JP4348801B2 - Component mounting device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a component mounting apparatus for mounting a surface mounting type electronic component (hereinafter referred to as an electronic component) on a circuit board.
[0002]
[Prior art]
A circuit board holding unit that holds a circuit board, a component supply unit that supplies electronic components and the like stored in a carrier tape, and a circuit board that takes out the electronic components supplied by the component supply unit and is held by the circuit board holding unit. 2. Description of the Related Art Generally, electronic devices are manufactured using a component mounting apparatus having a head unit that is mounted at a high speed.
[0003]
[Problems to be solved by the invention]
In recent years, electronic components have made rapid progress, and not only resistors and capacitors, but also electronic components having various functions, shapes, and sizes have been developed and used, including semiconductors. Among such a wide variety of electronic components, there are some which are larger than ordinary electronic components or have electrodes that are easily deformed, and it is required to handle them more reliably and stably. Therefore, in addition to being supplied in a form housed in a carrier tape, it is increasingly provided in a form in which electronic components are housed in storage recesses arranged in a matrix on a flat tray, even in a component mounting device, It has been required to stably mount various electronic components supplied in the form of being accommodated in the tray on the circuit board.
[0004]
SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems and to stably mount a wide variety of electronic components provided in a tray on a circuit board.
[0005]
[Means for Solving the Problems]
In order to achieve this object, the present invention is formed in a second direction perpendicular to the first direction and a substrate holding part that moves in the first direction while holding the circuit board on which the electronic component is mounted. A substrate transfer unit disposed adjacent to the substrate holding unit along the substrate transfer path, a taping component supply unit configured to be disposed on a side portion of the substrate transfer unit and configured to supply an electronic component stored in a carrier tape, and A suction nozzle that is disposed above the taping component supply unit and the substrate holding unit, moves between the taping component supply unit and the substrate holding unit in the second direction, and takes out electronic components from the taping component supply unit and mounts them on the circuit board. And a tray component supply unit that supplies an electronic component that is disposed above the moving range of the substrate holding unit and that is stored in the tray. The tray moves in a first direction A which was assumed to have a tray holding portion for advancing and retracting on the movement path of the suction nozzle between the head portion and the substrate holding portion to hold the substrate holder Since the tray is moved forward and backward by the tray holding part above the movement path of the suction nozzle, the electronic parts stored in the tray are directly taken out by the suction nozzle of the head part and mounted on the circuit board. It can be stably mounted on a circuit board.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
The invention according to claim 1 of the present invention is formed in a second direction orthogonal to the first direction and a board holding part that holds the circuit board on which the electronic component is mounted and moves in the first direction. A substrate transfer unit disposed adjacent to the substrate holding unit along the substrate transfer path, a taping component supply unit configured to be disposed on a side portion of the substrate transfer unit and configured to supply an electronic component stored in a carrier tape, and A suction nozzle that is disposed above the taping component supply unit and the substrate holding unit, moves between the taping component supply unit and the substrate holding unit in the second direction, and takes out electronic components from the taping component supply unit and mounts them on the circuit board. And a tray component supply unit that supplies electronic components stored in the tray and is disposed above the movement range of the substrate holding unit. The tray component supply unit holds the tray. The tray moves in a first direction A which was assumed to have a tray holding portion for advancing and retracting on the movement path of the suction nozzle between the head portion and the substrate holder, above the substrate holder The tray holding part moves the tray back and forth on the suction nozzle movement path, and the electronic components stored in the tray are directly taken out by the suction nozzle of the head part and mounted on the circuit board. It can be mounted on a circuit board.
[0008]
Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
[0009]
First, the overall configuration will be described with reference to FIGS.
[0010]
1 is a front view showing a schematic configuration of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a plan view thereof, and FIG. 3 is a side view thereof.
[0011]
In FIG. 1 to FIG. 3, reference numeral 1 denotes a board holding portion that holds a circuit board 2 on which an electronic component is mounted and is provided on a support base 3 and slides in the first direction on the support base 3. is there. A first substrate transport unit 4 is arranged adjacent to the left side of the substrate holding unit 1 in FIG. 2, and the second substrate transport unit 5 is connected to the first substrate transport unit 4 on the opposite right side. It is attached so as to face each other.
[0012]
The first substrate transport unit 4, the second substrate transport unit 5, and the substrate holding unit 1 are each a pair of guide rails and a transport that is attached to each guide rail and supports the circuit board 2 on the upper surface and transports the circuit board 2. It has a belt. The conveyance belts of the substrate holding unit 1 and the second substrate conveyance unit 5 are rotated by a single drive source (not shown) provided in the substrate holding unit 1 and the second substrate conveyance unit 5. As shown by a two-dot chain line in FIG. 2, it can swing downward.
[0013]
When the first substrate transport unit 4, the second substrate transport unit 5 and the substrate holding unit 1 are aligned in the X direction, which is the second direction, as shown in FIG. In this way, the circuit board 2 is transported in the opposite direction, and the substrate transport path is formed in the X direction by the first substrate transport unit 4, the second substrate transport unit 5 and the substrate holding unit 1 in this way. It has come to be.
[0014]
In the vicinity of both sides along the substrate conveyance path of the first substrate conveyance unit 4, there are a first taping component supply unit 6 and a second taping component supply unit 7 that mainly supply electronic components stored in the carrier tape, respectively. Has been placed. Each of the first taping component supply unit 6 and the second taping component supply unit 7 includes a plurality of component supply units 8 that sequentially supply the electronic components stored in the carrier tape to the substrate conveyance path side. Yes.
[0015]
Although not shown in detail, the component supply unit 8 slides toward the board conveyance path along the rails of the first taping component supply unit 6 or the second taping component supply unit 7 shown in FIGS. It is supposed to be attached. And it is electrically connected with a component mounting apparatus in the position pushed in the board | substrate conveyance path side most, and an electronic component is sequentially supplied by control of a component mounting apparatus in this position.
[0016]
The first taping component supply unit 6 and the second taping component supply unit 7 are mainly configured to supply electronic components stored in a carrier tape. For example, an electronic component supplied in a bulk state or an electronic component stored in a stick can be supplied using a component supply unit corresponding to the package.
[0017]
9 is disposed above the first taping component supply unit 6 and the substrate holding unit 1, and a plurality of electronic components are taken out from the first taping component supply unit 6 and mounted on the circuit board 2 held by the substrate holding unit 1. The suction nozzle 10 is arranged in a straight line in the X direction, and is a first head portion that slides between the first taping component supply unit 6 and the substrate holding unit 1 in the X direction.
[0018]
11 is arranged above the second taping component supply unit 7 and the substrate holding unit 1, and a plurality of electronic components are taken out from the second taping component supply unit 7 and mounted on the circuit board 2 held by the substrate holding unit 1. The suction nozzle 12 is arranged in a straight line in the X direction and is a second head portion that slides between the second taping component supply unit 7 and the substrate holding unit 1 in the X direction.
[0019]
Reference numeral 13 denotes an upper support frame mounted on the support base 3. As shown in FIG. 1 and FIG. 3, the outer shape is substantially rectangular and the inside is hollow, and as shown in FIG. The shape is cut out. On the upper support frame 13, a first head portion drive shaft 14 for driving the first head portion 9 in the X direction, and a first head portion drive motor 15 connected to the first head portion drive shaft 14 by a belt, A second head portion drive shaft 16 that drives the second head portion 11 in the X direction and a second head portion drive motor 17 that is connected to the second head portion drive shaft 16 by a belt are disposed.
[0020]
As shown in FIG. 3, the first head portion 9 is attached to the side portion of the first head portion drive shaft 14, and is driven in the X direction by the rotation of the first head portion drive motor 15. With the driving, the suction nozzle 10 of the first head unit 9 is also moved in the X direction. Similarly, the second head portion 11 is attached to the side portion of the second head portion drive shaft 16 as shown in FIG. 3 and is driven in the X direction by the rotation of the second head portion drive motor 17. With this drive, the suction nozzle 12 of the second head portion 11 is also moved in the X direction.
[0021]
Reference numeral 18 denotes a first recognition unit, which is disposed between the first taping component supply unit 6 and the substrate holding unit 1 as shown in FIGS. 1 and 2, and between the first recognition unit 18 and the substrate holding unit 1. The first component discharge unit 19 is arranged.
[0022]
Similarly, reference numeral 20 denotes a second recognition unit, which is arranged between the second taping component supply unit 7 and the substrate holding unit 1 as shown in FIG. 2, and between the second recognition unit 20 and the substrate holding unit 1. The second component discharge portion 21 is arranged.
[0023]
2 and 3, 22 indicated by a two-dot chain line is a tray component supply unit (described later) for supplying electronic components accommodated in the tray, and is located above the substrate holding unit 1 as shown in FIGS. 2 and 3. And it is arrange | positioned at the side of the 2nd taping component supply part 7. FIG. Similarly, 23 indicated by a two-dot chain line is a tray storage unit (described later) for storing a tray storing electronic components.
[0024]
1 and 2 is a substrate recognition camera attached to the first head unit 9, and 25 is a suction nozzle that is arranged on the first substrate transport unit 4 and holds a number of differently shaped suction nozzles. It is an exchange part.
[0025]
Next, the tray component supply unit 22 and the tray storage unit 23 will be described in detail with reference to FIGS. 4 and 5.
[0026]
4 is a front view showing the tray component supply unit 22, and FIG. 5 is a plan view thereof.
[0027]
As shown in FIGS. 4 and 5, the tray component supply unit 22 is attached to the support base 3 so as to be positioned above the substrate holding unit 1. A tray storage unit 23 is disposed outside the tray component supply unit 22, that is, on the upper side of the tray component supply unit 22 in FIG. 5. The tray storage unit 23 stores electronic components. A plurality of trays 26 are stored, and the trays 26 are transferred to the tray component supply unit 22 as necessary, and conversely, the trays 26 held by the tray component supply unit 22 are stored.
[0028]
Further, the tray component supply unit 22 is provided with a tray holding unit 27 that holds a tray 26 containing electronic components on a rail and slides in the Y direction shown in FIG.
[0029]
4 and FIG. 5 is a tray moving unit provided in the tray component supply unit 22, which slides in the Y direction on the tray holding unit 27 to transfer the tray 26 from the tray storage unit 23 to the tray holding unit 27. The tray 26 is pulled out, and conversely, the tray 26 held on the tray holding unit 27 is stored in the tray storage unit 23.
[0030]
Next, the overall operation will be described.
[0031]
First, the circuit board 2 is transferred from the first substrate transfer unit 4 or the second substrate transfer unit 5 to the substrate holding unit 1.
[0032]
Then, in accordance with the program, the first head portion 9 or the second head portion 11 moves in the X direction toward the first taping component supply portion 6 or the second taping component supply portion 7, respectively. The respective suction nozzles 10, 12 are lowered on the component supply unit 6 or the second taping component supply unit 7, and are raised after taking out the electronic components supplied from the component supply unit 8.
[0033]
Then, each of the first head unit 9 and the second head unit 11 moves in the X direction toward the substrate holding unit 1. At this time, the first head portion 9 passes over the first recognition portion 18 and the first component discharge portion 19, and the second head portion 11 passes over the second recognition portion 20 and the second component discharge portion 21.
[0034]
When the first head unit 9 or the second head unit 11 moves onto the substrate holding unit 1, the respective suction nozzles 10 and 12 are lowered, and electronic components are placed on the circuit board 2 held by the substrate holding unit 1. Installing. At this time, according to the program, the board holding part 1 slides in the Y direction, and the first head part 9 or the second head part 11 slides in the X direction to mount electronic components at predetermined positions on the circuit board 2. It is supposed to be.
[0035]
Next, the operation of the tray component supply unit 22 will be described with reference to FIGS.
[0036]
When supplying the electronic components stored in the tray 26, the tray holding unit 27 shown in FIG. 5 moves downward in the drawing, and the electronic components are moved to the suction nozzle 12 of the second head portion 11 shown in the drawing. It is arranged on the movement path in the X direction.
[0037]
In conjunction with the movement of the tray holding portion 27 in the Y direction, the second head portion 11 shown in FIG. 5 moves in the X direction and positions the suction nozzle 12 above the desired electronic component stored in the tray 26. . At this position, the suction nozzle 12 descends and takes out the electronic component and then ascends. When the suction nozzle 12 is raised, the tray holding unit 27 retracts the electronic component upward in FIG. 5, and then the suction nozzle 12 is lowered to mount the electronic component on the circuit board 2 held by the board holding unit 1. .
[0038]
In this way, since the electronic components stored in the tray 26 are directly taken out by the suction nozzle 12 of the second head portion 11 and mounted on the circuit board 2, deformation of the electronic components and adhesion of foreign matters to the electronic components are prevented, Stable mounting can be realized.
[0039]
In addition, since the electronic component stored in the tray 26 is supplied to the suction nozzle 12 of the second head unit 11 on the substrate holding unit 1, the time from the supply of the electronic component to the mounting can be shortened. The speed of the apparatus can be increased and the productivity can be improved.
[0040]
Next, a tray component supply unit according to another embodiment of the present invention will be described with reference to FIGS. The tray component supply unit of the present embodiment is provided with a transfer table unit having a transfer table arranged adjacent to the tray on the tray holding unit of the tray component supply unit of the previous embodiment. The only difference is that a transfer unit for transferring the electronic components stored in the tray is provided on the replacement stand, and the other points are the same as those in the previous embodiment, so the same configuration The parts are given the same names and numbers, and detailed description thereof is omitted.
[0041]
FIG. 6 is a front view showing the tray component supply unit of the present embodiment, and FIG. 7 is a plan view thereof.
[0042]
6 and 7, reference numeral 29 denotes a tray component supply unit. On the tray holding unit 27 of the tray component supply unit 29, a transfer table unit 30 is provided adjacent to the tray 26. In the unit 30, a plurality of transfer tables 31 are arranged on a straight line in the X direction. Then, as shown in FIGS. 6 and 7, the electronic parts stored in the tray 26 by moving in the X direction above the plurality of transfer tables 31 and the tray 26 are moved in the X direction. A transfer unit 32 is provided for transferring.
[0043]
When electronic components are supplied by the tray component supply unit 29, the electronic components stored in the tray 26 are transferred and held on the transfer table 31 by the transfer unit 32 in advance, and then the tray holding unit. 27 is moved downward in FIG.
[0044]
At this time, the tray 26 is placed on the tray holding unit 27 so that the electronic component to be supplied among the electronic components stored in the tray 26 is in a straight line with the electronic component transferred and held on the transfer table 31. Then, the tray holding unit 27 is moved downward in FIG. 7, and the plurality of electronic components are moved in the X direction of the suction nozzle 12 of the second head unit 11 shown in FIG. Place on top.
[0045]
By doing so, a large number of electronic components stored in the tray 26 can be simultaneously supplied to the suction nozzle 12 of the second head portion 11, and the productivity of the component mounting device can be improved.
[0046]
【The invention's effect】
As described above, according to the present invention, a wide variety of electronic components stored in a tray can be stably mounted on a circuit board.
[Brief description of the drawings]
FIG. 1 is a front view showing a schematic configuration of a component mounting apparatus according to an embodiment of the present invention. FIG. 2 is a plan view of the same. FIG. 3 is a side view of the same. FIG. 5 is a plan view of the tray part supply unit according to another embodiment of the present invention. FIG. 7 is a plan view of the tray part.
DESCRIPTION OF SYMBOLS 1 Board | substrate holding | maintenance part 2 Circuit board 3 Support stand 4 1st board | substrate conveyance part 5 2nd board | substrate conveyance part 6 1st taping component supply part 7 2nd taping component supply part 8 Component supply unit 9 1st head part 10 Suction nozzle 11 1st Two head parts 12 Suction nozzle 13 Upper support frame 14 First head part drive shaft 15 First head part drive motor 16 Second head part drive shaft 17 Second head part drive motor 18 First recognition part 19 First component discharge part 20 Second recognition unit 21 Second component discharge unit 22 Tray component supply unit 23 Tray storage unit 24 Substrate recognition camera 25 Suction nozzle replacement unit 26 Tray 27 Tray holding unit 28 Tray movement unit 29 Tray component supply unit 30 Transfer table unit 31 Replacement stand 32 Transfer section

Claims (1)

A substrate holding unit that holds a circuit board on which electronic components are to be mounted and moves in a first direction, and a substrate transfer path formed in a second direction orthogonal to the first direction. Arranged above the taping component supply unit and the substrate holding unit, the substrate transfer unit disposed adjacent to the taping component supply unit that supplies electronic components placed on the side of the substrate transfer unit and stored in the carrier tape. The head unit having a suction nozzle that moves between the taping component supply unit and the substrate holding unit in the second direction and takes out the electronic components from the taping component supply unit and mounts them on the circuit board, and the movement range of the substrate holding unit the tray becomes a disposed above the electronic component housed in the tray from the tray component supply section which supplies, the tray component supply section is moved in a first direction to hold the tray Component mounting apparatus as having a tray holding portion for advancing and retracting on a moving path of the suction nozzle between the head portion and the substrate holder.

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