KR101151982B1

KR101151982B1 - Work processing device or inspecting method of acf attachment status or display substrate module assembling line

Info

Publication number: KR101151982B1
Application number: KR1020100026611A
Authority: KR
Inventors: 게이이찌 에비사와; 유우지 아끼바; 다까후미 히사; 마사오미 다께다; 쥰이찌 다마모또; 히데아끼 가따호; 히데아끼 도이; 요시히로 사이또오
Original assignee: 가부시키가이샤 히다치 하이테크놀로지즈
Priority date: 2009-03-26
Filing date: 2010-03-25
Publication date: 2012-06-01
Also published as: CN101846825A; KR20100108251A; JP2010232295A; TW201100782A

Abstract

SUMMARY OF THE INVENTION An object of the present invention is to provide a processing work device or an ACF attachment state inspection method capable of shortening the total work time of the ACF attachment processing work and the inspection work of the ACF attachment state, or shortening the width of the processing work equipment required for ACF attachment. Alternatively, the tact time of the display board module assembly can be shortened, or a display board module assembly line having a short line length is provided.
When the ACF attached to a predetermined position of the side of the display substrate is illuminated and imaged, and when the state of attachment of the ACF is inspected based on the imaging result, at least the image pickup and inspection of the display substrate is carried out after the attachment of the ACF. It is characterized by.

Description

WORK PROCESSING DEVICE OR INSPECTING METHOD OF ACF ATTACHMENT STATUS OR DISPLAY SUBSTRATE MODULE ASSEMBLING LINE}

According to the present invention, a so-called TAB (= Tape Automated Bonding) such as mounting a driving IC or a chip on film (FOF), flexible printed circuits (FPC), or the like around a display substrate of an FPD (= Flat Panel Display) such as a liquid crystal or a plasma A processing work device for mounting a connection and a peripheral substrate (PCB = printed circuit board), and a display substrate module assembly line constituted by the same. More specifically, the present invention relates to an inspection unit and an inspection method for inspecting the adhesion state of an anisotropic conductive film (ACF = Anisotropic Conductive Film) and a display substrate module assembly line configured based on the inspection unit or the inspection result.

The display substrate module assembly line includes a plurality of processing operations on display substrates (hereinafter, simply referred to as substrates in the following), other substrates such as PCB substrates in the case of PCBs, such as liquid crystal and plasma. By sequentially performing the steps, the device is a device for mounting a driving IC, a TAB, a PCB substrate, and the like around the substrate.

For example, as an example of a process process, (1) the terminal cleaning process of cleaning the TAB attachment part of a board | substrate edge part, (2) the ACF process of attaching an ACF to the board | substrate edge part after cleaning, and (3) the adhesion state of the attached ACF ACF inspection process to inspect, (4) the mounting process of positioning and mounting a TAB or IC on the board | substrate wiring of the position to which ACF was attached, (5) the crimping process of fixing by ACF film by heat-pressing the mounted TAB, (6) Mounting inspection process for checking the position or connection state of the compressed TAB or IC; (7) PCB process (multiple processes) for attaching and mounting the PCB substrate with ACF on the side opposite to the substrate side of the TAB. Is done. Moreover, the number of each processing apparatus, the processing unit which rotates a board | substrate, etc. are needed with the number of sides of the board | substrate to process, the number of TABs, ICs, etc. which are processed. By obtaining such a process, both electrodes are electrically connected by thermopressing the ACF provided between the electrode of a board | substrate side, and the electrode of a side, such as TAB / IC.

There are a plurality of work processing points to be processed on one processing side of the substrate. In the conventional ACF inspection process apparatus, the CCD camera photographs and inspects the attached portion each time whether or not the ACF is properly attached. . In the inspection step, the attachment head becomes an obstacle when the attachment portion is picked up by the CCD camera. Thus, the head moves to at least one attachment position, and the attachment portion is picked up by the CCD camera while the substrate is stopped during the attachment processing operation. I was checking. As the prior art as described above, there is the following patent document.

[Patent Document 1] Japanese Patent Application Laid-Open No. 2003-142900

Therefore, this required a time of simply performing inspection without performing attachment work in several processing work places before the final processing work place. In addition, the head of the ACF attachment device needs to overrun by some of the above work points, and the width of the device is long.

A first object of the present invention is a treatment work device or ACF attachment state that can shorten the total work time of the ACF attachment treatment work and the inspection work in the ACF attachment state, or can shorten the width of the treatment work device required for ACF attachment. To provide a test method.

Moreover, the 2nd object of this invention is to provide the display board module assembly line which can shorten the tact time of display board module assembly, or has a short line length.

In order to achieve the first object described above, the display after attaching the ACF when the ACF attached to a predetermined position of the side of the display substrate is illuminated and imaged, and the attachment state of the ACF is inspected based on the imaging result. It is a 1st characteristic that the said imaging is carried out at least during a conveyance of a board | substrate.

Moreover, in order to achieve the said 1st objective, in addition to a 1st characteristic, the imaging position of the said imaging means or the said imaging means is located downstream of the ACF attachment head which the ACF attachment work processing apparatus which processes the said ACF attachment job has. And the ACF attachment head is an ACF attachment head to which the ACF is attached.

Moreover, in order to achieve the said 1st objective, in addition to a 2nd characteristic, the imaging position of the said imaging means or the said imaging means has the job processing which the downstream job processing apparatus provided downstream of the said ACF attachment work processing apparatus. A third feature is provided upstream of the head.

Moreover, in order to achieve the said 1st objective, in addition to a 1st characteristic, the said imaging means is a 4th characteristic provided in the downstream of the ACF attachment work processing apparatus which processes the said ACF attachment work.

Further, in order to achieve the first object, in addition to the third feature, at least one of the illumination means, the imaging means, and the inspection control means is installed in the ACF attachment job processing device or the downstream job processing device. The fifth feature is one.

Moreover, in order to achieve the said 1st objective, in addition to a 1st characteristic, the downstream installation of the ACF attachment work processing apparatus which processes the said ACF attachment state inspection unit and the said ACF attachment work, or the downstream of the said ACF attachment work processing apparatus. It is a 6th feature that it is integral with the side work processing apparatus.

Moreover, in order to achieve the said 1st objective, in addition to a 1st characteristic, it is a 7th feature that the said processing work apparatus is comprised only with an ACF attachment state inspection unit.

Further, in order to achieve the first object described above, in addition to any one of the features of the first to the seventh aspect, the imaging means is an eighth feature that the image pickup means is a line sensor camera or an area camera.

Furthermore, in order to achieve the said 1st objective, in addition to a 1st characteristic, the said imaging result is compressed based on the request | requirement detection accuracy ratio required for the said inspection in the direction orthogonal to the said conveyance direction and the said conveyance direction, The ninth feature is to obtain.

Moreover, in order to achieve the said 1st objective, in addition to a 9th characteristic, the said compression is carried out at the time of image pick-up, or the 10th feature is performed with the imaging data obtained by image pick-up.

Moreover, in order to achieve said 1st objective, in addition to a 1st characteristic, it is an 11th feature that the said imaging is performed based on conveyance position information of the said display substrate obtained from the conveyance means which performs the said conveyance.

Further, in order to achieve the first object described above, in addition to the first, second, or fourth feature, the imaging is performed by an ACF attachment job processing device or a downstream of the ACF attachment job processing device that processes the ACF attachment job. The twelfth feature is that the operation is performed based on inspection information included in the processing task control means for controlling the processing task of the downstream task processing apparatus provided in the apparatus.

Moreover, in order to achieve the said 1st objective, in addition to a 6th characteristic, the said ACF attachment work processing apparatus has a some attachment head and based on the test result of the said ACF attachment state inspection unit, a plurality of attachments is carried out. The thirteenth feature is that the processing operation is continued except for the attachment head on which the processing operation determined to be abnormal among the heads is performed.

Moreover, in order to achieve the said 2nd objective, the display substrate is conveyed, the process of attaching an ACF to the side of the said display substrate, the inspection state of the attachment of the said ACF, and other work processes are performed, When assembling, at least 14th imaging | photography is performed during the conveyance of the said board | substrate for the said test | inspection, and based on the said test result, the said other work process is controlled.

Finally, in order to achieve the aforementioned second object, in addition to the fourteenth feature, the control is an instruction to pass through a display substrate having an abnormality when the inspection result is determined to be abnormal. do.

According to the present invention, it is possible to shorten the total working time of the ACF attachment processing operation and the inspection operation of the ACF attachment state, or to provide a processing operation apparatus and an ACF attachment state inspection method capable of shortening the processing operation width required for ACF attachment. can do.

In addition, according to the present invention, the tact time of the display substrate module assembly can be shortened, or a display board module assembly line with a short line length can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS The figure which shows the display board module assembly line which is one Embodiment of this invention.
2 is a basic configuration and an operation explanatory diagram of a conveying apparatus for a display substrate according to the embodiment of the present invention.
Fig. 3 is a diagram showing a first example which is an embodiment of the present invention, showing only an ACF attachment processing work device, an ACF attachment state inspection unit, and a TAB / IC mounting processing work device.
4 is a diagram showing an ACF attachment inspection processing flow according to the embodiment of the present invention.
The figure which shows ACF adhesion state inspection information data obtained from CAD data in embodiment of this invention.

EMBODIMENT OF THE INVENTION Hereinafter, 1st Embodiment of this invention is described using FIGS.

FIG. 1: is the display board module assembly line 1 which is one Embodiment of this invention, and FIG. 2 is a figure which shows the basic structure of the conveyance apparatus 2 of the board | substrate.

The apparatus of FIG. 1 is conveyed by the conveying apparatus which consists of the board | substrate holding means 12 which hold | maintains the board | substrate P, and the board | substrate conveying means 11 for conveying the board | substrate to the position of the processing apparatus which adjoins, from the left side in a figure. It is an apparatus which carries out various processing operations to the periphery of a board | substrate, conveying a board | substrate sequentially toward the right side, and performs mounting assembly work, such as IC and TAB. The apparatus of FIG. 1 performs the process of the board | substrate long side side by the 13 L of processing work apparatus groups of the board | substrate long side of the left side, and after performing the process of the board | substrate long side side, the board | substrate is rotated by the board | substrate rotation means 19, The board | substrate short side side process is performed by 13S of process working apparatus groups on the board | substrate short side side which have the same structure. In the board | substrate long side 13L and the board | substrate short side 13S, the same code | symbol is described about the same apparatus and the same function below.

As a board | substrate long side process shown in FIG. 1, the terminal cleaning process which cleans the TAB attachment part of the board | substrate edge part from the left side, (2) the ACF process of attaching an anisotropic conductive film (ACF) to the board | substrate edge part after cleaning, (3 ) ACF inspection process for inspecting the attachment state of the attached ACF, (4) mounting process for positioning and mounting the TAB or IC on the board wiring at the position where the ACF is attached, and (5) heat-compressing the mounted TAB or IC. And the crimping | fixing process fixed by ACF film is performed sequentially, and after the last or all the process edge | side of a board | substrate end is comprised, it is comprised so that the process work which mounts a PCB board | substrate which is a peripheral board | substrate is performed.

In the figure, the code | symbol 14-20 is shown with the same code | symbol on both the long side and short side, respectively, and the terminal cleaning processing apparatus 14, the ACF attachment processing apparatus 15, the TAB / IC mounting processing operation apparatus 16, and this The ACF attachment state inspection unit 20 provided on the conveyance path between the crimp processing apparatus 17, the substrate rotating means 19, and the ACF attachment processing apparatus 15 and the TAB / IC mounting processing apparatus 16 is moved. It is shown. In addition, the board | substrate board | substrate mounting work processing apparatus is abbreviate | omitted. In addition, the ACF attachment processing work device 15 has a plurality of ACF attachment processing work units on both the long side and the short side of the substrate, so that the processing time of the above operation is long, so that the work is shared by each unit to display the substrate. In order to make uniform the processing time of each apparatus of a module assembly line, and to improve the throughput as a display board module assembly line.

2 is a cross-sectional view along the line A-A seen from the X direction, which is the conveyance direction of the substrate P. FIG. As shown in FIG. 2, the conveying apparatus 2 has the board | substrate conveying means 11 and the board | substrate holding means 12, and the position of each board | substrate conveyed to each processing operation apparatus as shown in FIG. 3 mentioned later. The linear encoder 2a which detects this is provided. The board | substrate holding means 12 has a plurality (4 in FIG. 2) of board | substrate holding member 12A elongate in a board | substrate conveyance direction. On the other hand, the board | substrate conveying means is provided in parallel between the said board | substrate holding member 12A (3 in FIG. 2), and is similar to the board | substrate conveying member 11A which is elongate in a board | substrate conveyance direction, FIG.2 (a), ( As shown in b), the board | substrate conveyance member elevating means 11B which raises and lowers the said board | substrate conveyance member 11A, in order to load or space the board | substrate P to the said board | substrate holding member 12A, and the board | substrate conveyance means 11 ) Has a slider 11D for moving it in the conveying direction on the guide rail 11C.

The conveying method in such a structure will be described taking the case of conveying the substrate P shown in FIG. 1 from the ACF attachment processing device 15 to the TAB / IC mounting processing device 16 as an example. The board | substrate conveying means 11 hold | maintains the board | substrate P with 11 A of board | substrate conveyance members at the place of the ACF attachment processing apparatus 15, as shown to FIG. It raises by the means 11B, and the board | substrate P is spaced apart from the board | substrate holding member 12A. Thereafter, the substrate P is conveyed to the position of the TAB / IC mounting processing working device 16 by the slider 11D while the substrate P is held up. At this time, the substrate conveyance member 11A moves between the members of the substrate holding member 12A. In the TAB / IC mounting processing work device 16, the substrate P is lowered and placed on the substrate holding member 12A (FIG. 2A) to separate the substrate conveying member 11A from the substrate P. . The substrate P is mounted by the TAB / IC mounting processing working device 16. During this mounting operation, the substrate conveying means 11 returns to the ACF attachment processing apparatus 15 to maintain the posture not holding the substrate and to convey the next substrate. Since the series operation is performed in synchronization with all the substrates P working on the assembly line 1, all the substrates are synchronously conveyed and the processing is performed.

The display board module assembly line and the conveying apparatus shown in FIG. 1, FIG. 2 are one Embodiment, Of course, what kind of processing apparatus needs to be placed continuously is of course dependent on the display board module structure which performs an assembly work.

Hereinafter, the ACF attachment state inspection unit 20 which is the most characteristic of this invention is demonstrated. The basic way of thinking of the present invention is as follows. Conventionally, the imaging means was provided downstream with respect to the moving direction of the attachment head of an ACF attachment processing apparatus, and the image was introduce | transduced and inspected every time an ACF is attached in an attachment operation position. On the other hand, in this embodiment, an imaging means is installed downstream of the attachment head with ACF, and the board | substrate P is installed in the TAB / IC mounting process work device 16 which is the next processing work device from that position, for example. ), The attached working position is picked up, and an image is introduced and inspected. Basically, the inspection result can be obtained before processing the next substrate. For example, even after the inspection time is required, the inspection can be completed within the ACF adhesion processing working time of the next substrate, so it is not necessary to provide time only for image introduction and inspection.

Therefore, according to this embodiment, the ACF attachment state inspection unit and the display board module assembly line which can shorten the tact time of display board module assembly can be provided.

FIG. 3 is a diagram showing a first embodiment for realizing it, showing only the ACF attachment processing apparatus 15, the ACF attachment state inspection unit 20, and the TAB / IC mounting processing apparatus 16. As shown in FIG. As shown in FIG. 1, on the long side, the ACF attachment processing work device 15 has four ACF attachment processing work units 15a-15d. The ACF attachment state inspection unit 20 of the first embodiment is provided on the conveyance between the downstream unit apparatus 15d and the TAB / IC mounting processing operation apparatus 16 among the four units, and the four ACF attachment processing operations at the front end. Inspect the attached ACF at once. This ACF attachment state inspection unit 20 is provided at the position indicated by an ellipse for each of the processing work device groups 13L and 13S on the board long side and the board short side.

The ACF attachment state inspection unit 20 receives instructions from the imaging means 22, which is the illumination means 21 and the line sensor camera 22a, and the device control portion 30, which is the device control means, for imaging the ACF attachment portion, It consists of the image processing part 23 which is control of a timing, etc., and inspection control means which processes the picked-up image signal. Of course, the line sensor camera 22a has a pixel resolution Gnr (18.6 mu m) capable of detecting a substrate terminal mark 25 of 300 mu m which will be described later during ACF attachment state inspection, and a maximum conveyance speed Hv ( It has a shutter opening speed (Snv) (18.6 kPa) in which image blur does not occur with respect to 1700 mm / s.

In this embodiment, the image processing unit 23 is incorporated in the device control unit 30 which also serves as a control unit of the ACF attachment processing apparatus 15. In addition, the components which the ACF attachment state inspection unit 20 affects the line length of the assembly line 1 are the lighting means 21 and the imaging means 22. In this embodiment, since the line sensor camera 22a is used as the imaging means 22, the illumination range which is an imaging range is narrow, and a illumination means can also be miniaturized. As a result, it can fully install in the conventional conveying means 2, without providing an installation width in particular. In the above embodiment, the image processing unit 23 is provided in the device control unit 30, but may be provided separately.

Therefore, according to this embodiment, the line length does not become long by the installation of the ACF attachment state inspection unit 20, and the line length can be shortened only by the width | variety of the width | variety of the ACF attachment processing work device 15. have.

In the above embodiment, the imaging means or the like is provided as the ACF attachment state inspecting unit 20 at the rear end of the ACF attachment processing work device 15. However, the imaging means and the like are inside the ACF attachment processing work device 15, and the most downstream. It may be provided downstream of the ACF attachment head 15dh of the ACF attachment processing work unit 15d. In addition, when there are many places of the ACF attachment processing work position with respect to one board | substrate, and the processing time of the acquired image cannot process in a desired time, for example, during conveyance, an imaging means etc. are downstream of ACF attachment head 15bh. In addition to this, the substrate P is imaged while moving from the ACF attachment heads 15ah to 15bh to the processing work position of the ACF attachment heads 15ch to 15dh, and the substrate P is attached to the ACF attachment heads 15ah to 15bh. You may check. In an extreme sense, imaging means or the like may be provided downstream of each of the ACF attachment heads 15ah to 15dh, and each of the attached ACFs may be imaged and inspected during transportation.

4 shows an ACF attachment inspection processing flow mainly of the image processing unit 23. FIG. 5 shows an example of ACF adhesion state inspection information data (hereinafter referred to simply as inspection information data) obtained from CAD data.

The image processing unit 23 first receives the completion signal of the ACF attachment work of the board | substrate P from the (1) apparatus control part 30. FIG. Next, (2) the start of conveyance is detected by the pulse signal 2s of the linear encoder 2a provided in the conveying means 2, the pulse signal 2s is counted, and the front end of the substrate P is counted. The introduction of the image is started based on the passing timing, and after that, the image is introduced at every constant sampling distance Dsh, and ends at the rear end of the substrate P. The passage timing is corrected based on positional shift information (hereinafter referred to as conveying error data) of the substrate with respect to the conveying means 2 of the terminal mark 25 obtained by the alignment implementation in the ACF attachment device 15. After that, the board terminal mark 25 is detected from the introduction image in (3) the image processing. Also in this detection process, when the position shift of the said conveyance error data is large, the detection range of the terminal mark 25 is taken wide. (4) A plurality of virtual detection lines are provided in the cut-out ACF attachment area, and the presence or absence of an ACF is determined by the shade on the detection line. (5) Next, the ACF attachment area image data is subjected to image processing such as binarization and detection detection such as misalignment, twisting or breaking of the attachment position of the ACF is performed. (6) When a determination result and an abnormality generate | occur | produce, it transmits to the integrated control part 60 the ACF attachment position where an abnormality occurred, and the image data used as the base.

In step (3) of the said processing flow, it is necessary that the board | substrate terminal mark 25 can be detected. Although the diameter of the said board | substrate terminal mark 25 in a present Example changes with a board | substrate, it is a minimum of 300 micrometers. As the line sensor 22a, a material having a pixel resolution Gr of 18.6 占 퐉 capable of acquiring sufficient data is used, and in order to take an image of the substrate terminal mark 25 in three pixels or more, 100 占 퐉 ( Data is acquired every 0.1 mm). The sampling distance required for the detection of the board terminal mark 25 for acquiring data along with the conveyance direction of the substrate is referred to as Dsm.

Next, the sampling distance Dsh necessary for the attachment state inspection is examined. In this embodiment, the amount of image processing and the amount of transfer of image data are reduced to shorten the inspection time and the transfer time between the control unit. Therefore, the resolution ratio of the vertical (X) horizontal (Y) of the image data to be introduced is defined based on the aspect ratio (Gr) of the required detection accuracy of the ACF inspection, and at least one data is compressed. By adopting such a method, the picked-up pixel is normalized to the required detection accuracy, so that the data can be efficiently inspected with little data while satisfying the required precision.

As a compression method of the X direction, the method of obtaining the average image in the meantime by opening the shutter for a fixed period of time or a fixed time from which the amount of light is at least from the viewpoint of downsizing of the lighting fixture is adopted. On the other hand, as a compression method in the Y direction, an average of data of a plurality of pixels is adopted.

The required detection accuracy (Gs) of the ACF inspection in this embodiment is Gsx = ± 0.5 mm in the conveyance (X) direction and Gsy = ± 0.1 mm in the (Y) direction orthogonal to the conveyance direction, and the required detection accuracy The ratio Gr is 5: 1 (= 5). Therefore, the resolution ratio of the introduction image in the inspection range with ACF is set to 5: 1 corresponding to the required detection accuracy ratio Gr. On the other hand, the image resolution in the X direction is 0.1 mm × 5 = 0.5 mm. Therefore, the sampling distance Dsh required for the adhesion inspection is 0.5 mm. Basically, it is necessary to have a relationship of Dsh? Gr, and the maximum sampling distance Dm is Gr. In this embodiment, since Dsh? Dm? Gr, the sampling distance Dsh cannot be made larger than that. Therefore, the shutter is opened for this distance to obtain a compressed image. On the other hand, in the Y direction, since 0.1 mm corresponds to five pixels, the average of five pixels or data for every five pixels is adopted and compressed.

In the present embodiment, as described above, the sampling distance Dsm necessary for the detection of the board terminal mark 25 and the sampling distance Dsh necessary for the ACF attachment state inspection are different. Therefore, in step 3 of the inspection process flow, data is acquired every 0.1 mm in the range where the board terminal mark 25 is considered to exist, and thereafter, data is acquired every 0.5 mm for the adhesion state inspection.

In the above description, the pixel resolution of the line sensor camera is sufficiently smaller than the required detection accuracy Gs in the embodiment, which is 18.6 m. Therefore, if there is room in the amount of image data in order to finish the inspection within a desired time, it is also possible to reduce the amount of compression and improve the detection accuracy in the state where the ACF is attached.

In addition, if it is not necessary to insist on efficiently processing the processing resolution of one pixel for data processing in the above embodiments in the X and Y directions, the effect of reducing the processing data and shortening the processing time is required detection accuracy ratio. It can be obtained even if (Gr) is smaller than 5 in the present embodiment.

As explained above, according to this embodiment, the ACF attachment state inspection unit method which can shorten an ACF attachment state inspection time can be provided.

Next, the process of the apparatus control part 30 which received the determination result by step (6) of FIG. 4, and the integrated control part 60 which controls the whole line is demonstrated.

The device control unit 30 transmits the information obtained from the image processing 23 and the board ID information in which the abnormality has occurred to the integrated control unit 60. The integrated control part 60 flows the said board ID information to the apparatus control part 31 of the TAB / IC mounting process work device 16, etc. from each said downstream apparatus from the said ACF attachment state inspection unit, Instead of performing processing on the substrate, it is simply instructed to carry out a passing treatment.

In addition, when the abnormality of the attachment of the same attachment continues more than a prescribed number of times, or when the abnormal frequency exceeds the designated ratio, the apparatus control part 30 judges that it is abnormal in the ACF attachment processing work device 15, and integrates the control part 60 Send the message. In addition, in the apparatus shown in FIG. 1, the ACF attachment processing work unit of a plurality (four long sides or two short sides) is provided with respect to the ACF attachment device 15. As shown in FIG. In this case, when an abnormality occurs at the same attachment point, the device control unit 30 determines whether to continue the work in the remaining attachment units, and transmits the message to the integrated control unit 60. When continuing, the integrated control part 60 may reduce the conveyance cycle between each processing work device performed for each process end, and, if possible, replaces or repairs the target ACF attachment unit in between. To hold the line.

According to the present embodiment described above, when an abnormality occurs in the ACF attachment state, the result is fed back to the ACF attachment processing device, whereby the ACF attachment processing device or display board module assembly line with high operation rate can be provided.

In addition, according to the present embodiment described above, when an abnormality occurs in the ACF attachment state, the result is fed forward to the display board module assembly line, and unnecessary work is not performed, so that the display board module assembly line has high efficiency and high reliability. Can be provided.

In addition, although the line sensor camera 22a was used as the imaging means 22 in the above embodiment, it picks up with the high speed area camera for every attachment work processing position, for example, cuts out the part of the attachment work processing position in the area image, Alternatively, similarly to the above embodiment, the image may be further compressed and subjected to image processing for inspection. In this case, since the whole attachment work processing position is imaged at once, the effect of taking the width as the ACF attachment state inspection unit and shortening the line length is somewhat less, but the effect of shortening the tact time can be obtained.

Alternatively, the same effect can be obtained by processing in the same manner as in the case of the high speed area camera, by using a normal CCD area camera so that a strong light quantity can be irradiated as a lighting means in a short time.

1: display board module assembly line
2: conveying device
2a: linear encoder
11: substrate transport means
12: substrate holding means
13L: Processing work equipment group of board long side
13S: Process working apparatus group of board short side
14: terminal cleaning processing work device
15: ACF attachment processing work device
15a to 15d: ACF attachment processing work unit
15ah to 15dh: ACF attachment head
16: TAB / IC mounted processing work device
17: this crimp processing device
19: substrate rotating means
20: ACF attachment state inspection unit
21: lighting means
22: imaging means
22a: line sensor camera
23: image processing unit
25: terminal mark indicating the end of the substrate
30: device control unit
60: integrated control unit
62: display device
63: input and output device
P: substrate (display substrate)

Claims

In the work processing apparatus which has an ACF attachment state inspection unit which examines the attachment state of the ACF attached to the predetermined position of the side of the said display substrate conveyed by the conveyance means which conveys a display board,
The ACF attachment state inspection unit includes illumination means for illuminating the predetermined position, imaging means for imaging the predetermined position, and inspection control means for inspecting at least the imaging during the conveyance,
The said image processing result is compressed and obtained based on the required detection accuracy ratio requested | required of the said inspection in the direction orthogonal to the said conveyance direction and the said conveyance direction, The job processing apparatus characterized by the above-mentioned.

The said imaging means or the imaging position of the said imaging means is provided downstream of the ACF attachment head which the ACF attachment work processing apparatus which processes the said ACF attachment job has, and the said ACF attachment head attaches the said ACF. It is an ACF attachment head, The job processing apparatus characterized by the above-mentioned.

The image processing position of the said imaging means or the said imaging means is provided upstream of the job processing head which the downstream job processing apparatus provided downstream of the said job processing apparatus with aACF, The job processing of Claim 2 characterized by the above-mentioned. Device.

The job processing apparatus according to claim 1, wherein the imaging means is provided downstream of an ACF attachment job processing apparatus that processes the ACF attachment job.

The job processing apparatus according to claim 3, wherein at least one of the illumination means, the imaging means, and the inspection control means is provided in the ACF attachment job processing device or the downstream job processing device.

The said ACF attachment state inspection unit and the ACF attachment job processing apparatus which processes the said ACF attachment job | work, or the downstream job processing apparatus provided downstream of the said ACF attachment job processing apparatus are integrated, It is characterized by the above-mentioned. Job processing unit.

The work processing device according to claim 1, wherein the processing work device is configured only with an ACF attachment state inspection unit.

The job processing apparatus according to any one of claims 1 to 7, wherein the image pickup means is a line sensor camera.

The job processing apparatus according to any one of claims 1 to 7, wherein the image pickup means is an area camera.

10. The job processing apparatus according to claim 9, wherein the area camera is a high speed area camera.

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The job processing apparatus according to claim 1, wherein the compression is performed at the time of imaging or by imaging data obtained by imaging.

The said processing control means performs the said imaging based on the conveyance position information of the said display board | substrate obtained from the said conveying means, The job processing apparatus of Claim 1 characterized by the above-mentioned.

The said ACF attachment work processing apparatus of Claim 6 has a plurality of attachment heads, and based on the test result of the said ACF attachment state inspection unit, the attachment head which performed the processing work determined as abnormal among a plurality of attachment heads. A job processing device, characterized in that the processing job is continued except for that.

The downstream inspection side according to any one of claims 1, 2, and 4, wherein the inspection control means is provided downstream of the ACF attachment work processing device or the ACF attachment work processing device that processes the ACF attachment work. And the imaging is performed based on inspection information of the processing job control means for controlling the processing job of the job processing device.

In the ACF attachment state inspection method of illuminating and imaging the ACF attached to a predetermined position of the side of the display substrate, and inspects the attachment state of the ACF based on the imaging result,
After the ACF is attached, the display substrate is imaged while being conveyed,
And acquiring the image pickup result based on a required detection accuracy ratio required for the inspection in the conveyance direction and the direction orthogonal to the conveyance direction.

The ACF adhesion state inspection method according to claim 16, wherein the inspection is further performed during the conveyance.

The ACF attachment state inspection method according to claim 16 or 17, wherein the imaging is performed with a line sensor camera or an area camera.

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The ACF attachment state inspection method according to claim 16, wherein the compression is performed at the time of imaging or with the imaging data obtained by imaging.

The ACF attachment state inspection method according to claim 16, wherein the imaging is performed based on the conveyance position information of the display substrate obtained from the conveyance means for carrying out the conveyance.

The said image pick-up is a process operation control means which controls the processing operation of the ACF attachment job processing apparatus which processes the said ACF attachment job, or the downstream job processing apparatus provided downstream of the said ACF attachment job processing apparatus. ACF adhesion state test | inspection method characterized by the above-mentioned.

The other job processing apparatus which performs other job processing with the job processing apparatus of any one of Claims 1-7, 12-14, The said display board | substrate is said job processing apparatus, and the said other job processing apparatus. In the display board module assembly line which has a conveying means which conveys sequentially between them, and the integrated control part which controls them,
And said integrated control part controls said another job processing apparatus based on the inspection result of said ACF attachment state inspection unit.

Another job processing apparatus which performs a job processing different from the job processing apparatus of Claim 8, The conveying means which conveys the said display board sequentially between the said job processing apparatus and the said other job processing apparatuses, and the integrated control part which controls them are provided. In the display board module assembly line,
And said integrated control part controls said another job processing apparatus based on the inspection result of said ACF attachment state inspection unit.

It has another job processing apparatus which performs a job processing different from the job processing apparatus of Claim 9, conveyance means which sequentially conveys the said display board between the said job processing apparatus and the said other job processing apparatus, and the integrated control part which controls them. In the display board module assembly line,
And said integrated control part controls said another job processing apparatus based on the inspection result of said ACF attachment state inspection unit.

Another job processing device which performs a job processing different from the job processing device of Claim 15, the conveying means which conveys the said display board between the said job processing device and the said other job processing device sequentially, and the integrated control part which controls them In the display board module assembly line,
And said integrated control part controls said another job processing apparatus based on the inspection result of said ACF attachment state inspection unit.