JPH02207600A - Device for positioning board and device for mounting electronic component - Google Patents
Device for positioning board and device for mounting electronic componentInfo
- Publication number
- JPH02207600A JPH02207600A JP1028168A JP2816889A JPH02207600A JP H02207600 A JPH02207600 A JP H02207600A JP 1028168 A JP1028168 A JP 1028168A JP 2816889 A JP2816889 A JP 2816889A JP H02207600 A JPH02207600 A JP H02207600A
- Authority
- JP
- Japan
- Prior art keywords
- board
- movable positioning
- mounting
- movable
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims abstract description 6
- 238000004904 shortening Methods 0.000 abstract 1
- 238000007796 conventional method Methods 0.000 description 3
- 230000001360 synchronised effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、リード付き及びリードレス電子部品をプリン
ト基板上の所定位置に挿入、装着する際、プリント基板
を所定の位置迄、搬送９位置決めを行う基板位置決め装
置及び電子部品実装装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention carries out 9-positioning of the printed circuit board to a predetermined position when inserting and mounting leaded and leadless electronic components to a predetermined position on a printed circuit board. The present invention relates to a board positioning device and an electronic component mounting device.
従来の技術
昨今、電子部品実装分野の拡大と共に電子部品実装装置
には高生産性、高稼働率が求められ、１屯当たりの実装
タクトの向上が、急速に進んでいる。BACKGROUND OF THE INVENTION In recent years, with the expansion of the field of electronic component mounting, high productivity and high operating rates are required of electronic component mounting equipment, and the mounting takt per ton is rapidly improving.
第６図、第６図を参照しながら、従来の基板保持Ｘ−Ｙ
テープμの機能について説明する。6, while referring to FIG. 6, the conventional substrate holding X-Y
The function of tape μ will be explained.
第６図は従来例として、電子部品装着装置中に組み込ま
れた基板保持テーブルを示している。電子部品挿入装置
に於てもこの基本的構成例は変わらない。FIG. 6 shows, as a conventional example, a board holding table built into an electronic component mounting apparatus. This basic configuration example remains the same in the electronic component insertion device.
１は部品供給テーブルであり、部品供給装置２を複数個
有しており、所定の電子部品１６を主軸３に吸着させる
様、位置決めを行う。４はノズルで、吸着した電子部品
１６を主軸３の間欠回転運動に伴い部品姿勢規正装置６
に送り、ここで規正された電子部品１６は次に所定の角
度方向に回転した後プリント基板１５に実装される。プ
リント基板１６は固定具１６により、基板保持テーブル
１４に固定されている。基板保持テープＡ／１４はポー
ルねじ２３の回転動作により、プリント基板１６を電子
部品１・６を有するノズ／Ｌ／４の装着位置下に来る様
位置決めｆＩｔＪ作を行う。１７はローダ−であり、前
工程より本装置に搬入した次基板１９を待機させている
。１８はアンローダ−でアリ、現在実装中の基板１６は
実装終了後、アンローダ−１８に搬出され、次工程へ送
られる。２ｏは基板搬送装置であり、ホールねじ２１に
より直線駆動を行う。２２はブラケットであり、基板１
６及び１９を基板保持テープ／Ｌ’１４から搬出或いは
、基板保持テープ／Ｉ／１４への搬入を行うものである
。Reference numeral 1 denotes a component supply table, which has a plurality of component supply devices 2, and positions a predetermined electronic component 16 so that it is attracted to the main shaft 3. Reference numeral 4 denotes a nozzle, which moves the electronic components 16 that have been sucked into the component posture adjustment device 6 along with the intermittent rotational movement of the main shaft 3.
The electronic component 16 regulated here is then rotated in a predetermined angular direction and then mounted on the printed circuit board 15. The printed circuit board 16 is fixed to the board holding table 14 by a fixture 16. The board holding tape A/14 performs a positioning operation fItJ by rotating the pole screw 23 so that the printed circuit board 16 is located below the mounting position of the nozzle/L/4 having the electronic components 1 and 6. Reference numeral 17 denotes a loader, which waits for the next substrate 19 carried into the apparatus from the previous process. Reference numeral 18 denotes an unloader. After the board 16 currently being mounted is finished being mounted, it is carried out to the unloader 18 and sent to the next process. Reference numeral 2o denotes a substrate transfer device, which is linearly driven by a hole screw 21. 22 is a bracket, and the board 1
6 and 19 are carried out from the substrate holding tape/L'14 or carried into the substrate holding tape/I/14.
以上の様に構成された電子部品装着装置についてその動
作を第６図を用いて説明する。第６図Ａは現在ヘッド３
の回転運動により基板１５へ実装中の状態を表わしてい
る。この時、次基板１９はローダ−１７で待機している
。基板１５への実装が終了した状態を示しているのが第
６図Ｂである。The operation of the electronic component mounting apparatus configured as described above will be explained using FIG. 6. Figure 6 A is currently head 3
The rotational movement of the board 15 represents the state in which it is being mounted on the board 15. At this time, the next substrate 19 is waiting in the loader 17. FIG. 6B shows a state in which the mounting on the board 15 has been completed.
ヘッド３は回転運動を停止し、次基板１９が、所定位置
へ来るまで、停止を続ける。基板保持テープ１ｖ１４が
、この時ローダ−１７とアンローダ−１８との間の位置
へ移動する。この時、基板保持テープＡ／１４のストロ
ーク長、或いはテープμサイズにより、ローダ−１７及
びアンローダ−１８が、あらかじめ基板保持テープ／Ｌ
’１４のストローク動作に干渉せぬ様な位置にあること
が多いがその場合ハ、ローダ−１７、アンローダ−１８
の移動もここで行われるが、基板１６と１９の搬入搬出
作°業のタイムロスとはならない。それは基板保持テー
ブル１４と同時に移動すればよいからである。次に第６
図Ｃに示すように、基板搬送装置２゜が、基板１５．１
９の後縁にブラケット２２を押し付け、ボールねじ２１
の回転駆動により、基板１６をアンローダ−１８へ搬出
、基板１９をローダ−１７から基板保持テープ／ｌ／１
４へ搬入する。The head 3 stops rotating and continues to stop until the next substrate 19 comes to a predetermined position. At this time, the substrate holding tape 1v14 moves to a position between the loader 17 and the unloader 18. At this time, depending on the stroke length of the substrate holding tape A/14 or the tape μ size, the loader 17 and unloader 18 may
In many cases, the position is such that it does not interfere with the stroke movement of '14.
The movement of the substrates 16 and 19 is also carried out here, but this does not result in a time loss in the work of loading and unloading the substrates 16 and 19. This is because it is sufficient to move the substrate holding table 14 at the same time. Next, the 6th
As shown in Figure C, the substrate transport device 2°
9, and press the bracket 22 against the rear edge of the ball screw 21.
The substrate 16 is carried out to the unloader 18 by the rotational drive of
Transport to 4.
この動作終了後、第６図りに示す様に基板保持テープ７
１／１４は基板１９への第１実装位置へ移動し、同時に
ヘッドの回転がスタートし、再び稼動状態となる。After this operation is completed, as shown in the sixth diagram, the board holding tape 7
1/14 moves to the first mounting position on the substrate 19, and at the same time, the head starts rotating and becomes operational again.
発明が解決しようとする課題
しかし上記の様な構成、動作では現在の基板への実装終
了時点から次の基板への実装開始迄、■基板保持テーブ
ルの実装最終ポイントから、プリント基板の基板保持テ
ーブルへの搬入、搬出位置迄の移動、■基板の搬入、搬
出動作、■次基板の第１実装点迄の移動、の３段階の動
作が必要になる。基板への装着点数が少なくなるにつれ
、稼動時間内における基板交換作業の占める割合は大き
くなり、−点画たりの装着挿入タクトが向上しても、基
板交換時間が早くならなくては、全体としての生産性は
向上しにくい。−例として、例えば、基板交換作業時間
と一点画たりの実装タクト比が２０対１で、−枚当たり
２０点実装する場合、１日の内半日は基板交換作業に費
やされることになる。Problems to be Solved by the Invention However, in the configuration and operation described above, from the end of mounting on the current board until the start of mounting on the next board, Three steps of operation are required: (1) loading and unloading the board, (2) moving the next board to the first mounting point. As the number of points to be mounted on a board decreases, the proportion of board replacement work in the operating time increases. Productivity is difficult to improve. - For example, if the board replacement work time and the mounting takt ratio per point is 20:1 and 20 points are mounted per board, half of the day will be spent on the board replacement work.
本発明は上記問題点に鑑み、基板交換作業時間を飛躍的
に向上し、実装機全体として見た生産性を向上させる基
板保持テープμを提供するものである。In view of the above-mentioned problems, the present invention provides a board holding tape μ that dramatically improves the board replacement work time and improves the productivity of the mounting machine as a whole.
課題を解決するための手段
上記問題点を解決するために、本発明の基板位置決め装
置及び電子部品実装装置は、平面状の支持部、前記支持
部上を移動可能で、プリント基板を搭載し、少なくとも
２個以上であり、一方が、一つの動作を実行中に、他方
が別の動作を実行し、互いに独立して移動可能である可
動位置決め部とから構成されている。Means for Solving the Problems In order to solve the above problems, a board positioning device and an electronic component mounting device of the present invention include a planar support part, movable on the support part, and equipped with a printed circuit board, There are at least two movable positioning parts, one of which performs one action while the other performs another action, and which are movable independently of each other.
作用
本発明は上記した構成により、一方の可動位置決め部に
於て、プリント基板上への電子部品装着挿入工程中に、
他方の可動位置決め部では、次のプリント基板を搬入し
ておシ、現在のプリント基板への実装終了後直ちに、次
のプリント基板への第１実装点へ移動し、基板交換に要
する時間を、今述べた可動位置決め部の基板搬入位置か
ら、第１実装位置への移動時間のみに短縮できるという
ものである。Effect The present invention has the above-described configuration, so that one movable positioning section can perform the following operations during the process of mounting and inserting electronic components onto a printed circuit board.
The other movable positioning unit carries in the next printed circuit board, and immediately after completing mounting on the current printed circuit board, moves to the first mounting point for the next printed circuit board, and the time required for replacing the board is The time required for the movable positioning section to move from the board loading position to the first mounting position can be reduced.
実施例
以下本発明の実施例の基板位置決め装置及び電子部品実
装装置について図面を参照しながら説明する。Embodiments Hereinafter, a substrate positioning apparatus and an electronic component mounting apparatus according to embodiments of the present invention will be described with reference to the drawings.
第１図は本発明の一実施例における電子部品装着装置と
基板位置決め装置を示すものである。１〜６迄は第５図
に示す従来例と同じであるので説明は省略する。６は電
子部品である。７は第１可動位置決め部であシ、駆動源
として自身に、２軸間時リニアシンクロナスモータを組
み込んでいる。FIG. 1 shows an electronic component mounting device and a board positioning device in one embodiment of the present invention. 1 to 6 are the same as the conventional example shown in FIG. 5, and therefore their explanation will be omitted. 6 is an electronic component. Reference numeral 7 denotes a first movable positioning section, which incorporates a two-axis time linear synchronous motor as a drive source.
第３図に当りニアモータの構成モチ°ｐを示す。１４は
プラテン、１６はＸ軸フォーサ、１６はＹ軸フォーサで
ある。FIG. 3 shows the configuration of the near motor. 14 is a platen, 16 is an X-axis forcer, and 16 is a Y-axis forcer.
第１図に戻！ｌ１８は基板９を固定保持する止め具であ
る。１０は第２可動位置決め部であり、第１可動位置決
め部７と同様、駆動源として、２軸間時リニアシンクロ
ナスモータを組み込んでいる。Return to Figure 1! 118 is a stopper that holds the board 9 fixedly. 10 is a second movable positioning section, which, like the first movable positioning section 7, incorporates a two-axis time linear synchronous motor as a drive source.
第２可動位置決め部１ｏは、次基板１１を既に固定して
おり、支持部１２の上を、第１可動位置決め部７は独立
して、互いに干渉せずに、平面移動が可能である。支持
部１２の上にはプラテン１４が凹凸状に組まれており、
これにより位置検出が可能になる。１３はＲＯＭであり
、実装点への位置決め、プリント基板の搬出、搬入のた
めの位置決め部がプログラム化されている。The second movable positioning part 1o has already fixed the next substrate 11, and the first movable positioning part 7 can independently move on a plane over the support part 12 without interfering with each other. A platen 14 is arranged in an uneven shape on the support part 12,
This enables position detection. Reference numeral 13 denotes a ROM, in which a positioning section for positioning to a mounting point, carrying out and carrying in a printed circuit board is programmed.
以上の様に構成された基板位置決め装置のＩＩｊＪ作を
第２図を用いて説明する。The construction of the substrate positioning device IIjJ constructed as described above will be explained with reference to FIG.
第２図において第２図Ａは、ｎ８口の基板９への実装動
作を示している。この時、第１可動位置決め部７は基板
９への電子部品実装のための位置決め動作を行い、−力
筒２可動位置決め部１０は、第１可動位置決め部７上の
プリント基板への実装と並行してｎ ＋ １番目の基板
１１の第２可動位置決め部１ｏへの搬入、保持を終了し
待機している。In FIG. 2, FIG. 2A shows the operation of mounting n8 ports onto the board 9. At this time, the first movable positioning section 7 performs a positioning operation for mounting electronic components on the board 9, and the force cylinder 2 movable positioning section 10 performs a positioning operation for mounting electronic components on the printed circuit board on the first movable positioning section 7. Then, the n+1th board 11 has been carried into the second movable positioning section 1o and held, and is now on standby.
第１可動位置決め部７の基板９への実装終了後、ヘッド
３は停止し第１可動位置決め部７は、基板搬出位置へ移
動し、同時に第２可動位置決め部１ｏは次基板１１を保
持して第１実装位置へ移動する。第２可動位置決め部１
ｏの第１実装点への到着を待って、ヘッド３は実装動作
を開始する。After the mounting of the first movable positioning section 7 on the substrate 9 is completed, the head 3 stops, the first movable positioning section 7 moves to the substrate unloading position, and at the same time, the second movable positioning section 1o holds the next substrate 11. Move to the first mounting position. Second movable positioning part 1
Waiting for the arrival of the head 3 at the first mounting point, the head 3 starts the mounting operation.
一方、第１可動位置決め部７は第２可動位置決め部１ｏ
への実装動作中に、ｎ＋２番目の基板の搬入位置へ移動
し、次々基板の搬入保持を行う。これを示したのが第２
図Ｃである。On the other hand, the first movable positioning part 7 is the second movable positioning part 1o.
During the mounting operation, the device moves to the loading position of the (n+2)th board, and carries in and holds the boards one after another. This is shown in the second
This is diagram C.
以上で述べた一連の動作は全てプログラム化され、各々
の可動位置決め部上のＲＯＭＫ登録されている。プログ
ラムのフローチャートを第４図に示す。The series of operations described above are all programmed and registered in the ROMK on each movable positioning section. A flowchart of the program is shown in FIG.
本実施例では、駆動源を可動位置決め部に組み込んでい
るが、逆に支持部に設けても構わない。In this embodiment, the drive source is incorporated in the movable positioning section, but it may be provided in the support section conversely.
又、可動位置決め部にＲＯＭを搭載したが、外部から位
置指令を行っても構わない。Further, although the ROM is mounted on the movable positioning section, position commands may be given from outside.
以上の様に、本実施例で示した構成をとれば、基板交換
に費やす時間が、その前の基板の実装終了から、次基板
を保持した可動位置決め部が待機場所より、第１実装点
へ移動する時間のみになる。As described above, if the configuration shown in this embodiment is adopted, the time spent on replacing the board can be reduced from the time when the previous board has been mounted, until the movable positioning unit holding the next board moves from the waiting area to the first mounting point. It only takes time to move.
これは従来方式に比べ、基板搬入、搬出ｔｏｉに費やす
時間の削除、可動位置決め部移動時間の半減を可能とす
る。Compared to the conventional method, this makes it possible to eliminate the time spent loading and unloading the substrates, and to halve the time required to move the movable positioning unit.
発明の効果
以上の様に本発明は、互いに独立駆動可能な少なくとも
２個以上の可動位置決め部を用いて、−方の可動位置決
め部に於て実装工程中に他方のテーブルにより、基板の
搬出、搬入を行っているので、基板交換に要する時間が
、前基板への実装終了から、次基板を保持している可動
位置決め部が待機場所から第１実装点迄移動する時間の
みとなり、従来方式に比べ、基板の搬入搬出速度の削除
、可動位置決め部の移動時間の半減が可能である。Effects of the Invention As described above, the present invention uses at least two or more movable positioning parts that can be driven independently of each other, so that the - one movable positioning part can carry out the board by the other table during the mounting process. Since the board is carried in, the time required to replace the board is only the time required for the movable positioning unit that holds the next board to move from the waiting area to the first mounting point after the completion of mounting on the previous board, which is different from the conventional method. In comparison, it is possible to reduce the loading/unloading speed of the board and the moving time of the movable positioning unit by half.
その結果、基板交換段取り時間を飛躍的に短縮し生産性
の向上に貢献する。又、従来方式におけるローダ一部、
アンローダ一部及び基板搬送部も不要になり装置全体の
シンプル化につながる。As a result, the board replacement setup time is dramatically reduced, contributing to improved productivity. Also, part of the loader in the conventional method,
Part of the unloader and the substrate transport section are also unnecessary, leading to the simplification of the entire device.
第１図は本発明の一実施例における電子部品実装装置の
斜視図、第２図へ、Ｂ、Ｃは可動位置決め部の動作を示
す電子部品実装装置の概略平面図、第３図は２軸向時リ
ニアシンクロナスモータの構造を示す斜視図、第４図は
本発明の可動位置決め部の動作をプログラム化したフロ
ーチャート図、第６図は従来の電子部品実装装置の斜視
図、第６図Ａ、Ｄは従来の基板交換作業を示す同概略平
面図である。
３・・・・・・ヘッド、７・・・・・・第１可動位置決
め部、９・・・・・・ｎ番目の基板、１０・山・・第２
可動位置決め部、１１・・・・・・ｎ＋１番めの基板、
１２・・・・・・支持部。
代理人の氏名 弁理士 粟 野 重 孝 ほか１名第
図
ｑ −−−ｎ魯Ｂつ基板FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a schematic plan view of the electronic component mounting apparatus showing the operation of the movable positioning section, and FIG. FIG. 4 is a perspective view showing the structure of a time-directed linear synchronous motor; FIG. 4 is a flowchart showing a programmed operation of the movable positioning unit of the present invention; FIG. 6 is a perspective view of a conventional electronic component mounting apparatus; FIG. 6A; D is the same schematic plan view showing the conventional board replacement work. 3...Head, 7...First movable positioning section, 9...Nth board, 10. Mountain...Second
Movable positioning unit, 11...n+1th board,
12...Support part. Name of agent: Patent attorney Shigetaka Awano and one other person
Claims (4)
かつプリント基板を搭載した可動位置決め部を有してな
り、この可動位置決め部は少なくとも２個以上設けられ
、一方が一つの動作を実行中に他方が別の動作を実行し
、互いに独立して移動可能である基板位置決め装置。(1) A planar support part, movable on this support part,
and has a movable positioning section mounted with a printed circuit board, and at least two movable positioning sections are provided, one of which executes one operation while the other executes another operation, and moves independently of each other. Board positioning device that is possible.
入を行い、同時に他方の可動位置決め部が基板への処理
を行うことを特徴とする特許請求の範囲第（１）項記載
の基板位置決め装置。(2) The board positioning device according to claim (1), wherein one movable positioning section carries out loading and unloading of the printed circuit board, and at the same time, the other movable positioning section processes the board. .
駆動源としてリニアモータを使用していることを特徴と
する特許請求の範囲第（１）項記載の基板位置決め装置
。(3) The substrate positioning device according to claim (1), wherein the movable positioning parts use linear motors as drive sources for independently driving each movable positioning part on a plane.
基板の所定位置へ実装する電子部品実装装置において、
平面状の支持部と、この支持部上を移動可能で、かつプ
リント基板を搭載した可動位置決め部と、電子部品を吸
着或いは把持し、実装地点迄移載する実装ヘッド部とを
設け、前記可動位置決め部は少なくとも２個以上設けら
れ、一方の可動位置決め部にてプリント基板への実装中
に、他方の可動位置決め部にて、プリント基板の搬入，
搬出を行うことを特徴とする電子部品実装装置。(4) In an electronic component mounting apparatus that sequentially takes out electronic components from a component supply section and mounts them at predetermined positions on a printed circuit board,
A planar support part, a movable positioning part that is movable on the support part and has a printed circuit board mounted thereon, and a mounting head part that sucks or grips electronic components and transfers them to a mounting point are provided. At least two positioning parts are provided, and while one movable positioning part is mounting the printed circuit board, the other movable positioning part is used to carry in the printed circuit board,
An electronic component mounting device characterized by carrying out unloading.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1028168A JPH02207600A (en) | 1989-02-07 | 1989-02-07 | Device for positioning board and device for mounting electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1028168A JPH02207600A (en) | 1989-02-07 | 1989-02-07 | Device for positioning board and device for mounting electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02207600A true JPH02207600A (en) | 1990-08-17 |
Family
ID=12241212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1028168A Pending JPH02207600A (en) | 1989-02-07 | 1989-02-07 | Device for positioning board and device for mounting electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02207600A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04176198A (en) * | 1990-11-07 | 1992-06-23 | Matsushita Electric Ind Co Ltd | Component mounting device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61214925A (en) * | 1985-03-20 | 1986-09-24 | Matsushita Electric Ind Co Ltd | Working apparatus of table moving type |
-
1989
- 1989-02-07 JP JP1028168A patent/JPH02207600A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61214925A (en) * | 1985-03-20 | 1986-09-24 | Matsushita Electric Ind Co Ltd | Working apparatus of table moving type |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04176198A (en) * | 1990-11-07 | 1992-06-23 | Matsushita Electric Ind Co Ltd | Component mounting device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2000168040A (en) | Screen printer | |
| KR20010090483A (en) | Components mounting apparatus | |
| TWI451819B (en) | Installation device and installation method of electronic parts | |
| JP3245409B2 (en) | Semiconductor device | |
| JPH02207600A (en) | Device for positioning board and device for mounting electronic component | |
| JP3165289B2 (en) | Surface mounting machine | |
| JP2014063946A (en) | Substrate processing apparatus | |
| JP2925670B2 (en) | Component mounting device and component mounting method | |
| JP4107712B2 (en) | Electronic component mounting method | |
| KR20010002599A (en) | Surface Mounting Device | |
| JP3019886B2 (en) | Electronic component mounting equipment | |
| JPH0783199B2 (en) | Electronic component mounting method | |
| JPS59133149A (en) | Circuit printing board positioning device | |
| JP2001185898A (en) | Parts mounting machine | |
| JPS5941889A (en) | Device for mounting electronic part | |
| JP4149718B2 (en) | Component mounting method | |
| JP2004047818A (en) | Component mounting device | |
| JPH10229298A (en) | Electronic part mounting equipment | |
| JP2978980B2 (en) | Automatic assembly apparatus and component supply method therefor | |
| JPH0370199A (en) | Mounting device and method for electronic component | |
| JPH0815238B2 (en) | Electronic component automatic mounting device | |
| JPH0422195A (en) | Mounting method for electronic component | |
| JPH02207595A (en) | Electronic component mounting device | |
| JPH0682960B2 (en) | Circuit board support device | |
| JPH0516973B2 (en) |