JP2012186260A - Component mounting system and component mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component mounting system and a component mounting method which can sufficiently investigate possible causes for a component determined as mounting failure to a substrate.SOLUTION: After performing a component transfer process (steps ST2-ST5) in which different receiving nozzles 57 respectively receive a plurality of components 3 supplied by a component supply unit 23 and transfer each of the components 3 to a prescribed pickup position and a component mounting process (steps ST6-ST8) in which the component 3 transferred to the pickup position is picked up and mounted on a substrate 2, correspondence relationship data recording a correspondence between the component 3 mounted on the substrate 2 and the receiving nozzle 57 by which the component 3 is transferred to the pickup position is created. Tracking data creation process (step ST9) that identifies movement path from when the component 3 is supplied to when the component 3 is mounted on the substrate 2 is performed using the correspondence relationship data.

Description

  The present invention relates to a component mounting system and a component mounting method for transferring a component supplied from a component supply unit to a predetermined pickup position by a component transfer unit and then picking up the component by a component mounting unit and mounting the component on a substrate. is there.

  In a component mounting system for manufacturing a liquid crystal panel in which components (electronic components) such as a drive circuit are mounted on terminals provided around a substrate (panel), an ACF (Anisotropic Conductive Film) attached to the terminals by an ACF mounting device. : An anisotropic conductive film). This temporary crimping apparatus receives a plurality of components supplied from a substrate positioning unit for positioning a substrate, a component supply unit for supplying components, and a plurality of components supplied from the component supply unit by different component receiving means. And a component mounting unit that picks up the component transferred to the pickup position by the component transfer unit and mounts the component on the substrate positioned by the substrate positioning unit. The components are mounted on the substrate by controlling the operation of the component supply unit, the component transfer unit, and the component mounting unit. Here, the component transfer unit has, for example, a configuration in which a plurality of nozzles (reception nozzles) that suck and receive components supplied from the component supply unit one by one are provided on the turntable. In addition, the component mounting unit is provided so as to be movable with respect to the substrate positioned by the substrate positioning unit, for example, by vacuum-sucking and picking up the component via the suction nozzle and releasing the vacuum suction on the substrate. It comprises one or a plurality of mounting heads for mounting components on a substrate.

  Here, the control device of the temporary crimping device temporarily operates according to an operation program that defines which mounting head (or which suction nozzle of the mounting head) of the component mounting portion mounts the component mounted on each terminal on the board. Operate each part of the crimping device. For this reason, as a result of inspecting the mounting state of each component mounted on the substrate by the inspection apparatus, the component determined to be defective in the mounting state on the substrate (for example, the actual mounting position relative to the target mounting position on the terminal is For parts that are significantly out of alignment, based on the operation program, create tracking data that identifies the movement path from when the part was supplied to when it was mounted on the board. Based on this, by pursuing the cause of the defective mounting state of the component, it is possible to prevent the quality of the board produced thereafter from being deteriorated (for example, Patent Document 1).

JP 2008-282964 A

  However, in the above-described conventional component mounting system (temporary pressure bonding apparatus), when the component supplied from the component supply unit is transferred to the pickup position by the component transfer unit, Which one is used is determined by the control device each time according to the situation at that time, so which part receiving means of the part transfer unit has transferred the part determined to be in a defective state to the pickup position. Cannot be traced from the operation program, and there is a problem that sufficient cause investigation cannot be performed for a component whose mounting state on the board is determined to be defective.

  Accordingly, an object of the present invention is to provide a component mounting system and a component mounting method capable of sufficiently investigating the cause of a component whose mounting state on a board is determined to be defective.

  The component mounting system according to claim 1 is configured to receive a substrate positioning unit that positions a substrate, a component supply unit that supplies components, and a plurality of components supplied from the component supply unit by different component receiving units. A component transfer unit that transfers each received component to a predetermined pickup position; a component mounting unit that picks up the component transferred to the pickup position by the component transfer unit and mounts the component on the substrate positioned by the substrate positioning unit; For each part mounted on the board, the correspondence data that records the correspondence between the part and the part receiving means that has transferred the part to the pickup position is created. The period from when the mounted component is supplied by the component supply unit to when it is mounted on the board by the component mounting unit is transferred. And a trace data generation means for generating a tracking data identifying the moving path.

  A component mounting system according to a second aspect is the component mounting system according to the first aspect, wherein an inspection unit that inspects a mounting state of each component mounted on the substrate on the substrate, and an inspection by the inspection unit. When it is determined by the first determination means that there is a mounting state defective component, based on the result, a first determination unit that determines whether there is a mounting state defective component that has a bad mounting state with respect to the board. A first notifying unit for identifying a component receiving unit that has transferred a defective mounting state component to the pickup position based on the tracking data created by the tracking data creating unit, and notifying the identified component receiving unit as a caution target; Prepared.

  The component mounting system according to claim 3 is the component mounting system according to claim 2, wherein the component mounting system is mounted on the board based on the result of the inspection by the inspection unit and the tracking data generated by the tracking data generation unit. Whether there is a statistical processing unit that performs statistical processing of the mounting state of components on the board for each component receiving unit, and whether there is a component receiving unit that satisfies the predetermined condition of the mounting state of components on the board as a result of statistical processing by the statistical processing unit A second determination unit that determines whether or not the component reception unit is specified when the second determination unit determines that there is a component reception unit that satisfies a predetermined condition of a component mounting state on the board. And second informing means for informing the specified part receiving means as a target of attention.

  According to a fourth aspect of the present invention, there is provided a component mounting method comprising: a substrate positioning step for positioning a substrate; a component supply step for supplying a component; and a plurality of components supplied in the component supply step received by different component receiving means. A component transfer step of transferring each received component to a predetermined pickup position, a component mounting step of picking up the component transferred to the pickup position in the component transfer step and mounting it on the substrate positioned in the substrate positioning step, and mounting on the substrate For each part, the correspondence data that records the correspondence between the part and the part receiving means that transferred the part to the pickup position is created, and then the part mounted on the board using the created correspondence data After being supplied in the component supply process, it is mounted on the board in the component mounting process. To create a tracking data identifying the movement path moved until that includes a tracking data producing step.

  The component mounting method according to claim 5 is the component mounting method according to claim 4, wherein an inspection process for inspecting a mounting state of each component mounted on the board and a result of the inspection in the inspection process Based on the first determination step of determining whether there is a mounting state defective component having a bad mounting state with respect to the board, and tracking when it is determined in the first determination step that there is a mounting state defective component A first notifying step of identifying a component receiving means that has transferred the defective mounting state component to the pickup position based on the tracking data created in the data creating step, and notifying the specified component receiving means as a target of caution.

  The component mounting method according to claim 6 is the component mounting method according to claim 5, wherein the component mounted on the board is based on the inspection result in the inspection step and the tracking data created in the tracking data creation step. Whether there is a statistical processing step that performs statistical processing of the mounting state on the board for each component receiving means, and whether there is a component receiving means that the mounting state of the components on the board satisfies a predetermined result as a result of the statistical processing in the statistical processing step A second determination step that performs the determination, and when it is determined in the second determination step that there is a component reception unit that satisfies the predetermined condition of the component mounting state on the board, the component reception unit is specified and specified A second notification step of notifying the received component receiving means as a caution target.

  In the present invention, for each component mounted on the board, correspondence data that records the correspondence between the component and the component receiving means that has transferred the component to the pickup position is created, and the created correspondence data is used. In addition, tracking data that identifies the movement path from the time the component mounted on the board is supplied until it is mounted on the board is created. By using this tracking data, It is possible to sufficiently investigate the cause of a component determined to be defective.

The block diagram of the component mounting system in one embodiment of this invention The figure which shows the advancing procedure of the component mounting operation | work with respect to the board | substrate by the component mounting system in one embodiment of this invention The perspective view of the temporary crimping | compression-bonding apparatus with which the component mounting system in one embodiment of this invention is provided The top view of the temporary crimping | compression-bonding apparatus in one embodiment of this invention The side view of the temporary crimping | compression-bonding apparatus in one embodiment of this invention The partial expanded front view of the temporary crimping | compression-bonding apparatus in one embodiment of this invention The block diagram which shows the control system of the temporary crimping | compression-bonding apparatus in one embodiment of this invention The flowchart which shows the flow of the temporary crimping operation which the temporary crimping | compression-bonding apparatus in one embodiment of this invention performs. The figure which shows an example of the tracking data memorize | stored in the memory | storage part of the temporary crimping | compression-bonding apparatus in one embodiment of this invention. The flowchart which shows the flow of the component mounting method which the component mounting system in one embodiment of this invention performs with respect to one board | substrate.

  Embodiments of the present invention will be described below with reference to the drawings. A component mounting system 1 for manufacturing a liquid crystal panel shown in FIG. 1 includes components such as a drive circuit (electronic circuit) on each of a plurality of terminals 2 a provided at the ends of a long side and a short side of a rectangular substrate (panel) 2. Component) 3 is mounted, and a terminal cleaning device 11, an ACF sticking device 12, a temporary crimping device 13, a first final crimping device 14, a second final crimping device 15 and an inspection device are executed. 16 are connected in this order. These devices 11 to 16 operate under integrated control by the host computer 17. When the production command is issued from the host computer 17, each of the devices 11 to 16 performs the work for each person in the component mounting work. Execute the process.

  The terminal cleaning device 11 constituting the component mounting system 1 receives the substrate 2 input from the outside, cleans each terminal 2a, and then carries the substrate 2 to the ACF adhering device 12 on the downstream process side.

  The ACF adhering device 12 receives the substrate 2 carried out from the terminal cleaning device 11 on the upstream process side, and receives an ACF (Anisotropic Conductive Film) 4 on each terminal 2a of the substrate 2 as shown in FIG. Is pasted out, and the substrate 2 is carried out to the temporary press-bonding device 13 on the downstream process side.

  The temporary pressure bonding device 13 receives the substrate 2 carried out from the ACF bonding device 12, mounts the component 3 on the ACF 4 bonded to each terminal 2 a of the substrate 2 (temporary pressure bonding), and then downstream the substrate 2. It is carried out to the first main crimping device 14 on the process side.

  The first main crimping device 14 receives the substrate 2 carried out from the temporary crimping device 13, and after thermocompression bonding (main crimping) the component 3 temporarily crimped to each terminal 2 a on the long side of the substrate 2, The substrate 2 is carried out to the second final crimping device 15 on the downstream process side.

  The second final crimping device 15 receives the substrate 2 carried out from the first final crimping device 14, and thermocompression-bonded (main-crimped) the component 3 that is temporarily crimped to each terminal 2 a on the short side of the substrate 2. Then, the substrate 2 is unloaded to the inspection device 16 on the downstream process side.

  The inspection device 16 receives the substrate 2 carried out from the second final crimping device 15, inspects the component 3 that is finally crimped to each terminal 2 a of the substrate 2, and performs various determination processes, and then the substrate 2 is removed. It is carried out of the component mounting system 1.

  Next, the provisional pressure bonding device 13 constituting the component mounting system 1 will be described in detail. 3, 4, and 5, the provisional pressure bonding device 13 is supplied on a base 21 from a substrate positioning unit 22 that positions the substrate 2, a component supply unit 23 that supplies components 3, and a component supply unit 23. A plurality of parts 3 are received by different parts receiving means (receiving nozzle 57 described later), and each received part 3 is transferred to a pickup position by a parts transfer section 24 and a parts transfer section 24 that transfer the received parts 3 to a predetermined pickup position. The component mounting unit 25 picks up the component 3 and mounts (temporarily press-bonds) it on the substrate 2 positioned by the substrate positioning unit 22. Hereinafter, for convenience of explanation, the left-right direction of the base 21 viewed from the operator OP is the X-axis direction, the front-rear direction of the base 21 viewed from the operator OP is the Y-axis direction, and the vertical direction of the base 21 is the Z-axis direction. . Further, the right side of the base 21 viewed from the operator OP is the right side and the left side is the left side, and the front side of the base 21 viewed from the operator OP is the front side and the back side is the rear side.

  4 and 5, the substrate positioning portion 22 is provided so as to be movable in the Y-axis direction with respect to the X table 31 provided relative to the base 21 in the X-axis direction and the X table 31. The Y table 32 includes a θ table 33 provided so as to be rotatable about the Z axis with respect to the Y table 32, and a substrate support table 34 provided on the upper surface of the θ table 33.

  3 and 6, the component supply unit 23 includes two left and right tape transport units 41 that transport the tape TP on which the component 3 is placed, and left and right punches the component 3 from the tape TP transported by the left and right tape transport units 41. Two part punching parts 42 are provided.

  3 and 6, the left and right tape transport units 41 are respectively a tape supply reel 41a for supplying (feeding out) the tape TP, and a tape take-up reel 41b for winding the tape TP supplied from the tape supply reel 41a. The cover tape take-up reel 41c is formed by removing the cover tape CT from the tape TP supplied from the tape supply reel 41a. In each tape transport section 41, the tape supply reel 41a, the tape take-up reel 41b, and the cover tape take-up reel 41c rotate synchronously, thereby supplying the tape TP from the tape supply reel 41a and using the tape take-up reel 41b. The tape TP is taken up and the cover tape CT is taken up from the tape TP by the cover tape take-up reel 41c, and a part of the tape TP from which the cover tape CT is peeled is conveyed in the horizontal plane direction (X-axis direction). Is done.

  5 and 6, the left and right component punching portions 42 are composed of a lower die 42a fixed to the base 21 and an upper die 42b that is moved up and down above the lower die 42a. Between the lower mold 42a and the upper mold 42b, the tape TP conveyed in the horizontal plane direction by the tape conveying unit 41 passes, and the upper mold 42b is lowered with respect to the lower mold 42a. Thus, the component 3 can be punched from the tape TP.

  3 and 6, the component transfer section 24 is provided so as to be relatively movable in the Y-axis direction with respect to the X-axis guide 51 provided on the base 21 so as to extend in the X-axis direction. Left and right Y-axis tables 52, left and right X-axis tables 53 provided so as to be movable in the X-axis direction with respect to each Y-axis table 52, and two left and right transfer heads 54 provided on each X-axis table 53 are provided. ing.

  Each transfer head 54 is rotatably provided around the Z axis with respect to the X axis table 53, and is driven by a table drive motor 55 (FIGS. 5 and 6) and rotated in a horizontal plane. 56 and a plurality (seven in this case) of receiving nozzles 57 (the above-described component receiving means) provided extending upward from the turntable 56. The plurality of receiving nozzles 57 can be individually moved up and down with respect to the turntable 56 by an actuator (not shown).

  Each transfer head 54 rotates the turntable 56 at a certain angle, so that any one of the plurality of receiving nozzles 57 is positioned below the lower die 42a of the component punching portion 42 (this position is hereinafter referred to as “ (Referred to as a receiving nozzle 57 indicated by a broken line in FIG. 5), and a receiving nozzle 57 raised at the component supplying position. Thus, after receiving and supporting the part 3 punched by the part punching part 42 from below, a series of movements including the operation of lowering the receiving nozzle 57 is repeated. In this way, the transfer head 54 receives the plurality of parts 3 continuously punched from the tape TP one after another by different receiving nozzles 57.

  Each of the transfer heads 54 moves to a predetermined position on the component mounting unit 25 side when receiving a plurality of components 3 punched by the component punching portion 42 by a plurality of receiving nozzles 57, and receives a plurality of receiving nozzles 3. By positioning one of 57 at a predetermined position (this position is hereinafter referred to as “nozzle movement position”), the pickup position of the component 3 by the component mounting portion 25 (this pickup position is the left and right mounting heads described later). There are two left and right parts corresponding to 63).

  The left and right transfer heads 54 are components 3 transferred to corresponding pickup positions (the left transfer head 54 corresponds to the left pickup position and the right transfer head 54 corresponds to the right pickup position). When picked up by the mounting portion 25, the turntable 56 is rotated by a certain angle so that the component 3 is newly transferred to the pickup position by the receiving nozzle 57 located next to the receiving nozzle 57 from which the component 3 has been picked up. .

  3, 4, and 5, the component mounting portion 25 includes a pair of left and right columns 61 a erected on the base 21, and a horizontal direction (X-axis direction) of the base 21 spanning the pair of columns 61 a. ), A left and right X-axis moving body 62 movably provided in the X-axis direction along the horizontal member 61b of the gate-shaped frame 61, and each X-axis moving body. Two left and right mounting heads 63 provided movably in the Y-axis direction with respect to 62, a backup unit 64 provided on the base 21 and positioned below the mounting head 63, and a camera provided on the backup unit 64 65.

  3 and 5, the mounting head 63 includes a single suction nozzle 63a that extends downward. The suction nozzles 63a included in the two left and right mounting heads 63 receive vacuum pressure from an air supply source (not shown) to perform vacuum suction of the component 3 and its release operation.

  In FIG. 5, a backup unit 64 includes an X-axis member 64a provided extending in the X-axis direction between the board positioning unit 22 and the component supply unit 23, and a slider provided so as to be horizontally movable along the X-axis member 64a. 64b, and a backup stage 64c (see also FIG. 3) provided to project forward from the top of the slider 64b in the Y-axis direction.

  The left and right mounting heads 63 correspond to the corresponding pickup positions by the corresponding transfer heads 54 of the component transfer unit 24 (the left transfer head 54 and the left pickup position correspond to the left mounting head 63, and the right mounting head 63. The parts 3 transferred to the right transfer head 54 and the right pickup position correspond to each other by vacuum suction by the suction nozzle 63a, and the parts 3 are mounted on the terminals 2a of the board 2 positioned by the board positioning unit 22. To do. At this time, the backup stage 64c of the backup unit 64 is positioned below the terminal 2a of the substrate 2, and the mounting head 63 presses the component 3 together with the terminal 2a against the backup stage 64c (FIG. 5). The terminals 2a on the long side and the terminals 2a on the short side of the substrate 2 positioned by the temporary crimping device 13 are placed on the ACF 4 by the ACF sticking device 12 installed on the upstream process side of the temporary crimping device 13. Is attached (see FIG. 4).

  In FIG. 5, the camera 65 is supported in a state where the imaging field of view is directed upward by a camera support portion 64d attached to the lower portion of the slider 64b (below the backup stage 64c) provided in the backup portion 64. As shown in FIG. 5, the backup stage 64 c is provided with a through hole 64 e extending in the vertical direction along the optical axis of the camera 65, and the camera 65 is connected to each terminal of the substrate 2 positioned by the substrate positioning unit 22. A terminal-side mark (not shown) provided on 2a and a component-side mark (not shown) provided on each component 3 sucked by the suction nozzle 63a of the mounting head 63 are viewed from below through a through hole 64e. It can be seen at the same time.

  Positioning operation of the substrate 2 by the substrate positioning unit 22 (movement operation of the X table 31 constituting the substrate positioning unit 22 in the X axis direction with respect to the base 21, movement operation of the Y table 32 with respect to the X table 31 in the Y axis direction, and The rotation operation of the θ table 33 around the Z axis with respect to the Y table 32) is performed by the control device 70 (FIG. 7) of the provisional pressure bonding device 13 to control the operation of the substrate positioning unit drive mechanism 71 (FIG. 7) including an actuator (not shown). Made by doing.

  The transport operation of the tape TP by the left and right tape transport units 41 constituting the component supply unit 23 is performed when the control device 70 controls the operation of a tape transport mechanism 72 (FIG. 7) including an actuator (not shown). In the punching operation of the part 3 from the tape TP by the left and right part punching parts 42 constituting the part supply part 23, the control device 70 controls the operation of the part punching part drive mechanism 73 (FIG. 7) including an actuator (not shown). Is made by

  Transfer operation of the component 3 by the left and right transfer heads 54 constituting the component transfer unit 24 (movement operation of each Y-axis table 52 in the Y-axis direction with respect to the X-axis guide 51, X of the X-axis table 53 with respect to each Y-axis table 52 The control device 70 includes the table drive motor 55 described above for the movement operation in the axial direction, the rotation operation of the turntable 56 around the Z axis with respect to each X-axis table 53, and the lifting operation of each receiving nozzle 57 with respect to the turntable 56. This is done by controlling the operation of the component transfer unit drive mechanism 74 (FIG. 7) including an actuator or the like.

  Movement operation of the left and right mounting heads 63 in the component mounting unit 25 (moving operation of each X-axis moving body 62 in the X-axis direction relative to the lateral member 61b of the portal frame 61 and Y of the mounting head 63 relative to each X-axis moving body 62) The movement operation in the axial direction) is performed when the control device 70 controls the operation of the mounting head moving mechanism 75 (FIG. 7) including an actuator (not shown).

  The suction and release operation of the component 3 by each mounting head 63 is performed by controlling the operation of a vacuum suction operation control mechanism 76 (FIG. 7) including an actuator connected to the air supply source (not shown). This is done by supplying a vacuum pressure in 63a or by supplying a positive pressure in the suction nozzle 63a to break the vacuum in the suction nozzle 63a.

  The imaging operation by the camera 65 is controlled by the control device 70 (FIG. 7), and the image data obtained by the imaging operation of the camera 65 is sent to the image recognition unit 70a (FIG. 7) of the control device 70 for image recognition. .

  In FIG. 7, a touch panel 77 as an input / output device is connected to the control device 70, and an operator OP can receive a message via the touch panel 77 and inputs a necessary command via the touch panel 77. be able to.

  In FIG. 7, the control device 70 is provided with a storage unit 70b. The storage unit 70b stores an operation program for executing the temporary crimping work (work for temporarily crimping the component 3 onto the board 2) that the temporary crimping apparatus 13 takes charge of during the component mounting work of the component mounting system 1. When the production command is issued from the host computer 17 of the component mounting system 1 to the temporary crimping device 13, the control device 70 executes the operation program read from the storage unit 70b to operate each part of the temporary crimping device 13. Let

  In the operation program executed by the control device 70 of the temporary crimping device 13, it is specified which mounting head 63 is used to mount the component 3 mounted on each terminal 2 a on the substrate 2. ing. On the other hand, which receiving nozzle 57 is used when the right and left transfer heads 54 constituting the component transfer unit 24 transfer the component 3 received from the component supply unit 23 to the pickup position is controlled according to the situation at each time. Since it is determined by the apparatus 70, it is not defined in the operation program which receiving nozzle 57 of the left and right transfer heads 54 provided in the component transfer unit 24 is used to transfer the component 3 to the pickup position.

  When the component 3 is mounted on the substrate 2 in accordance with the operation program stored in the storage unit 70b, the control device 70 of the temporary crimping device 13 is first sent from the ACF adhering device 12 which is an upstream process device. The substrate 2 (ACF 4 is attached to each terminal 2a of the substrate 2) is loaded into the temporary crimping device 13 by a substrate loading device (not shown), and then placed on the substrate support table 34 of the substrate positioning unit 22. A substrate positioning step is performed to place the substrate 2 and position the substrate 2 at a predetermined position by controlling the operation of the substrate positioning unit drive mechanism 71 (step ST1 shown in FIG. 8).

  After positioning the substrate 2, the control device 70 moves the left and right transfer heads 54 to the component supply unit 23 side, and still receives the component 3 among the plurality of receiving nozzles 57 provided in each transfer head 54. One that is not located is positioned at a component supply position corresponding to the transfer head 54 (the left component supply position for the left transfer head 54 and the right component supply position for the right transfer head 54) (FIG. 8). Step ST2).

  At this time, which of the plurality of receiving nozzles 57 included in each transfer head 54 is positioned at the component supply position to receive the component 3 is determined by the control device 70 each time according to the situation at that time, The control device 70 stores information on the determined content (which receiving nozzle 57 is positioned at the component supply position) in the storage unit 70b. At this time, the data stored in the storage unit 70b indicates the correspondence between the component 3 and the receiving nozzle 57 that has transferred the component 3 to the pickup position for each component 3 mounted on the board 2 later. This is used when creating correspondence data to be recorded, which will be described later.

  When the control device 70 positions one of the plurality of receiving nozzles 57 included in each of the left and right transfer heads 54 at the corresponding component supply position, the control device 70 operates the left and right tape transport units 41 to transport the tape TP. The component punching part 42 (the left part punching part 42 for the left tape transporting part 41 and the left part punching part 42 for the right tape transporting part 41) is operated to remove the part 3 from the tape TP. The component 3 is supplied to the left and right two component supply positions by the component supply unit 23 by punching and supplied to the two left and right component supply positions of the component supply unit 23 (punched by the component punching unit 42). The component 3 is received by the receiving nozzles 57 of the left and right transfer heads 54 positioned at the respective component supply positions (shown in FIG. 8). Step ST3).

  The control device 70 determines whether or not all the parts 3 that can be received by each transfer head 54 have been received by the receiving nozzle 57 (step ST4 shown in FIG. 8). As a result, when the reception of all the parts 3 that can be received by each transfer head 54 has not been completed, the process returns to step ST2 and the part 3 has not yet been received among the plurality of receiving nozzles 57 provided in each transfer head 54. If no receiving nozzle 57 is positioned at the component supply position to receive the component 3 and all the components 3 that can be received by each transfer head 54 have been received, the process proceeds to the next step ST5.

  Here, the state where the reception of all the parts 3 that can be received by the transfer head 54 is completed means a state where all the receiving nozzles 57 included in the transfer head 54 have received the parts 3, If there is a receiving nozzle 57 that cannot receive the part 3 due to a factor or that the part 3 is not allowed to be received, the receiving nozzle 57 other than the receiving nozzle 57 has received the part 3.

  When the control device 70 detects that the reception of all the components 3 that can be received by the left and right transfer heads 54 has been completed, the control device 70 moves the left and right transfer heads 54 toward the component mounting portion 25, respectively. One of the plurality of receiving nozzles 57 in the received state is positioned at the aforementioned nozzle movement position. Thereby, the component 3 supplied from the component supply unit 23 is transferred to the pickup position (step ST5 shown in FIG. 8).

  In this way, step ST3 is a component supply process for supplying the component 3, and in steps ST2 to ST5, the plurality of components 3 supplied from the component supply unit 23 are received by different receiving nozzles 57 and received. In addition, it is a component transfer process for transferring each component 3 to a predetermined pickup position.

  When the control device 70 transfers the component 3 to the left and right pickup positions by the left and right transfer heads 54 constituting the component transfer unit 24, the control device 70 moves the left and right mounting heads 63 directly above the corresponding pickup positions, and uses the suction nozzle 63a. Then, the component 3 transferred to the pickup position is attracted and picked up (step ST6 shown in FIG. 8). Note that a series of steps from reception of the component 3 by each transfer head 54 to pickup of the component 3 by the left and right mounting heads 63 may be performed in parallel with the loading of the substrate 2.

  When the control device 70 causes the mounting heads 63 to pick up the components 3, the identification information of the receiving nozzles 57 that have transferred the components 3 picked up by the mounting heads 63 to the pickup position, that is, the receiving nozzles 57 used during the transfer of the components 3. (For example, the nozzle number assigned to each receiving nozzle 57) is stored in the storage unit 70b (step ST7 shown in FIG. 8), and mounting (temporary pressure bonding) of the component 3 picked up by the mounting head 63 onto the substrate 2 is performed. Performed (step ST8 shown in FIG. 8).

  In this way, in steps ST6 to ST8, the component 3 transferred to the pickup position in the component transfer process of steps ST2 to ST5 is picked up by the mounting head 63 and mounted on the substrate 2 positioned in the substrate positioning process of step ST1. It is a mounting process.

  In mounting the component 3 on the substrate 2 by the mounting head 63, the control device 70 first moves the mounting head 63 that has attracted the component 3 to the side of the substrate 2 positioned by the substrate positioning unit 22, and The component 3 is positioned immediately above 2a, and the terminal side mark provided on the substrate 2 and the component side mark provided on the component 3 are simultaneously viewed (imaged) from below by the camera 65. Then, the image recognition unit 70a performs image recognition of both marks, and moves the mounting head 63 so that these marks are aligned vertically, thereby aligning the component 3 and the terminal 2a of the substrate 2. (At the time of this alignment, as described above, the backup stage 64c is positioned below the terminal 2a. See FIG. 5), the suction nozzle 63a is lowered. As a result, the component 3 is pressed against the terminal 2a, and the component 3 is mounted on the terminal 2a (temporarily crimped).

  When the component 3 is mounted on the terminal 2a of the substrate 2 by the mounting head 63, the control device 70 sets one of the plurality of receiving nozzles 57 included in the transfer head 54 to the component supply position in step ST2. Correspondence between the component 3 mounted on the substrate 2 and the receiving nozzle 57 that has transferred the component 3 to the pickup position based on the information determined at the time of positioning (information on which receiving nozzle 57 is positioned at the component supply position) Create correspondence data that records the relationship. Then, the component supply unit 23 supplies the component 3 mounted on the board 2 from the created correspondence data and the data specifying the movement path of the component 3 obtained from the operation program stored in the storage unit 70b. The movement path in which the component 3 has moved from when the component is mounted to the substrate 2 by the component mounting unit 25 is specified by information identifying each part of the temporary crimping apparatus 13 involved in the movement of the component 3 (specifically, Tracking data for specifying the transfer head 54 that has transferred the part 3 and the receiving nozzle 57 and the mounting head 63 that has mounted the part 3 is created (step ST9 shown in FIG. 8).

  That is, in step ST9, for each component 3 mounted on the substrate 2, the correspondence data recording the correspondence relationship between the component 3 and the receiving nozzle 57 that has transferred the component 3 to the pickup position is created, and then the creation is performed. Using the correspondence relationship data, the movement that has been performed after the component 3 mounted on the board 2 is supplied in the component supply process in step ST3 until it is mounted on the board 2 in the component mounting process in steps ST6 to ST8. This is a tracking data creation process for creating tracking data for specifying a route.

  As shown in FIG. 9, the tracking data includes at least a board ID given to each board 2 as identification information of the board 2, and a terminal given to each terminal 2a as identification information of the position of the terminal 2a on the board 2. Position number, left and right identification codes (L, R) of the turntable 56 as identification information of the receiving nozzle 57, and identification numbers (01, 02,...) Of each receiving nozzle 57 provided on each turntable 56 .., 07), and identification information (L, R) on the left and right of each mounting head 63 is included as identification information of the mounting head 63. That is, in the tracking data, for each component 3 mounted on the board 2, it is defined which terminal 2 a on the board 2 is mounted by the mounting head 63 on either side of each component 3 supplied by the component supply unit 23. In addition to the contents of the operation program, the correspondence relationship between the part 3 and the receiving nozzle 57 that has transferred the part 3 to the pickup position is recorded. The control device 70 stores the created tracking data in the storage unit 70b and also transmits the tracking data to the host computer 17 to be stored in a storage unit (not shown) included in the host computer 17.

  In the tracking data shown in FIG. 9, the combination of two terms of the board ID and the terminal position number and two terms of the left and right identification codes of the turntable 56 and the identification number of the receiving nozzle 57 is the control device 70. Of the component 3 obtained from the operation program in which the combination of the two terms of the board ID and the terminal position number and the left and right identification codes of the mounting head 63 is stored in the storage unit 70b. Corresponds to the data that identifies the travel route.

  In this way, the control device 70 creates correspondence data that records the correspondence between the component 3 and the receiving nozzle 57 that has transferred the component 3 to the pickup position for each component 3 mounted on the board 2. Using the created correspondence data, the movement path from the time when the component 3 mounted on the substrate 2 is supplied by the component supply unit 23 to the time when the component 3 is mounted on the substrate 2 by the component mounting unit 25 is specified. It functions as a tracking data creation means for creating tracking data.

  When the control device 70 creates tracking data for the component 3 mounted on the board 2 in step ST9, whether or not the mounting of all the components 3 on the board 2 on which the component 3 is currently mounted has been completed. A determination is made (step ST10 shown in FIG. 8). The temporary crimping device 13 temporarily crimps the component 3 to each terminal 2 a on the long side of the substrate 2, and then rotates the substrate 2 by 90 degrees by the substrate positioning unit 22 to each terminal 2 a on the short side of the substrate 2. Since the component 3 is temporarily crimped, whether or not the mounting of all the components 3 to the substrate 2 on which the component 3 is currently mounted has been completed depends on all the terminals 2a on the long side and the short side of the substrate 2. Judgment is made based on whether or not the component 3 is mounted on the.

  If the controller 70 determines in step ST10 that the mounting of all the components 3 on the board 2 to which the components 3 are currently mounted has not been completed, all the components received by the left and right transfer heads 54 are received. 3 is determined whether or not the mounting of the 3 on the substrate 2 is completed (step ST11 shown in FIG. 8). As a result, when it is determined that the mounting of all the components 3 received by the left and right transfer heads 54 to the substrate 2 has not been completed, the process returns to step ST5, and there is a component 3 that has not yet been mounted on the substrate 2. The part 3 is transferred to the pickup position by rotating the turntable 56 of the transfer head 54 on the moving side by a certain angle.

  On the other hand, if the control device 70 determines in step ST11 that the mounting of all the components 3 received by the left and right transfer heads 54 to the substrate 2 has been completed, the control device 70 returns to step ST2 to supply the transfer head 54 with the components. The part 3 is received by moving the receiving nozzle 57 at the part supply position. If the controller 70 determines in step ST10 that the mounting of all the components 3 on the substrate 2 on which the components 3 are currently mounted has been completed, the controller 2 removes the substrate 2 from the temporary crimping device 13. The work is carried out and the temporary press-bonding operation for each substrate 2 is completed (step ST12 shown in FIG. 8).

  Thus, the board | substrate 2 carried out from the temporary crimping | compression-bonding apparatus 13 is carried in to the 1st main crimping | compression-bonding apparatus 14, and after the component 3 temporarily crimped | bonded to the terminal 2a of the long side of the board | substrate 2 is finally crimped | bonded, It is carried out from one main crimping device 14 and carried into the second main crimping device 15. Then, after the component 3 temporarily crimped to the terminal 2 a on the short side of the substrate 2 in the second final crimping device 15 is finally crimped, the component 3 is unloaded from the second final crimping device 15 and loaded into the inspection device 16. In the inspection apparatus 16, each component 3 mounted on the terminal 2a of the board 2 is inspected.

  The inspection performed by the inspection device 16 is to check the mounting state of each component 3 mounted on the substrate 2 on the substrate 2 and is mounted on the substrate 2 by scanning an inspection camera (not shown) on the substrate 2. The amount of displacement of the component 3 from the target mounting position on the terminal 2a (ΔX: displacement amount in the X-axis direction, ΔY: displacement amount in the Y-axis direction: Δθ: displacement amount in the θ-direction, that is, the displacement amount around the Z axis). measure. Then, the positional deviation amount for each component 3 is written into the tracking data (the tracking data is received from the host computer 17) created by the control device 70 of the temporary crimping apparatus 13 (FIG. 9). .

  As described above, when the inspection device 16 creates new tracking data in which the positional deviation amount for each component 3 is added to the tracking data created by the control device 70 of the temporary crimping device 13, the new tracking data is created. (Ie, based on the result of the inspection), among the components 3 mounted on the board 2, the amount of displacement from the target mounting position on the terminal 2 a exceeds a predetermined threshold. A first determination step is performed to determine whether there is a mounting state defective part having a bad state. As a result, when the inspection device 16 determines that there is a defective mounting state component, the defective mounting state component is set at the pickup position based on the tracking data generated by the control device 70 of the temporary crimping device 13. The first receiving step of specifying the transferred receiving nozzle 57 and notifying the operator OP of the specified receiving nozzle 57 as a caution target is executed. This first notification step is executed by the inspection device 16 by notifying itself of the information of the specified receiving nozzle 57, or is transmitted to the control device 70 of the temporary pressure bonding device 13 via the host computer 17. This is performed by operating the touch panel 77 included in the temporary pressure bonding device 13 by the control device 70.

  Here, the contents notified to the operator by the inspection device 16 in the first notification step include, for example, that a defective mounting state component has been found, the position of the terminal 2a where the defective mounting state component is mounted, and the component 3 thereof. For example, a moving path moved from when (a mounting state defective part) is supplied to when it is mounted on the substrate 2. Then, as information indicating the movement path of the defective mounting state component, another identification code (L, R) on the left and right of the transfer head 54 that has transferred the supplied component 3 to the pickup position, the receiving nozzle 57 on the turntable 56. Identification numbers (01, 02,..., 07) and other identification codes (L, R) on the left and right of the mounting head 63 on which the component 3 is mounted on the substrate 2.

  As described above, the inspection device 16 functions as an inspection unit that inspects the mounting state of each component 3 mounted on the substrate 2 on the substrate 2. In addition, the inspection device 16 is a first determination unit that determines whether there is a defective mounting state component with a poor mounting state with respect to the substrate 2 based on a result of an inspection by itself (inspection device 16) as the inspection unit. Also works. Further, the touch panel 77 of the inspection device 16 and the temporary pressure bonding device 13 is created by the control device 70 of the temporary pressure bonding device 13 as tracking data creating means when it is determined by the first determination means that there is a mounting state defective part. Based on the tracked data, the receiving nozzle 57 that has moved the defective mounting state component to the pickup position is specified, and functions as a first notification means for notifying the operator OP of the specified receiving nozzle 57 as a caution target.

  Further, the inspection apparatus 16 applies to the substrate 2 based on the result of the inspection by itself (inspection apparatus 16) as the inspection means and the tracking data created by the control device 70 of the temporary crimping apparatus 13 as the tracking data creation means. A statistical process is performed for each nozzle 57 that receives statistical processing of the mounting state of the mounted component 3 on the substrate 2. Then, as a result of the statistical processing, the inspection apparatus 16 executes a second determination step of determining whether or not there is a receiving nozzle 57 in which the mounting state of the component 3 on the board 2 satisfies a predetermined condition. In the second determination step, when it is determined that there is a receiving nozzle 57 in which the mounting state of the component 3 on the board 2 satisfies the predetermined condition, the receiving nozzle 57 is specified, and the specified receiving nozzle is specified. A second notification step of notifying the operator OP of 57 as a caution target is executed.

  Specifically, the inspection device 16, for example, statistics on the relationship between the positional deviation amount (ΔX, ΔY, Δθ) of each component 3 recorded in the tracking data and the receiving nozzle 57 that has transferred the component 3 to the pickup position. In the case where a receiving nozzle 57 in which an abnormal tendency such as the amount of positional deviation of the component 3 gradually increases is found as a result, information for identifying the receiving nozzle 57 (of the transfer head 54) The inspection device 16 itself notifies the right and left separate identification codes and the identification number of the receiving nozzle 57) or transmits it to the control device 70 of the temporary pressure bonding device 13 via the host computer 17, and the pressure pressure bonding is performed by the control device 70. The 2nd alerting | reporting process is performed by operating the touch panel 77 with which the apparatus 13 is provided. Here, the amount of misalignment of the component 3 gradually increases, which corresponds to the mounting state of the component 3 satisfying a predetermined condition. In addition, the total misalignment amount exceeds a predetermined value. The state where the standard deviation of the positional deviation amount exceeds a predetermined value or the like may correspond to a case where a predetermined condition is satisfied.

  Thus, the inspection device 16 of the component mounting system 1 is based on the result of the inspection by itself (inspection device 16) as the inspection means and the tracking data created by the control device 70 of the temporary crimping device 13 as the tracking data creation means. Thus, it functions as statistical processing means that receives statistical processing of the mounting state of the component 3 mounted on the substrate 2 on the substrate 2 for each nozzle 57. Further, the inspection device 16 determines whether or not there is a receiving nozzle 57 in which the mounting state of the component 3 on the board 2 satisfies a predetermined condition as a result of statistical processing by itself (inspection device 16) as the statistical processing means. It also functions as second determination means. Further, the touch panel 77 provided in the inspection device 16 and the provisional pressure bonding device 13 includes a receiving nozzle 57 in which the mounting state of the component 3 on the substrate 2 satisfies a predetermined condition by itself (inspection device 16) as the second determination unit. When it is determined, the receiving nozzle 57 is specified, and the receiving nozzle 57 functions as a second notification unit that notifies the specified receiving nozzle 57 as a target of attention.

  Next, a component mounting method by the component mounting system 1 will be described. In the component mounting method by the component mounting system 1, first, as described above, a cleaning process (step ST21 shown in FIG. 10) for cleaning each terminal 2a of the substrate 2 by the terminal cleaning device 11, and cleaning by the ACF adhering device 12 are performed. An ACF adhering step (step ST22 shown in FIG. 10) for adhering ACF4 to each terminal 2a of the substrate 2 after the process is completed, and the temporary crimping apparatus 13 is used to attach each part 2a of the substrate 2 after the ACF adhering process. 3 is temporarily crimped (step ST23 shown in FIG. 10; details are shown in the flowchart of FIG. 8), and the first final crimping device 14 is used to connect each terminal 2a on the long side of the substrate 2 after the temporary crimping process. The first final crimping step (step ST24 shown in FIG. 10) in which the component 3 is finally crimped to each of the terminals 2, and the respective terminals on the short side of the substrate 2 on which the first final crimping step has been completed. To the substrate 2 of each component 3 mounted on the substrate 2 on which the second main press-bonding step is completed by the second main press-bonding step (step ST25 shown in FIG. 10) and the inspection device 16 for main-bonding the component 3 to a. An inspection process (step ST26 shown in FIG. 10) for inspecting the mounting state of the is performed.

  Then, the inspection device 16 executes a first determination process for determining whether there is a defective mounting state component with a poor mounting state with respect to the substrate 2 based on the inspection result in the inspection step of step ST26 (FIG. Step ST27 and step ST28 shown in FIG. 10, and as a result, if it is determined that there is a mounting state defective part, the mounting state defective part is set to the pickup position based on the tracking data created by the control device 70 of the temporary crimping apparatus 13. The transferred receiving nozzle 57 is specified, and a first notification process for notifying the operator OP of the specified receiving nozzle 57 as a caution target is executed (step ST29 shown in FIG. 10).

  On the other hand, when it is determined in the first determination step that there is no defective mounting state component or there is a defective mounting state component and the first notification step is performed, the inspection device 16 performs the inspection in step ST26. A statistical processing step is performed for each nozzle 57 that receives statistical processing of the mounting state of the component 3 mounted on the substrate 2 on the substrate 2 based on the result of the inspection in the process and the tracking data generated in the tracking data generation step of step ST9. It executes (step ST30 shown in FIG. 10). Then, as a result of the execution of the statistical processing step in step ST30, the inspection device 16 determines whether there is a receiving nozzle 57 in which the mounting state of the component 3 on the board 2 satisfies a predetermined condition. (Step ST31 and step ST32 shown in FIG. 10). As a result, if it is determined that there is a receiving nozzle 57 in which the mounting state of the component 3 on the board 2 satisfies the predetermined condition, the receiving nozzle 57 is A second notification step is performed in which the specified receiving nozzle 57 is specified and notified to the operator OP as a caution target (step ST33 shown in FIG. 10). Then, in the second determination step, the inspection device 16 determines that there is no receiving nozzle 57 in which the mounting state of the component 3 on the substrate 2 satisfies the predetermined condition, or the mounting state of the component 3 on the substrate 2 is predetermined. After determining that there is a receiving nozzle 57 that satisfies the above condition and executing the second notification step, a series of component mounting operations on one board 2 is finished.

  As described above, in the component mounting system 1 and the component mounting method according to the present embodiment, for each component 3 mounted on the substrate 2, the component 3 and the receiving nozzle 57 (component receiving means) that transfers the component 3 to the pickup position. The correspondence data in which the correspondence relation is recorded is created, and the created correspondence relation data is used to move from the supply of the component 3 mounted on the board 2 to the mounting on the board 2. Since tracking data for specifying the movement path is created, by using this tracking data, a sufficient cause search for the component 3 that is determined to be in a poor mounting state on the substrate 2 in step ST27. It can be performed.

  Further, based on the inspection result of the mounting state of each component 3 on the substrate 2 and the created tracking data, statistical processing of the mounting state of the component 3 mounted on the substrate 2 on the substrate 2 is performed for each receiving nozzle 57. When it is found that there is a receiving nozzle 57 in which the mounting state of the component 3 on the board 2 satisfies a predetermined condition, the receiving nozzle 57 is specified and notified to the operator OP. 57 (for example, when the receiving nozzle 57 is bent or when the mounting portion is loose with respect to the turntable 56), the mounting state of the component 3 on the substrate 2 becomes defective, and the production substrate itself is not used. It can be prevented that it becomes a non-defective product.

  Provided are a component mounting system and a component mounting method capable of sufficiently investigating the cause of a component whose mounting state on a board is determined to be defective.

DESCRIPTION OF SYMBOLS 1 Component mounting system 2 Board | substrate 3 Component 16 Inspection apparatus (Inspection means, 1st determination means, 1st alerting | reporting means, statistical processing means, 2nd determination means, 2nd alerting | reporting means)
22 substrate positioning unit 23 component supply unit 24 component transfer unit 25 component mounting unit 57 receiving nozzle (component receiving means)
70 Control device (tracking data creation means)
77 Touch panel (first notification means, second notification means)

Claims (6)

A substrate positioning unit for positioning the substrate;
A component supply unit for supplying components;
A component transfer unit that receives a plurality of components supplied from the component supply unit by different component receiving means and transfers each received component to a predetermined pickup position;
A component mounting unit that picks up the component transferred to the pickup position by the component transfer unit and mounts it on the substrate positioned by the substrate positioning unit;
For each part mounted on the board, after creating correspondence data that records the correspondence between the part and the part receiving means that has transferred the part to the pickup position, the created correspondence data is used to create the board. And a tracking data creating means for creating tracking data for specifying a moving path from when the component mounted on the board is supplied by the component supply unit to when it is mounted on the board by the component mounting unit. Component mounting system. Inspection means for inspecting the mounting state of each component mounted on the substrate to the substrate;
First determination means for determining whether there is a mounting state defective component whose mounting state with respect to the substrate is defective based on a result of the inspection by the inspection unit;
When it is determined by the first determination means that there is a mounting state defective part, the part receiving means for transferring the mounting state defective part to the pickup position is specified based on the tracking data created by the tracking data creation means, The component mounting system according to claim 1, further comprising: a first notification unit that notifies the specified component receiving unit as a caution target. A statistical processing means for performing statistical processing of the mounting state of the component mounted on the board on the board based on the result of the inspection by the inspection means and the tracking data created by the tracking data creating means;
As a result of statistical processing by the statistical processing means, second determination means for determining whether or not there is a component receiving means in which the mounting state of the component on the board satisfies a predetermined condition;
When it is determined by the second determination means that there is a component receiving means that the mounting state of the component on the board satisfies the predetermined condition, the component receiving means is specified, and the specified component receiving means is notified as a caution target. The component mounting system according to claim 2, further comprising a second notification unit. A substrate positioning step for positioning the substrate;
A component supply process for supplying components;
A component transfer step of receiving a plurality of components supplied in the component supply step by different component receiving means and transferring each received component to a predetermined pickup position;
A component mounting step of picking up the component transferred to the pickup position in the component transfer step and mounting it on the substrate positioned in the substrate positioning step;
For each part mounted on the board, create correspondence data that records the correspondence between the part and the part receiving means that transferred the part to the pick-up position, and then use the created correspondence data to create a board. A tracking data creating step for creating tracking data for specifying a moving path from when the mounted component is supplied in the component supplying step to when the mounted component is mounted on the substrate in the component mounting step. Implementation system. An inspection process for inspecting the mounting state of each component mounted on the substrate to the substrate;
A first determination step for determining whether there is a mounting state defective component whose mounting state with respect to the substrate is defective based on a result of the inspection in the inspection step;
When it is determined in the first determination step that there is a defective mounting state component, the component receiving means that has transferred the defective mounting state component to the pickup position is identified based on the tracking data created in the tracking data creation step, and the identification is performed. The component mounting method according to claim 4, further comprising a first notification step of notifying the component receiving means as a caution target. Based on the inspection result in the inspection process and the tracking data created in the tracking data creation process, a statistical processing process for performing statistical processing on the mounting state of the component mounted on the board for each component receiving means,
As a result of the statistical processing in the statistical processing step, a second determination step for determining whether there is a component receiving means in which the mounting state of the component on the board satisfies a predetermined condition;
In the second determination step, when it is determined that there is a component receiving means that the mounting state of the component on the board satisfies the predetermined condition, the component receiving means is specified, and the specified component receiving means is notified as a caution target. 6. The component mounting method according to claim 5, further comprising: a notification step.

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