JPH0516973B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a chip mounting apparatus, and more particularly to an apparatus for hybrid mounting chips on a plurality of wafers onto a substrate with good workability.

(Prior art) Electronic components such as ICs and LSIs are generally semiconductor chips (hereinafter simply referred to as "chips") on wafers.
After mounting the chip on a lead frame, the chip is molded with synthetic resin, and then the lead frame is punched and formed. This synthetic resin molded body is used to protect the chip, but when the molded body is formed, the size of the electronic components becomes considerably large, and there is a problem that a large number of electronic components cannot be mounted on a board at high density. For this reason, wafer chips are mounted on a substrate as they are without molding the chips with a mold body.

By the way, monolithic mounting technology, in which one chip of one type is mounted on a board, has been almost established, but hybrid mounting technology, in which multiple chips of various types are mounted on a board, has not yet been fully established. It was hot.

FIG. 3 shows a conventional hybrid mounting technique for mounting various types of chips on a board. In the figure, 12 is a substrate, which is conveyed along the conveyor 11 in the direction of arrow C. 1 is a chip supply device, which has a block 3 mounted on an XY table 2;
A plurality (five) of wafer holding jigs 6 are linearly attached to this block 3. Each jig 6 holds a wafer 7 to which chips of different types are attached. 4 is an X-direction motor, and 5 is a Y-direction motor.

9 is a transfer device (basic machine),
It is equipped with two heads 8. One head (lower head in the figure) 8 reciprocates between the wafer 7 and the positioning device 10 in the direction of arrow A, picks up a chip on the wafer 7, and transfers and mounts it onto the positioning device 10. The other head (the upper head in the figure) 8 reciprocates between the positioning device 10 and the substrate 12, picks up the chip whose positional deviation has been corrected in the positioning device 10, and transfers and mounts it on the substrate 12. .

(Problems to be Solved by the Invention) The above-mentioned conventional device drives the X-direction motor 4,
By linearly reciprocating the block 3 in the X direction, the wafer 7 having chips of the desired type is
is moved to the pick-up position of the head 8. However, with such a method,
The movement stroke in the X direction becomes extremely long,
The time required for movement becomes longer, which not only reduces work efficiency, but also reduces the accuracy of the stopping position, making it easier for the head 8 to make frequent pick-up mistakes, and furthermore, requiring a large installation space in the X direction. There were some problems, such as:

In addition, in this type of chip mounting equipment, the board 1
Adhesive must be applied in advance to the location where the second chip is to be mounted. For this reason, in the conventional means, an adhesive coating device (not shown) is separately installed as a pre-process, and this adhesive coating device is used to coat the substrate 12.
A coating agent is applied in advance to predetermined positions (of course, at multiple positions) on the substrate 12, and then conveyed by the conveyor 11.
The chip is then transported to a position directly below the head 8, and then, as described above, the two heads 8 are used to mount the chip on the board 12.

However, with such a configuration, not only does the entire device become large and complicated, requiring a large amount of installation space, but also requires a series of steps such as applying adhesive, correcting chip misalignment, and mounting the chip on the substrate 12. It is not possible to perform the various operations efficiently while closely coordinating each other, resulting in poor work efficiency, a considerable amount of time required to hybridly mount multiple types of chips on the board 12, and furthermore, equipment Various problems arose, including that the overall operation and maintenance management became extremely troublesome.

SUMMARY OF THE INVENTION An object of the present invention is to solve the problems of the conventional device described above and to provide a means for hybrid mounting various types of chips on a board with good workability using a compact structure.

(Means for Solving the Problems) For this purpose, in the present invention, a chip supply device for supplying chips to a first head is composed of an XY table and an indexing device supported by the XY table. Then, a plurality of wafer holding jigs are arranged around this indexing device,
By driving this indexing device to horizontally rotate the plurality of wafer holding jigs, a wafer to be supplied with chips to the first head is selected, and this XY table is driven to select the wafer to be supplied with chips. By moving the wafer holding jig in the XY direction, the chips on the wafer are
It is positioned at the pick-up position of the head of the camera.

Furthermore, the chip that has been transferred to the positioning device by the first head and whose position has been corrected is picked up by the second head and mounted on the substrate on the substrate holder. An adhesive application means that moves back and forth is provided, and the adhesive is applied in advance to the position on the substrate where the chip is to be mounted.

(Operation) In the above configuration, by driving the indexing device to horizontally rotate the jig, the wafer, that is, the type of chip to be mounted on the substrate is selected. Also, by driving the XY table and moving the selected wafer in the XY direction,
Place the tip in the pick-up position of the head. Therefore, according to the above configuration, chips of a desired type of wafer can be smoothly supplied to the head.
The first head can reliably pick up chips on a wafer.

In addition, adhesive is applied in advance to the position on the substrate where the chip is mounted by an adhesive application means that moves back and forth in the same way as both heads, so that the first head picks up the chip on the wafer and the picked up chip is removed. Transfer and mounting the chip onto the positioning device, picking up the chip on the positioning device using the second head and mounting it on the substrate on the substrate holder, and applying adhesive to the predetermined position of the substrate using the adhesive application means. However, these operations are carried out as a series of operations in close coordination with each other without waste of operations, and therefore hybrid mounting can be carried out with extremely good work efficiency and at high speed.

(Example) Next, an example of the present invention will be described with reference to the drawings.

FIG. 2 is an overall perspective view of the chip mounting apparatus 24. In the figure, reference numeral 11 denotes a conveyor for transporting substrates 12, which transports substrates 12 in a first stocker 19 held by a lifter (loader) 17 toward a second stocker 19 held by a lifter (unloader) 18. transport. A pushing device 20 is provided behind the stocker 19 on the side of the lifter 17, and pushes out the substrate 12 in the stocker 19 onto the conveyor 11. Alternatively, a carrying device 25 is provided in front of the stocker 19 on the lifter 18 side. This carry-in device 25 is a conveyor 11 on which chips have been loaded.
The upper substrate 12 is carried into the stocker 19. 26
is a guide rail for loading.

A substrate holder 21 is provided midway along the conveyor 11. This board holder 21 is designed to mount a chip at a predetermined coordinate position on the board 12.
The board 12 is moved in the XY directions.

9 is a transfer device (hereinafter referred to as basic machine)
As shown in FIG.
It has a, 8b, and 8c. As shown,
The three heads 8a, 8b, 8c are connected to the conveyor 11.
They are arranged in parallel on a straight line in the Y direction perpendicular to the transport direction (X direction) of the substrate 12. Further, below the basic machine 9, an epoxy unit 16,
The substrate holder 21, positioning device 10, chip ejector 15, and chip supply device 1 are arranged in parallel in the Y direction.

The epoxy unit 16 has a chip attached to the substrate 12.
Equipped with adhesive to adhere to. The positioning device 10 corrects the positional deviation of the chip mounted thereon. The ejector 15 pushes up the chips on the wafer 7 from below.

The three heads 8a, 8b, 8c are driven by the basic machine 9 in the Y direction (arrow A direction).
Travel back and forth. Of these, the third head 8a serving as adhesive application means is connected to the epoxy unit 16.
and the substrate 12 on the substrate holder 21 to apply the adhesive of the epoxy unit 16 to the substrate 12.
Apply in advance to the location where the chip will be mounted. Further, the first head 8c reciprocates between the wafer 7 of the chip supply device 1 and the positioning device 10, picks up the chips of the wafer 7, and transfers and mounts them on the positioning device 10. During this pick-up,
The ejector 15 pushes up the chips on the wafer 7 from below so that the head 8c can easily pick up the chips.

The second head 8b reciprocates between the positioning device 10 and the substrate 12, picks up the chip whose positional deviation has been corrected in the positioning device 10, and picks up the chip that has been previously applied to the substrate 12 by the head 8a as described above. Mount on adhesive.

Note that the three heads 8a, 8b, and 8c do not necessarily need to be integrally moved back and forth in the Y direction.
In short, it is sufficient that the heads 8a, 8b, 8c are reciprocated in conjunction with each other, but as in this embodiment, the three heads 8a, 8b, 8c can be reciprocated in the Y direction as a unit by driving the same basic machine 9. It is more advantageous in terms of equipment configuration and operation management.

Next, the detailed structure of the chip supply device 1 will be explained. 1 and 2, reference numeral 2 denotes an XY table, and an indexing device (pitch rotation device) 14 is provided on this XY table 2. In FIG. 4 is the X direction motor of XY table 2, 5 is the Y
It is a directional motor. A plurality of (eight in this embodiment) wafer holding jigs 6 are arranged radially around the index device 14. The jig 6 holds wafers 7, and each of the eight wafers 7 has chips of different types attached thereto.

When the indexing device 14 is driven, the eight jigs 6 horizontally rotate in the direction of arrow D around the indexing device 14, and pick up the wafers 7 having chips of the desired type from the pick-up device of the first head 8c.
That is, it is stopped directly above the ejector 15.
That is, this indexing device 14 selects the wafer 7.

Also, when the XY table 2 is driven, this selected wafer 7 moves in the XY direction, and the wafer 7
Place the upper chip at the pick-up position directly below the head 8c.

This chip mounting apparatus has the above-mentioned configuration, and the overall operation will be explained next.

The substrate 12 pushed out from the stocker 19 onto the conveyor 11 by the pushing device 20 is conveyed by the conveyor 11 and stopped on the substrate holder 21 . Next, with the substrate 12 positioned on the substrate holder 21, the basic machine 9 is driven, and the three heads 8a, 8b, 8c simultaneously reciprocate in the Y direction, so that the third head 8a is attached to the epoxy unit. 16 adhesive to the substrate 12
The first head 8c picks up the chip on the wafer 7 and transfers it to the positioning device 10, and the second head 8b picks up the chip whose misalignment has been corrected by the positioning device 10 and transfers it to the substrate 12. mounted on the adhesive.

Such a series of linked operations is performed on one board 12.
By repeating the process multiple times, the substrate 1
2 is equipped with a hybrid of multiple types of chips. Of course, in this case, by driving the substrate holder 21 and moving the substrate 12 in the XY directions, the adhesive is applied to a predetermined coordinate position on the substrate 12, and the chip is mounted.

As described above, chips of a plurality of types are mounted on the substrate 12 in a hybrid manner, but the type of chips can be changed by driving the indexing device 14 to select the first wafer 7, which has chips of the desired type, and the like.
This is done by moving the head 8c to the pick-up position.

After the chips have been loaded onto the substrate 12, the substrate 12 is conveyed to the conveyor 11 and collected into the stocker 19 of the lifter 18. Then, the next substrate 12 is sent out from the stocker 19 of the lifter 17, and the above operation is repeated.

(Effects of the Invention) As explained above, according to the present invention, a wide variety of chips can be hybrid mounted on a board with good workability. Furthermore, since the type of chip is changed using the indexing device installed on the XY table, high-speed switching is possible, increasing work efficiency, and the stopping position accuracy of the indexing device is extremely high. Therefore, pick-up errors in the first head can be drastically reduced, and the installation space for the chip feeding device can be reduced, so that the entire chip mounting device can be constructed compactly.

In addition, adhesive is applied in advance to the position on the substrate where the chip is mounted by an adhesive application means that moves reciprocally in the same way as both heads, so that the first head picks up the chip on the wafer and picks up the chip. The second head picks up the chip on the positioning device and places it on the substrate on the substrate holder, and the adhesive application means applies adhesive to a predetermined position on the substrate. , are carried out as a series of operations in close coordination with each other without waste of operations, and therefore hybrid mounting can be carried out with extremely good work efficiency and at high speed. Furthermore, since the adhesive application means can be incorporated into the device together with the first head and the second head, the entire chip mounting device can be configured compactly, and operation management and maintenance management are also extremely advantageous. can be done.

[Brief explanation of drawings]

The figure shows an embodiment of the present invention.
2 is a perspective view of the entire chip mounting apparatus, and FIG. 3 is a plan view of the main part of a conventional chip mounting apparatus. 1... Chip supply device, 2... XY table,
6... Wafer holding jig, 7... Wafer, 8
a... Adhesive application means, 8b... Second head,
8c...first head, 10...positioning device,
11... Conveyor, 12... Board, 14... Index device, 19... Stocker, 21... Board holder.

Claims (1)

[Claims] 1. A conveyor that transports substrates from a first stocker to a second stocker, a substrate holder that is provided in the middle of this conveyor and that moves the substrates in the XY direction, and a conveyor that moves the substrates in the XY direction. A chip positioning device and a chip supply device are arranged in parallel, and a second device moves back and forth between the chip supply device and the positioning device to transfer and load chips on a wafer installed in the chip supply device onto the positioning device. a second head that reciprocates between this positioning device and the substrate on the substrate holder and transfers and mounts the chip, whose positional deviation has been corrected in this positioning device, on the substrate; The chip supply device is equipped with an adhesive application means that reciprocates in the same direction as both heads and applies adhesive in advance to the position on the board where the chip is to be mounted.
It consists of an indexing device supported on a table and a plurality of wafer holding jigs placed around the indexing device.The indexing device is driven to horizontally hold these wafer holding jigs. selecting a wafer to supply chips to the first head by rotating the wafer;
Further, the chip on the wafer is positioned at the pick-up position of the first head by driving the XY table and moving the selected wafer holding jig in the XY direction. Chip mounting equipment.