JP4579658B2 - Mounting device and mounting method for mounted member - Google Patents

Mounting device and mounting method for mounted member Download PDF

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JP4579658B2
JP4579658B2 JP2004336011A JP2004336011A JP4579658B2 JP 4579658 B2 JP4579658 B2 JP 4579658B2 JP 2004336011 A JP2004336011 A JP 2004336011A JP 2004336011 A JP2004336011 A JP 2004336011A JP 4579658 B2 JP4579658 B2 JP 4579658B2
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substrate
mounting
sides
tcp
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JP2006147858A (en
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敏郎 白石
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芝浦メカトロニクス株式会社
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この発明はたとえば液晶表示装置に用いられるガラス製のパネルなどの基板に、被実装部材としての電子部品、たとえばTCP(Tape Carrier Package)などを実装する被実装部材の実装装置及び実装方法に関する。   The present invention relates to a mounting apparatus and mounting method for a mounted member that mounts an electronic component such as a TCP (Tape Carrier Package) as a mounted member on a substrate such as a glass panel used in a liquid crystal display device.
たとえば、液晶表示装置を製造する場合、ガラス製のパネルなどの基板に、被実装部材としてしての電子部品であるTCPを実装するための実装装置が用いられる。TCPは上記基板の4つの辺のうち、少なくとも1つの辺を除く2つ或いは3つの辺に実装されることが多い。   For example, when manufacturing a liquid crystal display device, a mounting device for mounting TCP, which is an electronic component as a mounted member, on a substrate such as a glass panel is used. The TCP is often mounted on two or three sides of the four sides of the substrate except at least one side.
上記実装装置は上記基板が供給載置される実装ステージを有する。この実装ステージは上記基板の平面形状よりも面積の小さな載置面を有し、この載置面に上記基板が供給載置される。その際、上記基板は、上記TCPが実装される周辺部を上記実装ステージの載置面の周縁から外方に突出させて位置決め保持される。   The mounting apparatus has a mounting stage on which the substrate is supplied and mounted. The mounting stage has a mounting surface having a smaller area than the planar shape of the substrate, and the substrate is supplied and mounted on the mounting surface. At that time, the substrate is positioned and held by causing the peripheral portion on which the TCP is mounted to protrude outward from the periphery of the mounting surface of the mounting stage.
基板を実装ステージに供給載置した後、この基板のTCPを実装する辺に被実装部材であるテープ状の異方性導電部材が貼着される。ついで、この異方性導電部材が貼着された箇所に複数の上記TCPを1つずつ仮圧着した後、仮圧着されたTCPを加熱加圧して上記基板に本圧着するということが行われる。特許文献1にはこのような実装技術が示されている。
特開2002−319601号公報
After the substrate is supplied and mounted on the mounting stage, a tape-like anisotropic conductive member, which is a member to be mounted, is attached to the side of the substrate where the TCP is mounted. Next, after temporarily bonding the plurality of TCPs one by one to the place where the anisotropic conductive member is adhered, the temporarily bonded TCPs are heated and pressed to be finally bonded to the substrate. Patent Document 1 discloses such a mounting technique.
JP 2002-319601 A
上述した実装工程においては、タクトタイムを短縮して生産性の向上を図ることが要求されている。タクトタイムの短縮を図るために、従来はたとえば上記基板を実装ステージに搬送供給したり、TCPの実装が終えた基板を実装ステージから搬出するための時間を短縮するということが行われたり、基板への異方性導電部材の供給や仮圧着されるTCPの供給に要する時間を短縮するという改善が行われていた。   In the mounting process described above, it is required to improve the productivity by reducing the tact time. In order to shorten the tact time, conventionally, for example, the above-mentioned substrate is transported and supplied to the mounting stage, or the time for transporting the TCP-mounted substrate from the mounting stage is shortened. Improvements have been made in that the time required for supplying the anisotropic conductive member to and the TCP to be temporarily crimped is reduced.
しかしながら、基板の搬送時間の短縮や基板への異方性導電部材やTCPの供給時間の短縮には限界があるため、組み立て作業全体のタクトタイムを大きく短縮するということが難しかった。   However, since there is a limit to shortening the time for transporting the substrate and the time for supplying the anisotropic conductive member and TCP to the substrate, it has been difficult to greatly reduce the tact time of the entire assembly operation.
しかも、基板の複数の辺にTCPを実装する場合には、基板の一辺にTCPを実装したならば、この基板を90度回転させて次の辺にTCPを実装するということをそれぞれの基板に対して繰り返して行わなければならない。そのため、TCPを実装する基板の枚数が多くなればなる程、生産性の低下を招くということがあった。   In addition, when TCP is mounted on a plurality of sides of the board, if the TCP is mounted on one side of the board, the board is rotated 90 degrees and the TCP is mounted on the next side. It must be repeated for this. For this reason, the larger the number of substrates on which TCP is mounted, the lower the productivity.
とくに、基板にTCPを本圧着する場合、異方性導電部材を加圧加熱するために多くの時間が必要となる。しかしながら、異方性導電部材を加圧加熱する時間は異方性導電部材を確実に溶融硬化させなければならないため、短縮することができない。したがって、基板の複数の辺にTCPを実装する場合にはタクトタイムが大幅に増大するということがある。   In particular, when TCP is pressure-bonded to the substrate, a lot of time is required to pressurize and heat the anisotropic conductive member. However, the time for pressure-heating the anisotropic conductive member cannot be shortened because the anisotropic conductive member must be surely melted and cured. Therefore, when TCP is mounted on a plurality of sides of the substrate, the tact time may be greatly increased.
この発明は、基板の少なくとも1つの辺を除く複数の辺に対して被実装部材を実装する場合、その実装に要するタクトタイムを短縮することができるようにした被実装部材の実装装置及び実装方法を提供することにある。   In the present invention, when mounting a mounted member on a plurality of sides excluding at least one side of a substrate, a mounting device and a mounting method for the mounted member capable of reducing the tact time required for the mounting Is to provide.
この発明は、基板の4辺のうち、少なくとも一辺を除く残りの辺に被実装部材を実装する実装装置であって、
水平方向及び回転方向に駆動可能であって、上面に2枚の基板が上記被実装部材が実装されない辺を対向させるとともに残りの辺を全長にわたって上記上面の周縁から外方へ突出させて載置される実装ステージと、
この実装ステージの上面周縁から突出させた上記基板の辺の下面を支持するバックアップツールと、
このバックアップツールによって支持された基板の辺に上記被実装部材を加圧実装する加圧ツールとを具備し、
上記実装ステージを90度ずつ回転させてこの実装ステージの上面周縁から突出した上記基板の上記被実装部材が実装される辺を上記バックアップツールによって順次支持するとともに、上記基板の4つの辺のうちの2つの辺に被実装部材を実装する際に、同一方向に並んで位置する一方の基板の被実装部材が実装される一辺の上記実装ステージの周縁からの突出寸法を、他方の基板の被実装部材が実装されない一辺の突出寸法よりも大きくすることを特徴とする被実装部材の実装装置にある。
This invention is a mounting apparatus for mounting a member to be mounted on the remaining sides excluding at least one side of the four sides of the substrate,
It can be driven in the horizontal direction and the rotation direction, and the two substrates are placed on the upper surface with the side on which the mounting member is not mounted facing each other and the remaining side protruding outward from the peripheral edge of the upper surface over the entire length. Implementation stage
A backup tool that supports the lower surface of the side of the substrate protruding from the upper surface periphery of the mounting stage;
A pressurizing tool for pressurizing and mounting the mounted member on the side of the substrate supported by the backup tool;
The mounting stage is rotated by 90 degrees, and the side on which the mounted member of the substrate protruding from the peripheral edge of the mounting stage is sequentially supported by the backup tool, and of the four sides of the substrate. When mounting a mounted member on two sides, the protruding dimension from the peripheral edge of the mounting stage on one side on which the mounted member on one substrate positioned in the same direction is mounted is mounted on the other substrate. An apparatus for mounting a member to be mounted is characterized in that it is larger than the protruding dimension of one side where the member is not mounted.
この発明は、基板の4辺のうち、少なくとも一辺を除く残りの辺に被実装部材を実装する実装方法であって、
水平方向及び回転方向に駆動可能な実装ステージの上面に2枚の基板を上記被実装部材が実装されない辺を対向させるとともに残りの辺を全長にわたって上記上面の周縁から外方へ突出させて載置する工程と、
この実装ステージの上面周縁の一側から突出した上記基板の一辺の下面をバックアップツールによって支持する工程と、
上記バックアップツールによって支持された基板の辺に上記被実装部材を加圧実装する工程と、
上記実装ステージを90度ずつ回転させることで上記バックアップツールによって支持される上記基板の他の辺に上記被実装部材を順次実装する工程を具備し、
上記基板の4つの辺のうちの2つの辺に被実装部材を実装する際に、同一方向に並んで位置する一方の基板の被実装部材が実装される一辺の上記実装ステージの周縁からの突出寸法を、他方の基板の被実装部材が実装されない一辺の突出寸法よりも大きくすることを特徴とする被実装部材の実装方法にある。
This invention is a mounting method for mounting a member to be mounted on the remaining sides of at least one side of the four sides of the substrate,
Two substrates are placed on the upper surface of a mounting stage that can be driven in the horizontal direction and the rotational direction, with the side on which the mounted member is not mounted facing each other, and the remaining side protruding outward from the peripheral edge of the upper surface over the entire length. And a process of
A step of supporting the lower surface of one side of the substrate protruding from one side of the upper peripheral edge of the mounting stage with a backup tool;
A step of pressure mounting the mounted member on the side of the substrate supported by the backup tool;
Comprising sequentially mounting the mounted member on the other side of the substrate supported by the backup tool by rotating the mounting stage by 90 degrees ;
When mounting a mounted member on two of the four sides of the substrate, the one side on which the mounted member of one substrate positioned in the same direction is mounted is projected from the peripheral edge of the mounting stage. The mounting member mounting method is characterized in that the dimension is made larger than the protruding dimension of one side where the mounting member of the other substrate is not mounted.
この発明によれば、実装ステージに2枚の基板を供給載置し、この2枚の基板に対して被実装部材の実装を同時に行うため、1枚毎の基板に対して実装を行う場合に比べてタクトタイムの短縮を図ることが可能となる。   According to the present invention, when two substrates are supplied and mounted on the mounting stage, and the mounted member is mounted on the two substrates at the same time, when mounting on each substrate, Compared to this, the tact time can be shortened.
以下、この発明の第1の実施の形態を図1乃至図3を参照して説明する。この実施の形態は基板に仮圧着された被実装部材としての電子部品であるTCPを本圧着する場合について説明する。   A first embodiment of the present invention will be described below with reference to FIGS. In this embodiment, a description will be given of a case where TCP, which is an electronic component as a mounted member temporarily bonded to a substrate, is permanently bonded.
図1は大きさの異なる2枚のガラス板1a,1bを貼り合わせた基板1に仮圧着された被実装部材である電子部品としてのTCP2を本圧着するための実装装置を示す。この実装装置はテーブルユニット3を備えている。このテーブルユニット3はベース4上に矢印で示すX方向に沿って移動可能に設けられたXテーブル5を有する。このXテーブル5は上記ベース4の一端に設けられたX駆動源6によって駆動されるようになっている。   FIG. 1 shows a mounting apparatus for final pressure-bonding a TCP 2 as an electronic component which is a mounted member temporarily bonded to a substrate 1 having two glass plates 1a and 1b of different sizes bonded together. This mounting apparatus includes a table unit 3. The table unit 3 has an X table 5 provided on a base 4 so as to be movable along the X direction indicated by an arrow. The X table 5 is driven by an X drive source 6 provided at one end of the base 4.
上記Xテーブル5上にはYテーブル8が上記X方向と直交するY方向に沿って移動可能に設けられている。このYテーブル8は上記Xテーブル5に設けられたY駆動源9によってY方向に沿って駆動されるようになっている。   A Y table 8 is provided on the X table 5 so as to be movable along the Y direction orthogonal to the X direction. The Y table 8 is driven along the Y direction by a Y drive source 9 provided on the X table 5.
上記Yテーブル8上にはθ実装ステージとなるθテーブル11が水平面と直交する軸線を中心にして回転可能に設けられている。このθテーブル11は上記Yテーブル8に設けられたθ駆動源12によって回転駆動されるようになっている。すなわち、上記θテーブル11はX、Y及びθ方向に駆動可能となっている。   A θ table 11 serving as a θ mounting stage is provided on the Y table 8 so as to be rotatable about an axis perpendicular to the horizontal plane. The θ table 11 is rotationally driven by a θ drive source 12 provided on the Y table 8. That is, the θ table 11 can be driven in the X, Y, and θ directions.
上記ベース4の一端部にはバックアップツール13が第1のZ駆動源14によって矢印で示すZ方向である上下方向に駆動可能に設けられている。このバックアップツール13の上部には第1のヒータ15が設けられ、バックアップツール13の上部を所定の温度に加熱するようになっている。   A backup tool 13 is provided at one end of the base 4 so as to be driven in the vertical direction, which is the Z direction indicated by the arrow, by the first Z drive source 14. A first heater 15 is provided above the backup tool 13 so as to heat the upper part of the backup tool 13 to a predetermined temperature.
上記バックアップツール13の上方には加圧ツール17が第2のZ駆動源18によって矢印で示すZ方向、つまり下端を上記バックアップツール13の上端に接離させる方向に駆動可能に設けられている。この加圧ツール17の下端部には第2のヒータ19が設けられ、加圧ツール17の他端部を所定の温度に加熱するようになっている。   Above the backup tool 13, a pressing tool 17 is provided by a second Z drive source 18 so as to be driven in the Z direction indicated by the arrow, that is, the direction in which the lower end is brought into contact with and separated from the upper end of the backup tool 13. A second heater 19 is provided at the lower end of the pressurizing tool 17, and the other end of the pressurizing tool 17 is heated to a predetermined temperature.
図3(b)に示すように、上記基板1は平面形状が矩形状になっていて、一方の長辺10aを除く3つの辺に上記TCP2が本圧着される。TCP2を基板1に本圧着する前の工程では、まず図3(a)に示すように上記基板1の下のガラス板1aの3つの辺にそれぞれテープ状の異方性導電部材21が図示しない貼着装置によって貼着される。基板1の他方の長辺を10bとし、一対の短辺をそれぞれ10cとする。   As shown in FIG. 3B, the substrate 1 has a rectangular planar shape, and the TCP 2 is finally pressure-bonded to three sides excluding one long side 10a. In the step before the main pressure bonding of the TCP 2 to the substrate 1, first, as shown in FIG. 3A, the tape-like anisotropic conductive members 21 are not shown on the three sides of the glass plate 1a below the substrate 1, respectively. It is stuck by the sticking device. The other long side of the substrate 1 is 10b, and the pair of short sides is 10c.
ついで、上記基板1の長辺10bと一対の短辺10cとの3つの辺には、図3(b)に示すようにTCP2が供給され、その一端部が上記異方性導電部材21に所定の圧力で加圧されて貼着実装される。つまり、仮圧着される。この実施の形態では、基板1の長辺10bには4つのTCP2が仮圧着され、一対の短辺10cにはそれぞれ3つのTCP2が仮圧着される。   Next, TCP2 is supplied to the three sides of the long side 10b and the pair of short sides 10c of the substrate 1 as shown in FIG. It is pressed and mounted with a pressure of. That is, it is temporarily crimped. In this embodiment, four TCPs 2 are temporarily pressure-bonded to the long side 10b of the substrate 1, and three TCPs 2 are temporarily pressure-bonded to the pair of short sides 10c.
このようにしてTCP2が仮圧着された基板1は、2枚が一組となって上記テーブルユニット3のθテーブル11の載置面となる上面に図示しない搬入アームによって一度に供給される。θテーブル11の上面には、図1及び図2(a)に示すように2枚の基板1が供給されてたとえば真空吸着などの手段によって保持される。   Thus, the board | substrate 1 to which TCP2 was temporarily crimped | bonded together is supplied to the upper surface used as the mounting surface of the (theta) table 11 of the said table unit 3 at once by the carrying arm which is not shown in figure. As shown in FIGS. 1 and 2A, two substrates 1 are supplied to the upper surface of the θ table 11 and held by means such as vacuum suction.
すなわち、2枚の基板1は、TCP2が仮圧着されていない長辺10aを所定間隔で離間させて対向させるとともに、残りの3つの辺、つまり他方の長辺10b及び一対の短辺10cを上記θテーブル11の周縁から外方へ所定寸法突出させて供給保持される。   That is, the two substrates 1 have the long sides 10a to which the TCP 2 is not temporarily press-fitted spaced apart from each other at a predetermined interval, and the remaining three sides, that is, the other long side 10b and the pair of short sides 10c described above. The θ table 11 is supplied and held with a predetermined dimension protruding outward from the periphery.
このようにしてθテーブル11に供給保持された2枚の基板1に仮圧着されたTCP2の本圧着は以下のように行われる。まず、図1と図2(a)に示すように一方の基板1のTCP2が仮圧着された長辺10bをバックアップツール13側に向ける。ついで、この長辺10bに設けられた位置合わせマークを2つのカメラ(ともに図示せず)によって撮像し、その撮像信号に基いて上記長辺10bがバックアップツール13の上端面の上方に位置するよう上記X、Yテーブル5,8を駆動する。   In this way, the final pressure bonding of the TCP 2 temporarily bonded to the two substrates 1 supplied and held on the θ table 11 is performed as follows. First, as shown in FIG. 1 and FIG. 2A, the long side 10b to which the TCP 2 of one substrate 1 is temporarily bonded is directed to the backup tool 13 side. Next, the alignment mark provided on the long side 10b is imaged by two cameras (both not shown), and the long side 10b is positioned above the upper end surface of the backup tool 13 based on the imaging signal. The X and Y tables 5 and 8 are driven.
ついで、上記第1のZ駆動源14によってバックアップツール13を上昇方向に駆動し、このバックアップツール13の上端面によって上記基板1の長辺10bの下面を支持する。   Next, the backup tool 13 is driven in the upward direction by the first Z drive source 14, and the lower surface of the long side 10 b of the substrate 1 is supported by the upper end surface of the backup tool 13.
バックアップツール13によって基板1の長辺10bが支持されると、加圧ツール17が第2のZ駆動源18によって下降方向に駆動される。それによって、基板1の長辺10bに仮圧着された4つのTCP2の一端部を図1に示すようにフッ素樹脂などで作られた保護テープ22を介して上記加圧ツール17によって所定時間加圧加熱する。その結果、TCP2を基板1に仮圧着した異方性導電部材21が溶融硬化するから、これら4つのTCP2が基板1に一括して本圧着されることになる。   When the long side 10 b of the substrate 1 is supported by the backup tool 13, the pressing tool 17 is driven in the downward direction by the second Z drive source 18. As a result, one end portion of the four TCPs 2 temporarily bonded to the long side 10b of the substrate 1 is pressed for a predetermined time by the pressing tool 17 through the protective tape 22 made of fluororesin or the like as shown in FIG. Heat. As a result, the anisotropic conductive member 21 obtained by temporarily press-bonding the TCP 2 to the substrate 1 is melt-cured, so that these four TCP 2 are collectively press-bonded to the substrate 1.
このようにして一方の基板1の長辺10bのTCP2を本圧着したならば、加圧ツール17が上昇し、バックアップツール13が下降した後、θテーブル11がθ駆動源12によって図2(a)に矢印θ1で示す反時計方向に90度回転駆動される。それによって、図2(b)に示すように、θテーブル11の一辺から突出した2枚の基板1のそれぞれの一方の短辺10cがバックアップツール13側を向き、これらの短辺10cに設けられた図示しない位置合わせマークが同じく図示しないカメラによって撮像される。   If the TCP 2 of the long side 10b of one substrate 1 is thus pressure bonded, the pressure tool 17 is raised and the backup tool 13 is lowered, and then the θ table 11 is moved by the θ drive source 12 as shown in FIG. ) Is rotated 90 degrees counterclockwise as indicated by arrow θ1. Thereby, as shown in FIG. 2B, one short side 10c of each of the two substrates 1 protruding from one side of the θ table 11 faces the backup tool 13 and is provided on these short sides 10c. An alignment mark (not shown) is picked up by a camera (not shown).
ついで、図2(b)に示すように、2枚の基板1のそれぞれの一方の短辺10cがバックアップツール13の上方になるよう、X、Yテーブル5,8が上記カメラからの撮像結果に基いて駆動された後、上記バックアップツール13が上昇方向に駆動されて2枚の基板1の短辺10cの下面を支持する。   Next, as shown in FIG. 2 (b), the X and Y tables 5 and 8 are obtained as a result of imaging from the camera so that one short side 10c of each of the two substrates 1 is located above the backup tool 13. After being driven based on the above, the backup tool 13 is driven in the upward direction to support the lower surfaces of the short sides 10c of the two substrates 1.
2枚の基板1のそれぞれの短辺10cがバックアップツール13によって支持されたならば、加圧ツール17が下降し、一対の短辺10cに仮圧着された複数のTCP2が一括して加圧加熱されて本圧着される。   If the respective short sides 10c of the two substrates 1 are supported by the backup tool 13, the pressure tool 17 is lowered, and a plurality of TCPs 2 temporarily bonded to the pair of short sides 10c are collectively heated under pressure. Then, this is crimped.
2枚の基板1の一対の短辺10cにTCP2が本圧着されたならば、加圧ツール17が上昇し、バックアップツール13が下降してθテーブル11が図2(b)に矢印θ2で示す反時計方向に90度回転駆動され、他方の基板1のTCP2が仮圧着された他方の長辺10bをバックアップ13側に位置させる。ついで、その基板1の長辺10bに設けられた位置合わせマークがカメラ(ともに図示せず)によって撮像された後、カメラからの撮像結果に基いて上記長辺10bがバックアップ13の上方に位置決めされる。   If the TCP 2 is finally bonded to the pair of short sides 10c of the two substrates 1, the pressure tool 17 is raised, the backup tool 13 is lowered, and the θ table 11 is indicated by an arrow θ2 in FIG. The other long side 10b, which is rotated 90 degrees counterclockwise and the TCP2 of the other substrate 1 is temporarily bonded, is positioned on the backup 13 side. Next, after the alignment mark provided on the long side 10b of the substrate 1 is imaged by a camera (both not shown), the long side 10b is positioned above the backup 13 based on the imaging result from the camera. The
上記長辺10bがバックアップ13の上方に位置決めされると、バックアップ13が上昇して長辺10bの下面を支持し、ついで加圧ツール17が下降する。それによって、上記長辺10bに仮圧着された複数のTCP2が一括して加圧加熱されて本圧着される。以上で、2枚の基板1のそれぞれの長辺10bと、一対の短辺10cとに仮圧着されたTCP2が本圧着されることになる。   When the long side 10b is positioned above the backup 13, the backup 13 rises to support the lower surface of the long side 10b, and then the pressure tool 17 descends. As a result, the plurality of TCPs 2 temporarily bonded to the long side 10b are collectively pressurized and heated and finally bonded. As described above, the TCP 2 temporarily press-bonded to the long side 10b and the pair of short sides 10c of the two substrates 1 is finally pressure-bonded.
つぎに、θテーブル11を反時計方向にさらに90度回転させる。そして、一対の基板1の他方の一対の短辺10cをバックアップツール13側に向け、これらの短辺10cに設けられた図示しない位置合わせマークを、同じく図示しないカメラによって撮像する。   Next, the θ table 11 is further rotated 90 degrees counterclockwise. Then, the other pair of short sides 10c of the pair of substrates 1 is directed toward the backup tool 13, and an alignment mark (not shown) provided on these short sides 10c is imaged by a camera (not shown).
2枚の基板1はカメラの撮像結果に基いて一対の短辺10cがバックアップツール13上になるよう位置決めされ、バックアップツール13が上昇し、加圧ツール17が下降することで、これら2枚の基板1の他方の短辺10cに仮圧着された複数のTCP2が本圧着される。   The two substrates 1 are positioned so that the pair of short sides 10c are on the backup tool 13 based on the imaging result of the camera, the backup tool 13 is raised, and the pressurizing tool 17 is lowered. A plurality of TCPs 2 temporarily bonded to the other short side 10c of the substrate 1 are finally bonded.
2枚の基板1のそれぞれの他方の長辺10bと一対の短辺10cとの3つの辺にTCP2が本圧着されると、これら2枚の基板1は図示しない搬出アームによって一度に吸着保持されてθテーブル11から搬出されて次工程に受け渡される。   When the TCP 2 is finally pressure-bonded to the three sides of the other long side 10b and the pair of short sides 10c of the two substrates 1, the two substrates 1 are sucked and held at a time by a carry-out arm (not shown). Then, it is unloaded from the θ table 11 and delivered to the next process.
このように、他方の長辺10bと一対の短辺10cの3つの辺にそれぞれ複数のTCP2が仮圧着された2枚の基板1を、θテーブル11に対してTCP2が仮圧着されていない長辺10aを互いに対向させるとともに、TCP2が仮圧着された長辺10b及び一対の短辺10cをそれぞれθテーブル11の周縁から外方へ突出させるようにして供給載置するようにした。   As described above, the two substrates 1 each having the plurality of TCP2s temporarily bonded to the three sides of the other long side 10b and the pair of short sides 10c are not long bonded to the θ table 11. The sides 10a are opposed to each other, and the long side 10b and the pair of short sides 10c to which the TCP 2 is temporarily bonded are supplied and mounted so as to protrude outward from the peripheral edge of the θ table 11, respectively.
そのため、基板1をθテーブル11に対して供給や搬出するために要するタクトタイムは、2枚の基板1を一度に供給及び搬出することで、1枚ずつ行う従来に比べて半分にすることができる。しかも、3つの辺に仮圧着されたTCP2を本圧着する際、2枚の基板1を同時に回転させるため、1枚ずつ回転させる場合に比べてθテーブル11を回転させるのに要するタクトタイムも半分にすることができる。   Therefore, the tact time required for supplying and unloading the substrate 1 to and from the θ table 11 can be halved as compared with the conventional method in which two substrates 1 are supplied and unloaded at a time. it can. In addition, since the two substrates 1 are simultaneously rotated when the TCP 2 temporarily bonded to the three sides is pressure-bonded, the tact time required to rotate the θ table 11 is also halved compared to the case where the two substrates 1 are rotated one by one. Can be.
さらに、2枚の基板2のそれぞれ他方の長辺10bと一対の短辺10cの3つの辺に仮圧着されたTCP2を本圧着する場合、1枚ずつの基板1に対して本圧着すると、2枚の基板1では6回の本圧着工程が必要となる。   Further, when the TCP 2 temporarily bonded to the three sides of the other two long sides 10b and the pair of short sides 10c is finally press-bonded to each of the substrates 1, each of the two substrates 2 is 2 For the single substrate 1, six main press-bonding steps are required.
しかしながら、この実施の形態では、θテーブル11に2枚の基板1を供給載置し、これら2枚の基板1の同一方向に位置する一対の短辺10cに仮圧着されたTCP2に対しては一度の工程で本圧着をするようにした。そのため、従来では2枚の基板1の3つの辺に仮圧着されたTCP2を本圧着するには6回の本圧着工程が必要であったが、この実施の形態では4回ですむから、本圧着工程に要するタクトタイムを従来の3分の2に短縮することができる。   However, in this embodiment, for the TCP 2 on which the two substrates 1 are supplied and mounted on the θ table 11 and temporarily bonded to the pair of short sides 10c located in the same direction of the two substrates 1. The main pressure bonding was performed in one step. For this reason, in the past, six final crimping steps were required to perform final crimping of the TCP 2 temporarily crimped to the three sides of the two substrates 1, but this embodiment requires four times. The tact time required for the crimping process can be reduced to two-thirds of the conventional time.
したがって、これらのことにより、仮圧着されたTCP2を本圧着するために必要とするタクトタイムを大幅に短縮することが可能となるから、生産性の大幅な向上を図ることができる。   Accordingly, the tact time required for the final press-bonding of the temporarily bonded TCP 2 can be greatly shortened, and the productivity can be greatly improved.
図4(a),(b)はこの発明の第2の実施の形態を示す。この実施の形態は基板1の4つの辺のうち、1つの長辺10bと1つの短辺10cとの2つの辺に仮圧着されたTCP2を本圧着する場合である。   4 (a) and 4 (b) show a second embodiment of the present invention. In this embodiment, the TCP 2 temporarily bonded to two sides of one long side 10b and one short side 10c among the four sides of the substrate 1 is finally pressure-bonded.
まず、2枚の基板1を図4(a)に示すようにθテーブル11上に供給して保持する。つまり、2枚の基板1のTCP2が仮圧着された1つの長辺10bを所定間隔で離間対向させるとともに、θテーブル11の図中Xで示す所定方向に位置する一辺側と他辺側とに位置させる。   First, the two substrates 1 are supplied and held on the θ table 11 as shown in FIG. That is, one long side 10b on which the TCP2 of the two substrates 1 are temporarily press-fitted is separated and opposed at a predetermined interval, and on one side and the other side located in a predetermined direction indicated by X in the figure of the θ table 11. Position.
また、一方の基板1のTCP2が仮圧着された一方の短辺10cを、上記所定方向と直交する一対の辺の一方側に位置させ、他方の基板1のTCP2が仮圧着された一方の短辺10cを、上記所定方向と直交する一対の辺の他方側に位置させる。さらに、θテーブル11の上記X方向と交差する方向に位置する2枚の基板1のそれぞれの短辺10cを同図にδで示す距離だけ位置をずらす。つまり、一対の基板1は図4(a)に示すθテーブル11の中心点Bを中心として点対象に配置されている。   In addition, one short side 10c on which the TCP2 of one substrate 1 is temporarily bonded is positioned on one side of the pair of sides orthogonal to the predetermined direction, and the one short side on which the TCP2 of the other substrate 1 is temporarily bonded. The side 10c is positioned on the other side of the pair of sides orthogonal to the predetermined direction. Further, the positions of the short sides 10c of the two substrates 1 positioned in the direction crossing the X direction of the θ table 11 are shifted by a distance indicated by δ in FIG. That is, the pair of substrates 1 are arranged as point targets with the center point B of the θ table 11 shown in FIG.
このようにして、θテーブル11に2枚の基板1を供給載置したならば、まず、図4(a)に示すように一方の基板1の長辺10bに仮圧着された4つのTCP2をバックアップツール13上に位置決めし、これらTCP2を一括して本圧着する。   In this way, when the two substrates 1 are supplied and mounted on the θ table 11, first, as shown in FIG. 4A, the four TCP 2 temporarily bonded to the long side 10 b of one substrate 1 are attached. Positioning on the backup tool 13, these TCPs 2 are collectively crimped together.
ついで、θテーブル11を矢印θ1で示す反時計方向に90度回転させ、図4(b)に示すように基板1の短辺10cをバックアップツール13側に向け、寸法δだけ突出した一方の基板1のTCP2が仮圧着された短辺10cを上記バックアップツール13によって支持する。そして、この短辺10cに仮圧着された3つのTCP2を加圧ツール17によって一括して加圧加熱して本圧着する。   Next, the θ table 11 is rotated 90 degrees in the counterclockwise direction indicated by the arrow θ1, and as shown in FIG. 4B, the short side 10c of the substrate 1 is directed toward the backup tool 13, and one substrate protruding by the dimension δ is provided. The backup tool 13 supports the short side 10c on which one TCP2 is temporarily bonded. Then, the three TCPs 2 temporarily bonded to the short side 10c are collectively pressed and heated by the pressing tool 17 and finally bonded.
一方の基板1の短辺10cと他方の基板1の短辺10cとが寸法δでずれている。そのため、バックアップツール13によってTCP2が仮圧着された一方の基板1の短辺10cを支持する際、他方の基板1のTCP2が仮圧着されていない短辺10cをバックアップツール13の上面に載らないようにすることができる。   The short side 10c of one substrate 1 and the short side 10c of the other substrate 1 are shifted by a dimension δ. Therefore, when supporting the short side 10c of the one substrate 1 on which the TCP 2 is temporarily pressure-bonded by the backup tool 13, the short side 10c on which the TCP 2 of the other substrate 1 is not temporarily pressure-bonded is not placed on the upper surface of the backup tool 13. Can be.
したがって、一方の基板1の短辺10cに仮圧着されたTCP2を本圧着する際、他方の基板1の短辺10cがバックアップツール13や加圧ツール17に干渉することがないから、他方の基板1の短辺10cを損傷させたり、傷付けるなどのことを防止することができる。   Therefore, since the short side 10c of the other substrate 1 does not interfere with the backup tool 13 or the pressing tool 17 when the TCP 2 temporarily bonded to the short side 10c of the one substrate 1 is finally bonded, the other substrate 1 It is possible to prevent the short side 10c of 1 from being damaged or damaged.
このようにして一方の基板1の短辺10cのTCP2を本圧着したならば、θテーブル11を図4(b)に矢印θ2で示すように反時計方向に90度回転させ、他方の基板1の長辺10bをバックアップツール13側に向ける。そして、その長辺10bをバックアップツール13上に位置決めし、そこに仮圧着された4つのTCP2を加圧ツール17によって一括して本圧着する。   When the TCP 2 of the short side 10c of one substrate 1 is thus pressure bonded, the θ table 11 is rotated 90 degrees counterclockwise as indicated by the arrow θ2 in FIG. The long side 10b is directed to the backup tool 13 side. Then, the long side 10 b is positioned on the backup tool 13, and the four TCPs 2 temporarily bonded thereto are collectively pressure-bonded by the pressing tool 17.
ついで、θテーブル11をさらに反時計方向に90度回転させ、一対の基板1の短辺10cをバックアップツール13側に向け、そのうちの寸法δで突出した他方の基板1の短辺10cをバックアップツール13上に位置決めする。位置決め後、加圧ツール17を下降させ、その短辺10cに仮圧着された3つのTCP2を一括して本圧着する。   Next, the θ table 11 is further rotated 90 degrees counterclockwise, the short side 10c of the pair of substrates 1 is directed to the backup tool 13 side, and the short side 10c of the other substrate 1 protruding with the dimension δ is backup tool Position on 13. After positioning, the pressure tool 17 is lowered, and the three TCPs 2 temporarily bonded to the short side 10c are collectively bonded together.
このときも、TCP2を本圧着する他方の基板1の短辺10が一方の基板1の他辺10cよりも突出し、δ寸法位置をずらしているから、TCP2が仮圧着されていない一方の基板1の短辺10cがバックアップツール13や加圧ツール17に干渉するのを防止することができる。   Also at this time, since the short side 10 of the other substrate 1 to which the TCP 2 is subjected to main pressure bonding protrudes from the other side 10c of the one substrate 1 and the δ dimension position is shifted, the one substrate 1 to which the TCP 2 is not temporarily pressure-bonded. Can be prevented from interfering with the backup tool 13 and the pressing tool 17.
このように、2枚の基板1の1つの長辺10bと1つの短辺10cとの2つの辺にTCP2を仮圧着する際、第1の実施の形態と同様、θテーブル11に2枚の基板1を一度に供給載置することで、基板1を供給したり、搬出したり、さらには回転させるために要するタクトタイムを1枚ずつ行う場合に比べて約半分にすることができる。   As described above, when the TCP 2 is temporarily pressure-bonded to the two sides of the long side 10b and the short side 10c of the two substrates 1, the two pieces are attached to the θ table 11 as in the first embodiment. By supplying and mounting the substrate 1 at a time, the tact time required to supply, carry out, and further rotate the substrate 1 can be reduced to about half compared to the case of performing one by one.
なお、各基板1の1つの長辺10bと1つの短辺10cとの、合計で4つの辺に対してTCP2を本圧着するために必要とする本圧着工程は従来と同じ4回となるから、本圧着工程に要するタクトタイムは同じである。   In addition, since the main press-bonding process required for the main press-bonding of the TCP 2 with respect to the total of four sides of one long side 10b and one short side 10c of each substrate 1 is the same as the conventional four times. The tact time required for the main crimping process is the same.
すなわち、基板1の2つの辺にTCP2を本圧着する場合は、本圧着工程は従来と同じ4回必要となるから、その工程は短縮することができないが、他の作業を行うために必要なタクトタイム、たとえば基板1の供給や搬出或いはθテーブル11の回転などは1枚ずつ行う場合に比べて約半分とすることができるから、その分、タクトタイムの短縮を図ることができる。   That is, when the TCP 2 is permanently crimped to the two sides of the substrate 1, the regular crimping process is required four times as in the prior art, so that process cannot be shortened, but is necessary for performing other operations. Since the takt time, for example, the supply and unloading of the substrate 1 or the rotation of the θ table 11 can be reduced to about half compared to the case where each is performed one by one, the takt time can be reduced accordingly.
しかも、2枚の基板1の同一方向に位置する一対の短辺10cを前後方向にδ寸法だけ位置をずらすようにした。そのため、2枚の基板1のどちらか一方の短辺10cにTCP2を本圧着する際、他方の基板1の短辺10cがバックアップツール13や加圧ツール17に干渉して損傷したり、傷付くのを防止することができる。   Moreover, the position of the pair of short sides 10c located in the same direction of the two substrates 1 is shifted in the front-rear direction by the δ dimension. For this reason, when the TCP 2 is finally crimped to one of the short sides 10c of the two substrates 1, the short side 10c of the other substrate 1 interferes with the backup tool 13 or the pressure tool 17 and is damaged or damaged. Can be prevented.
上記各実施の形態では基板に被実装部材として電子部品であるTCPを本圧着する場合について説明したが、異方性導電部材を貼着する場合やTCPを仮圧着する場合などであってもこの発明を適用すれば、タクトタイムを短縮することができる。つまり、被実装部材はTCPや他の電子部品に限られず、異方性導電部材の場合であってもよい。   In each of the above-described embodiments, the case where TCP, which is an electronic component, is permanently bonded to a substrate as a mounted member has been described. However, even when an anisotropic conductive member is attached or TCP is temporarily bonded, If the invention is applied, the tact time can be shortened. That is, the member to be mounted is not limited to TCP or other electronic components, but may be an anisotropic conductive member.
この発明の第1の実施の形態の実装装置の概略的構成を示す側面図。The side view which shows schematic structure of the mounting apparatus of 1st Embodiment of this invention. 2枚の基板の3つの辺にTCPを本圧着する手順を示す説明図。Explanatory drawing which shows the procedure which carries out the main pressure bonding of TCP to the three sides of two board | substrates. 基板に異方性導電部材を貼着してからTCPを仮圧着する手順を示す説明図。Explanatory drawing which shows the procedure which carries out pressure bonding of TCP after sticking an anisotropic conductive member to a board | substrate. この発明の第2の実施の形態を示す2枚の基板の2つの辺にTCPを本圧着する手順を示す説明図。Explanatory drawing which shows the procedure which carries out this pressure bonding of TCP to the two sides of the two board | substrates which show 2nd Embodiment of this invention.
符号の説明Explanation of symbols
1…基板、2…TCP(被実装部材)3…テーブルユニット、11…θテーブル(実装ステージ)、13…バックアップツール、17…加圧ツール、21…異方性導電部材。   DESCRIPTION OF SYMBOLS 1 ... Board | substrate, 2 ... TCP (mounting member) 3 ... Table unit, 11 ... (theta) table (mounting stage), 13 ... Backup tool, 17 ... Pressure tool, 21 ... Anisotropic conductive member.

Claims (2)

  1. 基板の4辺のうち、少なくとも一辺を除く残りの辺に被実装部材を実装する実装装置であって、
    水平方向及び回転方向に駆動可能であって、上面に2枚の基板が上記被実装部材が実装されない辺を対向させるとともに残りの辺を全長にわたって上記上面の周縁から外方へ突出させて載置される実装ステージと、
    この実装ステージの上面周縁から突出させた上記基板の辺の下面を支持するバックアップツールと、
    このバックアップツールによって支持された基板の辺に上記被実装部材を加圧実装する加圧ツールとを具備し、
    上記実装ステージを90度ずつ回転させてこの実装ステージの上面周縁から突出した上記基板の上記被実装部材が実装される辺を上記バックアップツールによって順次支持するとともに、上記基板の4つの辺のうちの2つの辺に被実装部材を実装する際に、同一方向に並んで位置する一方の基板の被実装部材が実装される一辺の上記実装ステージの周縁からの突出寸法を、他方の基板の被実装部材が実装されない一辺の突出寸法よりも大きくすることを特徴とする被実装部材の実装装置。
    A mounting device that mounts a mounted member on the remaining sides of at least one side of the four sides of the substrate,
    It can be driven in the horizontal direction and the rotation direction, and the two substrates are placed on the upper surface with the side on which the mounting member is not mounted facing each other and the remaining side protruding outward from the peripheral edge of the upper surface over the entire length. Implementation stage
    A backup tool that supports the lower surface of the side of the substrate protruding from the upper surface periphery of the mounting stage;
    A pressurizing tool for pressurizing and mounting the mounted member on the side of the substrate supported by the backup tool;
    The mounting stage is rotated by 90 degrees, and the side on which the mounted member of the substrate protruding from the peripheral edge of the mounting stage is sequentially supported by the backup tool, and of the four sides of the substrate. When mounting a mounted member on two sides, the protruding dimension from the peripheral edge of the mounting stage on one side on which the mounted member on one substrate positioned in the same direction is mounted is mounted on the other substrate. An apparatus for mounting a member to be mounted, wherein the mounting member is larger than a protruding dimension of one side where the member is not mounted.
  2. 基板の4辺のうち、少なくとも一辺を除く残りの辺に被実装部材を実装する実装方法であって、
    水平方向及び回転方向に駆動可能な実装ステージの上面に2枚の基板を上記被実装部材が実装されない辺を対向させるとともに残りの辺を全長にわたって上記上面の周縁から外方へ突出させて載置する工程と、
    この実装ステージの上面周縁の一側から突出した上記基板の一辺の下面をバックアップツールによって支持する工程と、
    上記バックアップツールによって支持された基板の辺に上記被実装部材を加圧実装する工程と、
    上記実装ステージを90度ずつ回転させることで上記バックアップツールによって支持される上記基板の他の辺に上記被実装部材を順次実装する工程を具備し、
    上記基板の4つの辺のうちの2つの辺に被実装部材を実装する際に、同一方向に並んで位置する一方の基板の被実装部材が実装される一辺の上記実装ステージの周縁からの突出寸法を、他方の基板の被実装部材が実装されない一辺の突出寸法よりも大きくすることを特徴とする被実装部材の実装方法。
    A mounting method for mounting a mounted member on the remaining sides of at least one side of the four sides of the substrate,
    Two substrates are placed on the upper surface of a mounting stage that can be driven in the horizontal direction and the rotational direction, with the side on which the mounted member is not mounted facing each other, and the remaining side protruding outward from the peripheral edge of the upper surface over the entire length. And a process of
    A step of supporting the lower surface of one side of the substrate protruding from one side of the upper peripheral edge of the mounting stage with a backup tool;
    A step of pressure mounting the mounted member on the side of the substrate supported by the backup tool;
    Comprising sequentially mounting the mounted member on the other side of the substrate supported by the backup tool by rotating the mounting stage by 90 degrees;
    When mounting a mounted member on two of the four sides of the substrate, the one side on which the mounted member of one substrate positioned in the same direction is mounted is projected from the peripheral edge of the mounting stage. A mounting method for a mounted member, wherein the dimension is made larger than a protruding dimension on one side where the mounted member on the other substrate is not mounted.
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Cited By (1)

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Publication number Priority date Publication date Assignee Title
WO2013141388A1 (en) * 2012-03-23 2013-09-26 芝浦メカトロニクス株式会社 Device and method for mounting electronic component

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KR102216879B1 (en) * 2014-01-14 2021-02-19 삼성디스플레이 주식회사 Mounting device for mounting flexible printed circuit board and method for mounting thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003078288A (en) * 2001-09-06 2003-03-14 Matsushita Electric Ind Co Ltd Apparatus and method for component mounting

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Publication number Priority date Publication date Assignee Title
JP3468074B2 (en) * 1998-01-05 2003-11-17 松下電器産業株式会社 Electronic component mounting apparatus and mounting method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003078288A (en) * 2001-09-06 2003-03-14 Matsushita Electric Ind Co Ltd Apparatus and method for component mounting

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013141388A1 (en) * 2012-03-23 2013-09-26 芝浦メカトロニクス株式会社 Device and method for mounting electronic component

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