JP2011249664A - Display board module assembling device, and method of assembling the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a display board module assembling device capable of shortening the length of an assembling line and a tact for the entire line, by eliminating an inspection space and an inspection time exclusive for inspecting displacement of a mounted component.SOLUTION: A display board module assembling device has: a thermocompression processing operation unit 17 for thermally compressing and bonding the mounted component onto a display board P; a carrier device 2 for carrying the display board P; and a mounted component displacement inspection unit 20 for inspecting positional displacement of the mounted component with respect to the display board P. The mounted component displacement inspection unit 20 has imaging means to image an imaging area required to inspect the positional displacement during one time carriage of the display board P by the carrier device 2.

Description

  In the present invention, a driving IC is mounted around a display substrate of an FPD (= Flat Panel Display) such as liquid crystal or plasma, or so-called TAB (= Tape Automated Bonding) such as COF (Chip on Film) or FPC (Flexible Printed Circuits). The present invention relates to a processing work apparatus for mounting a connection and a peripheral board (PCB = Printed Circuit Board), and a display board module assembly line composed thereof. More specifically, the present invention relates to a display substrate module assembling apparatus and an assembling method configured based on an inspection unit or an inspection result for inspecting a positional deviation of a mounted TAB or IC.

  The display substrate module assembly line is a process substrate for FPD display substrates such as liquid crystal and plasma (hereinafter, simply abbreviated as a substrate, and clearly described as a PCB substrate in the case of a PCB, for example). Is a device for mounting a driving IC, a TAB, a PCB substrate, and the like around the substrate by sequentially performing the above.

  For example, as an example of the processing step, (1) a terminal cleaning step for cleaning the TAB attachment portion at the end of the substrate, (2) an anisotropic conductive film (ACF = Anisotropic Conductive Film) is attached to the end of the substrate after cleaning. ACF process, (3) ACF inspection process for inspecting the pasted state of ACF, (4) Mounting process for positioning and mounting TAB and IC on the substrate wiring at the position where ACF is pasted, (5) Mounted TAB (6) Mounting inspection process for inspecting the position and connection state of the TAB or IC that has been crimped, (7) A PCB substrate on the opposite side of the TAB substrate side from the ACF, etc. It consists of a PCB process (multiple processes) and the like that are pasted and mounted. Furthermore, the number of processing apparatuses, processing units for rotating the substrates, and the like are required depending on the number of sides of the substrate to be processed and the number of TABs and ICs to be processed. By obtaining such a process, the substrate is electrically connected to the TAB or IC by thermocompression bonding of an ACF provided between the electrode on the substrate and an electrode such as TAB / IC.

  When the ACF is thermocompression-bonded, the expansion of the ACF, IC, and TAB, or they slightly move during the press-bonding, and a displacement of the mounted components occurs. Therefore, it is necessary to inspect whether the positional deviation amount is within an appropriate range. Conventionally, a substrate is transported to an adjacent position, stopped, and inspected. There exists following patent document 1 as such a prior art.

JP 2002-110733 A

  The prior art described above requires an inspection place corresponding to the dimensions of the substrate, and there is a problem that the display substrate module assembly line becomes long. Further, the above-described conventional technique has a problem that it requires a time only for inspection, and the tact, which is the processing time for the entire line, becomes long.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to eliminate the inspection space and inspection time dedicated to the positional deviation inspection of the components mounted on the display board, and reduce the length of the assembly line and shorten the tact of the entire line. And providing an assembly method.

  As one embodiment for achieving the above object, a thermocompression processing work apparatus for thermocompression-bonding a mounting component to a display substrate, a transport means for transporting the display substrate to which the mounting component is thermocompression-bonded, and the display substrate In the display substrate module assembling apparatus having a mounting component displacement inspection unit for inspecting a positional displacement of the mounted component, the mounted component displacement inspection unit picks up an image necessary for the positional displacement inspection during one transport by the transport means. A display substrate module assembling apparatus having imaging means for imaging an area is provided.

  Also, a thermocompression bonding step for thermocompression bonding the mounted component to the display substrate, a transporting step for transporting the display substrate on which the mounting component is thermocompression bonded, and the mounting on the display substrate during one transport in the transporting step. And a step of imaging an imaging area necessary for component misalignment inspection.

  According to the present invention, the imaging area necessary for the positional deviation inspection is imaged during one board transfer, thereby eliminating the inspection space and the inspection time dedicated to the positional deviation inspection of the components mounted on the display board, and assembling. It is possible to provide a display substrate module assembling apparatus and assembling method capable of reducing the length of the line and the tact of the entire line.

1 is a schematic plan view of an assembly line including a display substrate module assembly apparatus according to a first embodiment of the present invention. It is a schematic sectional drawing seen from the X direction for demonstrating operation | movement of the conveying apparatus of the display substrate module assembly apparatus which concerns on 1st Example of this invention, (a) is the state before conveyance or after conveyance ( b) shows the state in the middle of conveyance. FIG. 5 is a diagram showing an inspection location (lower side in the figure) and a timing chart (upper side in the figure) of the mounted component deviation inspection in the display substrate module assembling apparatus according to the first example of the present invention. It is the figure which showed the mounting component shift | offset | difference test | inspection principle and determination method by the alignment mark in the display board module assembly apparatus which concerns on 1st Example of this invention, (a) is an example of a disqualification, (b) is an example of a pass. Indicates. BRIEF DESCRIPTION OF THE DRAWINGS It is the schematic plan view which showed the mounting component shift | offset | difference test | inspection principle and determination method by the dummy lead in the display substrate module assembly apparatus based on 1st Example of this invention, (a) is a mounting component and the display substrate in which it is mounted. (B) and (c) show examples of patterns used for positional deviation evaluation, and (d) and (e) show examples of positional deviation evaluation determination. It is a figure which shows schematic structure of the mounting component shift | offset | difference test | inspection unit in the display substrate module assembly apparatus which concerns on 1st Example of this invention. It is a block diagram which shows an example of a structure of the mounting components shift | offset | difference test | inspection unit provided with the illumination and the camera for imaging | photography the position shift inspection pattern based on 1st Example of this invention. It is a figure which shows the mounting components shift | offset | difference test | inspection data obtained from CAD data in the display board module assembly apparatus based on the 1st Example of this invention. It is the figure which showed the test | inspection flowchart in the display board module assembly apparatus which concerns on the 1st Example of this invention. It is the figure which showed the light emission timing of the shutter of an imaging means and the illumination means in the mounting components shift | offset | difference inspection unit which concerns on 1st Example of this invention, (a) is a case where a high speed area camera is used as an imaging means, b) shows a case where an area camera such as a normal CCD camera is used. It is the figure which showed the processing flow at the time of assembling using the display substrate module assembly apparatus which concerns on 1st Example of this invention. It is a figure which shows the illuminating device structural example in the mounting component shift | offset | difference inspection unit which concerns on 1st Example of this invention, (a) is a whole structure top view, (b) is a structure top view of a light guide connection part, (C) is a structural plan view of the light source emitting end, (d) is a schematic side view of ring illumination, and (e) is a schematic cross-sectional view of dome-shaped illumination. It is a figure which shows the illuminating device structural example in the mounting component shift | offset | difference inspection unit which concerns on 2nd Example of this invention, (a) is the whole top view of spot illumination, (b) is the whole top view of ring illumination, (C) is a plan view of the ring illumination tip, and (d) is an example of detection signals for spot illumination and ring illumination.

  Hereinafter, an example explains.

  A first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a schematic plan view of a display board module assembly line 1 including a display board module assembly apparatus according to this embodiment, and FIG. 2 is a schematic cross-sectional view showing a basic configuration for explaining the operation of the board transfer apparatus 2. It is.

  The apparatus of FIG. 1 is moved from left to right in the figure by a transfer device 2 comprising a substrate holding means 12 for holding a substrate P and a substrate transfer means 11 for transferring the substrate to the position of an adjacent processing work apparatus. This is an apparatus for performing various assembly operations on the periphery of the substrate P while sequentially transporting the substrates P to perform mounting and assembly operations such as IC and TAB. The apparatus shown in FIG. 1 first performs processing on the long side of the substrate by the processing apparatus group 13L on the left side of the long side of the substrate (upper stage in FIG. 1). The substrate is rotated by the rotating means 19 (upper stage in FIG. 1), and processing on the short side of the substrate is performed by the processing work apparatus group 13S (lower stage in FIG. 1) having the same configuration. In the substrate long side processing work device group 13L and the substrate short side processing work device group 13S, the same reference numerals are used for the same devices and functions.

  As the substrate long side processing shown in FIG. 1, from the left, (1) a terminal cleaning process (processing with a terminal cleaning processing apparatus) for cleaning the TAB attaching portion at the substrate end, (2) the substrate end after cleaning ACF pasting process (processing with an ACF pasting processing work device) for pasting an anisotropic conductive film (ACF) on (3) and ACF inspection step (processing with an ACF pasting processing work device) for inspecting the pasting state of the pasted ACF ), (4) Mounting process (processing with TAB / IC mounting processing work device) for positioning and mounting TAB and IC on the substrate wiring at the position where ACF is pasted, (5) Thermocompression bonding of mounted TAB and IC Thus, the crimping process (processing by the main crimping processing work apparatus) for fixing with the ACF is sequentially performed, and further, the processing work for mounting the PCB substrate as the peripheral substrate is performed at the end on the long side of the substrate. Is constructed sea urchin.

  Reference numerals 14 to 20 in the figure denote the same reference numerals on the long side and the short side, respectively, and the terminal cleaning processing work device 14, the ACF sticking processing work device 15, the TAB / IC mounting processing work device 16, and the main pressure bonding processing, respectively. A mounting component misalignment inspection unit 20 provided on the downstream side of the working device 17, the substrate rotating means 19, and the main pressure bonding processing working device 17 is shown. Further, a to d described in the ACF sticking processing work device 15 indicate processing work units provided with a pressure bonding head, and arrows indicating two-way indicate movement directions of the processing work units. Although the PCB substrate mounting work processing apparatus is on the downstream side of the substrate short side processing work apparatus group 13S, it is omitted here.

  FIG. 2 is a cross-sectional view taken along the line AA when viewed from the X direction, which is the transport direction of the substrate P. As shown in the figure, the transfer device 2 includes a substrate transfer means 11 and a substrate holding means 12, and linearly detects the position of each substrate transferred to each processing work apparatus as shown in FIG. 6A described later. An encoder 2a is provided. The substrate holding means 12 has a plurality (four in FIG. 2) of substrate holding members 12A elongated in the substrate transport direction. On the other hand, a plurality of (three in FIG. 2) substrate transfer means 11 are juxtaposed between the substrate holding members 12A, and the substrate transfer member 11A is elongated in the substrate transfer direction, as shown in FIGS. 2 (a) and 2 (b). In order to place the substrate P on or away from the substrate holding member 12A, a substrate transport member lifting / lowering means 11B for moving the substrate transport member 11A up and down, and a slider 11D for moving the substrate transport means 11 on the guide rail 11C in the transport direction. Have

  A transport method in such a structure will be described by taking as an example the case where the substrate P shown in FIG. 1 is transported from the ACF attachment processing work device 15 to the TAB / IC mounting processing work device 16. As shown in FIG. 2B, the substrate transfer means 11 holds the substrate P by the substrate transfer member 11A and raises the substrate P by the substrate transfer member lifting / lowering means 11B at the place of the ACF attaching processing work device 15. Separated from the holding member 12A. Thereafter, the substrate P is transported to the position of the TAB / IC mounting processing work device 16 by the slider 11D while the substrate P is held upward. At this time, the substrate transport member 11A moves between the members of the substrate holding member 12A. In the TAB / IC mounting processing apparatus 16, the substrate P is lowered and placed on the substrate holding member 12 </ b> A (FIG. 2A), and the substrate transport member 11 </ b> A is separated from the substrate P. The substrate P is loaded by the TAB / IC loading processing work device 16. During this mounting operation, the substrate transfer means 11 holds the posture not holding the substrate P, and returns to the ACF application processing work device 15 to transfer the next substrate. Since the above series of operations are performed in synchronism with all the substrates P in operation on the assembly line 1, all the substrates P are conveyed in synchronism and processed.

  The display substrate module assembly line 1 and the transfer device 2 shown in FIG. 1 and FIG. 2 are one example, and in particular, what kind of processing work devices need to be connected depends on the configuration of the display substrate module that performs the assembly work. Dependent. Further, the above-described transfer device 2 is an example, and any transfer means provided with means for detecting the transfer position of the substrate may be used.

  Next, the mounted component deviation inspection unit 20 will be described. First, the mounting component shift inspection will be described. FIG. 3 is a diagram showing an inspection location (lower side in FIG. 3) and a timing chart (upper side in FIG. 3) of a mounted component deviation inspection, which will be described later, and FIG. 4 is a diagram showing an inspection principle and a determination method using alignment marks.

  On the lower side of FIG. 3, the processing work locations S1 to S6 (6 locations in the example of FIG. 3) on which the mounting components B1 to B6 are mounted and the alignment marks Mm1 and Mh1 on both ends of the mounting components B1 to B6. One side of the substrate P having ~ Mm6 and Mh6 is shown. As shown in FIG. 4A, the alignment marks Mm1, Mh1 to Mm6, and Mh6 include a substrate alignment mark MP provided on the substrate P and a mounting component alignment mark MT provided on the mounting component B. Therefore, the imaging areas Hm1, Hh1 to Hm6, and Hh6 indicated by the broken lines including the respective alignment marks Mm1, Mh1 to Mm6, and Mh6 are imaged, the respective alignment marks MP and MT are imaged, and the deviation amount, for example, FIG. 4 (a), the amount of deviation between the positive cross positions MPc and MTc indicating the centers of the alignment marks MP and MT is obtained, and if the amount of deviation is within a predetermined range, it is determined to be acceptable. Although it is an extreme example, FIG. 4 (a) shows an example of a failure with a large amount of deviation, and FIG. 4 (b) shows an example of a pass with matching cross positions. Note that the cross positions are not necessarily completely coincident and can be passed if they are within a predetermined range.

  In addition to the alignment mark described above, a dummy lead D can also be used as a location for inspecting the positional deviation of the mounted component B. FIG. 5A is a diagram showing dummy leads DT and DP and actual leads RT and RP that are actually used at the processing work site S of the substrate P corresponding to the mounting component B on the substrate P shown in FIG. . A substrate dummy lead DP is provided on the substrate P, and a mounting component dummy lead DT is provided on the mounting component B. The dummy leads DP and DT are provided at the ends of the leads RP and RT that are actually used, respectively. As shown in FIG. 5 (b), the dummy lead has a separation type in which the substrate dummy lead DP is wider than the mounting component dummy lead DT and is divided into two parts, and a continuous type as shown in FIG. 5 (c). There is. FIG. 5D is a diagram showing an example of pass / fail in the separation type, and FIG. 5E is a continuous type.

In the following description, an example of inspection using alignment marks will be described.
First, the basic concept of the mounting component position shift inspection method in the present embodiment will be described. As shown in FIG. 1, a mounting component deviation inspection unit 20 having an imaging means is provided downstream in the conveying direction of the thermocompression bonding head of the main pressure bonding processing work device 17, and the next processing work device (for example, FIG. On the long side, while the substrate P is being transported to the substrate rotating means 19), the imaging area H including the alignment mark M of each crimping work place S is imaged, and the image is captured and inspected. Basically, the inspection result can be obtained before processing the next substrate. Even if an inspection time is required thereafter, the inspection can be completed within the time of the thermocompression processing for the next substrate, so that it is not necessary to provide time only for image capture and inspection.

  FIG. 6A is a view showing the substrate rotating means 19 as an example of the main pressure bonding processing work device 17, the mounted component deviation inspection unit 20, and the next processing work device. As the next processing work device, in addition to the substrate rotating means 19, a PCB substrate mounting work processing device, a substrate unloading device for unloading a substrate from a line, and the like can be considered. As shown in FIGS. 1 and 6A, on the long side, the main crimping processing device 17 includes two main crimping processing units 17a and 17b. The mounted component misalignment inspection unit 20 of this embodiment is provided under the conveying means between the downstream unit 17b and the substrate rotating means 19 out of the two main pressure bonding processing work units, and the two main pressure bonding processing operations in the preceding stage. The processing work locations thermocompression-bonded by the units 17a and 17b are inspected at a time (by one transport). Note that one transfer means transfer until the substrate P held by the substrate holding member 12A is lifted and moved by the substrate transfer means 11, and an alignment mark is imaged during this time. As shown in FIG. 1, one mounting component misalignment inspection unit 20 is provided on the downstream side of the main pressure processing work device 17 shown by a rectangle for each of the processing work device groups 13S and 13L on the short substrate side and the long substrate side. It is provided one by one.

  As shown in FIG. 6A, the mounted component deviation inspection unit 20 includes an illumination unit 21 and an imaging unit 22 for imaging the alignment mark M in the processing work place S on which a plurality of mounted components B on each side are mounted. In response to an instruction from the position encoder sensor 24 that detects the position from the linear encoder 2a of the substrate P on the transport apparatus 2 and the apparatus control unit 30 that is an apparatus control means, the control of the imaging timing and the like, and the captured image signal are processed. The image processing unit 23 is an inspection control unit. The components that affect the length of the device in the conveyance direction of the mounted component deviation inspection unit 20 are the illumination unit 21 and the imaging unit 22, but in this embodiment, no special installation length is required, and the conventional conveyance is performed. It can be installed in the apparatus 2 sufficiently.

  FIG. 6B is a block diagram of a mounted component deviation inspection unit that realizes the above. There are two types of lighting. This is because the alignment mark attached to the mounted component and the alignment mark attached to the substrate P are simultaneously photographed. The alignment mark attached to the mounting component B is formed, for example, by etching a copper plate on polyimide, and the surface is uneven. In order to photograph it, it is necessary to photograph by diffuse reflection. On the other hand, the alignment mark attached to the substrate P is, for example, a conductive pattern on glass and has a flat surface, and in order to photograph it, the image may be photographed by regular reflection. In order to photograph both the alignment mark attached to the mounting component B and the alignment mark attached to the substrate P, diffuse reflection illumination and regular reflection illumination are provided. By illuminating and photographing these alignment marks at the same time, it is possible to obtain an image for mounting component displacement inspection in a short time even while the substrate is being conveyed. Here, reference numeral 21-1 is a light source, reference numeral 21-2 is a light guide, reference numeral 21-6 is ring illumination, reference numeral 122 is a half mirror, reference numeral 22-1 is a camera, reference numeral 22-2 is a lens, reference numeral 23-1 is an image. A board, reference numeral 23-2 represents digital I / O, and reference numeral 23-3 represents a LAN.

  In addition, in order to acquire an image during conveyance with high conveyance speed, the structure of the illumination means 21 and the imaging means 22 in which an image does not blur, and those control timings are important. FIG. 9A shows the light emission timing of the shutter and the illumination means when a high speed area camera is used as the imaging means, and FIG. 9B shows the shutter and illumination means when an area camera such as a normal CCD camera is used. FIG.

  First, the case where a high speed area camera is used as the camera 22-1 will be described. Since the shutter speed of the high-speed area camera is faster than the transport speed and the shutter release time Ra is short, the illumination means 21 continues to be lit with an appropriate amount of light Ua for imaging. As the lighting equipment in this method, a mercury lamp (arc lamp), a halogen lamp, a filament lamp, or the like that can be continuously lit can be used. Further, a line sensor camera can be used as the camera 22-1. When the line sensor camera is used, the imaging range is in a line shape and the amount of light is not so much, but the resolution and the shutter speed capable of detecting the alignment mark M described above are required. Needless to say, the line sensor camera is arranged such that its line direction is perpendicular to the substrate transport direction.

  On the other hand, in a normal area camera, the shutter speed of the camera is slow and the shutter release time Rb is sufficiently longer than the transport speed, so that an image flows due to the transport. Get images without. For light emission in a short time Ut, a high light quantity irradiation means is necessary. At this time, since the lighting time of the illumination is sufficiently shorter than the shutter opening time, the shutter of the camera is opened in advance in consideration of the shutter opening delay time dt, and then the lighting is turned on. is necessary.

  In this embodiment, the illumination method shown in FIG. 9B will be described. However, the present embodiment can also be applied to the case shown in FIG. 9A unless there are special circumstances except for the light source and the camera. 11A and 11B are diagrams showing an example of the configuration of the illumination device in the mounted component misalignment inspection unit according to the present embodiment. FIG. 11A is an overall configuration plan view, and FIG. 11B is a configuration plan view of the light guide connecting portion. 11 (c) is a structural plan view of the light source emitting end, FIG. 11 (d) is a schematic side view of ring illumination, and FIG. 11 (e) is a schematic cross-sectional view of dome-shaped illumination. A xenon lamp was used as a light source for obtaining a high amount of light in a short time. As shown in FIG. 11 (a), for example, a two-branch light guide 21-2 using an optical fiber is attached to the exit end of a xenon lamp of about 30 W, and one light guide 21-4 is used for diffuse reflection illumination and the other. By using the light guide 21-3 for regular reflection illumination, it becomes possible to simultaneously illuminate each alignment mark with one light emission.

  Next, regular reflection spot illumination will be described. For example, the spot illumination 21-5 for specular reflection can be achieved by attaching the tip of a light guide using one optical fiber branched from the two-branch light guide 21-2 to a coaxial incident lens. Alternatively, as shown in FIG. 6B, a half mirror 122 is arranged at an angle of 45 degrees with respect to the camera 22-1 between the lens 22-2 of the camera 22-1 and the object to be photographed, and 45 with respect to the half mirror surface. It is also possible to obtain the same effect as a coaxial incident lens by matching the light guide emission end using the optical fiber from an angle of 90 degrees (90 degrees with respect to the camera 22-1).

  Furthermore, the diffuse reflection illumination will be described. As shown in FIGS. 11A and 11D, a light guide using an optical fiber distributed for diffuse reflection branched from the two-branch light guide 21-2 is arranged on the circumference to form a ring illumination 21-6a. By adjusting the irradiation light 31 so as to be directed to one of the object points (FIG. 11D), it is possible to obtain diffuse reflection illumination. For example, on the circumference of about φ20, the exit end of the light guide using the optical fiber is arranged uniformly at 45 degrees inside to form a ring shape (FIG. 11A). Optimizing the diffuse reflection illumination can be achieved by placing a light guide using a ring-shaped optical fiber at a height of 10 mm of the object (substrate P) to be photographed.

  It is also possible to increase the N / A by inserting a lens at the output end of the fiber to prevent light diffusion. Although the ring-type illumination method is used as the diffuse reflection illumination method, the dome-shaped diffuse reflection illumination 21-6b may be used as shown in FIG. The illumination in the dome can be arranged in one or two rows along the inner periphery. More than that is possible, but considering the dimensions and illuminance, 1-3 rows are practical, and 2 rows are preferred. In addition, the illumination unit may be divided into several blocks instead of a continuous form like a ring type or a dome type. In this case, a multi-branch light guide corresponding to the number of blocks in the illumination unit may be used.

  As shown in FIG. 11C, the uneven emission of the xenon lamp can be suppressed by arranging a lens 21-9 at the exit end of the xenon lamp 21-10, for example. it can.

Next, how to use the light branched into two will be described. One light is used as regular reflection illumination, and the other is used as diffuse reflection illumination. At that time, it is necessary to allocate more light to the diffuse reflection illumination than to the regular reflection illumination. This is because, in the case of regular reflection illumination, the light from the light source is directly taken into the light receiving side, whereas in the case of diffuse reflection illumination, a part of the light on the light emitting side is taken into the light receiving side. That is,
Illumination light quantity for specular reflection <Illumination light quantity for diffuse reflection
And For this purpose, the light guide fiber distribution amount using the optical fiber is distributed, for example, as follows: regular reflection illumination light amount: diffuse reflection illumination light amount = 3: 7, and adjusting the regular reflection light amount and the diffuse reflection light amount, The alignment mark on the substrate P and the alignment mark on the mounting member B can be observed with the same brightness.

  Furthermore, a fine light amount adjustment method will be described. As shown in FIG. 11B, for example, a light guide using an optical fiber is cut halfway and a light guide connector 21-8 is inserted, and the optical fiber is inserted in the light guide connector 21-8. By providing a mechanism (light quantity diaphragm mechanism 21-7) for adjusting the distance of the light guide using the light, it is possible to adjust the irradiation light quantity. Alternatively, in the light guide connector 21-8, a colored glass filter (light quantity diaphragm mechanism 21-7) is inserted between the light guides using optical fibers so that the light intensity can be reduced and the irradiation light quantity can be adjusted. To do. Note that the light guide connector having the light quantity stop mechanism can be attached to the regular reflection light guide, the diffuse reflection light guide, or both.

  By adjusting the amount of illumination light for regular reflection and the amount of illumination light for diffuse reflection, it is possible to reliably image the alignment marks on the substrate side and the mounted component side, and to perform a mounted component shift inspection.

  Next, the imaging timing of the alignment mark for mounting component deviation inspection after the mounting component B is mounted on the substrate P will be described. FIG. 3 (upper side) shows a processing timing chart of the mounted component deviation inspection unit 20 shown in FIG. 6A as described above. FIG. 7 shows an example of mounted component displacement inspection data (hereinafter simply referred to as inspection data) necessary for mounted component displacement inspection obtained from CAD data. The substrate P is transported in the direction of arrow A shown in FIG. 3 (lower side), that is, from left to right. Conversely, time flows from right to left. Note that W shown in FIG. 3 (lower side) indicates a distance in the Y direction.

  The alignment mark M that is first imaged when the substrate P is transported is the right alignment mark Mm1 of the mounting component B1 on the rightmost side. Then, the left alignment mark Mh1 of the mounting component B1, the right side of the mounting component B2, the left alignment marks Mm2, Mh2,. In FIG. 3 (lower side), a broken line around the alignment mark M represents the imaging area H at each position, and its attached code is Hm1, Hh1, Hm2, Hh2,... According to the code of the alignment mark M.・ It expresses. The position of the imaging area is represented by the center position, and the code is represented as Xm1, Xh1, Xm2, Xh2,... Since the transport direction is the X direction. In order to obtain the position of each imaging area shown in Expression (1) and Expression (2), first, the distance Lm1 between the imaging means from the position of the alignment mark Mm1 on the rightmost side in the main crimping processing work apparatus, The second is the distance Lm between the right alignment marks, the third is the distance Lmh between the left and right alignment marks, and the number n of mounting positions.

Xmn = Lm1 + (n−1) × Lm (1)
Xhn = Xmn + Lmh (2)
Here, n is an integer from 1 to 6. Further, as inspection data, lengths in the X and Y directions, HX, and HY that define the dimensions of the imaging area are required. In the actual imaging area, a positional shift occurs due to a shift that occurs when the substrate P is placed on the transfer means 2 or during the transfer. However, this misalignment can be dealt with by setting a wide imaging area in anticipation of the misalignment or by correcting the imaging area based on the misalignment amount obtained by the alignment of the present crimping processing apparatus.

  Accordingly, by having the configuration of the imaging means 22 of this embodiment and the timing control means for controlling the control timing thereof, the imaging area can be reliably imaged and the mounted component deviation inspection can be performed.

Next, the inspection procedure will be described.
FIG. 8 shows an inspection processing flow of the mounted component deviation inspection unit 20, and the inspection flow will be described with reference to a processing timing chart shown in FIG. 3 (upper side).

The mounted component misalignment inspection unit 20 performs an inspection process according to the following steps when the main crimping processing device 17 finishes the processing operation.
First, in step S801, the image processing unit 23 monitors the encoder pulse signal. When the conveying means 2 starts to move, the encoder pulse signal S2 starts to be output. Therefore, the encoder pulse signal S2 is counted (step S802). The transport means 2 gradually increases the speed Vh, and then keeps the speed constant, and stops by gradually decreasing the speed before the substrate P arrives at the substrate rotating means 19 that is the next processing work apparatus. The pulse width of the encoder pulse signal S2 changes when the speed of the conveying means 2 rises or falls, but the position of the imaging area H is managed not by time but by distance, so the number of encoder pulses can be counted. If you can get.

  Therefore, it is determined whether the count number is the count shown in Expression (1) or Expression (2) (Step S803). When it is determined that the area is an imaging area, the image processing unit 23 outputs an imaging pulse St to the illumination unit 21 and the imaging unit 22. Therefore, the illumination unit 21 performs flushing Fs depending on the case, and the imaging unit 22 captures images in synchronization with Fs and transfers the image data to the image processing unit 23. The image processing unit 23 processes the image data and performs a positional deviation inspection (step S804). As a result of the inspection, it is determined whether the positional deviation is equal to or greater than a specified range, and pass / fail is determined (step S805). If it fails, the processing results such as the processing work position that has been rejected, the number of the thermocompression bonding head that has been processed, and the amount of displacement are stored (step S806). When the inspection at all the processing work locations S is completed (step S807), the apparatus control unit 30 transmits the inspection result and image data by the image processing unit 23 to the overall control unit 60 (step S808).

  In the present embodiment, the image processing unit 23 is built in the device control unit 30 that also serves as the control unit of the main pressure bonding processing work device 17, but may be built in the control unit of the next work processing device. Furthermore, as described above, the mounted component deviation inspection unit 20 does not require an apparatus length, but the image processing unit 23 is independent from the apparatus control unit 30, and a unit control unit dedicated to the mounted component deviation inspection unit is provided. You may provide in the inside.

  Further, in this embodiment, the image pickup means and the like are provided as the mounted component deviation inspection unit 20 at the rear stage of the main pressure bonding processing work device 17. May be provided downstream of the thermocompression-bonding head 17bh of the main-compression processing operation unit, that is, the main-compression processing operation unit 17b.

  Furthermore, if there are many main crimping processing locations S for one substrate and the processing time of the acquired image cannot be processed within a desired time, for example, during conveyance, further downstream of other thermocompression bonding heads. An imaging means or the like necessary for imaging may be provided. For example, the imaging means and the like can be provided between the thermocompression bonding head 17ah and the thermocompression bonding head 17bh.

  As described above, by performing the mounted component shift inspection during the conveyance, the processing time for the mounted component shift inspection work alone is not required, and a processing work space corresponding to the size of the substrate P is provided for the mounted component shift inspection work. It is possible to provide a processing work device or a mounted component shift inspection method that can perform the inspection work mounted component shift inspection that is unnecessary or does not require a dedicated mounted component shift inspection device according to the dimensions of the substrate P.

  In addition, because the flow of the workpiece (display substrate) is not hindered by the mounting component displacement inspection, the tact time of the display substrate module assembly can be shortened, and the substrate mounting stage dedicated to the mounting component displacement inspection device is unnecessary. A display substrate module assembly line and a display substrate module assembly method with a short line length can be provided.

Next, processing of the apparatus control unit 30 that has received the determination result in step S806 of the mounting position deviation inspection flowchart of FIG. 8 and the overall control unit 60 that controls the entire line will be described.
The apparatus control unit 30 transmits the inspection result information obtained from the image processing unit 23 and the board ID information having the mounting position that has been rejected to the overall control unit 60. The overall control unit 60 sends the board ID information to, for example, the apparatus control unit 30 of the board rotating means 19 for each apparatus downstream from the mounted component deviation inspection unit 20, and each apparatus processes the board. Instructs to do the slewing process, without running.

  Further, the apparatus control unit 30 determines that there is an abnormality in the present crimping processing work device 17 when the number of failures continues more than the specified number of times from the inspection, or when the frequency of the failures exceeds a specified ratio, and the overall control unit 60 To that effect. Further, in the apparatus shown in FIG. 1, a plurality (two on the long side) of the main pressure-bonding work unit 17 is provided for the main pressure-bonding work device 17. In this case, when the failure frequently occurs in the same main pressure bonding processing unit, in particular, the thermocompression bonding head of the main pressure bonding processing unit, or when the frequency of the failure is high, the apparatus control unit 30 performs the remaining main pressure bonding processing. It is determined whether or not the work unit is to continue work, and the fact is notified to the overall control unit 60. The overall control unit 60 causes the display device 62 to display a main crimping operation processing unit or a thermocompression bonding head that frequently fails or has a high frequency of rejection. In the case of continuing, for example, the display result is viewed, and the target main crimping processing unit is replaced or repaired in the meantime to maintain the line.

  Furthermore, the apparatus control unit 30 transmits not only the failure information but also the image processing data and the detection result itself to the overall control unit 60. The overall control unit 60 accumulates these data in the server 61, for example, pasting error Information or the like is processed in time series or statistically and provided to the operator by the display device 62.

Next, the processing flow from the designation of the work type to the end of the work will be described.
FIG. 10 is a processing flowchart when assembling using the display substrate module assembling apparatus according to the present embodiment.

  First, in step S10A, an operator designates a work type. Next, in step S10B, it is determined whether or not it is a new variety. If it is a new product, the overall control unit 60 creates and saves the mounted component deviation inspection data shown in the figure from the CAD data stored in the server 61 (step S10C), and then proceeds to step S10D.

  In step S <b> 10 </ b> D, the device control unit 30 receives the mounted component deviation inspection data from the overall control unit 60. Then, the process of step S801-step S808 shown in FIG. 8 is performed (step S10E). Next, in step S10F, the overall control unit 60 determines whether the necessary number of sheets has been processed. If not completed, the process returns to the above-described step S10E, and if completed, the process proceeds to the next step S10G. In step S10G, it is determined whether there is a request for switching the product type. If there is, the process returns to step S10A, and if not, the process is terminated.

  As described above, inspection data can be automatically obtained from CAD data, and a mounting component displacement inspection unit or a display substrate module assembly line that can reduce the burden on workers can be provided. In the step (S10C), it is automatically created from the CAD data stored in the server 61, but may be input from the input / output device 63.

  In addition, when an abnormality occurs in the mounted component deviation, the result is fed back to the main crimping processing work apparatus, thereby providing a main pressing processing work apparatus or a display substrate module assembly line with a high operating rate. Further, when an abnormality occurs in the mounted component deviation, the result is fed forward to the display board module assembly line, and an efficient and highly reliable display board module assembly line can be provided without performing unnecessary work. Furthermore, it is possible to provide a mounting component shift inspection unit or a display board module assembly line that can store various data such as mounting component position shifts and monitor time-series changes or statistical data.

  As described above, according to the present embodiment, the light from the single light source is illuminated as the specular reflection illumination and the diffuse reflection illumination during the one-time substrate transport, and the position inspection mark for each of the substrate and the mounted component is illuminated. By using the illumination to capture the imaging area necessary for positional deviation inspection during one board transfer, the inspection space and inspection time dedicated to positional deviation inspection of components mounted on the display board are eliminated, and the assembly line It is possible to provide a display substrate module assembling apparatus and an assembling method capable of reducing the length of the circuit board and reducing the tact time of the entire line.

  A second embodiment will be described with reference to FIG. FIGS. 12A and 12B are diagrams showing an example of a configuration of an illumination device in the mounted component misalignment inspection unit according to the present embodiment. FIG. 12A is an overall plan view of spot illumination, and FIG. 12B is an overall plan view of ring illumination. FIG. 12C is a plan view of the ring illumination tip, and FIG. 12D is an example of detection signals for spot illumination and ring illumination. Reference numeral 32 denotes an optical fiber, and reference numeral 40 denotes an optical sensor.

  In the first embodiment, a single xenon lamp is used as a flash light source. However, in this embodiment, as shown in FIGS. 12A and 12B, regular reflection illumination (FIG. 12A) and diffuse reflection are used. A separate xenon lamp is used as the illumination (FIG. 12 (b)). In the diffuse reflection illumination, it can be guided to each illumination hole of the ring illumination by using the optical fiber 32 (FIG. 12C).

  When two xenon lamps are used, even if a light emission instruction is given at exactly the same timing, a light emission shift (n (ms)) may occur due to individual differences of the xenon lamps (FIG. 12D). In order to suppress this, in this embodiment, light emission jitter was measured and the light emission timing was adjusted. In the first embodiment, the alignment marks on the member side and the substrate side are photographed at the same time, but in this embodiment, they are separately photographed during one transport, and the position correction is performed to compose the image. An image for a member position deviation inspection is obtained. Although the number of light sources is two, a plurality of light sources may be used.

  By using a lamp (such as a mercury lamp) capable of continuous irradiation described in FIG. 9A and a high-speed camera or a line sensor camera as the illumination for specular reflection and diffuse reflection, the emission timing can be adjusted. No adjustment is necessary. Even when this illumination method is used, it is possible to obtain an image for mounting component position shift inspection.

  Except for the configuration using two light sources as the regular reflection illumination and the diffuse reflection illumination, unless otherwise specified, the configuration of the display substrate module assembling apparatus and the conveying apparatus shown in the first embodiment, the mounted component deviation inspection unit The matters described in the first embodiment and not described in the present embodiment, such as the configuration of the above, the inspection method, the display substrate assembly method, the adjustment method of the light quantity of the regular reflection illumination and the diffusion illumination, and the like can also be applied to this embodiment.

  As described above, according to the present embodiment, light from a plurality of (two) light sources is used as a specular reflection illumination and a diffuse reflection illumination, respectively. By using this illumination, the imaging area necessary for the positional deviation inspection is imaged during one board transfer, so that the inspection space dedicated to the positional deviation inspection of the components mounted on the display board and the inspection time can be reduced. Accordingly, it is possible to provide a display substrate module assembling apparatus and an assembling method capable of eliminating the length of the assembling line and reducing the tact time of the entire line.

1: Display board module assembly line,
2: conveying device, 2a: linear encoder,
11: Substrate transport means, 11A: Substrate transport member, 11B: Substrate transport member lifting / lowering means, 11C: Guide rail, 11D: Slider,
12: Substrate holding means, 12A: Substrate holding member,
13L: processing work equipment group on the long side of the substrate, 13S: processing work equipment group on the short side of the substrate,
16: TAB / IC mounting processing work device,
17: Main pressure bonding processing work apparatus, 17a-b: Main pressure bonding processing work unit, 17ah-bh: Thermocompression bonding head,
19: Substrate rotating means,
20: Mounting component deviation inspection unit,
21: Illumination means, 21-1: flash light source, 21-2: 2-branch light guide, 21-3, 21-4: light guide, 21-5: spot illumination, 21-6, 21-6a: ring illumination 21-6b: Diffuse reflection dome illumination, 21-7: Light quantity stop mechanism, 21-8: Light guide connector, 21-9: Lens, 21-10: Xe lamp,
22: imaging means, 22-1: camera, 22-2: lens,
23: Image processing unit, 23-1: Image board, 23-2: Digital I / O, 23-3: LAN,
24: Position encoder sensor,
30: Device control unit,
31: Ring illumination irradiation light,
32: optical fiber,
40: optical sensor,
60: General control unit,
61: server,
62: Display device
63: I / O device,
122: Half mirror,
M: alignment mark, MP: substrate alignment mark, MT: alignment mark,
P: substrate (display substrate),
S: Processing work location.

Claims (18)

A thermocompression processing operation apparatus for thermocompression-bonding the mounted component to the display substrate, a conveying means for conveying the display substrate on which the mounted component is thermocompression-bonded, and a mounted component displacement for inspecting the positional displacement of the mounted component with respect to the display substrate In a display substrate module assembly apparatus having an inspection unit,
The mounting component deviation inspection unit includes an imaging unit that images an imaging area necessary for the positional deviation inspection during one transfer of the display substrate by the transfer unit. In the display substrate module assembly apparatus according to claim 1,
The mounting component shift inspection unit includes illumination means including a regular reflection illumination unit and a diffuse reflection illumination unit, and a light source that supplies light to the regular reflection illumination unit and the diffuse reflection illumination unit. Display board module assembly apparatus. The display substrate module assembly apparatus according to claim 2,
The display substrate module assembling apparatus, wherein the light source is a single light source. The display substrate module assembly apparatus according to claim 2,
The display substrate module assembling apparatus, wherein the light source is a plurality of light sources. The display substrate module assembly apparatus according to claim 3 or 4,
The display substrate module assembling apparatus, wherein the light source is a flash light source. In the display substrate module assembly apparatus according to claim 5,
A display substrate module assembling apparatus, wherein light emission unevenness suppressing means for suppressing light emission unevenness is provided at an emission end of the flash light emission source. In the display substrate module assembly apparatus according to claim 6,
The display substrate module assembling apparatus, wherein the light emission unevenness suppressing means is a lens. The display substrate module assembly apparatus according to claim 3 or 4,
The display substrate module assembling apparatus, wherein the light source is a continuous lighting light source. The display substrate module assembly apparatus according to any one of claims 2 to 8,
The diffuse reflection illumination light amount of the diffuse reflection illumination unit and the regular reflection illumination light amount of the regular reflection illumination unit are:
A display substrate module assembling apparatus having a relationship of illumination light quantity for regular reflection <light quantity for diffuse reflection. The display substrate module assembly apparatus according to claim 9,
A light guide connecting the light source and the regular reflection illumination unit or the diffuse reflection illumination unit;
A light guide connector that is inserted in the middle of the light guide and includes a light amount diaphragm mechanism that adjusts the amount of illumination light for regular reflection or the amount of illumination light for diffuse reflection, or both. Display board module assembly apparatus. The display substrate module assembling apparatus according to any one of claims 2 to 10,
The display substrate module assembling apparatus according to claim 1, wherein the diffuse reflection illumination section has a ring shape. The display substrate module assembling apparatus according to any one of claims 2 to 10,
The display substrate module assembling apparatus, wherein the diffuse reflection illumination section has a dome shape.   A thermocompression bonding step of thermocompression-bonding the mounted component to the display substrate; a transporting step of transporting the display substrate on which the mounting component is thermocompression bonded; and the mounting component with respect to the display substrate during one transport in the transporting step. A display substrate module assembling method, comprising: an imaging step of imaging an imaging area necessary for the positional deviation inspection. The display substrate module assembling method according to claim 13,
The imaging substrate includes an illumination step of performing illumination for specular reflection and illumination for diffuse reflection on an imaging area necessary for the positional deviation inspection during one transporting step. Module assembly method. The display substrate module assembling method according to claim 14,
The method of assembling a display substrate module, wherein the illumination step is performed using a single light source. The display substrate module assembling method according to claim 14,
The display substrate module assembling method, wherein the illumination step is performed using a plurality of light sources. The display substrate module assembling method according to claim 16,
The plurality of light sources are a plurality of flash light sources;
The display substrate module assembling method, wherein the illuminating step includes a step of measuring a light emission jitter of the plurality of flash light emission sources and adjusting a light emission timing. The display substrate module assembly method according to any one of claims 14 to 16,
The method of assembling a display substrate module, wherein the illumination step is performed using a continuous lighting light source.

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