JPH1168393A - Method of packaging electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of packaging an electronic component capable of accurately setting an angle of an electronic component vacuum suched by a nozzle, improving a packaging accuracy, shortening a tact time, and packaging at a high speed. SOLUTION: While an electronic component 30 of a parts feeder is vacuum suched and picked up by a lower end section of a nozzle 22, and transferred to a recognition device, the electronic component 30 is turned at a large angle and a packaging angle is set. The electronic component 30 is mounted on the substrate 3 by detecting a positioning deviation Δθ in a rotation direction of the electronic component 30 and by correcting a positioning deviation Δθ with rotation of the nozzle 22 at very small angle while transferred to the substrate 3. The setting of the packaging angle makes it possible to eliminate the positioning deviation in a horizontal rotation direction caused by a large angle rotation of the electronic component 30 and mount the electronic component 30 on the substrate 3 with an accurate positioning and at a high speed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting method for mounting an electronic component on a substrate.

[0002]

2. Description of the Related Art In an electronic component mounting apparatus, an electronic component provided in a parts feeder is vacuum-adsorbed to a lower end portion of a nozzle of a transfer head, picked up, and mounted at a coordinate position on a substrate.

When mounting electronic components on a substrate, two horizontal rotation angles are set. The first is the setting of the mounting angle (the direction of the electronic component) in the reference coordinate system. This mounting angle is generally 0 °, 90 °, 180 °, -90.
°, which is registered in the memory as a mounting program in advance. The second is misregistration correction. That is, the electronic component vacuum-adsorbed to the lower end of the nozzle of the transfer head has a displacement in the horizontal rotation direction. Therefore, the electronic component is recognized by a camera or the like, and the displacement is detected. This positional shift is corrected by driving the rotation actuator to rotate the nozzle around the axis.

Therefore, conventionally, the electronic component of the parts feeder picked up by the nozzle of the transfer head is recognized by a camera or the like, and the positional deviation Δθ in the horizontal rotation direction is detected.
The electronic component has been horizontally rotated by an angle in which the positional deviation Δθ is added to the mounting angle and mounted on the board. This displacement Δθ is generally a small angle of ± 10 ° or less.

[0005]

In the above conventional method,
For example, when the mounting angle is 90 °, the total rotation angle of the electronic component is 90 ° ± Δθ, and when the mounting angle is 180 °, it is 180 ° ± Δθ. However, displacement Δ
If the electronic component is rotated by such a large angle after detecting θ, there is a problem that a new positional shift in the horizontal rotation direction occurs and mounting accuracy is reduced.

It takes a considerable amount of time to rotate an electronic component at a large angle. However, this large-angle rotation must be performed between the time when the electronic component is displaced and the time when the electronic component is mounted on a substrate. Sufficient time must be secured from the recognition of the component displacement to the mounting on the board, which increases the tact time and reduces the mounting speed.

Accordingly, the present invention provides an electronic component mounting method capable of accurately setting the angle of an electronic component vacuum-adsorbed to a nozzle to increase mounting accuracy and shortening the tact time to enable high-speed mounting. The purpose is to provide.

[0008]

According to the electronic component mounting method of the present invention, a step of picking up the electronic components of the parts feeder by vacuum suction at the lower ends of the respective nozzles of a plurality of transfer heads, and a moving table On the way to transfer the electronic components to the recognition device, drive the θ rotation actuators provided independently for each transfer head in accordance with the mounting program data to move each nozzle to its center axis. Setting the mounting angle of the electronic component by rotating the electronic component, recognizing each electronic component with the recognition device and detecting the positional deviation in the horizontal rotation direction, and driving the moving table to mount the electronic component. By driving the θ rotation actuator during the transfer to the mounting position of the substrate, each nozzle is moved around its central axis. The method includes a step of correcting the displacement by rotating the nozzle, and a step of mounting the electronic component on the substrate by causing each nozzle to perform a descending / elevating operation.

According to this configuration, while the plurality of transfer heads picking up the electronic components of the parts feeder move to the recognition device, the respective nozzles are rotated to 90 degrees.
And a mounting angle of 180 ° are set. Then, after that, the recognition device detects the displacement of the electronic component and corrects the displacement during the transfer to the mounting position of the board,
Since the correction of the displacement is generally a small angle of ± 10 ° or less, the displacement caused by the rotation of the small angle is extremely small and can be neglected sufficiently. It can be mounted on a board with mounting position accuracy.

Since the setting of the mounting angle of the electronic component is performed before the positional deviation is detected by the recognition device,
After recognizing the position shift, the electronic component may be rotated by an angle (small angle) for correcting the position shift. Therefore, the tact time of mounting is substantially reduced due to the time required for setting the angle in the rotation direction of the electronic component. The electronic component can be mounted on the substrate at a high speed without lengthening.

[0011]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a plan view of the same, FIG. 3 is a perspective view of the head unit and a recognition device, and FIG. It is.

In FIGS. 1 and 2, a guide rail 2 is provided at the center of a base 1, and a substrate 3 is positioned on the guide rail 2. A large number of parts feeders 4 are arranged on both sides of the guide rail 2. The parts feeder 4 includes electronic components mounted on the substrate 3. A recognition device 13 is provided between the guide rail 2 and the parts feeder 4.

A Y table 5 is erected on the base 1, and an X table 6 is erected on the Y table 5. As shown in FIG.
And a motor 8 for rotating the feed screw 7.
The X table 6 also has a built-in feed screw 9 and a motor 10 for rotating the feed screw 9. In FIG. 1, a head unit 20 is mounted on the lower surface of the X table 6, and when the motors 8 and 10 are driven, the head unit 20 is moved in the X direction and Y direction.
Move horizontally in the direction. 12 is a guide rail in the Y direction. That is, the X table 6 and the Y table 5 are moving tables for moving the head unit 20 in the horizontal direction.

Next, the recognition device 13 and the head unit 20 will be described with reference to FIG. The recognition device 13 includes a cover case 14, a half mirror 15 built in the cover case 14, an optical element 16 provided below the half mirror 15, and a camera 17 provided beside the half mirror 15. ing. Further, light sources 18 are provided on both sides of the cover case 14. A slit 19 is formed in the upper surface of the cover case 14.
Through 9, the electronic component is recognized by the optical element 16 and the camera 17.

A plurality of head units 20 (three in this embodiment)
Transfer head 21 is provided. Each transfer head 21
Is a vertical nozzle 22, a motor 23 and a belt 24 which are independent from each other as θ rotation means for rotating the nozzle 22 about its axis, a feed screw 25 for causing the nozzle 22 to perform up and down operations, and a nut. 26 and a motor 27. Motor 27 serving as θ rotation actuator
Is driven to rotate the feed screw 25, the nut 26 moves up and down along the feed screw 25, and the nozzle 22 connected to the nut 26 also moves up and down. A back plate 28 for electronic component recognition is mounted below the nozzle 22. 3
Reference numeral 0 denotes an electronic component held at the lower end of the nozzle 22 by vacuum suction.

This electronic component mounting apparatus is configured as described above, and the operation will be described next. 1 and 2, when the X table 6 and the Y table 5 are driven, the head unit 20 moves above the parts feeder 4, where the nozzles 22 of the transfer heads 21 move up and down, thereby The nozzle 22 picks up the electronic component 30 provided in the parts feeder 4 by vacuum-sucking the electronic component 30 at its lower end, respectively.

Next, when the X table 6 and the Y table 5 are driven, the head unit 20 moves above the recognition device 13. During this movement, the motors 23 of the transfer heads 21 are driven. The mounting angle of the electronic component 30 is set by rotating each nozzle 22 by a large angle about its axis. The setting of the mounting angle is performed according to mounting program data registered in a memory (not shown) in advance. 4A shows the electronic component 30 immediately after the pickup, and FIG. 4B shows the electronic component 30 after the mounting angle is set. Note that the setting angle of the mounting angle in this example is 90 °, and thus the electronic component 30
As described above, when is rotated by a large angle, the electronic component 30 is likely to be displaced in the rotational direction.

When the head unit 20 has moved above the recognition device 13, the electronic components 30 which are vacuum-adsorbed to the nozzles 22 are recognized, and the positional deviation Δ in the horizontal rotation direction is recognized.
θ (FIG. 4C) is detected. This Δθ is generally ±
It is a small angle of 10 ° or less. Next, the head unit 20 is mounted on the substrate 3
During this movement, each motor 23 is driven to rotate each nozzle 22 around its axis, thereby correcting the positional deviation Δθ (FIG. 4).
(D)). Next, each nozzle 22 moves above a predetermined coordinate position on the substrate 3, and drives a motor 27 there to cause each nozzle 22 to perform a descending / elevating operation, and release the vacuum suction state of the electronic component 30. Electronic components 3
0 is mounted on the substrate 3 (FIG. 4E).

[0019]

According to the present invention, after picking up the electronic parts of the parts feeder with the nozzles of the plurality of transfer heads, the electronic parts are rotated by a large angle before the electronic parts are recognized, and the mounting angle is set. Since the electronic components are recognized and minute displacements in the rotation direction are detected, and each nozzle is rotated by a small angle to correct this displacement and is mounted on the board, the mounting angle is set. The electronic component can be mounted on the board with high positional accuracy without being affected by the displacement in the horizontal rotation direction caused by rotating the electronic component by a large angle.

Further, the mounting angle of the electronic component is set in the course of picking up the electronic component of the parts feeder and transferring it to the recognition device, and after detecting the positional deviation, the electronic component is rotated by a minute angle for correcting the positional deviation. Therefore, it is possible to prevent the tact time from being lengthened due to the setting of the rotation angle of the electronic component, and to mount the electronic component on the board at high speed with good workability.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of the electronic component mounting apparatus according to the embodiment of the present invention;

FIG. 3 is a perspective view of a head unit and a recognition device of the electronic component mounting apparatus according to one embodiment of the present invention;

FIG. 4 is a mounting process diagram of an electronic component of the electronic component mounting apparatus according to one embodiment of the present invention;

[Description of Signs] 3 Substrate 4 Parts Feeder 5 Y Table 6 X Table 13 Recognition Device 21 Transfer Head 22 Nozzle 30 Electronic Component

Claims (1)

[Claims] 1. A step of picking up and picking up electronic parts of a parts feeder at a lower end portion of each nozzle of a plurality of transfer heads, and a step of driving a moving table to transfer the electronic parts to a recognition device. In accordance with the mounting program data, the mounting angle of the electronic component is set by driving the θ-rotating actuator independently provided for each transfer head and rotating each nozzle around its central axis. Performing a step of recognizing each electronic component with a recognition device and detecting a positional shift in the horizontal rotation direction, and driving the moving table to transfer the electronic component to the mounting position of the substrate, thereby performing the θ rotation. A process for correcting the displacement by rotating each nozzle about its central axis by driving an actuator. And mounting the electronic component on a substrate by causing each nozzle to perform a descending / elevating operation.