WO2022219744A1

WO2022219744A1 - Determination device

Info

Publication number: WO2022219744A1
Application number: PCT/JP2021/015439
Authority: WO
Inventors: 英俊川合
Original assignee: 株式会社Fuji
Priority date: 2021-04-14
Filing date: 2021-04-14
Publication date: 2022-10-20
Also published as: JPWO2022219744A1

Abstract

This determination device determines whether a component supplied from a feeder is a component to be supplied, on the basis of side information indicating the sides of the supplied component.

Description

judgment device

The present invention relates to a judgment device for judging whether or not a supply component, which is a component supplied by a supply device, is a component to be supplied.

The following patent document describes a technique for determining whether or not a supply component, which is a component supplied by a supply device, is a component to be supplied.

Japanese Patent Application Laid-Open No. 2007-234669

An object is to appropriately determine whether or not a supply component, which is a component supplied by a supply device, is a component to be supplied.

In order to solve the above-described problems, the present specification provides a method for determining whether or not a supply component, which is a component supplied by a supply device, is a component to be supplied, based on side information, which is information indicating aspects of the supply component. Disclosed is a determination device for determining

In the present disclosure, it is determined whether or not the supplied part is a part to be supplied based on side information that is information indicating the side of the supplied part. This makes it possible to appropriately determine whether or not the part to be supplied is a part to be supplied.

It is a perspective view which shows an electronic component mounting apparatus. It is a perspective view which shows a mounting head. It is a top view which shows a tape-ized component. It is a side view which shows a tape feeder. It is a block diagram which shows a control apparatus. FIG. 10 is a diagram showing a flowchart for determining whether or not a supply component is an electronic component scheduled to be supplied; It is a figure which shows the image of the side surface of an electronic component. 4 is a schematic cross-sectional view of a suction nozzle; FIG. FIG. 4 is a schematic cross-sectional view showing the taped component when the height dimension of the electronic component is detected by a height sensor;

Hereinafter, as a mode for carrying out the present invention, an example of the present invention will be described in detail with reference to the drawings.

An electronic component mounting device 10 is shown in FIG. The electronic component mounting apparatus 10 has one system base 12 and two electronic component mounting machines (hereinafter sometimes abbreviated as "mounters") 16 adjacent to the system base 12. there is The direction in which the mounters 16 are arranged is called the X-axis direction, and the horizontal direction perpendicular to that direction is called the Y-axis direction.

Each mounting machine 16 mainly includes a mounting machine main body 20, a conveying device 22, a mounting head moving device (hereinafter sometimes abbreviated as "moving device") 24, a mounting head 26, a feeding device 28, a control device (FIG. 5). See) 30. The mounting machine main body 20 is composed of a frame 32 and a beam 34 mounted on the frame 32 .

The transport device 22 includes two

conveyor devices

40 and 42. These two

conveyor devices

40 and 42 are arranged on the frame 32 so as to be parallel to each other and extend in the X-axis direction. Each of the two

conveyor devices

40 and 42 conveys the circuit board supported on each

conveyor device

40 and 42 by an electromagnetic motor (see FIG. 5) 46 in the X-axis direction. Also, the circuit board is held at a predetermined position by a board holding device (see FIG. 5) 48 .

The moving device 24 is an XY robot type moving device. The moving device 24 includes an electromagnetic motor (see FIG. 5) 52 for sliding the slider 50 in the X-axis direction and an electromagnetic motor (see FIG. 5) 54 for sliding in the Y-axis direction. A mounting head 26 is attached to the slider 50 , and the mounting head 26 is moved to any position on the frame 32 by the operation of two

electromagnetic motors

52 and 54 .

The mounting head 26 mounts electronic components on the circuit board. The mounting head 26 includes a plurality of rod-shaped mounting units 60, as shown in FIG. The suction nozzle 62 communicates with a positive/negative pressure supply device (see FIG. 5) 66 via negative pressure air and positive pressure air passages. The suction nozzle 62 sucks and holds an electronic component with negative pressure, and releases the held electronic component with positive pressure. A plurality of rod-shaped mounting units 60 are held on the outer peripheral portion of a unit holder 68 at equal angular pitches in a state in which the axial direction is vertical. It extends downward.

Further, the unit holder 68 is intermittently rotated for each installation angle of the mounting unit 60 by the electromagnetic motor (see FIG. 5) 72 of the holder rotating device 70 . As a result, the mounting units 60 are sequentially stopped at one of the stop positions of the plurality of mounting units 60 , which is the elevating station (the most forward station). The mounting unit 60 positioned at the lifting station is lifted and lowered by the electromagnetic motor (see FIG. 5) 76 of the unit lifting device 74 . As a result, the vertical position of the electronic component sucked and held by the suction nozzle 62 is changed. Also, a stop position different from the lifting station is a rotation station, and the mounting unit 60 positioned at that station is rotated by an electromagnetic motor (see FIG. 5) 80 of the rotation device 78 . As a result, the holding posture of the electronic component sucked and held by the suction nozzle 62 is changed.

In addition, a stop position different from the lifting station and the rotation station described above is an imaging station, and a side camera 86 is arranged on the side of the mounting unit 60 positioned at the imaging station. The side camera 86 is arranged so as to face the suction nozzle 62 of the mounting unit 60 located in the imaging station, and images the electronic component held by the suction nozzle 62 from a lateral viewpoint. That is, the side camera 86 images the side surface of the electronic component held by the suction nozzle 62 .

The supply device 28 is a feeder-type supply device, and is arranged at the front end of the frame 32 as shown in FIG. The supply device 28 has a tape feeder 100 . The tape feeder 100 accommodates taped components, which are tapes containing electronic components, in a wound state. Then, the tape feeder 100 feeds the taped components by the operation of the feeding device (see FIG. 5) 102 . Thereby, the feeder-type supply device 28 supplies the electronic components at the supply position by feeding the taped components.

Specifically, the taped component 106 is composed of a carrier tape 108, an electronic component 110, and a top cover tape 112, as shown in FIG. A large number of accommodation recesses 114 and feed holes 116 are formed at equal pitches in the carrier tape 108 , and the electronic components 110 are accommodated in the accommodation recesses 114 . A housing recess 114 housing the electronic component 110 is covered with a top cover tape 112 .

Further, the tape feeder 100 is composed of a tape reel 118, a reel holder 120, and a feeder body 122, as shown in FIG. The taped component 106 is wound around the tape reel 118 , and the reel holder 120 holds the tape reel 118 . The taped component 106 is pulled out from the tape reel 118 held by the reel holder 120 , and the taped component 106 extends to the upper end surface of the feeder body 122 .

A sprocket 124 is built inside the feeder body 122 and engages with a feeding hole 116 formed in the taped component 106 . Then, the sprocket 124 is rotated by the operation of the delivery device 102 , whereby the taped component 106 is delivered in the direction away from the tape reel 118 on the upper end surface of the feeder body 122 . Further, the top cover tape 112 is peeled off from the carrier tape 108 of the taped component 106 by a peeling device (not shown). As a result, the receiving recesses 114 of the taped components 106 are sequentially released at the tip of the upper end surface of the feeder body 122 , and the electronic components 110 are taken out from the released receiving recesses 114 by the suction nozzles 62 .

Also, the tape feeder 100 is detachable from a tape feeder holder 130 fixedly provided at the front end of the frame 32 . Specifically, the tape feeder holding table 130 includes a holding table base 132 provided on the upper surface of the frame 32 and a holding table side frame 136 erected at the end of the holding table base 132 on the side closer to the conveying device 22 . It consists of A plurality of slide grooves 138 are formed in the holding table base 132 so as to extend in the Y-axis direction. A rail 140 is attached to the lower edge of the feeder body 122 of the tape feeder 100 . By fitting the rails 140 into the slide grooves 138 , the tape feeder 100 can be slid on the upper surface of the holder base 132 in the direction of approaching or separating from the holder side frames 136 .

A connection terminal 144 is provided on the holding base side frame 136 . On the other hand, a connector 146 is provided on the side wall surface of the tape feeder 100 opposite to the reel holder 120 . Then, an operator fits the rails 140 of the tape feeder 100 into the slide grooves 138 of the tape feeder holding table 130 and slides the tape feeder 100 in a direction approaching the holding table side frame 136 , so that the connector 146 is It is connected to the connection terminal 144 .

In addition, in the tape feeder 100, when the number of electronic components that can be supplied decreases due to the supply of electronic components, the electronic components are replenished by splicing. Splicing is to connect the leading end of a new taped component 106 to the trailing end of the taped component 106 used in the tape feeder 100 with a splicing tape (see FIG. 9) 150. replenishment is done. The tape feeder 100 also incorporates a proximity sensor (see FIG. 5) 152 , and the splicing tape 150 is detected by the proximity sensor 152 . As a result, the position of the splicing tape 150 is detected, and the timing at which the electronic component is supplied from the new taped component 106 connected by splicing can be specified.

The control device 30 also has a controller 160, a plurality of drive circuits 162, a control circuit 164, and a memory 165, as shown in FIG. A plurality of drive circuits 162 are connected to the

electromagnetic motors

46 , 52 , 54 , 72 , 76 , 80 , substrate holding device 48 , positive/negative pressure supply device 66 and delivery device 102 . The controller 160 includes a CPU, ROM, RAM, etc., is mainly a computer, and is connected to a plurality of drive circuits 162 . Accordingly, the controller 160 controls the operations of the conveying device 22, the moving device 24, and the like. Controller 160 is also connected to image processing device 166 . The image processing device 166 is a device for processing image data captured by the side camera 86 . Thereby, the controller 160 acquires various information from the imaging data. The controller 160 is also connected to the display device 170 via the control circuit 164 . An arbitrary image is thereby displayed on the display device 170 . In addition, controller 160 is connected to memory 165 . Thereby, the controller 160 acquires various information stored in the memory 165 and causes the memory 165 to store the various information.

In the mounting machine 16, the mounting operation is performed by the mounting head 26 on the circuit board transported to the transport device 22 by the above-described configuration. Specifically, the circuit board is transported to the work position by the transport device 22, and is fixedly held by the substrate holding device 48 at that position. Further, the tape feeder 100 feeds the taped components 106 by the feeding device 102 and supplies the electronic components 110 at the feed position. Mounting head 26 then moves above the supply position of electronic component 110 , and sucks and holds electronic component 110 with suction nozzle 62 . Subsequently, the mounting head 26 moves above the circuit board and mounts the held electronic component 110 on the circuit board.

Thus, in the mounting machine 16, the electronic component 110 supplied by the tape feeder 100 is mounted on the circuit board. Then, when the number of electronic components 110 that can be supplied from the tape feeder 100 becomes small, the electronic components are replenished by splicing as described above. Alternatively, the tape feeder 100 is removed from the tape feeder holding base 130 and a tape feeder 100 different from the tape feeder 100 is mounted on the tape feeder holding base 130 . That is, the tape feeder is replaced. Alternatively, after the tape feeder 100 is detached from the tape feeder holding base 130 and the tape reel 118 accommodated in the tape feeder 100 is replaced with a new tape reel, the tape feeder 100 is attached to the tape feeder holding base 130. is attached to the

However, during splicing, a worker may splice a taped component that is different from the taped component to be spliced. That is, when the taped component of the A component is accommodated in the tape feeder, the worker may splice the taped component of the B component onto the taped component of the A component. Also, when the operator replaces the tape feeder, there is a case where a tape feeder different from the tape feeder to be replaced is mounted on the tape feeder holding base 130 . In other words, there is a case where the operator replaces the tape feeder containing the taped component of the A component with the tape feeder containing the taped component of the B component. Further, when the operator replaces the tape reel, there is a case where the tape reel different from the tape reel to be replaced is set in the tape feeder. In other words, there is a case where the operator replaces the tape reel on which the taped component of the A component is wound with the tape reel on which the taped component of the B component is wound.

In such a case, the A component should be mounted on the circuit board, but the B component is mounted, resulting in a defective board. In view of this, in the mounting machine 16, the electronic parts supplied from the new taped parts by the execution of splicing, or the electronic parts supplied from the tape feeder after replacement and the tape reel are the electronic parts to be supplied. It is determined whether or not it is a part.

Specifically, when the tape feeder and tape reel are replaced, the tape feeder 100 is attached to and detached from the tape feeder holder 130 as described above. At this time, the connector 146 of the tape feeder 100 is attached/detached to/from the connection terminal 144 of the tape feeder holding base 130 . Therefore, as shown in FIG. 6, it is determined whether or not the tape feeder has been attached or detached (S10). At this time, when the tape feeder is being attached/detached (S10: YES), when the electronic component supplied from the tape feeder is held by the mounting head 26 immediately after the tape feeder is attached/detached, the mounting An electronic component held by the head 26 is imaged by the side camera 86 (S12). As a result, the side surface of the electronic component 110 fed from the tape feeder and tape reel after replacement is imaged by the side camera 86 as shown in FIG.

Also, if the tape feeder has not been attached or detached in S10 (S10: NO), it is determined whether or not the splicing tape has been detected by the proximity sensor 152 (S14). Then, if the splicing tape is detected by the proximity sensor 152 (S14: YES), since splicing is being executed, the mounting head 26 picks up the electronic component supplied from the new taped component connected by splicing. When held, the electronic component held by the mounting head 26 is imaged by the side camera 86 (S12). As a result, the side surface of the electronic component 110 supplied from the new taped component by the execution of splicing is imaged by the side camera 86 as shown in FIG.

In this way, when the side camera 86 captures the side surface of the electronic component supplied from the tape feeder or tape reel after replacement or the electronic component supplied from the new taped component by execution of splicing, the controller 160 Imaging data is analyzed. At this time, the controller 160 calculates the vertical length dimension of the side surface of the electronic component, that is, the height dimension of the electronic component, based on the imaging data. The memory 165 also stores height dimensions of electronic components to be supplied (hereinafter referred to as “dimensions of components to be supplied”), and the controller 160 acquires the dimensions of the components to be supplied from the memory 165 . Then, the controller 160 compares the height dimension of the electronic component calculated based on the imaging data (hereinafter referred to as “calculated component dimension”) with the planned supply component dimension, and determines the calculated component dimension and the planned supply component dimension. are the same. That is, it is determined whether or not the electronic component held by the mounting head 26 is the electronic component to be supplied (S16).

Then, when the calculated component size and the supply-scheduled component size are the same, it is determined that the electronic component held by the mounting head 26 is the supply-scheduled electronic component (S16: YES). It should be noted that not only when the calculated component dimensions and the supply-scheduled component dimensions are completely the same, but also when the difference between the calculated component dimensions and the supply-scheduled component dimensions is within a preset difference, the calculated component dimensions and the supply-scheduled component dimensions It is determined that the planned part dimensions are the same. In this way, when it is determined that the electronic component held by the mounting head 26 is the electronic component to be supplied, the electronic component is mounted on the circuit board (S20). Then, the mounting position of the electronic component on the circuit board, the identification information of the circuit board, the identification information of the electronic component, and the imaging data of the electronic component imaged in S12 are associated and stored in the memory 165. (S22).

In addition, if the difference between the size of the component to be calculated and the size of the component to be supplied is larger than a preset difference in S16, it is determined that the electronic component held by the mounting head 26 is not the electronic component to be supplied (S16 : NO). When it is determined that the electronic component held by the mounting head 26 is not the electronic component to be supplied, the mounting operation by the mounting machine 16 is stopped, and an error screen is displayed on the display device 170 (S18). The error screen displays a comment to the effect that the electronic component held by the mounting head 26 is different from the electronic component to be supplied. As a result, the operator recognizes that the electronic component supplied from the tape feeder is not the electronic component to be supplied, and by confirming the taped components stored in the tape feeder, the wrong component is attached to the circuit board. Wearing can be prevented.

Further, for example, if the height dimension of the electronic component to be supplied is the same as the height dimension of the electronic component of the taped component that was erroneously accommodated in the tape feeder, it is held by the mounting head 26 in S16. It is determined that the electronic component currently being supplied is the electronic component scheduled to be supplied (S16: YES). In such a case, the electronic component of the taped component that has been erroneously accommodated in the tape feeder is mounted on the circuit board (S20). , the identification information of the electronic parts, and the imaging data are associated with each other and stored in the memory 165 (S22). As a result, it becomes possible to trace the cause of the defective substrate by utilizing the imaging data as traceability information.

In addition, in the above embodiment, the calculated component dimensions are calculated based on the imaging data of the side surface of the electronic component, but the calculated component dimensions may be calculated by other methods. For example, the component dimension to be calculated may be calculated based on the height of the suction nozzle 62 when the electronic component is held. Specifically, the suction nozzle 62 is composed of a suction tube 180 and a holder 182, as shown in FIG. The holder 182 has a generally cylindrical shape, and the adsorption tube 180 is slidably held inside the holder 182 . The adsorption tube 180 is urged in a direction to extend from the inside of the holder 182 by an elastic force of an elastic body (not shown). Therefore, when the electronic component 110 is held by the suction tube 180 , the suction tube 180 slides toward the inside of the holder 182 against the elastic force of the elastic body. It suppresses the load when contacting the A contact sensor 186 is arranged inside the holder 182 , and when the suction tube 180 holds the electronic component 110 , it slides toward the inside of the holder 182 to contact the contact sensor 186 . do. Therefore, by specifying the height dimension of the suction nozzle 62 at the timing when the contact of the suction tube 180 is detected by the contact sensor 186, the height dimension of the electronic component 110, that is, the calculation component dimension can be calculated. . That is, when the suction nozzle holds the electronic component 110 at the supply position of the tape feeder, the suction nozzle is lowered by the operation of the electromagnetic motor 76 of the unit elevating device 74, and the suction nozzle comes into contact with the electronic component. At 186 contact of the adsorption tube 180 is detected. At this time, the rotation angle of the electromagnetic motor 76 is detected by an encoder (not shown) at the timing when the adsorption tube 180 contacts the contact sensor 186 . Then, based on the rotation angle of the electromagnetic motor 76, the height of the suction nozzle, specifically, the height of the tip of the suction tube 180 is calculated. Also, the height of the supply position of the electronic component is set in advance. Therefore, by subtracting the height of the supply position of the electronic component from the height of the tip of the adsorption tube 180, the component dimension to be calculated is calculated. Then, by comparing the computed part dimensions calculated in this way with the part dimensions to be supplied stored in the memory 165, it is also possible to determine whether the electronic parts supplied by the tape feeder are the electronic parts to be supplied. You can decide whether or not

Also, a height sensor may be used to detect the dimensions of the calculation parts. Specifically, as shown in FIG. 9, a height sensor 190 is arranged above the taped component 106 conveyed on the upper surface of the tape feeder 100 . The height sensor 190 is a reflective detection sensor, and detects the height of the object by irradiating the object with a laser beam and receiving the laser beam reflected by the object. Therefore, the height sensor 190 detects the height dimension of the leading electronic component 110 of the new taped component 106 connected by the splicing tape 150 . By comparing the calculated component dimensions detected by the height sensor 190 with the planned supply component dimensions stored in the memory 165, the electronic component supplied by the tape feeder is the electronic component to be supplied. It is possible to determine whether there is

It should be noted that in the above embodiment, the suction nozzle 62 is an example of a suction nozzle. Tape feeder 100 is an example of a supply device. Electronic component 110 is an example of a supply component. Controller 160 is an example of a determination device. Height sensor 190 is an example of a sensor.

In addition, the present invention is not limited to the above embodiments, and can be implemented in various aspects with various modifications and improvements based on the knowledge of those skilled in the art. Specifically, for example, in the above embodiment, the size of the component to be supplied is stored in the memory 165, but the size of the component to be supplied may be calculated based on the imaging data. Specifically, for example, the electronic component supplied from the tape feeder is imaged by the side camera 86 before the tape feeder is attached or detached, or before splicing is performed. Then, by calculating the vertical length dimension of the electronic component, that is, the height dimension, based on the imaging data of the electronic component, the dimension of the component to be supplied can be calculated.

Also, in the above embodiment, after the tape feeder is attached and detached, or after splicing is performed, it is determined whether the electronic component supplied from the tape feeder is the electronic component to be supplied. On the other hand, whether or not the electronic component supplied from the tape feeder is the electronic component to be supplied may be determined at an arbitrary timing regardless of whether the tape feeder is attached or detached, splicing is executed, or the like. For example, it may be determined whether or not the electronic component to be supplied first from the tape feeder during the mounting operation on the circuit board is the electronic component to be supplied.

In the above embodiment, it is determined whether or not the electronic component supplied from the tape feeder is the electronic component to be supplied. It may be determined whether or not the electronic component supplied from the mold supply device or the like is the electronic component to be supplied. In addition, it may be determined whether or not various parts other than electronic parts are to be supplied.

In the above embodiment, the length dimension in the vertical direction of the side surface of the electronic component, that is, the height dimension is calculated based on the imaging data of the side surface of the electronic component. A length dimension, that is, a width dimension may be calculated, or a length dimension of a predetermined portion of the side surface of the electronic component may be calculated. Further, color information indicating the color of the electronic component may be calculated based on image data of the side surface of the electronic component, without being limited to the length dimension. Furthermore, character information written on the side surface of the electronic component may be calculated using OCR, OCV, etc., based on image data of the side surface of the electronic component. Then, based on the length dimension, color information, character information, etc. of the electronic component, it may be determined whether or not the electronic component supplied from the supply device is the electronic component to be supplied.

62: Suction nozzle 100: Tape feeder (supply device) 110: Electronic parts (supplied parts) 160: Controller (judgment device) 190: Height sensor (sensor)

Claims

A judgment device for judging whether or not a supply component, which is a component supplied by the supply device, is a component to be supplied, based on side information, which is information indicating a side of the supply component.
The vertical length dimension of the side surface of the supply component is acquired as the side information, and whether or not the supply component is a component to be supplied is determined based on the vertical length dimension of the side surface of the supply component. 2. The determination device according to claim 1, for determining.
3. The determination device according to claim 2, wherein the length dimension in the vertical direction of the side surface of the supply component calculated based on the height of the suction nozzle when the suction nozzle holds the supply component is acquired as the side surface information. .
The determination device according to claim 2, wherein the length dimension in the vertical direction of the side surface of the supply component detected by a sensor is acquired as the side surface information.
2. The method according to claim 1, wherein imaging data of a side surface of said supply component is obtained as said side surface information, and whether or not said supply component is a component to be supplied is determined based on the imaging data of said side surface of said supply component. judgment device.
The determination device according to claim 5, wherein when the supply component is attached to the board, image data of the side surface of the supply component and identification information of the board are stored in association with each other.