JPH03268488A - Electronic part mounting device - Google Patents
Electronic part mounting deviceInfo
- Publication number
- JPH03268488A JPH03268488A JP2068697A JP6869790A JPH03268488A JP H03268488 A JPH03268488 A JP H03268488A JP 2068697 A JP2068697 A JP 2068697A JP 6869790 A JP6869790 A JP 6869790A JP H03268488 A JPH03268488 A JP H03268488A
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- positioning
- mounting member
- component
- moving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012937 correction Methods 0.000 claims abstract description 14
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000004806 packaging method and process Methods 0.000 abstract 3
- 230000009977 dual effect Effects 0.000 abstract 2
- 238000010276 construction Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、部品供給部から供給された電子部品を回路基
板等の実装部材に実装するために利用される電子部品実
装装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an electronic component mounting apparatus used for mounting electronic components supplied from a component supply section onto a mounting member such as a circuit board.
従来の技術
従来、電子部品を回路基板に実装するために使用される
電子部品実装装置には、電子部品を収容した複数の部品
供給ユニットを移動テーブル上に並列した部品供給部を
設け、移動テーブルをその並列方向に移動させて所定位
置で部品を取り出せるようにし、また回路基板を位置決
めする手段を設けて部品が装着される回路基板上の位置
が所定位置にくるようにし、実装手段で保持した部品の
位置ずれを部品認識手段により認識し、これに基いて回
路基板の位置補正をした後、前記実装手段により回路基
板に部品を実装するようにしたものが知られている。Conventional technology Conventionally, an electronic component mounting apparatus used for mounting electronic components on a circuit board is provided with a component supply section in which a plurality of component supply units containing electronic components are arranged in parallel on a movable table. are moved in the parallel direction so that the components can be taken out at a predetermined position, and a means for positioning the circuit board is provided so that the position on the circuit board on which the component is mounted is at a predetermined position, and the mounting means is used to hold the component. There is known a device in which the positional deviation of a component is recognized by a component recognition means, the position of the circuit board is corrected based on this, and then the component is mounted on the circuit board by the mounting means.
発明が解決しようとする課題
このような従来の電子部品実装装置においては、部品供
給部で保持した部品の位置ずれを部品認識手段により認
識して、回路基板の位置を補正する場合には、この補正
を回路基板の位置決め手段により行うようにしているた
め、実装手段を複数並設した実装装置では、実装手段ご
とに回路基板の位置補正をする必要から、実装手段と同
数の位置決め手段を設けねばならず、これでは製造コス
トが嵩むという欠点がある。Problems to be Solved by the Invention In such a conventional electronic component mounting apparatus, when the component recognition means recognizes the positional deviation of the component held in the component supply section and corrects the position of the circuit board, this is necessary. Since the correction is performed by the positioning means of the circuit board, in a mounting apparatus in which a plurality of mounting means are arranged in parallel, it is necessary to correct the position of the circuit board for each mounting means, so it is necessary to provide the same number of positioning means as the mounting means. However, this has the disadvantage of increasing manufacturing costs.
課題を解決するための手段
本発明は上記課題を解決するため、部品供給部と、部品
が実装される実装部材を位置決めするための実装部材位
置決め手段と、前記部品供給部の部品を保持してこれを
前記実装部材に実装するための実装手段と、前記保持部
品の位置ずれを認識する部品認識手段とを備えた電子部
品実装装置において、実装手段が複数並設され、その実
装部材位置決め手段が、平面上の2方向に移動可能な位
置決めテーブルと、複数の実装手段に対し個別に設けら
れかつ前記位置決めテーブル上に配置される複数の実装
部材保持テーブルとから構成され、前記実装部材保持テ
ーブルの内の1つは前記位置決めテーブル上に固定され
、他の実装部材保持テーブルは平面上の2方向に位置補
正移動可能となっていることを特徴とする。Means for Solving the Problems In order to solve the above problems, the present invention includes a component supply section, a mounting member positioning means for positioning a mounting member on which the component is mounted, and a mounting member positioning means for holding the component in the component supply section. In an electronic component mounting apparatus comprising a mounting means for mounting this on the mounting member and a component recognition means for recognizing a positional shift of the holding component, a plurality of mounting means are arranged in parallel, and the mounting member positioning means is arranged in parallel. , consisting of a positioning table movable in two directions on a plane, and a plurality of mounting member holding tables provided individually for a plurality of mounting means and arranged on the positioning table; One of the mounting member holding tables is fixed on the positioning table, and the other mounting member holding table is movable for position correction in two directions on a plane.
作用
本発明の電子部品実装装置の実装部材位置決め手段は、
複数の実装手段に対し共通の位置決めテーブルで各実装
部材の平面上の2方向の位置決めを行うことができ、各
部品認識手段による各実装部材の位置補正を、1つの実
装部材に対しては位置決めテーブルの移動で行い、他の
実装部材に対しては位置決めテーブル上に平面上の2方
向に位置補正移動可能に配設された実装部材保持テーブ
ルの移動で行うことができる。Function The mounting member positioning means of the electronic component mounting apparatus of the present invention is as follows:
It is possible to position each mounting member in two directions on a plane using a common positioning table for multiple mounting means, and it is possible to perform position correction of each mounting member by each component recognition means, while positioning for one mounting member. This can be done by moving the table, and for other mounting members, it can be done by moving a mounting member holding table that is disposed on the positioning table so that it can move in two plane directions for position correction.
実施例 以下本発明の実施例を図面を参照しながら説明する。Example Embodiments of the present invention will be described below with reference to the drawings.
第1図において、14は複数の部品供給ユニット13が
並設された部品供給部で、部品供給ユニット13をその
並設方向に移動して所定の部品供給位置に位置決めする
ことができ、かつ各部品供給ユニッ)13にはテーピン
グ部品が装着されて、各部品が順次所定の部品取出し位
置にまで送り出される。In FIG. 1, reference numeral 14 denotes a component supply section in which a plurality of component supply units 13 are arranged side by side, and the component supply units 13 can be moved in the direction in which they are arranged side by side to position them at predetermined component supply positions. Taped parts are attached to the parts supply unit (13), and each part is sent out one by one to a predetermined part take-out position.
12a 、12bは旋回型の第1および第2の実装手段
で、垂直軸に設ける回転テーブルにそれぞれ複数組の装
着ヘッド10a 、10bが輪状に等間隔で取り付けら
れ、装着ヘッド10a 、10bには上下移動する吸着
ノズルが備えられ、部品供給位置で下降して部品を吸着
保持する。Reference numerals 12a and 12b denote first and second mounting means of a rotating type, in which a plurality of sets of mounting heads 10a and 10b are mounted on a rotary table provided on a vertical axis at equal intervals in a ring shape, and the mounting heads 10a and 10b have upper and lower mounting heads. A moving suction nozzle is provided, which descends at the component supply position to suction and hold the component.
再実装手段12a 、12bにはそれぞれ部品認識手段
9a、9b (第1の実装手段12aの部品認識手段9
aは図示を省略する。)とθ回転ユニット11a 、l
lbが付設され、部品吸着時の正規の保持位置との位置
ずれ量を認識し、θ回転ユニット11a 、llbと後
記実装部材位置決め手段1により実装部材を位置補正す
る。The remounting means 12a and 12b have component recognition means 9a and 9b, respectively (component recognition means 9 of the first mounting means 12a).
A is omitted from illustration. ) and θ rotation units 11a, l
lb is attached to recognize the amount of positional deviation from the normal holding position when picking up the component, and correct the position of the mounting member using the θ rotation units 11a, llb and the mounting member positioning means 1, which will be described later.
回転テーブルは装着ヘッド10a 、10bの配置間隔
で間欠回転され、この装着ヘッド10a 、10bの停
止する位置が部品供給位置であり、また部品実装位置と
なる。The rotary table is intermittently rotated at intervals between the mounting heads 10a and 10b, and the positions where the mounting heads 10a and 10b stop are component supply positions and component mounting positions.
第1図において、実装部材位置決め手段1は、平面上の
X方向に移動可能な第1移動チーフル2と、この上に設
けられてX方向と直角方向で平面上にあるY方向に移動
可能な第2移動テーブル3とからなる位置決めテーブル
30を備えるとともに、第2移動テーブル3上に固定さ
れる第1の実装部材保持テーブル4と、第2移動テーブ
ル3上にX−Y方向移動可能に配設された第2の実装部
材保持テーブル7とを備えている。前記第1の実装部材
保持テーブル4は第1の実装手段12aに対応して設け
られ、前記第2の実装部材保持テーブル7は第2の実装
手段12bに対応して設けられている。そして第2の実
装部材保持テーブル7はX方向に移動可能な第3移動テ
ーブル5と、この上に設けられてY方向に移動可能な第
4移動テーブル6とからなる、第1の回路基板(実装部
材) 8aは前記第1の実装部材保持テーブル4上に固
定支持され、第2の回路基板(実装部材)8bは前記第
2の実装部材保持テーブル7上に固定支持される。In FIG. 1, the mounting member positioning means 1 includes a first movable tip 2 that is movable in the X direction on the plane, and a first moving tip 2 that is provided thereon and is movable in the Y direction on the plane in a direction perpendicular to the X direction. It includes a positioning table 30 consisting of a second moving table 3, a first mounting member holding table 4 fixed on the second moving table 3, and a first mounting member holding table 4 arranged movably in the X-Y directions on the second moving table 3. A second mounting member holding table 7 is provided. The first mounting member holding table 4 is provided corresponding to the first mounting means 12a, and the second mounting member holding table 7 is provided corresponding to the second mounting means 12b. The second mounting member holding table 7 includes a third moving table 5 that is movable in the X direction, and a fourth moving table 6 that is provided thereon and is movable in the Y direction. The mounting member) 8a is fixedly supported on the first mounting member holding table 4, and the second circuit board (mounting member) 8b is fixedly supported on the second mounting member holding table 7.
実装部材位置決め手段工の再実装手段12a、12bに
共通な部分、すなわち第1移動テーブル2と第2移動テ
ーブル3とからなる位置決めテーブル30により、図示
しない基板供給手段により供給された第1、第2の回路
基板8a、8bの位置決めを行い、そして第1の回路基
板8aの位置補正は前記位置決めテーブル30のX−Y
移動によりなされ、第2の回路基板8bの位置補正は実
装部材保持テーブル7のX−Y移動によりなされる。A part common to the remounting means 12a and 12b of the mounting member positioning means, that is, a positioning table 30 consisting of a first moving table 2 and a second moving table 3, allows the first and second substrates supplied by a substrate supplying means (not shown) to The second circuit boards 8a and 8b are positioned, and the position of the first circuit board 8a is corrected using the X-Y position of the positioning table 30.
The position of the second circuit board 8b is corrected by moving the mounting member holding table 7 in the X-Y direction.
次に実装部材位置決め手段1による両回路基板8a、8
bの位置決め動作につき説明する。Next, both circuit boards 8a and 8 are mounted by the mounting member positioning means 1.
The positioning operation b will be explained.
まず、部品供給部14上には回路基板8a、8bに実装
される各種部品がそれぞれ区別して収容された部品供給
ユニット13が並設される。First, on the component supply section 14, component supply units 13 are arranged in parallel, in which various components to be mounted on the circuit boards 8a and 8b are separately housed.
部品供給ユニット13の部品取出し位置に待機する部品
が、順次実装手段12a 、12bの装着ヘッド10a
、10bにより吸着保持され、装着ヘッド10a 、
10bがそれぞれ上昇した後、回転テーブルが回転して
、部品認識手段9a、9bにより部品の吸着位置のずれ
量が認識される。Components waiting at the component extraction position of the component supply unit 13 are sequentially transferred to the mounting head 10a of the mounting means 12a and 12b.
, 10b, and the mounting head 10a,
After each of the parts 10b is raised, the rotary table is rotated, and the component recognition means 9a and 9b recognize the amount of deviation in the suction position of the component.
それぞれの位置ずれの補正動作は、まず所定のテーブル
回転位置で各θ回転ユニッ)lla、11bにより、正
規の回転量に対してのずれ量分だけ装着ヘッド10a
、10bを回転させて、部品の回転位置の補正を行う。To correct each positional deviation, first, at a predetermined table rotation position, each θ rotation unit 11a, 11b rotates the mounting head 10a by the amount of deviation relative to the normal rotation amount.
, 10b to correct the rotational position of the component.
次に、第1の実装部材保持テーブル4上に固定支持され
た第1の回路基板8aが、第1移動テーブル2と第2移
動テーブル3のX−Y移動により、正規のXlY位置に
対する位置ずれが補正されて位置決めされる。また、同
時に第2の実装部材保持テーブル7上に固定支持された
第2の回路基板8bは、第3移動テーブル5と第4移動
テーブル6のX −Y移動により、第1の回路基板8a
における装着位置ずれ量と第2の回路基板8bにおける
装着位置ずれ量を加算したずれ量を補正して位置決めさ
れる。Next, the first circuit board 8a fixedly supported on the first mounting member holding table 4 is displaced from the normal XlY position due to the XY movement of the first moving table 2 and the second moving table 3. is corrected and positioned. Further, at the same time, the second circuit board 8b fixedly supported on the second mounting member holding table 7 is transferred to the first circuit board 8a by the X-Y movement of the third moving table 5 and the fourth moving table 6.
The positioning is performed by correcting the amount of deviation that is the sum of the amount of deviation in the mounting position in and the amount of deviation in the mounting position in the second circuit board 8b.
このようにして、補正により位置決めされた両回路基板
8a、8b上に、各実装手段12a 、12bのそれぞ
れの装着ヘッド10a 、10bにより部品が順次実装
される。In this way, components are sequentially mounted onto the circuit boards 8a, 8b positioned by the correction by the respective mounting heads 10a, 10b of the respective mounting means 12a, 12b.
第2図は、他の実施例の実装部材位置決め手段1を示す
。FIG. 2 shows the mounting member positioning means 1 of another embodiment.
位置決めテーブル30および第1の実装部材保持テーブ
ル4は第1図に示す実施例と同様に構成されている。他
方第2の実装部材保持テーブル7aは以下に述べるカム
機構によりX−Y位置が定められるようになっている。The positioning table 30 and the first mounting member holding table 4 are constructed similarly to the embodiment shown in FIG. On the other hand, the X-Y position of the second mounting member holding table 7a is determined by a cam mechanism described below.
駆動部15Xによりベル) 16Xが駆動され、これに
伴い同期回転するる1対のカム17X 、17XがX方
向のみ移動可能な1対の従動ローラ18X、18xをX
方向に移動させる。第2の実装部材保持テーブル7aは
1対のバネ19X、19Xニよって図の右方向に押され
ており、またその右辺には前記1対の従動ローラ18X
、18Xが圧接している。したがって1対のカム17
X 、17Xの回転位置によって第2の実装部材保持テ
ーブル7aのX方向の位置を設定することができる。同
様にして駆動部15Y1ベルト16Y、1対のカム17
Y、17Y、従動ローラ18Y 、18Y、1対のバネ
19Y 、19YからなるX方向位置規制手段によって
、第2の実装部材保持テーブル7aのX方向の位置を設
定することができる。このように吸着部品の位置ずれに
対応する第2の回路基板8bの位置補正は、駆動部15
X 、 15Yを駆動することにより行うことができる
。A pair of cams 17X and 17X rotate in synchronization with each other, and a pair of driven rollers 18X and 18X, which can move only in the X direction, are driven by a drive unit 15X.
move in the direction. The second mounting member holding table 7a is pushed rightward in the figure by a pair of springs 19X, 19X, and on its right side is the pair of driven rollers 18X.
, 18X are in pressure contact. Therefore, a pair of cams 17
The position of the second mounting member holding table 7a in the X direction can be set by the rotational position of X and 17X. Similarly, the drive unit 15Y1 belt 16Y, a pair of cams 17
The X-direction position of the second mounting member holding table 7a can be set by the X-direction position regulating means comprising Y, 17Y, driven rollers 18Y, 18Y, and a pair of springs 19Y, 19Y. In this way, the position correction of the second circuit board 8b corresponding to the positional deviation of the suction component is performed by the drive unit 15.
This can be done by driving X and 15Y.
第3図は、更に他の実施例の実装部材位置決め手段1を
示す。この実施例は第2図に示す実施例におけるカム1
7X 、17X 、17Y 、17Yに代えて、揺動7
−ム20X 、20X 、20Y 、 20Yを用いた
点に特徴があるが、その他は同様の構成であるので説明
を省略し、第3図に共通符号を付している。FIG. 3 shows a mounting member positioning means 1 of yet another embodiment. This embodiment is based on the cam 1 in the embodiment shown in FIG.
In place of 7X, 17X, 17Y, 17Y, swing 7
- The structure is characterized by the use of 20X, 20X, 20Y, and 20Y, but since the other configurations are the same, the explanation will be omitted and the common reference numerals are given in FIG.
このように 吸着部品の位置ずれに対応した第2の回路
基板8bの位置補正を、駆動部15X、15Yを駆動す
ることにより行うことができる。In this way, the positional correction of the second circuit board 8b corresponding to the positional deviation of the suction component can be performed by driving the drive units 15X and 15Y.
前記実施例では、電子部品を回路基板上に実装する装置
につき説明したが、電子部品を回路基板に挿入する装置
等についても本発明を適用することができる。また前記
実施例は実装手段12a 、12bが2基ある場合のも
のであるが、実装手段が3基以上ある場合にも本発明を
適用することができ、その場合、各実装手段に対応する
実装部材保持テーブルの内の1つを除いた他のものは、
XY力方向位置補正移動可能に構成されている。また前
記実施例では、位置決めテーブル上に固定される実装部
材保持テーブルは、位置決めテーブルと別体形成されて
いるが、これを位置決めテーブルに一体に設けることも
可能である。In the embodiments described above, an apparatus for mounting electronic components on a circuit board has been described, but the present invention can also be applied to an apparatus for inserting electronic components onto a circuit board. Further, although the above embodiment is a case where there are two mounting means 12a and 12b, the present invention can also be applied to a case where there are three or more mounting means, and in that case, the mounting means corresponding to each mounting means are All but one of the member holding tables are
It is configured to be movable for position correction in the XY force directions. Further, in the above embodiment, the mounting member holding table fixed on the positioning table is formed separately from the positioning table, but it is also possible to provide it integrally with the positioning table.
発明の効果
本発明の電子部品実装装置によれば、複数の実装部材に
共通な位置決めテーブルで実装部材を位置決めし、所定
の部品認識手段による複数の実装部材の位置補正を、そ
の内の1つは前記共通な位置決めテーブルの移動で行う
ことができ、その他のものは個別に設けた位置補正移動
可能な実装部材保持テーブルの移動で行うことができる
ようにしたので、各実装手段のそれぞれに対し実装部材
の位置補正機能を持つことができる構造を簡単な構造と
することができる。Effects of the Invention According to the electronic component mounting apparatus of the present invention, a mounting member is positioned using a positioning table common to a plurality of mounting members, and a predetermined component recognition means corrects the position of the plurality of mounting members by using one of the mounting members. can be done by moving the common positioning table, and other things can be done by moving the mounting member holding table that is individually provided and movable for position correction. The structure that can have the function of correcting the position of the mounting member can be made into a simple structure.
したがって本発明によれば、複数の部品実装手段を有し
、精度の高い部品の実装が可能であるとともに生産性の
高い電子部品実装装置を低コストで提供することができ
る。Therefore, according to the present invention, it is possible to provide an electronic component mounting apparatus having a plurality of component mounting means, capable of mounting components with high precision, and having high productivity at a low cost.
【図面の簡単な説明】
第1図は本発明の一実施例の電子部品実装装置を示す斜
視図、第2図は他の実施例における実装部材位置決め手
段を示す概略平面図、第3図は更に他の実施例における
実装部材位置決め手段を示す概略平面図である。
1・・・−・・・・・・・・・−・・・・・・・・・・
実装部材位置決め手段4・・・〜・・・・・・・・・・
・・・・・・・・・・・・実装部材保持テーブル7・・
・・・・・・・・・・・・・・・・・・・・・・・・・
・実装部材保持テーブル8a、8b−・・・・・・・・
・・−・・・・・・・実装部材9b−・−・・・・・−
・・・・・・・・・−・・・・・・・・部品認識手段1
2a 、 12b・・・・−・・・・・・実装手段14
−・・−・・・・・・・・・・・・・・・・・・・・・
・部品供給部30−・・・−・・・・・・・・・・・・
・・・・・・・・・、位置決めテーブル竺1図
’!−)i5rj;“Puイ>3二gnq;トうε9b
費み話減今以[BRIEF DESCRIPTION OF THE DRAWINGS] FIG. 1 is a perspective view showing an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a schematic plan view showing mounting member positioning means in another embodiment, and FIG. FIG. 7 is a schematic plan view showing mounting member positioning means in still another embodiment. 1・・・-・・・・・・・・・-・・・・・・・・・・・・
Mounting member positioning means 4...
......Mounted member holding table 7...
・・・・・・・・・・・・・・・・・・・・・・・・
・Mounting member holding tables 8a, 8b--
......Mounting member 9b--
・・・・・・・・・−・・・・・・・・・Component recognition means 1
2a, 12b...Mounting means 14
−・・−・・・・・・・・・・・・・・・・・・・
・Parts supply section 30--...
・・・・・・・・・Positioning table drawing 1'! −) i5rj; “Pu i>32gnq; touε9b
Expenses are decreasing now
Claims (1)
決めするための実装部材位置決め手段と、前記部品供給
部の部品を保持してこれを前記実装部材に実装するため
の実装手段と、前記保持部品の位置ずれを認識する部品
認識手段とを備えた電子部品実装装置において、実装手
段が複数並設され、その実装部材位置決め手段が、平面
上の2方向に移動可能な位置決めテーブルと、複数の実
装手段に対し個別に設けられかつ前記位置決めテーブル
上に配置される複数の実装部材保持テーブルとから構成
され、前記実装部材保持テーブルの内の1つは前記位置
決めテーブル上に固定され、他の実装部材保持テーブル
は平面上の2方向に位置補正移動可能となっていること
を特徴とする電子部品実装装置。(1) a component supply section, a mounting member positioning means for positioning a mounting member on which a component is mounted, and a mounting means for holding a component in the component supply section and mounting it on the mounting member; An electronic component mounting apparatus comprising a component recognition means for recognizing a positional shift of the holding component, a positioning table in which a plurality of mounting means are arranged in parallel, and the mounting member positioning means is movable in two directions on a plane; a plurality of mounting member holding tables provided individually for a plurality of mounting means and arranged on the positioning table; one of the mounting member holding tables is fixed on the positioning table; An electronic component mounting apparatus characterized in that the mounting member holding table is movable for position correction in two directions on a plane.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2068697A JP2786712B2 (en) | 1990-03-19 | 1990-03-19 | Electronic component mounting equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2068697A JP2786712B2 (en) | 1990-03-19 | 1990-03-19 | Electronic component mounting equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03268488A true JPH03268488A (en) | 1991-11-29 |
JP2786712B2 JP2786712B2 (en) | 1998-08-13 |
Family
ID=13381219
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2068697A Expired - Fee Related JP2786712B2 (en) | 1990-03-19 | 1990-03-19 | Electronic component mounting equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2786712B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002290098A (en) * | 2001-03-26 | 2002-10-04 | Sanyo Electric Co Ltd | Electronic component mounter |
DE102020116385B3 (en) | 2020-06-22 | 2021-09-23 | Asm Assembly Systems Gmbh & Co. Kg | Placement head with two rotor arrangements with individually actuatable handling devices, placement machine and method for the automatic placement of a component carrier |
-
1990
- 1990-03-19 JP JP2068697A patent/JP2786712B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002290098A (en) * | 2001-03-26 | 2002-10-04 | Sanyo Electric Co Ltd | Electronic component mounter |
DE102020116385B3 (en) | 2020-06-22 | 2021-09-23 | Asm Assembly Systems Gmbh & Co. Kg | Placement head with two rotor arrangements with individually actuatable handling devices, placement machine and method for the automatic placement of a component carrier |
Also Published As
Publication number | Publication date |
---|---|
JP2786712B2 (en) | 1998-08-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2009248551A (en) | Substrate position and angle correction device in screen printing machine | |
JP6572449B2 (en) | Component mounting system and component mounting method | |
JP6040255B2 (en) | Parts supply device | |
US10661401B2 (en) | Component mounted body manufacturing system and component mounted body manufacturing method | |
JPH03268488A (en) | Electronic part mounting device | |
JPH11102936A (en) | Method and equipment for supplying part | |
KR20020073274A (en) | Mounting device and component-mounting method thereof | |
JPH02234497A (en) | Method and apparatus for mounting chip-shaped electronic parts | |
JP6496913B2 (en) | Component mounting system and component mounting method | |
JP4326748B2 (en) | Parts mounting method | |
JPH0715181A (en) | Electronic component mounting device | |
JP2002290098A (en) | Electronic component mounter | |
JP6890249B2 (en) | Coating device and coating method | |
EP1051893B1 (en) | Component placement apparatus | |
JP3768044B2 (en) | Electronic component mounting device | |
JP4515165B2 (en) | Substrate transfer apparatus and substrate processing apparatus | |
JPWO2014068639A1 (en) | Parts supply device | |
JPH0236598A (en) | Packaging of electronic component | |
JPH1168393A (en) | Method of packaging electronic component | |
JP6920586B2 (en) | Component mounting device, component mounting method, and paste supply device | |
JP6924924B2 (en) | Component mounting system and component mounting method | |
JP2979612B2 (en) | Electronic component mounting machine | |
JPH0321119B2 (en) | ||
JP2001308591A (en) | Electronic part mounter and mounting method | |
JP2003273591A (en) | Method and apparatus for securing board and component packaging system |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |