JP2020021891A - Thermal compression bonding device and thermal compression bonding method - Google Patents

Abstract

To provide a thermal compression bonding device and the like capable of suppressing generation of defective items.SOLUTION: A thermal compression bonding device 100 comprises: a transportation part 60 that transports a substrate; a stage that comprises a heater 49b and on which the substrate transported by the transportation part 60 is placed; a thermal compression bonding part 42 that bonds a component to the substrate placed on the stage by thermal compression; and a controller 2a that makes the transportation part 60 place the substrate on the stage heated by the heater 49b and makes the thermal compression bonding part 42 bond the component to the substrate placed on the stage by thermal compression. The controller 2a, in a case where an other device abnormality signal indicating abnormalities of devices included in a component mounting line 1 except for the thermal compression bonding device 100 is received, makes the thermal compression bonding part 42 bond the component to the substrate by thermal compression and then makes the transportation part 60 separate the substrate from the stage, and further, stops the thermal compression bonding device 100.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a thermocompression bonding apparatus and a thermocompression bonding method for thermocompression bonding a component to a substrate.

  Conventionally, an ACF (Anisotropic Conductive Film) tape, which is an anisotropic conductive member, is adhered to an end portion of a substrate as an adhesive member, and electronic components such as a drive circuit (hereinafter simply referred to as a drive circuit) are attached to a portion of the substrate where the ACF tape is adhered. There is a component mounting line that includes a thermocompression bonding device that mounts a component on the board on which the component is mounted (hereinafter referred to as Patent Document 1).

  In addition, in order to reduce color unevenness when a liquid crystal panel displays an image, there is a component mounting line that heats a substrate when the component is thermocompression-bonded to the substrate via an ACF (for example, see Patent Document 2). .

JP-A-2006-186966 JP-A-2017-11110

  In a component mounting line for producing a liquid crystal panel, when the board is heated when a component is crimped to the board via an ACF, if the component mounting line stops due to some obstacle, the heating section for heating the board rapidly rises in temperature. Does not drop and the substrate remains heated. Therefore, parts such as the ACF and the polarizing plate may be deteriorated by heat, and the produced liquid crystal panel may be defective.

  The present invention provides a thermocompression bonding apparatus or the like that suppresses generation of defective products.

  A thermocompression bonding apparatus according to an aspect of the present invention is a thermocompression bonding apparatus for a component mounting line having a thermocompression bonding apparatus that thermocompression-bonds components to a substrate, the thermocompression bonding apparatus including a conveyance unit configured to convey the substrate, and a heater. A stage on which the substrate conveyed by the unit is mounted, a thermocompression unit for thermocompression-bonding components to the substrate mounted on the stage, and the stage in which the substrate is heated by the heater by the conveyance unit A thermocompression bonding device, comprising: a control unit that thermocompression-bonds the component by the thermocompression bonding unit to the substrate mounted on the stage; wherein the control unit includes the thermocompression bonding device. Except when the other device abnormality signal indicating the abnormality of the device having the component mounting line is received, the component is thermocompression-bonded to the substrate by the thermocompression bonding unit, and then the substrate is transferred to the stage by the transfer unit. Al is separated, further, stops the thermocompression bonding device.

  Further, the thermocompression bonding method according to an aspect of the present invention is a thermocompression bonding method performed by the thermocompression bonding apparatus of a component mounting line including a thermocompression bonding apparatus that thermocompression-bonds components to a board, wherein the substrate is transferred by a transport unit. A mounting step of mounting on a stage heated by a heater, and a thermocompression bonding step of thermocompression bonding the component to the substrate mounted on the stage, and, after the mounting step, the thermocompression bonding apparatus Except when the other device abnormality signal indicating the abnormality of the device having the component mounting line is received, after the thermocompression bonding step is completed, the substrate is separated from the stage by the transport unit, and further, the heat Stop the crimping device.

  Note that these comprehensive or specific aspects may be realized by a recording medium such as a system, a method, an integrated circuit, a computer program or a computer-readable CD-ROM, and the system, the method, the integrated circuit, and the computer program. And any combination of recording media.

  ADVANTAGE OF THE INVENTION According to this invention, the thermocompression bonding apparatus etc. which suppress generation | occurrence | production of a defective product can be provided.

FIG. 1 is a plan view showing a component mounting line according to the embodiment. FIG. 2 is a schematic configuration diagram illustrating a component mounting line according to the embodiment. FIG. 3 is a block diagram showing a functional configuration of a component mounting line including the thermocompression bonding apparatus according to the embodiment. FIG. 4 is a perspective view showing the final crimping portion according to the embodiment. FIG. 5 is a side view for explaining the main press bonding step performed by the main press unit according to the embodiment. FIG. 6 is a side view for explaining a main bonding step performed by the main bonding section according to the embodiment. FIG. 7 is a flowchart for explaining a processing procedure of an operation performed by the thermocompression bonding apparatus according to the embodiment.

  Hereinafter, a thermocompression bonding apparatus and the like according to an embodiment of the present invention will be described in detail with reference to the drawings. Each of the embodiments described below shows a specific example of the present invention. Therefore, the numerical values, shapes, materials, constituent elements, arrangement and connection forms of the constituent elements, the steps and the order of the steps, and the like shown in the following embodiments are merely examples, and do not limit the present invention. Therefore, among the components in the following embodiments, components that are not described in the independent claims that represent the highest concept of the present invention are described as arbitrary components.

  In addition, each drawing is a schematic diagram and is not necessarily strictly illustrated. In each drawing, the same components are denoted by the same reference numerals.

  In this specification and the drawings, the X axis, the Y axis, and the Z axis represent three axes of a three-dimensional orthogonal coordinate system. The X axis and the Y axis are axes orthogonal to each other, and both are orthogonal to the Z axis. In the following embodiments, the X-axis positive direction of the substrate transfer direction may be described as the Z-axis positive direction as the upper direction, and the Z-axis negative direction as the lower direction.

(Embodiment)
[Constitution]
First, an outline of a thermocompression bonding apparatus according to an embodiment will be described with reference to FIGS.

  FIG. 1 is a plan view of a component mounting line 1 according to the embodiment. FIG. 2 is a schematic configuration diagram of the component mounting line 1 according to the embodiment. FIG. 3 is a block diagram illustrating a functional configuration of the component mounting line 1 including the thermocompression bonding apparatus 100 according to the embodiment.

  The component mounting line 1 is a component mounting system for producing a liquid crystal panel or the like, and includes a thermocompression bonding apparatus 100 that thermocompression-bonds electronic components (hereinafter, referred to as components 5) such as a drive circuit to a substrate 3. Specifically, the component mounting line 1 attaches an anisotropic conductive member (ACF) 6 such as an ACF (Anisotropic Conductive Film) to the substrate 3 on which the electrode portion 4 is formed, and connects the substrate 3 with the substrate 3 via the ACF 6. This is a device for thermocompression bonding the component 5.

  The component mounting line 1 includes a board loading section 10, a sticking section 20, a temporary crimping section 30, a main crimping section 40, a board unloading section 50, a transport section 60, and a computer 2. In FIG. 1, the computer 2 is omitted from illustration, but the computer 2 is communicably connected to devices such as the sticking unit 20, the temporary crimping unit 30, and the main crimping unit 40 by control lines and the like. And controls each device.

  The substrate carrying-in part 10, the sticking part 20, the temporary crimping part 30, the main crimping part 40, and the substrate carrying-out part 50 are connected in this order. The component mounting line 1 mounts the component 5 on each of a plurality of electrode units 4 provided on the periphery of a rectangular substrate 3 such as a liquid crystal panel substrate loaded from a substrate loading unit 10 on the upstream side where the substrate 3 is transported. The board 3 on which the component 5 is mounted is carried out from the board carrying-out section 50. Each of the plurality of electrode units 4 is composed of, for example, a plurality of electrodes.

  The substrate loading section 10 includes a base 1a on which the substrate 3 to be loaded is placed. A stage 11 on which the substrate 3 is placed is provided on a base 1a of the substrate loading unit 10. The stage 11 moves up and down with respect to the base 1a in the Z-axis direction. Further, a plurality of suction holes 11a are provided on the upper surface of the stage 11, and the substrate 3 loaded on the stage 11 by being carried in from an operator or another device on the upstream side is provided with a pump or the like (not shown). Vacuum suction is carried out from the suction hole 11a by the suction device and held.

  The attaching section 20 has a function of performing an attaching operation (in other words, an attaching step) of attaching the ACF 6 as an adhesive member to the electrode section 4 of the substrate 3. The attaching unit 20 includes a substrate moving mechanism 21 and an attaching mechanism 22.

  The substrate moving mechanism 21 is a mechanism for moving the substrate 3. The substrate moving mechanism 21 includes, for example, an X-axis table movable in the X-axis direction, a Y-axis table movable in the Y-axis direction, a Z-axis table movable in the Z-axis direction, and a stage 23. The substrate moving mechanism 21 includes an X-axis table movable in the X-axis direction, a Y-axis table movable in the Y-axis direction, a Z-axis table movable in the Z-axis direction, and a stage on the base 1b in order from below. 23 are provided in an overlapping manner.

  The Y-axis table is provided to extend in the Y-axis direction, and moves freely on the X-axis table in the X-axis direction. The Z-axis table moves freely on the Y-axis table in the Y-axis direction, moves up and down the stage 23 provided on the top in the Z-axis direction, and rotates around the Z-axis.

  A plurality of suction holes 23a are provided on the upper surface of the stage 23, and hold the substrate 3 placed on the stage 23 by vacuum suction. As described above, the substrate moving mechanism 21 sucks and holds the substrate 3 to move the substrate 3 in a horizontal plane (specifically, the X-axis direction and the Y-axis direction), and moves the substrate 3 in the vertical direction (specifically, the Z-axis direction). Move up and down and rotate around the Z axis.

  The sticking mechanism 22 includes a plurality of sticking heads arranged in the X-axis direction above the base 1b. In the present embodiment, the sticking mechanism 22 has two sticking mechanisms. Each attaching head includes a supply unit for supplying the ACF 6 and an attaching tool for attaching the ACF 6 to the substrate 3. The plurality of attaching heads attach the ACF 6 to positions on the substrate 3 corresponding to the plurality of electrode units 4. At a lower position corresponding to each of the plurality of bonding heads, a bonding support base is provided. The sticking head and the sticking support on the downstream side are integrally moved in the X-axis direction by a head moving mechanism having a head moving motor.

  The temporary crimping section 30 performs a temporary crimping step of mounting the component 5 in the area where the ACF 6 is adhered and performing a temporary crimping. The temporary crimping unit 30 includes a substrate moving mechanism 31, a component mounting mechanism 32, and a component supply unit 33.

  The substrate moving mechanism 31 has the same structure as the substrate moving mechanism 21 of the sticking section 20, and has a function of sucking and holding the substrate 3, moving the substrate 3 in a horizontal plane, moving up and down in the vertical direction, and rotating about the Z axis. . A plurality of suction holes 37a are provided on the upper surface of the stage 37, and hold the substrate 3 placed on the stage 37 by vacuum suction.

  The component mounting mechanism 32 is provided on the base 1b and includes a mounting head 34, a mounting head moving mechanism 35, and a mounting support 36. The mounting head 34 is freely moved in a horizontal plane by the mounting head moving mechanism 35, and moves up and down in the Z-axis direction to suck (ie, pick up) the component 5 supplied by the component supply unit 33 from above. The substrate moving mechanism 31 positions the region of the substrate 3 to be held on which the ACF 6 is adhered, above the mounting support 36. The component mounting mechanism 32 temporarily press-fits the component 5 to the substrate 3 by mounting the sucked component 5 on the ACF 6 and pressing the substrate 3 together with the mounting support 36. The temporary pressure bonding section 30 may include a mechanism for rotating the direction of the substrate 3 held by the substrate moving mechanism 31 by 90 degrees.

  The component supply unit 33 is provided behind the base 1b behind the component mounting mechanism 32 (on the positive side in the Y-axis direction), and supplies the component 5 to the component mounting mechanism 32.

  The final press-bonding unit 40 executes a final press-bonding step (that is, a thermo-compression bonding step) of performing a final press-bonding (that is, thermo-compression bonding) of the component 5 that is temporarily press-bonded to the substrate 3 by the temporary press-bonding unit 30. Thus, the electrode portion 4 formed on the substrate 3 and the component 5 are electrically connected via the ACF 6. The specific configuration of the main crimping section 40 will be described later.

  The substrate unloading unit 50 has a function of vacuum-sucking and holding the substrate 3 conveyed from the main bonding unit 40 on the stage 51. The substrate 3 held in the substrate unloading section 50 is unloaded to another device on the downstream side or taken out of the stage 51 by an operator.

  The stage 51 moves up and down with respect to the base 1c in the Z-axis direction. In addition, a plurality of suction holes 51 a are provided on the upper surface of the stage 51, and the substrate 3 transferred from the main bonding section 40 is vacuum-adsorbed and held on the stage 51. The substrate 3 held in the substrate unloading section 50 is unloaded to another device on the downstream side or taken out of the stage 51 by an operator.

  The transport unit 60 is a device that transports the substrate 3. Specifically, the transport unit 60 transfers the substrate 3 loaded into the substrate loading unit 10 to the bonding unit 20, the temporary compression bonding unit 30, the final compression bonding unit 40, and the substrate unloading unit 50 in this order by a predetermined working unit. It has a function of transferring (transferring) the substrate 3 between them. The transporting section 60 is disposed in a region in front of the sticking section 20, the temporary crimping section 30, and the main crimping section 40 (on the Y axis negative direction side).

  The transport unit 60 includes a substrate transport mechanism 62A, a substrate transport mechanism 62B, and a substrate transport mechanism 62C on a moving base 61 extending in the X-axis direction across the bases 1a, 1b, and 1c in order from the upstream side. , And a substrate transport mechanism 62D.

  Each of the substrate transfer mechanisms 62A to 62D includes a base 63 and one or more arm units 64. In the present embodiment, a case where each of the substrate transfer mechanisms 62A to 62D includes two arm units 64 is illustrated.

  The base 63 is provided on the movable base 61 and moves freely in the X-axis direction. On the base 63, two arm units 64 are provided side by side in the X-axis direction. The arm unit 64 is provided with one or more arm-shaped suction nozzles 64a (see FIG. 4) extending horizontally rearward in the X-axis direction. The arm has suction pads 65 with suction surfaces directed downward. (See FIG. 4). In the present embodiment, an example is shown in which the arm unit 64 includes two suction nozzles 64a, and the substrate transport mechanisms 62A to 62D each include two suction pads 65.

  The arm unit 64 vacuum-suctions the substrate 3 from above via a total of four suction pads 65 provided on the two suction nozzles 64a.

  Each of the substrate transfer mechanisms 62A to 62D moves to a substrate transfer position where the substrate 3 held by the stages 11, 23, 37, 49, and 51 is vacuum-adsorbed from above, and then moves up and down the stages 11, 23, 37, and 49. From 51, the substrate 3 is received or delivered. For example, the substrate transport mechanism 62 </ b> A receives the substrate 3 placed on the stage 11 of the substrate loading unit 10 and transfers it to the stage 23 of the sticking unit 20. Further, for example, the substrate transport mechanism 62 </ b> B receives the substrate 3 from the stage 23 of the sticking unit 20 and transfers it to the stage 37 of the temporary crimping unit 30. Further, for example, the substrate transport mechanism 62 </ b> C receives the substrate 3 from the temporary pressure bonding unit 30 and transfers the substrate 3 to the stage 49 of the main pressure bonding unit 40. Further, for example, the substrate transport mechanism 62 </ b> D receives the substrate 3 from the stage 49 of the main crimping unit 40 and transfers the substrate 3 to the stage 51 of the substrate unloading unit 50.

  The computer 2 is a control device for controlling the operation of each device of the thermocompression bonding apparatus 100 and the component mounting line 1. The computer 2 includes a control unit 2a and a storage unit 2b.

  The storage unit 2b stores the size of the substrate 3 such as a liquid crystal panel substrate manufactured by the component mounting line 1, the type of the component 5 to be mounted on the substrate 3, the mounting position, the mounting direction, and the timing of transferring the substrate 3 between the respective working units. And various data necessary for component mounting work, a control program executed by the control unit 2a, and the like. The storage unit 2b is realized by a ROM (Read Only Memory), a RAM (Random Access Memory), or the like.

  The control unit 2 a controls the substrate moving mechanism 21 of the sticking unit 20, the substrate moving mechanism 31 of the temporary crimping unit 30, the substrate moving mechanism 41 of the main crimping unit 40, and the transport unit 60 to move the substrate 3 between the working units. To carry out a substrate transfer operation for transferring to the next step. The transfer of the substrate 3 from the upstream side to the downstream side in the substrate transfer operation is performed in synchronization between the respective working units.

  For example, the control unit 2a controls the adhering unit 20 to change the direction and position of the substrate 3 held by the substrate moving mechanism 21, change the interval between a plurality of adhering heads using a head moving motor, and The attaching section 22 causes the attaching section 20 to execute an attaching operation of attaching the ACF 6 to the substrate 3.

  Further, for example, the control unit 2 a controls the temporary press-bonding unit 30 to change the direction and the position of the substrate 3 held by the substrate moving mechanism 31, and transfers the component 5 supplied from the component supply unit 33 to the component mounting mechanism. 32, the substrate 3 is preliminarily pressed.

  Further, for example, the control unit 2 a controls the main bonding unit 40 to change the direction and the position of the substrate 3 held by the substrate moving mechanism 41, and the component 5 temporarily bonded to the substrate 3 by the thermocompression unit 42. Is fully bonded.

  The control unit 2a is, for example, stored in the storage unit 2b and includes a control program for controlling each device included in the thermocompression bonding apparatus 100 and the component mounting line 1, and a CPU (Central Processing Unit) that executes the control program. Is achieved.

[Thermo-compression bonding equipment]
<Structure>
Subsequently, a specific configuration of the thermocompression bonding apparatus 100 will be described with reference to FIGS. 3 and 4. More specifically, a specific configuration of the main crimping unit 40 included in the thermocompression bonding apparatus 100 will be described.

  FIG. 4 is a perspective view showing the final crimping section 40 according to the embodiment.

  The thermocompression bonding apparatus 100 shown in FIG. 3 thermocompression-bonds a component 5 to a substrate 3 via an ACF 6 temporarily crimped to an electrode portion 4 of the substrate 3 by a temporary crimping unit 30 in a component mounting line 1 for producing a liquid crystal panel or the like. It is a device to do.

  In the present embodiment, the thermocompression bonding apparatus 100 will be described as having the computer 2, the main compression section 40, and the transport section 60. The computer 2 (specifically, the control unit 2a) that controls each component of the thermocompression bonding apparatus 100 includes the bonding unit 20 other than the thermocompression bonding apparatus 100 included in the component mounting line 1, the temporary bonding unit 30, and the like. The computer that controls each device may be the same or different.

  As shown in FIG. 3, the main compression unit 40 includes a substrate moving mechanism 41, a thermocompression unit 42, and a heater 49b.

  The substrate moving mechanism 41 has a structure similar to that of the substrate moving mechanism 21 of the sticking section 20, and holds the substrate 3 by suction on the stage 49, moves the substrate 3 in a horizontal plane, moves up and down in the vertical direction, and rotates around the Z axis. Provide functions.

  The stage 49 includes a heater 49 b for heating the substrate 3, and is a table on which the substrate 3 transported by the transport unit 60 is placed. Specifically, the stage 49 is a table on which the substrate 3 on which the components 5 are temporarily pressed by the temporary pressing unit 30 by the transfer unit 60 (specifically, the substrate transfer mechanism 62C) is placed. A plurality of suction holes 49a are provided on the upper surface of the stage 49, and hold the substrate 3 placed on the stage 49 by vacuum suction.

  The stage 49 heats the substrate 3 by being heated by the heater 49b shown in FIG. The heater 49b only needs to be able to heat the substrate 3 placed on the stage 49, and its configuration and arrangement are not particularly limited. In the present embodiment, the stage 49 is made of a metal member having thermal conductivity, and the heater 49b is located inside the stage 49 and heats the substrate 3 via the stage 49. For example, when the substrate 3 is a substrate used for a liquid crystal panel, by heating the substrate 3 by the heater 49b in the final pressure bonding step, it is possible to reduce color unevenness when the liquid crystal panel displays an image. The temperature at which the heater 49b heats the substrate 3 is not particularly limited, but is, for example, 40 ° C to 50 ° C.

  The thermocompression bonding section 42 thermocompression-bonds the component 5 to the substrate 3 placed on the stage 49 via the ACF 6. As shown in FIG. 4, the thermocompression bonding section 42 includes a compression bonding section 43 and a compression bonding support section 44.

  The crimping section 43 includes a plurality of crimping units 45 that can be adjusted in the X-axis direction with respect to the base 43a. In the present embodiment, a case where the crimping unit 43 includes eight crimping units is illustrated. The crimping unit provided in the crimping section 43 is not particularly limited.

  The base 43a is provided with a pair of guides 43b extending in the X-axis direction. A plurality of rectangular flat plate-like mounting members 46 arranged in a vertical posture are mounted on the guide portion 43b so as to be adjustable in the X-axis direction.

  The pressure bonding unit 45 includes a pressure mechanism 47 and a pressure head 48.

  The pressing mechanism 47 is attached to the attachment member 46. The pressing mechanism 47 includes a rod 47a that can be vertically protruded and retracted, and a pressure bonding head 48 is provided at a lower end of the rod 47a.

  The plurality of pressure bonding heads 48 are arranged in a line above the pressure bonding support portion 44. By adjusting the crimping unit 45 to a desired position, the worker can change the interval between the crimping heads 48 according to the interval between the components 5 temporarily crimped to the substrate 3.

  The crimping head 48 has a built-in heating unit such as a heater, and is heated to a predetermined temperature by the heating unit before the component 5 is crimped. The pressure bonding head 48 is lowered by the driving of the pressure mechanism 47 and presses the component 5 mounted on the edge of the substrate 3 against the substrate 3 while heating the component 5, thereby fully pressing the component 5 to the substrate 3. At this time, the curing of the ACF 6 is promoted by the heat generated from the pressure bonding head 48.

  Further, the final press-bonding unit 40 rotates the direction of the substrate 3 held by the substrate moving mechanism 41 by 90 degrees, and performs the final press-bonding of the component 5 temporarily press-bonded to the periphery of the substrate 3. The thermocompression bonding section 42 is not limited to the above configuration, and the number and shape (for example, the length in the X-axis direction) of the compression bonding heads 48 capable of simultaneously performing the final compression bonding of the components 5 temporarily compressed on the peripheral edge of the substrate 3. ).

  The control unit 2a of the computer 2 places the substrate 3 on the stage 49 heated by the heater 49b by the transport unit 60, and attaches the component 5 to the substrate 3 placed on the stage 49 by the thermocompression unit 42. Thermocompression bonding.

  In addition, for example, after the substrate 3 is placed on the stage 49 and before the thermocompression bonding between the substrate 3 and the component 5 is completed, the control unit 2a operates the component mounting line 1 excluding the thermocompression bonding apparatus 100. When the other device abnormality signal indicating the abnormality of the device is received, the component 5 is thermocompression-bonded to the substrate 3 by the thermocompression bonding unit 42, and then the substrate 3 is separated from the stage 49 by the transport unit 60, and then (specifically, Specifically, after the substrate 3 is separated from the stage 49 by the transport unit 60), the thermocompression bonding apparatus 100 is stopped.

  In addition, for example, when the control unit 2a receives an own device abnormality signal indicating an abnormality of the thermocompression bonding apparatus 100 before performing thermocompression bonding by the thermocompression bonding unit 42, the thermocompression bonding unit 42 attaches the component 5 to the substrate 3. After the substrate 3 is separated from the stage 49 by the transport unit 60 without performing thermocompression bonding, the thermocompression bonding apparatus 100 is stopped.

  For example, the computer 2 includes a communication unit (not shown) that is a communication interface for transmitting and receiving signals to and from the attachment unit 20, the temporary crimping unit 30, the main crimping unit 40, the transporting unit 60, and the like. Each device such as the sticking unit 20, the temporary crimping unit 30, the main crimping unit 40, and the transporting unit 60 also includes a communication unit (not shown) which is a communication interface for transmitting and receiving signals to and from the computer 2.

  In addition, for example, each device such as the sticking unit 20, the temporary crimping unit 30, the main crimping unit 40, and the transporting unit 60 includes a detection unit (not shown) for detecting its own trouble.

  Here, the failure means that each device such as the sticking unit 20, the temporary crimping unit 30, the main crimping unit 40, and the transport unit 60 should be executed, for example, a failure such as a disconnection, the board 3 is not at a predetermined position, or the like. The operation cannot be performed, and the operation needs to be stopped.

  For example, the abnormality of the device included in the component mounting line 1 other than the thermocompression bonding device 100 is an abnormality of the bonding unit 20, the temporary bonding unit 30, and the like. It may include a displacement of the attachment position, a displacement of the mounting position of the component 5 in the temporary crimping section 30, and the like. The control unit 2a may receive another device abnormality signal from another device (not shown) of the component mounting line 1 and execute control based on the received other device abnormality signal.

  Further, for example, the abnormality of the thermocompression bonding apparatus 100 is an abnormality of the main compression bonding section 40, and the malfunction of the thermocompression bonding apparatus 100 may include a malfunction such as the heater 49b not heating.

  Further, the detection unit only needs to be able to detect a defect, and is, for example, a sensor for detecting electrical continuity of each device, a sensor for detecting a position of the ACF 6, the component 5, etc. with respect to the substrate 3, and the like. For example, the malfunction of the thermocompression bonding apparatus 100 may include a temperature sensor that detects a malfunction such as the heater 49b not heating. The communication unit included in each device transmits an abnormal signal indicating the defect to the control unit 2a when the detection unit included in each device detects its own defect. The control unit 2a controls each device included in the thermocompression bonding device 100 based on the received signal.

<Main crimping process>
Next, with reference to FIGS. 5 and 6, a specific procedure of the main bonding step (thermocompression step) performed by the main bonding section 40 will be described.

  FIG. 5 and FIG. 6 are side views for explaining the main bonding step performed by the main bonding section 40 according to the embodiment.

  First, as shown in FIG. 5A, the stage 49 is moved below the arm unit 64 holding the substrate 3. Specifically, the substrate 3 to which the component 5 has been temporarily press-bonded by the temporary press-bonding unit 30 via the ACF 6 is suction-adsorbed to a suction pad 65 disposed at the tip of a suction nozzle 64a provided in the substrate transfer mechanism 62C shown in FIG. Then, it is moved from the stage 37 of the temporary crimping section 30 to the transfer position of the main crimping section 40. Then, the stage 49 of the final crimping section 40 is moved below the transfer position where the substrate 3 is placed on the stage 49. The stage 49 is heated by the heater 49b. The timing at which the control section 2a controls the heater 49b to heat the stage 49 is not particularly limited. However, when the substrate 3 is placed, the temperature of the stage 49 heated by the heater 49b is stable. Good to be.

  Next, as shown in FIG. 5B, the stage 49 moves upward.

  Next, as shown in FIG. 5C, the arm unit 64 releases the suction of the substrate 3 and mounts the substrate 3 on the stage 49. Thereafter, the stage 49 on which the substrate 3 is mounted is moved downward. Go to That is, FIG. 5C is a diagram illustrating a mounting process in which the thermocompression bonding apparatus 100 mounts the substrate 3 on the stage 49.

  Next, as shown in FIG. 5D, the stage 49 moves to a working position on the side of the pressure bonding support portion 44 and the pressure bonding head 48 (specifically, on the Y axis positive direction side). In the working position, the board 3, the component 5, and the ACF 6 are arranged in a space between the crimp support 44 and the crimp head 48.

  Next, as shown in FIG. 5 (e), the stage 49 moves downward, and as shown in FIG. 5 (f), the pressure bonding head 48 moves downward. In this way, as shown in FIG. 5 (g), the substrate 3, the component 5, and the ACF 6 are sandwiched between the crimp support 44 and the crimp head 48. That is, the component 5 is fully pressed to the substrate 3. That is, FIGS. 5D to 5G are views showing a thermocompression bonding step in which the thermocompression bonding apparatus 100 thermocompression-bonds the substrate 3 and the component 5.

  Next, as shown in FIG. 6H, the pressure bonding head 48 moves upward. Thereby, the crimping head 48 is separated from the component 5.

  Next, as shown in FIG. 6 (i), the stage 49 moves upward.

  Next, as shown in (j) of FIG. 6, the stage 49 moves in a direction (specifically, the negative direction of the Y axis) away from the crimping support part 44 and the crimping head 48. Specifically, the stage 49 is moved from the work position to the transfer position where the arm unit 64 waits by the substrate moving mechanism 41. More specifically, in (j) of FIG. 6, the stage 49 moves to, for example, below the arm unit 64 of the substrate transfer mechanism 62D shown in FIG.

  Next, as shown in FIG. 6K, the stage 49 moves upward, and the arm unit 64 sucks the substrate 3.

  Next, as shown in FIG. 6 (l), the stage 49 moves downward.

  Next, as shown in FIG. 6 (m), the stage 49 moves in the positive direction of the Y axis.

  As a result, as shown in FIG. 6 (n), the substrate 3 is returned to the same transfer position as in FIG. 5 (a) in a state where the substrate 3 is attracted to the arm unit 64, and the arm unit 64 The movement is further started to place the substrate 3 on the substrate.

  The thermocompression bonding apparatus 100 continues to perform the main bonding process by sequentially repeating the operations of FIGS. 5A to 6N.

<Processing procedure>
Subsequently, a specific operation of the thermocompression bonding apparatus 100 will be described with reference to FIGS.

  First, it is assumed that the control unit 2a has received a signal (step S101).

  Next, the control unit 2a determines whether the signal received in step S101 is the own device abnormality signal which is an abnormality signal indicating an abnormality of the thermocompression bonding apparatus 100 among the devices included in the component mounting line 1, or whether the component mounting line 1 It is determined whether the received signal is an abnormal signal indicating an abnormality of a device other than the thermocompression bonding device 100 among the devices included in the device. Specifically, the control unit 2a determines whether or not the other device abnormality signal indicates an abnormality other than the thermocompression bonding device 100 (Step S102).

  When the control unit 2a determines that the received signal is the other device abnormal signal (Yes in Step S102), the control unit 2a causes the main crimping unit 40 to continue the main crimping process (Step S103).

  Next, when the main bonding step is completed (step S104), the control unit 2a stops the operation of the thermocompression bonding apparatus 100 (step S105).

  As described above, when the control unit 2 a receives the other device abnormality signal indicating the abnormality of the device included in the component mounting line 1 except the thermocompression bonding device 100, the thermocompression unit 42 thermocompression-bonds the component 5 to the substrate 3. After that, the substrate 3 is separated from the stage 49 heated by the heater 49b by the transfer unit 60, and thereafter, the thermocompression bonding apparatus 100 is stopped.

  According to such a configuration, even in a situation where a device included in the component mounting line 1 except the thermocompression bonding apparatus 100 breaks down during the main compression bonding process and the thermocompression bonding apparatus 100 has to be stopped for recovery work or the like. The substrate 3 can be separated from the stage 49 heated by the heater 49b. Therefore, the substrate 3 is kept mounted on the stage 49 heated by the heater 49b, thereby avoiding deterioration due to continued heating. Thereby, according to the thermocompression bonding apparatus 100, generation of defective products is suppressed. Further, for example, when the abnormality of the device included in the component mounting line 1 based on the abnormality signal is removed and the component mounting line 1 is restarted, it is possible to more efficiently operate each device included in the component mounting line 1. it can.

  In step S103, the control unit 2a may complete the main pressure bonding shown in (g) of FIG. 5 and move the substrate 3 away from the stage 49. Specifically, the control unit 2a may stop the operation of the thermocompression bonding apparatus 100 after moving the substrate 3 to the state shown in FIG. 6 (m) or the state shown in FIG. 6 (n). The operation of the thermocompression bonding apparatus 100 may be stopped after the substrate 3 has been moved to, or the operation of the thermocompression bonding apparatus 100 may be stopped after moving the substrate 3 to the stage 51 of the substrate unloading section 50.

  On the other hand, the control unit 2a determines whether or not the received signal is an example of an abnormal signal, and is the own device abnormal signal indicating an abnormality of the thermocompression bonding device 100 (specifically, the main bonding unit 40). (Step S106).

  When the control unit 2a determines that the received signal is the own device abnormality signal indicating the abnormality of the main crimping unit 40 (Yes in step S106), the control unit 2a does not allow the main crimping unit 40 to continue the main crimping process, and executes the process. The main bonding step is interrupted (step S107).

  Next, the controller 2a separates the substrate 3 from the stage 49 (Step S108), and stops the operation of the thermocompression bonding apparatus 100 (Step S105). Specifically, for example, after the substrate 3 is placed on the stage 49 in the transport unit 60 shown in FIG. 3 and before the component 5 is thermocompression-bonded to the board 3 by the thermocompression unit 42, When the self-apparatus abnormality signal is received, the board 3 is separated from the stage 49 by the transport unit 60 without thermocompression bonding the component 5 to the board 3 by the thermocompression unit 42, and then the thermocompression bonding apparatus 100 is stopped. . More specifically, in step S108, the control unit 2a controls the arm unit 64 and the stage 49 to attract the substrate 3 placed on the stage 49 with the arm unit 64 and separate the substrate 3 from the stage 49. Let it. For example, in the states of FIGS. 5C to 5G, the control unit 2a moves the substrate 3 so that the substrate 3 is in the state of FIG. The arm unit 64 and the substrate moving mechanism 41) are controlled.

  In addition, for example, in the state of FIG. 6 (h) to FIG. 6 (l), when the own device abnormality signal is received, the control unit 2a puts the board 3 into the state of FIG. 6 (m). As described above, the transfer unit 110 (specifically, the arm unit 64 and the stage 49) may be controlled.

  Further, in step S107 and step S108, the control unit 2a moves the substrate 3 to a state where the substrate 3 is separated from the stage 49 without performing the full pressure bonding shown in FIG. Should be stopped. Specifically, the control unit 2a may stop the operation of the thermocompression bonding apparatus 100 after moving the substrate 3 to the state shown in FIG. 5B, or may move the substrate 3 to the stage 37 or the stage 51. After the movement, the operation of the thermocompression bonding apparatus 100 may be stopped. Alternatively, the component mounting line 1 may further include a stage for moving the substrate 3 from the stage 49.

  As described above, when the control unit 2 a receives the self-device abnormality signal indicating the abnormality of the thermocompression bonding apparatus 100 before performing thermocompression bonding by the thermocompression bonding unit 42, the thermocompression bonding unit 42 attaches the component 5 to the substrate 3. After the substrate 3 is separated from the stage 49 by the transport unit 60 without performing the thermocompression bonding, the thermocompression bonding apparatus 100 is stopped after that.

  According to such a configuration, the control unit 2a is heated by the heater 49b even in a situation where the device of the thermocompression bonding apparatus 100 breaks down during the main compression bonding process and the thermocompression bonding apparatus 100 has to be stopped. The substrate 3 can be separated from the stage 49. Therefore, the substrate 3 is kept mounted on the stage 49 heated by the heater 49b, thereby avoiding deterioration due to continued heating. Thereby, according to the thermocompression bonding apparatus 100, generation of defective products is suppressed.

  In addition, the control unit 2a determines whether the received abnormal signal is an own device abnormal signal indicating an abnormality of the thermocompression bonding device 100 (specifically, the main crimping unit 40), or whether the received abnormal signal is the thermocompression bonding device 100 (specific Specifically, the control content is appropriately changed depending on whether or not the other device abnormality signal indicates an abnormality other than the main crimping section 40). By doing so, for example, when the abnormality of the device included in the component mounting line 1 that caused the abnormal signal is removed and the component mounting line 1 is restarted, the control unit 2a can more efficiently mount the component. Each device of the line 1 can be operated. For example, since the occurrence of defects in the substrate 3 can be suppressed, each device included in the component mounting line 1 can be operated without removing the substrate 3 once in the thermocompression bonding step from the process.

  Note that when the control unit 2a determines that the received signal is not the own device abnormality signal indicating an abnormality of the main crimping unit 40 (No in Step S106), the control unit 2a may execute control according to the signal. For example, in step S109, when the control unit 2a receives an emergency stop signal indicating that all the devices included in the component mounting line 1 need to be urgently stopped, the control unit 2a stops all the devices included in the component mounting line 1. May be.

(Other embodiments)
As described above, the thermocompression bonding apparatus and the like according to the present embodiment have been described based on the above embodiment, but the present invention is not limited to the above embodiment.

  For example, in the above embodiment, all or a part of the components of the computer 2 may be configured by dedicated hardware, or may be realized by executing a software program suitable for each component. Good. Each component may be realized by a program execution unit such as a CPU (Central Processing Unit) or a processor reading and executing a software program recorded on a recording medium such as a HDD (Hard Disk Drive) or a semiconductor memory. Good.

  Further, the components of the computer 2 may be configured by one or a plurality of electronic circuits. Each of the one or more electronic circuits may be a general-purpose circuit or a dedicated circuit.

  One or a plurality of electronic circuits may include, for example, a semiconductor device, an integrated circuit (IC), or a large scale integration (LSI). The IC or LSI may be integrated on one chip, or may be integrated on a plurality of chips. Here, the term “IC” or “LSI” is used. However, the term “IC” or “LSI” changes depending on the degree of integration. An FPGA (Field Programmable Gate Array) programmed after manufacturing the LSI can be used for the same purpose.

  In addition, a form obtained by applying various modifications that can be conceived by those skilled in the art to each embodiment, and a combination of components and functions in each embodiment arbitrarily without departing from the spirit of the present invention are realized. Embodiments are also included in the present invention.

  INDUSTRIAL APPLICABILITY The present invention can be used for a thermocompression bonding apparatus included in a component mounting line for producing a liquid crystal panel.

DESCRIPTION OF SYMBOLS 1 Component mounting line 1a, 1b, 1c Base 2 Computer 2a Control part 2b Storage part 3 Substrate 4 Electrode part 5 Component 6 Anisotropic conductive member (ACF)
DESCRIPTION OF SYMBOLS 10 Substrate carry-in part 11,23,37,49,51 Stage 11a, 23a, 37a, 49a, 51a Suction hole 20 Adhering part 21,31,41 Substrate moving mechanism 22 Adhering mechanism 30 Temporary crimping part 32 Component mounting mechanism 33 Component supply unit 34 Mounting head 35 Mounting head moving mechanism 36 Mounting support base 40 Main crimping unit 42 Thermocompression unit 43 Crimp unit 43a Base unit 43b Guide unit 44 Crimp support unit 45 Crimp unit 46 Mounting member 47 Press mechanism 47a Rod 48 Crimp Head 49b Heater 50 Substrate unloading unit 60 Transfer unit 61 Moving base 62A, 62B, 62C, 62D Substrate transfer mechanism 63 Base 64 Arm unit 64a Suction nozzle 65 Suction pad 100 Thermocompression bonding device 110 Transfer unit

Claims (2)

The thermocompression bonding device of a component mounting line having a thermocompression bonding device for thermocompression bonding a component to a substrate,
A transfer unit for transferring the substrate,
A stage including a heater, on which the substrate transported by the transport unit is placed,
A thermocompression bonding section for thermocompression bonding a component to the substrate mounted on the stage,
A controller configured to cause the substrate to be mounted on the stage heated by the heater by the transport unit, and to perform a thermocompression bonding of the component by the thermocompression bonding unit to the substrate mounted on the stage. A device,
The control unit includes:
When the other device abnormality signal indicating the abnormality of the device having the component mounting line except the thermocompression bonding device is received, the component is thermocompression-bonded to the board by the thermocompression bonding section, and then the board is transferred. Part to separate from the stage, further, stop the thermocompression bonding device,
Thermocompression bonding equipment. A thermocompression bonding method performed by the thermocompression bonding device of a component mounting line including a thermocompression bonding device for thermocompression bonding a component to a substrate,
A mounting step of mounting the substrate on a stage heated by a heater by a transport unit,
Thermocompression bonding step of thermocompression bonding the component to the substrate mounted on the stage,
Following the placing step, when receiving another device abnormality signal indicating an abnormality of the device having the component mounting line except for the thermocompression bonding device, after completing the thermocompression bonding process, the substrate is removed. Separated from the stage by the transport unit, further, stop the thermocompression bonding device,
Thermocompression bonding method.

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