JP4202042B2 - Electronic component mounting apparatus recognition method and recognition apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention provides a substrate recognition camera that images a positioning mark on a printed circuit board provided on a mounting head and an electronic component that is sucked and held by a suction nozzle of a mounting head that can be moved in a plane direction by a driving source. The present invention relates to a recognition method for an electronic component mounting apparatus that includes a component recognition camera, performs recognition processing by a recognition processing apparatus based on the imaging results of both cameras, and mounts on a printed circuit board, and the recognition apparatus.
[0002]
[Prior art]
In general, in order to take an image of an electronic component sucked and held by a suction nozzle with a component recognition camera, it must be temporarily stopped above the component recognition camera, but in an imaging method called a fly view method in which an image is picked up without stopping. Compared with the imaging method to be stopped, the output timing of the imaging trigger signal from the recognition processing unit to the component recognition processing unit with respect to the image capture signal to the recognition processing unit has a delay and variation.
[0003]
[Problems to be solved by the invention]
For this reason, since the image cannot be captured at the correct position, the center position of the suction nozzle with respect to the center of the component recognition camera cannot be accurately grasped, the recognition result is shifted, and the mounting accuracy of the electronic component is simply deteriorated by the variation. To do.
[0004]
Accordingly, an object of the present invention is to improve the mounting accuracy of an electronic component by eliminating variations in the timing of outputting an imaging start signal to a component recognition camera in a fly view system that captures an image while moving the electronic component.
[0005]
[Means for Solving the Problems]
For this reason, the first invention moves a board recognition camera that is provided on the mounting head and images a positioning mark on the printed board, and an electronic component that is sucked and held by the suction nozzle of the mounting head that can be moved in a plane direction by a driving source. In a recognition method for an electronic component mounting apparatus that includes a component recognition camera that captures images while performing recognition processing with a recognition processing device based on the imaging results of both cameras and mounts on a printed circuit board, above the center of the component recognition camera With the substrate recognition camera in a state where the suction nozzle of the mounting head is positioned, a distance equivalent to the distance between the rotation center of the suction nozzle and the camera center of the substrate recognition camera is set from the camera center of the component recognition camera. The mark attached to the electronic component mounting apparatus main body is imaged and recognized by the recognition processing apparatus to grasp the position of the mark. Electronic components and recognition processing by the recognition processing device marks the head is attached the electronic components and electronic component mounting apparatus body held by suction by the suction nozzle by the component recognition camera and the board recognition camera while moving simultaneously imaged And the position of the mark is grasped, and the amount of deviation of the position of the mark by the recognition processing is added to the correction of the grasped position of the electronic component.
[0006]
According to a second aspect of the present invention, a substrate recognition camera that images a positioning mark on a printed circuit board provided on the mounting head, and an electronic component that is suctioned and held by a suction nozzle of the mounting head that can be moved in a plane direction by a drive source. A recognition apparatus for an electronic component mounting apparatus that includes a component recognition camera that captures an image, and that is mounted on a printed circuit board by performing recognition processing using a recognition processing device based on the imaging results of both cameras, and the mounting above the center of the component recognition camera The substrate recognition camera with the suction nozzle of the head positioned has a distance equivalent to the distance between the rotation center of the suction nozzle and the camera center of the substrate recognition camera from the camera center of the component recognition camera. The mark attached to the electronic component mounting apparatus main body is imaged, and the recognition processing apparatus performs recognition processing to store the result of grasping the position of the mark. 1 of a storage unit, the component recognition camera and simultaneously captured by the recognition process marks the attached to the electronic component and the electronic component mounting apparatus body held by suction by the suction nozzle in the board recognition camera while moving the mounting head A second storage means for storing the result of the recognition processing performed by the apparatus and grasping the positions of the electronic component and the mark; and the displacement of the mark position by the both recognition processing stored in the first and second storage means. It comprises control means for calculating a quantity and controlling it in consideration of the correction of the position of the grasped electronic component.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
An embodiment of the present invention will be described below based on the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus 1. On the mounting apparatus main body 2 of the apparatus 1, there are component supply units 3 that supply various electronic components one by one to their component take-out portions (component suction positions). A plurality are arranged side by side. A supply conveyor 4, a positioning unit 5, and a discharge conveyor 6 are provided between the groups of opposing units 3. The supply conveyor 4 conveys the printed circuit board P received from the upstream to the positioning unit 5, and after the electronic components are mounted on the substrate P positioned by a positioning mechanism (not shown) by the positioning unit 5, the conveyance is conveyed to the discharge conveyor 6. Is done.
[0008]
8A and 8B are a pair of beams that are long in the X direction, each of which rotates a screw shaft 10 by driving a Y-axis motor 9, and along the pair of left and right guides 11, a component take-out portion ( The component suction position) is individually moved in the Y direction.
[0009]
Each of the beams 8A and 8B is provided with mounting heads 7A and 7B that move along the guide (not shown) by the X-axis motor 12 in the longitudinal direction, that is, the X direction. Each mounting head 7A or 7B is equipped with a vertical axis motor 14 for moving the suction nozzle 17A or 17B up and down and a θ-axis motor 15 for rotating around the vertical axis. Accordingly, the suction nozzles of the two mounting heads 7A and 7B can move in the X direction and the Y direction, can rotate around the vertical line, and can move up and down.
[0010]
16A and 16B are component recognition cameras for component position recognition, and two are provided corresponding to each of the suction nozzles 17A and 17B, and how much the electronic components are sucked and held with respect to the suction nozzles XY The electronic component is imaged for recognizing the position with respect to the direction and the rotation angle, and two electronic components can be simultaneously imaged. Nos. 18 and 18 are nozzle stockers for storing various suction nozzles, and a maximum of 10 can be stored, but 9 are stored.
[0011]
19A and 19B are board recognition cameras, which are provided on the mounting heads 7A and 7B, respectively, and pick up images of the mark M1 in order to recognize the position of the mark M1 attached to the printed board P.
[0012]
FIG. 2 is a control block diagram of the electronic component mounting apparatus 1. For convenience, only one X-axis motor 12, Y-axis motor 9, θ-axis motor 15, and vertical axis motor 14 are illustrated and described below.
[0013]
A CPU 21 serving as a control unit that performs overall control of operations related to electronic component mounting of the mounting apparatus 1, a RAM (random access memory) 22 as a storage device, a ROM (read only memory) 23, and the like. ing. In the RAM 22, mounting data and printed circuit boards including information on the X direction, Y direction, and angular position in the printed circuit board P, FDR number (arrangement number of each component supply unit 3) information, etc. for each electronic component mounting order. The position of the mark M1 attached to P is stored.
[0014]
Then, the CPU 21 controls the operation related to the component mounting operation of the electronic component mounting apparatus 1 according to the program stored in the ROM 23 based on the data stored in the RAM 22. That is, the CPU 21 drives the X-axis motor 12 via the drive circuit 25, drives the Y-axis motor 9 via the drive circuit 28, and drives the θ-axis motor 15 via the drive circuit 32. Further, the driving of the vertical axis motor 14 is controlled via a drive circuit 30.
[0015]
A recognition processing unit 13 is connected to the CPU 21 via an interface 24. The recognition processing unit 13 performs recognition processing of images captured by the component recognition cameras 16A and 16B. The processing result is sent out. That is, the CPU 21 outputs an instruction to the recognition processing unit 13 so as to perform recognition processing (calculation of misalignment amount, etc.) on the images captured by the component recognition cameras 16A and 16B, and the recognition processing result is output from the recognition processing unit 13. It is what you receive.
[0016]
That is, when the amount of positional deviation is grasped by the recognition processing of the recognition processing unit 13, the result is sent to the CPU 21, and the CPU 21 drives the mounting head 7A or 8B in the Y direction by driving the Y-axis motor 9 with the beam 8A or 8B. 7B is moved in the X direction by driving the X-axis motor 12, and is rotated by θ by the θ-axis motor 15, thereby correcting the rotational angular position about the X and Y directions and the vertical axis.
[0017]
In addition, the recognition processing unit 13 performs recognition processing of images captured by the board recognition cameras 19A and 19B, and the processing result is sent to the CPU 21. That is, the CPU 21 outputs an instruction to the recognition processing unit 13 so as to perform recognition processing (calculation of misalignment amount) on the images captured by the board recognition cameras 19A and 19B, and the recognition processing result is output from the recognition processing unit 13. It is what you receive.
[0018]
That is, when the amount of positional deviation is grasped by the recognition processing of the recognition processing unit 13, the result is sent to the CPU 21, and the CPU 21 drives the mounting head 7A or 8B in the Y direction by driving the Y-axis motor 9 with the beam 8A or 8B. 7B is moved in the X direction by driving the X-axis motor 12, and is rotated by θ by the θ-axis motor 15, so that the rotational angle position around the X, Y direction and the vertical axis can be corrected.
[0019]
The above-described substrate recognition processing operation is performed only before the first electronic component mounting by each beam. This is because not only the characteristics of the printed circuit board P but also the characteristics of each beam, each mounting head, etc. are reflected in the position correction for component mounting.
[0020]
Reference numeral 34 denotes a keyboard as input means connected to the CPU 21 via the keyboard driver 35 and the interface 24. Reference numeral 36 denotes a monitor for displaying an image such as a recognition component image. Note that an input unit such as a touch panel may be used instead of the keyboard 34 as the input unit.
[0021]
With the above configuration, the operation will be described below with reference to FIG. 3 in particular. However, although there are two mounting heads 7A and 7B, for convenience of description, the mounting head 7A will be described below as an example. First, before starting the operation, the CPU 21 drives the X-axis motor 12 and the Y-axis motor 9 via the drive circuits 25 and 28 to move the mounting head 7A to the upper side of the component recognition camera 16A, as shown in FIG. In this way, the rotation center of the suction nozzle 17A is positioned above the camera center of the component recognition camera 16A (step 1).
[0022]
Next, the mark M2 disposed on the mounting device 2 is placed on the board at a distance equivalent to the distance between the rotation center of the suction nozzle 17A and the camera center of the board recognition camera 19A from the camera center of the component recognition camera 16A. The recognition camera 19A captures an image, and the recognition processing unit 13 recognizes the position of the mark M2 (step 2).
[0023]
Then, the position of the mark M2 recognized by the recognition processor 13 is stored in the RAM 22 (step 3).
[0024]
In this state, the production operation is started (step 4). First, the printed circuit board P is conveyed from the upstream device to the positioning unit 5 via the supply conveyor 4 by a conveyor (not shown), and is positioned and fixed by the positioning mechanism. Then, according to the mounting data in which the XY coordinate position to be mounted on the printed circuit board P stored in the RAM 22, the rotation angle position about the vertical axis, the FDR number (arrangement number of each component supply unit 3) and the like are specified, the electronic component The electronic component to be mounted by the suction nozzle corresponding to the component type is picked up and taken out from the predetermined component supply unit 3.
[0025]
That is, the suction nozzle 17A of the mounting head 7A moves so as to be positioned above the component supply unit 3 that stores the electronic component to be mounted having the mounting step number 0001, but the Y-axis motor 9 is driven by the drive circuit 28 in the Y direction. The beam 8A moves along the pair of guides 11, and the X-axis motor 12 is driven by the drive circuit 25 in the X direction to move the mounting head 7A, and the predetermined supply unit 3 is already driven to the component suction position. Since the components are ready to be taken out, the vertical axis motor 14 is driven by the drive circuit 30 and the nozzle 17A descends to pick up and take out the electronic components.
[0026]
Next, the CPU 21 moves the beam 8A by the Y-axis motor 9 and stops it so that the rotation center of the suction nozzle 17A and the camera center of the component recognition camera 16A are on the same X-axis line (step 5). ).
[0027]
Then, the mounting head 7A is moved above the component recognition camera 16A by the X-axis motor 25 at a constant speed (step 6).
[0028]
Then, the CPU 21 inputs a mounting head detection signal from the head detection sensor 37 attached to a predetermined position of the beam 8A on the same line (Y direction) as the center position of the component recognition camera 16A to the recognition processing device 13 (step). 7). Exactly, one light emitting element of the head detection sensor 37 is provided at a predetermined position of the beam 8A on the same line (Y direction) as the center position of the component recognition camera 16A, and the other light receiving element is provided on the mounting head 7A. Therefore, when the mounting head 7A moves on the same line (Y direction) as the center position of the component recognition camera 16A, a mounting head detection signal is emitted from the head detection sensor 37, and the detection signal is used as a recognition processing device. 13 will be input.
[0029]
Next, in response to this, an imaging start signal is issued simultaneously from the recognition processing device 13 as the image processing device to the component recognition camera 16A and the board recognition camera 19A, and the electronic component sucked and held by the suction nozzle 17A and the mark M2 are displayed. The captured image is captured from both cameras 16A and 19A to the recognition processing device 13 (step 8).
[0030]
The recognition processing device 13 performs a captured image recognition process. Here, when the recognition processing device 13 receives a signal from the head detection sensor 37 and outputs an imaging start signal to the component recognition camera 16A, there is a delay time or the camera center of the component recognition camera 16A. When the mounting position of the head detection sensor 37 varies with respect to the position, as shown in FIG. 5, the position of the component is misaligned and the image is captured. However, the CPU 21 detects the mark M2 position in the steps 3 and 9. The amount of misalignment (Δx, Δy) is calculated and used to correct the component recognition position (step 9). That is, the amount of deviation of the positions of the two marks M2 grasped in Step 3 and Step 9 is calculated, and this is added to the position recognition of the electronic component.
[0031]
Therefore, as a result of the addition, the CPU 21 moves the beam 8A in the Y direction by driving the Y-axis motor 9 and moves the mounting head 7A in the X direction by driving the X-axis motor 12, and also by the θ-axis motor 15. The rotation angle position about the X and Y directions and the vertical axis is corrected by rotating θ.
[0032]
Although two mounting heads 7A and 7B are provided, for convenience of description, the mounting head 7A has been described above as an example. However, the mounting head 7B is similarly applied.
[0033]
Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various alternatives described above without departing from the spirit of the present invention. It includes modifications or variations.
[0034]
【The invention's effect】
As described above, the present invention can improve the mounting accuracy of an electronic component by eliminating variations in the timing of outputting an imaging start signal to a component recognition camera in a fly view system that captures an image while moving the electronic component. .
[Brief description of the drawings]
FIG. 1 is a plan view of an electronic component mounting apparatus.
FIG. 2 is a control block diagram of the electronic component mounting apparatus.
FIG. 3 is a flowchart.
FIG. 4 is a diagram illustrating a state in which the rotation center of the suction nozzle is positioned above the camera center of the component recognition camera.
FIG. 5 is a diagram showing a captured image of a mark M2.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 7A, B Mounting head 8A, B beam 16A, B Component recognition camera 17A, B Suction nozzle 19A, B Substrate recognition camera 13 Recognition processing part 21 CPU
22 RAM
M2 mark

Claims (2)

A board recognition camera that images a positioning mark on a printed circuit board provided on the mounting head, and a component recognition camera that captures an image while moving an electronic component sucked and held by a suction nozzle of the mounting head movable in a plane direction by a driving source In a recognition method for an electronic component mounting device that is subjected to recognition processing by a recognition processing device based on the imaging results of both cameras and mounted on a printed circuit board,
With the substrate recognition camera in a state where the suction nozzle of the mounting head is positioned above the center of the component recognition camera, the rotation center of the suction nozzle and the camera center of the substrate recognition camera from the camera center of the component recognition camera Image the mark attached to the electronic component mounting apparatus body at a distance equivalent to the distance between and recognize the position of the mark by the recognition processing device,
While the mounting head is moving, the component recognition camera and the board recognition camera simultaneously image the electronic component sucked and held by the suction nozzle and the mark attached to the electronic component mounting device main body, and the recognition processing device performs recognition processing. Know the position of electronic parts and marks,
A recognition method for an electronic component mounting apparatus, wherein an amount of deviation of the position of the mark by the both recognition processes is added to the correction of the grasped position of the electronic component. A board recognition camera that images a positioning mark on a printed circuit board provided on the mounting head, and a component recognition camera that captures an image while moving an electronic component sucked and held by a suction nozzle of the mounting head movable in a plane direction by a driving source In a recognition device for an electronic component mounting device that is subjected to recognition processing by a recognition processing device based on the imaging results of both cameras and mounted on a printed circuit board,
With the substrate recognition camera in a state where the suction nozzle of the mounting head is positioned above the center of the component recognition camera, the rotation center of the suction nozzle and the camera center of the substrate recognition camera from the camera center of the component recognition camera The first storage means for storing the result of capturing the mark attached to the electronic component mounting apparatus main body at a distance equivalent to the distance between the two and recognizing the position of the mark by the recognition processing apparatus When,
While the mounting head is moving, the component recognition camera and the board recognition camera simultaneously image the electronic component sucked and held by the suction nozzle and the mark attached to the electronic component mounting device main body, and the recognition processing device performs recognition processing. Second storage means for storing the result of grasping the position of the electronic component and the mark;
Control means for calculating a deviation amount of the position of the mark by the recognition processing stored in the first and second storage means and controlling the calculated position in consideration of correction of the position of the grasped electronic component. A recognition apparatus for an electronic component mounting apparatus.

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