JP7262008B2 - ACF sticking device and ACF sticking method - Google Patents

Description

The present invention relates to an ACF applying apparatus and an ACF applying method for applying an ACF (Anisotropic Conductive Film), which is an anisotropic conductive member, to a substrate.

Conventionally, there is a component mounting apparatus including a device that affixes (that is, affixes) ACF as an adhesive member to the edge of a substrate such as a display panel such as a liquid crystal panel or an organic EL (Electro Luminescence) panel (for example, Patent Document 1 reference).

JP 2015-65192 A

In order to attach the ACF to the substrate, a head (attaching head) is used to attach the ACF to the substrate by pressing the ACF onto the substrate. The ACF is supplied above the substrate in a belt-like state, cut to a specified size, and pressed against the substrate by the head.

In recent years, along with the miniaturization (narrow frame) of substrate terminals, the width of the ACF attached to the substrate has also been reduced. Therefore, when the ACF is attached to the substrate by lowering the head from above the ACF, the ACF deviates from the head in the width direction while the head is descending, and the ACF cannot be attached to the substrate at the specified position. There's a problem.

SUMMARY OF THE INVENTION The present invention provides an ACF applying device and the like that can adhere an ACF to a substrate with high positional accuracy.

An ACF applying apparatus according to an aspect of the present invention includes a substrate holding portion that holds a substrate, a substrate lower receiving portion that supports the substrate thereunder, and the substrate held by the substrate holding portion by moving the substrate holding portion. an ACF supply unit that supplies the ACF above the substrate lower receiving unit; and the ACF supplied from the ACF supply unit is attached to the substrate that is supported by the substrate lower receiving unit. and an elevating section for elevating the lower substrate receiving section. The substrate moving section moves the substrate between the lower substrate receiving section and the ACF supplied from the ACF supply section. After positioning, the substrate is lifted toward the ACF side, and the elevating section lifts the substrate lower receiving portion toward the substrate side to bring the substrate lower receiving portion into contact with the substrate, thereby moving the substrate to the above-mentioned position. It is made to be supported by the substrate lower receiving part.

An ACF applying method according to an aspect of the present invention includes a lower receiving step of lowering a substrate on a substrate lower receiving portion, an ACF supplying step of supplying ACF from an ACF supplying portion above the substrate lower receiving portion, an attaching step of attaching the ACF to the substrate by pressing the ACF against the substrate supported by the substrate lower receiving portion using an attaching head; positioned between the substrate lower receiving portion and the ACF supplied from the ACF supply portion, the substrate is raised toward the ACF supplied from the ACF supply portion, and the substrate lower receiving portion is moved toward the substrate side; The substrate is supported on the substrate under-receiving portion by raising the substrate under-receiving portion and bringing the substrate under-receiving portion into contact with the substrate.

In addition, these comprehensive or specific aspects may be realized by a system, method, integrated circuit, computer program, or a recording medium such as a computer-readable CD-ROM. and any combination of recording media.

According to the present invention, it is possible to provide an ACF sticking device and the like that can stick an ACF onto a substrate with good positional accuracy.

FIG. 1 is a schematic configuration diagram of a component mounting apparatus including an ACF applying apparatus according to an embodiment. FIG. 2A is a schematic front view showing the ACF applying device according to the embodiment. FIG. 2B is a schematic front view showing how the ACF applying device according to the embodiment adheres the ACF to the substrate. FIG. 3 is a flow chart for explaining the processing procedure of the ACF applying device according to the embodiment. FIG. 4 is a schematic side view of the ACF applying device for explaining operations performed by the ACF applying device according to the embodiment.

An ACF applying device and the like according to embodiments of the present invention will be described below in detail with reference to the drawings. It should be noted that each of the embodiments described below is a specific example of the present invention. Therefore, the numerical values, shapes, materials, components, arrangement and connection of components, steps and order of steps, etc. shown in the following embodiments are examples and are not intended to limit the present invention. Therefore, among the constituent elements in the following embodiments, constituent elements that are not described in independent claims representing the highest level concept of the present invention will be described as optional constituent elements.

Each figure is a schematic diagram and is not necessarily strictly illustrated. Moreover, in each figure, the same code|symbol is attached|subjected about the same component.

In addition, in this specification and drawings, the X-axis, Y-axis, and Z-axis represent three axes of a three-dimensional orthogonal coordinate system. The X-axis and the Y-axis are orthogonal to each other and both orthogonal to the Z-axis. Further, in the following embodiments, the X-axis positive direction of the substrate transfer direction may be referred to as the upward direction, the Z-axis positive direction may be referred to as the upward direction, and the Z-axis negative direction may be referred to as the downward direction.

Further, in the following embodiments, the case where the ACF applying device is viewed from the Y-axis negative direction side is referred to as a front view, and the case when viewed from the X-axis positive direction side is referred to as a side view.

(Embodiment)
[overview]
First, with reference to FIG. 1, an outline of a component mounting apparatus including an ACF applying apparatus according to an embodiment will be described.

FIG. 1 is a schematic configuration diagram of a component mounting apparatus 1 including an ACF applying apparatus 100 according to an embodiment.

The component mounting apparatus 1 is a component mounting system for producing display panels and the like, and performs a plurality of processes on substrates 200 such as display panels. Specifically, the component mounting apparatus 1 attaches the ACF 230, which is a film-like anisotropic conductive member, to the substrate 200 on which the electrode portion 210 is formed, and mounts the electronic component (component 220) on the substrate 200 ( More specifically, it is a device for thermocompression bonding to the electrode portion 210). The component mounting apparatus 1 is a part that performs a plurality of operations inline.

In this embodiment, the substrate 200 has a configuration in which two substrates, an upper substrate 201 and a lower substrate 202, are superimposed. Further, the upper substrate 201 and the lower substrate 202 do not partially overlap when viewed from the top, and the electrode section 210 is formed at a position of the lower substrate 202 which does not overlap the upper substrate 201 when viewed from the top. In recent years, with the miniaturization of the electrode section 210, the exposed portion of the upper surface of the lower substrate 202 that does not overlap with the upper substrate 201 in top view has become narrower. Along with such miniaturization, the ACF 230 attached to the substrate 200 is also narrowed.

Examples of the component 220 include flexible components such as TCP (Tape Carrier Package) and FPC (Flexible Printed Circuits), and IC (Integrated Circuit) components.

The ACF applying apparatus 100 according to the present embodiment is one of the component mounting apparatuses 1 having a plurality of apparatuses for performing a plurality of processes on a substrate 200 such as a display panel. Specifically, the ACF sticking device 100 is a device provided with a sticking section 20 that sticks the ACF 230 to the electrode section 210 formed on the substrate 200 .

In this embodiment, the component mounting apparatus 1 includes a board loading section 10 for loading a board 200 , a sticking section 20 for sticking an ACF 230 to the board 200 , and a temporary crimping section 30 for temporarily crimping a component 220 onto the ACF 230 . , ACF 230 and the component 220 are thermocompressed (finally crimped) to ensure electrical continuity between the substrate 200 and the component 220; , and a substrate transfer device 60 that moves the substrate 200 among the substrate loading unit 10 , the sticking unit 20 , the temporary pressure bonding unit 30 , the final pressure bonding unit 40 , and the substrate unloading unit 50 .

The component mounting apparatus 1 also includes a computer 110 that controls the operation of each device included in the component mounting apparatus 1 . The computer 110 is communicatively connected to each of the substrate loading unit 10, the sticking unit 20, the temporary pressure bonding unit 30, the final pressure bonding unit 40, the substrate unloading unit 50, and the substrate transfer device 60 via a control line or the like. It controls the operation of the device, the timing of the operation, and the like.

The board loading section 10, the sticking section 20, the temporary pressure bonding section 30, the final pressure bonding section 40, and the substrate unloading section 50 are connected in this order. For example, the substrate loading section 10, the sticking section 20, the temporary pressure bonding section 30, the final pressure bonding section 40, and the substrate unloading section 50 are arranged side by side along a predetermined direction in this order.

The component mounting apparatus 1 performs a component mounting operation of mounting a component 220 on an electrode portion 210 provided on a peripheral edge of a rectangular substrate 200 such as a display panel substrate carried in from an upstream substrate loading section 10 where the substrate 200 is transported. , and the board 200 with the component 220 mounted thereon is unloaded from the board unloading section 50 . The electrode section 210 is composed of, for example, an electrode.

The board carrying-in unit 10 is a device for carrying in a board 200 that has undergone a predetermined operation in an upstream facility arranged upstream of the component mounting apparatus 1 . The substrate loading unit 10 includes a stage 11, and the stage 11 holds the substrate 200 carried out from the upstream equipment.

The sticking unit 20 is a type of adhesive tape, and is a device that sticks the ACF 230 made of an anisotropic conductive film in a tape shape to the substrate 200 . The sticking section 20 includes, for example, a substrate holding section 21 . The substrate holding unit 21 is a stage that holds the substrate 200 unloaded from the substrate loading unit 10 . The attaching unit 20 moves the substrate 200 held by the substrate holding unit 21 in a predetermined direction, and moves the substrate 200 to an attaching position where the ACF 230 is attached.

The attaching unit 20 also attaches the ACF 230 cut to a predetermined size to the substrate 200 by the attaching head 22 . By doing so, the attaching unit 20 attaches the ACF 230 to the substrate 200 .

The temporary pressure-bonding unit 30 is a device that temporarily pressure-bonds the component 220 onto the ACF 230 attached to the substrate 200 . Specifically, the temporary pressure-bonding unit 30 moves the substrate 200 held by the stage 31 in a predetermined direction, and picks up the component 220 positioned on the component stage (not shown) by the temporary pressure-bonding tool 32 having a pick-up head, a pressure-bonding head, or the like. Then, the component 220 is heated and pressed against the substrate 200 via the ACF 230 for temporary pressure bonding.

The final pressure-bonding unit 40 is a device that performs thermocompression (final pressure-bonding) of the component 220 temporarily pressure-bonded to the substrate 200 . The final compression unit 40 moves the substrate 200 held by the stage 41 in a predetermined direction, and moves the substrate 200 to which the component 220 is preliminarily bonded to the component compression bonding position where the component 220 is thermally bonded. Further, the main crimping section 40 heats and presses the electronic component 220 onto the substrate 200 through the ACF 230 by a crimping tool 42 having a crimping head, a heater, and the like, for thermocompression bonding.

The substrate unloading unit 50 is a device that unloads the substrate 200 to which the component 220 is finally crimped by the main crimping unit 40 to the downstream equipment arranged downstream of the component mounting apparatus 1 . The substrate 200 held on the stage 51 of the substrate unloading section 50 is unloaded to downstream equipment by a unillustrated unillustrated unloading device capable of taking out the substrate 200 from the stage 51 and unloading it downstream.

The computer 110 is a control device that controls the operation of each device of the component mounting apparatus 1 including the ACF sticking device 100 and the ACF sticking device 100 . The computer 110 includes a control unit 120 that is a processing unit realized by executing software, and a storage unit 130 that stores the software.

Note that the ACF applying apparatus 100 may include the computer 110 independently, or the computer 110 included in the component mounting apparatus 1 may be shared with each device of the component mounting apparatus 1 .

The control unit 120 controls the operation of each device of the component mounting apparatus 1 including the board loading unit 10, the sticking unit 20, the temporary pressure bonding unit 30, the final pressure bonding unit 40, and the substrate unloading unit 50, the timing of the operation, and the like. . Further, the control unit 120 controls the board transfer device 60 to perform a board transfer operation of transferring the board 200 to the next process between the devices provided in the component mounting apparatus 1 .

The control unit 120 is implemented by, for example, a control program stored in the storage unit 130 and used to control each device included in the attaching unit 20 and the component mounting apparatus 1, and a CPU (Central Processing Unit) that executes the control program. be done.

The storage unit 130 stores component mounting information such as the size of the board 200, the type of the component 220 to be mounted on the board 200, the mounting position, the mounting direction, the operation of each device, the timing of the operation, and the timing of transferring the board 200 between the devices. It stores various data necessary for work, control programs executed by the control unit 120, and the like.

The storage unit 130 is implemented by a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory), for example.

[ACF application device]
Next, the ACF applying device 100 will be described in detail with reference to FIGS. 1, 2A and 2B.

FIG. 2A is a schematic front view showing the ACF applying device 100 according to the embodiment. FIG. 2B is a schematic front view showing how the ACF applying apparatus 100 according to the embodiment adheres the ACF 230 to the substrate 200. FIG. Specifically, FIGS. 2A and 2B are diagrams showing a specific configuration of the sticking section 20 included in the ACF sticking device 100. FIG. 2A and 2B, illustration of some of the components of the ACF applying apparatus 100, such as the computer 110 and the substrate transfer device 60, is omitted.

FIG. 2A shows the elevating section 27, the substrate moving section 28, and the head driving section 29 as functional blocks.

The ACF applying apparatus 100 includes a substrate holding section 21 , an applying head 22 , a cutting section 23 , an ACF supply section 24 , a peeling section 25 , a substrate lower receiving section 26 , an elevating section 27 and a substrate moving section 28 . , a head driving unit 29 , a substrate transfer device 60 , and a control unit 120 and a storage unit 130 included in the computer 110 .

The substrate holder 21 is a stage that holds the substrate 200 . Specifically, the substrate 200 located in the substrate carrying-in portion 10 is transferred to the substrate holding portion 21 by the substrate transfer device 60 . The substrate holding part 21 holds the substrate 200 transferred from the substrate transfer device 60 .

Further, the substrate holding portion 21 is movable by the substrate moving portion 28 .

The substrate moving unit 28 is composed of, for example, guides and motors for moving the substrate holding unit 21 in the Y-axis direction and the Z-axis direction.

The substrate moving part 28 moves the substrate holding part 21 . Specifically, the substrate moving unit 28 moves the substrate 200 held by the substrate holding unit 21 to a position where the attaching head 22 attaches the ACF 230 to the substrate 200 .

For example, the substrate moving section 28 moves the substrate holding section 21 to move the substrate 200 held by the substrate holding section 21 between the ACF 230 and the substrate lower receiving section 26 . Specifically, the substrate moving unit 28 moves the substrate holding unit 21 to move the substrate 200 held by the substrate holding unit 21 between the ACF 230 and the lower substrate receiving unit 26 to the height of the substrate 200 . (in other words, the position in the vertical direction) is moved without changing. More specifically, the substrate moving unit 28 moves the substrate 200 to the lower substrate receiving unit 26 without moving up and down before positioning the substrate 200 between the lower substrate receiving unit 26 and the ACF 230 supplied from the ACF supply unit 24 . and the ACF 230 supplied from the ACF supply unit 24 .

For example, the ACF applying apparatus 100 includes a recognition camera (not shown) for recognizing a substrate mark (not shown) for detecting the position of the substrate 200 formed on the substrate 200 before the ACF 230 is adhered to the substrate 200 . ) is used to image the mark. At this time, after the substrate 200 is placed on the substrate holding unit 21, the substrate moving unit 28 moves the substrate 200 to a position where the recognition camera whose position is fixed can capture an image. For example, the substrate moving unit 28 moves the substrate 200 between the substrate lower receiving unit 26 and the ACF 230 supplied from the ACF supply unit 24 without moving up and down after the image is captured by the recognition camera.

Further, for example, the substrate moving unit 28 raises the substrate holding unit 21 so as to move the substrate 200 moved between the ACF 230 and the substrate lower receiving unit 26 to the ACF 230 side.

The attaching head 22 is a pressure bonding head for attaching the ACF 230 to the substrate 200 by pressing it. The affixing head 22 is arranged at a predetermined height, and when it descends, it comes into contact with the tape member 232 having the ACF 230 , further descends together with the tape member 232 , and comes into contact with the substrate 200 via the tape member 232 . , and attach the ACF 230 to the substrate 200 .

The pasting head 22 is configured to be movable by a head driving section 29 .

The head driving section 29 moves the pasting head 22 . Specifically, the head driving unit 29 causes the attaching head 22 to attach the ACF 230 to the substrate 200 by moving the attaching head 22 downward.

The head driving section 29 is composed of, for example, a linear motion guide and a motor for moving the pasting head 22 in the Z-axis direction.

Further, when the ACF 230 is attached, the lower surface of the substrate 200 is supported by the substrate lower receiving portion 26 .

The substrate lower receiving portion 26 supports the substrate 200 from below when the ACF 230 is attached to the substrate 200 . The substrate lower receiving portion 26 is a so-called backup stage.

The substrate lower receiving portion 26 is configured to be movable by the lifting portion 27 .

The lifting section 27 moves the board lower receiving section 26 . Specifically, the elevating unit 27 raises the lower substrate receiving portion 26 to bring the lower substrate receiving portion 26 into contact with the substrate 200 positioned between the ACF 230 and the lower substrate receiving portion 26, thereby increasing the lower substrate receiving portion 26. The substrate 200 is supported by the receiving portion 26 .

The elevating section 27 is composed of, for example, a linear motion guide and an armor for moving the board lower receiving section 26 in the Z-axis direction.

The elevating section 27 may move the board 200 up and down together with the board holding section 21 while the board 200 is supported by the board lower receiving section 26 . The lower substrate receiving portion 26 may be moved up and down while the substrate 200 moved between 1 and 2 is moved toward the ACF 230 .

The cutting section 23 cuts the ACF 230 included in the tape member 232 to a specified size. For example, the tape member 232 has an ACF 230 and strip-shaped separators 231 that support the ACF 230 .

The separator 231 is a tape-shaped film that supports the ACF 230 and is made of polyethylene terephthalate or the like.

The cutting section 23 sandwiches the tape member 232 from above and below to cut only the ACF 230 between the ACF 230 and the separator 231 . As a result, the ACF 230 is cut to a predetermined size by the cutting section 23 and supported by the separator 231 , and is moved above the substrate receiving section 26 (that is, the substrate 200 ) by the ACF supply section 24 .

The cutting part 23 is, for example, a cutter.

2A and 2B omit illustration of a portion of the cutting portion 23 positioned below the tape member 232. As shown in FIG.

The ACF supply section 24 moves the ACF 230 above the substrate receiving section 26 (that is, the substrate 200). The ACF supply unit 24 is composed of, for example, guide rollers and a motor for moving the ACF 230 in the X-axis direction.

The peeling part 25 peels the ACF 230 from the separator 231 . In this embodiment, the peeling section 25 is composed of two peeling pins that sandwich the tape member 232 and a motor for moving these peeling pins. For example, after the ACF 230 is attached to the substrate 200 by the attaching head 22, the peeling section 25 sandwiches the separator 231 of the tape member 232 between the two peeling pins, and moves the two peeling pins in the negative direction of the X axis. move to Thereby, the peeling pin enters between the separator 231 and the ACF 230 in contact with the substrate 200 , and the ACF 230 in contact with the substrate 200 can be peeled off from the separator 231 .

The substrate transfer device 60 is a device that transfers (delivers) the substrate 200 between adjacent devices. The substrate transfer device 60, for example, reciprocates in a predetermined direction between devices arranged adjacent to each other, receives the substrate 200 from the upstream device, and places the substrate 200 on the stage of the downstream device. .

For example, the substrate transfer device 60 receives the substrate 200 positioned on the stage 11 provided in the substrate loading section 10 and places it on the substrate holding section 21 provided in the attaching section 20 .

The substrate transfer device 60 includes, for example, a suction pad for sucking, supporting and transporting the substrate 200 , a substrate loading section 10 , a sticking section 20 , a temporary pressure bonding section 30 , a final pressure bonding section 40 , and a substrate unloading section 50 . It is composed of a direct-acting guide and a motor for moving the suction pad between.

The control unit 120 controls each operation of the cutting unit 23, the ACF supply unit 24, the peeling unit 25, the lifting unit 27, the substrate moving unit 28, the head driving unit 29, the substrate transfer device 60, etc., the timing of each operation, and the like. It is a processing unit to control. In the present embodiment, the control section 120 also controls the operations of devices such as the temporary pressure bonding section 30 and the main pressure bonding section 40 provided in the component mounting apparatus 1 .

Further, the controller 120 raises the lower substrate receiving portion 26 toward the substrate 200 by the elevating portion 27 to bring the lower substrate receiving portion 26 into contact with the substrate 200 , thereby causing the substrate 200 to be supported by the lower substrate receiving portion 26 . .

For example, the control unit 120 causes the substrate moving unit 28 to raise the substrate 200 toward the ACF 230 supplied by the ACF supply unit 24 until it contacts the ACF 230 .

Note that the control unit 120 does not have to move the substrate 200 to the side of the ACF 230 supplied by the ACF supply unit 24 by the substrate moving unit 28 until the substrate 200 comes into contact with the ACF 230 . For example, after the substrate moving unit 28 positions the substrate 200 at the first height 240 (see FIG. 4) between the substrate lower receiving unit 26 and the ACF 230 supplied from the ACF supply unit 24, the control unit 120 , the substrate 200 is raised to the side of the ACF 230 supplied from the ACF supply unit 24 to the second height 241 (see FIG. 4). More specifically, the control unit 120 moves the substrate 200 without moving up and down before the substrate moving unit 28 positions the substrate 200 between the substrate lower receiving unit 26 and the ACF 230 supplied from the ACF supply unit 24 . After positioning the substrate 200 at the first height 240 (see FIG. 4) between the substrate lower receiving portion 26 and the ACF 230 supplied from the ACF supply portion 24, the substrate 200 is placed on the side of the ACF 230 supplied from the ACF supply portion 24. 2 Raise to a height 241 (see FIG. 4). The first height 240 is also a height for recognizing a board mark (not shown) attached to the board 200 by a recognition camera (not shown) provided in the ACF applying apparatus 100 .

Alternatively, the control unit 120 sets a first mode in which the ACF 230 is attached to the substrate 200 at a third height 242 (see FIG. 4) which is lower than the first height 240, and a second mode in which the substrate 200 is attached at the second height 241. A second mode in which the ACF 230 is attached to the substrate may be switched to control each device such as the lifting unit 27 and the substrate moving unit 28 .

The second height 241 and the third height 242 referred to here are heights at which the attaching part 20 can attach the ACF 230 to the substrate 200 positioned at each height position. In addition, since the substrate 200 positioned at the second height 241 is positioned closer to the ACF 230 than the third height 242, the second height 241 is positioned closer to the substrate 200 than the third height 242. This is the height at which the ACF 230 can be affixed by the affixing section 20 .

The storage unit 130 stores various data necessary for mounting the component 220 on the substrate 200, such as the operation of each device provided in the ACF applying apparatus 100, the timing of the operation, the timing of transferring the substrate 200 between the devices, and the control unit. 120 stores control programs and the like that are executed. In this embodiment, the storage unit 130 also stores a control program for the control unit 120 to control the operation of each device provided in the component mounting apparatus 1 other than the ACF attaching device 100, the timing of the operation, and the like. .

[Processing procedure]
Next, the processing procedure of the ACF applying device 100 according to the embodiment will be described in detail with reference to FIGS. 3 and 4. FIG.

FIG. 3 is a flow chart for explaining a processing procedure of operations performed by the ACF applying device 100 according to the embodiment. FIG. 4 is a side view for explaining operations performed by the ACF applying device 100 according to the embodiment.

3 and 4, illustration of some components of the ACF applying apparatus 100, such as the elevating unit 27 and the substrate moving unit 28, is omitted.

In FIG. 4, the first height 240 is indicated by a one-dot chain line, the second height 241 is indicated by a two-dot chain line, and the third height 242 is indicated by a three-dot chain line.

First, the substrate transfer device 60 places the substrate 200 on the substrate holder 21 as shown in step S101 of FIG. 3 and (a) of FIG.

Further, the ACF supply section 24 supplies the ACF 230 above the board lower receiving section 26 (step S102). In step S<b>102 , for example, the ACF supply unit 24 supplies the cut ACF 230 onto the board lower receiving unit 26 after the ACF 230 is cut into the prescribed size by the cutting unit 23 .

Next, as shown in step S103 of FIG. 3 and (b) of FIG. 4, the substrate moving unit 28 moves the substrate 200 onto the lower substrate receiving unit 26 while maintaining the first height 240. As shown in FIG. More specifically, the substrate moving unit 28 moves the substrate 200 from the lower substrate receiving unit 26 and the ACF supply unit 24 to the lower substrate receiving unit 26 by moving the substrate holding unit 21 while maintaining the first height 240 . is moved to between ACF 230 supplied to .

Note that the control unit 120 detects a substrate mark (not shown) attached to the substrate 200 by a recognition camera (not shown) provided in the ACF applying apparatus 100 before causing the substrate moving unit 28 to execute step S103. You may move to the 1st height 240 which is a position to image. Therefore, in step S<b>101 , the substrate 200 need not be placed on the substrate holder 21 at the first height 240 . For example, in step S101, the substrate holding part 21 may be located at a position where the substrate 200 is placed at a position lower than the first height 240, or at a position where the substrate 200 is higher than the first height 240. It may be located at the position where it is placed.

Next, the substrate moving unit 28 raises the substrate 200 from the first height 240 to the second height 241, as shown in step S104 of FIG. 3 and (c) of FIG. More specifically, the elevating section 27 elevates the substrate 200 from the first height 240 to the second height 241 by elevating the substrate holding section 21 .

Next, as shown in step S105 of FIG. 3 and (d) of FIG. The substrate 200 is supported on the substrate lower receiving portion 26 .

Next, the head driving section 29 lowers the pasting head 22 as shown in step S106 of FIG. 3 and (e) of FIG. As a result, the head driving section 29 causes the attaching head 22 to attach the ACF 230 to the substrate 200, as shown in FIG. 4(e).

Next, as shown in FIG. 3, the head driving section 29 raises the pasting head 22 (step S107).

Next, the peeling unit 25 peels the ACF 230 from the separator 231 by moving the two peeling pins sandwiching the separator 231 in the negative direction of the X-axis (step S108).

Next, the lifting section 27 lowers the substrate lower receiving section 26 (step S109).

Next, the substrate moving unit 28 withdraws the substrate 200 to which the ACF 230 is attached (step S110). Specifically, the elevating section 27 lowers the substrate 200 from the second height 241 to the first height 240 by lowering the substrate holding section 21 . Furthermore, the substrate moving unit 28 moves the substrate 200 to the original position (the position of the substrate 200 shown in FIG. 4A) while maintaining the first height 240. As shown in FIG.

In step S104, the elevating section 27 raises the substrate 200 from the first height 240 to the second height 241, but the second height 241 is not particularly limited. The second height 241 may be, for example, a height up to contact with the ACF 230, or a height not in contact with the ACF 230 and a distance from the ACF 230 of 1 mm or less, and may be set arbitrarily.

Further, for example, before executing step S101, an instruction to execute in the first mode or in the second mode may be obtained from an operation unit (not shown) such as a keyboard or a touch panel operable by the user. . The control unit 120 may control each device included in the ACF applying device 100 based on the instruction. For example, when receiving an instruction to execute in the first mode, the control unit 120 lowers the substrate 200 from the first height 240 to the third height 242 in step S104 and (c) of FIG. More specifically, the elevating section 27 lowers the substrate 200 from the first height 240 to the third height 242 by lowering the substrate holding section 21 .

[Effects, etc.]
As described above, the ACF applying apparatus 100 according to the embodiment includes the substrate holding portion 21 that holds the substrate 200, the substrate lower receiving portion 26 that supports the substrate 200, and the substrate holding portion 21 that is moved to hold the substrate. A substrate moving unit 28 for moving the substrate 200 held by the holding unit 21 , an ACF supply unit 24 for supplying the ACF 230 above the substrate lower receiving unit 26 , and an ACF supply to the substrate 200 supported by the lower substrate receiving unit 26 . A sticking head 22 for sticking the ACF 230 supplied from the part 24 and an elevating part 27 for elevating the substrate lower receiving part 26 are provided. After positioning the substrate 200 between the substrate lower receiving portion 26 and the ACF 230 supplied from the ACF supply portion 24, the substrate moving portion 28 raises the substrate 200 toward the ACF 230 side. In addition, the elevating section 27 lowers the substrate 200 on the lower substrate receiving portion 26 by raising the lower substrate receiving portion 26 toward the substrate 200 and bringing the lower substrate receiving portion 26 into contact with the substrate 200 .

With such a configuration, the substrate 200 approaches the ACF 230 before the ACF 230 is attached by the substrate moving section 28 . As a result, the attaching head 22 moves from contacting the ACF 230 (specifically, the tape member 232) until the ACF 230 is attached to the substrate 200 by the amount that the substrate 200 approaches the ACF 230 by the substrate moving unit 28. less movement. Therefore, when the attaching head 22 is lowered from above the ACF 230 to attach the ACF 230 to the substrate 200, the ACF 230 may be displaced from the attaching head 22 in the width direction of the ACF 230 while the attaching head 22 is being lowered. can be suppressed. As described above, according to the ACF applying apparatus 100, the ACF 230 is prevented from being displaced from the applying head 22, so that the ACF 230 can be adhered to the substrate 200 with high positional accuracy.

Further, for example, the substrate moving unit 28 positions the substrate 200 between the substrate lower receiving unit 26 and the ACF 230 supplied from the ACF supply unit 24, and then lifts the substrate 200 toward the ACF 230 until it contacts the ACF 230. Let

Such a configuration further reduces the amount of movement of the application head 22 between contact with the ACF 230 (specifically, the tape member 232 ) and application of the ACF 230 to the substrate 200 . Therefore, the ACF 230 can be attached to the substrate 200 with even better positional accuracy.

Further, for example, the substrate moving unit 28 positions the substrate 200 at the first height 240 between the substrate lower receiving unit 26 and the ACF 230 supplied from the ACF supply unit 24, and then moves the substrate 200 to the ACF supply unit 24. is raised to the second height 241 toward the ACF 230 supplied from .

According to such a configuration, after the board moving section 28 positions the board 200 between the board lower receiving section 26 and the ACF 230 , the board 200 is brought closer to the ACF 230 . For this reason, for example, even if there is a manufacturing error in the thickness of the substrate 200 or the like, by providing a wide width between the substrate lower receiving portion 26 and the ACF 230 in advance, the substrate 200 can be reliably positioned between the substrate lower supporting portion 26 and the ACF 230 . It can be reliably positioned between the ACF 230 and the amount of movement of the attaching head 22 from contacting the ACF 230 (specifically, the tape member 232) to attaching the ACF 230 to the substrate 200 is reduced. can.

Further, for example, the substrate moving unit 28 moves the substrate 200 to the first height 240 without moving up and down before positioning the substrate 200 between the substrate lower receiving unit 26 and the ACF 230 supplied from the ACF supply unit 24 . position. For example, the board moving section 28 moves to the first height 240, which is a position where the board mark (not shown) attached to the board 200 is imaged by the recognition camera (not shown) provided in the ACF applying apparatus 100. After taking an image by the recognition camera, the substrate 200 is positioned between the substrate lower receiving portion 26 and the ACF 230 supplied from the ACF supply portion 24 without moving up and down.

According to such a configuration, the substrate moving unit 28 can supply the substrate 200 from the substrate lower receiving unit 26 and the ACF supply unit 24 without moving the substrate holding unit 21 up and down, for example, after the image is captured by the recognition camera. It can be located at a first height 240 between the ACF 230 . Further, for example, the ACF applying apparatus 100 raises the substrate 200 to the first height 240 and raises the lower substrate receiving portion 26 to match the position of the substrate 200 . On the other hand, according to the ACF applying apparatus 100, the substrate 200 is positioned between the substrate lower receiving portion 26 and the ACF 230 supplied from the ACF supplying portion 24, for example, after the substrate 200 is imaged by the recognition camera. Do not go up or down until As a result, for example, the substrate moving unit 28 positions the substrate 200 between the substrate lower receiving unit 26 and the ACF 230 supplied from the ACF supply unit 24 and then moves up and down to position the substrate 200 at the first height 240 . Compared to the case where the ACF 230 is attached, the operation time required for attaching the ACF 230 can be reduced, and the productivity can be improved.

Further, for example, the ACF applying apparatus 100 further includes a first mode in which the ACF 230 is applied to the substrate 200 at a third height 242 that is lower than the first height 240 , and a first mode in which the ACF 230 is applied to the substrate 200 at a second height 241 . A control unit 120 is provided for switching between a second mode in which the ACF 230 is attached to the . Here, the third height 242 is such that the substrate 200 is supported on the lower substrate receiving portion 26 at the position of the lower substrate receiving portion 26 in FIG. can be any height.

According to such a configuration, it is possible to switch between a first mode in which the ACF 230 is attached to the substrate 200 at the third height 242 and a second mode in which the ACF 230 is attached to the substrate 200 at the second height 241. Therefore, the ACF 230 can be attached to the substrate 200 with good positional accuracy according to the size of the ACF 230, so convenience can be improved. In particular, if the third height 242 is a height at which the substrate 200 can be supported without raising the substrate lower receiving portion 26, the operation time can be reduced because the lower substrate receiving portion 26 does not need to be raised. , can improve productivity.

Further, the ACF applying method according to the embodiment includes a lower receiving step of lowering the substrate 200 on the lower substrate supporting portion 26 and an ACF supplying step of supplying the ACF 230 from the ACF supplying portion 24 above the lower substrate supporting portion 26 . and an attaching step of attaching the ACF 230 to the substrate 200 by pressing the ACF 230 against the substrate 200 that is supported by the substrate lower receiving portion 26 with the attaching head 22 . In the lower receiving step, the substrate 200 is positioned between the substrate lower receiving portion 26 and the ACF 230 supplied from the ACF supply portion 24, the substrate 200 is raised toward the ACF 230 supplied from the ACF supply portion 24, and the substrate The substrate 200 is supported on the substrate lower receiving portion 26 by raising the lower substrate receiving portion 26 toward the substrate 200 and bringing the substrate lower receiving portion 26 into contact with the substrate 200 .

According to such a method, the substrate 200 approaches the ACF 230 before the ACF 230 is applied by the substrate mover 28 . As a result, the amount of movement of the attaching head 22 from contacting the ACF 230 (specifically, the tape member 232 ) to attaching the ACF 230 to the substrate 200 is reduced by the amount that the substrate 200 approaches the ACF 230 . Therefore, when the attaching head 22 is lowered from above the ACF 230 to attach the ACF 230 to the substrate 200, the ACF 230 can be prevented from being displaced from the attaching head 22 while the attaching head 22 is being lowered. As described above, according to the ACF attaching method according to the present embodiment, the ACF 230 is prevented from being displaced from the attaching head 22, so that the ACF 230 can be attached to the substrate 200 with high positional accuracy.

(Other embodiments)
As described above, the ACF applying device and the like according to the present embodiment have been described based on the above embodiment, but the present invention is not limited to the above embodiment.

For example, in the above embodiment, all or part of the components of the computer 110 may be configured with dedicated hardware, or may be realized by executing software programs suitable for each component. good. Each component may be implemented by a program execution unit such as a CPU or processor reading and executing a software program recorded in a recording medium such as a hard disk drive (HDD) or semiconductor memory.

Also, the components of computer 110 may consist of one or more electronic circuits. Each of the one or more electronic circuits may be a general-purpose circuit or a dedicated circuit.

One or more electronic circuits may include, for example, a semiconductor device, an IC, or an LSI (Large Scale Integration). An IC or LSI may be integrated on one chip or may be integrated on a plurality of chips. Although they are called ICs or LSIs here, they may be called system LSIs, VLSIs (Very Large Scale Integration), or ULSIs (Ultra Large Scale Integration) depending on the degree of integration. An FPGA (Field Programmable Gate Array) that is programmed after the LSI is manufactured can also be used for the same purpose.

In addition, it can be realized by applying various modifications to each embodiment that a person skilled in the art can think of, or by arbitrarily combining the constituent elements and functions of each embodiment without departing from the spirit of the present invention. Forms are also included in the present invention.

INDUSTRIAL APPLICABILITY The ACF applying device according to the present invention can be used as an ACF applying device for applying an ACF to a substrate, which is provided in a component mounting device or the like for producing a display panel.

REFERENCE SIGNS LIST 1 component mounting apparatus 10 substrate loading unit 11, 31, 41, 51 stage 20 pasting unit 21 substrate holding unit 22 pasting head 23 cutting unit 24 ACF supply unit 25 peeling unit 26 substrate lower receiving unit 27 lifting unit 28 substrate moving unit 29 Head driving unit 30 Temporary pressure bonding unit 32 Temporary pressure bonding tool 40 Main pressure bonding unit 42 Pressure bonding tool 50 Substrate unloading unit 60 Substrate transfer device 100 ACF bonding device 110 Computer 120 Control unit 130 Storage unit 200 Substrate 201 Upper substrate 202 Lower substrate 210 Electrode unit 220 Parts 230 ACF
231 Separator 232 Tape member 240 First height 241 Second height 242 Third height

Claims (6)

a substrate holder that holds the substrate;
a substrate under-receiving portion for under-receiving the substrate;
a substrate moving unit that moves the substrate holding unit to move the substrate held by the substrate holding unit;
an ACF supply unit for supplying ACF (Anisotropic Conductive Film) above the substrate lower receiving unit;
a sticking head for sticking the ACF supplied from the ACF supply unit onto the substrate under-supported by the substrate under-supporting unit;
an elevating unit that elevates the substrate lower receiving unit;
The substrate moving unit positions the substrate between the substrate lower receiving unit and the ACF supplied from the ACF supply unit, and then raises the substrate toward the ACF,
The elevating unit raises the substrate lower receiving portion toward the substrate to bring the substrate lower receiving portion into contact with the substrate, thereby lowering the substrate on the substrate lower receiving portion. The substrate moving unit positions the substrate between the substrate lower receiving unit and the ACF supplied from the ACF supply unit, and then raises the substrate toward the ACF until it comes into contact with the ACF. The ACF applying device according to claim 1. The substrate moving unit positions the substrate at a first height between the substrate lower receiving unit and the ACF supplied from the ACF supply unit, and then moves the substrate to the position where the substrate is supplied from the ACF supply unit. The ACF applying device according to claim 1, wherein the ACF side is raised to a second height. The substrate moving unit positions the substrate at the first height without moving up and down before positioning the substrate between the substrate lower receiving unit and the ACF supplied from the ACF supply unit. 4. The ACF applying device according to 3. moreover,
a first mode in which the ACF is attached to the substrate at a third height that is lower than the first height;
5. The ACF applying apparatus according to claim 3, further comprising a control unit that controls switchably between a second mode in which the ACF is applied to the substrate at the second height. a lower receiving step of lowering the substrate on the substrate lower receiving portion;
an ACF supply step of supplying an ACF (Anisotropic Conductive Film) from an ACF supply unit above the substrate lower receiving unit;
an attaching step of attaching the ACF to the substrate by pressing the ACF against the substrate supported by the substrate lower receiving portion using an attaching head;
In the lower receiving step, the substrate is positioned between the substrate lower receiving portion and the ACF supplied from the ACF supply portion, and the substrate is raised toward the ACF supplied from the ACF supply portion; An ACF attaching method, wherein the substrate is supported on the substrate lower receiving portion by raising the substrate lower receiving portion toward the substrate and bringing the substrate lower receiving portion into contact with the substrate.

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