JP2013062403A - Component mounting system and state diagnostic method in component mounting system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component mounting system capable of finding the site of injury in an inspection part in the early stage while facilitating the identification thereof, and to provide a state diagnostic method in the component mounting system.SOLUTION: In an inspection section R2 for inspecting the mounting state of a component 4 on a circuit board 2 based on an inspection image obtained by imaging, a digital signal transmitted via a signal transmission cable 41, in a state where a photoelectric conversion element 40a is not receiving light, is sampled as an inspection signal for a certain period of time, and state diagnosis of the inspection section R2 is performed based on the results thus obtained in the diagnostic section 50e of a control unit 50. When a state where the output level of the inspection signal thus obtained has deviated continuously from a predetermined reference range D is detected, the diagnostic section 50e determines that an imaging head 40 is abnormal.

Description

  The present invention relates to a component mounting system including a component mounting unit that mounts a component on a substrate, and an inspection unit that inspects a mounting state of the component mounted on the substrate by the component mounting unit, and a state in this component mounting system It relates to a diagnostic method.

  A component mounting system that mounts components (electronic components) on a board to produce a mounting board, in addition to the component mounting part that mounts components on the board, the components mounted on the board by the component mounting part An inspection unit that captures an image to generate an inspection image and inspects the mounting state of the component on the substrate based on the generated inspection image is provided (for example, Patent Document 1).

  In such a component mounting system, the imaging head of the inspection unit includes an A / D converter that converts an analog signal output from the photoelectric conversion element into a digital signal in addition to the photoelectric conversion element. The A / D converted signal is transmitted to the image generation unit of the control device through a signal transmission cable connected to the imaging head. Here, the signal transmission cable is accommodated in a cable protection guide member that deforms following the movement operation of the imaging head. When the imaging head moves, the signal transmission cable bends and stretches in the cable protection guide member. For this reason, in the inspection unit, not only the components in the imaging head (for example, the photoelectric conversion element) but also the signal transmission cable in the cable protection guide member may be damaged or deteriorated (hereinafter referred to as damage or the like). There are cases where the reliability of data is impaired. For this reason, conventionally, an operator of a component mounting system has to quickly find a part such as a damage in a part in the imaging head or a signal transmission cable and repair the part.

JP 2010-87450 A

  However, conventionally, when some part of the inspection unit is damaged or the like, the operator notices this when the obtained inspection image is clearly different from the actual one, At this time, since the degree of damage or the like of the part where the damage or the like has occurred is often quite large, the reliability of the image data obtained so far is extremely low, and the inspection already performed is useless. There was a risk of becoming. In addition, even if the operator notices that some part of the inspection unit is damaged based on the obtained inspection image, whether the damaged part is generated in the components in the imaging head is transmitted. There is a problem in that it is difficult to quickly identify whether or not a cable is occurring.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a component mounting system and a state diagnosis method in the component mounting system that can detect the occurrence of a damaged part in an inspection unit at an early stage and can easily identify the damaged part.

  The component mounting system according to claim 1 generates a test image by imaging a component mounting unit that mounts a component on a substrate, a component mounted on the substrate by the component mounting unit with an imaging head, and the generated inspection An inspection unit that inspects the mounting state of the component on the substrate based on the image for processing, and the inspection unit converts the photoelectric conversion element provided in the imaging head and the analog signal output from the photoelectric conversion element into a digital signal. An A / D converter for conversion, and a signal transmission cable for transmitting a digital signal output from the A / D converter housed in a cable protection guide member that deforms following the movement of the imaging head. In this component mounting system, a digital signal transmitted from the signal transmission cable in a state where the photoelectric conversion element is not receiving light is used as a test signal for a predetermined time. And, with a diagnosis unit for performing a status diagnosis of the measurement part based on the results obtained.

  The component mounting system according to claim 2 is the component mounting system according to claim 1, wherein the inspection unit captures an analog signal output in a state where the photoelectric conversion element is not receiving light by the imaging head. This is a signal that is output in a standby state where no operation is performed.

  The component mounting system according to claim 3 is the component mounting system according to claim 1 or 2, wherein the diagnosis unit collects the inspection signal for a certain period of time, and based on the obtained result, the inspection It is determined that there is an abnormality in the imaging head when it is detected that the output level of the signal for use has deviated continuously from a predetermined reference range.

  The state diagnosis method in the component mounting system according to claim 4, wherein a component mounting unit that mounts a component on a substrate, a component mounted on the substrate by the component mounting unit is imaged by an imaging head, and an inspection image is generated. An inspection unit that inspects the mounting state of the component on the substrate based on the generated inspection image, and the inspection unit includes a photoelectric conversion element provided in an imaging head and an analog signal output by the photoelectric conversion element A / D converter for converting the signal into a digital signal, and signal transmission for transmitting the digital signal output from the A / D converter housed in a cable protection guide member that deforms following the moving operation of the imaging head A state diagnosis method in a component mounting system comprising a cable, wherein a data transmitted from the signal transmission cable in a state where the photoelectric conversion element is not receiving light. And a step of a predetermined time taken digital signal as the test signal, and performing a state diagnosis of the measurement part based on the results obtained by the test signal taken a certain time.

  The state diagnosis method in the component mounting system according to claim 5 is the state diagnosis method in the component mounting system according to claim 4, wherein the analog signal output in a state where the photoelectric conversion element is not receiving light is It is a signal that is output in a standby state in which the inspection unit is not performing imaging with the imaging head.

  The state diagnosis method in the component mounting system according to claim 6 is the state diagnosis method in the component mounting system according to claim 4 or 5, wherein the inspection signal is collected for a predetermined time, and as a result, the inspection When it is detected that the output level of the signal continuously deviates from a predetermined reference range, it is determined that there is an abnormality in the imaging head.

  According to the present invention, a digital signal transmitted from a signal transmission cable is sampled as a test signal for a predetermined time in a state where the photoelectric conversion element of the imaging head is not receiving light, and the state diagnosis of the inspection unit is performed based on the obtained result. Since the state diagnosis can be performed at an arbitrary time regardless of the acquisition of the inspection image, the occurrence of a site such as damage in the inspection unit can be detected at an early stage. Further, based on the obtained result, it is possible to determine that there is an abnormality in the imaging head when detecting a state in which the output level of the inspection signal is continuously deviated from a predetermined reference range. It is easy to specify.

The top view of the component mounting system in one embodiment of this invention The side view of the 1st component mounting machine with which the component mounting system in one embodiment of this invention is provided The side view of the 2nd component mounting machine with which the component mounting system in one embodiment of this invention is provided The block diagram which shows the structure of the test | inspection part with which the component mounting system in one embodiment of this invention is provided. The perspective view which shows the cable protection guide member with which the test | inspection part in one embodiment of this invention is provided. (A) (b) (c) (d) The figure which shows the motion of the cable protection guide member with which the test | inspection part in one embodiment of this invention is provided. The side view of the post-reflow inspection machine with which the component mounting system in one embodiment of this invention is provided The figure which shows the example of the signal for a test | inspection obtained by the state diagnosis of the test | inspection part in one embodiment of this invention (A) (b) (c) The figure which shows the example of the signal for a test | inspection obtained by the state diagnosis of the test | inspection part in one embodiment of this invention The figure which shows the example of the signal for a test | inspection obtained by the state diagnosis of the test | inspection part in one embodiment of this invention The flowchart which shows the execution procedure of the state diagnosis of the test | inspection part in one embodiment of this invention

  Embodiments of the present invention will be described below with reference to the drawings. A component mounting system 1 according to an embodiment of the present invention shown in FIG. 1 includes a screen printing machine 11, a first component mounting machine 12, a second component mounting machine 13, a reflow device 14, and the like. It has an after-reflow inspection machine 15.

  The screen printing machine 11 prints solder on the electrode part 3 of the substrate 2, and the first component mounting machine 12 mounts a component (electronic component) 4 on the electrode part 3 of the substrate 2 sent from the screen printing machine 11. To do. The second component mounting machine 13 mounts the component 4 on the board 2 sent from the first component mounting machine 12 and inspects the mounting state of each component 4 on the board 2. The reflow device 14 performs solder reflow for heating the substrate 2 on which the component 4 is mounted to melt the solder, and fixes the component 4 on the electrode portion 3 of the substrate 2. The post-reflow inspection machine 15 inspects the mounting state of each component 4 on the board 2 after the solder reflow is completed. In the following description, regarding the screen printing machine 11, the first component mounting machine 12, the second component mounting machine 13, the reflow device 14, and the post-reflow inspection machine 15, the transport direction of the substrate 2 is the X axis direction and the X axis direction. A horizontal plane direction orthogonal to the Y-axis direction is defined as a Y-axis direction, and a vertical direction is defined as a Z-axis direction.

  In FIG. 1, the screen printing machine 11 includes a substrate transport conveyor 22 extending in the X-axis direction on a base 21, and a plate-shaped mask 23 and a ridge extending in the X-axis direction above the substrate transport conveyor 22. A squeegee 24 is provided. The mask 23 is provided with an opening 23a arranged according to the arrangement of the electrode part 3 of the substrate 2, and the squeegee 24 is moved in the Y-axis direction by a squeegee moving mechanism (not shown).

  In the screen printing operation by the screen printing machine 11, first, the substrate 2 sent from the upstream process side (outside of the component mounting system 1) is carried by the substrate transfer conveyor 22 and positioned below the mask 23, and then the substrate 2 is moved. It is raised by a lift device (not shown) and brought into contact with the mask 23 from below. As a result, when the electrode portion 3 of the substrate 2 and the opening portion 23a of the mask 23 are in agreement, solder is supplied onto the mask 23, and the squeegee 24 is slid in the Y-axis direction on the mask 23. As the squeegee 24 slides, the solder is scraped on the mask 23, pushed into the opening 23 a of the mask 23, and transferred to the substrate 2 (electrode portion 3). When the solder is transferred to the substrate 2, the substrate 2 is lowered by the lift device so as to be separated from the mask 23, and the substrate transport conveyor 22 is operated to carry the substrate 2 to the downstream process side.

  1 and 2, the first component mounting machine 12 includes a substrate transfer conveyor 32 extending in the X-axis direction on a base 31 and a head moving mechanism 33 including an XY robot. The head moving mechanism 33 is fixed to the base 31 and extends in the Y-axis direction. The two X-axis tables 33b extend in the X-axis direction and are movable in the Y-axis direction on the Y-axis table 33a. , Two moving stages 33c that are movable in the X-axis direction on each X-axis table 33b are provided. A mounting head 35 having a plurality of suction nozzles 34 with suction ports facing downward is attached to each moving stage 33c, and the head moving mechanism 33 operates (the movement of the X-axis table 33b relative to the Y-axis table 33a and the X-axis). By combining the movement of the moving stage 33c with respect to the axis table 33b), the two mounting heads 35 can be moved in the XY plane, respectively.

  A plurality of component supply devices 36 such as tape feeders are provided at two locations facing the Y-axis direction of the base 31, and each component supply device 36 has a component 4 at a predetermined component supply position 36 a (FIG. 2). Supply. Each mounting head 35 is provided with a substrate camera 37 with the imaging field of view facing downward, and component cameras 38 with the imaging field of view facing upward are provided at two positions on the base 31 with the substrate transport conveyor 32 interposed therebetween. ing.

  In the mounting operation of the component 4 on the substrate 2 by the first component mounting machine 12, first, the substrate 2 sent from the screen printing machine 11 on the upstream process side is carried by the substrate transfer conveyor 32 and positioned. When the substrate 2 is positioned, the head moving mechanism 33 is operated to move one mounting head 35, and a substrate camera 37 provided in the mounting head 35 provides a pair of substrate marks (see FIG. (Not shown). Then, the positional deviation from the normal position of the substrate 2 is calculated from the position of the substrate mark obtained by the imaging of the substrate camera 37.

  When the positional deviation of the substrate 2 is calculated, the head moving mechanism 33 is operated to move the two mounting heads 35 back and forth between the component supply device 36 and the substrate 2, respectively, and the suction operation and suction release operation of the suction nozzle 34 are performed. The component 4 supplied by each component supply device 36 is transferred and mounted on the electrode portion 3 of the substrate 2.

  Until the component 4 sucked by the suction nozzle 34 is mounted on the substrate 2, the component 4 passes above the component camera 38, and the component 4 is imaged by the component camera 38 and the component for the suction nozzle 34. 4 position shift (adsorption shift) is detected. When the component 4 is mounted on the board 2, the position of the suction nozzle 34 is corrected so that the detected position shift and suction shift of the board 2 are cancelled. When the mounting of the component 4 on the substrate 2 is completed, the substrate transport conveyor 32 is operated to carry the substrate 2 to the downstream process side.

  1 and 3, the second component mounting machine 13 removes the mounting head 35 from one moving stage 33c of the head moving mechanism 33 provided in the first component mounting machine 12 and lowers the imaging field of view there. And the component supply device 36 and the component camera 38 on the side where the image pickup head 40 is attached are removed. The configuration and the contents of the operation of mounting the component 4 on the substrate 2 by the mounting head 35 are the same as those of the first component mounting machine 12.

  The image pickup head 40 is an image pickup means having a structure as a kind of sensor using a laser and a light receiving element. As shown in FIG. 4, a plurality of photoelectric elements including PSD (position sensitive device), PD (photodiode), and the like. A conversion element 40a and an A / D converter 40b for converting an analog signal output from each photoelectric conversion element 40a into a digital signal are provided. The imaging head 40 is connected to the control device 50 (see also FIG. 3) via a plurality of signal transmission cables 41 corresponding to the number of photoelectric conversion elements 40a. The control device 50 is provided with an image generation unit 50a, an image recognition unit 50b, a determination unit 50c, and a result output unit 50d, and a display device 60 is connected to the result output unit 50d.

  5 and 6, a cable protection guide member 42 is provided between the X-axis table 33b and the moving stage 33c. The cable protection guide member 42 deforms following the moving operation of the moving stage 33c relative to the X-axis table 33b. The signal transmission cable 41 is accommodated in the cable protection guide member 42 to be protected and guided. When the imaging head 40 moves relative to the X-axis table 33b, the plurality of signal transmission cables 41 bend and extend within the cable protection guide member.

  The photoelectric conversion element 40a included in the imaging head 40 outputs an analog signal (voltage signal) corresponding to the intensity of received light. By combining the movement of the imaging head 40 in the X-axis direction along the X-axis table 33b and the movement of the X-axis table 33b in the Y-axis direction along the Y-axis table 33a, the imaging head 40 moves in the XY plane direction relative to the substrate 2. Can be scanned, whereby the entire substrate 2 can be imaged.

  The A / D converter 40b performs A / D conversion on the analog signal output from the photoelectric conversion element 40a to generate a digital signal representing a luminance value.

  The image generation unit 50a of the control device 50 generates an inspection image based on the digital signal transmitted from the imaging head 40 via the signal transmission cable 41, and the image recognition unit 50b of the control device 50 includes the image generation unit. Image recognition is performed based on the inspection image generated by 50a. Thereby, the control apparatus 50 can grasp | ascertain the position, shape, etc. of the components 4 imaged with the imaging head 40. FIG.

  The determination unit 50c of the control device 50 performs inspection (good / bad determination) of the mounting state of the component 4 imaged by the imaging head 40 on the substrate 2 based on the position, shape, and the like of the component 4 recognized by the image recognition unit 50b. Do.

  The result output unit 50d of the control device 50 specifies the position of the component 4 on the substrate 2 when there is a component 4 that is determined to be defective on the substrate 2 by the determination unit 50c. It is displayed on the display device 60. Thereby, the operator of the component mounting system 1 can recognize the component 4 in which the mounting state on the board 2 is defective, and can take appropriate measures such as removing the board 2 from the production line.

  The second component mounting machine 13 configured as described above mounts the component 4 on the board 2 by the same procedure as the mounting procedure of the component 4 on the board 2 by the first component mounting machine 12, and then moves the imaging head 40. The component 4 mounted on the substrate 2 is picked up and imaged, and the mounting state of the component 4 on the substrate 2 is inspected based on the obtained inspection image.

  In FIG. 1, the reflow apparatus 14 includes a substrate transfer conveyor 72 and a reflow furnace 73 that extend on a base 71 in the X-axis direction. The board transfer conveyor 72 receives the board 2 transported from the second component mounting machine 13 on the upstream process side and transports it to the post-reflow inspection machine 15 on the downstream process side, and the reflow furnace 73 heats the board 2 in the meantime. The solder on the substrate 2 is melted. Thereby, each component 4 mounted on the substrate 2 is fixed on the electrode portion 3 of the substrate 2.

  1 and 7, the post-reflow inspection machine 15 removes the mounting head 35 from the head moving mechanism 33 provided in the second component mounting machine 13 described above, and also supplies a component supply device 36 and a component camera 38 from the base 31. It has the structure which removed. For this reason, the post-reflow inspection machine 15 has a function of inspecting the mounting state of the component 4 on the board 2 in the same manner as the second component mounting machine 13, and the board 2 on which the solder reflow is performed by the reflow device 14 is provided. It carries in by the board | substrate conveyance conveyor 32, and the mounting | wearing state of the components 4 on the board | substrate 2 is test | inspected.

  As described above, in the component mounting system 1 according to the present embodiment, the component mounting unit R1 (FIG. 1) for mounting the component 4 on the substrate 2 and the component 4 mounted on the substrate 2 by the component mounting unit are imaged by the imaging head 40. Thus, an inspection image is generated, and an inspection unit R2 (FIG. 1) that inspects the mounting state of the component 4 on the substrate 2 based on the generated inspection image is provided. The component mounting unit R1 corresponds to a part of the first component mounting machine 12 and the second component mounting machine 13 (part including the mounting head 35), and the inspection unit R2 is a part of the second component mounting machine 13. (The part including the imaging head 40) and the post-reflow inspection machine 15 correspond to each. Each inspection unit R2 is provided with a state diagnosis function that can detect when the imaging head 40 or the signal transmission cable 41 is damaged or deteriorated (damage or the like). Give an explanation.

  As shown in FIG. 4, the control device 50 (the control device 50 included in the second component mounting machine 13 or the control device 50 included in the post-reflow inspection machine 15) of each inspection unit R <b> 2 is connected via a signal transmission cable 41. A diagnostic unit 50e to which a signal from the imaging head 40 is input is provided. The diagnosis unit 50e of the control device 50 operates the diagnosis start switch 51 by the operator in a state where the photoelectric conversion element 40a is not receiving light (a standby state where the inspection unit R2 is not performing an imaging operation by the imaging head 40). When it is detected that the head movement mechanism 33 has been operated, the head moving mechanism 33 is controlled to move the imaging head 40 (the moving stage 33c to which the imaging head 40 is attached) along the X-axis table 33b with the maximum stroke MS ( In FIG. 6), a signal output in a state where each photoelectric conversion element 40a is not receiving light is sampled as a test signal for a predetermined time while reciprocating several times.

  Here, a signal output in a state where each photoelectric conversion element 40a does not receive light is an analog signal (voltage value), but this analog signal is converted into a digital signal by the A / D converter 40b. A signal received by the diagnosis unit 50e of the control device 50 via the signal transmission cable 41 is a digital signal.

  As shown in FIG. 6, the maximum stroke MS of the imaging head 40 is an image when the end of one end side of the movable region of the imaging head 40 on the X-axis table 33 b is A and the other end side is B. When the head 40 is moved from the end A to the end B (FIG. 6 (a) → FIG. 6 (b) → FIG. 6 (c) → FIG. 6 (d)), or the imaging head 40 is moved from the end B to the end B. When moving to section A (FIG. 6 (d) → FIG. 6 (c) → FIG. 6 (b) → FIG. 6 (a)), the moving stroke of the imaging head 40 is referred to, and the imaging head 40 is reciprocated at the maximum stroke MS. To move means to move the imaging head 40 in the order of end A → end B → end A or end B → end A → end B.

  FIG. 8, FIG. 9A, FIG. 9B, FIG. 10C, and FIG. 10 show the output level of the inspection signal acquired from one signal transmission cable 41 while the imaging head 40 is reciprocated four times with the maximum stroke MS. It is an example which shows the time change of. The symbols “A” and “B” shown in these figures indicate the position of the imaging head 40 on the movable area of the imaging head 40. In each figure, the collected data corresponding to one reciprocation of the maximum stroke MS is shown. The range is indicated by G.

  FIG. 8 shows an example in which the output level of the inspection signal is continuously within the reference range D. Here, the “reference range D” is a predetermined digital signal value that is expected to be output when there is no abnormality in both the imaging head 40 and the signal transmission cable 41 in consideration of variations due to noise. It is stored in the storage unit 50f (FIG. 4) of the control device 50. As described above, when the output level of the inspection signal is continuously within the reference range D, the diagnosis unit 50e of the control device 50 determines that the imaging head 40 and all the signal transmission cables 41 are normal. To do.

  FIGS. 9A, 9 </ b> B, and 9 </ b> C are examples in which the output level of the inspection signal transmitted from the signal transmission cable 41 is continuously deviated from the reference range D. FIGS. More specifically, FIG. 9A shows an example in which an inspection signal having an extremely large output level with respect to the reference range D is continuously output, and FIG. FIG. 9C shows an example in which an inspection signal having an extremely small output level is continuously output. FIG. 9C shows an inspection signal having an extremely large output level with respect to the reference range D and an inspection having an extremely small output level. This is an example in which business signals are output alternately and continuously. In these cases, it is apparent that there is a problem in the performance of the photoelectric conversion element 40a (the A / D converter 40b may occasionally have a problem), so the diagnosis unit 50e of the control device 50 It is determined that there is an abnormality in the imaging head 40.

  FIG. 10 shows that the output level of the inspection signal transmitted from the signal transmission cable 41 is not continuously deviated from the reference range D, but for inspection when the imaging head 40 passes a specific position. This is an example where the output level of the signal may temporarily deviate from the reference range D. In this case, the output level of the inspection signal corresponds to the reciprocating movement along the X-axis table 33b of the imaging head 40. Thus, a state of extremely large periodic and instantaneous increase is recognized.

  This is a case where the signal transmission cable 41 accommodated in the cable protection guide member 42 becomes abnormal when the signal transmission cable 41 is in a predetermined bent state in accordance with the moving operation of the imaging head 40. It is considered that a part of the signal transmission cable 41 (for example, the part P shown in FIG. 6) repeatedly bends and stretches due to the 41 being repeatedly deformed, causing a disconnection or the like. Therefore, the diagnostic unit 50e of the control device 50 determines that the output level of the obtained inspection signal is temporarily out of the reference range D when the imaging head 40 passes a specific position. It is determined that there is an abnormality in the signal transmission cable 41 that has transmitted the inspection signal.

  In the state diagnosis (state diagnosis method) in each inspection unit R2 of the component mounting system 1, the diagnosis unit 50e of the control device 50 of the inspection unit R2 first detects that the operator has operated the diagnosis start switch 51. Since the operator can operate the diagnosis start switch 51 not only at the start and end of the board production work but also at any time regardless of the acquisition of the inspection image, the diagnosis unit 50e operates the diagnosis start switch 51. Is always determined (step ST1 shown in FIG. 11), and when it is detected that the operator has operated the diagnosis start switch 51, the head moving mechanism 33 is controlled to operate. Each digital signal transmitted from each of the plurality of signal transmission cables 41 while the photoelectric conversion element 40a is not receiving light while the imaging head 40 is reciprocated several times along the X-axis table 33b with the maximum stroke MS. Is collected as a test signal for a certain period of time (inspection signal sampling step shown in step ST2 shown in FIG. 11).

  The diagnosis unit 50e of the control device 50 performs the diagnosis of the state of the inspection unit R2 based on the result of collecting each digital signal transmitted from each of the plurality of signal transmission cables 41 as an inspection signal for a certain period of time. (Steps ST3 to ST7 below).

  In this diagnosis execution step, first, it is checked whether or not the output level of at least one inspection signal out of a plurality of collected inspection signals is continuously out of the reference range D (shown in FIG. 11). Step ST3). As a result, when the output level of at least one inspection signal is continuously out of the reference range D, it is determined that there is an abnormality in the imaging head 40 and that fact is output via the result output unit 50d. Is displayed on the display device 60 (step ST4 shown in FIG. 11).

  On the other hand, in step ST3, when the output level of all the inspection signals is not continuously deviated from the reference range D, the diagnosis unit 50e then outputs the output level of at least one inspection signal. Is temporarily out of the reference range D (step ST5 shown in FIG. 11). As a result, when the output level of at least one inspection signal is temporarily out of the reference range D, the digital signal whose output level is temporarily out of the reference range D It is determined that there is an abnormality in the signal transmission cable 41 that has output the signal, and that effect is displayed on the display device 60 via the result output unit 50d (step ST6 shown in FIG. 11).

  On the other hand, in step ST5, the diagnosis unit 50e determines that the output level of any test signal is not temporarily out of the reference range D, that is, the output levels of all the test signals are continuous. Is within the reference range D, it is determined that the imaging head 40 and all the signal transmission cables 41 are normal (no abnormality), and that effect is displayed on the display device 60 via the result output unit 50d. (Step ST7 shown in FIG. 11).

  When the operator of the component mounting system 1 displays that the imaging head 40 is abnormal on the result of the state diagnosis of the inspection unit R2 shown through the display device 60, the imaging is performed. When the head 40 is replaced with a normal one and the display device 60 indicates that the signal transmission cable 41 is abnormal, the entire signal transmission cable 41 or the signal transmission cable in which the abnormality is recognized is displayed. Work to replace 41 with a normal one.

  Thus, in the component mounting system 1 and the state diagnosis method in the component mounting system 1 according to the present embodiment, the digital signal transmitted from the signal transmission cable 41 in a state where the photoelectric conversion element 40a of the imaging head 40 is not receiving light. Is collected as a signal for inspection for a certain period of time, and the state diagnosis of the inspection unit R2 is performed based on the obtained result, and the state diagnosis can be performed at any time regardless of the acquisition of the inspection image. Therefore, it is possible to detect the occurrence of a site such as damage in the inspection unit R2 at an early stage. Further, based on the obtained result, it is possible to determine that there is an abnormality in the imaging head 40 when it is detected that the output level of the inspection signal is continuously deviated from the predetermined reference range D. It is easy to specify the same part.

  Provided are a component mounting system and a state diagnosis method in the component mounting system, which can detect the occurrence of a damaged part in an inspection unit at an early stage and easily specify the damaged part.

DESCRIPTION OF SYMBOLS 1 Component mounting system 2 Board | substrate 4 Component 40 Imaging head 40a Photoelectric conversion element 40b A / D converter 41 Signal transmission cable 42 Cable protection guide member 50e Diagnosis part R1 Component mounting part R2 Inspection part D Reference range

Claims (6)

A component mounting unit that mounts the component on the board, and an image that is captured by the imaging head of the component mounted on the board by the component mounting unit is generated, and the component is mounted on the board based on the generated inspection image An inspection unit that inspects a state, and the inspection unit includes a photoelectric conversion element provided in an imaging head, an A / D converter that converts an analog signal output from the photoelectric conversion element into a digital signal, and the imaging A component mounting system comprising a signal transmission cable that is housed in a cable protection guide member that deforms following the movement of the head and transmits a digital signal output from an A / D converter,
A diagnostic unit that samples a digital signal transmitted from the signal transmission cable in a state where the photoelectric conversion element is not receiving light as a test signal for a certain period of time, and diagnoses the state of the test unit based on the obtained result A component mounting system characterized by comprising:   The component according to claim 1, wherein the analog signal output in a state where the photoelectric conversion element is not receiving light is a signal output in a standby state in which the inspection unit does not perform imaging by the imaging head. Implementation system.   The diagnostic unit collects the inspection signal for a predetermined time, and based on the obtained result, the imaging unit detects the state where the output level of the inspection signal is continuously deviated from a predetermined reference range. The component mounting system according to claim 1, wherein it is determined that the head is abnormal. A component mounting unit that mounts the component on the board, and an image that is captured by the imaging head of the component mounted on the board by the component mounting unit is generated, and the component is mounted on the board based on the generated inspection image An inspection unit that inspects a state, and the inspection unit includes a photoelectric conversion element provided in an imaging head, an A / D converter that converts an analog signal output from the photoelectric conversion element into a digital signal, and the imaging A state diagnosis method in a component mounting system comprising: a signal transmission cable that transmits a digital signal output from an A / D converter housed in a cable protection guide member that deforms following the movement of the head. There,
Collecting a digital signal transmitted from the signal transmission cable in a state where the photoelectric conversion element is not receiving light as a test signal for a certain period of time;
A state diagnosis method in the component mounting system, comprising: performing a state diagnosis of the inspection unit based on a result obtained by collecting the inspection signal for a predetermined time.   5. The component according to claim 4, wherein the analog signal output in a state where the photoelectric conversion element is not receiving light is a signal output in a standby state in which the inspection unit does not perform imaging by the imaging head. State diagnosis method in the mounting system.   The inspection signal is sampled for a certain period of time, and as a result, it is determined that there is an abnormality in the imaging head when a state in which the output level of the inspection signal is continuously deviated from a predetermined reference range is detected. The state diagnosis method in the component mounting system according to claim 4 or 5.

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