WO2021166220A1

WO2021166220A1 - Surface mounter and image analyzing method

Info

Publication number: WO2021166220A1
Application number: PCT/JP2020/007042
Authority: WO
Inventors: 和志高間
Original assignee: ヤマハ発動機株式会社
Priority date: 2020-02-21
Filing date: 2020-02-21
Publication date: 2021-08-26
Also published as: JP7290790B2; JPWO2021166220A1

Abstract

This surface mounter 1 for mounting a component E on a substrate P comprises: a rotary head 14 which supports a mounting head 21 for suctioning and retaining the component E to be raised and lowered; a head moving part 15 which moves the rotary head 14 in a direction parallel to the plate surface of the substrate P; a component measurement camera 71 which is provided on the rotary head 14, captures an image of the component E suctioned by the mounting head 21 to generate image data, and thins out and transmits the generated image data; and an analysis unit (an image capture board 84 and an arithmetic processing unit 81) which is connected to the component measurement camera 71 via a bending-resistant cable 110, and analyzes the thinned-out image data received from the component measurement camera 71. The component measurement camera 71 thins out the image data at a higher thinning rate in one direction (horizontal direction) that is set in accordance with the analysis content (measurement of the thickness of the component E) of the image data among the vertical direction and the horizontal direction of the image represented by the image data, than in the other direction (vertical direction), or thins out the image data in one direction while not thinning out the image data in the other direction.

Description

Surface mounter and image analysis method

The techniques disclosed in this specification relate to surface mounters and image analysis methods.

Conventionally, in a surface mounter that mounts a component on a board, a head portion that supports the component holding portion that holds the component so as to be able to move up and down, a moving portion that moves the head portion in a direction parallel to the plate surface of the substrate, and a head portion. An imaging unit provided in the above, which includes an imaging unit that images a component held by a component holding unit to generate image data, and an analysis unit that analyzes image data received from the imaging unit. It is known (see, for example, Patent Document 1).

Specifically, the electronic component mounting device described in Patent Document 1 includes a mounting head that supports an suction nozzle that holds an electronic component so as to be able to move up and down, and a moving device that moves the mounting head to an arbitrary position on a substrate. The parts camera, which is provided on the mounting head and captures the electronic components sucked and held by the suction nozzle, and the first image data input from the parts camera are subjected to gradation compression processing, and the processed result is the first. 2. It includes a transmission unit that transmits image data to the control unit and a control unit. The control unit determines whether or not the electronic component is normally held by the mounting head based on the received second image data.

Japanese Patent No. 6131315

In recent years, with the miniaturization of parts, higher resolution of the imaging unit has been required. When the resolution of the imaging unit is increased, the amount of image data increases. At the same time, recent surface mounters are required to process image data at high speed, and for this reason, it is required to transfer image data from the imaging unit to the analysis unit at high speed. Due to the demand for higher resolution and higher speed, a wide transfer band is required for the communication cable connecting the imaging unit and the analysis unit.

When the imaging unit is provided on the head unit, the head unit is moved by the moving unit, so that the imaging unit is often connected to the analysis unit via a bending-resistant cable (so-called flexible cable) as a communication cable. .. However, bending-resistant cables generally have a narrower transfer band than fixed cables. It is possible to widen the transfer band by increasing the number of communication cables, but it may be difficult due to layout restrictions, and problems such as increased cost and assembly man-hours will occur.

The electronic component mounting device described in Patent Document 1 compresses the gradation of the first image data, so that the amount of data can be reduced. Therefore, the image data can be transferred at high speed even in a narrow transfer band as compared with the case where the gradation is not compressed (in other words, the transmission time per image data can be shortened). However, the method of reducing the amount of data is not limited to gradation compression. Patent Document 1 does not study the problem in reducing the amount of data by a method other than the method of compressing gradation.

This specification discloses a technique that can reduce the amount of data while enabling highly accurate image analysis when the amount of data is reduced by thinning out the image data.

(1) The surface mounting machine disclosed in the present specification is a surface mounting machine that mounts components on a substrate, and has a head portion that supports the component holding portion that holds the component so as to be able to move up and down, and the head portion. An image data is generated by imaging the component held by the component holding unit, which is a moving unit that moves in a direction parallel to the plate surface of the substrate and an imaging unit provided on the head unit. An imaging unit that thins out the generated image data and transmits the image data, and an analysis unit that is connected to the imaging unit via a communication cable and analyzes the thinned-out image data received from the imaging unit. The imaging unit thins out one of the vertical direction and the horizontal direction of the image represented by the image data in one direction set according to the analysis content of the image data with a thinning rate larger than that of the other direction. While thinning out in one direction, it is not thinned out in the other direction.

The above-mentioned "one of the vertical direction and the horizontal direction set according to the analysis content of the image data" is "the direction in which the influence on the analysis accuracy is relatively small in the vertical direction and the horizontal direction". In other words.

For example, consider a case where a component held by a component holding portion is imaged from a horizontal direction and the thickness (width in the vertical direction) of the component is measured. In this case, if the image data is thinned out at a large thinning rate in the vertical direction, the measurement accuracy is lowered. On the other hand, even if thinning is performed with a large thinning rate in the lateral direction, the thickness measurement accuracy is not significantly affected.
According to the above-mentioned surface mounting machine, one of the vertical direction and the horizontal direction of the image represented by the image data, which is set according to the analysis content of the image data, is thinned out at a thinning rate larger than that of the other direction. Alternatively, one direction is thinned out, while the other direction is not thinned out. Therefore, for example, when the analysis content is the measurement of the thickness of a part, if the horizontal direction is set as one direction, the image data is not thinned out in the vertical direction (or thinned out at a thinning rate smaller than the horizontal direction). The amount of data can be reduced by thinning out the image data in the horizontal direction (or thinning out at a thinning rate larger than that in the vertical direction) while suppressing a decrease in the thickness measurement accuracy.

If the analysis content is the measurement of the horizontal width of the part, if the vertical direction is set as one direction, the image data will not be thinned out in the horizontal direction (or thinned out at a thinning rate smaller than the vertical direction). The amount of data can be reduced by thinning out image data in the vertical direction (or thinning out at a thinning rate larger than that in the horizontal direction) while suppressing a decrease in width measurement accuracy.
As described above, according to the above-mentioned surface mounting machine, when the image data is thinned out to reduce the amount of data, the thinning ratio is made different in the vertical direction and the horizontal direction of the image according to the analysis content of the image data. The amount of data can be reduced while enabling highly accurate image analysis.

In the above-mentioned Patent Document 1, since the gradation of the image data is compressed, necessary information may be lost. According to the above-mentioned surface mounter, by thinning out the gradation without compressing it, it is possible to suppress the loss of necessary information for the data remaining without being thinned out. Therefore, it is possible to perform highly accurate analysis as compared with the case of compressing the gradation. In the above surface mounter, if the analysis accuracy is not likely to decrease even if the gradation is compressed by binarization or the like, the gradation may be compressed and then thinned out.

(2) The imaging unit is provided on the head unit, and the component held by the component holding unit may be imaged from a horizontal direction.

According to the above surface mounter, when the component held in the component holding portion is imaged from the horizontal direction and the thickness or width of the component is measured, the amount of data can be reduced while enabling highly accurate image analysis. ..

(3) The analysis of the image data is the measurement of the thickness of the component, and the one direction may be the lateral direction.

According to the above surface mounter, when the component held in the component holding portion is imaged from the horizontal direction and the thickness of the component is measured, the amount of data can be reduced while enabling highly accurate image analysis.

(4) The analysis of the image data is the measurement of the width of the component, and the one direction may be the vertical direction.

According to the above surface mounter, when the component held in the component holding portion is imaged from the horizontal direction and the width of the component is measured, the amount of data can be reduced while enabling highly accurate image analysis.

(5) The analysis unit may execute a stretching process for stretching the image represented by the image data received from the imaging unit and analyze the stretched image.

For example, when measuring both the thickness (length in the vertical direction) and the width (width in the horizontal direction) of a part, high-precision measurement is required for the thickness, but low-precision measurement is allowed for the width of the part. If this is the case, the width may be measured from the image data thinned out in the horizontal direction with a thinning rate larger than that in the vertical direction. However, in that case, for example, if the image is thinned out in the horizontal direction by 1/2, the amount of calculation increases because the process of doubling the width measured from the image is required.

According to the above surface mounter, since the analysis unit stretches the image represented by the image data received from the imaging unit, the amount of calculation for measuring the width (or thickness) can be reduced by stretching the image to the number of pixels before thinning. .. As a result, the width (or thickness) of the component can be measured at high speed.
The image received from the imaging unit may be displayed on the display device for reasons such as investigating the cause when a problem occurs. When the thinned image is stretched, a natural image (or an image close to the natural image) can be displayed, so that there is an advantage that the convenience of the operator who views the image is improved.

(6) The image analysis method disclosed in the present specification is an image analysis method in a surface mounting machine that mounts a component on a substrate, and the surface mounting machine supports a component holding portion that holds the component so as to be able to move up and down. An image of the component provided on the head portion, a moving portion for moving the head portion in a direction parallel to the plate surface of the substrate, and the component held by the component holding portion. The image analysis method includes an image pickup unit that generates data and an analysis unit that is connected to the image pickup unit via a communication cable and analyzes the image data received from the image pickup unit. However, one of the vertical direction and the horizontal direction of the image represented by the image data is thinned out at a thinning rate larger than that of the other direction in one direction set according to the analysis content of the image data, or the one of the above. Includes a thinning step in which the image data is thinned out in the other direction but not in the other direction, and a transmission step in which the imaging unit transmits the image data after being thinned out in the thinning step to the analysis unit. ..

According to the above image analysis method, when the image data is thinned out to reduce the amount of data, the thinning ratio is made different in the vertical direction and the horizontal direction of the image according to the analysis content of the image data, so that the image is highly accurate. The amount of data can be reduced while enabling the analysis of.

The invention disclosed herein can be realized in various aspects such as a device, a method, a computer program for realizing the function of these devices or methods, a recording medium on which the computer program is recorded, and the like.

Top view of the surface mounter according to the first embodiment Perspective view of rotary head Perspective view of rotary head Side view of head moving part and rotary head Top view of rotary head Schematic diagram of rotary head and parts measurement camera Schematic diagram for explaining thinning out of image data Block diagram showing the electrical configuration of the surface mounter Block diagram showing the electrical configuration of the parts measurement camera Schematic diagram of the image sensor Schematic diagram for explaining thinning out of image data according to the second embodiment Schematic diagram for explaining thinning and stretching of image data according to the third embodiment.

<Embodiment 1>
The first embodiment will be described with reference to FIGS. 1 to 10. In the following description, the left-right direction shown in FIG. 1 is referred to as an X-axis direction, the front-back direction is referred to as a Y-axis direction, and the up-down direction shown in FIG. 4 is referred to as a Z-axis direction. Further, in the following description, the right side shown in FIG. 1 is referred to as an upstream side, and the left side is referred to as a downstream side. Further, in the following description, the reference numerals of the drawings may be omitted for the same constituent members except for a part.

(1) Overall Configuration of Surface Mounter The overall configuration of the surface mounter 1 according to the first embodiment will be described with reference to FIG. The surface mounter 1 is a device for mounting a component E such as an electronic component on a printed circuit board P (hereinafter, simply referred to as “board P”). The surface mounter 1 includes a base 10, a conveyor 11, a backup device (not shown), four tape component supply devices 13, a rotary head 14 (an example of a head unit), a head moving unit 15 (an example of a moving unit), and a component imaging camera. 16. The substrate imaging camera 17 and the like are provided. Although not shown in FIG. 1, the surface mounter 1 also includes a component measurement camera 71 (an example of an imaging unit) shown in FIG. 4, a control unit 80 shown in FIG. 8, an operation unit 90 shown in FIG. 8, and the like.

The base 10 has a rectangular shape in a plan view. The rectangular frame A shown by the alternate long and short dash line in FIG. 1 indicates a working position (hereinafter referred to as a working position A) when the component E is mounted on the substrate P.
The conveyor 11 carries the substrate P from the upstream side in the X-axis direction to the work position A, and carries out the substrate P on which the component E is mounted at the work position A to the downstream side. The conveyor 11 includes a pair of

conveyor belts

11A and 11B that circulate and drive in the X-axis direction, a conveyor drive motor 106 that drives those conveyor belts (see FIG. 8), and the like. The rear conveyor belt 11A can be moved in the front-rear direction, and the distance between the two

conveyor belts

11A and 11B can be adjusted according to the width of the substrate P.

A backup device (not shown) is arranged below the working position A. The backup device fixes the substrate P transported to the working position A at the working position A and supports the substrate P from below.
The tape component supply devices 13 are arranged at two locations along the X-axis direction on both sides of the conveyor 11 in the Y-axis direction, for a total of four locations. A plurality of feeders 20 are attached to these tape component supply devices 13 so as to be arranged side by side in the X-axis direction. Each feeder 20 is a so-called tape feeder, and includes a reel on which a component tape containing a plurality of components E is wound, an electric tape delivery device for pulling out the component tape from the reel, and the like. The parts E are supplied one by one from the parts supply position provided at the end on the side.

Here, the tape component supply device 13 will be described as an example of the component supply device, but the component supply device may be a so-called tray feeder that supplies a tray on which the component E is placed, or a device that supplies a semiconductor wafer. It may be.

The rotary head 14 includes a plurality of mounting heads 21 (an example of a component holding portion) arranged at equal intervals on the circumference. The mounting head 21 sucks (an example of holding) and releases the component E supplied by the tape component supply device 13. The mounting head 21 is supported so as to be able to move up and down in the vertical direction. Although not shown in FIG. 1, the rotary head 14 is also provided with a component measurement camera 71. The component measurement camera 71 is a camera for photographing the component E attracted by the mounting head 21 from the horizontal direction and measuring the thickness (width in the vertical direction) of the component E (an example of analysis). The configuration of the rotary head 14 and the component measurement camera 71 will be described later.
Here, the rotary head 14 will be described as an example of the head portion, but the head portion may be a so-called in-line type in which the mounting heads 21 are arranged in a row.

The head moving unit 15 moves the rotary head 14 in the X-axis direction and the Y-axis direction within a predetermined movable range. The head moving portion 15 includes a beam 22 that supports the rotary head 14 so as to be reciprocally movable in the X-axis direction, a pair of Y-axis guide rails 23 that support the beam 22 so that the rotary head 14 can be reciprocated in the Y-axis direction, and a rotary head 14. It is provided with an X-axis servo motor 101 that reciprocates the beam 22 in the X-axis direction, a Y-axis servo motor 102 that reciprocates the beam 22 in the Y-axis direction, and the like.

The two component imaging cameras 16 are provided between the two tape component supply devices 13 arranged in the X-axis direction, respectively. The component imaging camera 16 is for capturing an image of the component E attracted to the mounting head 21 from below to recognize the rotation angle of the component E with respect to the mounting head 21, the component shape, and the like.
The two substrate imaging cameras 17 are provided on the rotary head 14. The substrate imaging camera 17 is for recognizing the position and inclination of the substrate P by imaging a fiducial mark (not shown) attached to the substrate P.

(1-1) Rotary Head The rotary head 14 will be schematically described with reference to FIGS. 2 to 5.
As shown in FIG. 2, the rotary head 14 has an arm shape in which the head main body 52, which is the main body, is covered with the

covers

53 and 54. The rotary head 14 has a head body 52 supported by the beam 22, a substantially columnar shaft 55 rotatably supported by the head body 52 around a vertical line, and a pair fixed to the head body 52. The Z-axis drive device 60, the N-axis servomotor 104 that rotationally drives the shaft portion 55 around a vertical line (see FIG. 8), and the R-axis servomotor 105 that rotates the mounting head 21 around the axis of the mounting head 21 (see FIG. 8). ), A substrate imaging camera 17 (see FIG. 1), a component measurement camera 71 (see FIG. 4), and the like.

As shown in FIG. 3, a shaft holding portion 56 having a large diameter is provided at the lower end portion of the shaft portion 55. A plurality of through holes (18 in this embodiment) are formed in the shaft holding portion 56 at equal intervals in the circumferential direction, and the shaft-shaped mounting head 21 penetrates the shaft holding portion 56 in the Z-axis direction. It is held so that it can be raised and lowered so that it extends along the line. Each mounting head 21 includes a nozzle shaft 57 and a suction nozzle 58 detachably attached to the lower end of the nozzle shaft 57. A coil spring 59 is mounted on the nozzle shaft 57 so that the nozzle shaft 57 passes through the inside.

The Z-axis drive device 60 is a Z-axis linear motor 103 (see FIG. 8) that is housed in a device main body 60A, an elevating part 60B that is supported by the device main body 60A so as to be able to move up and down, and is housed in the device main body 60A to move the elevating part 60B up and down. ) Etc. are provided.
In addition to this, the rotary head 14 is provided with a mechanism for supplying negative pressure or positive pressure to the suction nozzle 58, but the description thereof will be omitted here.

A bending-resistant cable 110 (an example of a communication cable) connecting the rotary head 14 and the control unit 80 will be described with reference to FIG. FIG. 4 schematically shows the rotary head 14, and the substrate imaging camera 17 and the like are omitted. As shown in FIG. 4, one end of a bending resistant cable 110 (so-called flexible cable) is connected to the rotary head 14. The other end of the bending resistant cable 110 is connected to the beam 22. Although not shown, one end of a bending-resistant cable other than the bending-resistant cable 110 is connected to the beam 22. The other end of another bending-resistant cable is connected to a connector (not shown) provided on a non-movable portion such as a base 10. The control unit 80 supplies power to the rotary head 14 and communicates with the rotary head 14 via the bending-resistant cable 110 and another bending-resistant cable described above.

A case where the component E supplied by the tape component supply device 13 is sucked by the suction nozzle 58 will be described with reference to FIG. When the component E is sucked, the surface mounter 1 is the elevating part 60B of one of the two Z-axis drive devices 60 (for example, the Z-axis drive device 60 closer to the component supply position for supplying the component E to be sucked). The rotary head 14 is moved so as to be located above the component supply position, and the suction nozzle 58 for sucking the component E is located below the elevating portion 60B of the one Z-axis drive device 60. 14 is rotated.

Then, the surface mounter 1 drives the Z-axis drive device 60 to lower the elevating unit 60B. When the elevating part 60B is lowered, the mounting head 21 is pushed by the elevating part 60B and lowered, and the component E is sucked by the suction nozzle 58. When the component E is attracted to the surface mounter 1, the surface mounter 1 drives the Z-axis drive device 60 to raise the elevating portion 60B. When the elevating portion 60B rises, the mounting head 21 rises due to the urging force of the coil spring 59. Although the suction of the component E has been described here, the same applies when the suctioned component E is mounted on the substrate P.

(1-2) Light Source and Parts Measurement Camera The light source 70 and the parts measurement camera 71 will be described with reference to FIG. As shown in FIG. 6, a light source 70 that illuminates the component E held by the mounting head 21 from the horizontal direction is fixed to the lower surface of the shaft portion 55 of the rotary head 14. The light source 70 is formed in a columnar shape, and the outer peripheral surface emits light substantially uniformly. The component measurement camera 71 is fixed to the head main body 52.

The image 120 shown in FIG. 7 represents an image represented by the image data generated by the component measurement camera 71. When the component E is imaged by the component measurement camera 71, the light emitted from the light source 70 is blocked by the mounting head 21 and the component E. Therefore, the mounting head 21 and the component E appear as shadows in the image 120. In the image 120, the density of the pixel representing the shadow is close to 0 (black), and the density of the pixel to which the light from the light source 70 is incident is close to 255 (white).

(2) Electrical Configuration of Surface Mount Machine As shown in FIG. 8, the surface mount machine 1 includes a control unit 80 and an operation unit 90. The control unit 80 includes an arithmetic processing unit 81, a motor control unit 82, a storage unit 83, an image capture board 84, an external input / output unit 85, a feeder communication unit 86, and the like. The arithmetic processing unit 81 and the image capture board 84 are examples of the analysis unit.

The arithmetic processing unit 81 includes a CPU, a ROM, a RAM, and the like, and controls each unit of the surface mounter 1 by executing a control program stored in the ROM.
Under the control of the arithmetic processing unit 81, the motor control unit 82 includes an X-axis servomotor 101, a Y-axis servomotor 102, a Z-axis linear motor 103, an N-axis servomotor 104, an R-axis servomotor 105, a conveyor drive motor 106, and the like. Controls the start, stop and rotation speed of each motor.

The storage unit 83 is a rewritable storage device (hard disk, etc.) in which data is not erased even when the power is turned off. Various programs and data are stored in the storage unit 83. The various data includes the model of the board P scheduled to be produced, the data related to the various parts E (shape data of the part E, etc.), the order in which each model is produced, and the data for each model (number of production sheets, board P). The shape, the component E to be mounted, the mounting order of the component E, the mounting coordinates of the component E, the mounting angle, and the like are included.

The image capture board 84 receives the image data transmitted from the component imaging camera 16, the substrate imaging camera 17, and the component measurement camera 71, and stores the received image data in the RAM of the arithmetic processing unit 81.
The external input / output unit 85 is a so-called interface, and is configured to capture detection signals output from various sensors 88 provided in the main body of the surface mounter 1. Further, the external input / output unit 85 is configured to perform operation control for various actuators 89 (including an air supply device and a backup device (not shown)) based on a control signal output from the arithmetic processing unit 81.

The feeder communication unit 86 is connected to the feeder 20 and controls the feeder 20 in an integrated manner.
The operation unit 90 includes a display unit such as a liquid crystal display and an input unit such as a touch panel. The operator can operate the operation unit 90 to perform various settings and operation instructions for the surface mounter 1.

(3) Electrical Configuration of Parts Measurement Camera As shown in FIG. 9, the parts measurement camera 71 includes an image sensor 71A, an FPGA 71B (Field Programmable Gate Array), and a communication unit 71C. An ASIC (Application Specific Integrated Circuit) may be provided instead of the FPGA 71B.

The image sensor 71A includes an area sensor 91 in which light receiving elements are two-dimensionally arranged and an A / D converter 92. Each light receiving element applies a voltage corresponding to the accumulated charge to the A / D converter 92. The A / D converter 92 converts the voltage applied from each light receiving element into digital data of 0 (black) to 255 (white) and outputs the voltage to the FPGA 71B.

The FPGA 71B is a circuit that controls the image sensor 71A under the control of the control unit 80. The FPGA 71B transmits the digital image data output from the image sensor 71A to the control unit 80 via the communication unit 71C. As will be described in detail later, the FPGA 71B does not transmit the output image data as it is, but decimates it in the horizontal direction by 1/2 and transmits it.
The communication unit 71C is a circuit for the FPGA 71B to communicate with the control unit 80. The communication unit 71C is connected to the image capture board 84 via a bending-resistant cable 110 and another bending-resistant cable described above.

(4) Part Thickness Measurement The thickness measurement of the part E will be described with reference to FIG. 7. The component measurement camera 71 captures the component E attracted to the mounting head 21 from the horizontal direction to generate image data, thins out the generated image data, and transmits the image data to the image capture board 84.
When measuring the thickness of the component E, the effect on the thickness measurement accuracy (an example of analysis accuracy) is small in the horizontal direction of the image 120 represented by the image data even if the thinning rate is increased as compared with the vertical direction. Therefore, in order to reduce the amount of data while enabling highly accurate image analysis (thickness measurement) on the component measurement camera 71 (more specifically, FPGA 71B), the vertical direction of the image represented by the image data and the vertical direction of the image are represented. As one of the horizontal directions set according to the analysis content of the image data, the horizontal direction, which has a small influence on the measurement accuracy of the thickness, is set. When thinning out image data, the component measurement camera 71 thins out in the horizontal direction, which is the set direction, but does not thin out in the vertical direction.

Specifically, for example, in the image 120 represented by the image data, when the pixels arranged in a row in the horizontal direction are defined as rows and the pixels arranged in a row in the vertical direction are defined as columns, the component measurement camera 71 defines the image 120 in the horizontal direction. Thin out every other row. As a result, the image 120 is thinned out in the lateral direction (an example of one direction) by 1/2 (an example of a thinning rate) as in the image 121. On the other hand, the component measurement camera 71 does not thin out the image 120 in the vertical direction (an example of the other direction). In other words, the thinning rate in the vertical direction is 0 (zero). Therefore, all the lines of the image 120 are transmitted. However, each line is thinned out by 1/2.

The transmission of image data will be described more specifically with reference to FIG. When the exposure of the image sensor 71A is completed, the voltage corresponding to the electric charge stored in each light receiving element 122 is sequentially converted into digital data by the A / D converter 92 for each light receiving element 122. Specifically, for example, as shown in FIG. 10, the conversion is performed in the order from the upper row to the lower row of the area sensor 91. In each line, the light receiving element 122 on the left is converted in the order of the light receiving element 122 on the right. When the image data for one line is output from the A / D converter 92, the FPGA 71B outputs one digital data (data corresponding to one light receiving element 122) constituting the output image data for one line. It is transmitted to the image capture board 84 every other time. As a result, one line of image data is thinned out in the horizontal direction by 1/2 and transmitted.

Here, the case where the image 120 is thinned out every other row (that is, the case where the image 120 is thinned out to 1/2 in the horizontal direction) has been described as an example, but the number of rows to be thinned out can be appropriately determined. For example, one of the three columns may be thinned out, or two of the three columns may be thinned out.

The image capture board 84 stores the thinned-out image data received from the component measurement camera 71 in the RAM of the arithmetic processing unit 81. The arithmetic processing unit 81 analyzes the image data stored in the RAM. Specifically, the arithmetic processing unit 81 has the uppermost pixel representing the component E in the image 121 represented by the image data as the upper end of the component E and the lowermost pixel as the lower end of the component E from the upper end. The thickness of the component E is measured by converting the number of pixels to the lower end into the thickness [mm].

The measured thickness is used, for example, for determining the quality of the component E, determining the amount of lowering when the mounting head 21 is lowered and the component E is mounted on the substrate P, and the like. It is possible to appropriately determine what kind of control the measured thickness is used for.

(5) Effect of the Embodiment According to the surface mounting machine 1 according to the first embodiment, depending on the analysis content (measurement of the thickness of the component E) of the image data in either the vertical direction or the horizontal direction of the image represented by the image data. While thinning out in one set direction (horizontal direction), it does not thin out in the other direction (vertical direction). Specifically, in the first embodiment, the thinning rate in the horizontal direction is 1/2, and the thinning rate in the vertical direction is 0. Therefore, it is possible to reduce the amount of data by thinning out the image data in the horizontal direction while suppressing a decrease in the thickness measurement accuracy by not thinning out the image data in the vertical direction. As described above, according to the surface mounting machine 1, when the image data is thinned out to reduce the amount of data, the thinning ratio is made different in the vertical direction and the horizontal direction of the image according to the analysis content of the image data. The amount of data can be reduced while enabling accurate image analysis.
When measuring the thickness of the component E, the influence on the analysis accuracy is small in the horizontal direction even if the thinning rate is increased as compared with the vertical direction. Therefore, "one of the vertical direction and the horizontal direction set according to the analysis content of the image data" is "the direction in which the influence on the analysis accuracy is relatively small in the vertical direction and the horizontal direction". Can be paraphrased.

According to the surface mounter 1, since the gradation is thinned out without being compressed, it is possible to suppress the loss of necessary information for the data remaining without being thinned out. Therefore, it is possible to perform highly accurate analysis as compared with the case of compressing the gradation.

According to the surface mounter 1, the component measurement camera 71 is provided on the rotary head 14, and the component E held by the mount head 21 is imaged from the horizontal direction. Therefore, when measuring the thickness of the component E, the amount of data can be reduced while enabling highly accurate image analysis.

<Embodiment 2>
The second embodiment will be described with reference to FIG. In the first embodiment described above, a case where the thickness of the component E is measured from the image 120 represented by the image data has been described as an example. On the other hand, in the second embodiment, the width of the component E in the lateral direction is measured.

As shown in FIG. 11, the component measurement camera 71 according to the second embodiment transmits images 120 by thinning them out in the vertical direction. Specifically, the FPGA 71B of the component measurement camera 71 transmits image data every other line. As a result, the image data is thinned out in the vertical direction by 1/2 and transmitted. Image 131 shows an image after being thinned out in the vertical direction.

According to the surface mounting machine 1 according to the second embodiment, one of the vertical direction and the horizontal direction of the image 120 represented by the image data is set according to the analysis content (measurement of the width of the component E) of the image data. While thinning out in the direction (vertical direction), it is not thinned out in the other direction (horizontal direction). Specifically, in the second embodiment, the thinning rate in the vertical direction is 1/2, and the thinning rate in the horizontal direction is 0. Therefore, it is possible to reduce the amount of data by thinning out the image data in the vertical direction while suppressing a decrease in the measurement accuracy of the width by not thinning out the image data in the horizontal direction. Therefore, when the image data is thinned out to reduce the amount of data, the amount of data can be reduced while enabling highly accurate image analysis.

According to the surface mounter 1, the component measurement camera 71 is provided on the rotary head 14, and the component E held by the mount head 21 is imaged from the horizontal direction. Therefore, when measuring the width of the component E, the amount of data can be reduced while enabling highly accurate image analysis.

<Embodiment 3>
The third embodiment will be described with reference to FIG.
The third embodiment is a modification of the first embodiment or the second embodiment. Here, a modified example of the first embodiment will be described. The arithmetic processing unit 81 according to the third embodiment measures not only the thickness of the component E but also the width of the component E from the image thinned out in the horizontal direction but not in the vertical direction.

The image capture board 84 according to the third embodiment stretches the received image data in the thinned direction to generate image data of the original size (an example of the stretching process), and the generated image data is generated by the arithmetic processing unit 81. Store in RAM.
Specifically, for example, as shown in FIG. 12, when the image 120 is thinned out in the horizontal direction by 1/2, the image capture board 84 is on the right side (or left side) of each row of the thinned out images 121. Copy that column to. For example, when the even-numbered columns of the original image 120 are thinned out, the data of the odd-numbered columns such as the first column, the third column, and the fifth column of the original image 120 remains in the image 121 after the thinning out. .. In this case, the image capture board 84 copies the first row between the first and third rows to make it the second row, and copies the third row between the third and fifth rows. The fourth row. As a result, image data of the original size is generated. Image 140 shows the original size image that was generated. However, since the odd-numbered columns are only copied, the original image data (image data before thinning out) is not completely restored.

Since the amount of data increases when the image data is stretched, the time for transferring the data from the image capture board 84 to the RAM becomes long. However, since the image acquisition board 84 and the RAM are usually connected by a high-speed bus having a wider transfer band than the bending-resistant cable 110, even if the transfer time is long, the processing time is not significantly affected.

According to the surface mounter 1 according to the third embodiment, the image capture board 84 stretches the image represented by the image data received from the component measurement camera 71 in the horizontal direction, and therefore measures the width by stretching the image to the number of pixels before thinning. The amount of calculation for this can be reduced. As a result, the width of the component E can be measured at high speed.
The image received from the component measurement camera 71 may be displayed on the display unit of the operation unit 90 for reasons such as investigating the cause when a problem occurs. When the thinned image is stretched, a natural image (or an image close to the natural image) can be displayed, so that there is an advantage that the convenience of the operator who views the image is improved.

Here, the case of expanding to the number of pixels before thinning is described as an example, but the number of pixels to be expanded can be appropriately determined.

<Other embodiments>
The techniques disclosed herein are not limited to the embodiments described above and in the drawings, and for example, the following embodiments are also included in the technical scope disclosed herein.

(1) In the first embodiment, the thickness (width in the vertical direction) of the part E is measured, and the vertical direction of the image is not thinned out. On the other hand, thinning may be performed in the vertical direction as long as the required measurement accuracy is satisfied and with a thinning rate smaller than that in the horizontal direction. The same applies when measuring the width.

(2) In the above embodiment, the case where the gradation of the image data is thinned out and transmitted without being compressed has been described as an example, but the gradation may be compressed by binarization or the like and then thinned out.

(3) In the third embodiment, the case where the image is stretched by copying each column of the thinned-out image to the right side of the column is described as an example, but the stretching method can be appropriately determined. For example, the data in the first column and the data in the third column may be expanded by interpolating the data in the second column by interpolation processing.

(4) In the above embodiment, the case where the image data is thinned out and transmitted from the component measurement camera 71 to the control unit 80 has been described as an example, but it is possible to switch between the case where the image data is thinned out and the case where the image data is transmitted without thinning out. You may.

(5) In the above embodiment, the case where the component measurement camera 71 images the component E attracted by the mounting head 21 from the horizontal direction has been described as an example, but the imaging direction is not limited to the horizontal direction. For example, the component measurement camera 71 may image the component E from an obliquely upward direction or an obliquely downward direction.

(6) In the above embodiment, the mounting head 21 that attracts and holds the component E as the component holding portion has been described as an example, but the component holding portion is held by so-called chucking that sandwiches and holds the component E. May be good.

1 ... Surface mounter 14 ... Rotary head (example of head part)
15 ... Head moving part (an example of moving part)
21 ... Mounting head (an example of component holding unit)
71 ... Parts measurement camera (example of imaging unit)
81 ... Arithmetic processing unit (an example of analysis unit)
84 ... Image capture board (example of analysis unit)
110 ... Bending resistant cable (an example of communication cable)
E ... Parts P ... Printed circuit board (an example of a board)

Claims

A surface mounter that mounts components on a board
A head portion that supports the component holding portion that holds the component so as to be able to move up and down,
A moving portion that moves the head portion in a direction parallel to the plate surface of the substrate, and a moving portion.
An imaging unit provided on the head unit, which captures the component held by the component holding unit to generate image data, thins out the generated image data, and transmits the image data.
An analysis unit that is connected to the image pickup unit via a communication cable and analyzes the image data after thinning out received from the image pickup unit.
With
The imaging unit thins out one of the vertical direction and the horizontal direction of the image represented by the image data in one direction set according to the analysis content of the image data with a thinning rate larger than that of the other direction. , A surface mounter that thins out in one direction, but does not thin out in the other direction.
The surface mounter according to claim 1.
The imaging unit is a surface mounter that images the component held by the component holding unit from a horizontal direction.
The surface mounter according to claim 2.
The analysis of the image data is the measurement of the thickness of the part.
A surface mounter in which one direction is the lateral direction.
The surface mounter according to claim 2.
The analysis of the image data is the measurement of the width of the component.
A surface mounter in which one direction is the vertical direction.
The surface mounter according to any one of claims 1 to 4.
The analysis unit is a surface mounting machine that executes a stretching process for stretching an image represented by image data received from the imaging unit and analyzes the stretched image.
This is an image analysis method for surface mounters that mount components on a board.
The surface mounter is
A head portion that supports the component holding portion that holds the component so as to be able to move up and down,
A moving portion that moves the head portion in a direction parallel to the plate surface of the substrate, and a moving portion.
An imaging unit provided on the head unit and holding an image of the component held by the component holding unit to generate image data.
An analysis unit that is connected to the image pickup unit via a communication cable and analyzes the image data received from the image pickup unit.
With
The image analysis method is
The imaging unit thins out one of the vertical and horizontal directions of the image represented by the image data according to the analysis content of the image data with a thinning rate larger than that of the other direction. , A thinning step in which one direction is thinned out, while the other direction is not thinned out.
A transmission step in which the imaging unit transmits the image data after being thinned out in the thinning step to the analysis unit.
Image analysis methods, including.