JP2006322724A - Device and method for inspecting substrate and method for inspecting tape stuck state - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device and a method for inspecting substrate and a method for inspecting the tape stuck state capable of improving the production efficiency by reducing the photographing time for the position recognition or for the inspection. <P>SOLUTION: In the device for inspecting the substrate accompanied by the tape sticking device for sticking a bonding tape for bonding electronic components to the substrate 6, the two recognition marks of the substrate 6 are photographed while changing the mutual distance of two cameras 26 and 27 to the distance for recognition of substrate positions, then the substrate 6 is positioned based on the results of the position recognition of the recognition mark and after the bonding tape is stuck on the substrate 6, the distance between the cameras 26, 27 is changed to the distance for inspection for photographing the two inspection points, the two inspection points are simultaneously photographed by the cameras 26 and 27. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a substrate inspection apparatus and a substrate inspection method for inspecting an inspection location by imaging a substrate, and in particular, a tape application state inspection for inspecting a tape application state by imaging an inspection location after application of a bonding tape for joining electronic components. It is about the method.

  A display panel such as a plasma panel or a liquid crystal panel used as a display of an electronic device is assembled by connecting a driver substrate to the edge of a glass panel serving as a display screen. In this assembling operation, a bonding tape such as an anisotropic conductive tape is affixed so as to cover a connection terminal formed on the edge of the glass panel, and the substrate is connected via the connector by the bonding tape.

When connecting the substrates using this bonding tape, it is required that the bonding tape is attached to the correct position so as to cover the terminals for connecting the substrates. For this reason, conventionally, after the bonding tape application work, an image of the applied bonding tape is captured with a camera, and an application state inspection is performed to check whether the application state is normal (see, for example, Patent Document 1). In the example shown in this patent document example, a bonding tape bonding apparatus is provided with a single substrate imaging camera, and imaging for substrate position recognition and bonding status inspection after bonding tape bonding is performed by this camera. And do.
Japanese Patent No. 3324599

  However, in the above-described conventional apparatus example, as the size of the display panel increases, there is a problem that the time required for imaging by the camera is delayed. That is, in large display panels, the distance between the recognition marks for position recognition is set to be large, and the number of inspection points by the camera is large due to the large number of adhesive tapes applied. It was necessary to repeatedly execute the camera positioning operation for relative movement. For this reason, the time required for position recognition and inspection is delayed, and there is a problem that the production efficiency is lowered.

  Therefore, an object of the present invention is to provide a substrate inspection apparatus, a substrate inspection method, and a tape attachment state inspection method that can shorten the imaging time for position recognition and inspection and improve production efficiency.

  A substrate inspection apparatus according to the present invention is provided in association with a work device that performs a predetermined operation on a substrate, and images a recognition mark for recognizing the position of the substrate and an inspection location for inspecting a work result of the operation. A substrate inspection apparatus for recognizing the position of the substrate and inspecting the work result of the work, wherein a plurality of imaging means for imaging the substrate and a mutual interval between the plurality of imaging means are changed. An interval changing mechanism that controls the interval changing mechanism to change the interval to a substrate position recognition interval for imaging the recognition mark and to change to an inspection interval for imaging the inspection location. Control means and a relative movement mechanism for moving the substrate relative to the plurality of imaging means are provided.

The substrate inspection method of the present invention is for inspecting a recognition mark for recognizing the position of the substrate and a work result of the operation by a substrate inspection device provided in association with a work device that performs a predetermined operation on the substrate. A substrate inspection method for imaging an inspection location, recognizing the position of the substrate and inspecting a work result of the work, wherein a mutual interval between a plurality of imaging means for imaging the substrate is defined by the recognition mark. A substrate position recognition interval changing step for changing to a substrate position recognition interval for imaging, a substrate position recognition step for recognizing the substrate position by imaging the recognition mark by the plurality of imaging means, and the interval An inspection interval changing step for changing the inspection location to image the inspection location, and an inspection step for performing inspection by imaging the inspection location by the plurality of imaging means, And to execute the predetermined operations overlap with serial testing interval changing step.

  The method for inspecting a tape sticking state according to the present invention includes a recognition mark for recognizing the position of the substrate and the bonding tape by a substrate inspection device provided in association with a tape attaching device for attaching a joining tape for joining electronic components to the substrate. It is a tape sticking state inspection method for picking up an image of an inspection location after sticking, recognizing the position of the substrate and checking the tape sticking state. A substrate position recognition interval changing step for changing to a substrate position recognition interval for imaging the recognition mark, and a substrate position recognition step for simultaneously imaging the two recognition marks by the plurality of imaging means and recognizing the position. , Tape pasting for positioning the substrate with respect to the bonding tape based on the position recognition result in the substrate position recognition step and attaching the bonding tape to the substrate An inspection interval changing step of changing the interval to an inspection interval for imaging the plurality of inspection locations, and performing inspection by simultaneously imaging the plurality of inspection locations by the plurality of imaging means. Including the inspection step, and the tape pasting operation step is executed overlapping with the inspection interval changing step.

  According to the present invention, the interval between the plurality of imaging means for imaging the substrate is changed to the substrate position recognition interval for imaging the recognition mark, and is changed to the inspection interval for imaging the inspection location. However, it is possible to shorten the imaging time for position recognition and inspection and improve production efficiency by imaging the substrate by a plurality of imaging means and executing a predetermined operation overlapping with the inspection interval change. .

  Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a front view of a tape application state inspection device according to an embodiment of the present invention, FIG. 2 is a partial sectional view of the tape application state inspection device according to an embodiment of the present invention, and FIG. FIG. 4 is a block diagram showing the configuration of the control system of the tape application state inspection apparatus according to one embodiment of the present invention, and FIG. 5 is one embodiment of the present invention. FIG. 6, FIG. 7, and FIG. 8 are process explanatory views of the tape application state inspection method according to one embodiment of the present invention.

  The structure of the substrate inspection apparatus will be described with reference to FIGS. This board inspection apparatus is provided in association with a work apparatus that performs a predetermined work on a substrate, and images a test mark for inspecting a work mark by a recognition mark for position recognition of the board and the work apparatus, It has a function of recognizing the position of the substrate and inspecting the work result. Here, a substrate inspection device is attached to a tape application device for attaching a bonding tape for bonding electronic components to a substrate as a work device, and inspection of the bonding tape application state on the substrate is performed.

  In FIG. 1, a substrate table positioning means 2 having a configuration in which a Y-axis table 3 and an X-axis table 4 are stacked is disposed on a base 1. A substrate holding table 5 is mounted on the X-axis table 4, and the substrate holding table 5 holds a substrate 6. The substrate table positioning means 2 is also provided with a ZΘ axis table mechanism (not shown), and can move in the Z direction and the Θ direction.

  Above the base 1, ACF supply means 7 for attaching a tape-like ACF (anisotropic conductive agent) as a bonding tape to the substrate 6 is disposed. The ACF supply means 7 is configured by arranging a supply reel 8 and a pressing means 12 on a vertical base plate 7a. The supply reel 8 stores the ACF tape 9 having a configuration in which the ACF is laminated on one side of the base tape in a wound state. The ACF tape 9 fed from the supply reel 8 is guided by two guide rollers 10 and 11 disposed horizontally at the lower end of the base plate 7a, and only the base tape is collected downstream. A cutting unit 14 is arranged upstream of the guide roller 10. The cutting unit 14 cuts only the ACF of the ACF tape 9 at a predetermined pitch with a cutter.

  A pressing means 12 is disposed at an intermediate position between the two guide rollers 10 and 11, and the pressing means 12 includes a crimping tool 13 configured to be movable up and down. The tape sticking operation by the pressing means 12 will be described. As shown in FIG. 2A, the substrate table positioning means 2 is driven to move the substrate 6 held on the substrate holding table 5, and the edge of the substrate 6 is positioned below the crimping tool 13. Next, the crimping tool 13 is lowered, and the ACF tape 9 in which the ACF is cut is pressed against the substrate 6. As a result, the ACF cut to a predetermined length is attached to the substrate 6.

  Above the ACF supply means 7, an imaging unit 20 is arranged in the Y direction. The imaging unit 20 includes a first camera 26 and a second camera 27 that are a plurality of imaging means for imaging the substrate 6. The first camera 26 and the second camera 27 are camera brackets 24 and 25, respectively. Is held in. The camera brackets 24 and 25 are moved in the Y direction along the horizontal base frame 21 by the first camera positioning means 22 and the second camera positioning means 23. By driving the first camera positioning means 22 and the second camera positioning means 23, the first camera 26 and the second camera 27 move in the Y direction, respectively.

  The first camera 26 and the second camera 27 are arranged with the imaging direction facing downward, and are held on the substrate holding table 5 by driving the substrate table positioning means 2 as shown in FIG. The substrate 6 is moved horizontally and the object to be imaged is positioned below the first camera 26 and the second camera 27, so that the position recognition recognition mark formed on the substrate 6 and the ACF attached to the substrate 6 are displayed. Image. Image data acquired by imaging is sent to the first recognition processing unit 31 and the second recognition processing unit 32 (see FIG. 4).

  In the imaging of the substrate 6 by the first camera 26 and the second camera 27, the first camera positioning means 22 and the second camera positioning means 23 are driven so that the distance between the first camera 26 and the second camera 27 is reached. Can be changed, and imaging can be performed simultaneously on two parts with different intervals.

  Next, the imaging target of the first camera 26 and the second camera 27 on the substrate 6 will be described. As shown in FIG. 3A, two recognition marks MA and MB for position recognition are formed on the substrate 6 in advance. The position of the substrate 6 is detected by recognizing image data obtained by imaging the recognition marks MA and MB with the first camera 26 and the second camera 27, respectively. Based on the position of the substrate 6, position control at the time of applying the bonding tape is performed.

A plurality of (here, four) ACFs (1) to ACF (4) are attached to the edge of one side of the substrate 6 by a bonding tape applying device. FIG. 3B shows details of the position and size of the ACF to be attached. Each ACF (i) has a length L and an attachment pitch P, and is linearly attached along the edge of the substrate 6. Attached. In the inspection of the ACF attachment state, recognition processing is performed on the image data obtained by imaging the first end E1 and the second end E2 at both ends of each ACF (i), and the positions x1 ( i), x2 (i) and the center position xc (i) are obtained,
The quality is determined by comparison with a reference position stored in the storage unit 40 described below. The inspection of the ACF application state is not limited to the method of inspecting the ACF application position, and for example, a method of inspecting ACF turning, peeling, tearing, wrinkles, etc. by image processing may be used.

  Next, the configuration of the control system will be described with reference to FIG. The storage unit 40 stores recognition mark position recognition data 41, ACF position recognition data 42, recognition mark position data 43, and ACF attachment position data 44. The recognition mark position recognition data 41 is data serving as a reference image for position recognition of the recognition marks MA and MB formed on the substrate 6. The ACF position recognition data 42 is data serving as a reference image for detecting the end position from the image data obtained by imaging the first end E1 and the second end E2 shown in FIG. ) And x2 (i), respectively, are composed of first end position recognition data and second end position recognition data.

  The recognition mark position data 43 is data indicating a reference position for detecting the positions of the recognition marks MA and MB by image recognition processing. The ACF attachment position data 44 is data indicating a reference position for determining the quality of the position of each ACF (i) obtained by the ACF inspection. These data are composed of center position data, ACF sticking length data, ACF sticking pitch data, first end part position data, and second end part position data, respectively, xc (i) shown in FIG. 3 (b). , L, P, x1 (i), x2 (i). In the imaging operation for ACF position recognition, the first camera 26, the second camera positioning means 23, and the substrate table positioning means 2 are driven based on these data, whereby the first camera 26, The second camera 27 is aligned with the inspection location.

  The control unit 30 includes a first recognition processing unit 31, a second recognition processing unit 32, a determination unit 33, a calculation unit 34, and a mechanism control unit 35. The first recognition processing unit 31 and the second recognition processing unit 32 perform recognition processing on the image data acquired by the first camera 26 and the second camera 27, respectively. In this recognition process, the recognition mark position recognition data 41 and the ACF position recognition data 42 are referred to, whereby the recognition mark position recognition process and the ACF position recognition process are performed.

  The determination unit 33 compares the ACF position recognition result with the ACF application position data 44 to determine pass / fail of the ACF application state. The calculation unit 34 performs calculation processing for each data stored in the storage unit 40. For example, by giving L and xc (i) in each data shown in FIG. 3B, x1 (i) and x2 (i) can be obtained by calculation. The operation / input unit 36 is an input device such as a keyboard and a mouse, and inputs operation instructions and data. The display unit 37 is a display panel such as a liquid crystal panel, and displays an imaging screen of the first camera 26 and the second camera 27 and a guidance screen at the time of an input operation by the operation / input unit 36.

  The mechanism control unit 35 controls mechanism units such as the substrate table positioning unit 2, the ACF supply unit 7, the pressing unit 12, the first camera positioning unit 22, and the second camera positioning unit 23. In the above configuration, the substrate table positioning unit 2 is a relative movement mechanism that moves the substrate 6 relative to the plurality of imaging units, and the mechanism control unit 35 is the first camera positioning unit 22 that is an interval changing mechanism. The second camera positioning unit 23 is controlled to change the interval between the first camera 26 and the second camera 27 to the substrate position recognition interval for imaging the recognition marks MA and MB, and the ACF attachment position. This is interval control means for changing to an inspection interval for imaging the inspection location.

This board inspection apparatus is configured as described above. Hereinafter, a board inspection method will be described with reference to FIG. This substrate inspection method is for recognizing the position of a substrate 6 by a substrate inspection device provided in association with a working device (a bonding tape applying device) that performs a predetermined operation (here, a bonding tape applying operation) on the substrate 6. The recognition marks MA and MB and the inspection location for inspecting the work result (tape application state) are imaged to recognize the position of the substrate 6 and to inspect the work result.

  In FIG. 5, first, the substrate 6 to be inspected is carried onto the substrate holding table 5 (ST1). Two recognition marks MA and MB are formed on the substrate 6 as shown in FIG. Simultaneously with the loading operation of the substrate 6, these cameras are moved so that the interval between the first camera 26 and the second camera 27 (hereinafter simply referred to as two cameras) is changed to two recognition marks MA, An operation for setting the interval substantially the same as the MB interval is executed (ST2). That is, the interval between the plurality of imaging means for imaging the substrate 6 is changed to the substrate position recognition interval for imaging the recognition marks MA and MB (substrate position recognition interval changing step).

  Next, the two recognition marks MA and MB are positioned with respect to the two cameras (ST3). Thereby, as shown in FIG. 6A, the two cameras move to the positions of the recognition marks MA and MB, respectively. Reference numerals 26a and 27a denote imaging fields of view of the first camera 26 and the second camera 27, respectively. Then, two recognition marks MA and MB are picked up by two cameras (ST4). The positions of the recognition marks MA and MB are recognized by the first recognition processing unit 31 and the second recognition processing unit 32. That is, two recognition marks MA and MB are simultaneously imaged by a plurality of imaging means to recognize the position (substrate position recognition step).

  Next, an ACF attaching operation for attaching the ACF to the substrate 6 is performed. In this ACF application work, the ACF application location is positioned relative to the crimping tool 13 based on the above-described position recognition result (ST5). Next, the ACF is attached to the substrate 6 with the crimping tool 13 (ST6). That is, based on the position recognition result in the substrate position recognition step, the substrate 6 is positioned with respect to the ACF, and the ACF is attached to the substrate 6 (tape attaching operation step). The ACF pasting operations (ST5) and (ST6) are sequentially repeated for a plurality of pasting locations.

  In parallel with this ACF pasting operation, the two cameras are set to be substantially the same as the interval between the two inspection locations (ST7). That is, the interval between the two cameras is changed to an inspection interval for imaging a plurality of inspection locations of the ACF (inspection interval changing step). Here, the distance between the two cameras is set such that the two cameras can be aligned with one end portion of the two ACFs out of the plurality of ACFs attached to the substrate 6. If this ACF pasting operation is repeated and it is determined in (ST8) that it is the last pasting location, the ACF inspection operation is started.

  In the ACF inspection operation, first, two inspection locations are positioned relative to the two cameras (ST9). Next, the inspection location of the ACF is imaged with two cameras, and the application state (attachment position) is inspected (ST10). That is, a plurality of image pickup means simultaneously inspect and inspect a plurality of inspection locations (inspection process). The ACF inspection operations (ST9) and (ST10) are sequentially repeated for a plurality of other inspection locations. If it is determined in (ST11) that it is the last inspection location, the processed substrate 6 for which both ACF application and inspection have been completed is ejected from the substrate holding table 5 (ST12). The operation after ST1 is repeated on the target substrate 6 (ST1).

  Various variations are possible for the interval between the two cameras and the imaging order in the ACF inspection operation described above. For example, in the operation example shown in FIG. 6, an example in which one ACF is captured by the first camera 26 and the second camera 27 is shown. That is, as shown in FIG. 6B, the imaging fields 26a and 27a of the two cameras are first moved to the second end E2 of each of ACF (2) and ACF (4), and these inspections are performed by the two cameras. Image the location.

  Next, as shown in FIG. 6C, the imaging fields 26a and 27a of the two cameras are moved to the first end E1 of the ACF (2) and ACF (4), and the inspection location is imaged by the two cameras. . Thereafter, as shown in FIG. 6D, the first camera 26a and the second camera 27a are moved to the first end E1 of the ACF (2) and ACF (4), and the first camera 26 is moved. The inspection location is imaged by the second camera 27. After that, as shown in FIG. 6D, after the imaging fields 26a and 27a of the two cameras are moved to the second end E2 of the ACF (1) and ACF (3), the imaging is performed in the same manner. As shown in FIG. 6E, imaging is performed on the first end E1 of the ACF (1) and ACF (3).

  FIG. 7 shows an example in which the interval between the first camera 26 and the second camera 27 is set corresponding to the length L of one ACF. In this example, first, as shown in FIG. 7B, the first end E1 and the second end E2 at both ends of the ACF (4) are simultaneously imaged by two cameras. Thereafter, the two cameras are moved relative to the substrate 6 at the same interval, and as shown in FIGS. 7C, 7D, and 7E, ACF (3), ACF (2), ACF ( Images are taken sequentially for 1).

  FIG. 8 shows an example of the imaging operation when the lengths of the plurality of ACFs attached to the substrate 6 are different. Here, in the three ACFs (11), (12), and (13) to be attached to the substrate 6, the ACFs (12) and (13) have the same size, and only the ACF (11) has the other two ACFs. Is shorter. FIG. 8A is similar to the example of FIGS. 6 and 7 and shows a state in which two recognition marks MA and MB are imaged by two cameras.

  In the imaging of the inspection location, first, as shown in FIG. 8B, the interval between the two cameras is adjusted to the ACF attachment pitch, and the two ends E2 of the ACF (12) and ACF (13) are two. The imaging fields 26a and 27a of the camera are moved, and the inspection location is imaged by the two cameras. Next, as shown in FIG. 8B, the imaging fields 26a and 27a of the two cameras are moved to the first end E1 of the ACF (12) and ACF (13), and the inspection location is imaged by the two cameras.

  Next, imaging for ACF (11) is performed. That is, as shown in FIGS. 8D and 8E, the imaging field of view 26a of the first camera 26 is sequentially moved to the second end E2 and the first end E1 of the ACF (11), and the first camera is moved. 26, the inspection location of the ACF (11) is imaged. At this time, the second camera 27 also moves together with the first camera 26, but since the inspection location of the ACF (12) has already been imaged, imaging by the second camera 27 is not performed.

  In the above embodiment, an example in which a substrate inspection device is attached to the ACF sticking device is shown, but the example of the working device is not limited to the above example, and a predetermined work is performed on the substrate, and the work is performed. If it is the structure which test | inspects by imaging a result, it becomes an application object of this invention.

  As described above, in the present embodiment, the substrate is picked up by the plurality of image pickup means while changing the mutual interval of the plurality of image pickup means for picking up the substrate to the substrate position recognition interval for picking up the recognition mark. In addition, the predetermined work is executed overlapping with the inspection interval changing step. This shortens the imaging time for position recognition and inspection even when the recognition mark interval is set to be large, such as a large display panel, and the type of substrate with a large number of ACFs is attached. Thus, the production efficiency can be improved.

The substrate inspection apparatus and the substrate inspection method of the present invention have the effect that the imaging time for position recognition and inspection can be shortened and the production efficiency can be improved, and the inspection location is inspected by imaging the substrate. This is useful in the field, particularly in the field of inspecting the tape application state by imaging the inspection location after application of the bonding tape for bonding electronic components.

The front view of the tape sticking state inspection apparatus of one embodiment of the present invention The fragmentary sectional view of the tape sticking state inspection device of one embodiment of the present invention The top view of the board | substrate used as the test object of the tape sticking state inspection apparatus of one embodiment of this invention The block diagram which shows the structure of the control system of the tape sticking state inspection apparatus of one embodiment of this invention The flowchart which shows the tape sticking state inspection method of one embodiment of this invention Process explanatory drawing of the tape sticking state inspection method of one embodiment of this invention Process explanatory drawing of the tape sticking state inspection method of one embodiment of this invention Process explanatory drawing of the tape sticking state inspection method of one embodiment of this invention

Explanation of symbols

2 Substrate table positioning means 5 Substrate holding table 6 Substrate 7 ACF supply means 9 ACF tape 12 Press means 13 Crimping tool 22 First camera positioning means 23 Second camera positioning means 26 First camera 27 Second camera

Claims (3)

The position of the substrate is determined by imaging a recognition mark for recognizing the position of the substrate and an inspection location for inspecting the work result of the operation, which is provided in association with a working device that performs a predetermined operation on the substrate. A substrate inspection apparatus for recognizing and inspecting the work result of the work,
A plurality of imaging means for imaging the substrate, an interval changing mechanism for changing an interval between the plurality of imaging means, and a substrate position for controlling the interval changing mechanism to image the recognition mark at the interval An interval control unit that changes to an interval for recognition and changes to an inspection interval for imaging the inspection location, and a relative movement mechanism that relatively moves the substrate with respect to the plurality of imaging units. Board inspection equipment. Imaging a recognition mark for recognizing the position of the substrate and an inspection location for inspecting a work result of the operation by a substrate inspection device provided in association with a working device that performs a predetermined operation on the substrate, A substrate inspection method for recognizing a position of a substrate and inspecting a work result of the operation,
A substrate position recognition interval changing step for changing a mutual interval between a plurality of imaging means for imaging the substrate to a substrate position recognition interval for imaging the recognition mark; and the recognition mark by the plurality of imaging means. A substrate position recognition step of imaging and recognizing the position of the substrate, an inspection interval changing step of changing the interval to an inspection interval for imaging the inspection location, and the inspection location by the plurality of imaging means A substrate inspection method comprising: an inspection step of performing an inspection by imaging, and performing the predetermined operation overlapping with the inspection interval changing step. By imaging the inspection mark after pasting the recognition mark for the position of the substrate and the bonding tape by a substrate inspection device provided in association with a tape application device for attaching a bonding tape for electronic component bonding to the substrate, It is a tape application state inspection method for recognizing the position of the substrate and inspecting the tape application state,
A substrate position recognition interval changing step of changing the interval between the two imaging means for imaging the substrate to a substrate position recognition interval for imaging the two recognition marks; and Position recognition step of recognizing the position by simultaneously imaging two recognition marks, and tape attachment for positioning the substrate with respect to the bonding tape and affixing the bonding tape to the substrate based on the position recognition result in the substrate position recognition step A work step, an inspection interval changing step for changing the interval to an inspection interval for imaging a plurality of the inspection locations, and an inspection for performing inspection by simultaneously imaging the plurality of inspection locations by the plurality of imaging means A tape sticking state inspection method, wherein the tape sticking operation step is executed in duplicate with the inspection interval changing step.

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