JP2019175914A - Image management method and image management device - Google Patents

Abstract

To provide an image management method and an image management device capable of investigating the possible cause easily, when deficiency occurs in mounting of a component.SOLUTION: After repeating such a work as a component transfer part collects a component supplied from a component supply part and mounts on a board that is carried in by a board transfer part, a component mounter 20 executes operation for carrying out the board by the board transfer part, and an imaging part captures at least one image of a subject, i.e, each part, a component of the component mounter and the board, while executing the operation. The image is saved in a prescribed storage part. An image management device 50 collects the images stored in the storage part and satisfying prescribed conditions related to mounting of the component into one file, before being saved in the storage part. Furthermore, the files saved in the storage part is retrieved with prescribed conditions as a key, and a file hit by the retrieval is displayed on a screen.SELECTED DRAWING: Figure 1

Description

  The present specification discloses an image management method and an image management apparatus.

  As a component mounting system for producing a board on which a large number of components are mounted, a system in which a screen printing machine, a component mounting machine, a reflow machine, an inspection machine, and the like are connected by a transport device is known. Among these, the component mounter includes a component transfer unit, a component supply unit, a board transfer unit, an imaging unit, and a storage unit, and the component transfer unit collects components supplied from the component supply unit. Then, after repeating the operation of mounting on the substrate carried in by the substrate transport unit, an operation of unloading the substrate by the substrate transport unit is performed. As such a component mounting machine, there is also known a device that captures a component collected by a component collecting unit with a camera and recognizes the position of the component based on the captured image. For example, the component mounter described in Patent Document 1 stores the image when the position of the component cannot be recognized, and displays the stored image. Thereby, it is possible to see an image of the component that cannot be mounted, and to know the suction state at that time.

Japanese Patent No. 2698258

  By the way, by examining the image of the part collected by the part collection unit for the part that has become unmountable, the cause of the unmounting may not be known. For example, there was no particular defect in the parts collected by the parts collection unit, but the reference mark of the board imaged to recognize the board position was dirty and the board position was misrecognized. In some cases, parts cannot be installed. In that case, it is necessary to check the image of the fiducial mark on the board used when mounting a component that cannot be mounted. However, since the fiducial mark image is stored in large quantities, it takes time to find it. There was a problem that it took.

  The present disclosure has been made in order to solve such a problem, and a main object thereof is to easily investigate the cause in the event of incomplete mounting of components.

The image management method of the present disclosure includes:
An image management method used in a component mounting system including a component mounter,
The component mounter includes a component transfer unit, a component supply unit, a substrate transfer unit, and an imaging unit, and the component transfer unit collects components supplied from the component supply unit and transfers the substrate. The operation of unloading the substrate 40 by the substrate transfer unit after repeating the operation of mounting on the substrate 40 carried by the unit, and each part of the component mounter, the component, and the substrate during the operation Taking at least one image of the subject with at least one of 40 as a subject by the imaging unit,
The image is stored in a predetermined storage unit,
The image management method includes:
(A) a step of collecting, in the storage unit, one image that satisfies a predetermined condition related to component mounting among the images stored in the storage unit;
(B) searching for a file stored in the storage unit using the predetermined condition as a key and displaying a file hit by the search on a screen;
Is included.

  In this image management method, images satisfying a predetermined condition related to component mounting among images stored in the storage unit are stored together in a single file and stored in the storage unit using the predetermined condition as a key. Search the saved file and display the file hit by the search on the screen. For this reason, if a defect occurs in the mounting of the component, the cause of the defect can be easily investigated by checking a plurality of images collected in a file that has been searched and hit under the predetermined condition.

The image management apparatus of the present disclosure
An image management apparatus used in a component mounting system including a component mounter,
The component mounter includes a component transfer unit, a component supply unit, a substrate transfer unit, and an imaging unit, and the component transfer unit collects components supplied from the component supply unit and transfers the substrate. The operation of unloading the substrate 40 by the substrate transfer unit after repeating the operation of mounting on the substrate 40 carried by the unit, and each part of the component mounter, the component, and the substrate during the operation Taking at least one image of the subject with at least one of 40 as a subject by the imaging unit,
The image is stored in a predetermined storage unit,
The image management device includes:
A file management unit that stores the images stored in the storage unit that satisfy a predetermined condition related to mounting of components into a single file and that is stored in the storage unit;
A file search unit for searching for a file stored in the storage unit using the predetermined condition as a key and displaying a file hit in the search on the screen;
It is equipped with.

  In this image management method device, the file management unit stores, in the storage unit, images stored in the storage unit that satisfy a predetermined condition related to component mounting into a single file, and the file search unit A file saved in the storage unit is searched using a predetermined condition as a key, and a file hit by the search is displayed on the screen. For this reason, if a defect occurs in the mounting of the component, the cause of the defect can be easily investigated by checking a plurality of images collected in a file that has been searched and hit under the predetermined condition.

FIG. 2 is an explanatory diagram showing an outline of the configuration of a component mounting system 1. An explanatory view showing the outline of the composition of component mounting machine 20. FIG. FIG. 3 is an explanatory diagram showing an electrical connection relationship among a control device 31, a production management server 50, and an image storage server 60 of the component mounter 20. An explanatory view showing the outline of composition of substrate 40. The flowchart of a component mounting process routine. The flowchart of an image aggregation process routine. Explanatory drawing of the file which put together the image used in mounting components into one. The flowchart of an image search process routine. Explanatory drawing of the file which put together the image regarding what was mounted using the reference | standard mark of the board | substrate imaged with the component mounting machine.

  Next, an embodiment of the present invention will be described. FIG. 1 is an explanatory diagram showing an outline of the configuration of the component mounting system 1, FIG. 2 is an explanatory diagram showing an overview of the configuration of the component mounting machine 20, and FIG. FIG. 4 is an explanatory diagram showing an outline of the configuration of the substrate 40, and FIG. 4 is an explanatory diagram showing an electrical connection relationship between the management server 50 and the image storage server 60.

  As shown in FIG. 1, the component mounting system 1 includes a solder paste printing machine 10, a solder paste inspection machine 12, a mounting line 14, a reflow furnace 16, and a board appearance inspection machine 18. The mounting line 14 includes a plurality of component mounting machines 20A to 20D arranged in a line. Each of the machines 10, 12, 20 </ b> A to 20 </ b> D, 16, 18 is connected to the production management server 50 and the image storage server 60 via a communication network (for example, LAN) 2 so as to be capable of bidirectional communication.

  An outline of the operation of each machine constituting the component mounting system 1 will be described. Each machine executes processing according to a production job transmitted from the production management server 50. The production job is information that defines in what order the components of which component type are mounted in which position on the board in each of the component mounting machines 20A to 20D, and how many boards the components are mounted on. . The solder paste printer 10 prints the solder paste in a predetermined pattern on the surface of the board carried in from the upstream side in a predetermined pattern, and carries it out to the solder paste inspection machine 12 on the downstream side. The solder paste inspection machine 12 inspects whether the solder paste is correctly printed on the board that has been carried in. The board on which the solder paste is correctly printed is supplied to the component mounting machine 20A of the mounting line 14 via the intermediate conveyor 13. The plurality of component mounters 20A to 20D arranged on the mounting line 14 perform component mounting on the board in order from the upstream side. The substrate on which all the components have been mounted is supplied from the component mounting machine 20D to the reflow furnace 16 via the intermediate conveyor 15. In the reflow furnace 16, each component is fixed on the substrate in order to solidify after the solder paste on the substrate is melted. The board carried out from the reflow furnace 16 is carried into the board visual inspection machine 18 via the intermediate conveyor 17. The board appearance inspection machine 18 images the board from above with a camera and determines whether the components mounted on the board are good or bad.

  Next, the component mounters 20A to 20D will be described in detail. Since the component mounting machines 20A to 20D have the same configuration, the following description will be made as the component mounting machine 20 with the alphabet at the end omitted. As shown in FIG. 2, the component mounter 20 includes a component supply device 21, a board transfer device 24, a head 25, an XY robot 27, a side camera 28, a mark camera 29, a parts camera 30, And a control device 31 (see FIG. 3).

  The component supply device 21 includes a plurality of feeders 23 arranged on a feeder base 22 formed on the front surface of the main body frame 20a so as to be aligned in the left-right direction (X-axis direction). The feeder 23 is a tape feeder that feeds a carrier tape containing components at a predetermined pitch to a component supply position where the nozzle 26 can pick up. In addition, although not shown in figure, the carrier tape is comprised by the bottom tape in which the cavity (recessed part) was formed with predetermined pitch, and the top film which covers a bottom tape in the state in which components were accommodated in each cavity. The feeder 23 pulls out the carrier tape wound around the reel, feeds it to the component supply position, and peels off the top film from the bottom tape before the component supply position, so that the component is exposed at the component supply position, that is, can be picked up. State.

  The substrate transfer device 24 carries the substrate 40 from the left (upstream side) inlet to a predetermined position and supports the substrate 40 from the back side at the predetermined position. Further, after the components are mounted on the substrate 40, the substrate transport device 24 releases the support of the substrate 40 and carries the substrate 40 out from the right (downstream) outlet.

  The head 25 has a nozzle 26 detachably attached to the lower side. The XY robot 27 can move the head 25 in the XY directions. The head 25 picks up the component sent to the component supply position by the feeder 23 with the nozzle 26 and mounts the component on the substrate 40.

  The side camera 28 is attached to the front side of the head 25 and picks up an image of the component sucked by the nozzle 26 from the side. The mark camera 29 is attached to the rear side of the head 25 and images the reference mark 42 (see FIG. 4) attached to the surface of the substrate 40 from above. The parts camera 30 is provided between the component supply device 21 and the substrate transport device 24, and images the component sucked by the nozzle 26 from below.

  As shown in FIG. 3, the control device 31 is configured as a microprocessor centered on a CPU 32, and includes a ROM 33, an HDD 34, a RAM 35, and an input / output interface 36 in addition to the CPU 32, which are connected via a bus 37. Are electrically connected. In the control device 31, the position signal of the head 25 from the XY robot 27, the image data from the side camera 28, the image data from the mark camera 29, the image data from the parts camera 30, etc. are transmitted via the input / output interface 36. Entered. On the other hand, the control device 31 outputs a control signal to the component supply device 21, a control signal to the substrate transport device 24, a drive signal to the head 25, a drive signal to the XY robot 27, and the like via the input / output interface 36. Is done. The control device 31 is connected to the production management server 50 and the image storage server 60 via the communication network 2 so as to be capable of bidirectional communication.

  As shown in FIG. 4, the substrate 40 has reference marks 42 at two diagonal corners. These reference marks 42 are picked up by the mark camera 29 and used to acquire position information of the substrate 40 when the substrate 40 is supported and positioned from the back side by the substrate transfer device 24. Also, components are mounted in the area indicated by the dotted rectangle in FIG. In the present embodiment, for convenience, the component mounter 20A mounts five components (components Pa to Pe) in the left vertical row, and the component mounter 20B mounts six components in the second vertical row from the left. The component mounter 20C mounts five components in the third vertical row from the left, and the component mounter 20D mounts four components in the fourth vertical row from the left.

  The production management server 50 is, for example, a general-purpose computer, and includes a CPU 51, a ROM 52, an HDD 53, a RAM 54, an input / output interface 55, etc., as shown in FIG. 3, and these are electrically connected via a bus 56. Yes. An input signal is input to the production management server 50 from an input device 57 such as a mouse or a keyboard via an input / output interface 55, and an image signal to the display 58 is input from the production management server 50 via the input / output interface 55. Is output. The HDD 53 stores various types of information related to production jobs.

  The image storage server 60 is, for example, a general-purpose computer, and includes a CPU 61, a ROM 62, an HDD 63, a RAM 64, an input / output interface 65, and the like, as shown in FIG. Yes. An input signal is input to the image storage server 60 from an input device 67 such as a mouse or a keyboard via an input / output interface 65, and an image signal to the display 68 is input from the image storage server 60 via the input / output interface 65. Is output. The HDD 63 stores image data from the side camera 28 of each component mounter 20, image data from the mark camera 29, image data from the part camera 30, and image data from the camera of the board appearance inspection machine 18. .

  Next, the operation of each component mounter 20 will be described. When receiving the production job from the production management server 50, the CPU 32 of the control device 31 of each component mounter 20 executes the component mounting process based on the production job. FIG. 5 is a flowchart of the component mounting process routine.

  When the substrate transport device 24 carries the substrate 40 into a predetermined position and is supported from the back side, the CPU 32 images the two reference marks 42 on the substrate 40 with the mark camera 29 (S100). Specifically, the CPU 32 controls the XY robot 27 so that the two reference marks 42 attached to the substrate 40 are within the field of view of the mark camera 29, and drives the mark camera 29 in this state to The reference mark 42 is imaged. When the two reference marks 42 do not fit in one field of view of the mark camera 29, the two reference marks 42 are imaged separately. The image of the reference mark 42 is stored in the HDD 34 and transmitted to the image storage server 60 and stored in the HDD 63. At that time, the image of the reference mark 42 is attached with information on the board type of the board 40, information for specifying the imaged component mounter 20 (such as a mounter ID), and information for identifying the number of the production job. The

  Subsequently, the CPU 32 calculates the amount of displacement of the substrate 40 (S110). Specifically, the CPU 32 processes the image obtained in step S100 and the amount of positional deviation of the substrate 40 in the XY plane (each amount of deviation in the X-axis direction, the Y-axis direction, and the rotational direction with respect to a predetermined reference position). Is calculated.

  Subsequently, the CPU 32 causes the nozzle 26 to attract the component (S120). Specifically, the CPU 32 controls the feeder 23 so that the first component in the mounting order is sent to the component supply position, and controls the head 25 and the XY robot 27 so that the nozzle 26 comes to the component supply position. Then, a negative pressure is applied to the nozzle 26 to cause the nozzle 26 to adsorb the component.

  Subsequently, the CPU 32 captures an image of the component sucked by the nozzle 26 from the side (S130). Specifically, the CPU 32 drives the side camera 28 and images the part adsorbed by the nozzle 26 from the side. The obtained image is used for confirming that the component is attracted to the nozzle 26, confirming the posture of the component attracted to the nozzle 26, and the like. The captured image is stored in the HDD 34 and transmitted to the image storage server 60 and stored in the HDD 63. At that time, the image includes information on the board type of the board 40 on which the component is mounted, information on which board 40 the board 40 is in the production job, and information on the mounting order of the imaged parts. , Information on the component type of the component, information on the imaging date and time of the image, and the like are added.

  Subsequently, the CPU 32 captures an image of the component sucked by the nozzle 26 from below (S140). Specifically, the CPU 32 controls the XY robot 27 so that the component adsorbed by the nozzle 26 moves above the part camera 30, and drives the part camera 30 to image the component from below. The captured image is stored in the HDD 34 and transmitted to the image storage server 60 and stored in the HDD 63. At that time, the image includes information on the board type of the board 40 on which the component is mounted, information on which board 40 the board 40 is in the production job, and information on the mounting order of the imaged parts. , Information on the component type of the component, information on the imaging date and time of the image, and the like are added.

  Subsequently, the CPU 32 corrects the mounting position on the substrate 40 (S150). Specifically, the CPU 32 processes an image from the lower side of the component sucked by the nozzle 26 and performs a suction displacement amount of the component with respect to the center position of the nozzle 26 (X-axis direction, Y-axis direction with respect to the center position of the nozzle 26, Each shift amount in the rotation direction) is calculated. Then, the CPU 32 corrects the mounting position designated in advance by the production job based on the positional deviation amount of the substrate 40 and the component adsorption deviation amount.

  Subsequently, the CPU 32 mounts a component at the corrected mounting position (S160). Specifically, the CPU 32 controls the head 25 and the XY robot 27 so that the nozzle 26 that sucks the component comes to the corrected mounting position, and applies a positive pressure to the nozzle 26 to release the component from the nozzle 26.

  Subsequently, the CPU 32 determines whether or not the component mounter 20 has mounted all the components to be mounted on the substrate 40 (S170). If there are still components to be mounted, the components in the next mounting order are determined. The process of S120-S160 is performed about. On the other hand, if all the components have been mounted in S170, the CPU 32 ends this routine. When this routine ends, the substrate transport device 24 carries the substrate 40 out of the downstream outlet. Each of the component mounters 20A to 20D performs component mounting on the board 40 by the number of production jobs.

  Next, the operation of the production management server 50 will be described. The CPU 51 of the production management server 50 executes image aggregation processing every time one production job is completed. FIG. 6 is a flowchart of the image aggregation processing routine.

  When starting the image aggregation processing routine, the CPU 51 first selects a component that has not been subjected to image aggregation from among a large number of components mounted in the current production job (S200). Subsequently, the CPU 51 reads an image used for mounting the processing target component (S210), and attaches information for specifying the image to each read image (S220). For example, when the component to be processed is the mth component mounted on the nth board 40 by the component mounter 20A (m and n are natural numbers), the image used to mount the component is the component The image of the reference mark 42 of the nth board 40 captured by the mounting machine 20A, the image from the side of the mth component mounted on the nth board 40 by the component mounting machine 20A, and its components It is an image from below. Therefore, the CPU 51 reads out these images from the HDD 63 of the image storage server 60. Then, the CPU 51 attaches to the image of the reference mark 42 information indicating that the image is the image of the reference mark 42 of the nth board 40 captured by the component mounter 20A. In addition, information indicating that the image is from the side of the m-th component mounted on the nth board 40 by the component mounter 20A is attached to the image from the side of the component. Information indicating that the image is from the bottom of the m-th component mounted on the nth board 40 by the component mounter 20A is attached to the image from below.

  Subsequently, the CPU 51 associates each image with such information with the current processing target component and saves the image in the HDD 63 (S230). For example, the file name of the file 70 is stored in the HDD 63 as “the component mounted on the nth board 40 by the component mounter 20 </ b> A”. FIG. 7 shows an example in which images used for mounting the processing target component are combined into one file. An example of such a file is a PDF file.

  Subsequently, the CPU 51 determines whether or not the image aggregation processing has been performed for all the parts mounted in the current production job (S240). If the determination is negative, the process returns to S200 again. On the other hand, if the determination in step S240 is affirmative, the CPU 51 ends this routine. As a result, for each of all the components mounted by the component mounting machines 20A to 20D constituting the mounting line 14, the images used for mounting the components are collected in one file 70 and stored in the HDD 63. .

  Next, the operation of the production management server 50 after executing the image aggregation process will be described. After executing the image aggregation process, the CPU 51 of the production management server 50 executes the image search process when the operator inputs a search key to instruct the execution of the image search process. FIG. 8 is a flowchart of the image search processing routine.

  When the image search processing routine is started, the CPU 51 first recognizes a search key input by the operator (S300), and searches a large number of files 70 stored in the HDD 63 of the image storage server 60 using the search key (S310). . For example, if the search key is “the component mounted on the nth board 40 by the component mounter 20A”, the file 70 including the search key character string in the file name is searched. Subsequently, the CPU 51 displays the hit file 70 on the display 58 (S320), and ends this routine.

  For example, in the board appearance inspection machine 18, when the component mounting machine 20A determines that the component Pa first mounted on the fifth board 40 is a mounting error, the operator uses the production management server 50 as a search key. Enter “component Pa first mounted on fifth substrate 40 by component mounter 20A”. Then, the CPU 51 of the production management server 50 searches a large number of files 70 stored in the HDD 63 of the image storage server 60, and the file name is “mounted first on the fifth board 40 by the component mounting machine 20A”. The file 70 including the part Pa ″ is searched for, and the file 70 is displayed on the display 58. The operator looks at the image displayed on the display 58 (the file on the foremost side in FIG. 7), so that the image used for mounting the component Pa in which a mounting error has occurred, that is, the board on which the component Pa is mounted. The image of the 40 reference marks 42, the image obtained by imaging the part Pa from the side, and the image obtained by imaging the part Pa from below can be confirmed at a time.

  Here, the correspondence between the constituent elements of the present embodiment and the constituent elements of the present disclosure will be clarified. The production management server 50 of the above-described embodiment corresponds to the image management apparatus of the present disclosure, each of the component mounters 20A to 20D corresponds to a component mounter, and the head 25 and the XY robot 27 correspond to a component transfer unit. The component supply device 21 corresponds to a component supply unit, the substrate transfer device 24 corresponds to a substrate transfer unit, the side camera 28, the mark camera 29, and the part camera 30 each correspond to an imaging unit, and the image storage server 60. The HDD 63 corresponds to a storage unit. The CPU 51 of the production management server 50 corresponds to a file management unit and a file search unit. In the present embodiment, an example of the image management method of the present disclosure is also clarified by describing the operation of the production management server 50 that is an image management apparatus.

  In the present embodiment described above, one file 70 that satisfies a predetermined condition related to component mounting (a condition that the image is used to mount a specific component) among the images stored in the HDD 63. Are stored in the HDD 63, the file 70 stored in the HDD 63 is searched using the condition as a key, and the file 70 hit by the search is displayed on the screen. For this reason, if a defect occurs in the mounting of the component, the cause of the defect can be easily investigated by checking a plurality of images collected in the file 70 searched and hit under the conditions.

  Further, information specifying the image is added to each image collected in the file 70. Therefore, when checking a plurality of images collected in one file 70, the operator can recognize what is captured by each image, for example, by checking information added to each image. .

  It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be implemented in various modes as long as it belongs to the technical scope of the present invention.

  In the above-described embodiment, the condition of an image used for mounting a component is used as a predetermined condition for collecting a plurality of images into one. However, the present invention is not limited to this. For example, a specific component is used. You may use the condition of the image regarding what was mounted using the reference | standard mark 42 of the board | substrate 40 imaged with the mounting machine. FIG. 9 shows an example in which images relating to what is mounted using the fiducial mark 42 of the nth board 40 imaged by the component mounting machine 20 </ b> A are combined into one file 80. In this case, the five components Pa to Pe mounted on the substrate 40 are mounted using the reference mark 42 of the nth substrate 40 imaged by the component mounting machine 20A. Therefore, the image of the reference mark 42 on the board 40 and the images taken from the sides and the lower sides of the parts Pa to Pe are collected in one file 80. As a file name, “reference mark 42 of n-th board 40 imaged by component mounter 20A” is added. If a defect occurs when a component is mounted by the component mounter 20A, the component mounter 20A may be caused by misregistration of the position of the substrate 40 based on the reference mark 42. In such a case, mounting defects occur in all or most of the components mounted using the reference mark 42. This can be easily checked using the file 80 shown in FIG. That is, when there is no problem in the images taken from the side and the bottom of each component, but there is a problem in the reference mark image, the recognition of the position of the substrate 40 based on the reference mark 42 is shifted in the component mounter 20A. It can be determined that this was the cause. Further, as predetermined conditions for combining a plurality of images into one, a condition of an image related to a component mounted with a specific head 25, a condition of an image related to a component mounted with a specific nozzle 26, and a specific feeder 23 A condition of an image related to a component mounted or a condition of an image related to a component mounted by a specific component mounter 20 may be used.

  In the above-described embodiment, an image captured by the camera of the board appearance inspection machine 18 (an image in which the component is reflected) is collected in one file 70 that satisfies the condition of an image used for mounting the component. May be added to the file 70, and an image captured by the camera of the solder paste inspection machine 12 (an image of the solder paste at the position where the component is mounted) may be added to the file 70. The images of the nozzles 26 and the heads 25 used for mounting may be added to the file 70. If the board 40 is too large to fit in one field of view of the camera of the board appearance inspection machine 18 or the solder paste inspection machine 12, the board 40 is divided into a plurality of images. In this case, an image showing the target component or the position where the target component is mounted may be added to the file 70.

  In the above-described embodiment, the image aggregation process is executed after one production job is finished. However, the image aggregation process may be executed every time one board 40 is unloaded from the component mounting system 1. The image aggregation processing may be executed every time one board 40 is carried out from one component mounter 20.

  In the file 70 of FIG. 7 of the above-described embodiment, “a component mounted on the nth board 40 by the component mounter 20A” is added as a file name. “Embodiment mounted on the nth board 40 by the component mounter 20A” may be written in embeddable data (for example, metadata, Exif, etc.).

  In the embodiment described above, the CPU 51 of the production management server 50 executes the image aggregation process and the image search process. However, the CPU 61 of the image storage server 60 may execute the image aggregation process and the image search process. Further, the CPU 31 of the component mounter 20 may execute image aggregation processing and image search processing for a plurality of images stored in the HDD 34.

  In the above-described embodiment, the nozzle 26 is exemplified as a member for collecting components. However, the nozzle 26 is not particularly limited thereto, and may be, for example, a mechanical chuck or an electromagnet.

  In the embodiment described above, the feeder 23 is exemplified as the component supply unit. However, the feeder 23 is not particularly limited thereto, and for example, a tray unit that supplies components on a tray may be adopted.

  In the above-described embodiment, the component mounting order is exemplified as one piece of information for specifying an image. However, instead of or in addition to the component mounting order, a component mounting position may be added.

  The image management method of the present disclosure may be configured as follows.

  In the image management method according to the present disclosure, in the step (a), the files stored in the storage unit that satisfy the predetermined condition are combined into one file and stored in the storage unit. Information specifying the image may be added to each image included in the. In this way, when checking a plurality of images collected in one file, for example, the operator can recognize what is captured by each image by checking the information added to each image. it can.

  In the image management method of the present disclosure, in the step (a), a condition that the image is an image used for mounting a specific component may be used as the predetermined condition. In this way, if there is a deficiency in the mounting of a specific part, the images used to mount the specific part are collected in one file, so the cause of the deficiency can be easily investigated. be able to.

  Here, as the “image used to mount a specific component”, for example, an image obtained by capturing a specific component collected by the component sampling unit from a predetermined direction (for example, below), and a direction different from the predetermined direction Images taken from (for example, the side), images of marks attached to a board on which a specific component is mounted, images of marks attached to a component collection unit that collects a specific component, and component supply for supplying a specific component Part of the image. In addition, when the component mounting system includes an inspection machine that inspects the board carried out from the component mounting machine, and the inspection machine captures an image of the board while performing the inspection and stores it in the storage unit The “image used to mount a specific component” includes, for example, an image captured by an inspection machine and an image of a board on which the specific component is mounted.

  In the image management method of the present disclosure, in the step (a), the predetermined condition is a condition that the image relates to an image mounted using a predetermined mark of the board imaged by a specific component mounter. It may be used. If a deficiency occurs when a component is mounted on a specific component mounter, the component mounter may be caused by misrecognition of the board position based on a predetermined mark on the board. . In such a case, mounting failure occurs in all or most of components mounted using the mark. This can be easily examined.

DESCRIPTION OF SYMBOLS 1 Component mounting system, 2 Communication network, 10 Solder paste printing machine, 12 Solder paste inspection machine, 13, 15, 17 Intermediate conveyor, 14 Mounting line, 16 Reflow furnace, 18 Substrate visual inspection machine, 20, 20A-20D Component mounting Machine, 20a body frame, 21 parts supply device, 22 feeder base, 23 feeder, 24 substrate transfer device, 25 head, 26 nozzle, 27 XY robot, 28 side camera, 29 mark camera, 30 parts camera, 31 control device, 32, 51, 61 CPU, 33, 52, 62 ROM, 34, 53, 63 HDD, 35, 54, 64 RAM, 36, 55, 65 I / O interface, 37, 56, 66 bus, 40 board, 42 Reference mark , 50 Production management server, 57, 67 Input device, 5 , 68 display, 60 image storage server, 70 and 80 files.

Claims (5)

An image management method used in a component mounting system including a component mounter,
The component mounter includes a component transfer unit, a component supply unit, a substrate transfer unit, and an imaging unit, and the component transfer unit collects components supplied from the component supply unit and transfers the substrate. The operation of unloading the substrate by the substrate transfer unit after repeating the operation of mounting on the substrate carried in by the unit, and at least each part of the component mounter, the component, and the substrate during the operation Taking at least one image of the subject as one subject with the imaging unit,
The image is stored in a predetermined storage unit,
The image management method includes:
(A) a step of collecting, in the storage unit, one image that satisfies a predetermined condition related to component mounting among the images stored in the storage unit;
(B) searching for a file stored in the storage unit using the predetermined condition as a key and displaying a file hit by the search on a screen;
Image management method including In the step (a), when the images satisfying the predetermined condition among the images stored in the storage unit are collected in one file and stored in the storage unit, the image included in each file included in the file Add information to identify
The image management method according to claim 1. In the step (a), as the predetermined condition, a condition that an image is used for mounting a specific component is used.
The image management method according to claim 1. In the step (a), as the predetermined condition, a condition is used that is an image related to what is mounted using a predetermined mark of the board imaged by a specific component mounting machine,
The image management method according to claim 1. An image management apparatus used in a component mounting system including a component mounter,
The component mounter includes a component transfer unit, a component supply unit, a substrate transfer unit, and an imaging unit, and the component transfer unit collects components supplied from the component supply unit and transfers the substrate. The operation of unloading the substrate by the substrate transfer unit after repeating the operation of mounting on the substrate carried in by the unit, and at least each part of the component mounter, the component, and the substrate during the operation Taking at least one image of the subject as one subject with the imaging unit,
The image is stored in a predetermined storage unit,
The image management device includes:
A file management unit that stores the images stored in the storage unit that satisfy a predetermined condition related to mounting of components into a single file and that is stored in the storage unit;
A file search unit for searching for a file stored in the storage unit using the predetermined condition as a key and displaying a file hit in the search on the screen;
An image management apparatus comprising:

Images