JP2853176B2 - Component mounting apparatus and method - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to an electronic component mounting apparatus for mounting an electronic component such as a leadless electronic component on a substrate in an electronic circuit board assembly process.

2. Description of the Related Art In recent years, the speed of mounting leadless electronic components has been increased,
Also in an electronic component mounting apparatus in which a main holder having a plurality of sub-holders rotates in an index, the mounting tact is shortened. Japanese Patent Application Laid-Open No. 59-113699 discloses that a plurality of types of nozzles corresponding to the size of electronic components are attached to a sub-holder and the The nozzle is selected by rotating it with respect to the holder.

Hereinafter, an example of a conventional electronic component mounting apparatus will be described with reference to FIG. In the figure, 1 is a component supply unit, 2 is a main holder that rotates in an index with respect to each station, 3 is a sub-holder that is rotatably provided on the main holder 1, and 4 is a suction device that is attached to each sub-holder 3. A nozzle 5, a substrate transport unit 6, a camera 6 for recognizing a component position, a motor 7 for rotating a component posture, and a motor 8 for selecting a nozzle. Regarding each station configuration, A picks up a component, B detects presence / absence of a component, C recognizes a component position, D rotates an angle of a component, E mounts on a circuit board, and F selects a nozzle.

Regarding the electronic component mounting device configured as described above,
The operation will be described below.

After the component supply unit 1 positions the parts cassette on which the predetermined component tape is installed at the suction position, one nozzle 4 suctions one component at the A station. Main holder 2
Detects the presence or absence of a component at station B while rotating the index, recognizes the position of the component at the tip of nozzle 4 at station C, rotates the angle of the component based on the recognition result at station D, and rotates the angle of the component at station E. One component is mounted on a circuit board. In the F station, the nozzle 4 is selected by rotating the sub holder 3.

However, in the above configuration, the number of components carried by one sub-holder is limited to one. In addition, the sub holder with multiple nozzles is placed on the rotating circumference of the main holder.
Because the diameter of the rotating circle of the main holder increases and the rotational inertia increases due to the convenience of arranging 10 to 28, it is necessary to install an index unit having a life corresponding thereto. In this case, the driving mechanism system of each station becomes large, and there is a problem in that there is a limit at each place when speeding up and shortening the mounting tact.

However, especially when a small circuit board is selected as a mounting target, the mounting component is often mounted on the same component such as a square micro chip, and the component supply unit does not need to move while sucking the same component. The mounting tact is governed by the rotation tact of the main holder, and it is considered necessary to reduce the rotation tact of the main holder in order to shorten the mounting tact.

The present invention has been made in view of the above problems, and has as its object to provide an electronic component mounting apparatus capable of shortening a mounting tact from suction to mounting of an electronic component without increasing rotational inertia of a main holder. It is.

Means for Solving the Problems In order to solve the above problems, the present invention holds a main holder that performs index rotation for each station, and holds a plurality of suction nozzles, and is rotatably provided on the main holder. In a component mounting apparatus having a plurality of sub-holders, the sub-holder is rotated with respect to the main holder at each station, and all of the plurality of suction nozzles provided on the sub-holder are attached to the sub-holder at each station. The plurality of suction nozzles are configured to continuously perform a predetermined operation with the rotation of the sub-holder, and the components are continuously suctioned by all the suction nozzles with the rotation of the sub-holder, and configured to be mounted at a predetermined position. Things.

According to the present invention, the main holder is intermittently rotated for each of a series of operations from suction to mounting of a plurality of components by the above-described configuration, and the plurality of nozzles attached to the sub-holder continuously suction and mount with the rotation of the sub-holder. In addition, the mounting tact per component can be reduced.

Embodiment Hereinafter, an electronic component mounting apparatus according to an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 and FIG. 2 show an electronic component mounting apparatus in this embodiment.

In FIGS. 1 and 2, 1 is a component supply unit, 2 is a main holder, 3 is a sub holder, and 4 is a suction nozzle. As shown in FIG. 3, the suction nozzle 4 switches between a small nozzle 4a, a middle nozzle 4b, and a large nozzle 4c according to the size of the component 12. 5 is a board | substrate conveyance part, 6 is a recognition camera, 7
Denotes a component attitude rotation motor, 8 denotes a sub-holder rotation motor, 9 denotes an electronic circuit board, 10 denotes a parts cassette, and 11 denotes a component tape.

Regarding the electronic component mounting device configured as described above,
The operation will be described.

After the parts supply unit 1 positions the parts cassette 10 on which the parts tape 11 is set at the suction position, the nozzle 4 held by the sub holder 3 is rotated by the sub holder rotating motor 8 at the station A, and the four nozzles are rotated. Part 12 continuously to 4
Is adsorbed. Hereinafter, a predetermined operation is performed at each of the B, C, D, E, F, and G stations while the nozzle 4 is continuously intermittently rotated by the auxiliary holder rotation motor 8.

The B station detects the presence or absence of the component, and the C station causes the recognition camera 6 to recognize the position of the component 12 by recognizing the image of the component. At D station,
The component attitude rotation motor 7 rotates the nozzle 4 to an angle at which the component 12 is to be mounted. At the E station, the component 12 is mounted on the electronic circuit board 9 positioned at a predetermined position by the board transport unit 5.

In the G station, defective parts are discharged. Further, in the F station, the small nozzle 13, the middle nozzle 14, and the large nozzle 15 are switched according to the size of the component 12. Also H
At the station, the nozzle angle is returned to the origin rotation.

As described above, according to the present embodiment, each time the main holder 2 rotates intermittently, four components 12 can be sucked and mounted,
In particular, when targeting a board on which a large number of identical components 12 are mounted, the component supply unit 1 is stationary while the nozzle 4 is attracting the identical components 12 from the parts cassette 10, so that the four components 12 are absorbed. The mounting tact is greatly reduced as shown in FIG.

Further, in the conventional example, there is a problem that the component is displaced when the acceleration acting on the component sucked and held by the nozzle becomes excessive with respect to the component suction force of the nozzle with the speeding up of the main holder. The rotation tact time of the holder 2 can be sufficiently secured, and the problem can be solved at the same time even when the sub-holder rotates, since the rotation diameter of the sub-holder 3 is small.

Advantageous Effects of the Invention As described above, according to the present invention, in each station, a plurality of components are sucked and mounted during one intermittent rotation operation of the main holder by continuously performing a predetermined operation on the plurality of nozzles of the sub holder. And the mounting tact per component can be further reduced.

[Brief description of the drawings]

1 and 2 are perspective views of an electronic component mounting apparatus according to one embodiment of the present invention, FIG. 3 is a longitudinal sectional view of a main part showing a suction nozzle of the apparatus, and FIG. 4 is an operation timing chart of the apparatus. FIG. 5 is a perspective view of a conventional electronic component mounting apparatus. 2 ... Main holder, 3 ... Sub holder, 4 ... Suction nozzle, 12 ... Electronic components, A to H ... Station.

──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Takarube Ichiyanagi 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) References JP-A-59-113699 (JP, A) JP-A-61 -142799 (JP, A) (58) Fields investigated (Int. Cl. ⁶ , DB name) H05K 13/04 B23P 21/00 305

Claims (2)

(57) [Claims] 1. A component mounting apparatus comprising: a main holder for performing index rotation for each station; and a plurality of sub-holders holding a plurality of suction nozzles and rotatably provided on the main holder. The sub-holder is rotated with respect to the main holder at each station, and all of the plurality of suction nozzles provided in the sub-holder perform a predetermined operation continuously at each station together with the rotation of the sub-holder at each station. A component mounting device, characterized in that: 2. A main holder rotates with respect to each station, a plurality of sub-holders provided on the main holder rotate with respect to each main holder, and a plurality of suction units formed on the sub-holders. In the component mounting apparatus which sucks and mounts a component by a nozzle, the plurality of suction nozzles continuously suck a component by all of the suction nozzles and rotate the auxiliary holder, and mount the component to a predetermined position. Mounting method.