JPH0918195A - Part mounter - Google Patents

Abstract

PURPOSE: To obtain a part mounter in which defective product due to a shift in punching position is prevented from being generated and spread. CONSTITUTION: TCP image pickup cameras 11, 12 are disposed, while directing upward, between a transfer robot 9 and a board moving stage 13. A board image pickup camera 14 is disposed on one side of X-axis 13b of board moving stage 13. The TCP image pickup cameras 11, 12 pick up the image of a positioning mark for TCP projected by means of the transfer robot 9 including the surroundings thereof. The image is transmitted to an image processing arithmetic unit 22 in order to detect punching shift of TCP 18. Feeding position shift of a board 19 is detected by transmitting positional information from the board image pickup camera 14 to the image processing arithmetic unit 22. When a positional error is detected, the board moving stage 13 is driven to correct the compressing position.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting device.

[0002]

2. Description of the Related Art Conventionally, when a component continuously provided on a carrier tape at equal intervals, for example, a tape carrier package (hereinafter, simply referred to as TCP) is supplied to a printed circuit board, the carrier is used. TCP, which is continuously supplied with the tape, is punched with a press die. The punched TCP is adsorbed by a Cartesian transport robot or the like, supplied to a predetermined position on the printed circuit board, and pressure-bonded.

[0003]

However, the conventional TC
In the P mounting device, for example, when the punched position of the TCP punched out is deviated from the specified position due to an error in the connection portion of the carrier tape, when mounted on the plant substrate, It may not be possible to connect to the pattern.

Such a plant board was detected by a visual inspection after the TCP was mounted or a circuit inspection by a tester and was removed as a defective product, but then the printed circuit board becomes useless. Therefore, the purpose of the present invention is to
An object is to obtain a component mounting apparatus capable of preventing the generation and expansion of defective products due to the displacement of the punching positions of components such as P.

[0005]

According to a first aspect of the present invention, there is provided a component mounting apparatus which conveys a component punched from a carrier tape which is circulated at a predetermined pitch and stopped at a predetermined position to a predetermined position. A carrier device, an imaging device that images a component carried by the carrier device, and outputs an imaging signal including a position reference part and an outline of the component, and an imaging signal of the component is input from the imaging device and input in advance. An image processing calculation unit that compares the reference dimension information of the component and calculates and outputs the punching error of the component.

A component mounting apparatus according to a second aspect of the present invention is a component mounting apparatus that transports a component punched from a carrier tape that is circulated at a predetermined pitch and stopped at a predetermined position to a predetermined position. An image pickup device that picks up an image of the part conveyed by this conveyer device and outputs an image pickup signal including the position reference part and the outline of the part, and the reference dimensions of the part that the image pickup signal of the part is input from this image pickup device. An image processing arithmetic unit for comparing the information with each other to calculate and output the punching error of the component, and a tape drive device for correcting the stop position of the carrier tape when the punching error signal of the component is input from the image processing arithmetic unit Is characterized by.

Further, in the component mounting apparatus according to the third aspect of the invention, the component punched out from the carrier tape which is circulated at a predetermined pitch by the transport driving unit and stopped at a predetermined position is transported to a predetermined position. A transport device, a first imaging device that images a component transported by the transport device, and outputs an imaging signal including a position reference portion and an outline of the component, and a component that is supplied to a predetermined position and is mounted by the transport device. A second image pickup device that outputs an image pickup signal including a position reference portion of the printed circuit board, an image pickup signal of a component is input from the first image pickup device, and an image pickup signal of the board is input from the second image pickup device. Comparing the reference dimension information of the input component with the image signal of the component, calculating the punching error of the component, comparing the reference image signal of the substrate and the image signal input in advance, and conveying the position correction signal of the substrate. Department Characterized by comprising an image processing arithmetic unit for outputting.

[0008]

According to the first aspect of the present invention, if the punching position of the punched component is different from the predetermined position, it is obtained from the punching reference dimensions and the image pickup signal in the image processing arithmetic unit. The punching error is calculated from the calculation result with the punching dimension.

Further, in the invention according to claim 2,
If the punching position of the punched part is different from the predetermined position, the punching error is calculated from the calculation result of the punching reference dimension in the image processing calculation section and the punching dimension obtained from the image pickup signal. The component to be punched next is punched to a standard size by a driving device which receives a punching error signal and corrects the stop position of the carrier tape.

Further, in the third aspect of the present invention, if the punching position of the punched component and the position of the supplied substrate are different from the predetermined position, the punching in the image processing arithmetic unit is performed. The punching error is calculated from the calculation result of the reference dimension and the allowable value and the punching dimension obtained from the first image pickup device, and is obtained from the reference position of the substrate in the image treatment calculation unit and the second image pickup device. The position error of the substrate is calculated from the calculation result with the position signal of the substrate, and the supply position of the substrate is corrected by the transport driving unit to which the position correction signal is input from the image processing calculation unit.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the component mounting apparatus of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view showing a TCP mounting device as an example of the component mounting device of the present invention. Further, FIG. 2 shows an AA arrow diagram of FIG. In addition,
In FIG. 1, the right side of the component mounting apparatus is the front side, but this space is shown as in FIG.

1 and 2, at the front end on the left side,
A sprocket wheel 1 that is rotationally driven by the pulse motor 1a is provided, and the rotation angle of the pulse motor 1a is controlled by a separate drive controller 3.

On the right side of the sprocket wheel 1, a slide table 8 described later is provided in the front-rear direction in FIG. On the right side of the slide table 8, a tension-added sprocket wheel 2 that is rotationally driven by a pulse motor 2a is symmetrically provided. On the upper surfaces of these sprocket wheels 1 and 2, the pattern surface faces downward and the left side. To the right from arrow B1, B2. As shown in B3, both sides of the circulated film carrier tape 17 are in mesh with each other.

The lower die 3 is placed on the upper surface of the front end of the slide table 8. Four guide rods 5 are erected around the lower die 3, and the upper ends of these guide rods 5 penetrate the upper die 4 installed above the lower die 3.

Above the upper die 4, a pneumatic cylinder 6 is hung vertically downward with respect to the lower surface of the support base 7, and the lower end of the pneumatic cylinder 6 is centered on the upper end of the upper die 4. The upper die 4 is connected via a flange, and as a result, the upper die 4 is supported by the pneumatic cylinder 6.

At the rear portion of the slide table 8, the lower mold 3 conveyed from the front end by the slide table 8 in the process described later and the TCP 18 adsorbed to the lower mold 3 are both shown by a dashed line.

Behind the slide table 8, a rectangular coordinate type transfer robot 9 is installed. The transport robot 9 includes a biaxial drive unit 9b provided in a direction orthogonal to a uniaxial drive unit 9a installed in the left and right direction at a rear end, and a right side of a front end of the biaxial drive unit 9b orthogonal to the plane of the drawing. A three-axis driving unit (not shown) that is driven in the direction, and four θ-axis shafts provided at the lower end of the three-axis driving unit. Of these, a TCP mounting head 10 that operates by air pressure is attached to the lower end of the θ axis.

On the right side of the transfer robot 9, the Y-axis 13a and X
A substrate moving stage 13 having an axis 13b and a θ axis with respect to the X axis 13b is installed. This substrate moving stage 13
A substrate stage 15 is mounted on the θ-axis of the substrate, and suction holes 16 are provided in six rows in two lines on the upper surface of the substrate stage 15. On the substrate stage 15, the substrate 19 which is transferred to the upper surface of the substrate stage 15 and is sucked by the suction holes as described later is shown by a chain line.

A substrate positioning mark 20 is formed in advance on the rear side of the left end of the substrate 19, and a substrate positioning mark 21 is symmetrically formed on the front side of the left end. The TCP 18 to be mounted on the substrate 19 is shown on the left side of the substrate 19 by a one-dot chain line through the steps described below.

Above the front left side of the board 19, a board imaging camera 14 is attached downward. Above the left side of the substrate 19, TCP image pickup cameras 11 and 12 for picking up an image of the punching position of the TCP 18 are provided in the front and rear, and above the TCP image pickup cameras 11 and 12, the transfer robot described above is provided. The TCP 18 that is projected to a predetermined position by the mounting head 10 at the tip of 9 and is imaged is shown by a dashed line.

Further, an image processing / arithmetic unit 22 is installed behind the TCP image pickup cameras 11 and 12, and an input signal line of the image processing / arithmetic unit 22 is a TCP image pickup camera.
The output signal lines of the image processing operation unit 22 are connected to the drive controller 23 and the control unit (not shown) of the substrate moving stage 13.

FIG. 3 is a plan view of the TCP 18. A positioning mark 25 is formed in advance on the right side of a plurality of continuous leads 35, and a positioning mark is also formed on the left side of the lead 35.
26 are formed symmetrically. The ranges 27 and 28 indicate the fields of view captured by the TCP image capturing camera 11 shown in FIG. 1, respectively.

FIGS. 4A and 4B are views 27 and 28 of the TCP image pickup camera 11 shown in FIG. 3 and this view 2
Positioning marks 25 and 26 and TCP1 captured in 7 and 28
9 is an enlarged detailed view showing a part of FIG.

Among them, in FIG. 4A, reference numeral 30 which is shown by an L-shaped one-dot chain line shows the position of the outline line near the positioning mark 26 when the TCP 18 is punched at the specified position. On the other hand, the reference numeral 32 shown in the L-shape with a solid line is an example of the outline of the image captured by the TCP imaging camera 12 of the TCP 18 that is punched out from the specified position in the left direction in FIG. 4A. Show. Reference numeral 34 indicates the center of the positioning mark 26. The dimensions XL, YL, YLO will be described later.

Similarly, in FIG. 4 (b), reference numeral 29, which is indicated by an alternate long and short dash line in an inverted L-shape, indicates the outline of the TCP 18 in the vicinity of the positioning mark 25 when the TCP 18 is punched at a specified position, and is shown by a solid line. The reference numeral 31 shown in an inverted L-shape indicates an example of the outline of the TCP 18 of the image picked up by the TCP image pickup camera 11. Further, reference numeral 33 indicates the center of the positioning mark 25. Also, YR, XR, and YRO will be described later.

Next, the operation of the TCP mounting device configured as described above will be described. In FIGS. 1 and 2, a carrier tape 17 supplied from a drum (not shown) as indicated by an arrow B1 in FIG. 2 is for tape feeding driven by a pulse motor 1a at a predetermined pitch and stopped at a predetermined rotation angle. The sprocket wheel 1 and the sprocket wheel 2 for tensioning allow the sprocket wheel 1 to be positioned at a predetermined punching position.

On the other hand, the upper die 4 punches out the TCP 18 when the pneumatic cylinder 6 is actuated by a general controller (not shown) and is guided by the guide rod 5 to descend. The punched TCP 18 is adsorbed to the lower die 3 and is transported by the slide table 8 to the lower position of the mounting head 10 of the transport robot 9 together with the lower die 3.

Then, the TCP 18 is adsorbed by the tip of the TCP mounting head 10 of the transfer robot 9 driven by the robot controller in accordance with a signal from the general controller, and is projected to a position below the TCP image pickup cameras 11 and 12. As shown in FIG.
Positioning marks 2 on the left and right as shown in (a) and (b)
The images of 5, 26 and the surroundings of these positioning marks 25, 26 are imaged.

On the other hand, while the TCP 18 is being imaged, the substrate 19 is placed on the substrate stage 15 by a transfer mechanism (not shown), and the substrate is moved by the substrate moving stage 13 while being sucked and fixed by the suction holes 16. 19 is moved so that the left and right board positioning marks 20 are positioned below the board imaging camera 14.

The image of the board positioning mark 20 taken by the image processing / calculation unit 22 is the amount of positional deviation (ΔR) from the reference position (XR, YR) of the board positioning mark 20 on one side.
XR, ΔYR) is calculated.

Similarly, the positional deviation amount (ΔXL, ΔYL) from the reference position (XL, YL) of the board positioning mark 21 on the other side is calculated, and the difference between these reference positions XR, YR, XL, YL is calculated. Is the amount of displacement of the substrate 19 from the reference position (ΔXc, ΔYc, Δθ
c) is calculated, and this positional deviation amount (ΔXc, ΔYc, Δθc
The position of the substrate 19 is corrected by the substrate stage 15 based on

On the other hand, by the image processing / arithmetic unit 22 to which the image signal is input from the TCP image pickup camera 11, the amount of displacement of the TCP positioning mark 25 shown in FIGS. 3 and 4 (b) from the reference position (ΔXR, ΔYR) is calculated.

Similarly, when an image signal is input from the TCP image pickup camera 12, the image processing / calculation unit 22 causes the TC
Amount of displacement of the P positioning mark 26 from the reference position (ΔXL,
ΔYL) is calculated, and these positional displacement amounts (ΔXR, ΔYR,
A displacement amount (ΔXc, ΔYc, Δθc) from the reference position of the TCP 18 is calculated from ΔXL, ΔYL).

When an image signal is input from the TCP image pickup camera 11, the image processing / arithmetic unit 22 operates as shown in FIG.
The center 33 and T of the positioning mark 25 of the TCP 18 shown in (b)
The dimension (XR, YR) between the contour line 31 of CP18 is calculated.

Similarly, when an image signal is input from the TCP image pickup camera 12, the image processing / arithmetic unit 22 operates as shown in FIG.
The center of the positioning mark 26 of the TCP 18 shown in FIG.
The dimension (XL, YL) between the contour line 32 of P18 is calculated.

If these dimensions (XR, YR, XL, YL)
If all are within the tolerance range of the error preset in the image processing / arithmetic unit 22, the TCP
The position of the substrate 19 is corrected by driving the substrate stage 15 based on the position displacement amount (ΔXc, ΔYc, Δθc) of the TCP 18,
Is mounted on the substrate 19 at a predetermined position. Conversely, the dimensions (XR, Y
If any of (R, XL, YL) is out of the allowable error range, the TCP 18 is stored in the TCP discharge box (not shown) that stores the defective product.

Further, the positioning mark 25 shown in FIG. 4 (b) preset in the image processing / arithmetic unit and the dimension YRO in the Y direction of the outer contour line 29 of the TCP 18 punched at the specified position, and FIG. The difference ΔYRO, ΔYLO between the dimension YLO of the positioning mark 26 shown in a) and the dimension YLO of the outer contour line 30 of the TCP 18 punched at the specified position in the Y direction and the dimensions TR, YL are
It is calculated by the image processing / arithmetic unit 22.

A signal indicating the correction amount of the positioning position of the carrier tape 17 based on these differences ΔYRO and ΔYLO is output from the image processing / arithmetic unit 22 to the drive controller 23 for controlling the sprocket wheel 1 and subsequently punched out. The punching position of the carrier tape 17 with respect to (that is, the stop angle of the pulse motors 1a and 2a) is corrected.

In the above embodiment, when the deviation of the punching position of the TCP 18 is within the allowable range, the substrate moving stage 13 is driven to correct the mounting position of the TCP 18, but the transfer robot 9 is explained. May be driven to correct the position of the TCP mounting head 10.

[0040]

As described above, according to the component mounting apparatus of the invention described in claim 1, the component punched from the carrier tape which is circulated at a predetermined pitch and stopped at a predetermined position is conveyed to a predetermined position. A carrier device, an imaging device that images a component carried by the carrier device, and outputs an imaging signal including a position reference part and an outline of the component, and an imaging signal of the component is input from the imaging device and input in advance. By including an image processing calculation unit that calculates and outputs the punching error of the component by comparing it with the reference dimension information of the component, if the punching position of the punched component is different from the predetermined position, The punching error is calculated from the calculation result of the punching reference dimension in the image processing calculation section and the punching dimension obtained from the image pickup signal, and the abnormality can be recognized from the output result. It can be obtained component mounting apparatus capable of preventing the occurrence of defective products due to the positional deviation of and expansion.

Further, according to the component mounting apparatus of the present invention as defined in claim 2, a transport device for transporting a component punched from a carrier tape which is circulated at a predetermined pitch and stopped at a predetermined position to a predetermined position. And an image pickup device that outputs an image pickup signal including a position reference portion and an outline of the part conveyed by this conveyance device, and an image pickup signal of the part input from this image pickup device An image processing arithmetic unit for calculating and outputting the punching error of the component by comparing it with the reference dimension information, and a tape drive device for correcting the stopping position of the carrier tape when the punching error signal of the component is input from the image processing arithmetic unit Therefore, if the punching position of the punched part is different from the predetermined position, the punching reference size and the punching size obtained from the image pickup signal in the image processing calculation unit are used. The punching error is calculated from the calculation result, and the component to be punched next is punched to the reference size by the drive device that receives the punching error signal and corrects the stop position of the carrier tape. It is possible to obtain a component mounting device that can prevent the generation and expansion of defective products.

Further, according to the component mounting apparatus of the third aspect of the invention, the component punched out from the carrier tape which is circulated at a predetermined pitch and stopped at a predetermined position by the transport driving unit is moved to a predetermined position. A carrying device for carrying, and a first imaging device for taking an image of a part carried by the carrying device and outputting an image pickup signal including a position reference part and an outline of the part,
A second image pickup device which outputs an image pickup signal including a position reference portion of a substrate which is supplied to a predetermined position and on which a component is mounted by a transfer device, and an image pickup signal of the component which is input from the first image pickup device An image pickup signal of the board is input from the image pickup device, the reference dimension information of the part input in advance is compared with the image pickup signal of the part, the punching error of the part is calculated, and the reference image signal of the board and the image pickup signal input in advance. And an image processing arithmetic unit that outputs a substrate position correction signal to the transport drive unit, so that the punching position of the punched component and the position of the supplied substrate are different from the predetermined position. In this case, the punching error is calculated from the calculation result of the punching reference dimension and the allowable value in the image processing calculation section and the punching dimension obtained from the first image pickup device, and the board in the image treatment calculation section is calculated. Standard position And the position error of the substrate is calculated from the calculation result of the position signal of the substrate obtained from the second image pickup device, and the supply position of the substrate is corrected by the transport driving unit to which the position correction signal is input from the image processing calculation unit. Therefore, it is possible to obtain the component mounting apparatus capable of preventing the generation and expansion of the defective product due to the displacement of the punching position of the component.

[Brief description of the drawings]

FIG. 1 is a plan view showing an embodiment of a component mounting apparatus of the present invention.

FIG. 2 is a view taken in the direction of arrows AA in FIG. 1;

FIG. 3 is a target T to be mounted by the component mounting apparatus of the present invention.
The expanded top view which shows an example of CP.

FIG. 4A is a partially enlarged explanatory view showing the operation of the component mounting apparatus of the present invention. (B) is a partial enlarged explanatory view different from (a) which shows the effect | action of the component mounting apparatus of this invention.

[Explanation of symbols]

1, 2 ... sprocket wheel, 3 ... lower mold, 4 ... upper mold,
5 ... Guide rod, 6 ... Pneumatic cylinder, 7 ... Support base, 8 ...
Slide table, 9 ... Transport robot, 10 ... TCP mounting head, 11, 12 ... TCP imaging camera, 13 ... Substrate moving stage, 14 ... Substrate imaging camera, 15 ... Substrate stage, 16 ... Adsorption hole, 17 ... Film carrier, 18 ... TCP (tape carrier package), 19 ... Substrate, 20, 21 ... Substrate positioning mark, 22 ... Image processing / arithmetic unit, 23 ... Drive controller, 25, 26 ... Positioning mark, 27, 28 ... Field of view, 2
9, 30, 31, 32… Outer line, 33,34… Center of positioning mark.

Claims (3)

[Claims] 1. A transport device for transporting a component punched from a carrier tape which is circulated at a predetermined pitch and stopped at a predetermined position to a predetermined position, and an image of the component transported by the transport device, An image pickup device that outputs an image pickup signal including a position reference portion and an outline of this part, and the image pickup signal of the part is input from the image pickup device, and the reference dimension information of the part that has been input in advance is compared to obtain the part. A component mounting apparatus including an image processing calculation unit that calculates and outputs the punching error of the. 2. A carrier device for carrying a part punched from a carrier tape which is circulated at a predetermined pitch and stopped at a predetermined position to a predetermined position, and an image of the part carried by the carrier device, An image pickup device that outputs an image pickup signal including a position reference part and an outline of this part, and an image pickup signal of the part is input from this image pickup device, and the reference dimension information of the part that has been input in advance is compared to compare the part A component mounting apparatus comprising: an image processing calculation unit that calculates and outputs a punching error; and a tape drive device that receives a punching error signal of the component from the image processing calculation unit and corrects the stop position of the carrier tape. 3. A transport device for transporting a component punched from a carrier tape, which is circulated at a predetermined pitch and stopped at a predetermined position by a transport drive unit, to a predetermined position, and the component transported by the transport device. A first image pickup device that picks up an image and outputs an image pickup signal including a position reference part of this part and an outline, and an image pickup that includes a position reference part of a board that is supplied to a predetermined position and on which the part is mounted by the transfer device. A second image pickup device that outputs a signal, and an image pickup signal of the component are input from the first image pickup device, and an image pickup signal of the substrate is input from the second image pickup device. Comparing the reference dimension information with the image pickup signal of the component, calculating the punching error of the component, comparing the reference image signal of the substrate input in advance with the image pickup signal, and calculating the position correction signal of the substrate A component mounting apparatus having an image processing calculation unit for outputting to a conveyance drive unit.