JP4220288B2

JP4220288B2 - Electronic component mounting method and electronic component mounting apparatus

Info

Publication number: JP4220288B2
Application number: JP2003098601A
Authority: JP
Inventors: 和義大山
Original assignee: Hitachi High Tech Instruments Co Ltd
Current assignee: Hitachi High Tech Instruments Co Ltd
Priority date: 2003-04-01
Filing date: 2003-04-01
Publication date: 2009-02-04
Anticipated expiration: 2023-04-01
Also published as: JP2004311469A

Description

【０００１】
【発明の属する技術分野】
本発明は、装着ヘッドに設けられプリント基板上に付されたマークを撮像する基板認識カメラと、駆動源により平面方向に移動可能な装着ヘッドの吸着ノズルにより部品供給ユニットから電子部品を取出して吸着保持した電子部品を撮像する部品認識カメラとを備え、両カメラの撮像結果に基づき認識処理装置で認識処理してプリント基板上に装着する電子部品装着方法及び電子部品装着装置に関する。
【０００２】
【従来の技術】
プリント基板の位置決め位置を把握するため、この基板の対角位置に認識マークを設け、それらを認識処理することにより、正しい位置への電子部品装着を試みているのが一般的である（例えば、特開平１１−３４６０９８号公報参照）。しかしながら、プリント基板のパターン印刷の局部的な伸縮も存在するので、装着精度を必要とするファインピッチＱＦＰ部品等の装着に対しては、その装着位置の近傍に、全体マークとは別に、専用の個々基板認識マークを設けて、ピンポイントでの装着補正を可能にしている。
【０００３】
【特許文献】
特開平１１−３４６０９８号公報
【０００４】
【発明が解決しようとする課題】
しかし、従来ではシーケンスの効率を重視して、個々基板認識マークの撮像及び認識処理は、基板位置決めが完了した後、電子部品の装着を開始する前に全ての個々基板認識マークに対して一括処理（一括撮像及び認識処理）しているが、駆動領域の大きいガントリー型装着装置等においては、装置の発熱等による熱膨張の影響も無視できず、各装着直前での個々基板認識が好ましいとの見方もあるが、大きな電子部品を吸着した状態では、その電子部品自身が基板認識カメラの視野を覆ってしまい、認識が出来ない等の問題があった。
【０００５】
そこで本発明は、個々基板認識を行ううえで、基板認識カメラ視野と吸着部品外形の干渉の判定を行い、干渉がないと判定された場合には部品供給ユニットから電子部品を吸着して取出した後、個々基板認識を実行しプリント基板上に装着し、また干渉があると判定された場合には個々基板認識を実行した後、前記部品供給ユニットから電子部品を吸着して取出してプリント基板上に装着するようにし、できるだけ電子部品装着直前での個々基板認識を行うようにすることを目的とする。
【０００６】
【課題を解決するための手段】
このため第１の発明は、装着ヘッドに設けられプリント基板上に付されたマークを撮像する基板認識カメラと、駆動源により平面方向に移動可能な装着ヘッドの吸着ノズルにより部品供給ユニットから電子部品を取出して吸着保持した電子部品を撮像する部品認識カメラとを備え、両カメラの撮像結果に基づき認識処理装置で認識処理してプリント基板上に装着する電子部品装着方法において、前記プリント基板上に電子部品が装着される位置の近傍に付されたマークを認識する個々基板認識の実行タイミングを判定し、前記吸着ノズルに吸着される電子部品が前記基板認識カメラの視野を覆うと判定された場合には個々基板認識を実行した後、前記部品供給ユニットから電子部品を吸着して取出してプリント基板上に装着することを特徴とする。
【０００７】
第２の発明は、装着ヘッドに設けられプリント基板上に付されたマークを撮像する基板認識カメラと、駆動源により平面方向に移動可能な装着ヘッドの吸着ノズルにより部品供給ユニットから電子部品を取出して吸着保持した電子部品を撮像する部品認識カメラとを備え、両カメラの撮像結果に基づき認識処理装置で認識処理してプリント基板上に装着する電子部品装着方法において、前記プリント基板上に電子部品が装着される位置の近傍に付されたマークを認識する個々基板認識の実行タイミングを判定し、前記吸着ノズルに吸着される電子部品が前記基板認識カメラの視野を覆うことがないと判定された場合には前記部品供給ユニットから電子部品を吸着して取出した後、個々基板認識を実行しプリント基板上に装着することを特徴とする。
【０００８】
第３の発明は、装着ヘッドに設けられプリント基板上に付されたマークを撮像する基板認識カメラと、駆動源により平面方向に移動可能な装着ヘッドの吸着ノズルにより部品供給ユニットから電子部品を取出して吸着保持した電子部品を撮像する部品認識カメラとを備え、両カメラの撮像結果に基づき認識処理装置で認識処理してプリント基板上に装着する電子部品装着方法において、前記プリント基板上に電子部品が装着される位置の近傍に付されたマークを認識する個々基板認識の実行タイミングを判定し、前記吸着ノズルに吸着される電子部品が前記基板認識カメラの視野を覆うと判定された場合には個々基板認識を実行した後、前記部品供給ユニットから電子部品を電子部品を吸着して取出してプリント基板上に装着し、覆うことがないと判定された場合には前記部品供給ユニットから電子部品を吸着して取出した後、個々基板認識を実行しプリント基板上に装着することを特徴とする。
【０００９】
また第４の発明は、装着ヘッドに設けられプリント基板上に付されたマークを撮像する基板認識カメラと、駆動源により平面方向に移動可能な装着ヘッドの吸着ノズルにより部品供給ユニットから電子部品を取出して吸着保持した電子部品を撮像する部品認識カメラとを備え、両カメラの撮像結果に基づき認識処理装置で認識処理してプリント基板上に装着する電子部品装着装置において、前記プリント基板上に電子部品が装着される位置の近傍に付されたマークを認識する個々基板認識の実行タイミングを判定する判定手段と、該判定手段により前記吸着ノズルに吸着される電子部品が前記基板認識カメラの視野を覆うと判定された場合には個々基板認識を実行した後、前記部品供給ユニットから電子部品を吸着して取出してプリント基板上に装着するように制御する制御手段とを設けたことを特徴とする。
【００１０】
第５の発明は、装着ヘッドに設けられプリント基板上に付されたマークを撮像する基板認識カメラと、駆動源により平面方向に移動可能な装着ヘッドの吸着ノズルにより部品供給ユニットから電子部品を取出して吸着保持した電子部品を撮像する部品認識カメラとを備え、両カメラの撮像結果に基づき認識処理装置で認識処理してプリント基板上に装着する電子部品装着装置において、前記プリント基板上に電子部品が装着される位置の近傍に付されたマークを認識する個々基板認識の実行タイミングを判定する判定手段と、該判定手段により前記吸着ノズルに吸着される電子部品が前記基板認識カメラの視野を覆うことがないと判定された場合には前記部品供給ユニットから電子部品を吸着して取出した後、個々基板認識を実行しプリント基板上に装着するように制御する制御手段とを設けたことを特徴とする。
【００１１】
第６の発明は、装着ヘッドに設けられプリント基板上に付されたマークを撮像する基板認識カメラと、駆動源により平面方向に移動可能な装着ヘッドの吸着ノズルにより部品供給ユニットから電子部品を取出して吸着保持した電子部品を撮像する部品認識カメラとを備え、両カメラの撮像結果に基づき認識処理装置で認識処理してプリント基板上に装着する電子部品装着装置において、前記プリント基板上に電子部品が装着される位置の近傍に付されたマークを認識する個々基板認識の実行タイミングを判定する判定手段と、該判定手段により前記吸着ノズルに吸着される電子部品が前記基板認識カメラの視野を覆うと判定された場合には個々基板認識を実行した後、前記部品供給ユニットから電子部品を電子部品を吸着して取出してプリント基板上に装着し、覆うことがないと判定された場合には前記部品供給ユニットから電子部品を吸着して取出した後、個々基板認識を実行しプリント基板上に装着するように制御する制御手段とを設けたことを特徴とする。
【００１２】
更に第７の発明は、第１乃至第６の発明において、前記個々基板認識の実行タイミングの判定は、電子部品の装着順序毎の装着位置などを示す装着データに個々基板認識の指定がある場合に行われることを特徴とする。
【００１３】
また第８の発明は、第１乃至第６の発明において、前記装着ヘッドには複数の吸着ノズルが設けられていることを特徴とする。
【００１４】
【発明の実施の形態】
以下図に基づき、本発明の実施の形態を説明するが、図１は電子部品装着装置１の平面図で、該装置１の基台２上には種々の電子部品を夫々その部品取出し部（部品吸着位置）に１個ずつ供給する部品供給ユニット３が複数並設されている。対向するユニット３群の間には、供給コンベア４、位置決め部５及び排出コンベア６が設けられている。供給コンベア４は上流より受けたプリント基板Ｐを前記位置決め部５に搬送し、位置決め部５で図示しない位置決め機構により位置決めされた該基板Ｐ上に電子部品が装着された後、排出コンベア６に搬送される。
【００１５】
８Ａ、８ＢはＸ方向に長い一対のビームであり、夫々Ｙ軸モータ９の駆動によりネジ軸１０を回転させ、左右一対のガイド１１に沿ってプリント基板Ｐや部品供給ユニット３の部品取出し部（部品吸着位置）上方を個別にＹ方向に移動する。
【００１６】
各ビーム８Ａ、８Ｂにはその長手方向、即ちＸ方向にＸ軸モータ１２によりガイド(図示せず)に沿って移動する装着ヘッド７Ａ、７Ｂが夫々設けられている。各装着ヘッド７Ａ又は７Ｂには２本の吸着ノズル１７Ａ、１７Ｂ又は１７Ｃ、１７Ｄを上下動させるための上下軸モータ１４が２個搭載され、また鉛直軸周りに回転させるためのθ軸モータ１５が２個搭載されている。したがって、２個の装着ヘッド７Ａ、７Ｂの各吸着ノズルはＸ方向及びＹ方向に移動可能であり、垂直線回りに回転可能で、かつ上下動可能となっている。
【００１７】
１６は部品位置認識用の部品認識カメラで、前記各吸着ノズル１７Ａ、１７Ｂ、１７Ｃ、１７Ｄに対応して４個設けられ、電子部品が吸着ノズルに対してどれだけ位置ずれして吸着保持されているかＸＹ方向及び回転角度につき、位置認識するために電子部品を撮像するが、それぞれ同時に２個の電子部品を撮像可能である。１８、１８は種々の吸着ノズルを収納するノズルストッカで、最大１０本収納可能であるが９本収納している。
【００１８】
１９、１９は基板認識カメラで、前記装着ヘッド７Ａ、７Ｂにそれぞれ設けられ、プリント基板Ｐに付された認識マークの位置を認識するために該マークを撮像する。
【００１９】
図２は本電子部品装着装置１の制御ブロック図であり、便宜上Ｘ軸モータ１２、Ｙ軸モータ９、θ軸モータ１５及び上下軸モータ１４、部品認識カメラ１６、基板認識カメラ１９などは、各１個のみ図示して以下説明する。
【００２０】
本装着装置１の電子部品装着に係る動作を統括制御する制御部としてのＣＰＵ２１、記憶装置としてのＲＡＭ（ランダム・アクセス・メモリ）２２及びＲＯＭ（リ−ド・オンリー・メモリ）２３などから構成されている。前記ＲＡＭ２２には、図３に示すように、電子部品の装着順序（Ｐ−ＮＯで示す）毎にプリント基板Ｐ内でのＸ方向、Ｙ方向及び角度位置情報や、ＦＤＲ番号（各部品供給ユニット３の配置番号）情報や、「ペアリング」の指定を行うデータ「Ｓ」情報や、装着点毎の個々基板認識の有無の指定データ「Ｖ」情報等から成る装着データが格納されている。また、前記ＲＡＭ２２には、図５に示すような部品種毎に部品ライブラリデータ（Ｘ方向及びＹ方向のサイズなどのデータ）が格納されており、更には吸着ノズル及び基板認識カメラの位置なども格納されている。
【００２１】
即ち、「ペアリング」の指定を行うデータ「Ｓ」情報において、「Ｓ」が「２」と指定されると左右の吸着ノズル１７Ａ、１７Ｂ又は１７Ｃ、１７Ｄに個別に電子部品を吸着させて２ステップ分をまとめて処理し（吸着優先指定）、「Ｓ」に「２」と入力されたステップと次のステップが「ペアリング処理（組として処理）」され、また「Ｓ」が「１」と指定されると左右の吸着ノズル１７Ａ、１７Ｂ又は１７Ｃ、１７Ｄ間のピッチと部品供給ユニット３配置のピッチが同じ場合に２ステップ分処理されるもので吸着動作が左右の吸着ノズル１７Ａ、１７Ｂ又は１７Ｃ、１７Ｄが同時に実施され（同時吸着指定）、「Ｓ」に「１」と入力されたステップと次のステップが「ペアリング」処理されるものである。
【００２２】
そして、ＦＤＲ番号の百の位の判定で、自動的に２つのビーム８Ａ、８Ｂの処理が振り分けられる。即ち、１００番台はＡビーム８Ａが処理し、２００番台はＢビーム８Ｂが処理する。
【００２３】
また、装着点毎の個々基板認識の指定データである「Ｖ」情報について説明すると、「Ｖ」が「００」と指定されると個々基板認識は無しで、「０１」と指定されると１点の個々基板認識を行い、「０２」と指定されると２点の個々基板認識を行うように処理され、得られた認識処理結果に基づき装着点に対しＸＹθ位置補正が行われることとなる。この個々基板認識は、基板パターン印刷の局部的な伸縮を吸収したり、ＸＹビーム系精度の自浄作用に効果がある。
【００２４】
装着座標等を示す前記装着データとは別に、各装着ステップ（Ｐ−ＮＯで示す）毎に装着点毎の個々基板認識の指定データである「Ｖ」情報に呼応する形で、図４の認識座標データが準備される。「Ｖ−ＮＯ」は装着ステップである「Ｐ−ＮＯ」と同じ（装着ステップと対に生成される）であり、「Ｖ」は装着データの「Ｖ」データと同じで、「Ｘ１（ｍｍ）」は装着個々基板認識マーク（電子部品のプリント基板Ｐ上の装着すべき位置の近傍に付されている。）の１点目のＸ座標で、「Ｙ１（ｍｍ）」は装着個々基板認識マークの１点目のＹ座標、「Ｆ１」は装着個々基板認識１点目のマークコードデータ、「Ｘ２（ｍｍ）」は装着個々基板認識マークの２点目のＸ座標、[Ｘ]、「Ｙ２（ｍｍ）」は装着個々基板認識マークの２点目のＹ座標、「Ｆ２」は装着個々基板認識２点目のマークコードデータである。
【００２５】
「Ｆ１」「Ｆ２」の装着個々基板認識２点目のマークコードデータは、対象となる認識マークの諸元を示すもので、「マーク形状」、「マークサイズ」、「認識領域」、「明暗極性（画像取り込時のマーク像の明暗極性）」といった項目で構成される。マークコードデータが「０１」であれば、例えばマーク形状が円形で、このマークの外形が２ｍｍ等であることを示す。
【００２６】
尚、ここで装着エリアは、プリント基板Ｐ上に電子部品を装着する場合に各装着ヘッド７Ａ、７Ｂがバッティング（衝突）しないように、いずれかの装着ヘッドのみが装着できるようにいずれかの装着ヘッドのみが取得できるものである。
【００２７】
そして、ＣＰＵ２１は前記ＲＡＭ２２に記憶されたデータに基づき、前記ＲＯＭ２３に格納されたプログラムに従い、電子部品装着装置１の部品装着動作に係る動作を統括制御する。即ち、ＣＰＵ２１は、駆動回路２５を介して前記Ｘ軸モータ１２の駆動を、駆動回路２８を介して前記Ｙ軸モータ９の駆動を、また駆動回路３２を介して前記θ軸モータ１５の駆動を、更に駆動回路３０を介して前記上下軸モータ１４の駆動を制御している。
【００２８】
３３はインターフェース２４を介して前記ＣＰＵ２１に接続される部品認識処理部で、前記部品認識カメラ１６により撮像して取込まれた画像の認識処理が該認識処理部３３にて行われ、ＣＰＵ２１に処理結果が送出される。即ち、ＣＰＵ２１は、部品認識カメラ１６に撮像された画像を認識処理（位置ずれ量の算出など）するように指示を部品認識処理部３３に出力すると共に、認識処理結果を認識処理部３３から受取るものである。
【００２９】
即ち、前記部品認識処理部３３の認識処理により位置ずれ量が把握されると、その結果がＣＰＵ２１に送られ、ＣＰＵ２１はビーム８Ａ又は８ＢがＹ軸モータ９の駆動によりＹ方向に、装着ヘッド７Ａ又は７ＢがＸ軸モータ１２の駆動によりＸ方向に移動させることにより、またθ軸モータ１５によりθ回転させ、Ｘ，Ｙ方向及び鉛直軸線回りへの回転角度位置の補正がなされるものである。
【００３０】
１３は基板認識処理部で、前記基板認識カメラ１９により撮像して取込まれた画像の認識処理が該基板認識処理部１３にて行われ、ＣＰＵ２１に処理結果が送出される。即ち、ＣＰＵ２１は、基板認識カメラ１９に撮像された画像を認識処理（位置ずれ量の算出など）するように指示を基板認識処理部１３に出力すると共に、認識処理結果を基板認識処理部１３から受取るものである。
【００３１】
即ち、前記基板認識処理部１３の認識処理により位置ずれ量が把握されると、その結果がＣＰＵ２１に送られ、ＣＰＵ２１はビーム８Ａ又は８ＢがＹ軸モータ９の駆動によりＹ方向に、装着ヘッド７Ａ又は７ＢがＸ軸モータ１２の駆動によりＸ方向に移動させることにより、またθ軸モータ１５によりθ回転させ、Ｘ，Ｙ方向及び鉛直軸線回りへの回転角度位置の補正が可能となる。
【００３２】
尚、上述の基板認識処理動作は、夫々のビームによる最初の電子部品装着前に限り、行なわれる。それは、プリント基板Ｐの特性ばかりか、各ビーム、各装着ヘッドなどの特性を部品装着の位置補正に反映するためである。
【００３３】
３４はキーボードドライバー３５及びインターフェース２４を介して前記ＣＰＵ２１に接続される入力手段としてのキーボードで、３６は認識部品画像等の画像を表示するモニターである。尚、前記入力手段としてのキーボード３４に代えてタッチパネルなどの入力手段でも良い。
【００３４】
以上の構成により、以下特に図６及び図７に基づき動作について説明する。先ず、プリント基板Ｐが図示しないコンベアにより上流装置より供給コンベア４を介して位置決め部５に搬送され、位置決め機構により位置決め固定される。
【００３５】
そして、装着データにおける先頭ステップ「Ｐ−ＮＯ」（以下、「装着ステップ番号」という）０００１のデータを切出すが、「Ｓ」情報に「２」とあるので２ステップ分をまとめて処理（吸着優先指定）することとなる。即ち、ＲＡＭ２２に格納されたプリント基板Ｐの装着すべきＸＹ座標位置、鉛直軸線回りへの回転角度位置及びＦＤＲ番号（各部品供給ユニット３の配置番号）等が指定された装着データに従い、装着ステップ番号０００１及び０００２の電子部品の部品種に対応した吸着ノズルが装着すべき電子部品を所定の部品供給ユニット３から吸着して取出すこととなる。
【００３６】
この場合、先ず装着ヘッド７Ａに装備している吸着ノズル１７Ａ、１７Ｂを電子部品の指定吸着ノズルに合わせるために吸着ノズルの交換を必要な場合には実施する。即ち、各装着ヘッド７Ａがノズルストッカ１８の所定の吸着ノズル上方に位置するよう移動するが、Ｙ方向は駆動回路２８によりＹ軸モータ９、９が駆動して一対のガイド１１に沿ってビーム８Ａが移動し、Ｘ方向は駆動回路２５によりＸ軸モータ１２が駆動して装着ヘッド７Ａが移動し、ノズルの交換動作を行う。
【００３７】
次に、装着ステップ番号０００１及び０００２の個々基板認識の有無をＣＰＵ２１が判定し、「Ｖ」情報が「００」であるので指定がないので、個々基板認識処理をすることなく、ＣＰＵ２１により以下のように制御される。即ち、初めに装着ヘッド７Ａの吸着ノズル１７Ａは装着ステップ番号０００１の装着すべき電子部品を収納する部品供給ユニット３上方に位置するよう移動するが、Ｙ方向は駆動回路２８によりＹ軸モータ９が駆動して一対のガイド１１に沿ってビーム８Ａが移動し、Ｘ方向は駆動回路２５によりＸ軸モータ１２が駆動して装着ヘッド７Ａが移動し、既に所定の供給ユニット３は駆動されて部品吸着位置にて部品が取出し可能状態にあるため、駆動回路３０により上下軸モータ１４が駆動して前記ノズル１７Ａが下降して電子部品を吸着して取出し、吸着ノズル１７Ｂはステップ番号０００２の装着すべき電子部品を収納する部品供給ユニット３上方に位置するよう移動して電子部品を吸着して取出す。
【００３８】
更に、部品認識カメラ１６上方に吸着ノズル１７Ａ、１７Ｂが移動して、吸着保持された各電子部品を撮像し、部品認識処理部３３で認識処理し、その結果に基づき、再びビーム８Ａ及び装着ヘッド７Ａを移動させ、吸着ノズル１７Ａ、１７Ｂが部品認識結果を加味して位置ずれを補正しつつ、それぞれ電子部品をプリント基板Ｐ上に装着する。
【００３９】
次に、ＲＡＭ２２の先行実施フラグをオフし、次の装着ステップ番号０００３のデータを切出して、未装着ステップがあるので、個々基板認識実行タイミングの判定をＣＰＵ２１が行う。この判定は、個々基板認識の指定がある場合には基板認識カメラ視野と吸着部品外形の干渉のチェック、即ち吸着対象部品の部品ライブラリデータ（図５参照）を参照し、その最外形寸法（Ｘ，Ｙ）を元にして、吸着ノズルのセンターと部品領域(吸着ノズル及び電子部品の回転で占有する最大エリア)が基板認識カメラ１９視野を塞いでしまわないかをチェックし、干渉しないと判定されると先行実施フラグをオフし、干渉すると判定されると次ステップ番号の個々基板認識の先行実施（電子部品吸着前の先行認識）を決定し先行実施フラグをオンする。
【００４０】
上記の判定は、吸着ノズル１７Ａ、１７Ｂに吸着保持される電子部品が基板認識カメラ１９の視野を塞いでしまうか否かを判断するもので、判定に際してはＲＡＭ２２に格納されている吸着ノズル１７Ａ、１７Ｂ及び基板認識カメラ１９の位置なども考慮される。
【００４１】
なお、ＸＹ型ガントリー多機能マウンタはより高速な装置が要求され、ビームに搭載する装着ヘッドは如何に軽く、小さくするかが求められ、更に装置が扱う対象部品の守備範囲も大きく拡大して、微小電子部品から大型の電子部品（コネクタなど）まで多岐に及ぶため、装着ヘッドに搭載される基板認識カメラ位置を吸着ノズルと大きく離せば、装着ヘッドが肥大化して高速機動性を損なってしまうため、前述したような基板認識カメラ視野と吸着部品外形の干渉の判定が必要となるものである。
【００４２】
しかし、「Ｖ」情報が「００」であるので個々基板認識の指定がないので、個々基板認識処理をせずに、先行実施フラグがオフであるので、以下のようにＣＰＵ２１により制御される。即ち、装着ヘッド７Ａに装備している吸着ノズル１７Ａ、１７Ｂを電子部品の指定吸着ノズルに合わせるために必要な場合には吸着ノズルの交換を実施し、前述の如く、次に装着ヘッド７Ａは上昇すると共に吸着ノズル１７Ａ、１７Ｂが装着ステップ番号０００３及び０００４の装着すべき電子部品を収納する部品供給ユニット３上方に夫々移動し、同じく前記ノズル１７Ａ、１７Ｂが下降して電子部品を吸着し取出す。更に、部品認識カメラ１６上方に吸着ノズル１７Ａ、１７Ｂが移動して、吸着保持された電子部品を撮像し、部品認識処理部３３で認識処理し、その結果に基づき、再びビーム８Ａ及び装着ヘッド７Ａを移動させ、吸着ノズル１７Ａ、１７Ｂが部品認識結果を加味して位置ずれを補正しつつ当該電子部品をプリント基板Ｐ上に装着する。
【００４３】
次に、ＲＡＭ２２の先行実施フラグをオフし、次の装着ステップ番号０００５のデータを切出して、未装着ステップがあるので、個々基板認識実行タイミングの判定をＣＰＵ２１が行う。
【００４４】
即ち、「Ｖ」情報が「０２」で２点の個々基板認識を行う指定があり、基板認識カメラ視野と吸着部品外形の干渉のチェックがなされ、干渉しないと判定され部品吸着が先行可能であれば先行実施フラグをオフし、以下のようにＣＰＵ２１により制御される。即ち、前述したように、必要な場合には吸着ノズルの交換を実施し、「Ｓ」が「１」と指定されておりペアリング処理、即ち左右の吸着ノズル１７Ａ、１７Ｂの吸着動作が同時に実施され（同時吸着指定）、吸着ノズル１７Ａ、１７Ｂが装着ステップ番号０００５及び０００６の装着すべき電子部品を収納する部品供給ユニット３上方に夫々移動して、同じく前記ノズル１７Ａ、１７Ｂが下降して電子部品を吸着し取出し、部品認識カメラ１６で吸着保持された電子部品を撮像し、部品認識処理部３３で認識処理し、更に「Ｖ」情報が「０２」であるので、電子部品吸着後の２点の個々基板認識を行うように処理される。即ち、図４の認識座標データに基づき、ＣＰＵ２１は基板認識カメラ１９に装着ステップ番号０００５の電子部品のプリント基板Ｐ上の装着すべき位置の近傍に付された個々基板認識マーク（図示せず）を撮像させ、基板認識処理部３３に認識処理させ、これらの認識結果に基づき、再びビーム８Ａ及び装着ヘッド７Ａを移動させ、吸着ノズル１７Ａ、１７Ｂが部品認識結果に個々基板認識結果を加味して位置ずれを補正しつつ当該電子部品をプリント基板Ｐ上に装着する。
【００４５】
また、前記判定により、吸着される両部品の外形がともに大きいか一方が大きくて基板認識カメラ視野が確保できず干渉があるものと判定されて部品吸着が先行できなければ、次ステップ番号の個々基板認識の先行実施が決定されて先行実施フラグがオンとなる。従って、電子部品吸着前に先行認識を行うべく２点の個々基板認識が実施され、即ち基板認識カメラ１９で装着ステップ番号０００５及び０００６の電子部品のプリント基板Ｐ上の装着すべき位置の近傍に付された各２つの個々基板認識マーク（図示せず）を撮像し、基板認識処理部３３で認識処理する。そして、必要な場合には吸着ノズルの交換を実施し、前述の如く、「Ｓ」が「１」と指定されておりペアリング処理、即ち左右の吸着ノズル１７Ａ、１７Ｂの吸着動作が同時に実施され（同時吸着指定）、吸着ノズル１７Ａ、１７Ｂが装着ステップ番号０００５及び０００６の装着すべき電子部品を収納する部品供給ユニット３上方に夫々移動して、同じく前記ノズル１７Ａ、１７Ｂが下降して電子部品を吸着し取出す。更に、部品認識カメラ１６上方に吸着ノズル１７Ａ、１７Ｂが移動して、吸着保持された電子部品を撮像し、部品認識処理部３３で認識処理し、その結果に基づき、再びビーム８Ａ及び装着ヘッド７Ａを移動させ、吸着ノズル１７Ａ、１７Ｂが基板認識結果に部品認識結果を加味して位置ずれを補正しつつ当該電子部品をプリント基板Ｐ上に装着する。
【００４６】
次に、ＲＡＭ２２の先行実施フラグをオフし、次の装着ステップ番号０００７のデータを切出して、未装着ステップがあるので、個々基板認識実行タイミングの判定をＣＰＵ２１が行い、この判定に基づき、装着ステップ番号０００５と同様に処理され、電子部品をプリント基板に装着する。
【００４７】
また、ステップ番号０００９以降も、前述したように、同様に処理される。以上のように、ビーム８Ａ、８Ｂは、それぞれ自分の装着指定部品を順次装着する。その場合、各々のビームが、自分で処理するステップ番号を割出し、動作を行う。この際に、各ビームは、部品装着を完了した時点で、自身が次に部品吸着をするステップ番号の個々基板認識指定の有無をチェックし、認識指定ありの場合には、それらの部品の諸元データ（部品ライブラリデータ）から吸着時の部品外形と基板認識カメラ１９視野との干渉有無をチェックし、干渉が生ずると判定した場合には、部品吸着動作をする前、即ち装着動作を完了した後、装着領域を空けることなく、次ステップ番号の個々基板認識を部品吸着なしの状態で先行実施する。
【００４８】
従って、これにより装着直前に近い基板認識タイミングが実現され、外乱による不慮の基板ズレ等に追従できると共に、適切なシーケンスを確立することができる。
【００４９】
尚、個々基板認識マーク（電子部品のプリント基板Ｐ上の装着すべき位置の近傍に付されている。）を基板認識カメラ１９、１９で撮像して、基板認識処理部１３で認識処理し、この基板認識結果に部品認識結果を加味して位置ずれを補正しつつ電子部品を装着する構成にしているが、この個々基板認識マークの認識処理をせず（個々基板認識マークが付されていない場合の電子部品の場合）に装着する場合にはプリント基板の例えば対角線上に付された全体認識マークを認識処理して、この基板認識結果に部品認識結果を加味して位置ずれを補正しつつプリント基板Ｐ上に電子部品を装着するものである。
【００５０】
以上のように本発明の実施態様について説明したが、上述の説明に基づいて当業者にとって種々の代替例、修正又は変形が可能であり、本発明はその趣旨を逸脱しない範囲で前述の種々の代替例、修正又は変形を包含するものである。
【００５１】
【発明の効果】
以上のように本発明は、各装着直前での個々基板認識が好ましいが、各吸着ノズルに吸着保持される電子部品が基板認識カメラの視野を塞いでしまうか否かを判定し、覆うことがないと判定された場合には部品供給ユニットから電子部品を吸着して取出した後、個々基板認識を実行してプリント基板上に装着し、また塞いでしまうと判定された場合には電子部品の吸着前に個々基板認識を実行するようにしたから、極力電子部品装着直前での個々基板認識ができるようにすると共に、大きな電子部品であっても、確実に基板認識カメラで撮像及び認識処理できる。
【図面の簡単な説明】
【図１】電子部品装着装置の平面図である。
【図２】電子部品装着装置の制御ブロック図である。
【図３】装着データを示す図である。
【図４】認識座標データを示す図である。
【図５】部品ライブラリデータを示す図である。
【図６】概略フローチャートを示す図である。
【図７】個々基板認識実行タイミング判定ルーチンを示す図である。
【符号の説明】
１電子部品装着装置
３部品供給ユニット
７Ａ、Ｂ装着ヘッド
８Ａ、Ｂビーム
１６部品認識カメラ
１９基板認識カメラ
１７Ａ、Ｂ、Ｃ、Ｄ吸着ノズル
２１ＣＰＵ
２２ＲＡＭ[0001]
BACKGROUND OF THE INVENTION
The present invention picks up an electronic component from a component supply unit by a substrate recognition camera that images a mark provided on the printed circuit board provided on the mounting head and a mounting head that can move in a plane direction by a driving source. The present invention relates to an electronic component mounting method and an electronic component mounting apparatus that include a component recognition camera that images a held electronic component, and that performs recognition processing by a recognition processing device based on the imaging results of both cameras and mounts the image on a printed board.
[0002]
[Prior art]
In order to grasp the positioning position of the printed circuit board, a recognition mark is provided at a diagonal position of the circuit board, and it is common to attempt to mount an electronic component at a correct position by performing recognition processing (for example, (See JP-A-11-346098). However, since there is local expansion and contraction of pattern printing on the printed circuit board, for the mounting of fine pitch QFP parts and the like that require mounting accuracy, there is a dedicated area in the vicinity of the mounting position, apart from the whole mark. Individual board recognition marks are provided to enable pinpoint mounting correction.
[0003]
[Patent Literature]
Japanese Patent Laid-Open No. 11-346098
[0004]
[Problems to be solved by the invention]
However, in the past, focusing on the efficiency of the sequence, imaging and recognition processing of individual board recognition marks are performed collectively for all individual board recognition marks after board positioning is completed and before mounting of electronic components is started. (Batch imaging and recognition processing) However, in a gantry-type mounting device with a large driving area, the influence of thermal expansion due to heat generation of the device cannot be ignored, and individual substrate recognition immediately before each mounting is preferable. Although there is also a way of viewing, there is a problem that when a large electronic component is attracted, the electronic component itself covers the field of view of the board recognition camera and cannot be recognized.
[0005]
Therefore, the present invention determines the interference between the substrate recognition camera field of view and the suction component outer shape when performing individual substrate recognition. If it is determined that there is no interference, the electronic component is sucked out from the component supply unit. After that, the individual board recognition is executed and mounted on the printed circuit board. If it is determined that there is interference, the individual board recognition is executed, and then the electronic component is sucked out from the component supply unit and is taken on the printed circuit board. It is an object of the present invention to perform individual board recognition immediately before mounting electronic components as much as possible.
[0006]
[Means for Solving the Problems]
For this reason, the first invention provides an electronic component from a component supply unit by a substrate recognition camera that images a mark provided on the printed circuit board provided on the mounting head, and a suction nozzle of the mounting head that can be moved in a plane direction by a driving source. A component recognition camera that picks up and picks up and holds the electronic component picked up and held on the printed circuit board by the recognition processing device based on the imaging results of both cameras and mounted on the printed circuit board. When the execution timing of individual substrate recognition for recognizing a mark attached near the position where the electronic component is mounted is determined, and it is determined that the electronic component sucked by the suction nozzle covers the field of view of the substrate recognition camera In the method, after the individual substrate recognition is performed, the electronic components are sucked out from the component supply unit and mounted on the printed circuit board. That.
[0007]
According to a second aspect of the present invention, an electronic component is taken out from a component supply unit by a substrate recognition camera that images a mark provided on a printed circuit board provided on the mounting head, and a mounting head suction nozzle that is movable in a plane direction by a drive source. In the electronic component mounting method, the electronic component is mounted on the printed circuit board by performing recognition processing with a recognition processing device based on the imaging results of both cameras and mounting the printed circuit board on the printed circuit board. The execution timing of the individual substrate recognition for recognizing the mark attached in the vicinity of the position where the sensor is mounted is determined, and it is determined that the electronic component sucked by the suction nozzle does not cover the field of view of the substrate recognition camera. In this case, the electronic component is picked up and taken out from the component supply unit, and then the individual substrate recognition is executed and mounted on the printed circuit board. That.
[0008]
According to a third aspect of the present invention, an electronic component is taken out from a component supply unit by a substrate recognition camera that images a mark provided on a printed circuit board provided on the mounting head and a mounting head suction nozzle that is movable in a plane direction by a drive source. In the electronic component mounting method, the electronic component is mounted on the printed circuit board by performing recognition processing with a recognition processing device based on the imaging results of both cameras and mounting the printed circuit board on the printed circuit board. When the execution timing of the individual substrate recognition for recognizing the mark attached in the vicinity of the position where is mounted is determined, and it is determined that the electronic component sucked by the suction nozzle covers the field of view of the substrate recognition camera After executing the individual board recognition, the electronic parts can be picked up from the parts supply unit by picking up the electronic parts, mounted on the printed board, and covered. After removal by adsorption of the electronic component from the component supply unit when the Most is determined, characterized in that mounted on a printed circuit board that perform particular substrate recognition.
[0009]
According to a fourth aspect of the present invention, an electronic component is received from a component supply unit by a substrate recognition camera that images a mark provided on a printed circuit board provided on the mounting head, and a mounting head suction nozzle that is movable in a plane direction by a drive source. A component recognition camera that picks up and picks up and holds the electronic component picked up and held on the printed circuit board by the recognition processing device based on the imaging results of both cameras. A determination unit that determines an execution timing of individual substrate recognition for recognizing a mark attached in the vicinity of a position where the component is mounted, and an electronic component that is attracted to the suction nozzle by the determination unit has a field of view of the substrate recognition camera. If it is determined that the cover is to be covered, individual board recognition is performed, and then electronic components are picked up and taken out from the component supply unit. Characterized in that a control means for controlling to mount to.
[0010]
According to a fifth aspect of the present invention, an electronic component is taken out from a component supply unit by a substrate recognition camera that images a mark provided on the printed circuit board provided on the mounting head and a mounting head that can move in a plane direction by a driving source. In an electronic component mounting apparatus that includes a component recognition camera that captures an electronic component that has been sucked and held, and that performs recognition processing on a printed circuit board based on the imaging results of both cameras, the electronic component is mounted on the printed circuit board. Determining means for recognizing the execution timing of individual substrate recognition for recognizing a mark attached in the vicinity of the position where the sensor is mounted, and an electronic component sucked by the suction nozzle by the determination means covers the field of view of the substrate recognition camera If it is determined that there is no problem, the electronic components are picked up and taken out from the component supply unit, and then the individual substrate is recognized and printed Characterized in that a control means for controlling to mounted on a plate.
[0011]
According to a sixth aspect of the present invention, an electronic component is taken out from a component supply unit by a substrate recognition camera that images a mark provided on the printed circuit board provided on the mounting head and a mounting head that can move in a plane direction by a driving source. In an electronic component mounting apparatus that includes a component recognition camera that captures an electronic component that has been sucked and held, and that performs recognition processing on a printed circuit board based on the imaging results of both cameras, the electronic component is mounted on the printed circuit board. Determining means for recognizing the execution timing of individual substrate recognition for recognizing a mark attached in the vicinity of the position where the sensor is mounted, and an electronic component sucked by the suction nozzle by the determination means covers the field of view of the substrate recognition camera If it is determined that the electronic component is recognized, the electronic component is picked up from the component supply unit and picked up. Control means for controlling to mount on the printed board after performing individual board recognition after picking up and taking out the electronic component from the component supply unit when it is determined that the board is mounted and not covered And is provided.
[0012]
Further, according to a seventh aspect of the present invention, in the first to sixth aspects of the invention, the determination of the execution timing of the individual substrate is performed when the individual substrate recognition is specified in the mounting data indicating the mounting position for each mounting order of the electronic components. It is characterized by being performed.
[0013]
An eighth invention is characterized in that, in the first to sixth inventions, the mounting head is provided with a plurality of suction nozzles.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
The embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus 1. Various electronic components are placed on a base 2 of the apparatus 1. A plurality of component supply units 3 that supply one by one to the component adsorption position) are arranged side by side. A supply conveyor 4, a positioning unit 5, and a discharge conveyor 6 are provided between the groups of opposing units 3. The supply conveyor 4 conveys the printed circuit board P received from the upstream to the positioning unit 5, and after the electronic components are mounted on the substrate P positioned by a positioning mechanism (not shown) by the positioning unit 5, the conveyance is conveyed to the discharge conveyor 6. Is done.
[0015]
8A and 8B are a pair of beams that are long in the X direction, each of which rotates a screw shaft 10 by driving a Y-axis motor 9, and along the pair of left and right guides 11, a component take-out portion ( The component suction position) is individually moved in the Y direction.
[0016]
Each of the beams 8A and 8B is provided with mounting heads 7A and 7B that move along the guide (not shown) by the X-axis motor 12 in the longitudinal direction, that is, the X direction. Each mounting head 7A or 7B is equipped with two vertical axis motors 14 for vertically moving the two suction nozzles 17A, 17B or 17C, 17D, and a θ-axis motor 15 for rotating around the vertical axis. Two are installed. Accordingly, the suction nozzles of the two mounting heads 7A and 7B can move in the X direction and the Y direction, can rotate around the vertical line, and can move up and down.
[0017]
Reference numeral 16 denotes a component recognition camera for component position recognition, which is provided with four corresponding to each of the suction nozzles 17A, 17B, 17C, and 17D. The electronic component is imaged for recognizing the position in the XY direction and the rotation angle, but two electronic components can be simultaneously imaged. Nos. 18 and 18 are nozzle stockers for storing various suction nozzles, and a maximum of 10 can be stored, but 9 are stored.
[0018]
Reference numerals 19 and 19 denote board recognition cameras, which are provided on the mounting heads 7A and 7B, respectively, and pick up images of the marks in order to recognize the positions of the recognition marks attached to the printed board P.
[0019]
FIG. 2 is a control block diagram of the electronic component mounting apparatus 1. For convenience, the X-axis motor 12, the Y-axis motor 9, the θ-axis motor 15 and the vertical axis motor 14, the component recognition camera 16, the board recognition camera 19, etc. Only one is illustrated and described below.
[0020]
A CPU 21 serving as a control unit that performs overall control of operations related to electronic component mounting of the mounting apparatus 1, a RAM (random access memory) 22 as a storage device, a ROM (read only memory) 23, and the like. ing. As shown in FIG. 3, the RAM 22 stores information on the X direction, Y direction and angular position in the printed circuit board P and FDR numbers (each component supply unit) for each electronic component mounting order (indicated by P-NO). 3, information “S” information for designating “pairing”, designation data “V” information for the presence / absence of individual substrate recognition for each placement point, and the like are stored. The RAM 22 stores component library data (data such as sizes in the X direction and Y direction) for each component type as shown in FIG. 5, and also the positions of the suction nozzle and the substrate recognition camera. Stored.
[0021]
That is, in the data “S” information for designating “pairing”, when “S” is designated as “2”, the left and right suction nozzles 17A, 17B or 17C, 17D individually suck the electronic components to 2 Steps are processed together (adsorption priority designation), the step input as “2” in “S” and the next step are “paired (processed as a set)”, and “S” is “1”. If the pitch between the left and right suction nozzles 17A, 17B or 17C, 17D and the pitch of the component supply unit 3 arrangement are the same, processing is performed for two steps, and the suction operation is performed by the left and right suction nozzles 17A, 17B or 17C and 17D are performed at the same time (simultaneous suction designation), and “Pairing” processing is performed on the step where “1” is input to “S” and the next step.
[0022]
Then, the processing of the two beams 8A and 8B is automatically distributed by determining the hundreds of the FDR number. That is, the A beam 8A processes the 100th series, and the B beam 8B processes the 200th series.
[0023]
Further, the “V” information that is the designation data for individual substrate recognition for each mounting point will be described. When “V” is designated as “00”, there is no individual substrate recognition, and “01” is designated as “01”. The individual board recognition of the point is performed, and when “02” is designated, the processing is performed so as to perform the two-point individual board recognition, and the XYθ position correction is performed on the mounting point based on the obtained recognition processing result. . This individual substrate recognition absorbs the local expansion and contraction of the substrate pattern printing and is effective for the self-cleaning action of the XY beam system accuracy.
[0024]
In addition to the mounting data indicating the mounting coordinates and the like, the recognition shown in FIG. 4 is performed in response to “V” information, which is designation data for individual substrate recognition for each mounting point at each mounting step (indicated by P-NO). Coordinate data is prepared. “V-NO” is the same as the mounting step “P-NO” (generated in a pair with the mounting step), “V” is the same as the “V” data of the mounting data, and “X1 (mm)” "Is the X coordinate of the first point of the mounting individual board recognition mark (applied in the vicinity of the position where the electronic component is to be mounted on the printed board P), and" Y1 (mm) "is the mounting individual board recognition mark. Y coordinate of the first point, “F1” is the mark code data of the first point of mounting individual board recognition, “X2 (mm)” is the X coordinate of the second point of the mounting individual board recognition mark, [X], “Y2” “(Mm)” is the Y coordinate of the second point of the mounted individual substrate recognition mark, and “F2” is the mark code data of the second point of mounted individual substrate recognition.
[0025]
The mark code data at the second point of recognition of the individual boards recognized with “F1” and “F2” indicate the specifications of the target recognition mark. “Mark shape”, “Mark size”, “Recognition area”, “Light / darkness” "Polarity (brightness / darkness of mark image at the time of image capture)". If the mark code data is “01”, for example, the mark shape is circular and the outer shape of the mark is 2 mm or the like.
[0026]
Here, the mounting area is any mounting so that only one mounting head can be mounted so that the mounting heads 7A and 7B do not batting (collision) when electronic components are mounted on the printed circuit board P. It can only be acquired by the head.
[0027]
Then, the CPU 21 controls the operation related to the component mounting operation of the electronic component mounting apparatus 1 according to the program stored in the ROM 23 based on the data stored in the RAM 22. That is, the CPU 21 drives the X-axis motor 12 via the drive circuit 25, drives the Y-axis motor 9 via the drive circuit 28, and drives the θ-axis motor 15 via the drive circuit 32. Further, the driving of the vertical axis motor 14 is controlled via a drive circuit 30.
[0028]
Reference numeral 33 denotes a component recognition processing unit connected to the CPU 21 via the interface 24. An image captured by the component recognition camera 16 is recognized by the recognition processing unit 33 and processed by the CPU 21. The result is sent out. That is, the CPU 21 outputs an instruction to the component recognition processing unit 33 so as to perform recognition processing (calculation of positional deviation amount, etc.) on the image captured by the component recognition camera 16 and receives the recognition processing result from the recognition processing unit 33. Is.
[0029]
That is, when the amount of positional deviation is grasped by the recognition processing of the component recognition processing unit 33, the result is sent to the CPU 21, and the CPU 21 drives the mounting head 7A in the Y direction by driving the Y-axis motor 9 with the beam 8A or 8B. Alternatively, 7B is moved in the X direction by driving the X-axis motor 12, and is rotated by θ by the θ-axis motor 15, so that the rotational angular position about the X, Y direction and the vertical axis is corrected.
[0030]
A substrate recognition processing unit 13 recognizes an image captured and captured by the substrate recognition camera 19 at the substrate recognition processing unit 13 and sends the processing result to the CPU 21. That is, the CPU 21 outputs an instruction to the substrate recognition processing unit 13 to perform recognition processing (such as calculation of a positional deviation amount) on the image captured by the substrate recognition camera 19, and the recognition processing result is output from the substrate recognition processing unit 13. It is what you receive.
[0031]
That is, when the amount of displacement is grasped by the recognition processing of the substrate recognition processing unit 13, the result is sent to the CPU 21. The CPU 21 drives the mounting head 7A in the Y direction by driving the beam 8A or 8B by the Y-axis motor 9. Alternatively, 7B is moved in the X direction by driving the X axis motor 12, and is rotated by θ by the θ axis motor 15, so that the rotational angular position about the X, Y direction and the vertical axis can be corrected.
[0032]
The above-described substrate recognition processing operation is performed only before the first electronic component mounting by each beam. This is because not only the characteristics of the printed circuit board P but also the characteristics of each beam, each mounting head, etc. are reflected in the position correction for component mounting.
[0033]
Reference numeral 34 denotes a keyboard as input means connected to the CPU 21 via the keyboard driver 35 and the interface 24. Reference numeral 36 denotes a monitor for displaying an image such as a recognition component image. Note that an input unit such as a touch panel may be used instead of the keyboard 34 as the input unit.
[0034]
With the above configuration, the operation will be described below with reference to FIGS. 6 and 7 in particular. First, the printed circuit board P is conveyed from the upstream device to the positioning unit 5 via the supply conveyor 4 by a conveyor (not shown), and is positioned and fixed by the positioning mechanism.
[0035]
Then, the data of the first step “P-NO” (hereinafter referred to as “mounting step number”) 0001 in the mounting data is cut out. However, since “2” is included in the “S” information, two steps are collectively processed (sucking). Priority). That is, according to the mounting data in which the XY coordinate position to be mounted on the printed circuit board P stored in the RAM 22, the rotation angle position around the vertical axis, the FDR number (arrangement number of each component supply unit 3), and the like are specified. The electronic components to be mounted by the suction nozzles corresponding to the component types of the electronic components having the numbers 0001 and 0002 are picked up and taken out from the predetermined component supply unit 3.
[0036]
In this case, first, when the suction nozzles 17A and 17B equipped on the mounting head 7A are aligned with the designated suction nozzles of the electronic components, the suction nozzles are exchanged. That is, each mounting head 7A moves so as to be positioned above a predetermined suction nozzle of the nozzle stocker 18. However, in the Y direction, the Y-axis motors 9 and 9 are driven by the driving circuit 28 along the pair of guides 11 and the beam 8A. In the X direction, the X-axis motor 12 is driven by the drive circuit 25 and the mounting head 7A is moved to perform the nozzle replacement operation.
[0037]
Next, the CPU 21 determines whether or not each of the mounting step numbers 0001 and 0002 is recognized. Since the “V” information is “00”, there is no designation, so the CPU 21 performs the following without performing the individual substrate recognition process. To be controlled. That is, first, the suction nozzle 17A of the mounting head 7A moves so as to be positioned above the component supply unit 3 that stores the electronic component to be mounted of the mounting step number 0001, but the Y-axis motor 9 is driven by the drive circuit 28 in the Y direction. When driven, the beam 8A moves along the pair of guides 11, and in the X direction, the X-axis motor 12 is driven by the drive circuit 25 to move the mounting head 7A, and the predetermined supply unit 3 is already driven to pick up the components. Since the parts can be taken out at the position, the vertical axis motor 14 is driven by the drive circuit 30 and the nozzle 17A descends to pick up and pick up the electronic parts. The suction nozzle 17B should be mounted with step number 0002. The electronic component is moved so as to be positioned above the component supply unit 3 that accommodates the electronic component, and the electronic component is sucked and taken out.
[0038]
Further, the suction nozzles 17A and 17B are moved above the component recognition camera 16 to pick up images of each electronic component held by suction, and the recognition processing is performed by the component recognition processing unit 33. Based on the result, the beam 8A and the mounting head are again formed. 7A is moved, and the suction nozzles 17A and 17B each mount the electronic component on the printed circuit board P while correcting the misalignment in consideration of the component recognition result.
[0039]
Next, the preceding execution flag of the RAM 22 is turned off, the data of the next mounting step number 0003 is cut out, and since there is an unmounted step, the CPU 21 determines the individual board recognition execution timing. This determination is made by checking the interference between the board recognition camera field of view and the suction component outer shape, that is, referring to the component library data (see FIG. 5) of the suction target component when the individual substrate recognition is designated. , Y), it is determined that the center of the suction nozzle and the component area (the maximum area occupied by the rotation of the suction nozzle and the electronic component) will not block the visual field of the substrate recognition camera 19 and will not interfere. Then, the preceding execution flag is turned off, and if it is determined that interference occurs, the preceding execution of individual substrate recognition of the next step number (preceding recognition before electronic component suction) is determined and the preceding execution flag is turned on.
[0040]
The above determination is performed to determine whether or not the electronic components sucked and held by the suction nozzles 17A and 17B block the field of view of the substrate recognition camera 19. In the determination, the suction nozzles 17A and 17A stored in the RAM 22 are determined. The position of 17B and the board | substrate recognition camera 19 etc. are also considered.
[0041]
XY type gantry multi-function mounters are required to have a higher speed device, the mounting head mounted on the beam is required to be lighter and smaller, and the range of defense of the target parts handled by the device is greatly expanded. Since there is a wide range from minute electronic parts to large electronic parts (connectors, etc.), if the position of the board recognition camera mounted on the mounting head is separated from the suction nozzle, the mounting head will be enlarged and high-speed mobility will be impaired. As described above, it is necessary to determine the interference between the field of view of the substrate recognition camera and the outer shape of the suction component.
[0042]
However, since the “V” information is “00” and there is no designation of individual substrate recognition, the preceding execution flag is off without performing the individual substrate recognition process, and thus the CPU 21 controls as follows. That is, when it is necessary to match the suction nozzles 17A and 17B installed in the mounting head 7A with the designated suction nozzle of the electronic component, the suction nozzle is replaced, and the mounting head 7A is then lifted as described above. At the same time, the suction nozzles 17A and 17B respectively move above the component supply unit 3 that stores the electronic components to be mounted of the mounting step numbers 0003 and 0004. Similarly, the nozzles 17A and 17B descend to suck and take out the electronic components. Further, the suction nozzles 17A and 17B are moved above the component recognition camera 16, and the electronic component held by suction is picked up and recognized by the component recognition processing unit 33. Based on the result, the beam 8A and the mounting head 7A are again displayed. The suction nozzles 17A and 17B mount the electronic component on the printed circuit board P while correcting the positional deviation in consideration of the component recognition result.
[0043]
Next, the preceding execution flag in the RAM 22 is turned off, the data of the next mounting step number 0005 is cut out, and there is an unmounted step, so the CPU 21 determines the individual board recognition execution timing.
[0044]
In other words, when “V” information is “02”, there is a designation for performing two-point individual board recognition, and the interference between the board recognition camera field of view and the suction part outline is checked. For example, the preceding execution flag is turned off, and the CPU 21 controls as follows. That is, as described above, the suction nozzle is replaced when necessary, and “S” is designated as “1”, and the pairing process, that is, the suction operation of the left and right suction nozzles 17A and 17B is simultaneously performed. (Simultaneous suction designation), the suction nozzles 17A and 17B are moved above the component supply unit 3 for storing the electronic components to be mounted of the mounting step numbers 0005 and 0006, respectively, and the nozzles 17A and 17B are similarly lowered to be electronic. The part is picked up and taken out, the electronic part picked up and held by the part recognition camera 16 is picked up, recognized by the part recognition processing unit 33, and the “V” information is “02”. Processed to perform individual substrate recognition of points. That is, based on the recognition coordinate data shown in FIG. 4, the CPU 21 attaches an individual board recognition mark (not shown) attached to the board recognition camera 19 in the vicinity of the position on the printed board P of the electronic component having the mounting step number 0005. Then, the substrate recognition processing unit 33 performs recognition processing. Based on the recognition results, the beam 8A and the mounting head 7A are moved again, and the suction nozzles 17A and 17B add the individual substrate recognition results to the component recognition results. The electronic component is mounted on the printed circuit board P while correcting the displacement.
[0045]
Also, if it is determined by the above determination that both of the parts to be picked up are both large or one of them is large and the board recognition camera field of view cannot be secured and there is interference, and the part picking up cannot be preceded, the individual of the next step number Prior execution of board recognition is determined and the previous execution flag is turned on. Accordingly, two individual board recognition is performed to perform prior recognition before the electronic component is picked up, that is, the board recognition camera 19 is located in the vicinity of the position where the electronic components of the mounting step numbers 0005 and 0006 are to be mounted on the printed circuit board P. Each of the two individual substrate recognition marks (not shown) attached is imaged and recognized by the substrate recognition processing unit 33. Then, if necessary, the suction nozzles are replaced. As described above, “S” is designated as “1”, and the pairing process, that is, the suction operations of the left and right suction nozzles 17A and 17B are performed simultaneously. (Simultaneous suction designation), the suction nozzles 17A and 17B are moved above the component supply unit 3 for storing the electronic components to be mounted of the mounting step numbers 0005 and 0006, respectively, and the nozzles 17A and 17B are similarly lowered to electronic components. Adsorb and take out. Further, the suction nozzles 17A and 17B move above the component recognition camera 16 to pick up an image of the sucked and held electronic component, and a recognition process is performed by the component recognition processing unit 33. Based on the result, the beam 8A and the mounting head 7A again. The suction nozzles 17A and 17B mount the electronic component on the printed circuit board P while correcting the misalignment by adding the component recognition result to the substrate recognition result.
[0046]
Next, the preceding execution flag of the RAM 22 is turned off, the data of the next mounting step number 0007 is cut out, and since there is an unmounted step, the CPU 21 performs determination of the individual board recognition execution timing, and based on this determination, the mounting step The electronic component is mounted on the printed circuit board in the same manner as the number 0005.
[0047]
Further, the processing after step number 0009 is similarly performed as described above. As described above, the beams 8A and 8B are sequentially mounted with their own mounting designation parts. In that case, each beam determines the step number to be processed by itself and performs an operation. At this time, each of the beams checks whether or not the individual board recognition designation of the step number to be picked up next is completed when the component mounting is completed. If the presence of interference between the external shape of the component and the visual field of the board recognition camera 19 is checked from the original data (component library data) and it is determined that interference will occur, the mounting operation is completed before the component suction operation. Thereafter, the individual substrate recognition of the next step number is performed in advance without any component adsorption without leaving a mounting area.
[0048]
Therefore, the board recognition timing close to that immediately before the mounting is realized, and it is possible to follow an unexpected board shift caused by a disturbance and to establish an appropriate sequence.
[0049]
In addition, the individual board recognition mark (attached in the vicinity of the position where the electronic component is to be mounted on the printed board P) is imaged by the board recognition cameras 19 and 19, and the board recognition processing unit 13 performs the recognition process. The electronic component is mounted while correcting the displacement by adding the component recognition result to the substrate recognition result, but the individual substrate recognition mark recognition process is not performed (the individual substrate recognition mark is not attached). In the case of mounting on an electronic component), for example, an overall recognition mark on a diagonal line of a printed circuit board is recognized, and the position recognition is corrected by adding the component recognition result to the board recognition result. An electronic component is mounted on the printed circuit board P.
[0050]
Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.
[0051]
【The invention's effect】
As described above, according to the present invention, individual substrate recognition immediately before each mounting is preferable, but it is possible to determine and cover whether or not the electronic component sucked and held by each suction nozzle blocks the visual field of the substrate recognition camera. If it is determined that the electronic component is picked up and taken out from the component supply unit, individual substrate recognition is executed and the electronic component is mounted on the printed circuit board. Since the individual substrate recognition is performed before the suction, it is possible to recognize the individual substrate immediately before mounting the electronic component as much as possible, and even the large electronic component can be reliably imaged and recognized by the substrate recognition camera. .
[Brief description of the drawings]
FIG. 1 is a plan view of an electronic component mounting apparatus.
FIG. 2 is a control block diagram of the electronic component mounting apparatus.
FIG. 3 is a diagram showing mounting data.
FIG. 4 is a diagram showing recognition coordinate data.
FIG. 5 is a diagram showing component library data.
FIG. 6 is a schematic flowchart.
FIG. 7 is a diagram showing an individual substrate recognition execution timing determination routine.
[Explanation of symbols]
1 Electronic component mounting device
3 parts supply unit
7A, B Mounting head
8A, B beam
16 Parts recognition camera
19 Board recognition camera
17A, B, C, D Suction nozzle
21 CPU
22 RAM

Claims

An electronic component that is picked up and held by picking up an electronic component from the component supply unit by a board recognition camera that images the mark attached to the printed circuit board provided on the mounting head, and a mounting head suction nozzle that can be moved in the plane direction by a drive source In an electronic component mounting method that includes a component recognition camera that captures the image, and performs recognition processing by a recognition processing device based on the imaging results of both cameras and mounts on a printed circuit board.
Determining the execution timing of individual substrate recognition for recognizing a mark attached in the vicinity of a position where an electronic component is mounted on the printed circuit board;
When it is determined that the electronic component sucked by the suction nozzle covers the field of view of the substrate recognition camera, after performing individual substrate recognition, the electronic component is sucked and taken out from the component supply unit onto the printed circuit board. An electronic component mounting method comprising mounting the electronic component.

An electronic component that is picked up and held by picking up an electronic component from the component supply unit by a board recognition camera that images the mark attached to the printed circuit board provided on the mounting head, and a mounting head suction nozzle that can be moved in the plane direction by a drive source In an electronic component mounting method that includes a component recognition camera that captures the image, and performs recognition processing by a recognition processing device based on the imaging results of both cameras and mounts on a printed circuit board.
Determining the execution timing of individual substrate recognition for recognizing a mark attached in the vicinity of a position where an electronic component is mounted on the printed circuit board;
If it is determined that the electronic component attracted by the suction nozzle does not cover the field of view of the substrate recognition camera, the electronic component is attracted and taken out from the component supply unit, and then the individual substrate recognition is executed and printed. An electronic component mounting method comprising mounting on a substrate.

An electronic component that is picked up and held by picking up an electronic component from the component supply unit by a board recognition camera that images the mark attached to the printed circuit board provided on the mounting head, and a mounting head suction nozzle that can be moved in the plane direction by a drive source In an electronic component mounting method that includes a component recognition camera that captures the image, and performs recognition processing by a recognition processing device based on the imaging results of both cameras and mounts on a printed circuit board.
Determining the execution timing of individual substrate recognition for recognizing a mark attached in the vicinity of a position where an electronic component is mounted on the printed circuit board;
When it is determined that the electronic component sucked by the suction nozzle covers the field of view of the substrate recognition camera, after performing individual substrate recognition, the electronic component is picked up from the component supply unit and printed. When the electronic component is mounted on the substrate and it is determined that the electronic component is not covered, the electronic component is picked up and taken out from the component supply unit, and then the individual substrate is recognized and mounted on the printed circuit board. Component mounting method.

An electronic component that is picked up and held by picking up an electronic component from the component supply unit by a board recognition camera that images the mark attached to the printed circuit board provided on the mounting head, and a mounting head suction nozzle that can be moved in the plane direction by a drive source In an electronic component mounting apparatus that is mounted on a printed circuit board by performing recognition processing with a recognition processing device based on the imaging results of both cameras,
A determination means for determining an execution timing of individual substrate recognition for recognizing a mark attached in the vicinity of a position where an electronic component is mounted on the printed circuit board;
When it is determined by the determination means that the electronic component sucked by the suction nozzle covers the field of view of the substrate recognition camera, after the individual substrate recognition is performed, the electronic component is sucked and taken out from the component supply unit. An electronic component mounting apparatus comprising: control means for controlling to mount on a printed circuit board.

An electronic component that is picked up and held by picking up an electronic component from the component supply unit by a board recognition camera that images the mark attached to the printed circuit board provided on the mounting head, and a mounting head suction nozzle that can be moved in the plane direction by a drive source In an electronic component mounting apparatus that is mounted on a printed circuit board by performing recognition processing with a recognition processing device based on the imaging results of both cameras,
A determination means for determining an execution timing of individual substrate recognition for recognizing a mark attached in the vicinity of a position where an electronic component is mounted on the printed circuit board;
When it is determined by the determination means that the electronic component sucked by the suction nozzle does not cover the field of view of the substrate recognition camera, the electronic component is sucked and taken out from the component supply unit, and then the individual substrate recognition is performed. And an electronic component mounting apparatus characterized by comprising control means for performing control so as to be mounted on a printed circuit board.

An electronic component that is picked up and held by picking up an electronic component from the component supply unit by a board recognition camera that images the mark attached to the printed circuit board provided on the mounting head, and a mounting head suction nozzle that can be moved in the plane direction by a drive source In an electronic component mounting apparatus that is mounted on a printed circuit board by performing recognition processing with a recognition processing device based on the imaging results of both cameras,
A determination means for determining an execution timing of individual substrate recognition for recognizing a mark attached in the vicinity of a position where an electronic component is mounted on the printed circuit board;
When it is determined by the determination means that the electronic component sucked by the suction nozzle covers the field of view of the substrate recognition camera, after the individual substrate recognition is performed, the electronic component is sucked from the component supply unit. If it is determined that the electronic component is not covered, the electronic component is picked up and taken out from the component supply unit, and then the individual substrate is recognized and mounted on the printed circuit board. An electronic component mounting apparatus comprising a control means for controlling.

7. The determination of the execution timing of the individual substrate recognition is performed when individual substrate recognition is specified in mounting data indicating a mounting position or the like for each mounting order of electronic components. The electronic component mounting method or electronic component mounting apparatus according to any one of the above.

7. The electronic component mounting method or the electronic component mounting device according to claim 1, wherein the mounting head is provided with a plurality of suction nozzles.