JP3186387B2 - Electronic component mounting apparatus and electronic component mounting method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus and an electronic component mounting apparatus for picking up an electronic component provided in a parts feeder by a transfer head and transferring the electronic component to a substrate.
It is about the method .

[0002]

2. Description of the Related Art An electronic component mounting apparatus that mounts electronic components on a substrate is a device that mounts electronic components provided in a part feeder such as a tape feeder, a tube feeder, or a tray feeder by vacuum suction to a nozzle of a transfer head and picks up the electronic components. The substrate is transferred and mounted on the substrate positioned by the positioning unit. Prior to mounting the electronic component vacuum-adsorbed on the nozzle on the substrate, the position of the electronic component is detected, and if the electronic component is misaligned, the electronic component should be corrected and then mounted on the substrate. It has become.

As means for detecting the position of an electronic component,
For example, as described in Japanese Patent Application Laid-Open No. 4-359599, an optical system such as a camera and a mirror is assembled integrally with a transfer head, and an electronic component vacuum-adsorbed to a nozzle is moved while the transfer head is moving. A method of observing with this optical system is known.

An electronic component mounted on a substrate has a side of 1 m.
m or less to 50 mm or more on one side. Therefore, in the above-described conventional technology, a plurality of cameras having different magnifications are integrally assembled to a transfer head to reduce the size of electronic components. Optical systems such as mirrors were switched accordingly, and images of electronic components were captured by each camera.

[0005]

However, when a plurality of cameras and optical systems are integrally assembled to the transfer head,
There has been a problem that the weight of the transfer head is increased, the moving speed of the transfer head cannot be increased, the mounting speed cannot be increased, and the cost increases. In addition, since large-sized electronic components are observed with a low-magnification camera, the position detection accuracy is low, and the position accuracy of the electronic components mounted on the substrate is not improved.

Accordingly, the present invention solves the above-mentioned problems of the conventional means, and has an electronic component mounting apparatus and a simple structure which can mount electronic components of various sizes, large and small, on a substrate with high speed and high accuracy.
It is an object to provide an electronic component mounting method .

[0007]

According to the present invention, an electronic component provided in a positioning portion of a substrate and a parts feeder is vacuum-adsorbed to a lower end portion of a nozzle and picked up and positioned in the positioning portion. An electronic component mounting apparatus including a transfer head that transfers and mounts the substrate, and a transfer table that moves the transfer head between the parts feeder and the substrate, wherein the transfer head includes an image capturing unit ,
A moving means for moving the image capturing section in the horizontal direction below the electronic component vacuum-adsorbed to the nozzle is integrally assembled, and an image of the electronic component is obtained by the line sensor section. Further, according to the present invention, the transfer head is moved horizontally from the moving table, and the electronic component provided in the parts feeder is vacuum-adsorbed and picked up at the lower end of the nozzle of the transfer head, and the substrate is positioned on the positioning unit. In the electronic component mounting method adapted to be transferred and mounted, the transfer head picks up the electronic component provided in the parts feeder by vacuum-sucking the lower end of a nozzle of the transfer head, and positions the substrate positioned by the positioning unit. During transfer to the transfer head,
The image capturing section is moved below the electronic component by moving means to obtain an image of the electronic component.

[0008]

According to the above construction, the moving means is driven to move the line sensor section horizontally below the electronic component at a high speed while the electronic component is being vacuum-adsorbed to the nozzle of the transfer head and transferred to the substrate. Thus, an image of the electronic component can be obtained, and the position of the electronic component can be accurately determined based on the image.

[0009]

Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is an overall perspective view of an electronic component mounting apparatus according to a first embodiment of the present invention. Reference numeral 1 denotes a base, on which a cover box 2 is provided. Two guide rails 4 of the substrate 3 are provided at the center of the upper surface of the base 1. Each of the two guide rails 4 has a belt conveyor 5, and the substrate 3 is transported by the belt conveyor 5. Reference numeral 6 denotes a driving motor for driving the belt conveyor 5. The guide rail 4 serves as a positioning portion of the substrate 3 for clamping and positioning the substrate 3 from the left and right.

A table 7 is provided on both sides of the guide rail 4, and a parts feeder 8 is arranged on the table 7. Above the base 1, an X table 9 and a Y table 10 are provided orthogonal to each other. A transfer head 11 is mounted on the lower surface of the Y table 10. Driving motor 12 for X table 9 and Y table 10
When the drive motor 13 is driven, the transfer head 11
It moves horizontally in the direction and the Y direction.

Next, the structure of the transfer head 11 will be described with reference to FIGS. In FIG. 2, reference numeral 14 denotes a case, and a support plate 15 having an L-shaped section
Is attached. A bracket 16 having an L-shaped cross section is provided on the front surface of the support plate 15. A slider 17 is mounted on the back of the bracket 16 via a block 19. The slider 17 is mounted on the support plate 1.
5 is slidably fitted on a guide rail 18 in the Z direction provided on the front surface of the fifth guide 5.

A head section 30 is provided on the front surface of the bracket 16. The head portion 30 mainly includes a main body 31 mounted on the front surface of the bracket 16, and a nozzle shaft 32 penetrates the center of the main body 31 so as to be vertically movable. A nozzle 33 for vacuum-sucking the electronic component P is connected to a lower end of the nozzle shaft 32.

At the lower part of the main body 31, a back shadow plate 34 is mounted. The back plate 34 has a built-in light source. The back plate 34 is for clearly recognizing the silhouette of the electronic component P vacuum-adsorbed to the nozzle 33.
In addition to the light source built-in type such as 4, a light scattering plate such as a white acrylic resin plate can also be used. A large gear 35 is provided on the upper part of the main body 31. The large gear 35 is engaged with a small gear 37 driven by a motor 36 on the frame 20 provided on the front upper portion of the bracket 16. Therefore, when the motor 36 is driven, the large gear 35 rotates. Then, the nozzle shaft 32 rotates about its axis, and adjusts the direction of rotation of the electronic component P vacuum-adsorbed to the lower end of the nozzle 33.

In FIG. 2, two rollers 38 are mounted on the upper end of the nozzle shaft 32. A coil spring 39 is mounted on the nozzle shaft 32. The coil spring 39 urges the nozzle shaft 32 upward. The bearing 4 is provided on the upper part of the bracket 16.
0 is provided. A lever 41 is pivotally supported on the bearing 40 so as to be vertically swingable. The tip of the lever 41 is engaged between the rollers 38. A cam follower 42 is mounted on the rear end of the lever 41. The cam follower 42 is in contact with a cam 44 driven by a motor 43 and rotated. Therefore, motor 4
When the cam 3 is driven to rotate the cam 44, the lever 41 swings and the nozzle shaft 32 moves up and down. That is, the lever 41, the cam follower 42, the motor 43, and the cam 44 constitute first vertical moving means for vertically moving the nozzle shaft 32 and the nozzle 33.

In FIG. 2, a motor 21 is mounted above the support plate 15. The rotation of the motor 21 is transmitted to a timing pulley 24 via a timing pulley 22 and a timing belt 23. In FIG. 3, a vertical ball screw 25 is connected to the timing pulley 24. The ball screw 25 is provided with a nut 26 fixed to the tip of a rod 27 mounted on the back of the bracket 16.
Is screwed into. Therefore, when the motor 21 is driven, the ball screw 25 rotates, the nut 26 moves up and down along the ball screw 25, and the bracket 16 also moves up and down. When the bracket 16 moves up and down, the head unit 30 also moves up and down.
That is, the motor 21, the ball screw 25, the nut 26, and the like constitute second vertical movement means for vertically moving the nozzle shaft 32 and the nozzle 33. The second up-and-down moving means includes the electronic component P vacuum-adsorbed to the lower end of the nozzle 33 and the line sensor unit 5 in accordance with the type of the electronic component such as the thickness.
Fine adjustment of the distance of 0 , thereby providing a clear picture of the electronic component P.
This is a fine adjustment means for obtaining an image .

In FIG. 2, reference numeral 50 denotes a line sensor unit integrally mounted on the transfer head 11, and FIG.
The detailed structure will be described with reference to FIG.
Reference numeral 51 denotes a long box-shaped case, in which a line sensor 52 composed of a CCD is housed. An arm 53 supports the line sensor 52. A slit 54 for leaking light to the line sensor 52 is provided on the upper surface of the case 51.
Is open. When a light scattering plate is used instead of the back shadow plate 34, a linear light source for irradiating the light scattering plate with light is provided on the upper surface of the case 51.

A case 5 is provided at the lower rear portion of the support plate 15.
5 is attached. A horizontal ball screw 56 is housed inside the case 55. A nut 57 is screwed into the ball screw 56, and the arm 53 is connected to the nut 57 via a bracket 58. 59 is a motor for rotating the ball screw 56, and 60 is a position detector having a built-in linear encoder for detecting the moving position of the line sensor 52. Therefore, when the motor 59 is driven, the nut 57 moves along the ball screw 56, and the line sensor unit 50 moves in the horizontal direction. The line sensor unit 50 moves below the electronic component P vacuum-adsorbed to the nozzle 33 and captures a bottom image of the electronic component P. Although the silhouette of the electronic component P is observed in the present embodiment,
The lower surface of the electronic component P vacuum-adsorbed to the nozzle 33 may be irradiated with light, and the image of the electronic component P may be observed by the line sensor 52.

FIG. 5 is a block diagram of a control circuit of the electronic component mounting apparatus according to the first embodiment of the present invention. Motor 59
And the position detector 60 are connected to a drive circuit 61, and the drive circuit 61 is connected to a CPU 63 via a bus 62. The drive circuit 61 controls the moving speed and the moving stroke of the line sensor unit 50 while receiving the signal of the position detector 60.

The line sensor 52 is connected to a CPU 63 via an analog / digital converter 64, an image memory 65, a recognition circuit 66, and a bus 62. Line sensor 52
Is converted into a digital signal by the analog-to-digital converter 64 and is input to the image memory 65 at a constant period. Image data such as binary data or multivalued data is input to the image memory 65. Recognition circuit 66
Recognizes the position of the electronic component P and the bending of the lead of the electronic component P based on the data in the image memory 65. Also C
The PU 63 controls the entire electronic component mounting apparatus.

This electronic component mounting apparatus has the above-described configuration. Next, an electronic component mounting method will be described. In FIG. 1, when the X table 9 and the Y table 10 are driven, the transfer head 11 moves above a predetermined parts feeder 8, and the nozzle shaft 32 moves up and down. The electronic components P of a predetermined type provided in the apparatus 8 are picked up by vacuum suction. Next, the transfer head 11 moves above the substrate 3. During this movement, the electronic components P are
Recognize

FIG. 6A is a front view of an essential part of the small-sized electronic component P1 during image capture, and FIG. 6B shows an image of the electronic component captured by the line sensor unit 50.
While the transfer head 11 is moving, the motor 59 (see FIGS. 2 and 4) is driven, so that the line sensor unit 50 moves horizontally below the electronic component P1 and irradiates the electronic component P1 with light. Thereby, the image of the electronic component P1 shown in FIG. S1 is a movement stroke of the line sensor unit 50.

FIG. 7A is a front view of a main part of a large-sized electronic component P2 during image capture, and FIG. 7B shows an image of the electronic component captured by the line sensor unit 50.
The moving stroke in this case is S2, which is longer than the moving stroke S1. By setting the minimum necessary moving stroke in accordance with the size of the electronic component in this way, the time required to capture the image data can be reduced as much as possible. The movement stroke is changed by adjusting the rotation amount of the motor 59 by the drive circuit 61 (see FIG. 5). Further, the line sensor unit 50 is lightweight, and thus can capture an image while moving the line sensor unit 50 at a high speed by the motor 59 having a small capacity. The motor 21, the ball screw 25, and the nut 26 as the second vertical movement means (FIG. 2, FIG.
3), the height of the lower end of the nozzle 33 is finely adjusted so that the distances H1 and H2 between the electronic components P1 and P2 and the line sensor unit 50 become clear image capture distances.

The image data captured by the line sensor unit 50 is input to an image memory 65 (see FIG. 5), and the recognition circuit 66 performs an inspection for the presence or absence of the electronic component P, a positional shift in the XYθ direction, and the like. After correcting the displacement of the electronic component P based on the inspection result, the electronic component P is mounted on the substrate 3 at a predetermined coordinate position. In this case, by controlling the amount of rotation of the motor 21 according to the thickness of the electronic component P, the electronic component P is properly landed on the upper surface of the substrate 3 and mounted. When the image of the electronic component P is captured by the line sensor unit 50, the motor 59 (FIG. 2) rotates in the reverse direction, so that the line sensor unit 50 returns to the original position, and the image of the next electronic component P is captured. To wait for.

Next, another example of a method of capturing an image of the electronic component P by the line sensor unit 50 will be described. 8, V1 and V2 are the moving speeds of the line sensor unit 50. This moving speed is determined by the rotation speed of the motor 59. 9A is an image of the electronic component P captured by the line sensor unit 50 while moving at the low speed V1, and FIG. 9B is a diagram of the electronic component P captured by the line sensor unit 50 while moving at the high speed V2. It is an image. As shown in FIGS. 9A and 9B, the image captured at the low speed V1 is clear, and its position can be detected with high accuracy. However, the image captured at the high speed V2 is unclear, and Detection accuracy is low. Therefore, a clear image is obtained at a low speed V1 for an electronic component having a high required mounting accuracy, and an unclear image is obtained at a high speed V2 for an electronic component having a low required mounting accuracy. Avoids spending more time than necessary, and shortens the time required for image capture.

FIG. 10 shows still another example of the image capturing method. This electronic component P has leads L. Since the electronic component P is mounted with the tip of the lead L landing on the electrode on the upper surface of the substrate 3, the position of the lead L is detected. In addition, such electronic components with leads generally require high mounting accuracy. Therefore, as shown in the figure, the area where the lead L exists moves at a low speed V1 to obtain a clear image, and the other areas move at a high speed V2 to reduce the time required for image capture. .

FIG. 11 shows another embodiment of the transfer head. In the transfer head 71, two head units 30 are housed inside a case 74. This device improves the mounting efficiency by using two head units 30 as in the above-mentioned Japanese Patent Application Laid-Open No. 4-359599. The basic structure is the same as that of the first embodiment, and the description is omitted by attaching the same reference numerals to the main components. Each of the line sensor units 50 moves below the electronic component vacuum-adsorbed to the underline of the nozzle 33 of the head unit 30.
And capture the image. As shown in FIG.
0 is provided side by side in the moving direction of the line sensor unit 50.
The line sensor unit 50 is connected to these head units 30.
Obtain the images of the electronic components P vacuum-adsorbed to the chisel 33 in order
I do. Therefore, the two head sections 30 are connected to one line section.
Sensor unit 50 is shared, and line sensor unit 50
Images of two electronic components P are continuously batched by
Can be obtained.

FIG. 12 shows still another embodiment of the transfer head. The transfer head 81 also has two head sections 30 housed inside a case 84. These heads
The section 30 is a section orthogonal to the moving direction of the line sensor section 50.
It is provided side by side. Therefore, the moving direction of the line sensor unit 50 is below the nozzles 33 of the two head units 30.
This is a direction that simultaneously crosses below the electronic components P vacuum-adsorbed to the ends. By setting the moving direction in this way, images of these electronic components P can be obtained simultaneously and collectively.
As a result, the movement stroke S of the line sensor unit 50 can be shortened, and the time required for image capture can be shortened.

[0028]

As described above, according to the present invention, during the transfer of the electronic component to the substrate by vacuum suction of the nozzle of the transfer head, the moving means is driven to drive the image capturing section . By moving horizontally below the electronic component at high speed, an image of the electronic component can be obtained, and based on this image,
The position of the electronic component can be determined accurately. Also the image
The take-in part is lightweight, so it can move at high speed,
In addition, by adjusting the moving stroke of the image capturing unit according to the size of the electronic component or controlling the moving speed of the image capturing unit according to the required mounting accuracy of the electronic component, the time required for image capturing is minimized. Therefore, the mounting speed of electronic components can be increased. In addition, the transfer head has multiple heads to capture images
By parts are to move under the electronic component vacuum suction nozzle of the head portion, since a plurality of images of the electronic component in one movement operation available collectively, per one electronic component The image capture time can be significantly reduced, and electronic components can be mounted faster. And one image capture
Since the head portion can be shared by a plurality of head portions, the structure can be simplified and the manufacturing cost can be reduced. In this case, by arranging a plurality of head units in a direction orthogonal to the moving direction of the image capturing unit , images of a plurality of electronic components can be collectively obtained with a shorter moving stroke, so that further mounting of electronic components is possible. Higher speed can be realized.

[Brief description of the drawings]

FIG. 1 is an overall perspective view of an electronic component mounting apparatus according to a first embodiment of the present invention.

FIG. 2 is a perspective view of a transfer head of the electronic component mounting apparatus according to the first embodiment of the present invention.

FIG. 3 is a cross-sectional view of a transfer head of the electronic component mounting apparatus according to the first embodiment of the present invention.

FIG. 4 is a perspective view of a line sensor section of the electronic component mounting apparatus according to the first embodiment of the present invention.

FIG. 5 is a block diagram of a control circuit of the electronic component mounting apparatus according to the first embodiment of the present invention.

FIG. 6A is a front view of a main part of the electronic component mounting apparatus according to the first embodiment of the present invention during image capture; FIG. 6B is a view illustrating a line sensor of the electronic component mounting apparatus according to the first embodiment of the present invention; Image of captured electronic components

FIG. 7A is a front view of a main part of the electronic component mounting apparatus according to the first embodiment of the present invention during image capturing; FIG. 7B is a view illustrating a line sensor of the electronic component mounting apparatus according to the first embodiment of the present invention; Image of captured electronic components

FIG. 8 is a front view of a main part of the electronic component mounting apparatus according to the first embodiment of the present invention during image capture;

FIG. 9A is an image view of an electronic component captured by a line sensor unit of the electronic component mounting apparatus according to the first embodiment of the present invention; FIG. 9B is a view of the electronic component mounting apparatus according to the first embodiment of the present invention; Image of electronic components captured by line sensor

FIG. 10 is an image diagram of an electronic component taken into a line sensor unit of the electronic component mounting apparatus according to the first embodiment of the present invention.

FIG. 11 is a perspective view of a transfer head of an electronic component mounting apparatus according to another embodiment of the present invention.

FIG. 12 is a perspective view of a transfer head of an electronic component mounting apparatus according to another embodiment of the present invention.

[Explanation of symbols]

 3 board 4 guide rail (board positioning section) 9 X table (moving table) 10 Y table (moving table) 11 transfer head 33 nozzle 50 line sensor section 56 ball screw (moving means) 57 nut (moving means) 59 motor (Moving Means) 71 Transfer Head 81 Transfer Head

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H05K 3/30 H05K 13/00-13/08

Claims (6)

(57) [Claims] 1. A positioning head for a substrate, a transfer head for picking up and picking up an electronic component provided in a parts feeder at a lower end portion of a nozzle, and transferring and mounting the electronic component on the substrate positioned at the positioning portion; an electronic component mounting apparatus that includes a the transfer head moving table for moving between the substrate and the parts feeder, the transfer head, and an image capture unit, the image removal write
A moving means for moving a lower portion of the electronic component in a horizontal direction below the electronic component vacuum-adsorbed to the nozzle, and integrally obtaining the image of the electronic component by the image capturing portion. Component mounting equipment. 2. The image forming apparatus according to claim 1, wherein the transfer head has a plurality of heads arranged in a moving direction of the image capturing unit .
2. The image capturing unit according to claim 1, wherein the image capturing unit is moved below the electronic components vacuum-adsorbed to the nozzles of the head unit to collectively obtain images of the electronic components in order. Electronic component mounting equipment. 3. The transfer head has a plurality of heads arranged in a direction perpendicular to the direction of movement of the image capturing unit , and the image capturing unit is connected to the nozzles of these heads by a vacuum. 2. The electronic component mounting apparatus according to claim 1, wherein the electronic component mounting device is moved below the sucked electronic component to collectively obtain images of the electronic components. 4. A transfer head is horizontally moved from a moving table, and an electronic component provided in a parts feeder is vacuum-adsorbed and picked up at a lower end portion of a nozzle of the transfer head, and is picked up on a substrate positioned by a positioning portion. In the electronic component mounting method adapted to be transferred and mounted, the transfer head picks up the electronic component provided in the parts feeder by vacuum-sucking the lower end of a nozzle of the transfer head, and positions the substrate positioned by the positioning unit. Wherein the image capturing unit integrated with the transfer head is moved below the electronic component by moving means to obtain an image of the electronic component. Implementation method. 5. The image forming apparatus according to claim 1, wherein the transfer head has a plurality of head units arranged in a moving direction of the image capturing unit .
The image capturing section is moved below the electronic components vacuum-adsorbed to the lower ends of the nozzles of these heads, so that the images of these electronic components are obtained collectively in order. Item 5. The electronic component mounting method according to Item 4. 6. The transfer head has a plurality of heads arranged in a direction perpendicular to the moving direction of the image capturing unit , and the image capturing unit is connected to lower ends of nozzles of these heads. 5. The electronic component mounting method according to claim 4, wherein the electronic component is vacuum-adsorbed to the unit and moved below to collectively obtain images of the electronic components.