JPH0682960B2 - Circuit board support device - Google Patents
Circuit board support deviceInfo
- Publication number
- JPH0682960B2 JPH0682960B2 JP59243068A JP24306884A JPH0682960B2 JP H0682960 B2 JPH0682960 B2 JP H0682960B2 JP 59243068 A JP59243068 A JP 59243068A JP 24306884 A JP24306884 A JP 24306884A JP H0682960 B2 JPH0682960 B2 JP H0682960B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- moving body
- support member
- intermediate support
- plane moving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 この発明は、微小な電子部品を電子回路基板へ装着する
場合等に用いる回路基板支持装置に関するものである。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board support device used for mounting minute electronic components on an electronic circuit board.
従来例の構成とその問題点 従来、チップ型抵抗やチップ型積層コンデンサ等に代表
されるリードレス型の微小電子部品を電子回路基板に装
着する場合、回路基板の必要箇所に接着剤を塗布してお
き、順次電子部品を回路基板に供給して接着する方法が
採られている。電子部品を接着した回路基板は、半田デ
ィップにより、電気的接続を行なう。前述の電子部品の
接着に際しては、回路基板の一対の側縁をテーブルで支
持し、電子部品を吸着ノズル等で吸着して回路基板上に
押し付ける。回路基板に対する電子部品の取付位置の変
更は、前記テーブルと前記吸着ノズルとを相対的に移動
させることにより行なう。このような装着装置におい
て、吸着ノズルで電子部品を回路基板に押付けたとき
に、回路基板が撓むという問題がある。この撓みを防止
するものとして、回路基板を裏側からピン状の中間支持
部材で支えるものがある。中間支持部材は、回路基板の
裏面の導体や電子部品を傷つけないために、これらと当
らない位置に配置する。Configuration of conventional example and its problems Conventionally, when a leadless type micro electronic component typified by a chip type resistor and a chip type multilayer capacitor is mounted on an electronic circuit board, an adhesive is applied to a necessary portion of the circuit board. In addition, a method of sequentially supplying and adhering electronic components to a circuit board is adopted. The circuit board to which the electronic components are adhered is electrically connected by solder dipping. At the time of adhering the electronic components described above, a pair of side edges of the circuit board is supported by a table, and the electronic components are sucked by a suction nozzle or the like and pressed onto the circuit board. The mounting position of the electronic component on the circuit board is changed by relatively moving the table and the suction nozzle. In such a mounting device, there is a problem that the circuit board bends when the electronic component is pressed against the circuit board by the suction nozzle. As a means for preventing this bending, there is one that supports the circuit board from the back side with a pin-shaped intermediate support member. The intermediate support member is arranged at a position where it does not hit the conductors and electronic components on the back surface of the circuit board so as not to damage them.
しかし、回路基板の種類が変わると、導体のパターンが
変わり、そのため中間支持部材の位置が固定状態である
と、回路基板の種類によっては、中間支持部材が導体等
に触れ、使用できない場合がある。However, when the type of the circuit board changes, the pattern of the conductor changes, so that if the position of the intermediate support member is fixed, the intermediate support member may come into contact with the conductor or the like and cannot be used depending on the type of the circuit board. .
これを解消するものとして、従来、テーブル側にマトリ
クス状に差込孔を設け、中間支持部材を回路基板の種類
に応じて任意の差込孔に差し替えるものが提案されてい
る。しかし、回路基板の変更ごとに、手作業で回路基板
の抜き差しを行わなければならないため、非常に手間が
かかり、稼動率が低下するという問題がある。In order to solve this, conventionally, it has been proposed to provide insertion holes in a matrix on the table side and replace the intermediate support member with an arbitrary insertion hole according to the type of the circuit board. However, since it is necessary to manually insert and remove the circuit board every time the circuit board is changed, there is a problem that it takes a lot of time and labor and the operating rate is lowered.
発明の目的 この発明は、導体のパターンが種々異なる回路基板の支
持を、撓みを生じさせることなく行なえ、かつ回路基板
の種類変更時の切替作業を迅速に行なえる回路基板支持
装置を提供することを目的とする。An object of the present invention is to provide a circuit board supporting device capable of supporting circuit boards having different conductor patterns without causing bending, and capable of swiftly performing a switching operation when changing the type of the circuit board. With the goal.
発明の構成 この発明の回路基板支持装置は、回路基板の一対の対向
する側縁を支持する側縁支持部材を有して前記側縁支持
部材を一平面上のXY方向に移動させるXYテーブルと、こ
のXYテーブルに設けられて前記回路基板の裏側で前記回
路基板と略平行なXY方向に移動可能な平面移動体と、こ
の平面移動体を移動させる平面移動体駆動装置と、前記
平面移動体に前記回路基板に向って昇降可能に設けられ
て前記回路基板の裏面を支える中間支持部材と、この中
間支持部材の昇降駆動装置とを備えたものである。Configuration of the invention, the circuit board support device of the present invention, an XY table having a side edge support member for supporting a pair of opposing side edges of the circuit board, for moving the side edge support member in the XY direction on one plane. A plane moving body provided on the XY table and movable in the XY direction substantially parallel to the circuit board on the back side of the circuit board; a plane moving body drive device for moving the plane moving body; and the plane moving body. In addition, an intermediate support member that is provided so as to be capable of moving up and down toward the circuit board and supports the back surface of the circuit board, and a lifting drive device for the intermediate support member are provided.
この発明の構成によれば、XYテーブルに回路基板の側縁
支持部材を設けるとともに、回路基板の裏面を支持可能
な中間支持部材をXY方向に移動可能にXYテーブルに設け
たため、回路基板をXY方向に移動できるので回路基板に
電子部品を実装するためにロータリーヘッド構成を採用
することが可能となり、その位置決めに要する移動時間
を短くでき設備の高速化が図れる。また電子部品の実装
時に中間支持体により回路基板に撓みを生じることなく
回路基板の裏面を確実に支持できるので信頼性を向上で
き、しかも中間支持体がXYテーブル上でXY方向に移動可
能であるため、回路基板の変更時には平面移動体を回路
基板の導体パターンに応じて障害のない位置に移動させ
中間支持部材を回路基板の裏面へ進出させて回路基板を
支持するので、中間支持部材の位置の切換作業が迅速に
行える。According to the configuration of this invention, the side edge support member of the circuit board is provided on the XY table, and the intermediate support member capable of supporting the back surface of the circuit board is provided on the XY table so as to be movable in the XY directions. Since it can be moved in any direction, it is possible to adopt a rotary head configuration for mounting electronic components on a circuit board, shorten the movement time required for its positioning, and speed up the equipment. In addition, the reliability of the intermediate support can be improved because the back surface of the circuit board can be reliably supported by the intermediate support when the electronic components are mounted without causing the circuit board to bend, and the intermediate support can move in the XY direction on the XY table. Therefore, when the circuit board is changed, the plane moving body is moved to a position where there is no obstacle according to the conductor pattern of the circuit board and the intermediate support member is advanced to the back surface of the circuit board to support the circuit board. Switching work can be done quickly.
実施例の説明 この発明を電子部品の装着装置に適用した一例を、第１
図ないし第６図に示す。図において、１は基台であり、
２枚の回路基板2,2′を図の左右に並べて載せるXYテー
ブル４が前部に設置され、かつ右側の回路基板２′上に
接着剤を塗布する接着剤塗布装置５と、左側の回路基板
２上に電子部品８を装着する部品装着ヘッド６とが並設
されている。左側の回路基板２は、接着剤の塗布の後、
XYテーブル４上で右側からシフトされたものである。XY
テーブル４は、回路基板支持装置となるものである。部
品装着ヘッド６の後方には多数の部品供給カセット22を
取付けた部品供給ロータ７が設置されている。部品装着
ヘッド６は、電子部品８を保持するチャック９が周方向
に10個等配されており、チャック９の配置ピッチで鉛直
軸心回りに間欠回転する。チャック９は負圧吸着ノズ
ル、あるいは挾持爪等からなる。チャック９は部品装着
ヘッド６に昇降可能に設けられており、回転停止位置S1
で部品供給ロータ７の部品供給セット22から電子部品８
を受取り、回転停止位置で下降して電子部品８を回路基
板２に押付ける。なお、回転停止位置S1,S6間の各回転
停止位置には、電子部品８の位置や角度を規正する装置
（図示せず）等が配置されている。Description of Embodiments An example in which the present invention is applied to an electronic component mounting apparatus will be described below.
Shown in FIGS. In the figure, 1 is a base,
An XY table 4 on which two circuit boards 2 and 2'are placed side by side on the left and right of the figure is installed in the front part, and an adhesive application device 5 for applying an adhesive on the right circuit board 2'and a left circuit A component mounting head 6 for mounting the electronic component 8 is arranged on the substrate 2 in parallel. The circuit board 2 on the left side, after applying the adhesive,
It is shifted from the right side on the XY table 4. XY
The table 4 serves as a circuit board supporting device. Behind the component mounting head 6, a component supply rotor 7 to which a large number of component supply cassettes 22 are attached is installed. The component mounting head 6 is provided with ten chucks 9 for holding the electronic components 8 arranged in the circumferential direction, and intermittently rotates around the vertical axis at the arrangement pitch of the chucks 9. The chuck 9 is composed of a negative pressure suction nozzle, a holding claw or the like. The chuck 9 is provided on the component mounting head 6 so as to be able to move up and down, and the rotation stop position S 1
From the component supply set 22 of the component supply rotor 7 to the electronic component 8
Is received, and the electronic component 8 is pressed against the circuit board 2 by descending at the rotation stop position. A device (not shown) that regulates the position and angle of the electronic component 8 is arranged at each rotation stop position between the rotation stop positions S 1 and S 6 .
XYテーブル４につき説明する。XYテーブル４は左右（Ｘ
軸方向）と前後（Ｙ軸方向）に移動するものであり、前
後ガイドレール15に設置されて前後方向（Ｙ軸方向）に
移動するＹテーブル4a（第３図）と、このＹテーブル4a
上の横ガイドレール16（第１図）に設置されて横方向
（Ｘ軸方向）に移動するＸテーブル4bとからなる。Ｙテ
ーブル4aおよびＸテーブル4bの駆動は、それぞれパルス
モータと送りねじ機構（図示せず）により行なわれる。
XYテーブル４の両側には、回路基板2,2′の搬入ガイド
レール19と、搬出ガイドレール20が設置してある。The XY table 4 will be described. XY table 4 left and right (X
The Y table 4a (FIG. 3), which moves in the axial direction) and in the front-rear direction (Y-axis direction), is installed on the front-rear guide rail 15 and moves in the front-rear direction (Y-axis direction).
The X table 4b is installed on the upper horizontal guide rail 16 (FIG. 1) and moves in the horizontal direction (X-axis direction). The Y table 4a and the X table 4b are driven by a pulse motor and a feed screw mechanism (not shown), respectively.
On both sides of the XY table 4, a carry-in guide rail 19 and a carry-out guide rail 20 for the circuit boards 2 and 2'are installed.
Ｘテーブル4bは、回路基板2,2′の対向する一対の側縁
を支持する側縁支持部材23を有し、かつ回路基板２を裏
側から支える撓み防止用の中間支持部材24を有する。側
縁支持部材23は溝状に形成されており、回路基板2,2′
をＸ軸方向に摺動自在に支持する。なお、Ｙテーブル4a
には、回路基板2,2′をＸ軸方向の所定位置で位置決め
する位置決め手段（図示せず）を有する。The X table 4b has side edge support members 23 that support a pair of opposing side edges of the circuit boards 2 and 2 ', and also has an intermediate support member 24 that supports the circuit board 2 from the back side and that prevents bending. The side edge supporting member 23 is formed in a groove shape, and the circuit boards 2, 2 '
Is slidably supported in the X-axis direction. In addition, Y table 4a
Has a positioning means (not shown) for positioning the circuit boards 2, 2'at a predetermined position in the X-axis direction.
中間支持部材24は、シリンダ装置等からなる昇降駆動装
置25（第５図）を介して平面移動部材26に昇降可能に設
置されている。平面移動部材26は、Ｘテーブル4bに、平
面移動体駆動装置27を介し、Ｘ軸およびＹ軸方向の任意
位置に移動可能に設けられている。平面移動体駆動装置
27を説明する。Ｘテーブル4bに２本のガイド軸28がＸ軸
方向に設けられ、このガイド軸28に沿って移動可能にＸ
方向移動体29が設けられている。Ｘ方向移動体29には送
りねじ30が螺合しており、Ｘテーブル4bに設置したパル
スモータ31で送りねじ30を回転させることにより、Ｘ方
向移動体29の進退駆動が行なわれる。また、Ｘ方向移動
体29に、２本のガイド軸32がＹ軸方向に沿って設けら
れ、このガイド軸32に沿って移動自在に、前記平面移動
体26が設置されている。平面移動体26には送りねじ33が
螺合しており、Ｘ方向移動体29に設置したパルスモータ
34の駆動で送りねじ33を回転させることにより、平面移
動体26の進退駆動が行なわれる。The intermediate support member 24 is installed to be movable up and down on the plane moving member 26 via a lift drive device 25 (FIG. 5) including a cylinder device and the like. The plane moving member 26 is provided on the X table 4b via a plane moving body driving device 27 so as to be movable to arbitrary positions in the X axis and Y axis directions. Planar moving body drive
Explain 27. Two guide shafts 28 are provided on the X table 4b in the X-axis direction so that the X-axis can move along the X-axis direction.
A direction moving body 29 is provided. A feed screw 30 is screwed onto the X-direction moving body 29, and the pulse motor 31 installed on the X table 4b rotates the feed screw 30 to drive the X-direction moving body 29 forward and backward. Further, the X-direction moving body 29 is provided with two guide shafts 32 along the Y-axis direction, and the plane moving body 26 is installed so as to be movable along the guide shafts 32. The feed screw 33 is screwed into the plane moving body 26, and the pulse motor installed in the X-direction moving body 29.
By rotating the feed screw 33 by driving 34, the plane moving body 26 is driven forward and backward.
動作 XYテーブル４で位置決め支持された回路基板２に、チャ
ック９で電子部品８を押付け、電子部品８の回路基板２
への接着を行なう。このとき、回路基板２は、中間位置
を中間支持部材24で裏側から支えられる。そのため、回
路基板８は、チャック９による押付力等によって撓わむ
ことが防止され、水平に保持される。そのため、電子部
品８の接着が高精度に行なわれる。Operation The electronic component 8 is pressed by the chuck 9 onto the circuit board 2 positioned and supported by the XY table 4, and the circuit board 2 of the electronic component 8 is pressed.
Adhere to. At this time, the circuit board 2 is supported at the intermediate position by the intermediate support member 24 from the back side. Therefore, the circuit board 8 is prevented from being bent by the pressing force of the chuck 9 or the like, and is held horizontally. Therefore, the electronic components 8 are bonded with high accuracy.
回路基板２が導体パターンの異なるものに変った場合
は、次のように中間支持部材24の位置を変える。すなわ
ち、パルスモータ31の駆動でＸ方向移動体29をＸ軸方向
に移動させるとともに、パルスモータ34の駆動で平面移
動体26をＹ軸方向に移動させる。これにより、平面移動
体26をＸテーブル4bに対し、水平面内の任意位置に移動
させ、この後中間支持部材24を昇降駆動装置25で回路基
板２の裏面の高さに上昇させる。このようにして、種々
の導体パターンの回路基板２を、裏面の導体や電子部品
に触れることなく、中間支持部材24で支持することがで
きる。パルスモータ31,34等の駆動は、XYテーブル４に
供給する各回路基板２の順に応じて、予じめプログラム
制御する。When the circuit board 2 has a different conductor pattern, the position of the intermediate support member 24 is changed as follows. That is, the pulse motor 31 is driven to move the X-direction moving body 29 in the X-axis direction, and the pulse motor 34 is driven to move the plane moving body 26 in the Y-axis direction. As a result, the plane moving body 26 is moved to an arbitrary position within the horizontal plane with respect to the X table 4b, and then the intermediate support member 24 is raised to the height of the back surface of the circuit board 2 by the lifting drive device 25. In this way, the circuit board 2 having various conductor patterns can be supported by the intermediate support member 24 without touching the conductors and electronic components on the back surface. The drive of the pulse motors 31, 34, etc. is controlled in advance according to the order of the circuit boards 2 supplied to the XY table 4.
このように、平面移動体26を移動させて中間支持部材24
の昇降を行なうだけで、回路基板２の種類変更に対する
切替えが行なえる。そのため、従来のように支持ピンを
マトリクス状の取付孔に抜き差しするものに比べ、切替
作業が迅速に行なえ、それだけ稼動率を向上させること
ができる。In this way, the plane moving body 26 is moved to move the intermediate support member 24.
It is possible to switch to the change of the type of the circuit board 2 simply by moving up and down. Therefore, as compared with the conventional one in which the support pins are inserted into and removed from the matrix-shaped mounting holes, the switching operation can be performed more quickly, and the operating rate can be improved accordingly.
なお、前記実施例では、平面移動体26を送りねじ30,33
とパルスモータ31,34との組合せで移動させるようにし
たが、他の手段で平面移動体26の移動を行なわせるよう
にしてもよい。Incidentally, in the above-mentioned embodiment, the plane moving body 26 is provided with the feed screws 30, 33.
Although the combination of the pulse motors 31 and 34 is used for the movement, the plane moving body 26 may be moved by other means.
発明の効果 この発明の回路基板支持装置は、XYテーブルに回路基板
の側縁支持部材を設けるとともに、回路基板の裏面を支
持可能な中間支持部材をXY方向に移動可能にXYテーブル
に設けたため、回路基板をXY方向に移動できるので回路
基板に電子部品を実装するためにロータリーヘッド構成
を採用することが可能となり、その位置決めに要する移
動時間を短くでき設備の高速化が図れる。また電子部品
の実装時に中間支持体により回路基板に撓みを生じるこ
となく回路基板の裏面を確実に支持できるので信頼性を
向上でき、しかも中間支持体がXYテーブル上でXY方向に
移動可能であるため、回路基板の変更時には平面移動体
を回路基板の導体パターンに応じて障害のない位置に移
動させ中間支持部材を回路基板の裏面へ進出させて回路
基板を支持するので、中間支持部材の位置の切換作業が
迅速に行えるという効果がある。Advantageous Effects of InventionThe circuit board supporting device of the present invention is provided with the side edge supporting member of the circuit board on the XY table, and the intermediate supporting member capable of supporting the back surface of the circuit board is provided on the XY table so as to be movable in the XY directions. Since the circuit board can be moved in the XY directions, it is possible to adopt a rotary head configuration for mounting electronic components on the circuit board, and it is possible to shorten the moving time required for positioning and speed up the equipment. In addition, the reliability of the intermediate support can be improved because the back surface of the circuit board can be reliably supported by the intermediate support when the electronic components are mounted without causing the circuit board to bend, and the intermediate support can move in the XY direction on the XY table. Therefore, when the circuit board is changed, the plane moving body is moved to a position where there is no obstacle according to the conductor pattern of the circuit board and the intermediate support member is advanced to the back surface of the circuit board to support the circuit board. There is an effect that the switching work of can be performed quickly.
第１図はこの発明の一実施例の回路基板支持装置を用い
た電子部品装着装置の平面図、第２図はその正面図、第
３図は同じくその回路基板支持装置の側面図、第４図は
同横断平面図、第５図は第４図のV-V線断面図、第６図
は同動作説明図である。 ２…回路基板、４…XYテーブル、８…電子部品、９…チ
ャック、23…側縁支持部材、24…中間支持部材、25…昇
降駆動装置、26…平面移動体、27…平面移動体駆動装
置、29…Ｘ方向移動体、30,33…送りねじ、31,34…パル
スモータ1 is a plan view of an electronic component mounting apparatus using a circuit board supporting device according to an embodiment of the present invention, FIG. 2 is a front view thereof, and FIG. 3 is a side view of the circuit board supporting device thereof. FIG. 5 is a cross-sectional plan view of the same, FIG. 5 is a cross-sectional view taken along the line VV of FIG. 4, and FIG. 2 ... Circuit board, 4 ... XY table, 8 ... Electronic component, 9 ... Chuck, 23 ... Side edge support member, 24 ... Intermediate support member, 25 ... Elevating drive device, 26 ... Planar moving body, 27 ... Planar moving body drive Device, 29 ... X-direction moving body, 30, 33 ... Feed screw, 31, 34 ... Pulse motor
Claims (1)
側縁支持部材を有して前記側縁支持部材を一平面上のXY
方向に移動させるXYテーブルと、このXYテーブルに設け
られて前記回路基板の裏側で前記回路基板と略平行なXY
方向に移動可能な平面移動体と、この平面移動体を移動
させる平面移動体駆動装置と、前記平面移動体に前記回
路基板に向って昇降可能に設けられて前記回路基板の裏
面を支える中間支持部材と、この中間支持部材の昇降駆
動装置とを備えた回路基板支持装置。1. A side edge support member for supporting a pair of opposing side edges of a circuit board, the side edge support member being provided on a plane.
XY table to be moved in the direction, and an XY table provided on this XY table that is substantially parallel to the circuit board on the back side of the circuit board.
Direction movable plane moving body, a plane moving body drive device for moving the plane moving body, and an intermediate support that is provided on the plane moving body so as to be able to move up and down toward the circuit board and supports the back surface of the circuit board. A circuit board support device comprising a member and a lifting drive device for the intermediate support member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59243068A JPH0682960B2 (en) | 1984-11-16 | 1984-11-16 | Circuit board support device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59243068A JPH0682960B2 (en) | 1984-11-16 | 1984-11-16 | Circuit board support device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61121400A JPS61121400A (en) | 1986-06-09 |
| JPH0682960B2 true JPH0682960B2 (en) | 1994-10-19 |
Family
ID=17098314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59243068A Expired - Lifetime JPH0682960B2 (en) | 1984-11-16 | 1984-11-16 | Circuit board support device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0682960B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2636285B2 (en) * | 1987-12-17 | 1997-07-30 | 松下電器産業株式会社 | Electronic component mounting device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57104574U (en) * | 1980-12-17 | 1982-06-28 | ||
| JPS59201774A (en) * | 1983-04-28 | 1984-11-15 | 株式会社東芝 | Automatic assembling device |
-
1984
- 1984-11-16 JP JP59243068A patent/JPH0682960B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61121400A (en) | 1986-06-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |