JPH09186193A - Method and apparatus for mounting electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the mounting direction of a component which makes it possible to shorten a cycle time. SOLUTION: The method for mounting an electronic component comprises the steps of supplying a TCP(tape carrier package) to an index unit 1, detecting the attitude of the TCP in the rotating direction before the TCP supplied to the unit is conveyed to a mounting position 13, correcting the attitude of a liquid crystal cell in the rotating direction before the TCP is conveyed to the mounting position in response to the detection signal of the previous step, detecting the deviation of the TCP and cell at the position in a horizontal direction, controlling the position of a board in the horizontal direction in response to the signal of the previous step, and mounting the TCP on the board controlled at the position in the horizontal direction.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting method and apparatus for positioning and mounting electronic components on a substrate with high accuracy.

[0002]

2. Description of the Related Art For example, in a manufacturing process of a liquid crystal display device, there is a process of mounting a TCP (Tape Carrier Package) as an electronic component on a glass substrate constituting a liquid crystal cell. In this mounting step, the TCP lead is attached to the lead made of the transparent conductive film formed on the glass substrate.
Are electrically connected through the anisotropic conductive film. Since both of these leads are formed with a narrow pitch, it may be necessary to position them both with high accuracy.

On the other hand, an index unit is used to mount the TCP on the glass substrate at high speed. This index unit has an index board that is intermittently rotated by a predetermined angle, for example, 90 degrees, and suction heads are provided at intervals of 90 degrees in the circumferential direction on the index board.

In the circumferential direction of the index board, there are provided a supply position for supplying TCP to the suction head, and a mounting position for mounting the electronic components supplied to the suction head on the glass substrate at this supply position.

At the mounting position, there is provided a stage for controlling the posture of the substrate in the rotation direction (θ) and the horizontal direction (X, Y), and the TCP transferred to this mounting position. An image pickup camera for picking up an image of the glass substrate held on the stage is provided.

Before the TCP is mounted at the mounting position, the TCP and the liquid crystal cell are imaged by the image pickup camera, and based on the image pickup signal, the TCP lead and the liquid crystal cell lead are first detected. Correct the deviation in the θ direction.
If the correction in the θ direction is completed, the shift amount in the XY direction is detected, the shift in the XY direction is corrected by the detection signal, and then the TCP is mounted on the glass substrate via the anisotropic conductive film. I am trying.

However, when the TCP is mounted on the glass substrate in this manner, θ is corrected after the TCP is conveyed to the mounting position, and then XY correction is performed. Therefore, at the mounting position, since it is necessary to perform two corrections, θ correction and XY correction, before mounting the TCP on the glass substrate, it takes time from the time when the TCP is transported to the mounting position until the mounting. There was an occasion. That is, the cycle time for mounting one TCP may be long.

[0008]

As described above, in the prior art, the positioning correction in the rotational direction of the electronic component at the mounting position,
Since the horizontal positioning correction is sequentially performed, the cycle time from the supply of the electronic components to the index unit to the mounting of the electronic components may be long.

The present invention has been made based on the above circumstances, and an object of the invention is to mount an electronic component such that the cycle time from supplying the electronic component to the index unit to mounting it on the substrate can be shortened. A method and an apparatus therefor are provided.

[0010]

According to a first aspect of the present invention, there is provided a mounting method for mounting an electronic component on a substrate using an index unit, the first step of supplying the electronic component to the index unit, and the index unit. A second step of detecting the rotational orientation of the electronic component before the electronic component supplied to the electronic component is conveyed to the mounting position; and the electronic component is set to the mounting position in response to a detection signal from the second step. A third step of correcting the rotational orientation of the board before being transported, a fourth step of detecting a horizontal shift amount between the electronic component and the board at the mounting position, and a fourth step. A fifth step of correcting the horizontal position of the board according to a detection signal of the step and a sixth step of mounting the electronic component on the board of which the horizontal position has been corrected. Characterized in that Bei was.

According to a second aspect of the present invention, in an electronic component mounting apparatus for mounting an electronic component on a substrate, an index unit to which the electronic component is supplied and the substrate at a mounting position where the electronic component is mounted on the substrate are provided. A stage for holding the substrate and controlling the position of the substrate in the rotation direction and the horizontal direction, a first image pickup means for picking up an image of the electronic component supplied to the index unit before being conveyed to the mounting position, Second image capturing the relative position of the board and the electronic component at the mounting position
Image pickup means and the image pickup signal of the first image pickup means to drive the stage to correct the posture of the substrate in the rotating direction before the electronic component is conveyed to the mounting position. And a control means for correcting the horizontal position of the substrate according to the image pickup signal of the image pickup means.

According to the first and second aspects of the present invention, while the electronic component is being conveyed to the mounting position, the posture of the board is corrected according to the deviation of the rotation direction of the electronic component, and the electronic component is mounted at the mounting position. The horizontal deviation between the substrate and the substrate is corrected.

Therefore, the correction of the deviation in the rotation direction of the electronic component is performed during the transportation, and only the horizontal correction is performed at the mounting position, so that the electronic component is supplied from the index unit to the mounting. The cycle time can be shortened by the time required to correct the rotation direction.

[0014]

An embodiment of the present invention will be described below with reference to the drawings. 1 and 2 show a schematic structure of a mounting apparatus of the present invention, in which 1 is an index unit. This index unit 1 is an index board 2
A drive shaft 3 is provided at the center of the index board 2 with its axis perpendicular. The drive shaft 3 is connected to a drive source 4 so as to intermittently rotate the index board 2 by 90 degrees in a clockwise direction shown by an arrow in FIG.

On the peripheral portion of the index board 2, four suction heads 5 are provided at intervals of 90 degrees in the circumferential direction with their axes perpendicular to each other. That is, four holders 6 are provided in the peripheral portion of the index board 2 at intervals of 90 degrees in the circumferential direction so as to partially project radially outward from the outer peripheral surface of the index board 2.

The adsorption head 5 is provided on the vertical surface of each holder 6 projecting outward in the radial direction of the index board 2 so as to be vertically slidable by a linear guide (not shown). The suction head 5 is vertically driven by a Z drive cylinder 7. Further, each suction head 5 is formed with a suction hole (not shown) opened on the lower end surface, and a suction force can be generated in this suction hole by a suction pump (not shown).

As shown in FIG. 1, a supply position 11, a first imaging position 12, and a mounting position 13 are sequentially provided in the circumferential direction of the index board 2 at intervals of 90 degrees in the circumferential direction. 2 in the supply position 11
Two punching units 21 are provided. Each punching unit 21 is provided with a supply reel 22 around which a carrier tape T is wound, and a take-up reel 23 around which the carrier tape T is wound up. The carrier tape T derived from the supply reel 22 is guided to the mold unit 24, where the TCP 25 as an electronic component is punched out from the carrier tape T. Carrier tape T and TCP
25 is shown in FIG.

As shown in FIG. 4, the mold unit 24 has a base 24a, and a pedestal 24b is erected on one end side in the longitudinal direction of the base 24a. An upper mold 25 is vertically movable by a first cylinder 25a on the pedestal 24b, and a lower mold 26 is slid on a rail 24c laid along the longitudinal direction of the base 24a. It is provided freely. This lower mold 26 is based on the base 2 described above.
It is adapted to be driven along the rail 24c by a rod-type second cylinder 26a provided on the lower surface side of 4a.

The carrier tape T is supplied onto the lower mold 26 as shown by a chain line in FIG. In this state, the upper die 25 is driven in the descending direction and the TCP 25 is punched out from the tape carrier T. After punching, TC
The lower die 26 holding P25 is conveyed and driven by the second cylinder 26a to the delivery position A near the supply position 1.

As shown in FIG. 1, a base 27a of a transfer mechanism is provided between the transfer positions A of the pair of punching units 21. A delivery stage 27 is provided on the base 27a so as to be driven by a drive mechanism (not shown) along the longitudinal direction of the base 27a. On the transfer stage 27, the TCP held by the lower mold 26 by the pickup nozzle 28.
25 is supplied. This pickup nozzle 28 is shown in FIG.
As shown in FIG. 3, the XY drive mechanism 30 is driven in the X and Y directions indicated by the arrows in FIG.

The transfer stage 27 can be moved from the transfer position A to the supply position 11, that is, to a position facing below the suction head 5 provided on the index board 2. Therefore, the T
When the delivery stage 27, to which the CP 25 has been delivered, moves to the supply position 11, the suction head 5 descends so that the TCP 25 can be suction-held.

When the suction head 5 sucks and holds the TCP 25, the index board 2 is rotated 90 degrees in the direction of the arrow. As a result, the suction head 5 that suction-holds the TCP 25 reaches the first imaging position 12. This first
In the image pickup position 12 of the
The imaging camera 31 of is arranged. The first image pickup camera 31 uses the TCP 2 sucked and held by the suction head 5.
5 is imaged.

The image pickup signal from the first image pickup camera 31 is input to the first image processing section 32. The image processing unit 32 calculates the rotation angle of the TCP 25 from the image pickup signal from the first image pickup camera 31 as described later. The rotation angle of the TCP 25 detected by the first image processing unit 32 is input to the control device 33 as a control means.

At the mounting position 13, the TCP2 is installed.
A stage 35 is provided on which the liquid crystal cell 34 as a substrate on which the No. 5 is mounted is supplied and mounted by a transport mechanism (not shown). The stage 35 is attached to a θ shaft 37 which is rotationally driven by a θ drive source 36.

The θ drive source 36 is attached to a Y table 39 which is driven in the Y direction by a Y drive source 38. The Y table 39 is slidably provided on the X table 40 along the X direction orthogonal to the Y direction, and is driven by the X drive source 41 along the X direction. There is.

At the mounting position 13, the first imaging position 1 is provided by intermittent rotation of the index board 2.
TCP25 transported from 2 to mounting position 13
And a second image pickup camera 42 as a second image pickup means for picking up an image of the liquid crystal cell 34 supplied and held by the stage 35. The image pickup signal from the second image pickup camera 42 is input to the second image processing unit 43, processed here, and then input to the control device 33.

The control device 33 includes the first image pickup camera 3
The θ drive source 36 is driven by a signal from the first image processing unit 32 that has processed the first image pickup signal, and the rotation angle of the stage 35 holding the liquid crystal cell 34 is controlled. That is,
The stage 35 is driven in the θ direction in accordance with the deviation of the rotation angle between the TCP 25 imaged at the first imaging position 12 and the liquid crystal cell 34 held by the stage 35, and T
The deviation between the CP 25 and the liquid crystal cell 34 in the θ direction is eliminated. Therefore, the TCP 25 is imaged at the first imaging position 12 and then mounted at the mounting position 13.
The correction in the θ direction will be made by the time the paper is transported to.

Further, the control device 33 uses the second image pickup camera 42 which simultaneously picks up the image of the TCP 25 and the liquid crystal cell 34.
Correction is performed in the XY directions, which are the horizontal directions, by the image pickup signal from. That is, when the θ25-corrected TCP 25 reaches the mounting position 13, the TCP 25 and the liquid crystal cell 3
XY based on the imaging signals obtained by simultaneously imaging 4 and
A displacement amount in the directions is calculated, and based on the calculation result, the stage 35 is driven in the XY directions to correct the displacement in the XY directions of the liquid crystal cell 34 with respect to the TCP 25.

At the first image pickup position 12, before the first image pickup camera 31 picks up the image of the TCP 25 sucked by the suction head 5, the TCP 25 is largely deviated from the visual field range of the first image pickup camera 31. In order to prevent this, the suction position with respect to the suction head 5 is corrected by the positioning mechanism 45 shown in FIG.

The positioning mechanism 45 has a base 46. A positioning cylinder 47 is provided on the base 46 with its axis extending in the radial direction of the index board 2. A gauge block 48 is attached to the rod 47a of the cylinder 47. When the cylinder 47 operates, the gauge block 48 attached to the rod 47a presses one side of the TCP 25 suction-held by the suction head 5 located at the first imaging position 12.

As a result, the TCP 25 is positionally corrected within a predetermined range so that the suction position with respect to the suction head 5 is not largely displaced.
The image pickup camera 31 can reliably pick up an image of a predetermined portion of the TCP 25.

The first image pickup camera 31 picks up an image of the lead 25a provided with the reference mark 25b of the TCP 25 as shown in FIG. 6 (a), and the centerline C1 of the lead 25a is taken. The tilt angle θ1 with respect to the reference line L1 of the first imaging camera 31 is calculated.

On the other hand, at the mounting position 13, before mounting the TCP 25 on the liquid crystal cell 34 held by the stage 35, the lead 3 provided with the reference mark 34b thereof.
4a is imaged by the second imaging camera 42. In this embodiment, the TCP 25 is used at the first imaging position 12.
The liquid crystal cell 34 is imaged by the second imaging camera 42 in synchronism with the timing of imaging.

Then, according to the image pickup signal from the second image pickup camera 42, as shown in FIG.
Angle θ2 between the reference line L2 of the second imaging camera 42 and
That is, the tilt angle θ2 of the liquid crystal cell 34 is calculated.

The stage 35 is rotationally driven by the θ drive source 36 in accordance with the difference between the inclination angles θ1 and θ2. As a result, the TCP 25 is mounted at the mounting position 1
The rotation angle of the liquid crystal cell 34 is corrected so that the lead 34a of the liquid crystal cell 34 and the lead 25a of the TCP 25 are not tilted when the liquid crystal cell 34 is conveyed.

Next, the TC having the above-described structure is mounted on the TC.
The operation of mounting P25 on the liquid crystal cell 34 will be described. The TCP 25 punched from the carrier tape T by the mold unit 24 is held by the lower mold 26 of the mold unit 24 and conveyed to the delivery position A. At the delivery position A, the TCP 25 held by the lower die 26 is transferred to the delivery stage 27 by the pickup nozzle 28.

When the transfer stage 27 on which the TCP 25 is transferred moves to the supply position 11, the suction head 5 standing by at the supply position 11 descends to suction-hold the TCP 25.

When the suction head 5 suctions the TCP 25 and moves up, the index board 2 rotates 90 degrees and the suction head 5 is displaced to the first image pickup position 12. Here, after the suction position of the TCP 25 is corrected by the positioning mechanism 45, the image pickup signal picked up by the first image pickup camera 31 is processed by the first image processing unit 32 to calculate its tilt angle θ 1. The value is input to the control device 33.

The control unit 33 compares the tilt angle θ1 of the TCP 25 with the tilt angle θ2 of the liquid crystal cell 34 held by the stage 35, and the difference between these angles causes the above-mentioned stage angle θ1.
The rotation angle of the liquid crystal cell 34 is corrected by rotationally driving the drive circuit 35. That is, at the mounting position 13, TCP
The rotational angle of the liquid crystal cell 34 is corrected so that the leads 25a and 34a of the liquid crystal cell 34 and the liquid crystal cell 34 are not displaced in the rotational direction.

That is, the rotation angle of the liquid crystal cell 34 is corrected until the TCP 25 is intermittently driven and the TCP 25 is conveyed from the first image pickup position 12 to the mounting position 13.

When the TCP 25 is conveyed to the mounting position 13, the TCP is picked up by the second image pickup camera 42.
The images of the leads 25a and 34a to which reference marks 25b and 34b of 25 and the liquid crystal cell 34 are attached are simultaneously taken. The image pickup signal from the second image pickup camera 42 is image-processed by the second image processing section 43, so that the shift amounts of the leads 25a and 34a in the XY directions are calculated.

That is, as shown in FIG. 6C, the deviation amount dx in the X direction is calculated from the deviation of the center lines C1 and C2 of the leads 25a and 34a, and the reference mark of each lead 25a and 34a is calculated. The shift amount dy in the Y direction is calculated from the shift between the marks 25b and 34b.

X, Y calculated by the second image processing unit 43
The deviation amounts dx and dy in the directions are input to the control device 33.
Thereby, the control device 33 drives and positions the stage 35 in the XY directions so that the lead 25a of the liquid crystal cell 34 coincides with the lead 34a of the TCP 25.

When the TCP 25 and the liquid crystal cell 34 are positioned in the XY directions, the suction head 5 holding the liquid crystal cell 34 by suction is driven downward, and the TCP 25 is mounted on the liquid crystal cell 34 (temporary pressure bonding). It will be. In the portion of the liquid crystal cell 34 where the TCP 25 is mounted, as shown in FIG.
As shown by the chain line in (c), the tape-shaped anisotropic conductive film 51.
Is attached in advance. Therefore, the TCP 25 is temporarily pressure-bonded by the anisotropic conductive film 51.

According to this mounting method, TCP25
By the time the index board 2 is transported to the mounting position 13, the rotation angle of the liquid crystal cell 34 provided in the stage 27 is corrected in advance according to the deviation of the TCP 25 in the rotation direction.

Therefore, at the mounting position 13, it is only necessary to correct the position of the liquid crystal cell 34 in the X direction and the Y direction with respect to the TCP 25.
The correction time in 3 can be shortened.

That is, since the θ correction of the liquid crystal cell 34 with respect to the deviation of the TCP 25 in the rotation direction is performed during the transportation, it does not affect the cycle time for mounting the TCP 25. Therefore, after the TCP 25 reaches the mounting position 13, the liquid crystal cell 34
The cycle time for mounting the TCP 25 can be shortened as much as the correction of the rotation direction is not performed.

FIG. 7A shows the cycle time according to the mounting method of the present invention, and FIG. 7B shows the cycle time according to the conventional mounting method. In the present invention, as described above, the liquid crystal cell 3 is moved during the moving time b during which the TCP 25 is transported from the supply position 11 to the mounting position 13.
Since θ correction of 4, the total cycle time T1
Does not include the time a for θ correction,
The sum with the Y correction time c, that is, T1 = b + c.

However, in the conventional mounting method, since the θ correction and the XY correction are performed at the mounting position 13, the total cycle time T2 is T2 = a + b + c, and the time a required for the θ correction is longer than that of the present invention. become longer.

[0050]

As described above, according to the first and second aspects of the present invention, when the electronic component supplied to the index unit is conveyed to the mounting position, the electronic component responds to the shift in the rotational direction of the electronic component. The electronic component is mounted on the board by correcting the rotational orientation of the board and correcting only the horizontal deviation between the electronic part and the board at the mounting position.

That is, the correction of the board for the deviation in the rotation direction of the electronic component is performed during the transportation of the electronic component to the mounting position, and only the horizontal correction is performed at the mounting position. The cycle time from supply to
The time required to correct the deviation in the rotation direction of the substrate can be shortened compared to the conventional case.

[Brief description of the drawings]

FIG. 1 is a plan view showing the overall configuration of an embodiment of the present invention.

FIG. 2 is a side view showing a partial cross section of the index unit.

FIG. 3 is an enlarged explanatory view of a positioning mechanism provided at a first imaging position.

FIG. 4 is an explanatory view of a mold unit of the same.

FIG. 5 is a perspective view showing a carrier tape and a TCP.

6A is an explanatory diagram for calculating a shift amount of a TCP in a rotation direction at a first imaging position, and FIG. 6B is an explanatory diagram for calculating a rotation angle of a liquid crystal cell at a mounting position; FIG. 7C is an explanatory diagram for calculating the amount of deviation between the TCP and the liquid crystal cell in the XY directions.

FIG. 7 (a) is an explanatory diagram of the cycle time of the present invention,
(B) is an explanatory view of the conventional cycle time.

[Explanation of symbols]

1 ... Index unit, 13 ... Mounting position, 2
5 ... TCP (electronic component), 31 ... First imaging camera (first imaging means), liquid crystal cell (substrate), 33 ... Control device (control means), 34 ... Liquid crystal cell (substrate), 35 ... Steer
42, second imaging camera (second imaging means).

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kengo Tanaka 33, Shinisogo-cho, Isogo-ku, Yokohama, Kanagawa Prefecture

Claims (2)

[Claims] 1. A mounting method for mounting an electronic component on a substrate using an index unit, comprising: a first step of supplying the electronic component to the index unit; and transporting the electronic component supplied to the index unit to a mounting position. Before the electronic component is conveyed to the mounting position according to the detection signal of the second step. A third step of correcting the posture; a fourth step of detecting a horizontal shift amount between the electronic component and the board at the mounting position; and a horizontal direction of the board according to a detection signal of the fourth step. An electronic part comprising: a fifth step of correcting the position in the direction; and a sixth step of mounting the electronic component on the substrate whose position in the horizontal direction is corrected. How to mount the product. 2. An electronic component mounting apparatus for mounting an electronic component on a substrate, comprising: an index unit to which the electronic component is supplied; and a holding unit for holding the substrate at a mounting position where the electronic component is mounted on the substrate. A stage for controlling the rotational and horizontal positions of the board, a first image pickup means for picking up an image of the electronic component supplied to the index unit before being conveyed to the mounting position, and the board at the mounting position. A second image pickup means for picking up an image of the relative position between the electronic component and the electronic component; and the board driven by driving the stage before the electronic component is conveyed to the mounting position by the image pickup signal of the first image pickup means. Of the electronic device at the mounting position according to the image pickup signal of the second image pickup means. Mounting apparatus of electronic components, characterized by comprising a control means for correcting the horizontal position of the article.