JP2009170528A - Component transfer apparatus, component mounting device and component test instrument - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress an increase in scale in a vertical (height) direction of a head unit. <P>SOLUTION: A component mounting device has the movable head unit 15 having heads 16 attached in columns, and a scanning unit 18 movably attached in the head arranging direction for the body part of the head unit 15 to capture images of sucked components by each of heads 16. A bendable cable guiding member 32 bent in U-shape is provided along a horizontal plane, one end side of the cable guiding member 32 is fixed on the body part of the head unit 15, the other end side is fixed on the scanning unit 18, and various kinds of cables to be wired from the body part side of the head unit 15 to the scanning unit 18 side are housed in the cable guiding member 32. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a component transfer device including a component recognition device that captures and recognizes an image of a holding state of a component held by a component holding member, a component mounting device to which the component transfer device is applied, and a component test device It is about.

  Conventionally, it has a movable head unit equipped with a plurality of nozzles (component holding members) for picking up components, and after picking up and picking up components from the component supply unit with the nozzle, the components are moved. There is known a component transfer apparatus that transports and transfers a target position to a target position. Such a component transfer device is widely applied to, for example, a component mounting device and a component testing device.

Further, in this type of apparatus, there is also provided an apparatus in which an imaging device (scan unit) for component recognition is mounted on the head unit in order to increase the positioning accuracy of the component with respect to a target position. For example, in Patent Document 1, a component mounting surface imaging device is movably mounted on a head unit, and after picking up a component, the lower position of each nozzle is moved across the nozzle arrangement direction to move each imaging device. A device that recognizes an image of a suction component is disclosed.
JP 2004-158819 A

  In the conventional apparatus disclosed in Patent Document 1, the main body of the head unit and the imaging apparatus are electrically connected via various cables, and drive signals, image data, and the like are transmitted through the cables. Therefore, in the conventional apparatus, a duct-shaped cable guide member that can be bent is provided, and is fixed over the head unit and the imaging device in a state where the duct-shaped cable guide member is bent in a U shape along the vertical plane. The cable is accommodated in the housing to protect the cable and to follow the movement of the imaging device.

  However, in the conventional apparatus having such a configuration, the required space in the vertical direction of the cable guide member is relatively large, and the head unit is structurally easy to increase in size in the vertical (height) direction. Such an increase in the size of the head unit in the vertical direction is undesirable because it is a negative factor in stably driving the unit at a high speed. On the other hand, the cable guide member for performing a smooth bending operation is not desirable. It is necessary to secure a bending radius (bending radius), and there is a problem that it is difficult to achieve both of them. Further, since the upper portion of the cable guide member bent in a U shape along the vertical plane is in an unsupported state, it is considered that a slack due to its own weight occurs slightly. For this reason, when the image pickup apparatus is moved, this slack portion may cause vibration and damage due to dancing.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to suppress an increase in the size of the head unit, in particular, an increase in size in the vertical (height) direction. It is to drive stably.

  In order to solve the above-described problems, the present invention includes a head unit that includes a plurality of component holding members arranged in a row and is provided so as to be movable relative to a target position, and is included in the head unit. In a component transfer apparatus having a scan unit that images a holding component by each component holding member supported so as to be movable in the arrangement direction of the component holding member with respect to a main body portion of the unit, from the main body portion side of the head unit A bending-movable electric wiring member routed to the scan unit side is provided in a state of being bent in a U-shape along a horizontal plane. One end side of the electric wiring member is the main body portion of the head unit, and the other end side is It is characterized by being respectively fixed to the scan unit. More specifically, the electrical wiring member is configured to allow only bending along a horizontal plane.

  In this component transfer apparatus, the electric wiring member is provided so as to be bent in a U shape along a horizontal plane. Therefore, while ensuring the required bending radius (bending radius) of the electric wiring member, the required space in the vertical (height) direction of the cable guide member is reduced to a conventional device (the electric wiring member is U-shaped along the vertical surface). Therefore, the head unit can be compactly configured in the vertical direction. In addition, since the bending of the electric wiring member in the direction along the vertical plane is restricted, the electric wiring member is not bent due to its own weight as in the conventional apparatus, so that the slack does not occur. It is possible to avoid the occurrence of vibration and damage caused by dancing.

  As a more specific configuration, in the component transfer apparatus, the main body portion of the head unit is provided with a support portion for the electric wiring member extending in the moving direction of the scan unit, while the scan unit includes the support portion. Extending portions are provided so as to be aligned in a substantially horizontal direction with respect to the electric wiring member, and both ends of the electric wiring member are fixed to the supporting portion and the extending portion, respectively, The part is supported by the support part.

  According to this configuration, as a result of the middle portion of the electric wiring member being supported by the support portion, it is effectively prevented that the entire electric wiring member is bent in a cantilever state with the fixed end as a fulcrum. Therefore, it is possible to avoid the inconvenience that a stress acts on the electric wiring member due to the bending and the smooth bending operation of the electric wiring member is hindered.

  It has a support beam for the head unit extending in the horizontal direction, and the head unit is movably supported along the side surface of the support beam, and the scan unit is disposed at the lower end of the main body of the head unit. In this case, it is preferable that the electrical wiring member is disposed at a position below the support beam.

  According to this configuration, the electrical wiring member can be disposed in the vicinity of the support beam and along the lower surface thereof, and thereby, the space efficiency in which the constituent members of the head unit are concentrated and disposed in the vicinity of the support beam. Good structure.

  In each of the above configurations, the electrical wiring member includes a cable guide member that can be bent and various cables that are accommodated in the cable guide member and are routed from the main body portion side of the head unit to the scan unit side. It may be a flat cable in which various cables arranged from the main body portion side to the scan unit side of the head unit are integrated in the vertical direction.

  On the other hand, a component mounting apparatus according to the present invention has a head unit that is movable relative to a substrate to be mounted, and holds and conveys components by a component holding member mounted on the head unit, and also has a component holding member. A component transfer device that images the component held on the substrate and recognizes the holding state of the component and then transfers the component onto the substrate. The component is transferred from the predetermined component supply unit to the substrate. The component mounting apparatus to be mounted has the above-described component transfer apparatus as the component transfer apparatus.

  In addition, the component inspection apparatus according to the present invention has a head unit that is movable relative to the component inspection unit, and holds and conveys the component by the component holding member mounted on the head unit. A component transfer device that picks up the component held in the image and recognizes the image of the holding state of the component and then transfers the component to the component inspection unit. The component testing apparatus to be transferred to the inspection unit has the above-described component transfer apparatus as the component transfer apparatus.

  According to these apparatuses, since the component transfer apparatus as described above is applied, it is possible to suppress an increase in the size of the head unit, in particular, an increase in size in the vertical (height) direction. It is possible to avoid an increase in the size of the entire apparatus accompanying an increase in size.

  According to the present invention, since the electric wiring member is provided in a state of being bent in a U shape along the horizontal plane, the electric wiring member is secured while ensuring a required bending radius (bending radius) of the electric wiring member. The required space in the vertical (height) direction can be reduced as compared with the conventional apparatus. Accordingly, the head unit can be made compact in the vertical direction, and the size of the head unit, particularly the size in the vertical direction, can be suppressed. In addition, it is possible to suppress the occurrence of slack due to bending of the electric wiring member due to its own weight, as in the conventional apparatus, and thus avoid the occurrence of vibration and damage due to the slack portion dancing when the scan unit moves. Thus, the scan unit can be stably driven for a long time.

  A preferred embodiment of the present invention will be described with reference to the drawings.

  1 and 2 are plan views showing a schematic configuration of a component mounting apparatus according to the present invention (a component mounting apparatus to which a component transfer apparatus according to the present invention is applied). In the drawings used in this description including this figure, XYZ rectangular coordinate axes are shown in order to clarify the directional relationship of each figure.

  As shown in the figure, a conveyor 12 is disposed as a board transport mechanism on a base 10 of the component mounting apparatus, and a printed board P (hereinafter simply referred to as a board P) is placed from the right side of the figure by the conveyor 12. It is transported to the left side and carried into a predetermined work position (the position of the substrate P shown in the figure). A substrate support device (not shown) that supports the substrate P with a backup pin during a mounting operation is disposed in a region below the work position.

  Component supply units 13 are provided on both sides of the conveyor 12 (upper and lower sides in FIG. 1), and component supply devices such as a tape feeder 14 are arranged in parallel along the conveyor 12 in these component supply units 13, for example. Has been placed. Each tape feeder 14 holds a small piece of chip parts such as an integrated circuit (IC), a transistor, a resistor, and a capacitor at a predetermined interval and holds a reel around which a tape is wound. By feeding the tape, the component is supplied to the component supply position at the tip of the feeder, and the component is picked up by the head unit 15.

  The head unit 15 for mounting components is provided above the base 10. The head unit 15 picks up components from the tape feeder 14 and conveys them onto the substrate P and mounts them on a predetermined position on the substrate P. The head unit 15 is mounted in a predetermined position on the substrate P in the X-axis direction (the substrate P by the conveyor 12). It is possible to move in the Y-axis direction orthogonal to this in the (conveying direction) and horizontal planes. That is, a support beam 20 extending in the X-axis direction is provided above the base 10, and the head unit 15 is movably supported by a fixed rail 21 fixed to the support beam 20. The support beam 20 is supported by a fixed rail 22 whose both end portions extend in the Y-axis direction, and is movable along the fixed rail 22 in the Y-axis direction. The head unit 15 is driven in the X-axis direction by the X-axis servo motor 23 via the ball screw shaft 24, while the support beam 20 is driven in the Y-axis direction by the Y-axis servo motor 25 via the ball screw shaft 26. It has come to be.

  A plurality of heads 16 (component holding members according to the present invention) for holding and transporting components are mounted on the head unit 15. In this embodiment, a total of ten heads 16 are arranged in the X-axis direction. Arranged in rows. Each head 16 has a component suction nozzle 16a attached to the tip (lower end) of a drive shaft extending in the Z-axis direction (vertical direction). The nozzle 16a is connected to the negative pressure generator via an internal passage of the drive shaft and a switching valve (not shown), and when sucking parts, a negative pressure suction force is applied from the negative pressure generator to the nozzle tip. Part adsorption is possible.

  Each head 16 can be moved up and down (moved in the Z-axis direction) and rotated around the nozzle central axis (R axis) with respect to the head unit 15, and is driven by a lift drive mechanism and a rotary drive mechanism, respectively. ing. Among these drive mechanisms, the lift drive mechanism lifts and lowers the head 16 between a lowered position when picking up or mounting (mounting) components and a raised position when carrying or picking up components. is there. On the other hand, the rotation drive mechanism is a mechanism for rotating the head 16 as necessary, and the component can be positioned in a predetermined R-axis direction during mounting by rotation drive. Each of these drive mechanisms is composed of a servo motor and a predetermined power transmission mechanism.

  The head unit 15 further includes a board imaging unit 17, a scan unit 18, a drive mechanism for driving the scan unit 18, and the like.

  The board imaging unit 17 includes an area sensor including a CCD imaging device, an illumination device, and the like, and is fixed to the head unit 15 in a downward posture. As a result, various marks on the substrate P carried into the work position can be imaged.

  On the other hand, the scan unit 18 images a suction component of the head 16 (nozzle 16a), and includes a linear sensor including a CCD image sensor, a lighting device, and a prism for guiding a component image to the linear sensor. ing.

  Here, the configuration of the head unit 15, the scan unit 18, and the drive mechanism will be described in some detail with reference to FIGS. 3 to 5 show a more specific configuration of the head unit 15, FIG. 3 is a perspective view, FIG. 4 is a side view, and FIG. 5 is a plan view showing the head unit 15. .

  As shown in FIG. 4, the head unit 15 is disposed on the front side of the support beam 20 (the side on which the operation panel of the component mounting apparatus is provided; the right side in the figure). That is, the support beam 20 has a substantially rectangular cross-sectional shape, and the fixed rail 21 is fixed to the front surface of the support beam 20, and the head unit 15 is movably supported on the fixed rail 21.

  The head unit 15 has an L-shaped cross section having a vertical portion 151 a extending in the Z-axis direction along the front surface of the support beam 20 and a horizontal portion 151 b extending rearward from the lower end portion along the lower surface of the support beam 20. The base frame 151 has a width in the X-axis direction.

  The head 16 and its elevation drive mechanism, rotation drive mechanism, and the like are assembled to the front surface of the vertical portion 151a of the base frame 151, and the scan unit 18 is attached to the lower surface of the horizontal portion 151b. The linear motor 30 is supported so as to be movable in the X-axis direction via the drive mechanism, and can be moved in the X-axis direction by receiving a driving force from the linear motor 30. That is, although a detailed view is omitted, a rail of the linear guide is fixed to the lower surface of the horizontal portion 151b, and a mover of the linear motor 30 is fixed to a slider mounted on the rail, and further, a scan unit is attached to the mover. Eighteen frames are fixed. And the stator of the linear motor 30 is being fixed to the lower surface of the said perpendicular | vertical part 151a so that the said needle | mover may be opposed. With this configuration, the linear motor 30 drives the scan unit 18 in the X-axis direction. In the present embodiment, as the linear motor 30, a moving coil type linear motor in which a mover is formed of a coil portion is applied.

  The scan unit 18 is flat in the Z-axis direction in which the illuminating device is positioned below the head 16 disposed at the raised position, and the linear sensor is laid out on the substantially horizontal rear side of the illuminating device. The reflected light reflected by the suction component while being projected from the lighting device is further reflected by a prism or the like and guided to the linear sensor to image the suction component. When the scanning unit 18 moves in the X-axis direction in response to the driving force from the linear motor 30, the suction components of each head 16 can be sequentially imaged along with this movement.

  A cable guide member 32 that can be bent and moved following the movement of the scan unit 18 is disposed in the upper rear portion of the scan unit 18 and below the support beam 20. Parts other than the scan unit 18; various cables from the main part of the head unit according to the present invention, specifically, cables for transmitting a drive signal to the coil part (movable element) of the linear motor 30, A drive signal for the linear sensor or the like of the scan unit 18 and a cable for transmitting image data are accommodated in the cable guide member 32. The cable guide member 32 and various cables correspond to the electrical wiring member according to the present invention.

  The cable guide member 32 is a duct-shaped member configured such that only bending along a predetermined plane is allowed, such as a cable bear (registered trademark). As shown, the cable guide member 32 is bent in a U-shape along the horizontal plane as the predetermined plane, and one end side of the cable guide member 32 is the upper surface of the horizontal portion 151b of the base frame 151 (corresponding to the support portion of the present invention). Further, the other end side is fixed to a support bracket 181 (corresponding to the extending portion of the present invention) provided in a pair on the scan unit 18 and extending rearward. The mounting surface of the cable guide member 32 in the support bracket 181 is set at substantially the same height as the upper surface of the horizontal portion 151b, whereby the cable guide member 32 is supported horizontally, and the middle portion thereof is a horizontal portion. 151b is supported.

  Various devices mounted on the head unit 15 including the cables for transmitting the drive signal of the linear motor 30, for example, other cables for transmitting the drive signal for controlling the drive of the head 16, 10 is electrically connected to a controller mounted on the controller 10. Accordingly, a cable guide member 34 that can be bent and moved following the movement of the head unit 15 in the X-axis direction is disposed on the fixed rail 22 and the fixed rail 22 on which the support beam 20 is supported. A cable guide member 35 that can be bent and moved following the movement of the support beam 20 in the Y-axis direction is disposed on the side, and the cables are accommodated in the cable guide members 34 and 35. These cable guide members 34 and 35 are also applied with, for example, a cable bear (registered trademark) or the like, similarly to the cable guide member 32 of the head unit 15.

  In the component mounting apparatus described above, components are mounted as follows. First, the head unit 15 moves to the component supply unit 13 and the components are sucked by the heads 16. Specifically, after a predetermined head 16 is disposed above the tape feeder 14, the head 16 is driven up and down, whereby the nozzle 16a is lowered to pick up and take out the components in the tape. At this time, if possible, parts are taken out simultaneously by the plurality of heads 16. When the suction of the components is completed, the head unit 15 moves onto the substrate P, and during the movement period, the scanning unit 18 is driven, and the suction state of the suction components by each head 16 is recognized. Specifically, after each head 16 is arranged at the raised position, the scan unit 18 is driven at a constant speed in the X-axis direction, and with this movement, each suction component is imaged and their suction state is recognized, A correction amount at the time of mounting corresponding to the amount of adsorption deviation is calculated. When the head unit 15 reaches the first mounting position on the substrate P, the head 16 is driven up and down to mount components on the substrate P. Thereafter, the head unit 15 sequentially moves to the mounting position and the remaining heads 16 are moved. Are sequentially driven up and down, so that components are sequentially mounted on the substrate P.

  As shown in FIG. 1, a component recognition unit 28 for recognizing a component that is difficult to be imaged by the scan unit 18, for example, a large special component, is disposed on the base 10. Is mounted, instead of the image recognition of the suction component by the scan unit 18, the image recognition of the suction component by the component recognition unit 28 is performed. Specifically, after the component is picked up by the head 16, the head unit 15 moves onto the substrate P via the component recognition unit 28, whereby the picked-up component is imaged by the component recognition unit 28, and the suction state is Image recognition. The component recognition unit 28 includes, for example, an area sensor including a CCD image pickup device and the like, an illumination device, and the like, similar to the board image pickup unit 17.

  According to such a component mounting apparatus according to the present invention, since the head unit 15 is configured as described above, the following effects are obtained. That is, the cables from the head unit main body side to the scan unit 18 side are accommodated in the cable guide member 32. In this embodiment, the cable guide member 32 is U-shaped along the horizontal plane as described above. The head unit 15 is assembled in a bent state. Therefore, the required bending radius (bending radius) of the cable guide member 32 can be ensured while the required space in the Z-axis direction of the cable guide member 32 can be reduced (reduced). In this embodiment, the horizontal space 151b of the head unit 15a, that is, the scan unit 18 is used as shown in FIG. 4 by utilizing the fact that the required space in the Z-axis direction of the cable guide member 32 is reduced in this way. Since the cable guide member 32 is arranged in the space between the assembly position and the support beam 20, the head unit 15 has a compact configuration in which its constituent elements are arranged in the vicinity of the support beam 20. It becomes composition. Therefore, the head unit 15 is more in the Z-axis (height) direction than the conventional device of this type in which the cable guide member is incorporated in the head unit 15 in a state of being bent in a U shape along the vertical plane. As a result, it is possible to effectively suppress an increase in size of the head unit, particularly an increase in size in the vertical (height) direction.

  In addition, the cable guide member 32 is configured such that only bending along the horizontal plane is allowed as described above, and bending along the vertical plane is restricted, so that the cable guide member is bent by its own weight as in the conventional device. As a result, no slack occurs. Therefore, there is also an advantage that it is possible to drive the scan unit 18 stably in the long term by avoiding the occurrence of vibration and damage due to the slack portion dancing when the scan unit 18 moves.

  In the head unit 15, one end of the cable guide member 32 is fixed to the upper surface of the horizontal portion 151 b extending in the moving direction (X-axis direction) of the scan unit 18, as shown in FIGS. 4 and 5. In addition, the middle portion of the cable guide member 32 is supported by the horizontal portion 151b. Accordingly, it is possible to effectively prevent the entire cable guide member 32 from being bent in a cantilever state with the fixed end as a fulcrum, and stress acting on the cable guide member 32. Accordingly, the cable guide member 32 can be smoothly bent as the scan unit 18 moves while the cable guide member 32 is incorporated into the head unit 15 while being bent in a U shape along the horizontal plane. There is an advantage.

  The component mounting apparatus described above is an exemplification of a preferred embodiment of the component mounting apparatus according to the present invention (the component mounting apparatus to which the component transfer apparatus according to the present invention is applied), and its specific configuration. Can be appropriately changed without departing from the scope of the present invention.

  For example, in the embodiment, since the horizontal portion 151b for attaching the linear motor 30 or the like is provided at the lower end portion of the vertical portion 151a of the base frame 151, the horizontal portion 151b is used as a support portion according to the present invention. The one end of the cable guide member 32 is fixed to the upper surface of the horizontal portion 151b, and the middle portion of the cable guide member 32 is supported by the horizontal portion 151b. Of course, separately from the horizontal portion 151b. Alternatively, the support portion of the cable guide member 32 may be provided, and the cable guide member 32 may be fixed to the support portion.

  Further, in the embodiment, the description has been given of the case where various cables are accommodated in the cable guide member 32 as the electrical wiring member routed from the head unit main body side to the scan unit 18 side. However, the electrical wiring material includes a plurality of cables. Flat cable integrated in the vertical direction by covering with vinyl diameter or rubber, etc., and several round cables (3 in the example shown) are heat-sealed or bonded as shown in FIG. Alternatively, the flat cable 40 may be integrated and lined up and down.

  In the embodiment, the scan unit 18 is configured to be driven by the linear motor 30. Of course, the scan unit 18 is driven by the rotary motor via the ball screw shaft, or the rotary unit is used for the rotation. The scan unit 18 may be driven via a moving endless belt.

  In the above embodiment, the application of the present invention has been described using the component mounting apparatus as an example. However, the application target of the present invention is not limited to the component mounting apparatus, and includes, for example, a plurality of heads that hold the components. The present invention can also be applied to a component testing apparatus that takes out a component from a component supply unit and transfers it to a predetermined component inspection unit by a component transfer device having a movable head unit, and performs component inspection.

1 is a plan view showing an outline of a component mounting apparatus according to the present invention (a component mounting apparatus to which a component transfer apparatus according to the present invention is applied). It is a front view which shows the outline of the component mounting apparatus. It is a perspective view which shows the specific structure of a head unit. It is a side view which shows the specific structure of a head unit. It is a top view which shows the specific structure of a head unit. It is a perspective view which shows another structure of a head unit.

Explanation of symbols

DESCRIPTION OF SYMBOLS 15 Head unit 151 Base frame 151a Vertical part 151b Horizontal part 16 Head 16a Nozzle 18 Scan unit 181 Support bracket 20 Support beam 30 Linear motor 32 Cable guide member

Claims (8)

A head unit provided with a plurality of component holding members in a row and provided so as to be relatively movable with respect to a target position, and an arrangement of the component holding members included in the head unit and with respect to a main body portion of the unit In a component transfer apparatus having a scan unit that is supported movably in a direction and images a holding component by each component holding member,
A bending-movable electric wiring member arranged from the main body portion side of the head unit to the scanning unit side is provided in a state of being bent in a U shape along a horizontal plane, and one end side of the electric wiring member is provided on the head unit. A component transfer apparatus, wherein the other end side is fixed to the main body portion and a scan unit. The component transfer apparatus according to claim 1,
The component transfer apparatus according to claim 1, wherein the electric wiring member is configured to allow only bending along a horizontal plane. In the component transfer apparatus according to claim 1 or 2,
While the main body portion of the head unit is provided with a support portion for the electric wiring member extending in the moving direction of the scan unit,
The scanning unit is provided with an extending portion that extends so as to be aligned in a substantially horizontal direction with respect to the support portion,
The electric wiring member is fixed to the support part and the extension part, and a part of the electric wiring member is supported by the support part. In the component transfer apparatus according to any one of claims 1 to 3,
The head unit has a support beam extending in the horizontal direction. The head unit is supported movably along a side surface of the support beam, and the scan unit is disposed at the lower end of the main body of the head unit. The component transfer apparatus according to claim 1, wherein the electric wiring member is disposed at a position below the support beam. In the components transfer apparatus as described in any one of Claims 1 thru | or 4,
The electrical wiring member is composed of a cable guide member that can be bent and various cables that are accommodated in the cable guide member and are routed from the main body portion side of the head unit to the scan unit side. Mounting device. The component transfer apparatus according to claim 1,
The component transfer apparatus according to claim 1, wherein the electric wiring member is a flat cable in which various cables routed from the main body portion side to the scan unit side of the head unit are integrated in a vertical direction. A head unit that can move relative to the substrate to be mounted is provided, and the components are held and conveyed by a component holding member mounted on the head unit, and the components held on the component holding member are imaged to obtain the components. In a component mounting apparatus that includes a component transfer device that transfers the component onto a substrate after image recognition of the holding state of the component, takes out the component from a predetermined component supply unit, and mounts it on the substrate,
A component mounting apparatus comprising the component transfer apparatus according to claim 1 as the component transfer apparatus. It has a head unit that can move relative to the component inspection unit, and holds and conveys the component by the component holding member mounted on the head unit, and images the component held by the component holding member In a component test apparatus that includes a component transfer device that transfers the component to the component inspection unit after image recognition of the holding state of the component, takes out the component from a predetermined component supply unit, and transfers it to the component inspection unit,
A component test apparatus comprising the component transfer apparatus according to claim 1 as the component transfer apparatus.

Images