JPWO2021166220A1 - - Google Patents

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Publication number
JPWO2021166220A1
JPWO2021166220A1 JP2022501553A JP2022501553A JPWO2021166220A1 JP WO2021166220 A1 JPWO2021166220 A1 JP WO2021166220A1 JP 2022501553 A JP2022501553 A JP 2022501553A JP 2022501553 A JP2022501553 A JP 2022501553A JP WO2021166220 A1 JPWO2021166220 A1 JP WO2021166220A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022501553A
Other languages
Japanese (ja)
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JP7290790B2 (en
JPWO2021166220A5 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of JPWO2021166220A1 publication Critical patent/JPWO2021166220A1/ja
Publication of JPWO2021166220A5 publication Critical patent/JPWO2021166220A5/ja
Application granted granted Critical
Publication of JP7290790B2 publication Critical patent/JP7290790B2/en
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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
JP2022501553A 2020-02-21 2020-02-21 SURFACE MOUNTING MACHINE AND IMAGE ANALYSIS METHOD Active JP7290790B2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/007042 WO2021166220A1 (en) 2020-02-21 2020-02-21 Surface mounter and image analyzing method

Publications (3)

Publication Number Publication Date
JPWO2021166220A1 true JPWO2021166220A1 (en) 2021-08-26
JPWO2021166220A5 JPWO2021166220A5 (en) 2022-07-27
JP7290790B2 JP7290790B2 (en) 2023-06-13

Family

ID=77390761

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022501553A Active JP7290790B2 (en) 2020-02-21 2020-02-21 SURFACE MOUNTING MACHINE AND IMAGE ANALYSIS METHOD

Country Status (2)

Country Link
JP (1) JP7290790B2 (en)
WO (1) WO2021166220A1 (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09135442A (en) * 1995-11-10 1997-05-20 Sony Corp Image data processing nit and its method
JPH09259250A (en) * 1996-03-19 1997-10-03 Hitachi Ltd Medical image managing method
JPH1098642A (en) * 1996-09-20 1998-04-14 Fuji Photo Film Co Ltd Digital camera
JP2003273589A (en) * 2002-03-19 2003-09-26 Fuji Mach Mfg Co Ltd Electronic circuit component mounting apparatus and image processing system
JP2010232295A (en) * 2009-03-26 2010-10-14 Hitachi High-Technologies Corp Operation processing device or acf sticking state inspection method, and display substrate module assembling line or display substrate module assembling method
JP2014090076A (en) * 2012-10-30 2014-05-15 Juki Corp Image processing device and electronic component mounting device
WO2015019487A1 (en) * 2013-08-09 2015-02-12 富士機械製造株式会社 Mounting device and part detection method
JP2019110257A (en) * 2017-12-20 2019-07-04 ヤマハ発動機株式会社 Component mounting system

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09135442A (en) * 1995-11-10 1997-05-20 Sony Corp Image data processing nit and its method
JPH09259250A (en) * 1996-03-19 1997-10-03 Hitachi Ltd Medical image managing method
JPH1098642A (en) * 1996-09-20 1998-04-14 Fuji Photo Film Co Ltd Digital camera
JP2003273589A (en) * 2002-03-19 2003-09-26 Fuji Mach Mfg Co Ltd Electronic circuit component mounting apparatus and image processing system
JP2010232295A (en) * 2009-03-26 2010-10-14 Hitachi High-Technologies Corp Operation processing device or acf sticking state inspection method, and display substrate module assembling line or display substrate module assembling method
JP2014090076A (en) * 2012-10-30 2014-05-15 Juki Corp Image processing device and electronic component mounting device
WO2015019487A1 (en) * 2013-08-09 2015-02-12 富士機械製造株式会社 Mounting device and part detection method
JP2019110257A (en) * 2017-12-20 2019-07-04 ヤマハ発動機株式会社 Component mounting system

Also Published As

Publication number Publication date
WO2021166220A1 (en) 2021-08-26
JP7290790B2 (en) 2023-06-13

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