JP2022101997A - Component crimping device and component crimping method - Google Patents

Abstract

To provide a component crimping device which can improve mounting accuracy.SOLUTION: A component crimping device 100 includes a substrate movement mechanism 31, a crimping tool 34, an imaging unit 39, an imaging movement mechanism 38 and a control unit 2a. The control unit 2a causes the imaging unit 39 to image an edge of a component 5, and after imaging the edge of the component 5, causes the imaging movement mechanism 38 to execute the movement of the imaging range of the imaging unit 39, and causes the imaging unit 39 to image a second alignment mark Mc of the component 5. Based on the imaging result of the edge of the component 5 and the second alignment mark Mc, the control unit generates and outputs related information indicative of the positional relationship between the edge of the component 5 and the second alignment mark Mc, causes the substrate movement mechanism 31 to execute the movement of a substrate 3, causes the imaging unit 39 to image a first alignment mark Mb of the substrate 3, and based on the imaging results of the first alignment mark Mb and the second alignment mark Mc, controls the crimping of the component 5 to the substrate 3.SELECTED DRAWING: Figure 4

Description

The present disclosure relates to a component crimping device for crimping a component to a substrate.

Conventionally, a component crimping device for crimping an electronic component (hereinafter, simply referred to as a “component”) to a substrate such as a liquid crystal panel has been provided as an electronic component mounting device (see Patent Document 1). This component crimping device is provided with a punching device for punching parts from a film carrier, and the punched parts are crimped to a liquid crystal panel while feeding the film carrier at a constant pitch. As a result, a mounting board, which is a board on which components are crimped, is produced.

Japanese Unexamined Patent Publication No. 7-106796

However, the component crimping device of Patent Document 1 has a problem that the mounting accuracy may be lowered.

Therefore, in the present disclosure, a component crimping device and the like capable of improving mounting accuracy are provided.

The component crimping device according to one aspect of the present disclosure holds a substrate moving mechanism that holds a substrate on which a first alignment mark is formed and moves the substrate, and a component on which a second alignment mark is formed. The control unit includes a crimping tool for crimping to the substrate, an image pickup unit for imaging a subject included in the image pickup range, an image pickup movement mechanism for moving the image pickup range of the image pickup unit, and a control unit. The imaging movement mechanism is made to move the imaging range so that the edge of the component held by the crimping tool fits within the imaging range, and the edge of the component included in the imaging range is used as the subject. When the image pickup unit is made to image and the second alignment mark is not included in the image pickup range, the image pickup is performed so that the second alignment mark is within the image pickup range after the edge edge of the component is imaged. The image pickup movement mechanism is made to move the range, the image pickup unit is made to image the second alignment mark included in the image pickup range as the subject, and the edge of the component and the second alignment mark are respectively. Based on the imaging result, the relationship information indicating the positional relationship between the edge of the component and the second alignment mark is generated and output, and the substrate is provided with the first alignment mark within the imaging range. The movement is executed by the substrate moving mechanism, the first alignment mark included in the imaging range is imaged by the imaging unit as the subject, and the first alignment mark and the second alignment mark are imaged respectively. Based on the result, the crimping of the component to the substrate by the substrate moving mechanism and the crimping tool is controlled.

It should be noted that these comprehensive or specific embodiments may be realized in a recording medium such as a system, method, integrated circuit, computer program or computer readable CD-ROM, and the system, method, integrated circuit, computer program. And may be realized by any combination of recording media. Further, the recording medium may be a non-temporary recording medium.

The component crimping device of the present disclosure can improve the mounting accuracy.

Further advantages and effects in one aspect of the present disclosure will be apparent from the specification and drawings. Such advantages and / or effects are provided by some embodiments and the features described in the specification and drawings, respectively, but not all are provided in order to obtain one or more identical features. No need.

FIG. 1 is a diagram showing a schematic configuration of a component mounting line according to an embodiment. FIG. 2 is a plan view of the component mounting line according to the embodiment. FIG. 3 is a diagram showing a computer and each component controlled by the computer provided in the component mounting line in the embodiment. FIG. 4 is a block diagram showing a configuration of a component crimping device according to an embodiment. FIG. 5 is a diagram showing an example of each of a tape member provided with a plurality of parts in the embodiment and a part of the substrate. FIG. 6 is a diagram showing a configuration example of a punched portion of the component supply portion according to the embodiment. FIG. 7 is a diagram showing a flow of parts supplied to the crimping tool from the parts supply unit to the crimping tool via the parts moving unit in the embodiment. FIG. 8 is a diagram showing an example of a procedure for crimping a component by a crimping tool and a stage of a substrate moving mechanism in the embodiment. FIG. 9 is a diagram showing an example of relationship information in the embodiment. FIG. 10 is a diagram showing an example of each of the first camera, the second camera, and the image pickup moving mechanism included in the image pickup unit in the embodiment. FIG. 11 is a diagram showing a state in which the first camera and the component are viewed from the X-axis direction when the component is imaged in the embodiment. FIG. 12A is a diagram showing an image pickup example of the first camera according to the embodiment. FIG. 12B is a diagram showing an imaging example of the second camera according to the embodiment. FIG. 13A is a diagram showing an example of imaging with the edge of a component as a subject in the embodiment. FIG. 13B is a diagram showing an example of imaging with the second alignment mark as a subject in the embodiment. FIG. 14A is a diagram showing another example of imaging with the edge of the component as a subject in the embodiment. FIG. 14B is a diagram showing another example of imaging with the second alignment mark as a subject in the embodiment. FIG. 15 is a flowchart showing an overall processing process of the component crimping device according to the embodiment. FIG. 16 is a flowchart showing details of the positional relationship specifying process in step S13 of FIG. FIG. 17 is a diagram for explaining the timing at which the imaging unit and the imaging range move in the embodiment. FIG. 18 is a diagram showing a configuration example of a part of the imaging movement mechanism in the modified example of the embodiment.

(Findings underlying this disclosure)
The present inventor has found that the following problems arise with respect to the component crimping apparatus of Patent Document 1 described in the column of "Background Technique".

With the recent narrowing of the frame of liquid crystal panels, it is required to improve the punching accuracy of parts. The punching accuracy is the accuracy of the state of the component including the position of the component punched from the film carrier. However, as in Patent Document 1, it is difficult to maintain the required accuracy only by the mechanical accuracy of the punching device. Further, if the punching device is provided with a sensor for confirming the punching state in order to maintain the punching accuracy, the punching device may become large in size. Therefore, if the camera used for aligning the component and the substrate is used as a sensor for confirming the punching state, it is possible to suppress the increase in size of the punching device. However, in that case, it may be necessary to move the camera in order to align the component with the board. As a result, due to the movement of the camera, the accuracy of alignment between the component and the board may not be sufficiently obtained, and the mounting accuracy may decrease.

In order to solve such a problem, the component crimping device according to one aspect of the present disclosure includes a substrate moving mechanism for holding the substrate on which the first alignment mark is formed and moving the substrate, and a second. A crimping tool that holds a component on which an alignment mark is formed and crimps it to the substrate, an imaging unit that captures a subject included in the imaging range, an imaging movement mechanism that moves the imaging range of the imaging unit, and a control unit. The control unit causes the image pickup moving mechanism to move the image pickup range so that the edge of the component held by the crimping tool fits within the image pickup range, and is included in the image pickup range. The image pickup unit is made to image the edge of the component as the subject, and if the second alignment mark is not included in the imaging range, the second alignment mark is imaged after the edge of the component is imaged. The image pickup movement mechanism is made to move the image pickup range so as to be within the image pickup range, and the image pickup unit is made to image the second alignment mark included in the image pickup range as the subject, and the edge of the component is used. Based on the imaging results of the second alignment mark, the relationship information indicating the positional relationship between the edge of the component and the second alignment mark is generated and output, and the first alignment mark is used. The substrate moving mechanism is made to move the substrate so as to be within the imaging range, and the image pickup unit is made to image the first alignment mark included in the imaging range as the subject, and the first alignment mark and the image are captured. Based on the imaging result of each of the second alignment marks, the crimping of the component to the substrate by the substrate moving mechanism and the crimping tool is controlled. For example, the component crimping device further includes a punching portion for sequentially punching each of the plurality of components from a tape member provided with the plurality of components, and the crimping tool provides a punching portion for the component punched by the punching portion. It may be held and crimped to the substrate.

As a result, it is not necessary to provide a sensor for confirming the punched state of the component in the punched portion, and it is possible to suppress an increase in the size of the punched portion. That is, in the component crimping device according to one aspect of the present disclosure, since the imaging unit can also be used as a sensor for confirming the punched state of the component, it is possible to suppress an increase in the size of the punched portion. Specifically, the image pickup unit is used to control the crimping of the component to the substrate by the substrate moving mechanism and the crimping tool. For example, the image pickup unit is used for imaging the first alignment mark and the second alignment mark for controlling the alignment between the component and the substrate. In the component crimping device according to one aspect of the present disclosure, the edge of the component is also imaged by such an image pickup unit, and the related information is generated and output, so that the image pickup section is used for confirming the punched state of the component. It can also be used as a sensor. Therefore, since it is not necessary to bother to provide a sensor for confirming the punched state of the component in the punched portion, it is possible to suppress an increase in the size of the punched portion.

Here, in order to confirm the punched state of the component, it is necessary to image the edge of the component and the second alignment mark, respectively, but if they cannot be imaged at the same time, the imaging range is moved. It is necessary to let them image them individually. In such a case, for example, when the second alignment mark is imaged first, the imaging range is moved after that, and the edge of the component is imaged, the alignment between the component and the substrate is performed next. In addition, the imaging range must be further moved to return to the original position. The alignment requires imaging of the first alignment mark, and the imaging of the first alignment mark and the imaging of the second alignment mark have an imaging range in order to ensure the accuracy of the alignment. It is desirable to be in the same position. However, even if the imaging range is returned to the original position, if the reproducibility of the position is insufficient, the accuracy of the alignment between the component and the substrate will be lowered.

Therefore, in the component crimping device according to one aspect of the present disclosure, when the edge of the component and the second alignment mark cannot be imaged at the same time, the edge of the component is imaged first, and then the second alignment mark is imaged. Alignment mark is imaged. As a result, the first alignment mark of the substrate is accommodated in the image pickup range by moving the substrate without moving the image pickup range when the second alignment mark is imaged, and the first alignment thereof. The mark can be imaged. Therefore, since the positions of the imaging ranges are the same in the imaging of the first alignment mark and the imaging of the second alignment mark, it is possible to sufficiently secure the accuracy of the alignment between the component and the substrate. That is, the mounting accuracy can be improved. As a result, it is possible to confirm the punched state of the component while suppressing the increase in size of the punched portion, and it is possible to improve the mounting accuracy.

Further, the control unit may further control the punching of parts from the tape member by the punching unit by outputting the related information.

As a result, the positional relationship between the edge of the component and the second alignment mark can be automatically kept constant, and the punching accuracy of the component can be easily improved.

Further, the control unit further generates the relational information indicating the distance between the edge of the component and the second alignment mark as the positional relationship, and the distance is within a predetermined allowable range. If not, it may be notified that a problem has occurred in the punched portion.

As a result, it is possible to urge the operator to inspect and repair the punched portion and improve the punching accuracy.

Further, the image pickup moving mechanism does not move the image pickup range of the image pickup unit from the time when the image pickup unit takes an image of the second alignment mark until the image pickup of the first alignment mark is performed. You may.

As a result, since the positions of the imaging ranges are the same for the imaging of the first alignment mark and the imaging of the second alignment mark, the accuracy of alignment between the component and the substrate can be sufficiently ensured. That is, the mounting accuracy can be improved.

Hereinafter, embodiments will be specifically described with reference to the drawings.

It should be noted that all of the embodiments described below are comprehensive or specific examples. Numerical values, shapes, materials, components, arrangement positions and connection forms of components, steps, order of steps, etc. shown in the following embodiments are examples, and are not intended to limit the present disclosure. Further, among the components in the following embodiments, the components not described in the independent claim indicating the highest level concept are described as arbitrary components. Further, each figure is a schematic view and is not necessarily exactly illustrated. Further, in each figure, the same components are designated by the same reference numerals. Further, in the following embodiments, expressions such as substantially the same are used. For example, substantially the same means not only that they are exactly the same, but also that they are substantially the same, that is, they include an error of, for example, a few percent. Further, substantially the same means that they are the same to the extent that the effects of the present disclosure can be achieved. The same applies to expressions using other "abbreviations".

(Embodiment)
[Outline configuration of component mounting line]
FIG. 1 is a diagram showing a schematic configuration of a component mounting line according to the present embodiment.

The component mounting line 1 in the present embodiment is a system for producing a mounting substrate by mounting the component 5 on a substrate 3 which is a display panel such as a liquid crystal panel or an organic EL (Electro-Luminescence) panel. The component 5 is an electronic component such as a drive circuit. Specifically, as shown in FIG. 1, the component mounting line 1 has a substrate carry-in portion 10, a sticking portion 20, a temporary crimp portion 30, a main crimp portion 40, and a substrate carry-out portion 50. The substrate carry-in portion 10, the sticking portion 20, the temporary crimping portion 30, the main crimping portion 40, and the substrate carry-out portion 50 are connected in this order.

The board loading unit 10 receives the rectangular board 3 carried in from the operator or another device on the upstream side. Then, the substrate 3 is carried out to the attachment portion 20 on the downstream side.

The attachment portion 20 receives the substrate 3 carried out from the substrate carry-in portion 10, and attaches an adhesive member to each of the plurality of electrode portions 4 on the peripheral edge of the substrate 3. Then, the substrate 3 to which the adhesive member is attached is carried out to the temporary crimping portion 30. Each of the plurality of electrode portions 4 is composed of, for example, a plurality of electrodes.

The temporary crimping portion 30 receives the substrate 3 carried out from the pasting portion 20, and mounts the component 5 on the portion to which the adhesive member of the substrate 3 is attached and crimps the substrate 3. Then, the substrate 3 to which the component 5 is crimped is carried out to the main crimping portion 40. The crimping performed by the temporary crimping portion 30 is also referred to as temporary crimping.

The main crimping portion 40 receives the substrate 3 carried out from the temporary crimping portion 30, and performs main crimping (also referred to as thermocompression bonding) to the component 5 temporarily crimped to the substrate 3. Then, the substrate 3 to which the main crimping is performed is carried out to the board carrying-out portion 50.

The board carry-out section 50 receives the board 3 carried out from the main crimping section 40. The substrate 3 received by the substrate carry-out unit 50 is carried out to the downstream side.

In this way, the component mounting line 1 executes the component mounting work of mounting the component 5 on each of the plurality of electrode portions 4 provided on the peripheral edge of the carried-in substrate 3, and the component 5 is mounted on the substrate 3. A certain mounting board is carried out from the board carry-out unit 50.

[Detailed configuration of component mounting line]
FIG. 2 is a plan view of the component mounting line 1 in the present embodiment. Specifically, FIG. 2 shows a configuration in which the component mounting line 1 is viewed from above. In the present embodiment, the transport direction of the substrate is referred to as the X-axis direction, the vertical direction is referred to as the Z-axis direction, and the directions perpendicular to the X-axis direction and the Z-axis direction, that is, the depth direction is referred to as the Y-axis direction. Further, the negative side and the positive side in the X-axis direction correspond to the upstream side and the downstream side in the transport direction of the substrate, respectively, and the negative side and the positive side in the Z-axis direction correspond to the lower side and the upper side in the vertical direction, respectively. , The negative side and the positive side in the Y-axis direction correspond to the front side and the back side in the depth direction, or the front side and the rear side, respectively.

The board carrying-in unit 10 includes a base 1a on which the board 3 to be carried in is placed. A stage 11 on which the substrate 3 is placed is provided on the base 1a of the substrate carry-in portion 10. The stage 11 moves up and down in the Z-axis direction with respect to the base 1a. Further, a plurality of suction holes 11a are provided on the upper surface of the stage 11. Such a stage 11 holds the substrate 3 carried in from an operator or another device on the upstream side and placed on the stage 11 by vacuum suction from the suction hole 11a by a suction device such as a pump (not shown). ..

The sticking portion 20 has a function of performing a sticking operation (in other words, a sticking step) of sticking an ACF (Anisotropic Conductive Film) which is an adhesive member to the electrode portion 4 of the substrate 3. The ACF is also referred to as an anisotropic conductive adhesive, and is a member for electrically conducting the electrode portion 4 of the substrate 3 and the component 5. The sticking portion 20 includes a substrate moving mechanism 21 and a sticking mechanism 22.

The board moving mechanism 21 is a mechanism for moving the board 3. The substrate moving mechanism 21 includes, for example, an X-axis table movable in the X-axis direction, a Y-axis table movable in the Y-axis direction, a Z-axis table movable in the Z-axis direction, and a stage 23. The substrate moving mechanism 21 is provided with an X-axis table, a Y-axis table, a Z-axis table, and a stage 23 in order from the bottom on the base 1b.

The Y-axis table is provided so as to extend in the Y-axis direction, and freely moves on the X-axis table in the X-axis direction. The Z-axis table freely moves on the Y-axis table in the Y-axis direction, and the stage 23 provided on the upper part is moved up and down in the Z-axis direction and rotated around the Z-axis.

Further, a plurality of suction holes 23a are provided on the upper surface of the stage 23, and the stage 23 vacuum sucks and holds the substrate 3 placed on the upper surface thereof. In this way, the substrate moving mechanism 21 sucks and holds the substrate 3 and moves it in the horizontal plane (specifically, the X-axis direction and the Y-axis direction), and moves it in the vertical direction (specifically, the Z-axis direction). It is moved up and down and rotated around the Z axis.

The sticking mechanism 22 includes, for example, two sticking heads arranged in the X-axis direction above the base 1b. Each sticking head includes a supply unit for supplying the ACF and a sticking tool for sticking the ACF to the substrate 3. ACF is attached to each of the two attachment heads at positions corresponding to the plurality of electrode portions 4 on the substrate 3. Further, a sticking support base is provided at a lower position corresponding to each of the two sticking heads.

The temporary crimping portion 30 executes a temporary crimping step in which the component 5 is mounted on the region (that is, the crimping target portion) to which the ACF of the substrate 3 is attached and temporarily crimped. The temporary crimping portion 30 includes a substrate moving mechanism 31, a component mounting mechanism 32, a component supply section 33, and a component moving section 35.

The substrate moving mechanism 31 has the same structure as the substrate moving mechanism 21 of the sticking portion 20. Specifically, the substrate moving mechanism 31 has a stage 37 for holding the substrate 3. A plurality of suction holes 37a are provided on the upper surface of the stage 37. The substrate moving mechanism 31 vacuum-sucks and holds the substrate 3 placed on the stage 37 by the plurality of suction holes 37a. Further, the substrate moving mechanism 31 has a function of moving the stage 37 that sucks and holds the substrate 3 in a horizontal plane, raises and lowers it in the vertical direction, and rotates it around the Z axis. The substrate moving mechanism 31 positions the region to which the ACF of the substrate 3 attracted and held by the movement and rotation of the stage 37 is attached above the lower receiving portion 36 which is the backup stage of the component mounting mechanism 32. .. Further, a first alignment mark, which will be described later, is formed on the substrate 3. That is, the substrate moving mechanism 31 in the present embodiment holds the substrate 3 on which the first alignment mark is formed and moves the substrate 3.

The component supply unit 33 is provided so as to project from the rear portion of the base 1b on the back side (that is, the positive side in the Y-axis direction) of the component mounting mechanism 32. For example, the component supply unit 33 includes a supply reel 33a around which a tape member such as TCP (Tape carrier package) is wound, a punching unit 33b, a movable stage 33c, and a rail 33d. Such a component supply unit 33 sequentially supplies the component 5 from the tape member by the movement of those components.

The component moving unit 35 holds the component 5 supplied from the component supply unit 33 and moves it to the crimping tool 34 side included in the component mounting mechanism 32.

The component mounting mechanism 32 is provided on the base 1b and includes a crimping tool 34 and a lower receiving portion 36.

The lower receiving portion 36 supports the crimping target portion, which is a predetermined portion of the substrate 3 held on the stage 37, from below. The crimping target portion is a portion where the ACF is attached at the edge portion of the substrate 3. That is, the lower receiving portion 36 supports the edge portion of the substrate 3 to which the component 5 is crimped from the lower side of the substrate 3.

The crimping tool 34 holds the component 5 and crimps the component 5 to the substrate 3 held on the stage 37. A second alignment mark, which will be described later, is formed on the component 5. That is, the crimping tool 34 in the present embodiment holds the component 5 on which the second alignment mark is formed and crimps it to the substrate 3. Specifically, the crimping tool 34 moves up and down in the Z-axis direction, and sucks (that is, picks up) the component 5 moved by the component moving portion 35 from above. Then, the crimping tool 34 temporarily crimps the component 5 to the substrate 3 by mounting the adsorbed component 5 on the ACF and pressing the substrate 3 together with the lower receiving portion 36. For example, the crimping tool 34 crimps the component 5 to the substrate 3 in a state of being heated to about 80 ° C. The temporary crimping portion 30 may include a mechanism for rotating the direction of the substrate 3 held by the substrate moving mechanism 31 by 90 degrees.

The main crimping portion 40 executes a main crimping step (that is, a thermocompression bonding step) of main crimping (that is, thermocompression bonding) the component 5 temporarily crimped to the substrate 3 by the temporary crimping portion 30 to the substrate 3. By doing so, the electrode portion 4 formed on the substrate 3 and the component 5 are electrically connected via the ACF. Such a crimping portion 40 includes a substrate moving mechanism 41 and a crimping mechanism 42.

The substrate moving mechanism 41 has the same structure as the substrate moving mechanism 21 of the sticking portion 20. Specifically, the substrate moving mechanism 41 has a stage 49. A plurality of suction holes 49a are provided on the upper surface of the stage 49. The substrate moving mechanism 41 vacuum-sucks and holds the substrate 3 placed on the stage 49 by the plurality of suction holes 49a. Further, the substrate moving mechanism 41 has a function of moving the stage 49 that attracts and holds the substrate 3 in a horizontal plane, raises and lowers it in the vertical direction, and rotates it around the Z axis. The substrate moving mechanism 41 positions a region where the component 5 of the substrate 3 sucked and held is temporarily crimped by the movement and rotation of the stage 49 above the lower receiving portion 46 of the crimping mechanism 42.

The crimping mechanism 42 is provided on the base 1b and includes a crimping tool 43 and a lower receiving portion 46.

The crimping tool 43 is heated and presses the component 5 of the substrate 3 supported by the lower receiving portion 46 toward the lower receiving portion 46. For example, the crimping tool 43 presses the component 5 in a state of being heated to about 200 ° C. As a result, the component 5 is finally crimped, and the electrode portion 4 formed on the substrate 3 and the component 5 are electrically connected via the ACF.

The substrate carry-out portion 50 has a function of vacuum-sucking and holding the substrate 3 conveyed from the main crimping portion 40 on the stage 51. The board 3 held by the board unloading unit 50 is carried out to another device on the downstream side, or is taken out from the stage 51 by an operator.

The stage 51 moves up and down in the Z-axis direction with respect to the base 1c. Further, a plurality of suction holes 51a are provided on the upper surface of the stage 51, and the stage 51 vacuum sucks and holds the substrate 3 transferred from the crimping portion 40 on the upper surface thereof.

The transport unit 60 is a device that transports the substrate 3. Specifically, the transport unit 60 delivers the substrate 3 carried into the substrate carry-in section 10 to the sticking section 20, the temporary crimp section 30, the main crimp section 40, and the board carry-out section 50 in this order (transfer). It has a function. The transport portion 60 is arranged in the front region (that is, the negative side in the Y-axis direction) of the sticking portion 20, the temporary crimping portion 30, and the main crimping portion 40.

The transfer unit 60 is arranged in order from the upstream side on the base 1a, the base 1b, and the moving base 61 extending in the X-axis direction over the base 1c. It includes a substrate transfer mechanism 62C and a substrate transfer mechanism 62D.

The substrate transfer mechanisms 62A to 62D include a base 63 and one or more arm units 64, respectively. In this embodiment, the case where the substrate transport mechanisms 62A to 62D each include two arm units 64 is illustrated.

The base 63 is provided on the movement base 61 and freely moves in the X-axis direction. Two arm units 64 are provided side by side in the X-axis direction on the base portion 63. The arm unit 64 vacuum-sucks the substrate 3 from above.

Each of the substrate transfer mechanisms 62A to 62D moves the substrate 3 held by the stages 11, 23, 37, 49, 51 to the substrate transfer position where the substrate 3 is vacuum-adsorbed from above, and moves up and down the stages 11, 23, 37, 49, respectively. The substrate 3 is received or delivered from 51. For example, the substrate transfer mechanism 62A receives the substrate 3 mounted on the stage 11 of the substrate carry-in portion 10 and delivers it to the stage 23 of the attachment portion 20. Further, for example, the substrate transfer mechanism 62B receives the substrate 3 from the stage 23 of the sticking portion 20 and delivers it to the stage 37 of the temporary crimping portion 30. Further, for example, the substrate transfer mechanism 62C receives the substrate 3 from the stage 37 of the temporary crimping portion 30 and delivers it to the stage 49 of the main crimping portion 40. Further, for example, the substrate transfer mechanism 62D receives the substrate 3 from the stage 49 of the main crimping portion 40 and delivers it to the stage 51 of the substrate carry-out portion 50.

FIG. 3 is a diagram showing a computer provided in the component mounting line 1 and each component controlled by the computer.

The component mounting line 1 includes a computer 2 as shown in FIG. The computer 2 is communicably connected to, for example, a sticking portion 20, a temporary crimping portion 30, a main crimping portion 40, a transporting portion 60, and the like by a control line, and controls each of these portions. The computer 2 includes a control unit 2a, a storage unit 2b, and a display unit 2c.

The display unit 2c displays an image, characters, and the like, and is composed of, for example, a liquid crystal display, a plasma display, an organic EL (Electro-Luminescence) display, and the like. The display unit 2c is not limited to these displays.

The storage unit 2b contains various data necessary for component mounting work such as the size of the board 3, the type of the component 5 mounted on the board 3, the mounting position, the mounting direction, and the timing of transferring the board 3, and the control unit 2a. Stores the control program etc. executed by. The storage unit 2b is realized by, for example, a ROM (Read Only Memory) or a RAM (Random Access Memory).

The control unit 2a controls the board moving mechanism 21 of the sticking part 20, the board moving mechanism 31 of the temporary crimping part 30, the board moving mechanism 41 of the main crimping part 40, and the transporting part 60, and transfers the board 3 between the parts. Perform the board transfer work to transfer to the next process. The transfer of the substrate 3 from the upstream side to the downstream side in the substrate transfer work is performed synchronously between the parts.

For example, the control unit 2a changes the orientation and position of the substrate 3 held by the substrate moving mechanism 21 by controlling the sticking unit 20, and changes the spacing between the plurality of sticking heads by the head moving motor. The sticking unit 20 is made to perform the sticking work of sticking the ACF to the substrate 3 by the sticking mechanism 22.

Further, for example, the control unit 2a controls the temporary crimping unit 30. That is, the control unit 2a changes the direction and position of the substrate 3 held by the substrate moving mechanism 31, and causes the component mounting mechanism 32 to temporarily crimp the component 5 to the substrate 3. At this time, the control unit 2a may correct or change the position of the substrate 3 according to the result of imaging by the image pickup unit 39 provided in the temporary crimping portion 30. The imaging range of the imaging unit 39 is moved by the imaging moving mechanism 38. Further, the control unit 2a moves the component 5 supplied from the component supply unit 33 to the component mounting mechanism 32 side by controlling the component supply unit 33 and the component movement unit 35.

Further, for example, the control unit 2a changes the direction and position of the substrate 3 held by the substrate moving mechanism 41 by controlling the main crimping portion 40, and the component 5 temporarily crimped to the substrate 3 is crimped by the crimping mechanism 42. This is crimped.

Further, the control unit 2a displays an image, characters, and the like on the display unit 2c by controlling the display unit 2c.

Such a control unit 2a is, for example, a control program stored in the storage unit 2b for controlling each unit and each mechanism of the component mounting line 1, and a CPU (Central Processing Unit) that executes the control program. It is realized by a processor such as.

[Structure of parts crimping device]
FIG. 4 is a block diagram showing the configuration of the component crimping device 100 according to the present embodiment.

The component crimping device 100 includes a temporary crimping portion 30 in the component mounting line 1 and a control unit 2a of the computer 2.

Specifically, the component crimping device 100 includes a control unit 2a, a component supply unit 33, a component moving unit 35, a crimping tool 34, a lower receiving unit 36, a substrate moving mechanism 31, and an image pickup moving mechanism 38. , A first camera 39L and a second camera 39R.

The image pickup unit 39 described above includes the first camera 39L and the second camera 39R. Each of the first camera 39L and the second camera 39R captures a subject included in the imaging range. The image pickup moving mechanism 38 moves the respective image pickup ranges of the first camera 39L and the second camera 39R. The image pickup moving mechanism 38 adjusts the distance between the image pickup ranges of the first camera 39L and the second camera 39R by moving the respective image pickup ranges. Further, the image pickup moving mechanism 38 moves the respective image pickup ranges of the first camera 39L and the second camera 39R along the Y-axis direction. The distance between these imaging ranges is also referred to as an optical system pitch or a camera pitch. For example, the image pickup moving mechanism 38 in the present embodiment moves the first camera 39L and the second camera 39R to move their image pickup ranges.

The control unit 2a controls the substrate moving mechanism 31, the component supply unit 33, the crimping tool 34, the component moving unit 35, the image pickup moving mechanism 38, and the first camera 39L and the second camera 39R.

[Supply of parts]
FIG. 5 is a diagram showing an example of each of a tape member provided with a plurality of parts 5 and a part of the substrate 3.

As shown in FIG. 5A, the tape member 70 includes a plurality of parts 5. These plurality of parts 5 are arranged along the longitudinal direction of the tape member 70, and are provided at positions separated from each other by a predetermined distance. Such a tape member 70 is a member in which a plurality of parts 5 are mounted on a flexible resin film, and is also called a film carrier. For example, the tape member 70 is TCP. From this tape member 70, TCP or COF (Chip on Film) in a piece state is punched out as a component 5. A plurality of sprocket holes 71 arranged in a row along the longitudinal direction of the tape member 70 are formed at both ends of the tape member 70 in the width direction.

The component 5 is formed with an electrode portion 6 composed of a plurality of electrodes and a pair of second alignment marks Mc. The material constituting the component 5 is not particularly limited, but is, for example, a resin such as polyimide.

Each electrode included in the electrode portion 6 is a conductive member such as metal provided on the surface of the component 5. The plurality of electrodes are arranged side by side along the width direction of the tape member 70, for example.

Each of the pair of second alignment marks Mc is a mark for acquiring the positional relationship between the substrate 3 and the component 5. For example, each of the pair of second alignment marks Mc is a cross-shaped mark, and is arranged so as to sandwich the electrode portion 6 along the width direction of the tape member 70.

As shown in FIG. 5B, the substrate 3 is formed with an electrode portion 4 composed of a plurality of electrodes and a pair of first alignment marks Mb. Each electrode included in the electrode portion 4 is a conductive member such as a metal provided on the surface of the substrate 3. The plurality of electrodes are arranged side by side along the X-axis direction, for example.

Each of the pair of first alignment marks Mb is a mark for acquiring the positional relationship between the substrate 3 and the component 5. For example, each of the pair of first alignment marks Mb is a cross-shaped mark and is arranged so as to sandwich the electrode portion 4 along the X-axis direction. Further, the above-mentioned ACF 91 is attached to the electrode portion 4.

FIG. 6 is a diagram showing a configuration example of a punched portion 33b of the component supply portion 33. The punching portion 33b sequentially punches a plurality of parts 5 from the tape member 70 while feeding the tape member 70 at a constant pitch. For example, the punching portion 33b includes a sprocket 331 that engages with a sprocket hole 71 provided in the tape member 70, a motor 332 that rotationally drives the sprocket 331, and a punch 333 and a die 334 that punch out a component 5 from the tape member 70. I have. The motor 332 is controlled by the control unit 2a, and the sprocket 331 is rotationally driven to feed the tape member 70 at a constant pitch. The motor 332 can finely adjust the feed amount of the tape member 70. The component 5 punched from the tape member 70 by the punched portion 33b is placed on the movable stage 33c.

FIG. 7 is a diagram showing the flow of the component 5 supplied from the component supply unit 33 to the crimping tool 34 via the component moving unit 35.

The component supply unit 33 includes a punching unit 33b, a supply reel 33a, a cover tape collection unit 336, a winding unit 335, a movable stage 33c, and a rail 33d.

A tape member 70 is wound around the supply reel 33a. The tip end side of the tape member 70 is pulled out from the supply reel 33a by the punching portion 33b without sagging. The cover tape collecting unit 336 collects the cover tape 72 peeled off from the tape member 70. The winding unit 335 winds up and collects the remaining portion of the tape member 70. The remaining portion of the tape member 70 is the remaining portion where the cover tape 72 is peeled off from the tape member 70 and the component 5 is punched out. The movable stage 33c receives and holds the component 5 punched by the punched portion 33b from the punched portion 33b, and moves along the rail 33d.

The component moving unit 35 includes a transfer head 35a and a transfer stage 35b. The transfer head 35a receives the component 5 held by the movable stage 33c that has moved along the rail 33d from the movable stage 33c. Then, the transfer head 35a moves to the crimping tool 34 side while sucking and holding the component 5. The transfer stage 35b receives the component 5 that is attracted and held by the transfer head 35a from the transfer head 35a that has moved to the crimping tool 34 side. The transfer stage 35b that has received the component 5 moves to the lower part of the crimping tool 34.

The crimping tool 34 sucks and holds the component 5 mounted on the transfer stage 35b. Here, the image pickup unit 39 including the first camera 39L and the second camera 39R described above captures the component 5 held by the crimping tool 34 via the lower receiving portion 36. Further, the image pickup unit 39 takes an image of the edge portion of the substrate 3 held by the stage 37 of the substrate movement mechanism 31 via the lower receiving portion 36 thereof. The stage 37 aligns the component 5 with the substrate 3 based on the results of imaging of the edges of the component 5 and the substrate 3. Then, the crimping tool 34 crimps the component 5 to the aligned substrate 3.

As described above, the component supply unit 33 of the component crimping device 100 according to the present embodiment includes a punching unit 33b for sequentially punching each of the plurality of components 5 from the tape member 70 provided with the plurality of components 5. Then, the crimping tool 34 holds the component 5 punched by the punched portion 33b and crimps it to the substrate 3.

[Crimping of parts]
FIG. 8 is a diagram showing an example of a procedure for crimping a component 5 by a crimping tool 34 and a stage 37 of a substrate moving mechanism 31.

First, as shown in FIG. 8A, the transfer stage 35b conveys the component 5 to the crimping tool 34 and the lower receiving portion 36 side. Next, as shown in FIG. 8B, the transfer stage 35b stops below the crimping tool 34, that is, between the crimping tool 34 and the lower receiving portion 36. Next, as shown in FIG. 8 (c), the crimping tool 34 descends to hold the component 5. As a result, the component 5 is delivered from the transfer stage 35b to the crimping tool 34. Then, as shown in FIG. 8D, the crimping tool 34 rises while holding the component 5.

Next, as shown in FIG. 8 (e), the transfer stage 35b to which the component 5 has been delivered is retracted from below the crimping tool 34. Then, as shown in FIG. 8 (f), the image pickup unit 39 takes an image of the component 5. In this imaging, the edge of the component 5 and the second alignment mark Mc are imaged. The image pickup result is used for confirming the punching accuracy of the component 5 by the punching portion 33b. Further, the image pickup result of the second alignment mark Mc is used for the alignment between the component 5 and the substrate 3. The crimping tool 34 may lower the component 5 to or near the focal position of the imaging unit 39. Further, the image pickup unit 39 may change the focal position. Next, as shown in FIG. 8 (g), when the crimping tool 34 is lowered, the crimping tool 34 is raised and the stage 37 holding the substrate 3 is moved. As shown in FIG. 8 (h), when the edge of the substrate 3 reaches the lower part of the crimping tool 34 due to the movement of the stage 37, the stage 37 is lowered. As a result, the edge portion of the substrate 3 is supported from below by the lower receiving portion 36. At this time, the image pickup unit 39 takes an image of the first alignment mark Mb formed on the substrate 3. Then, the stage 37 adjusts the position of the substrate 3 based on the imaging results of the first alignment mark Mb and the second alignment mark Mc. That is, the alignment between the component 5 and the substrate 3 is performed.

Next, as shown in FIG. 8 (i), the crimping tool 34 starts descending to mount the component 5 on the edge of the substrate 3. Then, as shown in FIG. 8 (j), the crimping tool 34 presses the component 5 against the edge portion of the substrate 3. As a result, the component 5 is temporarily crimped to the substrate 3, and the electrode portion 6 of the component 5 is electrically conductive with the electrode portion 4 of the substrate 3 by the ACF 91 attached to the substrate 3. After that, as shown in FIG. 8 (k), the crimping tool 34 is raised, and the substrate 3 to which the component 5 is temporarily crimped is carried out by moving the stage 37.

[Relationship information]
The control unit 2a in the present embodiment generates and outputs related information indicating the punching accuracy of the component 5 based on the image pickup result of the component 5 by the imaging unit 39 in the situation shown in FIG. 8 (f).

FIG. 9 is a diagram showing an example of related information.

The relationship information is the positional relationship between the second alignment mark Mc and the edge of the component 5 around the second alignment mark Mc for each of the pair of second alignment marks Mc. Shown as punching accuracy. Specifically, the relationship information indicates the distance between the edge of the component 5 and the second alignment mark Mc as a positional relationship. More specifically, the relational information includes the distance XL and the distance YL for the second alignment mark Mc on the positive side in the X-axis direction and the distance XR and the distance YR for the second alignment mark Mc on the negative side in the X-axis direction. And.

The distance XL is the distance between the second alignment mark Mc on the positive side in the X-axis direction and the cut line of the component 5 along the Y-axis direction closest to the second alignment mark Mc. The distance YL is the distance between the second alignment mark Mc on the positive side in the X-axis direction and the cut line of the component 5 along the X-axis direction closest to the second alignment mark Mc.

The cut line is one side of the part 5 generated by punching the part 5 by the punching portion 33b. Further, the edge of the component 5 around the second alignment mark Mc on the positive side in the X-axis direction is on the negative side in the Y-axis direction and on the cut line along the X-axis direction and on the positive side in the X-axis direction. It consists of a cut line along the Y-axis direction.

Similarly, the distance XR is the distance between the second alignment mark Mc on the negative side in the X-axis direction and the cut line of the component 5 along the Y-axis direction closest to the second alignment mark Mc. The distance YR is the distance between the second alignment mark Mc on the negative side in the X-axis direction and the cut line of the component 5 along the X-axis direction closest to the second alignment mark Mc. The edge of the component 5 around the second alignment mark Mc on the negative side in the X-axis direction is on the negative side in the Y-axis direction and on the cut line along the X-axis direction and on the negative side in the X-axis direction. It consists of a cut line along the Y-axis direction.

Such relationship information is fed back to, for example, the punching section 33b. That is, the control unit 2a in the present embodiment controls the punching of the component 5 from the tape member 70 by the punching unit 33b by outputting the related information.

For example, when the distance YL and the distance YR deviate from the reference distance, the punching portion 33b shifts the punching position of the component 5 in the longitudinal direction of the tape member 70 so that the distances approach the reference distance. Alternatively, the punching portion 33b adjusts the punching interval of the component 5. Further, when one of the distance XL and the distance XR is shorter than the reference distance and the other is longer, the punching portion 33b tapes the punching position of the component 5 so that the distance approaches the reference distance. Shift the member 70 in the width direction.

[Details of imaging by the imaging unit]
FIG. 10 is a diagram showing an example of each of the first camera 39L and the second camera 39R and the image pickup moving mechanism 38 included in the image pickup unit 39 in the present embodiment.

The first camera 39L and the second camera 39R are arranged below the lower receiving portion 36 and take an image of the upper part in the Z-axis direction. Further, the first camera 39L and the second camera 39R are arranged in the X-axis direction.

The image pickup moving mechanism 38 moves the image pickup range thereof, for example, by moving each of the first camera 39L and the second camera 39R. The image pickup moving mechanism 38 changes the distance between the cameras, that is, the camera pitch, by moving each of the first camera 39L and the second camera 39R along the X-axis direction. Further, the image pickup moving mechanism 38 moves the first camera 39L and the second camera 39R along the Y-axis direction.

When the component 5 is imaged, the crimping tool 34 includes an electrode portion 6 composed of a plurality of electrodes formed on the component 5 and a pair of second alignment marks Mc arranged so as to sandwich the electrode portion 6. Is sucking and holding the component 5 in a state where the component 5 is directed downward. The pair of second alignment marks Mc are arranged so as to face the lower receiving portion 36.

The first camera 39L and the second camera 39R are located on the lower side of the pair of second alignment marks Mc of the component 5 and the two edges of the component 5 via the two penetrating portions h1 of the lower receiving portion 36. Take an image from. Each of the two penetrating portions h1 is, for example, a hole having an opening on the upper surface of the lower receiving portion 36 arranged along the X-axis direction, and penetrates the lower receiving portion 36 along the Z-axis direction. is doing. The first camera 39L has a second alignment mark Mc on the positive side in the X-axis direction of the component 5 and a component 5 around the second alignment mark Mc through the through portion h1 on the positive side in the X-axis direction. Image with the edge of. The second camera 39R has a second alignment mark Mc on the negative side in the X-axis direction of the component 5 and a component 5 around the second alignment mark Mc via the penetration portion h1 on the negative side in the X-axis direction. Image with the edge of. Although the penetration portion h1 in the present embodiment is a hole, it may be a groove recessed on the positive side in the Y-axis direction, or may be made of a member such as glass having translucency.

When the substrate 3 is imaged, the edge portion of the substrate 3 held by the stage 37 is arranged above the lower receiving portion 36. Further, on the upper surface of the edge portion, an electrode portion 4 composed of a plurality of electrodes and a pair of first alignment marks Mb arranged so as to sandwich the electrode portions 4 are formed. Further, ACF 91 is attached to the upper surface of the edge portion so as to cover the electrode portion 4.

The first camera 39L and the second camera 39R take an image of the pair of first alignment marks Mb of the substrate 3 from the lower side via the two penetrating portions h1 of the lower receiving portion 36. The portion of the substrate 3 on which the pair of first alignment marks Mb is formed has translucency. Therefore, the first alignment mark Mb formed on the upper surface of the substrate 3 is imaged through the translucent portion thereof. The first camera 39L captures the first alignment mark Mb on the positive side in the X-axis direction on the substrate 3 via the penetration portion h1 on the positive side in the X-axis direction. The second camera 39R captures the first alignment mark Mb on the negative side in the X-axis direction on the substrate 3 via the penetration portion h1 on the negative side in the X-axis direction.

FIG. 11 is a diagram showing a state in which the first camera 39L and the component 5 are viewed from the X-axis direction when the component 5 is imaged.

As shown in FIG. 11, the first camera 39L captures an image of the component 5 above the lower receiving portion 36 from the lower side of the lower receiving portion 36 via the penetrating portion h1 of the lower receiving portion 36. Similarly, the second camera 39R also takes an image of the component 5 via the penetrating portion h1 of the lower receiving portion 36.

12A and 12B are diagrams showing imaging examples of the first camera 39L and the second camera 39R, respectively.

In the example shown in FIGS. 12A (a) and 12A, the image pickup range DL of the first camera 39L has a second alignment mark Mc on the positive side in the X-axis direction of the component 5 and a second alignment mark thereof. It includes the edge of the component 5 around the Mc. In this case, the first camera 39L simultaneously captures the second alignment mark Mc and the edge of the component 5. By this imaging, imaging data which is an image in which the second alignment mark Mc and the edge of the component 5 are projected is generated. Then, the control unit 2a recognizes the position of the edge of the component 5 from the image pickup data as shown in FIG. 12A (a), and further recognizes the position of the edge of the component 5 as shown in FIG. 12A (b). Recognize the position of the alignment mark Mc.

Similarly, in the examples shown in FIGS. 12B (a) and 12B, the image pickup range DR of the second camera 39R includes the second alignment mark Mc on the negative side in the X-axis direction of the component 5 and its second alignment mark Mc. Includes the edge of the component 5 around the alignment mark Mc. In this case, the second camera 39R simultaneously captures the second alignment mark Mc and the edge of the component 5. By this imaging, imaging data which is an image in which the second alignment mark Mc and the edge of the component 5 are projected is generated. Then, the control unit 2a recognizes the position of the edge of the component 5 from the image pickup data as shown in FIG. 12B (a), and further recognizes the position of the edge of the component 5 as shown in FIG. 12B (b). Recognize the position of the alignment mark Mc.

Here, each of the imaging ranges DL and DR may not include both the second alignment mark Mc and the edge of the component 5. For example, when the distance between the edge of the component 5 and the second alignment mark Mc is long, both the second alignment mark Mc and the edge of the component 5 are included in each of the imaging ranges DL and DR. Can't. In such a case, the image pickup moving mechanism 38 in the present embodiment moves the image pickup range DL of the first camera 39L and the image pickup range DR of the second camera 39R. Then, the control unit 2a first causes the first camera 39L and the second camera 39R to image the two edges of the component 5, and then the pair of second alignment marks Mc is captured by the first camera 39L. And the second camera 39R is made to take an image.

FIG. 13A is a diagram showing an example of imaging with the edge of the component 5 as a subject. FIG. 13B is a diagram showing an example of imaging with the second alignment mark Mc as a subject.

As described above, it may not be possible to include both the second alignment mark Mc and the edge of the component 5 in the imaging range DL of the first camera 39L. In such a case, first, the control unit 2a controls the image pickup moving mechanism 38 so that the edge of the component 5 fits in the image pickup range DL as shown in FIG. 13A (a). Move the imaging range DL. Then, as shown in FIG. 13A (b), the control unit 2a causes the first camera 39L to take an image of the edge of the component 5 before taking an image of the second alignment mark Mc. As a result, the first camera 39L generates imaging data which is an image in which the edge of the component 5 is projected.

After the edge of the component 5 is imaged, the control unit 2a controls the image pickup moving mechanism 38 to move the image pickup range DL to the negative side in the X-axis direction as shown in FIG. 13B (a). As a result, the second alignment mark Mc of the component 5 is included in the imaging range DL. Then, as shown in FIG. 13B (b), the control unit 2a causes the first camera 39L to take an image of the second alignment mark Mc. As a result, the first camera 39L generates imaging data which is an image on which the second alignment mark Mc is projected.

The control unit 2a recognizes the position of the edge of the component 5 in the imaging range DL from the imaging data of the edge of the component 5 shown in FIG. 13A (b). Further, the control unit 2a recognizes the position of the second alignment mark Mc in the imaging range DL from the imaging data of the second alignment mark Mc shown in FIG. 13B (b). Then, the control unit 2a aligns the edge of the component 5 with the second alignment based on the position of the edge of the component 5, the position of the second alignment mark Mc, and the moving direction and the moving distance of the imaging range DL. Specify the positional relationship with the mark Mc. The control unit 2a generates relationship information (XL, YL) indicating the positional relationship.

The control unit 2a also executes the same processing as that related to imaging shown in FIGS. 13A and 13B for the imaging range DR of the second camera 39R. As a result, relationship information (XR, YR) is generated.

FIG. 14A is a diagram showing another example of imaging with the edge of the component 5 as a subject. FIG. 14B is a diagram showing another example of imaging with the second alignment mark Mc as a subject.

Similar to the example shown in FIG. 13A, when the imaging range DL cannot include both the second alignment mark Mc and the edge of the component 5, first, the control unit 2a is as shown in FIG. 14A (a). The edge of the component 5 is housed in the imaging range DL. Next, as shown in FIG. 14A (b), the control unit 2a causes the first camera 39L to image the edge of the component 5. As a result, the first camera 39L generates imaging data which is an image in which the edge of the component 5 is projected.

After the edge of the component 5 is imaged, the control unit 2a controls the image pickup moving mechanism 38 to move the image pickup range DL to the positive side in the Y-axis direction as shown in FIG. 14B (a). As a result, the second alignment mark Mc of the component 5 is included in the imaging range DL. Then, the control unit 2a causes the first camera 39L to take an image of the second alignment mark Mc as shown in FIG. 14B (b). As a result, the first camera 39L generates imaging data which is an image on which the second alignment mark Mc is projected.

[Processing flow of component crimping device]
FIG. 15 is a flowchart showing an overall processing process of the component crimping device 100 according to the present embodiment.

The punching section 33b included in the component supply section 33 of the component crimping device 100 executes a punching process for punching the component 5 from the tape member 70 (step S11). The punched-out part 5 is moved to the crimping tool 34 side by the part moving portion 35.

Next, the crimping tool 34 sucks and holds the component 5 supplied from the component supply unit 33 (step S12). Then, the control unit 2a causes the image pickup unit 39 to image the component 5 held by the crimping tool 34, and the positional relationship specifying process for specifying the positional relationship between the edge of the component 5 and the second alignment mark Mc. Is executed (step S13). In this step S13, the imaging data in which each of the pair of second alignment marks Mc formed on the component 5 is projected is generated by the imaging by the imaging unit 39 of the component 5.

Then, the control unit 2a determines whether or not the positional relationship is within the allowable range (step S14). Here, when the control unit 2a determines that the positional relationship is within the allowable range (Yes in step S14), the control unit 2a feeds back the positional relationship to the punching process (step S15). That is, the control unit 2a outputs the relational information indicating the positional relationship to the punching unit 33b of the component supply unit 33, whereby the punching position of the component 5 by the punching unit 33b is adjusted by the punching unit 33b.

Then, the control unit 2a receives the substrate 3 by controlling the substrate moving mechanism 31 without changing the positions of the image pickup range DL and the image pickup range DR of the image pickup unit 39 set at the end of the process of step S13. Move to the unit 36 side. The control unit 2a accommodates the pair of first alignment marks Mb of the substrate 3 in the imaging range DL and the imaging range DR by moving the substrate 3 (step S16). That is, the control unit 2a causes the substrate moving mechanism 31 to move the substrate 3 so that the pair of first alignment marks Mb are contained in the imaging range DL and the imaging range DR, respectively.

Next, the control unit 2a causes the image pickup unit 39 to take an image of the pair of first alignment marks Mb included in the image pickup range DL and the image pickup range DR, respectively (step S17). That is, the first camera 39L captures the first alignment mark Mb included in the imaging range DL, and the second camera 39R captures the first alignment mark Mb included in the imaging range DR. As a result, imaging data in which each of the pair of first alignment marks Mb is projected is generated.

Next, the control unit 2a causes the substrate moving mechanism 31 to adjust the position of the substrate 3 based on the pair of the second alignment marks Mc of the component 5 and the pair of the first alignment marks Mb of the substrate 3. (Step S18). That is, the control unit 2a recognizes the position of the first alignment mark Mb from the image pickup data of the first alignment mark Mb, and recognizes the position of the second alignment mark Mc from the image pickup data of the second alignment mark Mc. .. Then, in the stage 37 of the substrate moving mechanism 31 holding the substrate 3, the substrate 3 is controlled by the control unit 2a so that the pair of second alignment marks Mc and the pair of first alignment marks Mb overlap each other. Adjust the position of. As a result, the alignment between the component 5 and the substrate 3 is performed. Then, the control unit 2a crimps the component 5 to the edge portion of the substrate 3 supported by the lower receiving portion 36 by lowering the crimping tool 34 (step S19). That is, the control unit 2a crimps the component 5 to the substrate 3 by the substrate moving mechanism 31 and the crimping tool 34 based on the imaging results of the pair of first alignment marks Mb and the pair of second alignment marks Mc. To control.

Further, in step S14, when it is determined that the positional relationship is not within the allowable range (No in step S14), the control unit 2a prohibits crimping of the component 5 held by the crimping tool 34 to the substrate 3 (step S20). ). At this time, the control unit 2a may stop the punching of the component 5 by the punching unit 33b. Then, the control unit 2a notifies that a defect has occurred in the punching unit 33b of the component supply unit 33 (step S21). For example, the control unit 2a notifies the occurrence of the defect by displaying a message or a warning notifying the occurrence of the defect on the display unit 2c.

Specifically, the control unit 2a notifies that a defect has occurred in the punching unit 33b when the distance indicated by the related information is not within a predetermined allowable range. More specifically, when the distance YL and the distance YR indicated by the relational information are shorter than the permissible range or longer than the permissible range, the control unit 2a notifies the occurrence of the defect. Further, when the difference between the distance YL and the distance YR is not within the allowable range, the control unit 2a may notify the occurrence of a defect. Further, when either one of the distance XL and the distance XR indicated by the relational information is shorter than the permissible range and the other is longer than the permissible range, the control unit 2a may notify the occurrence of a defect.

FIG. 16 is a flowchart showing details of the positional relationship specifying process in step S13 of FIG.

The control unit 2a causes each of the first camera 39L and the second camera 39R to take an image of the component 5 (step S131). As a result, the imaging data of the component 5 is generated in each of the first camera 39L and the second camera 39R. Then, the control unit 2a sets the edge of the component 5 and the second alignment mark Mc on each of the image pickup range DL of the first camera 39L and the image pickup range DR of the second camera 39R based on the image pickup data. It is determined whether or not both of the above are included (step S132).

Here, when the control unit 2a determines that both the edge of the component 5 and the second alignment mark Mc are included in each of the image pickup range DL and the image pickup range DR (Yes in step S132), the above description is made. Generate relationship information (step S133). That is, the control unit 2a specifies the positional relationship (XL, YL) between the edge of the component 5 displayed in the image pickup data of the first camera 39L and the second alignment mark Mc. Similarly, the control unit 2a specifies the positional relationship (XR, YR) between the edge of the component 5 displayed in the image pickup data of the second camera 39R and the second alignment mark Mc. Then, the control unit 2a generates relationship information (XL, YL), (XR, YR) indicating the specified positional relationship.

On the other hand, when the control unit 2a determines that both the edge of the component 5 and the second alignment mark Mc are not included in each of the image pickup range DL and the image pickup range DR (No in step S132), the image pickup movement mechanism The imaging range DL and the imaging range DR are moved to 38 (step S134). That is, the control unit 2a moves the image pickup range DL and the image pickup range DR so that the edge of the component 5 held by the crimping tool 34 fits in each of the image pickup range DL and the image pickup range DR. To execute. Then, the control unit 2a causes each of the first camera 39L and the second camera 39R to take an image of the edge of the component 5 included in each of the image pickup range DL and the image pickup range DR as a subject (step S135). As a result, image pickup data on which the edge of the component 5 is projected is generated by each of the first camera 39L and the second camera 39R.

In step S134, while each of the first camera 39L and the second camera 39R takes an image, the image pickup range is moved until the edge of the component 5 fits in each of the image pickup range DL and the image pickup range DR. It may be executed continuously. In this case, steps S134 and S135 are executed at the same time. Further, the process of step S134 is executed immediately when a negative determination is made in step S132, but it may not be executed immediately. For example, when a negative determination is made in step S132, the control unit 2a moves the image pickup range DL and the image pickup range DR by controlling the image pickup movement mechanism 38, and repeats the processes of steps S131 and S132. Run. Then, even if step S132 is repeatedly executed a predetermined number of times, the process of step S134 may be executed when a positive determination is not made in step S132. That is, the process of step S134 may be executed when both the edge of the component 5 and the second alignment mark Mc cannot be accommodated in each of the imaging range DL and the imaging range DR. Further, when it is known in advance that the edge of the component 5 and the second alignment mark Mc cannot be simultaneously imaged based on the specifications of the component 5, the first camera 39L and the second camera 39R, step S131 and The process of step S134 may be executed without performing the process of S132.

Next, the control unit 2a moves the image pickup range DL and the image pickup range DR to the image pickup movement mechanism 38 (step S137). That is, the control unit 2a moves the image pickup range DL and the image pickup range DR so that the second alignment mark Mc of the component 5 fits in each of the image pickup range DL and the image pickup range DR. In other words, when the pair of second alignment marks Mc is not included in the imaging range DL and the imaging range DR, the control unit 2a receives the pair of second alignment marks after imaging the edge of the component 5. The imaging movement mechanism 38 is made to move the imaging range DL and the imaging range DR so that Mc is within the imaging range DL and the imaging range DR, respectively. Then, the control unit 2a causes the first camera 39L and the second camera 39R to take an image of the second alignment mark Mc included in each of the image pickup range DL and the image pickup range DR as a subject (step S138). As a result, the image pickup data on which the second alignment mark Mc is projected is generated by each of the first camera 39L and the second camera 39R.

Even in step S137, while each of the first camera 39L and the second camera 39R is taking an image, the image pickup range is moved until the second alignment mark Mc is contained in each of the image pickup range DL and the image pickup range DR. May be executed continuously. In this case, steps S137 and S138 are executed at the same time.

After the imaging in step S138, the control unit 2a generates the above-mentioned relationship information (step S133). At this time, the control unit 2a includes the image pickup data generated in step S135 on which the edge of the component 5 is projected and the image pickup data generated in step S138 on which the second alignment mark Mc is projected. Is used. For example, the control unit 2a recognizes the position of the edge of the component 5 displayed in the image pickup data generated in step S135 by the first camera 39L, that is, the position of the edge in the image pickup range DL. Further, the control unit 2a recognizes the position of the second alignment mark Mc displayed in the image pickup data generated in step S137 by the first camera 39L, that is, the position of the second alignment mark Mc in the image pickup range DL. do. Then, the control unit 2a is based on the position of the edge of the recognized component 5, the position of the second alignment mark Mc, and the moving distance and moving direction of the imaging range DL moved in step S137. The positional relationship between the edge of the component 5 and the second alignment mark Mc is specified.

As described above, in step S133, the control unit 2a has a positional relationship between the edge of the component 5 and the second alignment mark Mc based on the imaging results of the edge of the component 5 and the second alignment mark Mc. Generates and outputs the relational information indicating. The relationship information generated in step S133 is used, for example, for feedback control of the punching position of the component 5 by the punching section 33b, notification of a defect in the punching section 33b, and the like.

As described above, in the present embodiment, it is not necessary to provide the sensor for confirming the punched state of the component 5 in the punched portion 33b, and it is possible to suppress the increase in size of the punched portion 33b. That is, in the component crimping device 100 according to the present embodiment, since the imaging unit 39 can also be used as a sensor for confirming the punched state of the component 5, it is possible to suppress the increase in size of the punched unit 33b. Specifically, the image pickup unit 39 is used to control the crimping of the component 5 to the substrate 3 by the substrate moving mechanism 31 and the crimping tool 34. For example, the image pickup unit 39 is used for imaging the first alignment mark Mb and the second alignment mark Mc for controlling the alignment between the component 5 and the substrate 3. In the component crimping device 100 according to the present embodiment, the image pickup unit 39 is in a punched state of the component 5 by having such an image pickup unit 39 image the edge of the component 5 to generate and output related information. It can also be used as a confirmation sensor. Therefore, since it is not necessary to bother to provide the sensor for confirming the punched state of the component 5 in the punched portion 33b, it is possible to suppress the increase in size of the punched portion 33b.

Here, in order to confirm the punched state of the component 5, it is necessary to image the edge of the component 5 and the second alignment mark Mc, respectively, but if they cannot be imaged at the same time, image is taken. It is necessary to move the range DL and the imaging range DR and image them individually. In such a case, for example, a procedure is assumed in which the second alignment mark Mc is first imaged, then the image pickup range DL and the image pickup range DR are moved, and the edge of the component 5 is imaged. However, in that procedure, the imaging range DL and the imaging range DR must be further moved and returned to their original positions in order to align the component 5 and the substrate 3 in the next step. The alignment requires imaging of the first alignment mark Mb. Then, in the imaging of the first alignment mark Mb and the imaging of the second alignment mark Mc, it is desirable that the imaging range DL and the imaging range DR are at the same position in order to ensure the accuracy of the alignment. .. However, even if each of the image pickup range DL and the image pickup range DR is returned to the original position, if the reproducibility of the position is insufficient, the accuracy of the alignment between the component 5 and the substrate 3 is lowered.

However, in the component crimping device 100 according to the present embodiment, when the edge of the component 5 and the second alignment mark Mc cannot be imaged at the same time, the edge of the component 5 is imaged first, and then the edge of the component 5 is imaged first. , The second alignment mark Mc is imaged.

FIG. 17 is a diagram for explaining the timing at which the image pickup unit 39 and the image pickup range in the component crimping device 100 of the present embodiment move.

As shown in FIG. 17, in the component crimping device 100 according to the present embodiment, the edge of the component 5 is first imaged, and then the second alignment mark Mc is imaged. Between these imaging, the first camera 39L and the second camera 39R, that is, the imaging range DL and the imaging range DR move. However, between the imaging of the second alignment mark Mc and the imaging of the first alignment mark Mb, the first camera 39L and the second camera 39R are not moved, and the component 5 and the substrate 3 are separated from each other. The position of the stage 37, which is the alignment, can be adjusted. This is because the edge of the component 5 is imaged before the second alignment mark Mc. That is, in the present embodiment, the first alignment mark Mb can be imaged without moving the image pickup range DL and the image pickup range DR when the second alignment mark Mc is imaged. Specifically, by moving the substrate 3 without moving the imaging range DL and the imaging range DR, the first alignment mark Mb of the substrate 3 is accommodated in those imaging ranges, and the first alignment mark Mb thereof is accommodated. Can be imaged. Therefore, in the imaging of the first alignment mark Mb and the imaging of the second alignment mark Mc, the positions of the imaging range DL and the imaging range DR are the same. Therefore, the accuracy of alignment between the component 5 and the substrate 3 can be sufficiently ensured. That is, the mounting accuracy can be improved. As a result, it is possible to confirm the punched state of the component 5 and improve the mounting accuracy while suppressing the increase in size of the punched portion 33b.

Further, the control unit 2a in the present embodiment controls the punching of the component 5 from the tape member 70 by the punching unit 33b by outputting the related information. As a result, the positional relationship between the edge of the component 5 and the second alignment mark Mc can be automatically kept constant, and the punching accuracy of the component 5 can be easily improved.

Further, the control unit 2a in the present embodiment generates relational information indicating the distance between the edge of the component 5 and the second alignment mark Mc as a positional relationship, and when the distance is longer than the threshold value, the control unit 2a generates the relational information. , Notifies that a problem has occurred in the punched portion 33b. As a result, it is possible to urge the operator to inspect and repair the punching portion 33b and improve the punching accuracy.

(Modification example)
In the above embodiment, the image pickup moving mechanism 38 moves the image pickup range DL and the image pickup range DR by moving the first camera 39L and the second camera 39R. However, the image pickup moving mechanism 38 may move the image pickup range DL and the image pickup range DR without moving the first camera 39L and the second camera 39R.

FIG. 18 is a diagram showing a configuration example of a part of the imaging movement mechanism 38 in this modified example.

As shown in FIGS. 18A and 18B, the image pickup moving mechanism 38 in this modification includes an optical member 38a composed of a lens, a mirror, or the like. The image pickup moving mechanism 38 moves the optical member 38a upward, for example, as shown in FIG. 18A, without moving the first camera 39L and the second camera 39R. As a result, the imaging range DL and the imaging range DR move in the X-axis direction so that the camera pitch is widened. Alternatively, the image pickup moving mechanism 38 moves the optical member 38a downward, for example, as shown in FIG. 18B, without moving the first camera 39L and the second camera 39R. As a result, the imaging range DL and the imaging range DR move in the X-axis direction so that the camera pitch is narrowed.

As described above, in this modification, the imaging range DL and the imaging range DR can be simultaneously and easily moved along the X-axis direction by moving the optical member 38a.

(Other variants)
Although the component crimping device according to one or more embodiments has been described above based on the above-described embodiment and its modifications, the present disclosure is not limited to this embodiment and the modifications. As long as it does not deviate from the gist of the present disclosure, various modifications that can be conceived by those skilled in the art are applied to the above-described embodiment and its modified examples, and a form constructed by combining the components of the above-described embodiment and its modified examples is also available. It may be included within the scope of the present disclosure.

For example, in the above-described embodiment and its modifications, the shapes of the first alignment mark Mb and the second alignment mark Mc are cross-shaped, but the shape is not limited to this shape and may be another shape. You may.

Further, in the above embodiment and its modification, the substrate 3 is a display panel, and the component 5 is temporarily crimped and main crimped to the display panel, but the substrate 3 may be a substrate other than the display panel. ..

Further, in the above-described embodiment and its modification, the first alignment mark Mb is imaged after the second alignment mark Mc is imaged. However, the first alignment mark Mb and the second alignment mark Mc may be imaged at the same time.

Further, in the above-described embodiment and its modification, the control unit 2a notifies the occurrence of the defect in the punching unit 33b by displaying a message or a warning notifying the occurrence of the defect on the display unit 2c. At this time, the control unit 2a may display the distance XL, the distance XR, the distance YL, and the distance YR shown in the relational information on the display unit 2c, and adjust the punching unit 33b according to the distances. The numerical value may be displayed on the display unit 2c.

Further, in the above-described embodiment and its modification, all or a part of the components of the computer 2 may be configured by dedicated hardware, or by executing a software program suitable for each component. It may be realized. Even if each component is realized by a program execution unit such as a CPU (Central Processing Unit) or a processor reading and executing a software program recorded on a recording medium such as an HDD (Hard Disk Drive) or a semiconductor memory. good. For example, the program execution unit causes the temporary crimping unit 30 to execute each step included in the flowcharts shown in FIGS. 15 and 16.

Further, the component of the computer 2 may be composed of one or a plurality of electronic circuits. The one or more electronic circuits may be general-purpose circuits or dedicated circuits, respectively. The one or more electronic circuits may include, for example, a semiconductor device, an IC (Integrated Circuit), an LSI (Large Scale Integration), or the like. The IC or LSI may be integrated on one chip or may be integrated on a plurality of chips. Here, it is called IC or LSI, but the name changes depending on the degree of integration, and it may be called system LSI, VLSI (Very Large Scale Integration), or ULSI (Ultra Large Scale Integration). An FPGA (Field Programmable Gate Array) programmed after the LSI is manufactured can also be used for the same purpose.

The present disclosure can be used, for example, in a component crimping device included in a component mounting line for mounting components on a display panel.

1 Parts mounting line 2 Computer 2a Control part 2b Storage part 2c Display part 3 Board 4 Electrode part 5 Parts 6 Electrode part 10 Board carry-in part 20 Sticking part 30 Temporary crimping part 31 Board movement mechanism 32 Parts mounting mechanism 33 Parts supply part 33a Supply reel 33b Punching part 33c Movable stage 33d Rail 34 Crimping tool 35 Parts moving part 35a Transfer head 35b Transfer stage 36 Under receiving part 37 Stage 37a Suction hole 38 Imaging moving mechanism 38a Optical member 39 Imaging unit 39L First camera 39R 2nd camera 40 crimping part 50 board carrying part 60 carrying part 70 tape member 91 ACF
100 Parts crimping device DL Imaging range DR Imaging range Mb First alignment mark Mc Second alignment mark

Claims (6)

A substrate moving mechanism that holds the substrate on which the first alignment mark is formed and moves the substrate,
A crimping tool that holds the part on which the second alignment mark is formed and crimps it to the substrate.
An imaging unit that captures the subject included in the imaging range, and
An imaging movement mechanism that moves the imaging range of the imaging unit, and
Equipped with a control unit
The control unit
The imaging movement mechanism is made to move the imaging range so that the edge of the component held by the crimping tool fits within the imaging range.
The image pickup unit is made to image the edge of the component included in the image pickup range as the subject.
If the second alignment mark is not included in the imaging range,
After imaging the edge of the component, the imaging movement mechanism is made to move the imaging range so that the second alignment mark is within the imaging range.
The second alignment mark included in the imaging range is used as the subject to be imaged by the imaging unit.
Based on the imaging results of the edge of the component and the second alignment mark, relationship information indicating the positional relationship between the edge of the component and the second alignment mark is generated and output.
The substrate moving mechanism is made to move the substrate so that the first alignment mark is within the imaging range.
The first alignment mark included in the imaging range is used as the subject to be imaged by the imaging unit.
Based on the imaging results of the first alignment mark and the second alignment mark, the crimping of the component to the substrate by the substrate moving mechanism and the crimping tool is controlled.
Parts crimping device. The component crimping device further
A tape member provided with a plurality of parts is provided with a punching portion for sequentially punching each of the plurality of parts.
The crimping tool holds the parts punched by the punched portion and crimps to the substrate.
The component crimping device according to claim 1. The control unit further
By outputting the relational information, the punching of parts from the tape member by the punching portion is controlled.
The component crimping device according to claim 2. The control unit further
The relationship information indicating the distance between the edge of the component and the second alignment mark as the positional relationship is generated.
If the distance is not within the predetermined allowable range, it is notified that a defect has occurred in the punched portion.
The component crimping device according to claim 2 or 3. The image pickup moving mechanism does not move the image pickup range of the image pickup unit from the time when the image pickup unit takes an image of the second alignment mark until the image pickup of the first alignment mark is performed.
The component crimping device according to any one of claims 1 to 4. This is a component crimping method in which a component crimping device crimps a component to a board.
The component crimping device is
A substrate moving mechanism that holds the substrate on which the first alignment mark is formed and moves the substrate,
A crimping tool that holds the part on which the second alignment mark is formed and crimps it to the substrate.
An imaging unit that captures the subject included in the imaging range, and
An imaging movement mechanism that moves the imaging range of the imaging unit, and
Equipped with a control unit
In the component crimping method,
The image pickup moving mechanism moves the image pickup range so that the edge of the component fits within the image pickup range.
The imaging unit captures the edge of the component included in the imaging range as the subject.
If the second alignment mark is not included in the imaging range,
After imaging the edge of the component, the imaging moving mechanism moves the imaging range so that the second alignment mark fits within the imaging range.
The imaging unit captures the second alignment mark included in the imaging range as the subject.
Based on the imaging results of the edge of the component and the second alignment mark, the control unit generates and outputs relationship information indicating the positional relationship between the edge of the component and the second alignment mark. death,
The substrate moving mechanism moves the substrate so that the first alignment mark is within the imaging range.
The imaging unit captures the first alignment mark included in the imaging range as the subject.
Based on the imaging results of the first alignment mark and the second alignment mark, the control unit controls the crimping of the component to the substrate by the substrate moving mechanism and the crimping tool.
Parts crimping method.

Images