WO2022190976A1

WO2022190976A1 - Bonding device and bonding method

Info

Publication number: WO2022190976A1
Application number: PCT/JP2022/008783
Authority: WO
Inventors: 祐介久保田
Original assignee: キヤノンマシナリー株式会社
Priority date: 2021-03-12
Filing date: 2022-03-02
Publication date: 2022-09-15
Also published as: JP2022139910A

Abstract

A bonding device 10 includes a delivery position Pc1 (Pc2) of a chip C1 (C2), a pickup head 14, and a bonding head 15 that are provided between a pickup position Pa of the chip C1 (C2) and a bonding position Pb1 (Pb2). Where the feed direction of a member 12 provided with the bonding positions Pb1 and Pb2 is an X direction and the direction orthogonal to the X direction is an Y direction, the delivery position Pc1 (Pc2) is provided at a plurality of locations in the X direction correspondingly to the plurality of bonding positions Pb1, Pb2 adjacent to each other in the X direction, and the pickup head 14 is configured to be movable in the X direction and Y direction toward the delivery position Pc1 (Pc2) corresponding to the bonding position Pb1 (Pb2) to which the picked-up chip C1 (C2) is supplied.

Description

Bonding device and bonding method

The present invention relates to a bonding apparatus and bonding method.

In the manufacture of semiconductor products, a wafer on which a large number of semiconductor elements are collectively manufactured is diced to separate individual semiconductor chips (hereinafter simply referred to as "chips"), and the separated chips are placed on lead frames one by one. A method of chip bonding is adopted in which bonding is performed at a predetermined position (bonding position) such as.

Conventional methods of this type include a method of transporting chips directly from a wafer to a bonding position, as well as a method of picking up chips at a pickup position and supplying them to an intermediate stage, as described in Patent Document 1 and the like. A system is known in which the chips supplied onto the intermediate stage are picked up again and supplied to the island portion of the lead frame as the bonding position.

In addition, as a device for picking up a chip and conveying it to a predetermined position, as described in Patent Document 2 and the like, an X movable portion capable of reciprocating along the X direction and a device capable of reciprocating along the Y direction. and a Z movable portion capable of reciprocating along the Z direction; and a bonding head provided on the Z movable portion of the driving device and having a collet capable of sucking a chip as a work. is known.

Therefore, the transfer apparatus described in Patent Document 2 and the like is applied to transfer chips between a pickup position and a predetermined position on the intermediate stage, and to transfer chips between a predetermined position on the intermediate stage and a bonding position. By doing so, it becomes possible to supply the chip to the bonding position via the intermediate stage.

Retable No. 2018/225664 Japanese Unexamined Patent Application Publication No. 2020-31078

As described above, when the chip bonding positions are set on the island portions of the lead frame, generally one chip is supplied to each island portion. On the other hand, depending on the type of semiconductor product, a plurality of chips may be supplied (mounted) per island.

For such a bonding position arrangement mode, for example, as shown in FIG. 19, a method of moving the lead frame 112 by a predetermined pitch according to the bonding positions Pb1 and Pb2 can be considered. In this case, the lead frame 112 is supported by a supporting/conveying device 117 and can be conveyed by a predetermined pitch along a predetermined direction (hereinafter simply referred to as the X direction). Further, the lead frame 112 is provided with a plurality of island portions 116 in a predetermined arrangement, and each island portion 116 is provided with two bonding positions Pb1 and Pb2 adjacent to each other in the X direction. In FIG. 19, the member denoted by reference numeral W is a wafer, the member denoted by reference numeral 111 is a wafer support, the member denoted by reference numeral 113 is an intermediate stage, the member denoted by reference numeral 114 is a pickup head, A member denoted by reference numeral 115 is a bonding head.

In this case, one bonding position (first The lead frame 112 is arranged so that the center position of the bonding position Pb1) in the X direction is positioned. A chip corresponding to the first bonding position Pb1 (hereinafter referred to as a first chip C1) is picked up from the wafer W by the pickup head 114 and placed at a predetermined position (intermediate position Pc) on the intermediate stage 113. , the chip C1 is placed. After that, the bonding head 115 picks up the first chip C1 from the intermediate position Pc and mounts the first chip C1 on the predetermined position on the island part 116, which is the first bonding position Pb1 on the reference line L here. and perform the prescribed bonding work.

When supplying a chip C2 (hereinafter referred to as a second chip C2) corresponding to a second bonding position Pb2 adjacent to the first bonding position Pb1 in the X direction, as shown in FIG. The lead frame 112 is conveyed by a predetermined pitch in the X direction by the support conveying device 117, and the center position of the second bonding position Pb2 in the X direction is arranged on the reference line L. Then, the pickup head 114 picks up the second chip C2 from the wafer W and mounts the second chip C2 at a predetermined position (intermediate position Pc) on the intermediate stage 113 . After that, the bonding head 115 picks up the second chip C2 from the intermediate position Pc, places the second chip C2 on the second bonding position Pb2, and performs a predetermined bonding operation.

In this way, by transporting the chip C1 (C2) while feeding the lead frame 112 by a predetermined pitch in the X direction, for example, the bonding head 115 can be moved only in the Y and Z directions without moving in the X direction. Chip C1 (C2) can be supplied to bonding position Pb1 (Pb2). Therefore, compared to the case where the bonding head 115 is moved in the X direction to supply the chip C1 (C2) to the bonding position Pb1 (Pb2) (not shown), when the chip C1 (C2) is supplied, the chip C1 (C2) Vibration applied to is suppressed. As a result, bonding of the chip C1 (C2) can be performed with high positional accuracy.

However, on the other hand, if the lead frame 112 is moved each time bonding is performed, the number of times the lead frame 112 is sent increases, which may lead to a decrease in production efficiency. In addition, taking into account the fact that the risk of inducing misalignment of the lead frame 112 increases as the number of times of feeding increases, lowering the feeding speed also leads to a decrease in production efficiency.

The above problem is not limited to the case of supplying two or more chips per island part of the lead frame. For example, when the number of bonding positions arranged in the feed direction is larger than the number of general arrays, or when chips are supplied across two island parts per feed position of the lead frame, etc., it can be done efficiently in a short time. It can occur in any process that requires feeding a chip to a bonding location.

In view of the above circumstances, the technical problem to be solved in this specification is to enable chips to be accurately supplied to bonding positions while increasing production efficiency by reducing standby time.

The solution of the above problems is achieved by the bonding apparatus according to the present invention. That is, in this device, a delivery position serving as a delivery point of the chip is provided between a pickup position and a bonding position of the chip as a semiconductor element, and a pickup head for transporting the chip from the pickup position to the delivery position. , and a bonding head for transporting a chip from a delivery position to a bonding position, where the feeding direction of the member provided with the bonding position is the X direction, and the direction perpendicular to the X direction is the Y direction. Furthermore, the delivery positions are provided at a plurality of locations in the X direction corresponding to a plurality of bonding positions adjacent in the X direction, and the pickup head is located at a bonding position to which the picked-up chips are to be supplied, among the plurality of delivery positions. It is characterized in that it is configured to be movable in the X and Y directions toward a delivery position corresponding to the .

As described above, in the bonding apparatus according to the present invention, a plurality of delivery positions are provided in the X direction corresponding to a plurality of bonding positions adjacent in the X direction, and among the plurality of delivery positions, the picked-up chip is supplied to a destination. The pickup head can be moved in the X direction and the Y direction toward the transfer position corresponding to each bonding position. In this manner, the chip delivery positions are set at a plurality of locations in the X direction, and the pickup head can be moved in the X and Y directions toward a predetermined delivery position corresponding to the picked-up chip. can be supplied to the delivery position at substantially the same position in the X-direction as the bonding position to which it is supplied. Therefore, the chip can be transferred from the delivery position to the bonding position without moving the bonding head greatly in the X direction and without moving the member such as the lead frame provided with the bonding position in the X direction each time. Therefore, the vibration applied to the chip when the chip is placed on the bonding position, particularly the vibration in the X direction, can be minimized, and the chip can be accurately supplied to the bonding position. In addition, since it is not necessary to move the member provided with the bonding position in the X direction each time the delivery position is switched, the waiting time can be reduced, thereby improving the production efficiency.

Further, in the bonding apparatus according to the present invention, the pickup head may be configured to move linearly from the pickup position to the delivery position by moving in the Y direction along with the movement in the X direction.

By making the pick-up head linearly movable in this way, it is possible to move the pick-up head in the state of picking up chips to the delivery position in the shortest distance while switching the delivery position. Therefore, a series of operations from picking up to bonding can be performed in a shorter time, and production efficiency can be further improved.

Also, in the bonding apparatus according to the present invention, each of the plurality of delivery positions may be provided at the same position in the X direction as the corresponding bonding position.

By providing the transfer position in this way, the bonding head can be moved to the bonding position in the shortest distance without moving in the X direction. Therefore, it is possible to further shorten the time required for a series of operations from pick-up to bonding while ensuring the positional accuracy at the time of bonding.

Further, in the bonding apparatus according to the present invention, all of the plurality of delivery positions may be provided on a delivery stage fixed at a predetermined position in the X direction.

By providing each delivery position on the delivery stage fixed at a predetermined position in this way, the positional accuracy of the delivery position is stabilized. Therefore, it is possible to improve the access accuracy of the pickup head or bonding head and realize stable pickup.

Alternatively, in the bonding apparatus according to the present invention, a delivery stage may be provided at the delivery point, and a mounting portion on which a chip can be placed may be provided on the delivery stage. Further, in this case, the transfer stage may be movable in the X direction so that the placement section can be arranged at any one of the plurality of transfer positions.

In this way, the delivery stage is provided with a placement section on which a chip can be placed, and the delivery stage is made movable in the X direction so that the placement section can be arranged at an arbitrary delivery position among a plurality of delivery positions. Accordingly, it is possible to correspond to a plurality of delivery positions by providing only one chip mounting portion on the delivery stage. Moreover, since it is sufficient to provide only one chip mounting portion, it is possible to avoid an increase in the size and complexity of the delivery stage, thereby reducing the equipment cost.

Further, in the bonding apparatus according to the present invention, the island portion may be provided on the lead frame as a member on which the bonding position is provided, and the island portion may be provided with the bonding position. Further, in that case, the X-direction center position of the island portion, the X-direction center position of the transfer stage on which the transfer position is provided, and the X-direction center position of the wafer on which the pickup position is provided may be set at the same position.

Thus, the present invention can be particularly preferably applied when bonding positions are provided on the island portion of the lead frame. In that case, by aligning the center positions of the island portion, the transfer stage, and the wafer in the X direction, the positioning of the transfer position and the bonding position can be performed using a common reference, so that the positioning is easy and highly accurate. can go to

Further, when the bonding positions are provided on the island portion as described above, in the bonding apparatus according to the present invention, a plurality of bonding positions are provided for one island portion, and a plurality of bonding positions are provided at the same positions in the X direction as the respective bonding positions. A delivery location may be provided.

As described above, the present invention makes it possible to cope with a plurality of transfer positions by moving the pickup head in the X direction, thereby improving both the production efficiency and the positional accuracy when chips are mounted on the bonding positions. Therefore, it is particularly suitable when a plurality of bonding positions are provided for one island portion and a plurality of delivery positions are provided at the same positions in the X direction as the bonding positions.

Further, the solution of the above problems is also achieved by the bonding method according to the present invention. That is, in this bonding method, a transfer position serving as a chip transfer point is provided between a pick-up position and a bonding position of a chip as a semiconductor element, and a first transfer step of transferring the chip from the pickup position to the transfer position. and a second transporting step of transporting the chip from the delivery position to the bonding position, wherein the feeding direction of the member provided with the bonding position is the X direction, and the direction orthogonal to the X direction is the Y direction. In this case, the delivery positions are provided at a plurality of locations in the X direction corresponding to a plurality of bonding positions adjacent to each other in the X direction, and in the first transfer step, the pickup head in a state of picking up the chips is placed at the plurality of delivery positions. Among them, it is characterized by moving in the X direction and the Y direction toward the transfer position corresponding to the bonding position to which the picked-up chip is to be supplied.

As described above, in the bonding method according to the present invention, a plurality of delivery positions are provided in the X direction corresponding to a plurality of bonding positions adjacent in the X direction, and among the plurality of delivery positions, the picked-up chip is supplied. A pick-up head picking up a chip is moved in the X direction and the Y direction toward a transfer position corresponding to a different bonding position. By setting the chip transfer positions at a plurality of locations in the X direction and moving the pickup head in the X and Y directions toward a predetermined transfer position corresponding to the picked-up chip, bonding according to the present invention can be achieved. As with the apparatus, the picked-up chip can be supplied to the transfer position which is located at substantially the same position in the X direction as the bonding position to which the chip is to be supplied. Therefore, the chip can be transferred from the delivery position to the bonding position without moving the bonding head greatly in the X direction and without moving the member such as the lead frame provided with the bonding position in the X direction each time. Therefore, the vibration applied to the chip when the chip is placed on the bonding position, particularly the vibration in the X direction, can be minimized, and the chip can be accurately supplied to the bonding position. In addition, since it is not necessary to move the member provided with the bonding position in the X direction each time the delivery position is switched, the waiting time can be reduced, thereby improving the production efficiency.

In addition, in the bonding method according to the present invention, in the first transporting step, the pickup head picking up the chip is moved in the Y direction along with the movement in the X direction, thereby moving the pickup head from the pickup position to the bonding position. It may be moved linearly toward the delivery position corresponding to the position.

By moving the pick-up head linearly in this way, it is possible to move the pick-up head in the state of picking up chips to the delivery position in the shortest distance while switching the delivery position. Therefore, a series of operations from picking up to bonding can be performed in a shorter time, and production efficiency can be further improved.

As described above, according to the present invention, it is possible to accurately supply chips to bonding positions while improving production efficiency by reducing standby time.

BRIEF DESCRIPTION OF THE DRAWINGS It is a top view which shows the outline|summary of the bonding apparatus which concerns on 1st embodiment of this invention. It is the side view which looked at the bonding apparatus shown in FIG. 1 from the direction of arrow A. FIG. FIG. 3 is a plan view for explaining an example of a bonding method using the bonding apparatus shown in FIG. 1, and is a plan view showing a state in which a first chip is picked up by a pickup head; FIG. 3 is a plan view for explaining an example of a bonding method using the bonding apparatus shown in FIG. 1, and is a plan view showing a state in which the first chip is transported to a delivery position by a pickup head; 2 is a plan view for explaining an example of a bonding method using the bonding apparatus shown in FIG. 1, and is a plan view showing a state in which a first chip is picked up at a first transfer position by a bonding head; FIG. FIG. 3 is a plan view for explaining an example of a bonding method using the bonding apparatus shown in FIG. 1, and is a plan view showing a state in which a first chip is conveyed to a first bonding position by a bonding head; FIG. 4 is a plan view for explaining an example of a bonding method using the bonding apparatus shown in FIG. 1, and is a plan view showing a state in which a second chip is picked up at a second transfer position by a bonding head; FIG. 4 is a plan view for explaining an example of a bonding method using the bonding apparatus shown in FIG. 1, and is a plan view showing a state in which a second chip is transported to a second bonding position by a bonding head; FIG. 3 is a plan view showing an overview of a bonding apparatus according to a second embodiment of the invention; FIG. 10 is a plan view for explaining an example of the bonding method using the bonding apparatus shown in FIG. 9, and is a plan view showing a state in which the first chip is picked up by the pickup head; FIG. 10 is a plan view for explaining an example of the bonding method using the bonding apparatus shown in FIG. 9, and is a plan view showing a state in which the first chip is conveyed to the delivery position by the pickup head; FIG. 10 is a plan view for explaining an example of the bonding method using the bonding apparatus shown in FIG. 9, and is a plan view showing a state in which the bonding head picks up the first chip at the first delivery position; FIG. 10 is a plan view for explaining an example of a bonding method using the bonding apparatus shown in FIG. 9, in a state in which the delivery stage is moved in the X direction so that the second chip can be delivered at the second delivery position; It is a plan view showing the. FIG. 10 is a plan view for explaining an example of the bonding method using the bonding apparatus shown in FIG. 9, and is a plan view showing a state in which the first chip is conveyed to the first bonding position by the bonding head; 10 is a plan view for explaining an example of the bonding method using the bonding apparatus shown in FIG. 9, and is a plan view showing a state in which the second chip is picked up at the second transfer position by the bonding head; FIG. FIG. 10 is a plan view for explaining an example of the bonding method using the bonding apparatus shown in FIG. 9, and is a plan view showing a state in which the second chip is conveyed to the second bonding position by the bonding head; FIG. 10 is a plan view for explaining another example (third embodiment of the present invention) of the bonding method using the bonding apparatus shown in FIG. is a plan view showing the trajectory of . A plan view showing an overview of a bonding apparatus according to a fourth embodiment of the present invention, showing an arrangement mode when selectively supplying chips to a plurality of bonding positions straddling island parts adjacent in the X direction. It is a top view. 1 is a plan view showing an outline of a bonding apparatus according to an invention to be compared with the present invention and an example of its use, and is a plan view showing an arrangement mode when chips are supplied to one bonding position; FIG. 20 is a plan view for explaining a usage example of the bonding method using the bonding apparatus shown in FIG. 19, and is a plan view showing an arrangement mode when chips are supplied to the other bonding position; FIG.

The content of the bonding apparatus and bonding method according to the first embodiment of the present invention will be described below based on the drawings.

FIG. 1 is a plan view showing the outline of the bonding apparatus according to the first embodiment of the present invention. This bonding apparatus 10 is an apparatus for bonding chips C1 and C2 as semiconductor elements, and as shown in FIG. a substrate 12 having a portion of a substrate 12; a transfer stage 13 disposed between the wafer support 11 and the substrate 12; a pickup head 14; and a bonding head 15. Details of each element will be described below.

The wafer support table 11 supports a wafer W composed of a plurality of chips C1 and C2, and is configured to be movable in the X and Y directions in this embodiment. Pickup positions Pa for the chips C1 and C2 are set at predetermined positions on the wafer support table 11 (see FIG. 1). A predetermined controller (not shown) can move the wafer support 11 in the X and Y directions so that the chip picked up by the pickup head 14 is placed at the pickup position Pa.

The base material 12 is, for example, a lead frame, and a plurality of bonding positions Pb1, Pb2, . . . are set on the base material 12. In this embodiment, a plurality of island portions 16 are arranged at predetermined positions on the substrate 12, and two bonding positions Pb1 and Pb2 are provided for each island portion 16. As shown in FIG. The base material 12 having the above structure is supported by the supporting/conveying device 17 and fed by a predetermined pitch (here, the distance between the center positions of the island portions 16 adjacent in the X direction). Here, the feed direction of the base material 12 coincides with the X direction. In addition, the mounting direction of the substrate 12 with respect to the supporting/conveying device 17 is set so that the first bonding position Pb1 and the second bonding position Pb2 set on each island portion 16 are adjacent to each other in the X direction. there is

The transfer stage 13 is disposed at a Y-direction intermediate position between the wafer W (wafer support table 11), which is the transfer point of the chip C1 (C2), and the base material 12 (support transfer device 17). A plurality of transfer positions Pc1 and Pc2 are set on the transfer stage 13, and each transfer position Pc1 and Pc2 corresponds in the X direction to the first and second bonding positions Pb1 and Pb2 adjacent in the X direction. position. In this embodiment, mounting

portions

18a and 18b on which the chips C1 and C2 can be placed are provided on the delivery stage 13. These mounting

portions

18a and 18b and the delivery positions Pc1 and Pc2 are aligned in the X direction. placed in the same position.

Regarding the positional relationship between the pickup position Pa and the bonding positions Pb1 and Pb2, the X-direction center position of the pickup position Pa and the X-direction center position of the island portion 16 of the base material 12 on which the bonding positions Pb1 and Pb2 are provided. and extending in the Y direction passes through an intermediate position in the X direction between the first transfer position Pc1 and the second transfer position Pc2. The X-direction positions of the delivery positions Pc1 and Pc2 are set. In the present embodiment, the delivery stage 13 is in a state where movement in at least the X direction is restricted (always stopped in the X direction).

The pickup head 14 has a collet 19 that can pick up the chip C1 (C2) and place it at a predetermined position. Specifically, as shown in FIG. 2, by configuring the collet 19 to be movable in the Y and Z directions, the chip C1 (C2) on the wafer support table 11 is picked up by suction or the like and picked up. The chip C1 (C2) can be supplied to the delivery position Pc1 (Pc2) on the delivery stage 13. FIG.

Any configuration (moving mechanism) can be adopted for the movement mechanism of the pickup head 14 as long as the collet 19 can be moved in the X, Y, and Z directions. In this embodiment, the movement mechanism of the pickup head 14 includes an XY stage 14a that can reciprocate in the X and Y directions by a motor (not shown), and an XY stage 14a that is supported by the XY stage 14a and moves in the Z direction by a motor (not shown). and a Z stage 14b capable of reciprocating. Of course, although not shown, the movement mechanism of the pickup head 14 includes an X stage that can be reciprocated in the X direction by a motor, a Y stage that is supported by the X stage and can be reciprocated in the Y direction by a motor, and an X stage. Alternatively, it may have a Z stage that is supported by the Y stage and can be reciprocated in the Z direction by a motor.

The bonding head 15 has a collet 20 that can pick up the chip C1 (C2) and place it at a predetermined position. Specifically, as shown in FIG. 2, by configuring the collet 20 to be movable in the Y and Z directions, the chip C1 (C2) on the delivery stage 13 is picked up by suction or the like, and the picked up chip C1 (C2) can be supplied to bonding position Pb1 (Pb2) on substrate 12 .

Here, the movement mechanism of the bonding head 15 can adopt any configuration (movement mechanism) as long as the collet 20 can be moved in the X, Y and Z directions. In this embodiment, the moving mechanism of the bonding head 15 includes an XY stage 15a that can reciprocate in the X and Y directions by a motor (not shown), and an XY stage 15a that is supported by the XY stage 15a and moves in the Z direction by a motor (not shown). and a Z stage 15b capable of reciprocating. Of course, the moving mechanism of the bonding head 15 includes, for example, an X stage that can be reciprocated in the X direction by a motor, a Y stage that is supported by the X stage and can be reciprocated in the Y direction by a motor, and an X stage. Alternatively, it may have a Z stage that is supported by the Y stage and can be reciprocated in the Z direction by a motor.

Since the required performance is different between the pickup head 14 and the bonding head 15, the movement mechanism (such as the XY stage 15a) of the bonding head 15 is made higher in rigidity than the movement mechanism (such as the XY stage 14a) of the pickup head 14. For this reason, the moving mechanism for the bonding head 15 may be made larger than the moving mechanism for the pickup head 14, as shown in FIG.

Next, an example of a bonding method using the bonding apparatus 10 configured as described above will be described mainly based on FIGS. 3 to 8. FIG.

First, as shown in FIG. 3, the pick-up head 14 is moved in the Y direction to place the collet 19 at the pick-up position Pa on the wafer support table 11 . Then, after the collet 19 is lowered to suck the chip at the pickup position Pa (the first chip C1 in this case), the collet 19 is raised to pick up the first chip C1.

After that, the pick-up head 14 is moved in the X direction and the Y direction, and as shown in FIG. The collet 19 is arranged at the first delivery position Pc1 corresponding to the preceding first bonding position Pb1. Then, the collet 19 is lowered to mount the first chip C1 on the mounting portion 18a arranged at the first delivery position Pc1. In the present embodiment, as indicated by the two-dot chain line in FIG. 4, by moving the pickup head 14 in the X direction and the Y direction, the collet 19 provided on the pickup head 14 and the collet 19 are moved. The first chip C1 held by the pickup position Pa is linearly moved from the pick-up position Pa toward the first delivery position Pc1.

After supplying the first chip C1 to the first delivery position Pc1 in this manner, the collet 19 of the pickup head 14 is retracted from the first delivery position Pc1, and the bonding head 15 is moved in the X and Y directions. and the collet 20 is arranged at the first delivery position Pc1 (see FIG. 5). Then, the collet 20 is lowered, and the first chip C1 placed on the placement portion 18a of the first delivery position Pc1 is picked up by suction or the like.

After the delivery of the first chip C1 at the first delivery position Pc1 is completed in this manner, the bonding head 15 is moved in the Y direction as indicated by the two-dotted chain line in FIG. A collet 20 is arranged at a first bonding position Pb1 to which one chip C1 is supplied. Then, the collet 20 is lowered to place the first chip C1 at a predetermined position on the island portion 16 corresponding to the first bonding position Pb1, and a predetermined bonding operation is performed.

Next, an example of the mode of supplying the second chips C2 toward the second bonding position Pb2 will be described.

First, as shown in FIG. 5, the pick-up head 14 is moved in the X direction and the Y direction, and the collet 19 is arranged at the pick-up position Pa on the wafer support 11 . Then, after the collet 19 is lowered to suck the chip at the pickup position Pa (the second chip C2 in this case), the collet 19 is raised to pick up the second chip C2. In this embodiment, the pick-up operation of the second chip C2 by the pick-up head 14 is performed simultaneously with the pick-up operation of the first chip C1 by the bonding head 15. FIG.

After that, the pick-up head 14 is moved in the X direction and the Y direction, and as shown in FIG. The collet 19 is arranged at the second transfer position Pc2 corresponding to the preceding second bonding position Pb2. Then, the collet 19 is lowered to mount the second chip C2 on the mounting portion 18b arranged at the second delivery position Pc2. In the present embodiment, as indicated by the two-dot chain line in FIG. 6, the collet 19 is moved in the X direction and then in the Y direction, thereby moving the collet 19 from the pick-up position Pa toward the second delivery position Pc2. are moved linearly.

After supplying the second chip C2 to the second delivery position Pc1 in this manner, the collet 19 of the pickup head 14 is retracted from the second delivery position Pc2, and the bonding head 15 is moved in the X and Y directions. and the collet 20 is arranged at the second delivery position Pc2 (see FIG. 7). Then, the collet 20 is lowered, and the second chip C2 placed on the placement portion 18b of the second delivery position Pc2 is picked up by suction or the like.

After the delivery of the second chip C2 at the second delivery position Pc2 is completed in this way, the bonding head 15 is moved in the Y direction as indicated by the two-dotted chain line in FIG. The collet 20 is arranged at the second bonding position Pb2 to which the second chip C2 is supplied. Then, the collet 20 is lowered to place the second chip C2 at a predetermined position on the island portion 16 corresponding to the second bonding position Pb2, and a predetermined bonding operation is performed.

Each time the base material 12 is conveyed by the supporting/conveying device 17 by the distance between the center positions of the

island portions

16, 16 adjacent in the X direction, the above operation is repeated, thereby obtaining a predetermined number of substrates 12 for the base material 12. are bonded to chips C1 and C2.

As described above, according to the bonding apparatus 10 or the bonding method of the present invention, the delivery positions Pc1 and Pc2 of the chips C1 and C2 are set at a plurality of locations in the X direction, and the picked-up chip C1 (C2) is By moving the pickup head 14 in the X direction and the Y direction toward the predetermined delivery position Pc1 (Pc2) corresponding to the pickup, the picked up chip C1 (C2) is placed in the X direction with the bonding position Pb1 (Pb2) as the supply destination. It can be supplied to the delivery position Pc1 (Pc2) at the same position. Therefore, without moving the bonding head 15 in the X direction and without moving the base material 12 in the X direction each time, the chip C1 (C2) is transferred from each delivery position Pc1 (Pc2) to the corresponding bonding position Pb1 (Pb2). ) can be transported. Therefore, when the chip C1 (C2) is placed on each bonding position Pb1 (Pb2), the vibration in the X direction applied to the chip C1 (C2) is minimized, and the chip C1 (C2) is accurately positioned at the bonding position Pb1. (Pb2) can be supplied. In addition, since the substrate 12 provided with the bonding positions Pb1 and Pb2 does not need to be moved in the X direction each time the transfer position Pc1 (Pc2) is switched, the waiting time can be reduced, thereby improving production efficiency. Improvement can be achieved.

Further, as in the present embodiment, by moving the pickup head 14 in the Y direction along with the movement in the X direction, the pickup head 14 is linearly moved from the pickup position Pa toward one of the delivery positions Pc1 (Pc2). By movably configuring, while switching the delivery position Pc1 (Pc2), the pickup head 14 picking up the chip C1 (C2) can be moved to the corresponding delivery position Pc1 (Pc2) in the shortest distance. can. Therefore, a series of operations from picking up to bonding can be performed in a shorter time, and production efficiency can be further improved.

Further, as in this embodiment, by providing the plurality of delivery positions Pc1 and Pc2 at the same positions in the X direction as the corresponding bonding positions Pb1 and Pb2, the bonding head 15 can be completely moved in the X direction and the It can be moved to the bonding position Pb1 (Pb2) in the shortest distance. Therefore, it is possible to further shorten the time required for a series of operations from pick-up to bonding while assuring the positional accuracy at the time of bonding.

In addition, in the present embodiment, a plurality of delivery positions Pc1 and Pc2 are provided on the delivery stage 13 fixed at predetermined positions in the X direction, so the positional accuracy of the delivery positions Pc1 and Pc2 is stabilized. Therefore, it is possible to improve the access accuracy of the pickup head 14 or the bonding head 15 and realize stable pickup.

Further, in the present embodiment, the pickup head 14 retracted from the first transfer position Pc1 is moved to the pickup position Pa, and the bonding head 15 picks up the first chip C1 and the pickup head 14 picks up the second chip C1. Chip C2 was picked up at the same time (see FIGS. 5 and 6). By simultaneously moving the pickup head 14 and the bonding head 15 in this manner, at least part of a series of operations from picking up the second chip C2 from the wafer W to supplying it to the second bonding position Pb2 can be performed by the second chip C2. A series of operations from picking up one chip C1 from the wafer W to supplying it to the first bonding position Pb1 can overlap in time. Therefore, it is possible to greatly shorten the time required for the bonding work of the plurality of chips C1 and C2, and to further improve the working efficiency.

Although the first embodiment of the present invention has been described above, the bonding apparatus and bonding method according to the present invention can adopt configurations other than those described above without departing from the scope of the present invention.

FIG. 9 shows a plan view of a bonding apparatus 30 according to the second embodiment of the invention. This bonding apparatus 30 differs from the bonding apparatus 10 according to the first embodiment in the configuration of the transfer stage 31 . The following description focuses on differences from the first embodiment.

A bonding apparatus 30 according to the present embodiment, like the bonding apparatus 10 according to the first embodiment, is an apparatus for bonding chips C1 and C2 as semiconductor elements, and supports a wafer W and a wafer W. It comprises a wafer support table 11, a base material 12 having a part to be bonded, a transfer stage 31 arranged between the wafer support table 11 and the base material 12, a pickup head 14, and a bonding head 15. .

Among these, the configurations of the wafer support table 11, the base material 12, the pickup head 14, and the bonding head 15 are the same as those of the first embodiment, so detailed description thereof will be omitted.

The transfer stage 31 is arranged at an intermediate position in the Y direction between the wafer W (wafer support table 11) and the substrate 12 (support transfer device 17). Here, the first and second transfer positions Pc1 and Pc2 are set at positions corresponding in the X direction to the first and second bonding positions Pb1 and Pb2 adjacent in the X direction, respectively, as in the first embodiment. be. On the other hand, in the present embodiment, the delivery stage 31 has, at one place on the delivery stage 31, a placement portion 31a on which either one of the first and second chips C1 and C2 can be placed. The delivery stage 31 is configured to be movable in the X direction so that the placement portion 31a is at the same position in the X direction as one of the first and second delivery positions Pc1 and Pc2. In FIG. 9, the transfer stage 31 is arranged at a predetermined position in the X direction so that the placement portion 31a is at the same position in the X direction as the first transfer position Pc1.

Next, an example of a bonding method using the bonding apparatus 30 configured as described above will be described mainly based on FIGS. 10 to 16. FIG.

First, as shown in FIG. 10, the pick-up head 14 is moved in the Y direction to place the collet 19 at the pick-up position Pa on the wafer support table 11 . Then, after the collet 19 is lowered to suck the chip at the pickup position Pa (the first chip C1 in this case), the collet 19 is raised to pick up the first chip C1. At this time, the delivery stage 31 is arranged at a predetermined position in the X direction so that the placement portion 31a thereof is at the same position in the X direction as the first delivery position Pc1 corresponding to the first chip C1. It is in.

After that, the pick-up head 14 is moved in the X direction and the Y direction, and as shown in FIG. The collet 19 is arranged at the first delivery position Pc1 corresponding to the preceding first bonding position Pb1. At this point, the mounting portion 31a of the delivery stage 31 is located at the same position as the first delivery position Pc1 in the X direction as described above, so that the collet 19 is lowered to place it at the first delivery position Pc1. The first chip C1 is mounted on the mounting portion 31a in the folded state.

After supplying the first chip C1 to the first delivery position Pc1 in this manner, the collet 19 of the pickup head 14 is retracted from the first delivery position Pc1, and the bonding head 15 is moved in the X and Y directions. and the collet 20 is arranged at the first delivery position Pc1 (see FIG. 12). Then, the collet 20 is lowered to pick up the first chip C1 placed on the placement portion 31a of the first delivery position Pc1 by suction or the like.

After the delivery of the first chip C1 at the first delivery position Pc1 is completed in this way, the bonding head 15 is moved in the Y direction as shown in FIG. 13 to supply the picked up first chip C1. The collet 20 is arranged at the first bonding position Pb1 (see FIG. 14). Then, the collet 20 is lowered to place the first chip C1 at a predetermined position on the island portion 16 corresponding to the first bonding position Pb1, and a predetermined bonding operation is performed.

Here, in this embodiment, in parallel with the transportation of the first chip C1 from the first transfer position Pc1 to the first bonding position Pb1, the second chip C2 is transported from the pickup position Pa to the second transfer position. Carry out transportation up to Pc2. Therefore, as shown in FIG. 12, when the bonding head 15 picks up the first chip C1 at the first transfer position Pc1, the pickup head 14 picks up the second chip C2 at the pickup position Pa on the wafer W. in a state of

Therefore, from the state shown in FIG. 12, the bonding head 15 starts moving toward the first bonding position Pb1, and the pickup head 14 starts moving toward the second delivery position Pc2. At the same time, the delivery stage 31 is moved in the X direction to arrange the placement section 31a at the same position as the second delivery position Pc2 in the X direction (see FIG. 13 for both).

With the mounting portion 31a arranged at the second delivery position Pc2 in this manner, the pickup head 14 is moved in the X and Y directions to arrange the collet 19 at the second delivery position Pc2 (FIG. 14). ). Then, the collet 19 is lowered to mount the second chip C2 on the mounting portion 31a arranged at the second delivery position Pc2.

After supplying the second chip C2 to the second delivery position Pc2 in this manner, the collet 19 of the pickup head 14 is retracted from the second delivery position Pc2, and the bonding head 15 is moved in the X and Y directions. and the collet 20 is arranged at the second delivery position Pc2 (see FIG. 15). Then, the collet 20 is lowered to pick up the second chip C2 placed on the placement portion 31a of the second delivery position Pc2 by suction or the like.

After the delivery of the second chip C2 at the second delivery position Pc2 is thus completed, as shown in FIG. 16, the bonding head 15 is moved in the Y direction to supply the picked-up second chip C2. The collet 20 is arranged at the second bonding position Pb2, which is the first. Then, the collet 20 is lowered to place the second chip C2 at a predetermined position on the island portion 16 corresponding to the second bonding position Pb2, and a predetermined bonding operation is performed.

Each time the base material 12 is conveyed in the X direction by the supporting/conveying device 17 by a predetermined pitch (here, by the distance between the center positions of the island portions 16 in the X direction), the above operation is repeated to obtain a predetermined amount of the base material 12 . A number of chips C1 and C2 are bonded.

As described above, according to the bonding apparatus 30 or the bonding method according to the present embodiment, similarly to the first embodiment, the substrate 12 can be moved in the X direction without moving the bonding head 15 in the X direction. The chip C1 (C2) can be transported from each delivery position Pc1 (Pc2) to the corresponding bonding position Pb1 (Pb2) without moving each time. Therefore, when the chip C1 (C2) is placed on each bonding position Pb1 (Pb2), the vibration in the X direction applied to the chip C1 (C2) is minimized, and the chip C1 (C2) is accurately positioned at the bonding position Pb1. (Pb2) can be supplied. In addition, since the substrate 12 provided with the bonding positions Pb1 and Pb2 does not need to be moved in the X direction each time the transfer position Pc1 (Pc2) is switched, the waiting time can be reduced, thereby improving production efficiency. Improvement can be achieved.

Further, in the present embodiment, the delivery stage 31 arranged at the delivery point is moved in the X direction so that the placement section 31a can be arranged at an arbitrary delivery position Pc1 (Pc2) among the plurality of delivery positions Pc1 and Pc2. (See FIGS. 9 and 13). By making the transfer stage 31 movable in the X direction in this way, a plurality of transfer positions Pc1 and Pc2 can be handled by providing only one mounting portion 31a for the chip C1 (C2) on the transfer stage 31. becomes possible. In addition, since only one mounting portion 31a for the chip C1 (C2) needs to be provided, the transfer stage 31 can be prevented from becoming large and complicated, thereby reducing equipment costs.

In the embodiment shown in FIG. 9 and the like, the case where the delivery stage 31 is movable in the X direction so that one placement section 31a can correspond to the two delivery positions Pc1 and Pc2 has been exemplified. Any other form may be adopted. For example, although not shown, the transfer stage may be movable in the X direction so that one placement unit can handle three or more transfer positions. Alternatively, the delivery stage may be made movable in the X direction so that two placing sections can handle three or more delivery sections. In short, the transfer stage may be configured to be movable in the X direction so that the number of placement units smaller than the number of transfer positions can be used.

Further, in the above-described embodiment, as shown in FIG. 4 and the like, the pickup head 14 is moved in the Y direction along with the movement in the X direction, thereby moving from the pickup position Pa toward each delivery position Pc1 (Pc2). Although the case of linear movement has been exemplified, of course, other movement forms may be adopted. FIG. 17 shows an example of a bonding method according to that example (third embodiment of the present invention). In the present embodiment, the collet 19 is linearly moved from the pickup position Pa along the reference line L by moving the pickup head 14 in the state of picking up the first chip C1 in the Y direction. After the collet 19 is moved to a predetermined position on the transfer stage 13 in the Y direction, the pickup head 14 is moved in the X direction to move the collet 19 to the first transfer position Pc1.

Alternatively, although not shown, for example, the collet 19 moves the pickup head 14 at the pickup position Pa linearly along the X direction first, and then linearly along the Y direction. The collet 19 may be moved to the first delivery position Pc1.

In the above description, two bonding positions Pb1 and Pb2 are set for each island portion 16 provided on the substrate 12, and the corresponding chips C1 and C2 are attached to these two bonding positions Pb1 and Pb2. Although the case of selectively supplying is exemplified, of course, other forms may be adopted. FIG. 18 shows an outline of a bonding apparatus 40 according to one example (fourth embodiment of the present invention). In this embodiment, the X-direction position of the base material 12 with respect to the reference line L is set so that the reference line L passes through the intermediate position between the

island portions

16, 16 adjacent in the X-direction. In this case, two bonding positions (hereinafter referred to as a third bonding position Pb3 and a fourth bonding position Pb4) are set across the two

island portions

16, 16, and these third and fourth bonding positions are set. Two delivery positions (hereinafter referred to as a third delivery position Pc3 and a fourth delivery position Pc4) are set at the X direction positions of the delivery points corresponding to the bonding positions Pb3 and Pb4. In this case, the transfer stage 41 is provided with two mounting

portions

41a and 41b in an X-direction span corresponding to the third and fourth transfer positions Pc3 and Pc4.

According to the bonding apparatus 40 configured as described above, although the details are omitted, the second chip C2 picked up at the pickup position Pa on the wafer W is supplied to the corresponding third delivery position Pc3 by the pickup head 14, and The second chip C2, which has been delivered at the third delivery position Pc3 by the bonding head 15, can be supplied to the corresponding third bonding position Pb3. When the first chip C1 is picked up at the pickup position Pa on the wafer W, the pickup head 14 supplies the first chip C1 to the corresponding fourth transfer position Pc4, and the bonding head 15 supplies the first chip C1 to the corresponding fourth delivery position Pc4. The first chip C1 that has been delivered at the four delivery positions Pc4 can be supplied to the corresponding fourth bonding positions Pb4. Thus, according to the bonding apparatus or bonding method of the present invention, it is possible to deal with various types of bonding.

Also, in the above description, the case where chip bonding is performed on the island portion 16 of the base material 12 is exemplified, but the present invention can of course be applied to bonding objects other than the island portion 16 of the base material 12 .

Reference Signs List

10, 30, 40 bonding device 11 wafer support table 12

base material

13, 31, 41 delivery stage 14 pickup head 15 bonding head 16 island portion 17 supporting and conveying

device

18a, 18b, 31a, 41a,

41b mounting portion

19, 20 collet 112 Lead frame 113 Intermediate stage 114 Pickup head 115 Bonding head 116 Island part 117 Supporting and transporting devices C1, C2 Chip L Reference line Pa Pickup positions Pb1, Pb2, Pb3, Pb4 Bonding positions Pc1, Pc2, Pc3, Pc4 Delivery position W Wafer

Claims

a pickup head for transporting the chip from the pickup position to the transfer position; A bonding apparatus comprising a bonding head for transporting a chip from the delivery position to the bonding position,
When the feeding direction of the member on which the bonding positions are provided is the X direction, and the direction orthogonal to the X direction is the Y direction, the delivery positions are arranged in X directions corresponding to the plurality of bonding positions adjacent in the X direction. Along with being provided at multiple locations in the direction,
The pickup head is configured to be movable in the X direction and the Y direction toward a delivery position corresponding to the bonding position to which the picked-up chip is to be supplied, among the plurality of delivery positions. bonding equipment.
The bonding apparatus according to claim 1, wherein the pick-up head is configured to be linearly movable from the pick-up position to the delivery position by moving in the Y direction along with the movement in the X direction.
The bonding apparatus according to claim 1 or 2, wherein each of the plurality of delivery positions is provided at the same position in the X direction as the corresponding bonding position.
The bonding apparatus according to any one of claims 1 to 3, wherein all of the plurality of delivery positions are provided on a delivery stage fixed at a predetermined position in the X direction.
A delivery stage is provided at the delivery point, and the delivery stage is provided with a mounting portion on which the chip can be placed,
4. The bonding apparatus according to any one of claims 1 to 3, wherein the transfer stage is movable in the X direction so that the placement section can be arranged at an arbitrary transfer position among the plurality of transfer positions. .
An island portion is provided on a lead frame as a member on which the bonding position is provided, and the bonding position is provided on the island portion,
2. The X-direction center position of the island portion, the X-direction center position of the delivery stage on which the delivery position is provided, and the X-direction center position of the wafer on which the pickup position is provided are set at the same position. 6. The bonding apparatus according to any one of 5.
7. The bonding apparatus according to claim 6, wherein two bonding positions are provided for one island portion, and two delivery positions are provided at the same positions in the X direction as the respective bonding positions.
a first transporting step of providing a delivery position as a delivery point of the chip between a pick-up position and a bonding position of a chip as a semiconductor element, and transporting the chip from the pick-up position to the delivery position; a second transporting step of transporting the chip from the delivery position to the bonding position,
When the feeding direction of the member on which the bonding positions are provided is the X direction, and the direction orthogonal to the X direction is the Y direction, the delivery positions are arranged in X directions corresponding to the plurality of bonding positions adjacent in the X direction. Along with being provided at multiple locations in the direction,
In the first transporting step, the pickup head, which has picked up the chip, is directed to a delivery position corresponding to the bonding position to which the picked-up chip is to be supplied, among the plurality of delivery positions, in the X direction. and moving in the Y direction.
In the first transporting step, the pickup head picking up the chip is moved in the Y direction along with the movement in the X direction, so that a straight line is formed from the pickup position to the delivery position corresponding to the bonding position. 9. The bonding method according to claim 8, wherein the substrate is moved systematically.