.

【図面の簡単な説明】[Brief description of the drawings]

第1図〜第5図は本発明の一実施例を示し、第1図は部
品実装装置の全体の概略構成を示す平面図、第2図は位
置決め手段の斜視図、第3図は部品供給部の要部の斜視
図、第4図は移動体の構成を示す斜視図、第5図は移動
体の移動原理の説明図、第6図、第7図は従来の部品実
装装置の概略構成を示す平面図である。 1……部品実装機、7a、7b……部品装着手段、9、9a、
9b……回路基板、10……位置決め手段、11……案内プレ
ート、12a、12b……移動体、A……部品供給位置、B…
…部品装着位置。
1 to 5 show an embodiment of the present invention, FIG. 1 is a plan view showing a schematic configuration of the entire component mounting apparatus, FIG. 2 is a perspective view of a positioning means, and FIG. FIG. 4 is a perspective view showing the structure of the moving body, FIG. 5 is an explanatory view of the principle of movement of the moving body, and FIGS. 6 and 7 are schematic structures of a conventional component mounting apparatus. FIG. 1 ... component mounting machine, 7a, 7b ... component mounting means, 9, 9a,
9b ... circuit board, 10 ... positioning means, 11 ... guide plate, 12a, 12b ... moving body, A ... parts supply position, B ...
… Component mounting position.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 疋田 理 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (56)参考文献 特開 平2−207600(JP,A) 特開 昭58−138091(JP,A) 特開 昭64−64399(JP,A) ──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Osamu Hikita 1006 Kadoma, Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) References JP-A-2-207600 (JP, A) JP-A-58- 138091 (JP, A) JP-A-64-64399 (JP, A)

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】互いに同期して動作する複数の装着手段を
併設し,各装着手段は垂直軸心周りに間欠回転可能な回
転体の周囲に複数の装着ヘッドを配設し,前記各回転体
を間欠回転することにより,前記各装着ヘッドにより所
定の各装着手段毎の部品供給位置にて部品供給部の部品
取出位置から各々部品を取り出した後,各装着手段毎の
所定の部品装着位置において位置決め手段により位置決
めされた被装着部材上に部品を装着する部品実装装置で
あって, 前記部品供給部は,同種類の部品を有した部品供給装置
を複数個載置した複数の移動体からなり,かつ個々の移
動体は一定平面上を各々が独立して任意の方向に,前記
各部品供給位置に対して所望の部品を搭載した各部品供
給装置が位置決めされるよう移動可能に構成され, 前記位置決め手段は,被装着物を保持可能な複数の移動
体からなり,個々の移動体は一定平面上を各々が独立し
て任意の方向に移動可能で,かつ保持した各被装着物を
前記各部品装着位置に対して同時に位置決めするよう構
成したことを特徴とする部品実装装置。
A plurality of mounting means operating in synchronism with each other, each mounting means being provided with a plurality of mounting heads around a rotating body which is intermittently rotatable about a vertical axis, wherein each of said rotating bodies is provided. Is intermittently rotated to take out each component from the component pick-up position of the component supply unit at the component supply position for each predetermined mounting means by each of the mounting heads, and then at the predetermined component mounting position for each mounting means. What is claimed is: 1. A component mounting apparatus for mounting components on a member to be mounted positioned by positioning means, wherein the component supply unit includes a plurality of moving bodies on which a plurality of component supply devices having components of the same type are mounted. And each of the moving bodies is configured to be movable independently on a predetermined plane in an arbitrary direction so that each component supply device on which a desired component is mounted is positioned with respect to each component supply position. The positioning The means comprises a plurality of movable bodies capable of holding the mounted objects, each movable body being independently movable in an arbitrary direction on a fixed plane, and each of the held mounted objects being mounted on each of the components. A component mounting apparatus characterized in that it is configured to be positioned simultaneously with respect to a mounting position.
JP2303618A 1990-11-07 1990-11-07 Component mounting equipment Expired - Fee Related JP2938556B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2303618A JP2938556B2 (en) 1990-11-07 1990-11-07 Component mounting equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2303618A JP2938556B2 (en) 1990-11-07 1990-11-07 Component mounting equipment

Publications (2)

Publication Number Publication Date
JPH04176198A JPH04176198A (en) 1992-06-23
JP2938556B2 true JP2938556B2 (en) 1999-08-23

Family

ID=17923157

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2303618A Expired - Fee Related JP2938556B2 (en) 1990-11-07 1990-11-07 Component mounting equipment

Country Status (1)

Country Link
JP (1) JP2938556B2 (en)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58138091A (en) * 1982-02-10 1983-08-16 シ−ケ−デイ株式会社 Device for automatically disposing electronic part
JP2718683B2 (en) * 1987-09-04 1998-02-25 株式会社日立製作所 Automatic mounting equipment for electronic components
JPH0749716B2 (en) * 1988-07-11 1995-05-31 鹿島建設株式会社 Concrete vibrating equipment
JPH02207600A (en) * 1989-02-07 1990-08-17 Matsushita Electric Ind Co Ltd Device for positioning board and device for mounting electronic component

Also Published As

Publication number Publication date
JPH04176198A (en) 1992-06-23

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