JP3894612B2 - Component supply device and component mounter - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention includes a component supply device provided in a component mounter that picks up a component such as an electronic component and mounts the component on a circuit board, the component supply method executed by the component supply device, and the component supply device. The present invention relates to a component mounting machine and a component mounting method executed by the component mounting machine.
[0002]
[Prior art]
Conventionally, the component mounting machine is disclosed in Japanese Patent Publication No. 3-221326, and a component mounting machine 2 including a component supply device 1 as shown in FIG. That is, the component supply apparatus 1 includes a plurality of component supply cassettes 3 in which components are temporarily fixed on the tape along the tape extending direction and the tape is wound, and the component supply cassette 3 can be mounted on the rail. A first supply table 4 and a second supply table 5 that are supported by 6 and guided and capable of self-propelling are provided. Note that the type of components temporarily fixed on the tape may be changed or the same for each component supply cassette 3. The component mounting machine 2 includes a mounting head 9 that sucks and holds the components on the tape in the component supply cassette 3 and mounts the held components on the mounting position on the substrate 8 positioned by the XY table 7.
Such a conventional component mounter operates as follows. For example, when a component supply cassette 3 having the same type of electronic component is mounted on each of the first and second supply tables 4 and 5, a certain type of component breakage occurs in one of the supply tables. The one supply table and the other supply table can be exchanged, and the parts can be supplied from the component supply cassette 3 of the other supply table. Parts can be replenished. When there are many types of parts to be used, the supply cassette 3 having different types of electronic parts is mounted on the first and second supply tables 4 and 5, and the first and second supply tables 3 are mounted on the mounting head 9. While replacing the second supply tables 4 and 5, necessary components are sucked and held and mounted on the substrate 8.
[0003]
[Problems to be solved by the invention]
In recent years, it is not limited to the requirement that various types of components can be mounted on a high-speed electronic component mounting machine, and the component supply cassette 3 is not limited to the component type determined in advance, and can flexibly handle various types of components. The demand for possible mounting machines is increasing. However, since the conventional component mounter 2 uses the component supply cassette 3 as described above, the type of component to be mounted is determined for each cassette, and the component seems to be temporarily fixed on the tape. This is a mounting machine with a narrow range of applications, with the exception of other parts.
The present invention has been made to solve such problems, and provides a component supply device, a component mounter, a component supply method, and a component mounting method that can flexibly cope with components that require mounting. The purpose is to provide.
[0004]
[Means for Solving the Problems]
  The component supply apparatus according to the first aspect of the present invention is a component supply apparatus provided in a component mounting machine that mounts a component held at a component supply position on a mounting position on a substrate.
  A transfer device that holds the component from the component container and places the held component on the adhesive tape; and
  A component rearrangement device having a component transporting device for transporting a component placed on the adhesive tape to the component supply position;e,
The pressure-sensitive adhesive tape formed a plurality of pressure-sensitive adhesive regions having different adhesive forces with the center line as the axis of symmetry in the width direction perpendicular to the extending direction.It is characterized by that.
[0005]
A component mounter according to a second aspect of the present invention includes the component supply device according to the first aspect.
[0006]
A component supply method according to a third aspect of the present invention is a component supply method in a component mounter that mounts a component held at a component supply position on a mounting position on a substrate.
Hold the parts from the parts container,
Place the held component on the placement member,
The above-mentioned placement member is moved and the above-placed component is transferred to the above-mentioned component supply position.
It is characterized by having that.
[0007]
The component mounting method according to the fourth aspect of the present invention is a component mounting method in a component mounting machine for mounting a component held at a component supply position to a mounting position on a substrate.
Hold the parts from the parts container,
Place the held component on the placement member,
Move the above-mentioned placing member and transfer the above-mentioned placed part to the above-mentioned parts supply position,
Holding the component transferred to the component supply position and mounting it on the mounting position,
It is characterized by having that.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
A component supply apparatus, a component mounter, a component supply method, and a component mounting method according to an embodiment of the present invention will be described below with reference to the drawings. In addition, the same code | symbol is attached | subjected about the same component in each figure. The component supply method is executed by the component supply device, the component mounter includes the component supply device, and the component mounting method is executed by the component mounter. Is.
[0009]
As illustrated in FIGS. 1 to 4, the component mounter 100 according to the present embodiment includes a component supply device 200 and a component holding and conveying device 300.
As shown in FIG. 1, the component holding / conveying device 300 is roughly divided into a substrate conveying device 301, an XY table 302, and a component holding device 303, all of which have a known configuration. Therefore, the description about these is abbreviated. The substrate transport device 301 transports the unmounted substrate 8 from the previous process of the mounting process onto the XY table 302 along the X direction, and moves the mounted board 8 to the subsequent process of the mounting process along the X direction. It is a device that conveys. The component holding device 303 holds the main body 305 fixed to the base plate 304 of the component holding and conveying device 300 and the components to be mounted on the substrate 8 and mounts on the substrate 8 as shown in FIGS. A mounting head 306 having a nozzle 309 and movable along the periphery of the main body 305 is provided. The component is held by the nozzle 309 at the component supply position 307 and mounted on the mounting position 308 on the substrate 8. Since the mounting head 306 moves around the fixed main body 305 as described above, in the present embodiment, the positions corresponding to the component supply position 307 and the mounting position 308 in the mounting head 306 are set in advance. Position. Therefore, the XY table 302 holds the substrate 8 and positions the substrate 8 on the substrate 8 so that the mounting position 308 on the substrate 8 on which the component is to be mounted and the position corresponding to the mounting position 308 in the mounting head 306 coincide with each other. , Move in the Y direction.
[0010]
The component supply apparatus 200 includes a plurality of component supply cassettes 3 that are detachably mounted on the mounting table 201 and the pedestal 204, and components that are characteristic components in the present embodiment. And a rearrangement device 203. The component rearrangement device 203 is disposed between the component supply cassette 3 and the component holding device 303, holds the component from the component supply cassette 3, and conveys the component to the component supply position 307.
As shown in FIGS. 1 and 3, in this embodiment, each of the component supply cassette groups 205 includes two component supply cassette groups 205 and 206 each having a plurality of component supply cassettes 3 arranged side by side. On the pedestal 204 for the component rearrangement device 203, it is installed adjacent to the component holding and conveying device 300, and the other component supply cassette group 206 is adjacent to the component holding and conveying device 300 with the component rearranging device 203 interposed therebetween. Installed. Moreover, in this embodiment, each component supply cassette group 205,206 can mutually replace the installation place.
[0011]
The component rearrangement device 203 is mounted on rails 202 and 202 laid along the X direction which is the arrangement direction of the component supply cassette 3 on a pedestal 204 installed adjacent to the base plate 304 of the component holding and conveying device 300. It is installed on the engaged table 207 and is slid on the rail 202 when the table 207 is driven by the moving device 208 provided in the component rearrangement device 203. The one component supply cassette group 205 can also slide on the rails 202, 202 along the rail 202.
Such a component rearrangement device 203 includes a transfer device 211 and a component transport device 221.
The transfer device 211 includes a feed lever driving device 213 and a nozzle unit 214. The feed lever driving device 213 presses the feed lever 251 provided in the component supply portion of the component supply cassette 3, and in this embodiment, the air cylinder 212 is used as a drive source. The feed lever 251 has a ratchet mechanism, and when the feed lever 251 is pushed down by the feed lever driving device 213, the component supply cassette 3 is attached to the tape by feeding the wound component temporary fixing tape. The parts 252 currently being supplied are supplied to the part selection position 253 one by one. The nozzle unit 214 has nozzles 215 in the I direction shown in the figure corresponding to the Z direction, which is the vertical direction, and in the II direction corresponding to the Y direction perpendicular to the I direction and the X direction, which is the arrangement direction of the component supply cassettes 3. And a mechanism capable of automatically selecting the nozzle 215 suitable for the component 252 to be held. Such a nozzle 215 moves in the I direction at the component selection position 253 and holds the component 252. Then, the nozzle unit 214 moves in the II direction and places the held component 252 at the conveyance start position 223 on the placement member 222 in the component rearrangement apparatus 203.
[0012]
The component conveying device 221 moves the mounting member 222, the supply-side reel 225 around which the mounting member 222 is wound, the take-up reel 224 that winds the mounting member 222, and the mounting member 222. A motor 226 as a drive source and a separation assist mechanism 261 are provided.
The mounting member 222 in the present embodiment is an adhesive tape on which the mounting surface on which the component 252 is mounted has adhesiveness, and the above described between the two pulleys 227a and 227b disposed along the II direction. It is stretched along the II direction. As shown in FIG. 6, feed holes 222a are formed at regular intervals in the extending direction at the side edges in the width direction orthogonal to the extending direction of the mounting member 222. The protrusions formed on the pulleys 227a and 227b engage with each other, and the pulley 227b is driven by the motor 226 via the timing belt, so that the mounting member 222 moves in the II direction.
[0013]
As shown in FIG. 5, the detachment assist mechanism 261 includes a pressing bar 262, a swing plate 264, and a protrusion pin 263, and is provided in the component holding device 303 by a pressing mechanism 321 that can be moved up and down in the vertical direction. When the 262 is pressed, the swing plate 264 swings around the pivot 265, reaches the conveyance end position 228, that is, the component supply position 307, and moves the component 252 held by the nozzle 309 to the back side of the mounting member 222. Is pushed up by the push-up pin 263 toward the nozzle 309. The push bar 262 and the push-up pin 263 are both restored to their original states by springs 266 and 267.
[0014]
The component conveying device 221 configured as described above operates as follows. That is, the placement member 222 sent out from the supply-side reel 225 moves to the conveyance start position 223 after engaging with the pulley 227a. At the transfer start position 223, the component 252 is placed on the placement member 222 by the nozzle 215. The mounting member 222 is moved in the II direction by a certain amount by the motor 226 so that the next component 252 can be mounted each time the component 252 is mounted. In this way, at least one component 252 is placed on the placement member 222. The mounted component 252 is transferred to the transfer end position 228 by the transfer of the mounting member 222 by the motor 226. As shown in FIG. 3, the table 207 is transferred with or after the conveyance of the component 252 to the conveyance end position 228 so that the conveyance end position 228 in the component conveyance device 221 and the component supply position 307 in the component holding device 303 coincide with each other. The entire component rearrangement device 203 is guided by the rails 202 and 202 and moved in the X direction. Note that the nozzle 309 of the mounting head 306 holds the component 252 conveyed to the conveyance end position 228 by the component conveying device 221 in a state where the conveyance end position 228 and the component supply position 307 coincide with each other due to the movement. . When a plurality of components 252 are placed on the placement member 222, the component conveying device 221 moves the placement member 222 while winding the placement member 222 on the take-up reel 224. The plurality of components 252 placed on the placement member 222 are sequentially conveyed to the conveyance end position 228. Therefore, the nozzle 309 sequentially holds the components 252.
[0015]
As described above, in this embodiment, the mounting member 222 is an adhesive tape, but the adhesive tape can be configured as shown in FIG. That is, adhesive regions 231 to 233 having different adhesive forces in the width direction of the mounting member 222 are formed along the extending direction of the mounting member 222 with the center line 222b of the mounting member 222 as the axis of symmetry. For example, the adhesive region 231 has the weakest adhesive force in the three adhesive regions, and is located in the central portion including the center line 222b. The adhesive region 233 has the strongest adhesive force in the three adhesive regions, and is located at the side edge portion of the placement member 222 in the width direction. The adhesive region 232 has a medium adhesive force in the three adhesive regions, and is located between the adhesive region 231 and the adhesive region 233 in the width direction of the mounting member 222. By providing a plurality of types of regions having different adhesive forces as described above, the mounting member 222 can stably hold each of various components 234 to 236 having different sizes and weights as illustrated. In addition, the component holding force of the mounting member 222 is set to be smaller than the holding force of the nozzle 309 in the component holding device 303 due to suction, for example, and larger than the external force due to acceleration, inertial force, or the like applied to the component during conveyance by the mounting member 222. Is done. In addition, the said adhesion area | region is not limited to the above-mentioned three types, Moreover, the position is not limited to the above-mentioned arrangement | positioning. In FIG. 7, for the sake of convenience, the thickness of the adhesive regions 231 to 233 is shown to be larger than the thickness of the base material of the adhesive tape. Thinner than.
[0016]
Further, without providing the supply reel 225 and the take-up reel 224, the mounting member 222 may be configured as an endless belt and used many times.
Further, before the component 252 is first placed on the placement member 222 at the conveyance start position 223, the placement member 222 stretched between the conveyance start position 223 and the conveyance end position 228 is wasted. In order to avoid this, a predetermined amount of the mounting member 222 may be sequentially rewound onto the supply-side reel 225 and used without waste.
[0017]
In the present embodiment, as described above and as shown in FIGS. 1 and 3, the component supply cassette 3 is the only means for providing the component 252 to the component rearrangement device 203, but the present invention is not limited to this. Is not to be done. That is, as shown in FIG. 8, the parts supply cassette 3 or sticks 280, which are commonly called sticks, can supply parts 252 one by one along a slide-like part supply path, or in a frame arranged in a grid. A plurality of trays 281 and the like in which components 252 are housed can be used alone or in combination. Note that the tray 281 is movable in the XY directions.
In this manner, by using the stick 280 and the tray 281, parts 252 having different types, shapes, and sizes can be prepared. In this case, by using the above-mentioned adhesive tape having the plurality of adhesive regions 231 to 233 as the mounting member 222, the parts 252 having different shapes and sizes can be mounted more efficiently.
[0018]
The operation of the component mounter 100 of the present embodiment configured as described above will be described below. As shown in FIG. 9, the board transfer device 301, the XY table 302, the component holding device 303, and the component rearrangement device 203 are connected to a control device 110 provided in the component mounter 100 and perform operation control.
Any one of the component supply cassette 3 or the component supply cassette groups 205 and 206 for providing the component 252 to be mounted on the substrate 8 or the stick 280 and the tray 281 in addition to the component supply cassette groups 205 and 206 as shown in FIG. Install one or both. Note that the control device 110 of the component mounter 100 includes the component supply cassette 3, the types of components accommodated in the stick 280 and the tray 281, and the types of components 252 mounted on the substrate 8 according to the mounting information. The number is recognized in advance.
In this state, for example, when receiving a component from the component supply cassette group 206, the control device 110 first stores the component 252-1 to be mounted on the board 8 based on the mounting information. The component rearrangement device 203 is moved in the X direction so that the component selection position 253 in the supply cassette 3 and the nozzle 215 provided in the component rearrangement device 203 are disposed at the same position. After the movement of the component rearrangement device 203 is completed, the feed lever 251 provided in the component supply cassette 3 is pushed down by the feed lever driving device 213 provided in the component rearrangement device 203, and one of the components accommodated in the component supply cassette 3 is pressed. One part 252-1 is sent out to the part selection position 253. Next, the nozzle unit 214 provided in the component rearrangement device 203 is driven, and the component 252-1 is selected at the component selection position 253 by the nozzle 215 adapted to the component 252-1 sent to the component selection position 253. For example, by adsorbing. Further, the nozzle unit 214 is driven to move the nozzle 215 holding the component 252-1 in the II direction to the conveyance start position 223, and then the component 252-1 is placed on the mounting member 222 at the conveyance start position 223. Place. In this embodiment, since the mounting member 222 is an adhesive tape, the component 252-1 is adhered and held on the mounting member 222. After the placement, the component conveying device 221 moves the placement member 222 while winding it on the take-up reel 224 so that the next component can be placed on the placement member 222.
When the component is mounted on the substrate 8 by the nozzle 309 of the mounting head 306 every time the component is mounted on the mounting member 222, the component 252-is transferred by the transfer of the mounting member 222. 1 is transported to the transport end position 228. On the other hand, when a plurality of components are arranged on the mounting member 222 in advance, the above operations are repeated, so that the components 252-2 and 252 are sequentially arranged from the component supply cassette 3 corresponding to the component 252 to be mounted based on the mounting information. -3, 252-4, ... are placed on the placement member 222. In the following description, a case where a plurality of components 252 are placed on the placement member 222 is taken as an example.
Further, when the stick 280 and the tray 281 are further provided, as in the case of the component supply cassette group 206 described above, the components are sequentially held by the nozzles 215 from the corresponding stick 280 and tray 281 based on the mounting information. Are sequentially placed on the placement member 222. In particular, when receiving components from the tray 281, as described above, it is possible to provide components of various sizes, so even when components 252 of various sizes are sequentially mounted on the substrate 8. Depending on the mounting order, components 252 of various sizes can be arranged on the mounting member 222. In the case of the tray 281, since the components are arranged in a grid, the necessary components are positioned at the component selection position 253 so that the nozzle 215 of the nozzle unit 214 can hold the component at the component selection position 253. The tray 281 moves in the X and Y directions.
[0019]
In this way, the component rearrangement device 203 in which the components 252-1, 252-2, 253-3,... Are arranged on the mounting member 222 according to the mounting order is positioned at the head of the arranged components 252. After transporting the component 252-1 to be transported to the transport end position 228 or while transporting it, the transport end position 228 corresponds to the component supply position 307 for the nozzle 309 of the mounting head 306 along the rail 202 in the X direction. Moved to. Therefore, the component 252-1 positioned at the head is positioned at the component supply position 307 and can be sucked and held by the nozzle 309 of the mounting head 306.
[0020]
The XY table 302 is moved by the control device 110 so that the component 252-1 is mounted at the mounting position 308 on the substrate 8. Simultaneously with or before and after the movement of the XY table 302, the nozzle 309 of the mounting head 306 holds the component 252-1 by sucking, for example, and then moves the mounting head 306 to the mounting position 308. The component 252-1 is mounted. Further, when the nozzle 309 of the mounting head 306 holds the component 252-1, the depressing mechanism 321 provided in the mounting head 306 operates the separation assisting mechanism 261 provided in the component rearranging device 203 to remove the component from the mounting member 222. It is preferable to assist the removal of the part 252-1.
After the component 252-1 is removed from the placement member 222 in this way, the component rearrangement device 203 winds the placement member 222 with the take-up side reel 224, whereby the component to be mounted next. A certain component 252-2 is transported to the transport end position 228. Therefore, the component 252-2 is positioned at the component supply position 307 and can be held by the nozzle 309 of the mounting head 306. Thereafter, similarly to the case of the component 252-1 described above, the component 252-2 is mounted at the mounting position 308 where the component 252-2 is to be mounted. In the same manner, the components 252-3, 252-4,... Are sequentially mounted in the same manner in the mounting positions 308 corresponding to the respective components.
When all the components 252 to be mounted on one substrate 8 can be placed on the mounting member 222, the substrate 8 is transported when the mounting of all the components 252 on the mounting member 222 is completed. The component 301 is transported to the next process by the device 301, and the component rearrangement device 203 places the component 252 again on the placement member 222 from the component supply cassette 3 or the like in the order of mounting. On the other hand, there are many components 252 to be mounted on one substrate 8 with respect to the length from the transfer start position 223 to the transfer end position 228 in the mounting member 222, and all the components 252 to be mounted are on the mounting member 222. If the component rearrangement device 203 places the components 252 again in the order of mounting on the placement member 222 from the component supply cassette 3 or the like again, the component rearrangement device 203 again carries the transfer end position in the component rearrangement device 203. The component mounting is repeated by making 228 correspond to the component supply position 307 in the apparatus head 306. These operations are repeated until component mounting on one board 8 is completed.
[0021]
Thus, according to the component mounting machine 100 of the present embodiment, by providing the component rearrangement device 203, not only the component supply cassette 3 but also the components 252 stored in the tray 281 and the like are included in the component rearrangement device 203. It can be held by the nozzle 215 and conveyed to the component supply position 307. Therefore, flexible component mounting that is not trapped by the configuration of the component storage body that stores components is possible.
[0022]
Furthermore, by providing the component rearrangement device 203, for example, even if the components 252 have different shapes, they can be arranged on the mounting member 222 in the order of mounting, and flexible component mounting that is not captured by the form of the components 252. Is possible. In addition, for example, when mounting each component having a different shape, conventionally, it took time to replace the component supply cassette, for example. However, as described above, it is not captured by the configuration of the component storage body that stores the component. Since the components 252 can be arranged on the placement member 222 in the order of mounting by the nozzle 215 of the component rearrangement device 203, the respective components 252 are continuously placed from the placement member 222 to the component supply position 307. The component 252 can be supplied, and the time required for mounting can be shortened as compared with the prior art.
[0023]
Also, since the nozzle 215 of the component rearrangement device 203 has only to arrange the component supply cassette 3 or the like that stores the components necessary for mounting at the component selection position 253 that holds the components, as shown in FIG. There is no need to arrange a large number of component supply cassettes 3 along the X direction shown. Therefore, according to the present embodiment, it is possible to provide a component mounter having a short length in the X direction, that is, the conveyance direction of the substrate 8.
[0024]
In the above-described embodiment, the mounting member 222 in the component rearrangement device 203 is extended in the Y direction as shown in FIG. 1, for example. However, the present invention is not limited to this. It may be extended.
Further, from the viewpoint of enabling flexible component mounting that is not caught by the shape of the component storage body such as the component supply cassette 3 or the tray 281, the component rearrangement device 203 does not have to be provided with the mounting member 222. Good. In this case, the component is held by the nozzle 215 in the component rearrangement device 203, and the component held by the nozzle 215 is directly transferred to the component supply position 307 by moving the component rearrangement device 203 and the nozzle 215. It becomes operation to do. The component rearrangement device 203 needs to be provided with a transfer device having a structure for performing such an operation.
[0025]
【The invention's effect】
As described in detail above, according to the component supply device of the first aspect and the component supply method of the third aspect of the present invention, the component relocation device is provided, and the held component is mounted on the mounting member, and mounted. Since the placed component is transported to the component supply position in order to be mounted on the substrate, various components having different shapes and sizes can be placed in advance on the placement member. Therefore, it is possible to supply a flexible component that is not captured by the shape of the component storage body and that is not captured by the shape or size of the component.
[0026]
According to the component mounting machine of the second aspect of the present invention and the component mounting method of the fourth aspect, the mounting member is provided with the component supply device of the first aspect and the component supply method of the second aspect. Since the component placed on the top is transported to the component supply position and used for mounting on the board, various components having different shapes and sizes can be placed in advance on the placement member. . Therefore, it is possible to perform flexible component mounting that is not caught by the form of the component storage body, and it is possible to continuously mount the various components arranged on the mounting member, and to shorten the time required for mounting compared to the conventional case. Can do.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a configuration of a component mounter having a component supply apparatus according to an embodiment of the present invention.
FIG. 2 is a side view of FIG.
FIG. 3 is a plan view of FIG. 1;
FIG. 4 is a side view of the component supply apparatus shown in FIG.
FIG. 5 is a diagram illustrating a configuration of a separation assisting device provided in the component rearrangement device illustrated in FIG.
6 is a plan view showing an example of a placement member provided in the component rearrangement apparatus shown in FIG. 1. FIG.
7 is a cross-sectional view of FIG. 6. FIG.
FIG. 8 is a perspective view showing the configuration of another embodiment of the component mounter shown in FIG. 1;
FIG. 9 is a block diagram of the component mounter shown in FIG. 1;
FIG. 10 is a plan view showing a configuration of a conventional component mounter.
[Explanation of symbols]
3 ... parts supply cassette,
100: Component mounting machine, 110: Control device,
200 ... part supply device, 203 ... part rearrangement device,
208 ... mobile device,
211 ... Transfer device, 221 ... Part conveyance device, 222 ... Placement member,
224... Take-up reel, 225. Supply reel,
253 ... part selection position, 261 ... separation assist device, 281 ... tray,
300 ... component holding and conveying device, 303 ... component holding device,
307: Component supply position.

Claims (1)

In the component supply device (200) provided in the component mounter (100) for mounting the component held at the component supply position (307) to the mounting position on the substrate,
A transfer device (211) for holding a component from the component storage body (3, 280, 281) and placing the held component on the adhesive tape (222);
E Bei parts rearranging device (203) and a component feeder (221) for conveying the components placed on the adhesive tape to the component supply position,
The above-mentioned pressure-sensitive adhesive tape has a plurality of pressure-sensitive adhesive regions having different adhesive forces with a center line as a symmetry axis in the width direction perpendicular to the extending direction .

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