CN111954455A

CN111954455A - Component mounting device and component mounting method

Info

Publication number: CN111954455A
Application number: CN202010375994.0A
Authority: CN
Inventors: 冈田康弘; 松尾畅也
Original assignee: Panasonic Intellectual Property Management Co Ltd
Current assignee: Panasonic Intellectual Property Management Co Ltd
Priority date: 2019-05-15
Filing date: 2020-05-06
Publication date: 2020-11-17
Also published as: JP7398724B2; JP2020188141A

Abstract

The invention provides a component mounting device and a component mounting method, which can prevent the device from being large-sized and inform the punching bad condition of a component. The component mounting device is provided with: a punching unit (107) that sequentially punches the parts (202) from the belt member (200) while feeding the belt member (200) at a predetermined interval, the belt member (200) being provided with a plurality of parts (202) at a predetermined interval; a mounting head (142) that holds a component (202) and is mounted to a substrate (201); an imaging unit (116) that images a component (202) held by the mounting head (142); and a calculation unit (410) that calculates and notifies relationship information indicating the positional relationship between the edge of the member (202) and an alignment mark (222) provided on the member, based on the image data captured by the image capture unit (116).

Description

Component mounting device and component mounting method

Technical Field

The present invention relates to a component mounting apparatus and a component mounting method for mounting a component punched out of a tape on a substrate.

Background

In manufacturing a display device, a member for transmitting a video signal or the like is mounted on an edge of a display substrate. Such components are sometimes supplied in a state where a tape member of the component is provided at a predetermined pitch on a long substrate tape. In such a case, for example, as in the mounting device of patent document 1, a punching unit that punches out a component from a tape member is provided, and the punched-out component is mounted on the display substrate while feeding the tape member at a constant pitch.

Prior art documents

Patent document

Patent document 1: japanese laid-open patent publication No. 7-106796

With the recent narrowing of the frame of the display device, it is required to improve the punching accuracy of the member. However, it is difficult to maintain the required accuracy for a long period of time only by the mechanical accuracy of the punching unit. Further, if a sensor for confirming the punching state is provided in the punching portion in order to maintain the punching accuracy, there is a problem that the punching unit becomes large.

Disclosure of Invention

Problems to be solved by the invention

The present invention has been made in view of the above problems, and an object thereof is to provide a component mounting device and a component mounting method capable of maintaining punching accuracy of punching a component from a belt member without increasing the size of the device.

Means for solving the problems

In order to achieve the above object, a component mounting apparatus according to an aspect of the present invention includes: a punching unit that sequentially punches parts from a belt member provided with a plurality of parts at predetermined intervals while feeding the belt member at predetermined intervals; a mounting head holding the component blanked by the blanking unit and mounted to a display substrate; an image pickup unit that picks up an image of the component held by the mounting head; and a calculation unit that calculates and notifies relationship information indicating a positional relationship between an edge of the member and an alignment mark provided in the member, based on the image data captured by the image capture unit.

Further, in order to achieve the above object, a component mounting method as another aspect of the present invention includes: a blanking step of sequentially blanking, by a blanking unit, parts from a belt member, in which a plurality of the parts are provided at predetermined intervals, while feeding the belt member at the predetermined intervals; a holding step of holding the component blanked out by the blanking unit by a mounting head; an imaging step of imaging the component held by the mounting head by an imaging unit; a mounting step of mounting the component held by the mounting head on a display substrate based on the imaging data imaged by the imaging unit; and a calculation step of calculating and notifying, by a calculation unit, relationship information indicating a positional relationship between an edge portion of the member and an alignment mark provided in the member, based on the image data captured by the image capture means.

Effects of the invention

According to the present invention, the state of the punching unit can be determined by measuring the deviation of the punching position from the belt member without mounting a new device.

Drawings

Fig. 1 is a block diagram showing the overall structure of an assembly system.

Fig. 2 is a plan view showing a component tape provided with components.

Fig. 3 is a plan view showing the relationship of the component and the substrate.

Fig. 4 is a perspective view showing the mounting device.

Fig. 5 is a diagram schematically showing the feeding mechanism together with a part of the mounting device.

Fig. 6 is a diagram schematically illustrating a blanking unit.

Fig. 7 is a block diagram showing functional portions of the wire controller, the punching unit, and the mounting device.

Fig. 8 is a flowchart showing a mounting process of the mounting device.

Description of the symbols:

100, assembling the system;

101 a loader;

102 a cleaning machine;

103 parts assembling device;

104 a supply mechanism;

105 an inspection device;

106 an unloader;

107 blanking unit;

108 line controllers;

109 a communication cable;

113 an adhering means;

114 mounting means;

115 crimping means;

116 an image pickup unit;

141 a work table;

142 mounting a head;

144 a backup station;

150 a conveying device;

151 a tape supply unit;

152 cover tape recovery unit;

153 a winding unit;

154 a movable stage;

155 a transfer head;

156 a stage moving table;

171 sprocket wheel;

a 172 motor;

173 a punch;

174, a die;

181 a control unit;

200 a strap member;

201 a substrate;

202 parts;

203 sprocket holes;

211 a substrate electrode;

212 a component electrode;

221 a substrate mark;

222 alignment marks;

a 410 calculation unit;

a 411 storage unit;

412 an input unit;

413 a display unit;

414 communication I/F section.

Detailed Description

Embodiments of a component mounting apparatus and a component mounting method according to the present invention will be described below with reference to the drawings. The embodiments described below are all general or specific examples. The numerical values, shapes, materials, constituent elements, arrangement positions and connection modes of the constituent elements, steps, order of the steps, and the like shown in the following embodiments are examples, and the gist thereof is not limited to the invention. Further, among the components in the following embodiments, components not described in the independent claims representing the uppermost concept will be described as arbitrary components.

The drawings are schematic drawings in which emphasis, omission, and adjustment of the ratio are appropriately performed to show the present invention, and may be different from the actual shape, positional relationship, and ratio.

Fig. 1 is a conceptual diagram showing the overall structure of an assembly system including a component crimping apparatus. The assembly system 100 is a system for assembling components 202 on a substrate 201, and includes a loader 101, a washer 102, a component assembly apparatus 103, an inspection apparatus 105, and an unloader 106. The apparatus further includes a line controller 108 as a computer for controlling the respective mechanisms.

The substrate 201 of the assembly member 202 is not particularly limited, but in the case of the present embodiment, a display substrate constituting an organic EL display, a liquid crystal display, or the like is exemplified as the substrate 201. The material constituting the substrate 201 is not particularly limited, but examples thereof include glass, polyimide, and other resins. The shape of the substrate 201 is also not particularly limited, but in the present embodiment, the substrate 201 is plate-shaped, and as shown in fig. 3, a plurality of substrate electrodes 211 and substrate marks 221 are provided at one end edge.

As shown in fig. 2, the components 202 are supplied in a state of a belt member 200, and the belt member 200 is provided with a plurality of components 202 at given intervals. The type of the component 202 is not particularly limited, but for example, a circuit Film component in which an electronic component is mounted on a flexible resin Film such as TCP (Tape Carrier Package) or COF (Chip on Film). As shown in fig. 3, the part 202 is provided with a plurality of part electrodes 212 and alignment marks 222. The material of the component 202 is not particularly limited, but for example, resin such as polyimide can be exemplified. The shape of the substrate 201 is also not particularly limited, but in the present embodiment, it is a flexible rectangular film.

The component electrode 212 is a conductive member such as metal provided on the surface of the component 202. The component electrodes 212 are arranged in a first direction (X-axis direction in the figure). In the present embodiment, the plurality of component electrodes 212 are thin plate-like members extending in the short-side direction (Y-axis direction in the figure) of the component 202, and are exposed.

The alignment mark 222 is a mark for acquiring a positional relationship between the substrate 201 and the component 202. The shape and position of the alignment mark 222 are not particularly limited, but in the present embodiment, the alignment mark is a cross-shaped mark provided on both sides in the arrangement direction (X-axis direction in fig. 2) of the component electrode 212.

The loader 101 is a device that introduces the substrate 201 manufactured in another step into the assembly system 100. On the other hand, the unloader 106 is a device that leads out the substrate 201 with the component 202 mounted thereon by the assembly system 100 and delivers it to another process.

The cleaning machine 102 is a device that receives the substrate 201 supplied from the loader 101 and cleans a portion of the substrate 201 to which an ACF (Anisotropic Conductive Film) is attached, and removes dirt and the like by wiping cloth and the like on the periphery of the substrate 201.

The component assembling apparatus 103 is a line for mounting the component 202 on the peripheral edge portion of the substrate 201, and includes the ACF attachment apparatus 113, the supply mechanism 104 having the punching unit 107, the mounting apparatus 114, and the pressure bonding apparatus 115.

The ACF attachment device 113 is a device that attaches an ACF tape to a given position on the surface of the substrate 201. Here, the ACF is a member that is disposed so as to be interposed between the substrate 201 and the component 202, and that enables electrical conduction to be ensured only in the pressure direction by applying heat and pressure together at only the portion to which pressure is applied. The ACF is a substance that permanently adheres and fixes the component 202 to the substrate 201 and can maintain electrical continuity between the substrate electrodes provided on the substrate 201 and the component electrodes provided on the component 202. ACF is sometimes literally referred to as an anisotropic conductive adhesive. The ACF tape means a long tape-like ACF.

The mounting device 114 is a device in which the component 202 is disposed on the ACF adhered to the substrate 201 by the ACF adhesion device 113, and the component 202 is temporarily pressed against the substrate 201 to be mounted. In the case of the present embodiment, as shown in fig. 4, the mounting device 114 includes a mounting head 142 that temporarily pressure-contacts the component 202 to the substrate 201. The mounting head 142 holds the component 202 held by the transfer stage 156 (see fig. 5) from the supply mechanism 104, transfers the component to a predetermined mounting position at the end edge of the substrate 201, and mounts the component 202 on the substrate 201.

In the present embodiment, the mounting device 114 includes a table 141, a mounting head 142, and a backup table 144.

The stage 141 is a stage on which the substrate 201 is placed, and can move the substrate 201 in the XY directions by moving the substrate in parallel in the XY directions by the driving mechanism. The table 141 can be rotated in the θ direction while being moved up and down in the Z direction, so that the substrate 201 placed thereon can be transferred in the Z direction and rotated in the θ direction.

The mounting head 142 suctions and holds the component 202 supplied from the supply mechanism 104 by a suction nozzle or the like, and conveys the component 202 in the rotational direction to be disposed at the mounting position.

The backup stage 144 is a member that supports the periphery of the substrate 201 from below, and applies a clamping force for pressing the component 202 against the substrate 201 from below when the mounting head 142 is lowered. The backup stage 144 includes a transparent portion, and the substrate 201 and the component 202 can be imaged from below the backup stage 144.

The transfer device 150 transfers the substrate 201 from the ACF attachment device 113 to the stage 141, and after the component 202 is mounted, retrieves the substrate 201 from the stage 141 and transfers the substrate to the pressure bonding device 115.

The imaging unit 116 images the component 202 held by the mounting head 142 before the substrate 201 is arranged at a given position. Specifically, the imaging unit 116 images at least one alignment mark 222 of the component 202 and at least one end edge of the component 202 in the vicinity of the imaged alignment mark 222. The imaging unit 116 may image both edges at which at least one alignment mark 222 intersects with the member 202 in the vicinity of the imaged alignment mark 222. In the case of the present embodiment, as shown by the two-dot chain line in fig. 3, the image pickup unit 116 simultaneously picks up an edge closest to the component electrode 212 and one alignment mark 222, and also picks up an edge intersecting the edge, in a direction orthogonal to the arrangement direction of the pair of alignment marks 222.

Further, the imaging unit 116 may simultaneously image the substrate mark 221 provided on the substrate 201 with the substrate electrode 211 interposed therebetween and the alignment mark 222 provided on the component 202 with the component electrode 212 interposed therebetween before being thermocompression bonded by the bonding device 115. Image pickup data as data picked up by the image pickup unit 116 is transmitted to the line controller 108.

The imaging unit 116 is not particularly limited as long as it can acquire relationship information indicating a positional relationship between the alignment mark 222 and the edge of the punched member 202, but a digital camera including a line sensor or the like can be exemplified.

Fig. 5 is a diagram showing the supply mechanism. As shown in the figure, the supply mechanism 104 includes a punching unit 107, a tape supply unit 151, a cover tape collection unit 152, a winding unit 153, a movable table 154, a transfer head 155, and a transfer table 156.

Fig. 6 is a diagram illustrating a blanking unit. The punching unit 107 is a device that sequentially punches the parts 202 from the belt member 200 while feeding the belt member 200 at a given interval, and the belt member 200 is provided with a plurality of parts 202 at a given interval. In the case of the present embodiment, the punching unit 107 includes: a sprocket 171 engaged with a sprocket hole 203 provided in the belt member 200; a motor 172 for rotationally driving the sprocket 171; a punch 173 that punches the part 202 from the belt member 200; and a die 174. The motor 172 is controlled by the control unit 181, and the feed amount of the belt member 200 can be finely adjusted. The component 202 punched out of the belt member 200 by the punching unit 107 (punching process) is placed on the movable table 154.

In the present embodiment, the control unit 181 controls the motor 172 of the punching unit 107 to adjust the punching interval based on the distance Y (see fig. 3) between the alignment mark 222 of the member 202 and the edge of the member 202 included in the relationship information notified from the arithmetic unit 410, which will be described later.

The tape supply unit 151 supplies the tape member 200 wound around the reel without slackening. The cover tape recovery unit 152 is a device that recovers the cover tape peeled off from the tape member 200. The winding unit 153 is a device for collecting the belt member 200 after the punching of the member 202.

The movable stand 154 is a device that receives and holds the member 202 punched out by the punching unit 107 from the punching unit 107, and conveys the member to the vicinity of the mounting device 114.

The transfer stage 156 is a device that transfers the component 202 to a position below the mounting head 142 of the mounting device 114. The component 202 conveyed by the transfer stage 156 can be delivered to the mounting head 142.

The transfer head 155 is a device for transferring the component 202 from the movable stage 154 to the transfer stage 156.

The pressure bonding device 115 is a device that strongly presses the component 202 mounted on the surface of the substrate 201 via the ACF by the mounting device 114 while applying a relatively high temperature by the heating and pressing head, thereby mounting the component 202 on the surface of the substrate 201 and ensuring the conduction between the substrate electrodes and the component electrodes. Further, in the component assembly apparatus 103, a plurality of pressure bonding apparatuses 115 may be provided in parallel, and for example, by performing pressure bonding by dividing the long side and the short side of the substrate 201 by two pressure bonding apparatuses 115, throughput of the component assembly apparatus 103 can be improved.

The inspection apparatus 105 inspects the positional relationship between the substrate 201 and each member 202 thermocompression bonded by the bonding apparatus based on the alignment mark 222 and the substrate mark 221. In the present embodiment, the inspection device 105 is a camera, and performs image analysis on the captured image to calculate the positional relationship between the alignment mark 222 and the substrate mark 221, and determines pass or fail by threshold determination.

The line controller 108 is a computer that manages and controls the operation status of the entire assembly system 100, communication of various data, and the like. A communication cable 109 connects the line controller 108 and each device.

Fig. 7 is a functional block diagram showing a schematic configuration of the wire controller and the mounting device of the assembly system. The line controller 108 includes an arithmetic unit 410, a storage unit 411, an input unit 412, a display unit 413, and a communication I/F unit 414.

The calculation unit 410 is a processing unit that acquires imaging data imaged by the imaging unit 116 via the communication I/F, calculates relationship information indicating the positional relationship between the edge of the member 202 and the alignment mark 222 provided in the member 202, and notifies the information via the display unit 413 or the like. In the case of the present embodiment, the relationship information includes the distance Y between the edge closest to the component electrode 212 and the alignment mark 222 in the direction orthogonal to the arrangement direction of the pair of alignment marks 222. Further, the distance between the alignment mark 222 and the other end edge of the member 202 (for example, the distance X in fig. 3) may be included.

The storage unit 411 is a storage medium such as a hard disk or a semiconductor memory, and stores information for assembling the component 202 to the substrate.

The input unit 412 is an information input device such as a keyboard, a mouse, or a touch panel, and the Display unit 413 acquires failure condition information indicating that a failure condition has occurred in the punching unit 107 from the arithmetic unit 410 when the distance Y between the edge portion of the member 202 and the alignment mark 222 is greater than a threshold value, and notifies the operator of the failure condition information via a Display device such as a CRT (Cathode Ray Tube) or an LCD (Liquid Crystal Display). In addition, a human-machine interface is formed by the input unit 412 and the display unit 413. These are used for dialog of the line controller 108 with the operator, etc.

The communication I/F unit 414 is a LAN (Local Area Network) adapter or the like, and is used for communication or the like between the line controller 108 and the component mounting apparatus 103 and the inspection apparatus 105.

The line controller 108 may execute the line control data stored in the storage unit 411 in accordance with an instruction from an operator or the like, and control each part of the assembly system 100 in accordance with the execution result.

Next, the operations of the mounting device 114 and the supply mechanism 104 will be described. Fig. 8 is a view sequentially showing the operations of the mounting device and the supply mechanism.

(a) The transfer station 156 carries the component 202 to the mounting device 114. (b) The transfer stage 156 arranges the component 202 below the mounting head 142. (c) The mounting head 142 descends to hold the component 202 (holding process). (d) The mounting head 142 ascends in a state of holding the component 202. Ce) the transfer stage 156 that has delivered the component 202 is retracted from the lower side of the mounting head 142. Cf) the imaging unit 116 images the alignment mark 222 of the member 202 and the edge of the member 202 (imaging step). At this time, the mounting head 142 may also lower the component 202 to the focal position of the imaging unit 116 or its vicinity. The imaging unit 116 may change the focal position. Note that the alignment mark 222 and the edge of the member 202 may not be imaged simultaneously, and the imaging unit 116 may be moved in the horizontal plane to image the alignment mark 222 and the edge of the member 202, respectively. In this case, information on the movement of the imaging unit 116 is also included in the imaging data. (g) When the mounting head 142 descends, the mounting head 142 ascends and the substrate 201 starts to move. (h) The table 141 moves the substrate 201 until the edge portion is disposed below the mounting head 142, and the table is lowered until the edge of the substrate 201 is placed on the backup stage 144. (i) To mount the component 202 to the end edge portion of the substrate 201, the mounting head 142 starts to descend. (i) The mounting head 142 presses the component 202 to the edge of the substrate 201 (mounting process). The component 202 is temporarily crimped to the substrate 201 by the ACF mounted to the substrate 201. In addition, the alignment mark 222 and the substrate mark 221 may be imaged by the imaging unit 116 before the component 202 is mounted. (k) The mounting head 142 is raised, and the substrate 201 on which the component 202 is mounted is carried out.

The mounting of the component 202 on the substrate 201 is performed through the above steps of Ca to k), and the imaging data is obtained in the step (f). Note that, instead of providing the step (f), the edge of the member 202 and the alignment mark 222 may be aligned in the step (i), for example.

Next, the processing of the calculation unit 410 and the control unit 181 using the image pickup data obtained by picking up the image of the alignment mark 222 and the edge of the component 202 in the mounting device 114 will be described.

The calculation unit 410 calculates relationship information indicating the positional relationship between the edge of the member 202 and the alignment mark 222 based on the imaging data, and notifies (outputs) the calculated relationship information. The relationship information may include a distance Y between the edge of the member 202 near the center of the substrate 201 and the alignment mark 222, a distance X between the edge of the member 202 in the arrangement direction of the pair of alignment marks 222 and the alignment mark 222 in the vicinity thereof, and the like. The calculation unit 410 may calculate whether or not a failure has occurred in the punching unit 107 based on the distance X, the distance Y, and the like, and may notify (output) failure information as relationship information when a failure has occurred.

As a method of determining occurrence of a failure, for example, failure information may be generated and notified when the distance Y is greater than a first threshold value. Further, the failure condition information may be generated and notified in at least one of a case where the distance Y is greater than the first threshold value and a case where the distance X is greater than the second threshold value. In addition, the failure state information may be generated and notified when the distance Y is greater than the first threshold value and when the distance X is greater than the second threshold value. Further, the failure information may be generated and notified when the difference between the respective distances Y between the two alignment marks 222 disposed on both sides of the component electrode 212 and the edge of the component 202 is greater than the third threshold value.

Then, the display unit 413 that acquires the failure condition information may display the failure condition information and present the failure condition information to the operator. In this case, the measurement results of the distance X, the distance Y, and the like may be additionally displayed, or the numerical value for adjusting the punching unit 107 may be additionally displayed. The control unit 181 of the punching unit 107 that has acquired the failure information may stop the punching operation of the punching unit 107 and wait for adjustment by the operator. In this case, the wire controller 108 may interrupt the operation of the mounting device 114, or may temporarily interrupt the operation of the entire assembly system 100.

Further, the control unit 181 may control the punching interval of the punching unit 107 based on the distance Y calculated by the calculation unit 410. In the present embodiment, the member 202 is arranged such that the pair of alignment marks 222 is orthogonal to the longitudinal direction of the belt member 200, but when the member 202 is arranged such that the pair of alignment marks 222 is along the longitudinal direction of the belt member 200, the control unit 181 may control the punching interval of the punching unit 107 based on the distance X calculated by the calculation unit 410.

In addition, the controller 181 of the punching unit 107 may stop the punching operation after punching the component 202 from the new belt member 200 by the punch 173 and the die 174, and convey only the punched component 202 to a position where the imaging unit 116 can capture an image by the movable stand 154, the transfer head 155, the transfer stage 156, and the like, in a case where a new belt member 200 is assembled to the punching unit 107, or the like. Further, the calculation unit 410 may create the relationship information based on the image pickup data obtained by picking up the distance from the alignment mark 222 of the member 202 conveyed to the position to the edge, and determine whether or not to restart the punching operation based on the relationship information notified by the calculation unit 410. By this processing, it is possible to avoid the situation in which the component 202 held by the movable table 154, the transfer head 155, or the like is discarded due to the generation of the failure state information in the normal process.

As described above, by notifying the relation information indicating the relation between the alignment mark 222 of the component 202 and the end edge of the component 202 based on the imaging data obtained by the imaging unit 116 that the mounting device 114 uses to image the component 202 and the substrate 201 in order to determine the mounting position of the component 202 with respect to the substrate 201, it is possible to grasp that a defect has occurred in the punching unit 107. Therefore, the substrate 201 in which the component 202 is assembled can be manufactured with high yield without introducing a special device for inspecting the punching state into the assembly system 100, particularly the punching unit 107, and increasing the size of the device itself.

The present invention is not limited to the above embodiments. For example, the constituent elements described in the present specification may be arbitrarily combined, and another embodiment in which some of the constituent elements are removed may be an embodiment of the present invention. Further, the present invention includes modifications of the above-described embodiment, which are made by various modifications that a person skilled in the art may find without departing from the gist of the present invention, that is, without departing from the meaning of the claims.

For example, a flat panel used for an organic EL display, a liquid crystal display, or the like is exemplified as the substrate 201, but the present invention is not limited thereto.

Further, as the component 202, a circuit film in which an electronic component is mounted on a wiring film is exemplified, but the component is not limited thereto, and a wiring film in which an electronic component is not mounted may be used.

Further, a plurality of components 202 may be mounted on one substrate 201.

Further, although the substrate electrode 211 and the component electrode 212 are both in a band shape and arranged in parallel, the substrate electrode 211 and the component electrode 212 may be arranged so as to extend in the radial direction, and the arrangement and the shape may be arbitrary.

Industrial applicability

The present invention can be used when a driver IC or a circuit film is mounted on a flat panel used for an organic EL display, a liquid crystal display, or the like.

Claims

1. A component mounting device is provided with:

a punching unit that sequentially punches parts from a belt member provided with a plurality of parts at predetermined intervals while feeding the belt member at predetermined intervals;

a mounting head that holds the component blanked by the blanking unit and mounts to a substrate;

an image pickup unit that picks up an image of the component held by the mounting head; and

and a calculation unit that calculates and notifies relationship information indicating a positional relationship between an edge of the member and an alignment mark provided in the member, based on the imaging data captured by the imaging unit.

2. The component mounting apparatus according to claim 1,

further provided with: and a control unit that controls the punching unit based on the relationship information from the calculation unit.

3. The component mounting apparatus according to claim 1 or 2,

the calculation unit notifies failure information indicating that a failure has occurred in the punching unit when a distance between an end edge of the member and the alignment mark is greater than a threshold value.

4. The component mounting apparatus according to claim 3,

the control unit stops the punching operation by the punching unit when the failure information is acquired from the calculation unit.

5. The component mounting apparatus according to claim 2,

the calculation unit calculates a distance between an edge portion of the member and the alignment mark as relationship information,

the control unit controls the punching interval of the punching unit based on the distance calculated by the calculation unit.

6. The component mounting apparatus according to claim 2,

the control unit stops the punching operation after the punching unit punches the member, and determines whether to restart the punching operation based on the relationship information from the calculation unit.

7. A component mounting method, comprising:

a punching step of sequentially punching out the components from a belt member provided with a plurality of components at predetermined intervals by a punching unit while feeding the belt at the predetermined intervals;

a holding step of holding the component blanked out by the blanking unit by a mounting head;

an imaging step of imaging the component held by the mounting head by an imaging unit;

a mounting step of mounting the component held by the mounting head on a substrate based on the imaging data imaged by the imaging unit; and

and a calculation step of calculating and notifying, by a calculation unit, relationship information indicating a positional relationship between an edge portion of the member and an alignment mark provided in the member, based on the imaging data captured by the imaging means.