JP2002290098A - Electronic component mounter - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component mounter in which the space can be saved and maintenance of a mounting head is facilitated. SOLUTION: A mounting table is disposed movably in the X direction and a mounting head having a suction nozzle and a coating head for applying adhesive are disposed on the opposite outsides of a shared frame 4 movably in the direction orthogonal to the mounting table along the shared frame 4. Since paste has been applied from any one of adhesive supply unit 19A or 19B to the coating nozzle 17 of an already moved adhesive coater 5 when a mounter 6 moves above a positioning table 72 in order to take out an electronic component, the adhesive coater 5 moves above the mounting table and transfers paste onto a printed board.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus in which electronic components are mounted on a printed circuit board mounted on a mounting table by suction nozzles.

[0002]

2. Description of the Related Art In a conventional mounting apparatus, when a plurality of mounting heads are to be provided, they are separately provided inside respective frames.

[0003]

However, arranging the mounting heads in this manner requires a plurality of frames, and thus requires a space for the plurality of frames. There is a problem that it is difficult to maintain the mounting head.

Accordingly, an object of the present invention is to provide a mounting apparatus which can save space and can easily maintain a mounting head.

[0005]

Means for Solving the Problems For this reason, the first invention provides
In an electronic component mounting apparatus in which electronic components are mounted by suction nozzles on a printed board mounted on a mounting table, the mounting head having the suction nozzles is provided on both outer sides of one shared frame. It is characterized by being provided movably along the frame.

According to a second aspect of the present invention, in the mounting apparatus, the mounting table is provided so as to be movable in one direction, and the mounting head having the suction nozzle is provided on both outer sides of one shared frame along the frame. It is characterized in that it is provided so as to be movable in a direction orthogonal to the moving direction of the placing table.

According to a third invention, in the mounting apparatus,
A mounting head having the suction nozzle and an application head for applying an adhesive are provided on both outer sides of one shared frame so as to be movable along the shared frame.

[0008] In a fourth aspect of the present invention, in the mounting apparatus,
The placement table is provided so as to be movable in one direction, and a mounting head having the suction nozzle and an application head for applying an adhesive are provided on both outer sides of one shared frame along the moving direction of the placement table along the frame. It is characterized in that it is provided so as to be movable in directions orthogonal to each other.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below. Reference numeral 2 denotes a base of the mounting device 1 for mounting electronic components in the form of a chip, and a single shared frame for saving space in the Y direction via the front and rear mounting bodies 3A and 3B fixed to the upper part of the base 2. (Mounting frame) 4 is provided. Then, a transfer-type adhesive application device 5 and a mounting device 6 are provided on both outer sides of the shared frame 4 so as to be individually movable along the shared frame 4. This facilitates maintenance of the adhesive application device 5 and the mounting device 6.

First, the adhesive application device 5 includes a nut body (not shown) into which a screw shaft 9 rotated via a coupling 8 by a Y-axis drive motor 7 is fitted. To move in the Y direction. A nut body 14 to which a screw shaft 13 rotated via a coupling 12 by an up / down motor 11 provided at an upper portion is provided. Coating head 1 having coating nozzle 17
8 can be moved up and down. The coating head 18 is provided with a selection device (not shown) for selecting and lowering an arbitrary coating nozzle 17.

Reference numerals 19A and 19B denote adhesive supply devices disposed below the adhesive application device 5 on both sides of the common frame 4, for example. The paste or the like is formed at a height by a transfer drum formed by a squeegee, and the paste having the fixed height is attached to the tip of the application nozzle 17 descending of the adhesive application device 5, and the application nozzle 17 is described later. The image is transferred to a printed circuit board 46 on the mounting table 45. As described above, the adhesive supply devices 19A and 19B may supply pastes having different characteristics as well as pastes having different film thicknesses. In this case, it can be supplied by making the height of the squeegee different. Adhesive supply device 19
Since A and 19B are provided on both sides of the shared frame 4, maintenance such as supply of paste can be easily performed from both sides.

Next, the mounting device 6 includes a nut body (not shown) to which a screw shaft 21 rotated by a Y-axis drive motor 20 via a coupling (not shown) is fitted. 22 and can move in the Y direction along the Y direction.
It is possible to move in the direction. Further, the linear guide 2 includes a nut body 26 to which a screw shaft 25 rotated via a coupling 24 by a vertical motor 23 provided at an upper portion is fitted.
A mounting head 30 having a plurality of suction nozzles 29 can be moved up and down along a mounting member 7 via a mounting body 28.

As shown in FIGS. 3 and 4, when the rotary motor 31 is driven, the timing belt 34 stretched between the pulleys 32 and 33 supported on the horizontal portion of the mounting body 28 causes the timing belt 34 to stretch. Since the holder support 35 is fixed to a part of the pulley 33 disposed in the concave portion of the horizontal portion, the holder support 3 supporting the mounting head 30 is provided.
5 rotates around the vertical line, and as a result, the mounting head 30 and the suction nozzle 29 rotate.

Further, when the intermittent rotation motor 38 is driven,
With the pulley 39, the pulley 40 formed around the mounting head 30, and the timing belt 41, the mounting head 30 intermittently rotates around a horizontal line around the horizontal support shaft, that is, with the support shaft being a fulcrum at intervals of 60 degrees. Rotate.

As shown in FIG. 1, reference numerals 45 respectively correspond to the adhesive application device 5 and the mounting device 6 provided on both outer sides of the shared frame 4, and one or a plurality of sheets (two in this embodiment). Are mounted on the mounting table 45. The screw shaft 47 is rotated by an X-axis drive motor (not shown) to rotate the nut 48.
Is guided by the guide 44, and
It moves in the X direction.

Reference numeral 50 denotes a sheet 5 of the diced wafer.
Reference numeral 1 denotes a component supply device capable of moving the four fixed wafer tables 52 in the XY directions. The supply device 50 rotates a screw shaft by an X-axis drive motor 53 and moves along a guide via a nut body 54. Table 55 that moves in the X direction
And a transmission belt is stretched between a pulley 57 provided on a drive shaft of a Y-axis drive motor 56 and another pulley on the X table 55 to rotate a driven shaft, and follow a guide through a nut body. Table 58 that moves in the Y-direction, and pulley 6 provided on the drive shaft of rotary motor 59 on Y table 58
An index unit 63 that rotates a driven shaft that rotates by stretching a transmission belt 62 between the zero and another pulley 61 and rotates about a vertical axis, and is fixed to an output shaft (shaft) of the unit 63. And a rotating wafer table 52.

Two component supply devices 50 are provided in front of the mounting device 1 in correspondence with the mounting device 6, and four types of electronic components are set in each of the component supply devices 50, Index unit 6 driven by motor 59
A predetermined type of electronic component is selected by the operation of No. 3. The wafer table 52 is mounted and fixed in a state in which the wafer attached to the sheet 51 is diced and divided into individual electronic components, and the electronic components are pushed up from the back surface by push-up pins (not shown). While being taken out.

It should be noted that the component supply device 50 can be provided with a molded chip component having leads and supply the molded chip component. In this case, it may be supplied in a tray or the like.

Reference numeral 68 denotes a first recognition camera fixed at a predetermined position above an electronic component take-out position by each transfer device 70 to be described later. The first recognition camera 68 picks up an electronic component to be taken out on the wafer table 52 and recognizes the position. I do. Then, based on the recognition result, the X-axis drive motor 5 of the
3. Using the Y-axis drive motor 56 and the rotation motor 59,
The component supply device 50 is corrected and moved by the deviation amount.

Reference numeral 70 denotes a transfer device, which reciprocates in an arc shape and moves up and down by a driving source (not shown) as shown in FIG. The electronic components are taken out and placed on the respective positioning tables 72.

Next, the positioning table 72 will be described with reference to FIGS. First, when the X-axis drive motor 73 as a switching device is driven, the coupling 74 is driven.
, The screw shaft 75 rotates, and the nut body 76 and the table 77 are moved in the X direction by the linear guide 78. That is, the table 77 has a communication passage 83 communicating with a vacuum source and a vacuum suction hole 82 having a different size (having a different suction force) at the center so that electronic components having different shapes and sizes can be transferred to the table 77. The placement units 79, 80, and 81 are formed, and any one of the placement units is selected according to the driving amount of the X-axis drive motor 73, and the transfer device 70
Thereby, it is possible to transfer from the component supply device 50 to the selected placement section of the positioning table 72. The right mounting portion 79 has a flat shape and is suitable for mounting a flat electronic component such as a leadless bare chip, and the center mounting portion 80 has a periphery around a vacuum suction hole 82. A space 80 for receiving a lead of an electronic component with a four-way lead by further digging the periphery as a rectangular flat mounting surface 80A.
B is suitable for mounting the leaded electronic component, and the left mounting portion 81 is a circular flat plate-shaped mounting surface 81 </ b> A around the vacuum suction hole 82 and is further dug around the circumference. I have. By mounting an appropriate jig (not shown) on the mounting surface 81A, the mounting surface 81A can be configured to correspond to the shape and size of various electronic components with leads and other electronic components.

Reference numeral 85 denotes a second recognition camera fixed at a predetermined position above each transfer device 70. The second recognition camera 85 images electronic components on the positioning table 72 and recognizes the position. Using the Y-axis drive motor 20 and the rotation motor 31 of the mounting device 6 and the X-axis drive motor 73 of the positioning table 72, the suction nozzle 29 and the positioning table 72 are corrected and moved by the amount of the shift.

An adhesive application device 5 and a mounting device 6 are provided on both outer sides of the common frame 4, and the adhesive application device 5, the mounting device 6, and the adhesive supply devices 19A and 19 are provided.
B and the transfer device 70 are arranged in a straight line.

The operation of the above configuration will be described below. First, the printed circuit board 46 is transported from an upstream device (not shown) and is positioned and fixed on the mounting table 45. Then, the wafer table 52 of the two component supply devices 50 is moved to the X-axis drive motor 53, the Y-axis drive motor 56, and the rotation motor so that the electronic components to be mounted are sucked and taken out by the suction nozzle 71 of each transfer device 70. 59
Is moved to a predetermined take-out position, the position of the electronic component to be mounted is recognized by the first recognition camera 68, and the wafer table 52 is corrected and moved. Then, the suction nozzle 71 is moved down, and the transfer device 70 is moved, and the positioning table 72 is moved.
Is placed on any of the placing sections 79, 80, 81.

At this time, if the electronic component is a flat plate-like electronic component such as a leadless bare chip, the X-axis drive motor 73
To move the right mounting portion 79 of the positioning table 72 to a predetermined position. For example, in the case of an electronic component with four-way leads, the X-axis driving motor 73 is driven to move the mounting portion 80 to the predetermined position. , And for other electronic components, the placement unit 81 is moved to be located at a predetermined position, and the placement unit is switched by the X-axis drive motor 73.
For this reason, the electronic components are replaced by the type (shape, size) of the electronic components.
Can be mounted on the mounting portion 79, 80, or 81 that suits the requirements. The electronic component mounted on the mounting portion 79, 80 or 81 is sucked and held by the mounting portion 79, 80 or 81 by a communication path 83 and a vacuum suction hole 82 communicating with a vacuum source (not shown).

Next, the second recognition camera 85 images the electronic components on the positioning table 72 and recognizes the position. Based on the recognition result, when the mounting device 6 moves above the positioning table 72, , Y of the mounting device 6
The suction nozzle 29 and the positioning table 72 are corrected and moved by an amount corresponding to the displacement using the shaft drive motor 20, the rotation motor 31 and the X-axis drive motor 73 of the positioning table 72.

That is, of the deviation amounts, the deviation amount in the X direction is corrected using the X-axis drive motor 73 of the positioning table 72, and the mounting device 6 in the Y direction and direction is corrected.
After the correction is performed using the Y-axis drive motor 20 and the rotary motor 31, the suction nozzle 29 descends to suck and take out.

Then, when the suction nozzle 29 of the mounting device 6 sucks and takes out, the vacuum suction of the electronic component through the suction hole 82 of the mounting portion 79 of the positioning table 72 is released.

When the mounting device 6 moves above the positioning table 72 to take out the electronic components, the mounting device 6 has already moved to the application nozzle 17 of the adhesive application device 5 and has one of the adhesive supply devices 19A and 19B. Since the paste has been adhered, the adhesive application device 5 moves above the mounting table 45 and transfers the paste onto the printed circuit board 46.

When the adhesive application device 5 moves above any one of the adhesive supply devices 19A and 19B, the suction nozzle 29 of the mounting device 6 descends to mount the taken out electronic component. The electronic component is moved above the mounting table 45 and mounted on the printed circuit board 46. At this time, since two printed circuit boards 46 are fixed on the mounting table 45, the adhesive application device 5 and the mounting device 6 on the right side of the shared frame 4 The transfer and the mounting are performed on the substrate 46, and the adhesive application device 5 and the mounting device 6 on the left are mounted on the mounting table 4 on the left.
5 is to be transferred and mounted on each printed circuit board 46 on the substrate 5.

Although the embodiments of the present invention have been described above, various alternatives, modifications or variations are possible for those skilled in the art based on the above description, and the present invention is not limited thereto without departing from the spirit and scope of the invention. It is intended to cover alternatives, modifications or variations.

[0032]

As described above, according to the present invention, since a single shared frame is used, space can be saved, and since the mounting heads are provided on both outer sides of the shared frame, the mounting head can be easily maintained. An apparatus can be provided. Further, since the mounting head and the coating head are provided on both outer sides of the shared frame, maintenance of the coating head is easy.

[Brief description of the drawings]

FIG. 1 is a left side view of a mounting apparatus.

FIG. 2 is a plan view of the mounting apparatus.

FIG. 3 shows a plan view of the mounting device.

FIG. 4 shows a side view of the mounting device.

FIG. 5 shows a plan view of a positioning table.

FIG. 6 shows a side view of the positioning table.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Mounting device 4 Shared frame 7, 20 Y-axis drive motor 5 Adhesive application device 6 Mounting device 18 Application head 30 Mounting head 45 Mounting table

 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Teruhiro Tomizawa 2-5-5 Keihanhondori, Moriguchi-shi, Osaka Sanyo Electric Co., Ltd. (72) Ryuichi Komatsu 2-chome Keihanhondori, Moriguchi-shi, Osaka No.5 No.5 Sanyo Electric Co., Ltd. F-term (reference) 5E313 AA02 AA03 AA11 AA21 AA23 CC03 CC04 CC05 CD05 DD01 DD02 DD03 DD07 DD21 EE01 EE02 EE03 EE05 EE24 EE25 EE35 FF06 FF12 FF24 FF26 FF28 PP16 FF29 PP05 PP17 5F047 FA05 FA08 FA25

Claims (4)

[Claims] 1. An electronic component mounting apparatus in which electronic components are mounted on a printed circuit board mounted on a mounting table by suction nozzles, wherein the suction nozzles are provided on both outer sides of one shared frame. An electronic component mounting apparatus, wherein a mounting head is provided movably along the shared frame. 2. An electronic component mounting apparatus in which electronic components are mounted on a printed board mounted on a mounting table by suction nozzles, wherein the mounting table is provided so as to be movable in one direction. An electronic component mounting apparatus, wherein mounting heads having suction nozzles are provided on both outer sides of one shared frame so as to be movable along the frame in a direction orthogonal to the moving direction of the mounting table. 3. An electronic component mounting apparatus in which electronic components are mounted on a printed circuit board mounted on a mounting table by suction nozzles, wherein the suction nozzles are provided on both outer sides of one shared frame. An electronic component mounting apparatus, wherein a mounting head and an application head for applying an adhesive are provided movably along the shared frame. 4. An electronic component mounting apparatus in which electronic components are mounted by suction nozzles on a printed board mounted on a mounting table, wherein the mounting table is provided so as to be movable in one direction. A mounting head having a suction nozzle and an application head for applying an adhesive are provided on both outer sides of one shared frame so as to be movable along the frame in a direction orthogonal to the moving direction of the mounting table. Electronic component mounting equipment.