JPH0653694A - Electronic component mounting machine - Google Patents
Electronic component mounting machineInfo
- Publication number
- JPH0653694A JPH0653694A JP4220606A JP22060692A JPH0653694A JP H0653694 A JPH0653694 A JP H0653694A JP 4220606 A JP4220606 A JP 4220606A JP 22060692 A JP22060692 A JP 22060692A JP H0653694 A JPH0653694 A JP H0653694A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- mounting
- coordinate measuring
- dimensional information
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、基板上に電子部品を実
装する電子部品実装機に係り、特に実装と同時に実装の
確認を行なうことのできる電子部品実装機に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounter for mounting electronic components on a board, and more particularly to an electronic component mounter capable of confirming mounting simultaneously with mounting.
【０００２】[0002]
【従来の技術】電子部品実装機により基板上に電子部品
を実装したとき、従来は、電子部品をリフローはんだま
たは接着剤で基板に取り付け、硬化後検査機などの別装
置で実装状態の確認を行なっていた。2. Description of the Related Art Conventionally, when an electronic component is mounted on a board by an electronic component mounter, the electronic component is conventionally attached to the board by reflow soldering or an adhesive, and after mounting, the mounting state is confirmed by another device such as an inspection machine. I was doing.
【０００３】また、装着ノズルにより真空力で電子部品
を吸着したとき、その吸着位置は必ずしも部品の中心と
は限らず、また電子部品の角度も実装機のＸＹ座標軸か
らずれていることが一般的である。この電子部品の吸着
状態を検査するために、従来は複数台のカメラを用いて
電子部品を撮像し、取り込んだ画像の輝度情報から中心
や座標軸に対するずれを計算し、補正を行なっていた。
またはレーザスポット光を用いた３次元測長器により部
品の一部を測長し、その３次元情報から補正計算を行な
っていた。In addition, when an electronic component is sucked by a mounting nozzle by a vacuum force, the suction position is not always the center of the component, and the angle of the electronic component is generally deviated from the XY coordinate axes of the mounting machine. Is. In order to inspect the suction state of the electronic component, conventionally, the electronic component is imaged by using a plurality of cameras, and the deviation with respect to the center or the coordinate axis is calculated from the brightness information of the captured image and correction is performed.
Alternatively, a part of a part is measured by a three-dimensional length measuring device using a laser spot light, and correction calculation is performed from the three-dimensional information.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、電子部
品の基板への実装状態の検査は、従来は別工程で行なわ
れているため、実装機内での実装確認、検査は行なわれ
ていなかった。また、リフローはんだ付け後または接着
剤硬化後の検査は、最終検査としては有効であるが、検
査により欠品、位置ずれ、立ち装着などの実装エラーを
発見しても、修復は容易でない。このため、はんだ付け
前または接着剤硬化前に人手により抜き取り検査などを
行なうこともあるが、実際には完全にチェックすること
ができない。この結果、実装済基板に不良品が発生する
おそれがあった。However, since the inspection of the mounting state of the electronic component on the substrate has been conventionally performed in a separate process, the mounting confirmation and inspection in the mounting machine have not been performed. Further, the inspection after the reflow soldering or after the adhesive is cured is effective as the final inspection, but even if the inspection finds a mounting error such as a missing item, a position shift, or a stand-up mounting, the repair is not easy. For this reason, a sampling inspection may be manually performed before soldering or before curing the adhesive, but in reality, it cannot be completely checked. As a result, there is a possibility that defective products may occur on the mounted board.
【０００５】また、装着ノズルに吸着された電子部品の
状態を検査するためにカメラを用いる場合は、照明や背
景に配慮しないと補正計算に要求される鮮明な画像が得
られない。このため、部品の影を利用する場合は、部品
の背景に白く光るリフレクタなどを配置したり、部品の
電極の反射光を利用する場合は、背景を黒くするための
板などを配置している。しかしながら、部品の大きさの
違いなどから、部品により、これらの板を替えたり、複
雑なメカニズムや制御が必要となるという問題があっ
た。Further, when a camera is used to inspect the state of the electronic component sucked by the mounting nozzle, a clear image required for the correction calculation cannot be obtained unless the illumination and the background are taken into consideration. Therefore, when utilizing the shadow of a component, a reflector that glows white is placed on the background of the component, and when using the reflected light of the electrode of the component, a plate is used to darken the background. . However, due to the difference in size of parts, there is a problem in that these plates need to be replaced or a complicated mechanism or control is required depending on the parts.
【０００６】またレーザスポット光を用いるときは、部
品全体を測定することは実際上不可能であり、部品の一
部を測定するときでもレーザスポット光を走査するため
に時間がかかり、高速で測定することは困難であった。Further, when the laser spot light is used, it is practically impossible to measure the entire component, and even when measuring a part of the component, it takes time to scan the laser spot light, and the measurement is performed at high speed. It was difficult to do.
【０００７】本発明はこのような状況に鑑みてなされた
もので、基板へ実装される電子部品の状態を実装時に確
認することができ、大幅な実装品質の向上を図ることが
できる電子部品実装機を提供することを目的とする。The present invention has been made in view of such a situation, and the state of electronic components mounted on a board can be confirmed at the time of mounting, and the mounting quality can be greatly improved. The purpose is to provide a machine.
【０００８】[0008]
【課題を解決するための手段】請求項１に記載の電子部
品実装機は、電子部品を装着ノズル３により吸着し、基
板１上の所定の位置に実装する電子部品実装機におい
て、実装過程における電子部品４にスリット光を走査し
て３次元情報を得る座標測定器８を設けたことを特徴と
する。According to a first aspect of the present invention, there is provided an electronic component mounting machine, wherein an electronic component is picked up by a mounting nozzle 3 and mounted at a predetermined position on a substrate 1. The electronic component 4 is provided with a coordinate measuring device 8 that scans slit light to obtain three-dimensional information.
【０００９】請求項２に記載の電子部品実装機は、座標
測定器８が、基板１上に実装された直後の個々の電子部
品４の３次元情報を得ることを特徴とする。An electronic component mounter according to a second aspect is characterized in that the coordinate measuring machine 8 obtains three-dimensional information of each electronic component 4 immediately after being mounted on the substrate 1.
【００１０】請求項３に記載の電子部品実装機は、座標
測定器８が、基板１上に実装されたすべての電子部品４
の３次元情報を得ることを特徴とする。In the electronic component mounter according to a third aspect of the present invention, the coordinate measuring device 8 is mounted on the substrate 1 for all electronic components 4.
It is characterized by obtaining three-dimensional information of.
【００１１】請求項４に記載の電子部品実装機は、座標
測定器８が、装着ノズル３に吸着された電子部品４の３
次元情報を得ることを特徴とする。In the electronic component mounting machine according to the fourth aspect, the coordinate measuring device 8 is mounted on the mounting nozzle 3 to attach the electronic component 3 to the electronic component 4.
It is characterized by obtaining dimensional information.
【００１２】請求項５に記載の電子部品実装機は、３次
元情報は座標測定器８から電子部品４までの距離情報で
あることを特徴とする。An electronic component mounting machine according to a fifth aspect is characterized in that the three-dimensional information is distance information from the coordinate measuring device 8 to the electronic component 4.
【００１３】請求項６に記載の電子部品実装機は、吸着
ノズル３に吸着された電子部品４の吸着状態を、３次元
情報に基づいて補正する補正機構としてのＸＹテーブル
位置決め機構２３および装着角度補正機構２４を設けた
ことを特徴とする。In the electronic component mounting machine according to the sixth aspect, the XY table positioning mechanism 23 and the mounting angle as a correction mechanism for correcting the suction state of the electronic component 4 sucked by the suction nozzle 3 based on the three-dimensional information. It is characterized in that a correction mechanism 24 is provided.
【００１４】[0014]
【作用】請求項１、２に記載の電子部品実装機において
は、基板１上に装着された直後の電子部品４の３次元情
報を座標測定器８により得ることができ、装着が確実に
なされたかどうかを確認することができる。In the electronic component mounter according to the first or second aspect, the coordinate measuring device 8 can obtain the three-dimensional information of the electronic component 4 immediately after it is mounted on the substrate 1, and the mounting is ensured. You can check whether or not.
【００１５】請求項３に記載の電子部品実装機において
は、１枚の基板１上にすべての電子部品４の装着が完了
した後に基板１を所定の位置に位置決めし、すべての電
子部品４の３次元情報を座標測定器８により得ることが
でき、すべての電子部品４の装着が確実になされたかど
うかを確認することができる。In the electronic component mounter according to a third aspect of the present invention, after the mounting of all the electronic components 4 on one substrate 1 is completed, the substrate 1 is positioned at a predetermined position and all the electronic components 4 are mounted. Three-dimensional information can be obtained by the coordinate measuring device 8 and it can be confirmed whether or not all the electronic components 4 have been mounted securely.
【００１６】請求項４に記載の電子部品実装機において
は、装着ノズル３に吸着された電子部品４に座標測定器
８から発するスリット光を走査することにより、電子部
品４の３次元情報を得ることができる。この情報によ
り、装着ノズル３に吸着された電子部品４の中心位置の
ずれや傾きなどを確認することができる。In the electronic component mounter according to the fourth aspect, the three-dimensional information of the electronic component 4 is obtained by scanning the electronic component 4 sucked by the mounting nozzle 3 with the slit light emitted from the coordinate measuring instrument 8. be able to. With this information, it is possible to confirm the deviation or inclination of the central position of the electronic component 4 sucked by the mounting nozzle 3.
【００１７】請求項５に記載の電子部品実装機において
は、従来カメラから取り込んだ画像の輝度情報の代わり
に、座標測定器８から発するレーザスリット光により、
三角測量法の原理により、座標測定器８から電子部品４
までの距離情報を得て、この距離情報により電子部品４
の装着状態を確認するので、簡単な装置により正確な確
認を行うことができる。In the electronic component mounter according to the fifth aspect, instead of the brightness information of the image captured from the conventional camera, the laser slit light emitted from the coordinate measuring device 8 is used,
Based on the principle of triangulation, the coordinate measuring device 8 to the electronic component 4
To the electronic component 4 by obtaining the distance information up to
Since the mounting state of the device is confirmed, accurate confirmation can be performed with a simple device.
【００１８】請求項６に記載の電子部品実装機において
は、座標測定器８が得た３次元情報に基づいて、ＸＹテ
ーブル位置決め機構２３により基板１を載置したＸＹテ
ーブルを移動することにより、吸着ノズル３に吸着され
た電子部品４の位置ずれを補正することができる。同様
に、装着角度補正機構２４により吸着ノズル３の角度を
補正することにより、吸着ノズル３に吸着された電子部
品４のななめ吸着を補正することができる。In the electronic component mounter according to the sixth aspect, the XY table on which the substrate 1 is placed is moved by the XY table positioning mechanism 23 based on the three-dimensional information obtained by the coordinate measuring machine 8. The positional deviation of the electronic component 4 sucked by the suction nozzle 3 can be corrected. Similarly, by correcting the angle of the suction nozzle 3 by the mounting angle correction mechanism 24, the lick suction of the electronic component 4 sucked by the suction nozzle 3 can be corrected.
【００１９】[0019]
【実施例】以下、本発明の電子部品実装機の実施例を図
面を参照して説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of an electronic component mounting machine of the present invention will be described below with reference to the drawings.
【００２０】図１に本発明の第１の実施例の構成を示
す。実装機本体の所定の位置に位置決めされた基板とし
てのプリント基板１上には、予め決められた位置にクリ
ーム半田２が印刷または塗布されている。クリーム半田
２は接着剤であってもよい。クリーム半田２上には装着
ノズル３に吸着された電子部品４が、装着ノズル３の昇
降によって装着される。このとき、クリーム半田２は電
子部品４の外周からはみ出している場合もはみ出してい
ない場合もある。FIG. 1 shows the configuration of the first embodiment of the present invention. The cream solder 2 is printed or applied at a predetermined position on a printed circuit board 1 as a substrate positioned at a predetermined position of the mounting machine body. The cream solder 2 may be an adhesive. The electronic component 4 adsorbed by the mounting nozzle 3 is mounted on the cream solder 2 by raising and lowering the mounting nozzle 3. At this time, the cream solder 2 may or may not protrude from the outer periphery of the electronic component 4.
【００２１】基板１の上部には、レーザスリット光５を
投光する投光部６と、反射光を受光する受光部７とを備
えた３次元座標測定器８が設けられており、投光部６か
ら発した線状のレーザスリット光５は、基板１上の斜線
で示す範囲Ａを走査するようになっている。そして基板
１及び基板１上に実装された電子部品４から反射した光
は受光部７を介して座標測定器８に入り、三角測量法の
原理で座標測定器８から基板１または電子部品４までの
距離を測定する。A three-dimensional coordinate measuring instrument 8 having a light projecting section 6 for projecting the laser slit light 5 and a light receiving section 7 for receiving the reflected light is provided on the substrate 1, and the light projecting section 8 is provided. The linear laser slit light 5 emitted from the portion 6 scans the range A indicated by the diagonal lines on the substrate 1. Then, the light reflected from the board 1 and the electronic component 4 mounted on the board 1 enters the coordinate measuring instrument 8 through the light receiving portion 7, and from the coordinate measuring instrument 8 to the board 1 or the electronic component 4 by the principle of the triangulation method. To measure the distance.
【００２２】座標測定器８には、演算装置９と警報発生
装置１０が順次接続されており、演算装置９は、座標測
定器８が検出した３次元情報を演算処理して、電子部品
４の有無、装着位置のずれ、装着姿勢、形状などの検
査、確認を行なう。ここで得られる３次元情報とは、Ｃ
ＣＤカメラ１１などで電子部品４の画像を２次元イメー
ジのフレーム・メモリなどに取り込んだときの輝度情報
に相当する、座標測定器８から基板１または電子部品４
までの距離情報のことである。演算装置９で演算処理さ
れた３次元情報が所定の基準範囲を超えたときは、警報
発生装置１０により警報を発する。なお、符号１２は既
に実装されている電子部品である。An arithmetic unit 9 and an alarm generator 10 are sequentially connected to the coordinate measuring instrument 8, and the arithmetic unit 9 arithmetically processes the three-dimensional information detected by the coordinate measuring instrument 8 to obtain the electronic component 4 Examine and check presence / absence, displacement of mounting position, mounting posture, shape, etc. The three-dimensional information obtained here is C
From the coordinate measuring device 8 to the substrate 1 or the electronic component 4 corresponding to the luminance information when the image of the electronic component 4 is captured by the CD camera 11 or the like into the frame memory of the two-dimensional image.
It is the distance information to. When the three-dimensional information calculated by the arithmetic unit 9 exceeds a predetermined reference range, the alarm generator 10 issues an alarm. Note that reference numeral 12 is an already mounted electronic component.
【００２３】次に、本実施例の作用を図２を参照して説
明する。電子部品４を装着ノズル３により吸着し、基板
１上の所定の位置に予め印刷されたクリーム半田３上に
電子部品４を装着する。そして装着直後で装着ノズル３
が上方に退避した時に、ステップ１０１において、検査
を開始する。次にステップ１０２において、座標測定器
８の投光部６から線状のレーザスリット光を電子部品４
及びその近傍に照射してスキャンする。そして、その反
射光を受光部７で受光し、座標測定器８と電子部品４及
びその近傍との間の距離としての３次元情報を取り込
む。Next, the operation of this embodiment will be described with reference to FIG. The electronic component 4 is sucked by the mounting nozzle 3, and the electronic component 4 is mounted on the cream solder 3 preprinted at a predetermined position on the substrate 1. And immediately after mounting, the mounting nozzle 3
When is retracted upward, the inspection is started in step 101. Next, in step 102, linear laser slit light is emitted from the light projecting unit 6 of the coordinate measuring instrument 8 into the electronic component 4.
And irradiate it and its vicinity for scanning. Then, the reflected light is received by the light receiving unit 7, and three-dimensional information as a distance between the coordinate measuring device 8 and the electronic component 4 and its vicinity is captured.
【００２４】次にステップ１０３において、演算装置９
により前記３次元情報を演算処理して、電子部品４の有
無及び形状を検査し、所定の電子部品４が実装されたか
否かの確認を行なう。次にステップ１０４において、所
定の電子部品４が実装されていれば、電子部品４のＸ、
Ｙ、θ方向の装着位置及び中心点の位置の検出を行な
う。Next, in step 103, the arithmetic unit 9
Thus, the three-dimensional information is arithmetically processed to check the presence and shape of the electronic component 4 and confirm whether the predetermined electronic component 4 is mounted. Next, in step 104, if the predetermined electronic component 4 is mounted, X of the electronic component 4,
The mounting position in the Y and θ directions and the position of the center point are detected.
【００２５】次にステップ１０５において、電子部品４
の装着位置及び中心点の位置のずれが所定の基準範囲内
に入っているか否かを判断し、基準範囲内にあればステ
ップ１０６において、電子部品４の傾きなどの姿勢の検
出を行なう。次にステップ１０７において、電子部品４
の姿勢が所定の基準範囲内に入っているか否かを判断
し、基準範囲内にあれば電子部品４が基板１に正しく実
装されたと判断され、ステップ１０８において検査を終
了する。Next, in step 105, the electronic component 4
It is determined whether the displacement between the mounting position and the center point is within the predetermined reference range. If the deviation is within the reference range, the posture such as the inclination of the electronic component 4 is detected in step 106. Next, in step 107, the electronic component 4
Is within a predetermined reference range, and if it is within the reference range, it is determined that the electronic component 4 is correctly mounted on the board 1, and the inspection is ended in step 108.
【００２６】なお、ステップ１０３、１０５、１０７に
おいて、電子部品４が所定のものでないか、または実装
位置及び姿勢が基準範囲をこえていると判断された場合
には、ステップ１０９において、警報発生装置１０によ
りランプやブザーなどで警報を発する。If it is determined in steps 103, 105, and 107 that the electronic component 4 is not the predetermined one, or the mounting position and orientation are out of the reference range, in step 109, the alarm generator An alarm is emitted by a lamp or a buzzer by 10.
【００２７】本実施例によれば、１個の電子部品４を基
板１上の所定の位置に印刷されたクリーム半田２上に装
着した直後に、装着が正しく行なわれているか否かの確
認を行なうことができ、装着不良の場合には警報が発せ
られるので、容易に除去または位置修正を行なうことが
できる。また、検査確認にレーザスリット光５を発する
座標測定器８を用いることにより、実装機のタクトタイ
ムにほとんど影響を及ぼすことなく、確認作業を行なう
ことができる。According to this embodiment, immediately after mounting one electronic component 4 on the cream solder 2 printed at a predetermined position on the substrate 1, it is confirmed whether or not the mounting is properly performed. It can be carried out, and an alarm is issued in the case of poor mounting, so that removal or position correction can be easily carried out. Further, by using the coordinate measuring device 8 which emits the laser slit light 5 for the inspection confirmation, the confirmation work can be performed with almost no influence on the tact time of the mounting machine.
【００２８】なお、座標測定器８により３次元情報を取
り込むときに、ＣＣＤカメラ１１などで通常の画像を取
り込み、この画像の輝度情報を前記演算処理の際の補助
情報として用いることにより、検査、確認の信頼性をよ
り高めることができる。Incidentally, when the coordinate measuring device 8 takes in three-dimensional information, a normal image is taken in by the CCD camera 11 or the like, and the luminance information of this image is used as auxiliary information in the above-mentioned calculation processing, The reliability of confirmation can be further increased.
【００２９】図３及び図４にそれぞれ本発明の第２及び
第３の実施例の構成を示す。これらの図において、図１
に示す第１の実施例の部分に対応する部分には同一の符
号を付してあり、その説明は適宜省略する。3 and 4 show the configurations of the second and third embodiments of the present invention, respectively. In these figures, FIG.
The same reference numerals are given to the portions corresponding to the portions of the first embodiment shown in, and the description thereof will be appropriately omitted.
【００３０】図３に示す第２の実施例は、基板１の１枚
分に対して、すべての電子部品４の装着が終了した直後
に、第１の実施例の場合と同様に、座標測定器８から発
するレーザスリット光５により、実装面の３次元情報を
得るものである。この場合、基板１上にすべての電子部
品４を装着した直後に、基板１を実装機内のアンローグ
ユニット１３に位置決め載置した後、座標測定器８によ
る測定を行なう。In the second embodiment shown in FIG. 3, the coordinate measurement is performed immediately after the mounting of all the electronic components 4 on one substrate 1 is completed, as in the case of the first embodiment. The laser slit light 5 emitted from the container 8 obtains three-dimensional information on the mounting surface. In this case, immediately after mounting all the electronic components 4 on the board 1, the board 1 is positioned and mounted on the unload unit 13 in the mounting machine, and then the measurement by the coordinate measuring instrument 8 is performed.
【００３１】本実施例によれば、電子部品４を基板１に
装着した直後の半田リフローまたは装着剤硬化直前の、
すべての電子部品４の装着状態の検査、確認を同時に行
なうので、実装済基板１の品質について、より確実な情
報を得ることができる。According to this embodiment, immediately after the electronic component 4 is mounted on the board 1, immediately before solder reflow or curing of the mounting material,
Since the mounting states of all electronic components 4 are inspected and confirmed at the same time, more reliable information on the quality of the mounted substrate 1 can be obtained.
【００３２】図４に示す第３の実施例は、装着ノズル３
に吸着された電子部品４の吸着姿勢を、座標測定器８か
ら発するレーザスリット光５を電子部品４に照射して３
次元情報を得ることにより確認して、補正するようにし
たものである。複数本の装着ノズル３はノズルブロック
２１に取り付けられており、それぞれ対応する形状の電
子部品４を吸着する。また演算装置９に設けられたメモ
リには、ＣＣＤカメラで取り込んだ画像の各画素の輝度
に相手する、座標測定器８から電子部品４までの距離が
入力される。The third embodiment shown in FIG. 4 is a mounting nozzle 3
The electronic component 4 is irradiated with the laser slit light 5 emitted from the coordinate measuring device 8 so that the electronic component 4 is attracted to the electronic component 4 by 3
The dimensional information is obtained for confirmation and correction. The plurality of mounting nozzles 3 are attached to the nozzle block 21, and suck the electronic components 4 having a corresponding shape. In addition, the distance provided from the coordinate measuring device 8 to the electronic component 4 corresponding to the brightness of each pixel of the image captured by the CCD camera is input to the memory provided in the arithmetic unit 9.
【００３３】さらに、座標測定器８が取り込んだ３次元
情報を演算装置９で演算処理することにより、電子部品
４の立ち吸着、ななめ吸着、裏吸着などの異常吸着を検
出する。この検出結果によりマシン制御装置２２を介し
て、基板１を載置するＸＹテーブルの位置決め機構２３
及び装着ノズル３への電子部品４の装着角度補正機構２
４を帰還制御し、電子部品４の装着ノズル３による吸着
位置および傾きなどの吸着姿勢を、正しい姿勢に修正す
るようになっている。Further, the three-dimensional information captured by the coordinate measuring instrument 8 is processed by the arithmetic unit 9 to detect abnormal suction such as standing suction, lick suction and back suction of the electronic component 4. Based on the detection result, the positioning mechanism 23 for the XY table on which the substrate 1 is placed is transferred via the machine control device 22.
And a mounting angle correction mechanism 2 for mounting the electronic component 4 on the mounting nozzle 3.
4 is feedback-controlled to correct the suction position and inclination of the electronic component 4 by the mounting nozzle 3 to the correct position.
【００３４】本実施例によれば、装着ノズル３に対する
電子部品４の吸着位置及び角度などの吸着姿勢を、明確
に、かつ容易に認識することができ、演算装置９により
補正計算を高速かつ高信頼性をもって行なうことができ
る。また、従来のように、照明や背景の明るさなどを配
慮する必要がないので、装置の構成を簡単にすることが
できる。さらに、電子部品４にレーザスリット光を照射
することにより、電子部品４の全体の吸着姿勢の３次元
情報が得られるので、電子部品４の異常吸着を適確に検
出することができる。According to the present embodiment, the suction position and angle of the electronic component 4 with respect to the mounting nozzle 3 can be clearly and easily recognized, and the calculation unit 9 can perform correction calculation at high speed and with high accuracy. It can be done reliably. Further, unlike the conventional case, it is not necessary to consider the illumination and the brightness of the background, so that the configuration of the device can be simplified. Further, by irradiating the electronic component 4 with laser slit light, three-dimensional information of the entire suction posture of the electronic component 4 can be obtained, so that abnormal suction of the electronic component 4 can be accurately detected.
【００３５】なお、座標測定器８による３次元座標測定
と同時に、従来と同様にＣＣＤカメラにより画像を取り
込み、この画像の輝度情報を補正計算の補助情報として
用いることにより、さらに信頼性の高い補正を行なうこ
とができる。At the same time as the three-dimensional coordinate measurement by the coordinate measuring device 8, the image is captured by the CCD camera as in the conventional case, and the luminance information of this image is used as auxiliary information for the correction calculation, so that the correction can be performed with higher reliability. Can be done.
【００３６】[0036]
【発明の効果】以上説明したように、本発明の電子部品
実装機によれば、実装過程における電子部品に、座標測
定器からスリット光を走査して３次元情報を得るように
したので、基板へ実装される電子部品の状態を実装時に
確認することができ、大幅な実装品質の向上を図ること
ができる。As described above, according to the electronic component mounter of the present invention, the slit light is scanned from the coordinate measuring machine to obtain three-dimensional information on the electronic component in the mounting process. It is possible to confirm the state of the electronic components to be mounted at the time of mounting, and it is possible to significantly improve the mounting quality.
【図１】本発明の電子部品実装機の第１の実施例の要部
の構成を示す説明図である。FIG. 1 is an explanatory diagram showing a configuration of a main part of a first embodiment of an electronic component mounting machine of the present invention.
【図２】本発明の第１の実施例の作用を説明するフロー
図である。FIG. 2 is a flowchart illustrating the operation of the first embodiment of the present invention.
【図３】本発明の第２の実施例の要部の構成を示す説明
図である。FIG. 3 is an explanatory diagram showing a configuration of a main part of a second embodiment of the present invention.
【図４】本発明の第３の実施例の要部の構成を示す説明
図である。FIG. 4 is an explanatory diagram showing a configuration of a main part of a third embodiment of the present invention.
１ プリント基板（基板） ３ 装着ノズル ４ 電子部品 ５ レーザスリット光（スリット光） ８ 座標測定器 1 Printed circuit board (board) 3 Mounting nozzle 4 Electronic component 5 Laser slit light (slit light) 8 Coordinate measuring instrument
─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成４年１１月１７日[Submission date] November 17, 1992
【手続補正１】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】請求項６[Name of item to be corrected] Claim 6
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【手続補正２】[Procedure Amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１３[Correction target item name] 0013
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００１３】 請求項６に記載の電子部品実装機は、装
着ノズル３に吸着された電子部品４の吸着状態を、３次
元情報に基づいて補正する補正機構としてのＸＹテーブ
ル位置決め機構２３および装着角度補正機構２４を設け
たことを特徴とする。[0013] Electronic component mounting apparatus according to claim 6, instrumentation
It is characterized in that an XY table positioning mechanism 23 and a mounting angle correction mechanism 24 are provided as a correction mechanism for correcting the suction state of the electronic component 4 sucked by the landing nozzle 3 based on the three-dimensional information.
【手続補正３】[Procedure 3]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１８[Correction target item name] 0018
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００１８】 請求項６に記載の電子部品実装機におい
ては、座標測定器８が得た３次元情報に基づいて、ＸＹ
テーブル位置決め機構２３により基板１を載置したＸＹ
テーブルを移動することにより、装着ノズル３に吸着さ
れた電子部品４の位置ずれを補正することができる。同
様に、装着角度補正機構２４により装着ノズル３の角度
を補正することにより、装着ノズル３に吸着された電子
部品４のななめ吸着を補正することができる。In the electronic component mounter according to claim 6, XY is based on the three-dimensional information obtained by the coordinate measuring machine 8.
XY in which the substrate 1 is placed by the table positioning mechanism 23
By moving the table, it is possible to correct the positional deviation of the electronic component 4 sucked by the mounting nozzle 3 . Similarly, by correcting the angle of the mounting nozzle 3 by the mounting angle correction mechanism 24, it is possible to correct the licking suction of the electronic component 4 sucked by the mounting nozzle 3 .
【手続補正４】[Procedure amendment 4]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００３０[Name of item to be corrected] 0030
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００３０】 図３に示す第２の実施例は、基板１の１
枚分に対して、すべての電子部品４の装着が終了した直
後に、第１の実施例の場合と同様に、座標測定器８から
発するレーザスリット光５により、実装面の３次元情報
を得るものである。この場合、基板１上にすべての電子
部品４を装着した直後に、基板１を実装機内のアンロー
ダユニット１３に位置決め載置した後、座標測定器８に
よる測定を行なう。The second embodiment shown in FIG.
Immediately after the mounting of all the electronic components 4 on the number of sheets, the three-dimensional information of the mounting surface is obtained by the laser slit light 5 emitted from the coordinate measuring device 8 as in the case of the first embodiment. It is a thing. In this case, immediately after mounting all the electronic components 4 on the board 1, the board 1 is unloaded in the mounting machine.
After positioning and mounting on the da unit 13 , the measurement is performed by the coordinate measuring device 8.
【手続補正５】[Procedure Amendment 5]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００３１[Correction target item name] 0031
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００３１】 本実施例によれば、電子部品４を基板１
に装着した後の半田リフローまたは装着剤硬化直前の、
すべての電子部品４の装着状態の検査、確認を同時に行
なうので、実装済基板１の品質について、より確実な情
報を得ることができる。According to this embodiment, the electronic component 4 is mounted on the substrate 1
Solder reflow after mounting on or just before hardening of mounting material,
Since the mounting states of all electronic components 4 are inspected and confirmed at the same time, more reliable information on the quality of the mounted substrate 1 can be obtained.
【手続補正６】[Procedure correction 6]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００３２[Name of item to be corrected] 0032
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００３２】 図４に示す第３の実施例は、装着ノズル
３に吸着された電子部品４の吸着姿勢を、座標測定器８
から発するレーザスリット光５を電子部品４に照射して
３次元情報を得ることにより確認して、補正するように
したものである。複数本の装着ノズル３はノズルブロッ
ク２１に取り付けられており、それぞれ対応する形状の
電子部品４を吸着する。また演算装置９に設けられたメ
モリには、ＣＣＤカメラで取り込んだ画像の各画素の輝
度に相当する、座標測定器８から電子部品４までの距離
が入力される。In the third embodiment shown in FIG. 4, the coordinate measuring device 8 measures the suction posture of the electronic component 4 sucked by the mounting nozzle 3.
The electronic component 4 is irradiated with the laser slit light 5 emitted from the electronic component 4 to obtain three-dimensional information, which is confirmed and corrected. The plurality of mounting nozzles 3 are attached to the nozzle block 21, and suck the electronic components 4 having a corresponding shape. Further, the memory provided in the arithmetic unit 9 is input with the distance from the coordinate measuring instrument 8 to the electronic component 4 corresponding to the brightness of each pixel of the image captured by the CCD camera.
【手続補正７】[Procedure Amendment 7]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００３３[Correction target item name] 0033
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００３３】 さらに、座標測定器８が取り込んだ３次
元情報を演算装置９で演算処理することにより、電子部
品４の未吸着、立ち吸着、ななめ吸着、裏吸着などの異
常吸着を検出する。この検出結果により、異常吸着部品
は装着しないで廃棄することができ、また、正常吸着部
品は、その吸着姿勢がわかるので、マシン制御装置２２
を介して、基板１を載置するＸＹテーブルの位置決め機
構２３及び装着ノズル３への電子部品４の装着角度補正
機構２４を帰還制御し、電子部品４の装着ノズル３によ
る吸着位置および傾きなどの吸着姿勢を、正しい姿勢に
修正するようになっている。Furthermore, the three-dimensional information captured by the coordinate measuring instrument 8 is processed by the arithmetic unit 9 to detect abnormal suction such as non-suction, standing suction, tanning suction, and back suction of the electronic component 4. Based on this detection result , abnormal suction parts
Can be discarded without mounting, and the
Since the suction posture of the product is known, the machine control device 22
The positioning mechanism 23 of the XY table on which the substrate 1 is mounted and the mounting angle correction mechanism 24 of the electronic component 4 to the mounting nozzle 3 are feedback-controlled via the, and the suction position and the inclination of the electronic component 4 by the mounting nozzle 3 and the like. The suction posture is corrected to the correct posture.
【手続補正８】[Procedure Amendment 8]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００３５[Correction target item name] 0035
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００３５】 なお、座標測定器８による３次元座標測
定と同時に、ＣＣＤカメラなどにより画像を取り込み、
この画像の輝度情報を補正計算の補助情報として用いる
ことにより、さらに信頼性の高い補正を行なうことがで
きる。 At the same time as the three-dimensional coordinate measurement by the coordinate measuring device 8, an image is taken in by a CCD camera or the like ,
By using the brightness information of this image as auxiliary information for the correction calculation, it is possible to perform the correction with higher reliability.
Claims (6)
板上の所定の位置に実装する電子部品実装機において、 実装過程における前記電子部品にスリット光を走査して
３次元情報を得る座標測定器を設けたことを特徴とする
電子部品実装機。1. An electronic component mounter for adsorbing an electronic component by a mounting nozzle and mounting the electronic component at a predetermined position on a substrate. A coordinate measuring instrument that scans slit light on the electronic component in the mounting process to obtain three-dimensional information. An electronic component mounting machine characterized by being provided with.
れた直後の個々の前記電子部品の３次元情報を得ること
を特徴とする請求項１記載の電子部品実装機。2. The electronic component mounting machine according to claim 1, wherein the coordinate measuring device obtains three-dimensional information of each of the electronic components immediately after being mounted on the substrate.
れたすべての前記電子部品の３次元情報を得ることを特
徴とする請求項１記載の電子部品実装機。3. The electronic component mounting machine according to claim 1, wherein the coordinate measuring device obtains three-dimensional information of all the electronic components mounted on the substrate.
着された前記電子部品の３次元情報を得ることを特徴と
する請求項１記載の電子部品実装機。4. The electronic component mounting machine according to claim 1, wherein the coordinate measuring device obtains three-dimensional information of the electronic component sucked by the mounting nozzle.
前記電子部品までの距離情報であることを特徴とする請
求項１乃至４のうち、いずれか１項記載の電子部品実装
機。5. The electronic component mounter according to claim 1, wherein the three-dimensional information is distance information from the coordinate measuring device to the electronic component.
品の吸着状態を、前記３次元情報に基づいて補正する補
正機構を設けたことを特徴とする請求項１または請求項
４または請求項５記載の電子部品実装機。6. The correction mechanism for correcting the suction state of the electronic component sucked by the suction nozzle based on the three-dimensional information, according to claim 1, 4, or 5. Electronic component mounting machine described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4220606A JPH0653694A (en) | 1992-07-28 | 1992-07-28 | Electronic component mounting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4220606A JPH0653694A (en) | 1992-07-28 | 1992-07-28 | Electronic component mounting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0653694A true JPH0653694A (en) | 1994-02-25 |
Family
ID=16753613
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4220606A Withdrawn JPH0653694A (en) | 1992-07-28 | 1992-07-28 | Electronic component mounting machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0653694A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5560100A (en) * | 1992-11-26 | 1996-10-01 | Englert; Klaus | Systems and method for automatic disassembly |
| KR20020084974A (en) * | 2001-05-03 | 2002-11-16 | 삼성전자 주식회사 | 3 dimensional soldering inspection apparatus and its control method |
| KR20040026457A (en) * | 2002-09-24 | 2004-03-31 | 미래산업 주식회사 | Method for Checking Mounting of Electronic Parts |
| US7276673B2 (en) * | 2003-09-26 | 2007-10-02 | Tdk Corporation | Solder bonding method and solder bonding device |
| JP2008507699A (en) * | 2004-07-21 | 2008-03-13 | サイバーオプティクス コーポレーション | Pick and place machine with improved inspection |
| WO2008142864A1 (en) * | 2007-05-24 | 2008-11-27 | Panasonic Corporation | Component mounting method, component mounting apparatus, method for determining mounting conditions, and apparatus and program for determining mounting conditions |
| US8525070B2 (en) * | 2005-12-20 | 2013-09-03 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation apparatus, laser irradiation method, and method for manufacturing semiconductor device |
| CN103974609A (en) * | 2013-01-25 | 2014-08-06 | Juki株式会社 | Electronic component mounting apparatus and electronic component mounting method |
| CN106370106A (en) * | 2016-09-30 | 2017-02-01 | 上海航天精密机械研究所 | Industrial robot and linear guide rail-combined linear laser scanning measurement system and method |
-
1992
- 1992-07-28 JP JP4220606A patent/JPH0653694A/en not_active Withdrawn
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5560100A (en) * | 1992-11-26 | 1996-10-01 | Englert; Klaus | Systems and method for automatic disassembly |
| KR20020084974A (en) * | 2001-05-03 | 2002-11-16 | 삼성전자 주식회사 | 3 dimensional soldering inspection apparatus and its control method |
| KR20040026457A (en) * | 2002-09-24 | 2004-03-31 | 미래산업 주식회사 | Method for Checking Mounting of Electronic Parts |
| US7276673B2 (en) * | 2003-09-26 | 2007-10-02 | Tdk Corporation | Solder bonding method and solder bonding device |
| JP2008507699A (en) * | 2004-07-21 | 2008-03-13 | サイバーオプティクス コーポレーション | Pick and place machine with improved inspection |
| US8525070B2 (en) * | 2005-12-20 | 2013-09-03 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation apparatus, laser irradiation method, and method for manufacturing semiconductor device |
| WO2008142864A1 (en) * | 2007-05-24 | 2008-11-27 | Panasonic Corporation | Component mounting method, component mounting apparatus, method for determining mounting conditions, and apparatus and program for determining mounting conditions |
| US8527082B2 (en) | 2007-05-24 | 2013-09-03 | Panasonic Corporation | Component mounting method, component mounting apparatus, method for determining mounting conditions, and apparatus and program for determining mounting conditions |
| CN103974609A (en) * | 2013-01-25 | 2014-08-06 | Juki株式会社 | Electronic component mounting apparatus and electronic component mounting method |
| JP2014143365A (en) * | 2013-01-25 | 2014-08-07 | Juki Corp | Electronic component mounting device and electronic component mounting method |
| CN106370106A (en) * | 2016-09-30 | 2017-02-01 | 上海航天精密机械研究所 | Industrial robot and linear guide rail-combined linear laser scanning measurement system and method |
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