JP3859319B2

JP3859319B2 - Component supply apparatus, component mounting machine, and component mounting method

Info

Publication number: JP3859319B2
Application number: JP24830997A
Authority: JP
Inventors: 茂和米山; 勇蔵西森; 眞透瀬野
Original assignee: Panasonic Corp; Matsushita Electric Industrial Co Ltd
Current assignee: Panasonic Corp; Panasonic Holdings Corp
Priority date: 1997-09-12
Filing date: 1997-09-12
Publication date: 2006-12-20
Anticipated expiration: 2017-09-12
Also published as: JPH1187990A

Description

【０００１】
【発明の属する技術分野】
本発明は、電子部品等の部品を吸着して回路基板等に実装する部品実装機に備わる部品供給装置、及び該部品供給装置にて実行される部品供給方法、並びに上記部品供給装置を備えた部品実装機、及び該部品実装機にて実行される部品実装方法に関する。
【０００２】
【従来の技術】
従来、上記部品実装機は、特公平３−２２１３２６号公報に開示され、図１３に示すような、部品供給装置１を備えた部品装着機２が一般的であった。即ち、部品供給装置１は、テープの延在方向に沿って部品が当該テープ上に仮固定され当該テープを巻回した複数の部品供給カセット３と、該部品供給カセット３が装着可能でありレール６に支持されかつ案内されて自走可能な第１供給テーブル４及び第２供給テーブル５とを備える。尚、各部品供給カセット３毎に、テープ上に仮固定されている部品の種類を変更してもよいし、同一としてもよい。部品実装機２には、部品供給カセット３における上記テープ上の部品を吸着保持して、ＸＹテーブル７によって位置決めされた基板８上の実装位置に上記保持した部品を実装する装着ヘッド９を備える。
このような従来の部品実装機は以下のように動作する。例えば、第１、第２の供給テーブル４，５にはそれぞれ同種類の電子部品を有する部品供給カセット３を装着しておくことで、一方の供給テーブルにてある種類の部品切れが発生した場合には、該一方の供給テーブルと他方の供給テーブルとを入れ替え、上記他方の供給テーブルの部品供給カセット３からその部品を供給することができ、その間に部品切れが発生した部品供給カセット３への部品補給を行うことができる。又、使用する部品の種類が多い場合は、第１及び第２供給テーブル４，５に各々別種類の電子部品を有する供給カセット３を装着しておき、装着ヘッド９に対して、第１及び第２供給テーブル４，５を入れ替えながら必要な部品を吸着保持して基板８へ実装する。
【０００３】
【発明が解決しようとする課題】
近年、高速電子部品実装機にて多品種の部品を実装可能とする要求や、部品供給カセット３によって予め部品種類が決定されているものに限られず、種々の形態の部品に対して柔軟に対応可能な実装機の要求が高まっている。しかしながら、上述のように従来の部品実装機２では、部品供給カセット３を使用することから、実装する部品の種類がカセット毎に決定されており、又、テープ上に部品が仮固定されたような部品以外は実装できず、応用範囲の狭い実装機となっている。
本発明は、このような問題点を解決するためになされたもので、実装要求のある部品に対して柔軟に対応可能である部品供給装置、部品実装機、部品供給方法、及び部品実装方法を提供することを目的とする。
【０００４】
【課題を解決するための手段】
本発明の第１態様による部品供給装置は、部品供給位置にて保持した部品を基板上の実装位置へ実装する部品実装機に備わる部品供給装置において、
部品収納体から部品を保持し保持した部品を、吸引動作にて部品を保持する吸着ベルト上に搬送開始位置にて載置する移載装置と、
上記吸着ベルト上に上記部品を吸着するために負圧を発生する負圧発生装置と、
上記吸着ベルトを備え、かつ少なくとも上記搬送開始位置から上記部品供給位置までの上記吸着ベルトの下方にて当該吸着ベルトの延在方向に沿って形成され上記負圧発生装置に連結した負圧溝と、上記吸着ベルトと上記負圧溝との間に上記吸着ベルトの延在方向に沿って設けられるシール部材と、上記吸着ベルト上に吸着された部品を上記吸着ベルトを移動させて上記部品供給位置まで搬送する部品搬送装置と、上記吸着ベルトに吸着された部品に対して上記部品供給位置における上記吸着ベルトからの離脱を容易にするため、上記部品の離脱時に上記負圧溝の内、上記部品供給位置に配置された部品に対応する離脱部品用負圧溝を上記負圧発生装置から遮断して上記負圧発生装置による負圧作用を及ばなくする切替装置と、を有する部品再配置装置と、
を備え、
上記離脱部品用負圧溝において、上記吸着ベルトと上記シール部材との間には、上記切替装置にて上記離脱部品用負圧溝が上記負圧発生装置から遮断された状態において上記離脱部品用負圧溝を大気圧に戻す隙間を設けたことを特徴とする。
【０００５】
本発明の第２態様による部品実装機は、上記第１態様による部品供給装置を備えたことを特徴とする。
【０００６】
本発明の第３態様による部品供給方法は、部品供給位置にて保持した部品を基板上の実装位置へ実装する部品実装機における部品供給方法において、
部品収納体から部品を保持し、
上記保持した部品を吸引動作にて部品を保持する吸着ベルト上に載置し、
上記吸着ベルトを移動させて上記載置した部品を上記部品供給位置まで移送する、
ことを備えたことを特徴とする。
【０００７】
本発明の第４態様による部品実装方法は、部品供給位置にて保持した部品を基板上の実装位置へ実装する部品実装機における部品実装方法において、
部品収納体から部品を保持し、
上記保持した部品を吸着ベルト上に搬送開始位置にて載置し、
上記搬送開始位置から上記部品供給位置までの上記吸着ベルトの下方にて上記吸着ベルトの延在方向に沿ってシール部材を介して形成される負圧溝であって、上記吸着ベルト上へ上記部品を吸着するために負圧を発生する負圧発生装置に連結される負圧溝による吸引動作にて上記載置した部品を上記吸着ベルト上に保持し、
上記吸着ベルトを移動させて上記保持した部品を上記部品供給位置まで移送し、
上記部品供給位置に移送された部品に対して上記吸着ベルトからの離脱を容易にするため、上記部品の離脱時に上記負圧溝の内、上記部品供給位置に配置された部品に対応する離脱部品用負圧溝を上記負圧発生装置から遮断して上記負圧発生装置による負圧作用を及ばなくし、
上記負圧作用を及ばなくすることで、上記離脱部品用負圧溝において上記吸着ベルトと上記シール部材との間に設けた隙間にて上記離脱部品用負圧溝を大気圧に戻して上記部品の吸引保持を解除し、
上記部品供給位置における部品を保持して上記実装位置へ実装する、
ことを備えたことを特徴とする。
【０００８】
【発明の実施の形態】
本発明の一実施形態の部品供給装置、部品実装機、部品供給方法、及び部品実装方法について、図を参照しながら以下に説明する。尚、各図において同一の構成部分については同じ符号を付している。又、上記部品供給方法は、上記部品供給装置にて実行されるものであり、上記部品実装機は上記部品供給装置を備えるものであり、上記部品実装方法は上記部品実装機にて実行されるものである。
【０００９】
図１ないし図４に示すように、本実施形態における部品実装機１００は、部品供給装置２００と、部品保持搬送装置３００とを備える。
図１に示すように部品保持搬送装置３００は、大きく分けて、基板搬送装置３０１、ＸＹテーブル３０２、及び部品保持装置３０３を備え、これらは皆公知の構成にてなる。よってこれらについての説明は略説する。基板搬送装置３０１は、当該実装工程の前工程から未実装の基板８をＸ方向に沿ってＸＹテーブル３０２上へ搬送し、かつ実装後の基板８を当該実装工程の後工程へＸ方向に沿って搬送する装置である。部品保持装置３０３は、部品保持搬送装置３００の台板３０４に固定された本体３０５と、図２及び図４に示すように、基板８に実装する部品を保持しかつ基板８への実装を行うノズル３０９を有し本体３０５の周囲に沿って移動可能な装着ヘッド３０６とを備え、部品供給位置３０７にて上記ノズル３０９で部品を保持して基板８上の実装位置３０８へ部品を実装する。上述のように装着ヘッド３０６は固定された本体３０５の周囲を移動することから、本実施形態においては、装着ヘッド３０６における部品供給位置３０７及び実装位置３０８に対応する位置は予め設定された不動の位置である。したがって、ＸＹテーブル３０２は、基板８を保持するとともに、部品を実装すべき基板８上の実装位置３０８と、装着ヘッド３０６における実装位置３０８に対応する位置とを一致させるように、基板８をＸ，Ｙ方向へ移動させる。
【００１０】
部品供給装置２００は、装着台２０１上、及び台座２０４上に着脱自在に装着された、従来と同様の構造にてなる複数の部品供給カセット３と、本実施形態における特徴的構成部分である部品再配置装置２０３とを有する。部品再配置装置２０３は、部品供給カセット３と部品保持装置３０３との間に配置され、部品供給カセット３から部品を保持して該部品を上記部品供給位置３０７へ搬送する。図１及び図３に示すように本実施形態では、それぞれが複数の部品供給カセット３を並設してなる、２組の部品供給カセット群２０５，２０６を備え、一方の部品供給カセット群２０５は、部品再配置装置２０３用の台座２０４上にて、部品保持搬送装置３００に隣接して設置され、他方の部品供給カセット群２０６は部品再配置装置２０３を介在させて部品保持搬送装置３００に隣接して設置される。又、本実施形態では、それぞれの部品供給カセット群２０５，２０６は、互いにその設置場所を交換可能である。
【００１１】
部品再配置装置２０３は、部品保持搬送装置３００の台板３０４に隣接して設置される台座２０４上にて部品供給カセット３の配列方向であるＸ方向に沿って敷設されたレール２０２，２０２に係合したテーブル２０７上に設置され、部品再配置装置２０３に備わる移動装置２０８にてテーブル２０７が駆動されることでレール２０２上を滑動する。尚、上記一方の部品供給カセット群２０５もレール２０２，２０２上をレール２０２に沿って滑動可能である。
このような部品再配置装置２０３は、移載装置２１１と、部品搬送装置２２１とを備える。
移載装置２１１は、送りレバー駆動装置２１３と、ノズルユニット２１４とを備える。送りレバー駆動装置２１３は、部品供給カセット３の部品供給部分に設けられる送りレバー２５１を押下するものであり、本実施形態ではエアーシリンダ２１２を駆動源としている。一方、上記送りレバー２５１はラチェット機構を有し、送りレバー駆動装置２１３にて送りレバー２５１が押下されることで、部品供給カセット３は、巻回している部品仮固定テープを送り出すことで該テープに付着している部品２５２を一つずつ部品選択位置２５３へ供給する。ノズルユニット２１４は、垂直方向であるＺ方向に相当する図示のI方向、及び該I方向と部品供給カセット３の配列方向であるＸ方向とに直交するＹ方向に相当するII方向に、ノズル２１５をカムにより移動可能とする機構を有するとともに、保持する部品２５２に適合したノズル２１５を自動的に選択可能な機構を有する。このようなノズル２１５は部品選択位置２５３にて上記I方向へ移動して部品２５２を保持する。そしてノズルユニット２１４が上記II方向へ移動して当該部品再配置装置２０３における載置部材２２２上の搬送開始位置２２３に上記保持した部品２５２を載置する。
【００１２】
部品搬送装置２２１は、上記載置部材２２２と、該載置部材２２２が巻回されている供給側リール２２５及び載置部材２２２を巻き取る巻取側リール２２４と、載置部材２２２を移動させる駆動源としてのモータ２２６と、離脱補助機構２６１とを備える。
本実施形態における載置部材２２２は、部品２５２が載置される載置面が粘着性を有する粘着テープであり、上記II方向に沿って配設された２つのプーリ２２７ａ，２２７ｂ間にて上記II方向に沿って張設される。載置部材２２２の延在方向に直交する幅方向における側縁部には、図６に示すように、送り穴２２２ａが上記延在方向に一定間隔にて明けられており、該送り穴２２２ａとプーリ２２７ａ，２２７ｂに形成されている突起とが係合し、タイミングベルトを介してモータ２２６にてプーリ２２７ｂが駆動されることで載置部材２２２は上記II方向へ移動する。
【００１３】
離脱補助機構２６１は、図５に示すように、押下棒２６２と、揺動板２６４と、突上ピン２６３とを備え、部品保持装置３０３に備わり垂直方向に昇降可能な押下機構３２１により押下棒２６２が押下されることで、枢軸２６５回りに揺動板２６４が揺動し、搬送終了位置２２８、即ち部品供給位置３０７に到達しノズル３０９にて保持される部品２５２を載置部材２２２の裏側からノズル３０９方向へ突上ピン２６３にて突き上げる。尚、押下棒２６２及び突上ピン２６３はともにスプリング２６６，２６７にて元の状態に復帰する。
【００１４】
このように構成される部品搬送装置２２１は以下のように動作する。即ち、供給側リール２２５から送出された載置部材２２２は、プーリ２２７ａに係合した後、搬送開始位置２２３へ移動する。搬送開始位置２２３ではノズル２１５にて部品２５２が載置部材２２２上に載置される。載置部材２２２は、部品２５２が載置される度に次の部品２５２が載置可能なようにモータ２２６にて一定量だけ上記II方向へ移送される。このようにして少なくとも一つの部品２５２が載置部材２２２上に載置される。載置された部品２５２はモータ２２６による載置部材２２２の移送により搬送終了位置２２８まで搬送される。図３に示すように、部品搬送装置２２１における搬送終了位置２２８と部品保持装置３０３における部品供給位置３０７とを一致させるように、部品２５２の搬送終了位置２２８までの搬送とともに又は搬送後に、テーブル２０７に備わる移動装置２０８にて部品再配置装置２０３の全体がレール２０２，２０２に案内されてＸ方向へ移動する。尚、該移動により上記搬送終了位置２２８と上記部品供給位置３０７とが一致した状態にて、装着ヘッド３０６のノズル３０９は部品搬送装置２２１にて搬送終了位置２２８に搬送された部品２５２を保持する。又、載置部材２２２上に複数の部品２５２が載置されているときには、部品搬送装置２２１は、巻取側リール２２４に載置部材２２２を巻き取らせながら載置部材２２２を移動することで、載置部材２２２上に載置した複数の部品２５２を順次、搬送終了位置２２８へ搬送する。よって上記ノズル３０９は、順次部品２５２を保持していく。
【００１５】
上述したように本実施形態では載置部材２２２は粘着テープであるが、該粘着テープは図６に示すように構成することができる。即ち、載置部材２２２の中心線２２２ｂを対称軸として載置部材２２２の幅方向において粘着力が異なる粘着領域２３１〜２３３を載置部材２２２の延在方向に沿って形成する。例えば、粘着領域２３１は、この３つの粘着領域内では粘着力が最も弱く、中心線２２２ｂを含む中央部分に位置する。粘着領域２３３は、この３つの粘着領域内では粘着力が最も強く、載置部材２２２の幅方向の側縁部分に位置する。粘着領域２３２は、この３つの粘着領域内では粘着力が中程度であり、載置部材２２２の幅方向において粘着領域２３１と粘着領域２３３との間に位置する。このように粘着力の異なる領域を複数種類設けることで、載置部材２２２は、図示するように大きさ、重量の異なる多種の部品２３４〜２３６のそれぞれを安定して粘着保持することができる。又、載置部材２２２の部品保持力は、部品保持装置３０３におけるノズル３０９の例えば吸着による保持力より小さく、かつ載置部材２２２による搬送時に部品に加わる加速度、慣性力等による外力よりは大きく設定される。尚、上記粘着領域は上述の３種類に限定されるものではなく、又、その位置も上述の配置に限定されるものではない。又、図７では、便宜上、粘着テープの基材の厚さに対して粘着領域２３１〜２３３の厚さを厚く図示しているが、実際には粘着領域２３１〜２３３の厚さは上記基材よりも薄い。
【００１６】
又、供給側リール２２５及び巻取側リール２２４を設けずに、載置部材２２２はエンドレスベルトのように構成し、何回も使うようにしてもよい。
又、搬送開始位置２２３にて部品２５２が最初に載置部材２２２に載置される前に、搬送開始位置２２３から搬送終了位置２２８までの間に張設されている載置部材２２２が無駄にならないように、順次、所定量の載置部材２２２を供給側リール２２５に巻き戻して、無駄無く使用するように構成してもよい。
【００１７】
又、本実施形態では、上述したように、又、図１、図３に示すように、部品再配置装置２０３へ部品２５２を提供する手段としては部品供給カセット３のみであるが、これに限定されるものではない。即ち、図８に示すように、部品供給カセット３や、スティックと通称され、滑り台状の部品供給路に沿って一つづつ部品２５２が供給可能なスティック２８０や、格子状に配列された枠内に部品２５２を収容した複数のトレイ２８１等を、単種類で、又は組み合わせて使用することができる。尚、トレイ２８１は、ＸＹ方向に移動可能である。
このようにスティック２８０やトレイ２８１を使用することで、種類、形状、及び大きさの異なる部品２５２を用意することができる。この場合、載置部材２２２として上述の複数の粘着領域２３１〜２３３を有する粘着テープを使用することで、形状や大きさの異なる部品２５２をより効率的に載置することができる。
【００１８】
このように構成される本実施形態の部品実装機１００の動作について以下に説明する。尚、図９に示すように、基板搬送装置３０１、ＸＹテーブル３０２、部品保持装置３０３、部品再配置装置２０３は、部品実装機１００に備わる制御装置１１０に接続され、動作制御が行われる。
基板８に実装する部品２５２を提供する、部品供給カセット３若しくは部品供給カセット群２０５，２０６、又は、図８に示すように部品供給カセット群２０５，２０６に加えてさらにスティック２８０、トレイ２８１のいずれ一方若しくはこれら両方を設置する。尚、当該部品実装機１００の制御装置１１０は、各部品供給カセット３や、スティック２８０、及びトレイ２８１に収容されている部品の種類、及び実装情報に従い基板８へ実装される部品２５２の種類、個数を予め認識している。
このような状態にて、例えば部品供給カセット群２０６から部品の提供を受ける場合、まず、上記制御装置１１０は、上記実装情報に基づき、基板８へ実装する部品２５２−１が収納されている部品供給カセット３における部品選択位置２５３と、部品再配置装置２０３に備わるノズル２１５とが同位置に配置されるように、部品再配置装置２０３をＸ方向に移動させる。部品再配置装置２０３の移動終了後、部品供給カセット３に備わる送りレバー２５１を部品再配置装置２０３に備わる送りレバー駆動装置２１３にて押下して、部品供給カセット３に収容している部品の一つの部品２５２−１を部品選択位置２５３へ送り出させる。次に、部品再配置装置２０３に備わるノズルユニット２１４を駆動して、上記部品選択位置２５３へ送り出された部品２５２−１に適合するノズル２１５によって、上記部品選択位置２５３にて上記部品２５２−１を例えば吸着することで保持する。さらにノズルユニット２１４を駆動して、部品２５２−１を保持したノズル２１５を上記II方向へ搬送開始位置２２３まで移動した後、搬送開始位置２２３にて載置部材２２２上に当該部品２５２−１を載置する。尚、本実施形態では載置部材２２２は粘着テープであることから部品２５２−１は載置部材２２２上に粘着し保持される。該載置後、部品搬送装置２２１は、次の部品が載置部材２２２上に載置可能なように、載置部材２２２を巻取側リール２２４に巻き取らせながら移送する。
尚、載置部材２２２へ部品が載置される度に、載置された部品を装着ヘッド３０６のノズル３０９にて基板８へ実装する場合には、載置部材２２２の移送により上記部品２５２−１は搬送終了位置２２８まで搬送される。一方、複数の部品を載置部材２２２上に予め配置するときには、上述の動作を繰り返すことで、上記実装情報に基づき実装すべき部品２５２に対応する部品供給カセット３から順次部品２５２−２，２５２−３，２５２−４，…を載置部材２２２上へ載置していく。尚、以下の説明では複数の部品２５２が載置部材２２２上へ載置された場合を例に採る。
又、スティック２８０及びトレイ２８１をさらに設けた場合も、上述の部品供給カセット群２０６の場合と同様であり、上記実装情報に基づき対応するスティック２８０及びトレイ２８１からノズル２１５にて順次部品を保持して載置部材２２２上に順次載置する。特に、トレイ２８１から部品提供を受ける場合、上述したように、種々の大きさの部品の提供が可能であることから、種々の大きさの部品２５２が順次基板８に実装されるようなときでも、その実装順に応じて種々の大きさの部品２５２を載置部材２２２上に配置することができる。尚、トレイ２８１の場合、部品が格子状に配列されているのでノズルユニット２１４のノズル２１５が部品選択位置２５３にて部品を保持可能なように、必要な部品が部品選択位置２５３に位置するようにトレイ２８１はＸ，Ｙ方向に移動する。
【００１９】
このようにして載置部材２２２上に実装順に従い部品２５２−１，２５２−２，２５２−３，…が配列された部品再配置装置２０３は、上記配列された部品２５２の内、先頭に位置する部品２５２−１を搬送終了位置２２８へ搬送した後、又は搬送しながら、装着ヘッド３０６のノズル３０９に対する部品供給位置３０７に上記搬送終了位置２２８が対応するように、レール２０２に沿ってＸ方向に移動される。したがって、上記先頭に位置する部品２５２−１は、部品供給位置３０７に位置することになり、装着ヘッド３０６のノズル３０９にて吸着、保持が可能となる。
【００２０】
基板８上の実装位置３０８に上記部品２５２−１が実装されるように、制御装置１１０にてＸＹテーブル３０２が移動される。該ＸＹテーブル３０２の移動と同時に、又はその前後にて、装着ヘッド３０６のノズル３０９は上記部品２５２−１を例えば吸着することで保持し、その後の装着ヘッド３０６の移動により上記実装位置３０８へ上記部品２５２−１を実装する。又、装着ヘッド３０６のノズル３０９が上記部品２５２−１を保持するとき、装着ヘッド３０６に備わる押下機構３２１により部品再配置装置２０３に備わる離脱補助機構２６１を動作させて、載置部材２２２からの部品２５２−１の離脱を補助するのが好ましい。
このようにして部品２５２−１が載置部材２２２から外された後、部品再配置装置２０３は、巻取側リール２２４にて載置部材２２２を巻き取ることで、次に実装される部品である部品２５２−２を搬送終了位置２２８へ搬送する。よって、部品２５２−２は、部品供給位置３０７に位置することになり、装着ヘッド３０６のノズル３０９にて保持が可能となる。以後、上述した部品２５２−１の場合と同様にして、部品２５２−２が実装されるべき実装位置３０８へ部品２５２−２が実装される。以下、同様にして順次、部品２５２−３，２５２−４，…がそれぞれの部品に対応する実装位置３０８へ実装されていく。
一枚の基板８に実装すべきすべての部品２５２が載置部材２２２上に載置できる場合には、載置部材２２２上のすべての部品２５２の実装が終了した時点で、基板８は基板搬送装置３０１にて次工程へ搬送され、又、部品再配置装置２０３は、再び、部品供給カセット３等から載置部材２２２上へ実装順に部品２５２を載置する。一方、載置部材２２２における搬送開始位置２２３から搬送終了位置２２８までの長さに対して一枚の基板８に実装すべき部品２５２が多く、実装すべきすべての部品２５２が載置部材２２２上に載置できない場合には、部品再配置装置２０３は、再び、部品供給カセット３等から載置部材２２２上へ実装順に部品２５２を載置した後、再度、部品再配置装置２０３における搬送終了位置２２８と装置ヘッド３０６における部品供給位置３０７とを対応させて、部品実装を繰り返す。これらの動作を１枚の基板８への部品実装が終了するまで繰り返す。
【００２１】
このように本実施形態の部品実装機１００によれば、部品再配置装置２０３を設けたことで、部品供給カセット３に限らずトレイ２８１等に収納されている部品２５２も部品再配置装置２０３のノズル２１５によって保持して、部品供給位置３０７へ搬送することができる。よって、部品を収納している部品収納体の形態に捕らわれない柔軟な部品実装が可能となる。
【００２２】
さらに、部品再配置装置２０３を設けたことで、例えばそれぞれが形状の異なる部品２５２であっても載置部材２２２上に実装順に配置することができ、部品２５２の形態に捕らわれない柔軟な部品実装が可能となる。又、例えば形状が異なるそれぞれの部品を実装する場合、従来では例えば部品供給カセットを交換する等の時間を要したが、上述のように、部品を収納している部品収納体の形態に捕らわれず部品再配置装置２０３のノズル２１５にて実装順に部品２５２を載置部材２２２上に配置することができることから、各部品２５２を載置した載置部材２２２から部品供給位置３０７へ連続的にそれぞれの部品２５２を供給することができ、実装に要する時間を従来より短縮することができる。
【００２３】
又、部品再配置装置２０３のノズル２１５が部品を保持する部品選択位置２５３へ実装に必要な部品を収納している部品供給カセット３等を配置すればよいことから、従来のように図９に示すＸ方向に沿って多数の部品供給カセット３を配列する必要がなくなる。よって、本実施形態によれば、上記Ｘ方向、即ち基板８の搬送方向に長さが短い部品実装機を提供することができる。
【００２４】
尚、上述の実施形態では、部品再配置装置２０３における載置部材２２２は、例えば図１に示すように、Ｙ方向に延在させているが、これに限定されるものではなく、Ｘ方向に延在させてもよい。
又、部品供給カセット３やトレイ２８１のような部品収納体の形態に捕らわれない柔軟な部品実装を可能にするという観点によれば、部品再配置装置２０３には載置部材２２２を設けなくてもよい。この場合には、部品再配置装置２０３におけるノズル２１５にて部品を保持し、部品再配置装置２０３及びノズル２１５を移動させることで、ノズル２１５にて保持した部品を直接に部品供給位置３０７へ搬送する動作となる。尚、部品再配置装置２０３には、このような動作を行う構造を有する移載装置を設ける必要がある。
【００２５】
上述の実施形態では、載置部材２２２として粘着テープを例に採り説明したが、以下に説明するように載置部材２２２として、図１０及び図１１に示すように、負圧により部品２５２を吸着可能な吸着ベルト４０１を使用することもできる。この場合、上述した部品再配置装置２０３に対応した、本例における部品再配置装置１２０３には新たに負圧発生装置４０２が設けられ、部品再配置装置１２０３の部品搬送装置１２２１には、部品の吸着及び非吸着を切り替える切替装置４０３が新たに設けられる。尚、本例における部品再配置装置１２０３は、以下に説明する構成、動作においてのみ上述の部品再配置装置２０３と相違するものであり、その基本的な構成、動作は上述の部品再配置装置２０３と相違するところはない。
【００２６】
又、吸着ベルト４０１上に部品２５２が載置される上述の搬送開始位置２２３からノズル３０９にて部品が保持される部品供給位置３０７まで、吸着ベルト４０１上に部品２５２を吸着保持可能なように、部品搬送装置１２２１には吸着ベルト４０１の延在方向に沿って吸着ベルト４０１の下方に、負圧溝４０４が形成されている。該負圧溝４０４には上記負圧発生装置４０２が接続される。又、吸着ベルト４０１における幅方向の両縁部分に対応して、吸着ベルト４０１と負圧溝４０４との間には、負圧溝４０４内の負圧を維持可能なように、気密確保用シール部材４０５が吸着ベルト４０１の延在方向に沿って設けられている。又、吸着ベルト４０１には、その幅方向のほぼ中央部分に、その延在方向に沿って一定間隔にて吸着用穴４０６が明けられている。よって、負圧発生装置４０２にて負圧溝４０４内が負圧となり、吸着用穴４０６上に部品２５２が載置されることで部品２５２は吸着ベルト４０１に吸着保持される。尚、制御装置１１０により、部品再配置装置１２０３における移載装置２１１のノズルユニット２１４の上記II方向への移動が制御され、ノズルユニット２１４のノズル２１５にて保持された部品２５２は、吸着ベルト４０１の吸着用穴４０６に対応して載置される。尚、上述の実施形態にて説明したように、プーリ２２７ｂはモータ２２６にて駆動してもよいが、図１０に示すように、別途設けた駆動用モータ４０７によりタイミングベルト４０８を介して駆動させてもよい。
【００２７】
切替装置４０３は、図１０及び図１２に示すように、遮蔽部材４０９と遮蔽部材４０９を駆動する駆動用シリンダ４１０とを備える。部品供給位置３０７に到達した部品２５２は装着ヘッド３０６のノズル３０９にて吸着されねばならないことから、制御装置１１０の動作制御により、部品供給位置３０７に位置する部品２５２を吸着するために装着ヘッド３０６のノズル３０９が下降すると同時に、駆動用シリンダ４１０が動作して遮蔽部材４０９が上昇する。これにより、部品供給位置３０７に配置されている部品２５２に対応した離脱部品用負圧溝４０４−１は、負圧溝４０４から遮断され、負圧発生装置４０２による吸引動作が部品供給位置３０７に配置されている部品２５２に作用しないようになる。よって、離脱部品用負圧溝４０４−１内の気圧は、吸着ベルト４０１と気密確保用シール４０５とのわずかな隙間等からのリークにより、大気圧に戻る。尚、装着ヘッド３０６のノズル３０９にて部品２５２が吸着されノズル３０９が上昇を開始した時点で、駆動用シリンダ４１０が動作し遮蔽部材４０９は下降する。よって、離脱部品用負圧溝４０４−１は、負圧発生装置４０２により再び負圧状態になる。吸着ベルト４０１上に複数の部品２５２が吸着されているときには、このような動作を繰り返して順次部品２５２が装着ヘッド３０６にて基板８へ実装されていく。
【００２８】
【発明の効果】
以上詳述したように本発明の第１態様の部品供給装置、及び第３態様の部品供給方法によれば、部品再配置装置を備え、部品を吸着ベルト上に吸着させ、吸着した部品を基板への実装に供するために部品供給位置に搬送するようにしたことから、上記吸着ベルト上には例えば形状や大きさの異なる種々の部品を予め配置することができる。したがって、部品収納体の形態に捕らわれず、かつ部品の例えば形状や大きさに捕らわれない柔軟な部品の供給を行うことができる。
【００２９】
又、本発明の第２態様の部品実装機、及び第４態様の部品実装方法によれば、上記第１態様の部品供給装置、及び第２態様の部品供給方法を備えることで、吸着ベルト上に吸着した部品を部品供給位置に搬送して基板への実装に供するようにしたことから、上記吸着ベルト上には例えば形状や大きさの異なる種々の部品を予め配置することができる。したがって、部品収納体の形態に捕らわれない柔軟な部品実装を行うことができるとともに、上記吸着ベルトに配置した上記種々の部品を連続的に実装可能であり実装に要する時間を従来より短縮することができる。
【図面の簡単な説明】
【図１】本発明の一実施形態の部品供給装置を有する部品実装機の構成を示す斜視図である。
【図２】図１の側面図である。
【図３】図１の平面図である。
【図４】図１に示す部品供給装置の側面図である。
【図５】図１に示す部品再配置装置に備わる離脱補助装置の構成を示す図である。
【図６】図１に示す部品再配置装置に備わる載置部材の一例を示す平面図である。
【図７】図６の横断面図である。
【図８】図１に示す部品実装機の他の実施形態の構成を示す斜視図である。
【図９】図１に示す部品実装機におけるブロック図である。
【図１０】図１に示す部品供給装置において載置部材として吸着ベルトを用いた場合の部品搬送装置の側面図である。
【図１１】図１０に示す部品搬送装置の平面図である。
【図１２】図１０に示すIII−III部の断面図である。
【図１３】従来の部品実装機の構成を示す平面図である。
【符号の説明】
３…部品供給カセット、
１００…部品実装機、１１０…制御装置、
２００…部品供給装置、２０３…部品再配置装置、
２０８…移動装置、
２１１…移載装置、２２１…部品搬送装置、２２２…載置部材、
２２４…巻取側リール、２２５…供給側リール、
２５３…部品選択位置、２６１…離脱補助装置、２８１…トレイ、
３００…部品保持搬送装置、３０３…部品保持装置、
３０７…部品供給位置
４０１…吸着ベルト、４０２…負圧発生装置、４０３…切替装置、
４０４…負圧溝、
１２０３…部品再配置装置、１２２１…部品搬送装置。[0001]
BACKGROUND OF THE INVENTION
The present invention includes a component supply device provided in a component mounter that picks up a component such as an electronic component and mounts the component on a circuit board, the component supply method executed by the component supply device, and the component supply device. The present invention relates to a component mounting machine and a component mounting method executed by the component mounting machine.
[0002]
[Prior art]
Conventionally, the component mounting machine is disclosed in Japanese Patent Publication No. 3-221326, and a component mounting machine 2 including a component supply apparatus 1 as shown in FIG. That is, the component supply apparatus 1 includes a plurality of component supply cassettes 3 in which components are temporarily fixed on the tape along the tape extending direction and the tape is wound, and the component supply cassette 3 can be mounted on the rail. A first supply table 4 and a second supply table 5 that are supported by 6 and guided and capable of self-propelling are provided. Note that the type of components temporarily fixed on the tape may be changed or the same for each component supply cassette 3. The component mounting machine 2 includes a mounting head 9 that sucks and holds the components on the tape in the component supply cassette 3 and mounts the held components on the mounting position on the substrate 8 positioned by the XY table 7.
Such a conventional component mounter operates as follows. For example, when a component supply cassette 3 having the same type of electronic component is mounted on each of the first and second supply tables 4 and 5, a certain type of component breakage occurs in one of the supply tables. The one supply table and the other supply table can be exchanged, and the parts can be supplied from the component supply cassette 3 of the other supply table. Parts can be replenished. When there are many types of parts to be used, the supply cassette 3 having different types of electronic parts is mounted on the first and second supply tables 4 and 5, and the first and second supply tables 3 are mounted on the mounting head 9. While replacing the second supply tables 4 and 5, necessary components are sucked and held and mounted on the substrate 8.
[0003]
[Problems to be solved by the invention]
In recent years, it is not limited to the requirement that various types of components can be mounted on a high-speed electronic component mounting machine, and the component supply cassette 3 is not limited to the component type determined in advance, and can flexibly handle various types of components. The demand for possible mounting machines is increasing. However, since the conventional component mounter 2 uses the component supply cassette 3 as described above, the type of component to be mounted is determined for each cassette, and the component seems to be temporarily fixed on the tape. This is a mounting machine with a narrow range of applications, with the exception of other parts.
The present invention has been made to solve such problems, and provides a component supply device, a component mounter, a component supply method, and a component mounting method that can flexibly cope with components that require mounting. The purpose is to provide.
[0004]
[Means for Solving the Problems]
  The component supply apparatus according to the first aspect of the present invention is a component supply apparatus provided in a component mounting machine that mounts a component held at a component supply position on a mounting position on a substrate.
  A transfer device that holds and holds a component from the component storage body on a suction belt that holds the component in a suction operation at a transfer start position; and
  A negative pressure generating device for generating a negative pressure for adsorbing the parts on the adsorption belt;
  A negative pressure groove including the suction belt and formed along the extending direction of the suction belt below the suction belt from at least the conveyance start position to the component supply position and connected to the negative pressure generatorAnd a seal member provided along the extending direction of the suction belt between the suction belt and the negative pressure groove,The parts adsorbed on the adsorption beltMove the suction beltA component conveying device for conveying to the component supply position;In order to facilitate the separation of the component adsorbed by the adsorption belt from the adsorption belt at the component supply position, the component arranged at the component supply position in the negative pressure groove when the component is detached A switching device that shuts off the corresponding negative pressure groove for the detachment part from the negative pressure generating device and does not exert a negative pressure action by the negative pressure generating device;A component rearrangement device comprising:
With
  In the release part negative pressure groove, between the suction belt and the seal member, the release part negative pressure groove is disconnected from the negative pressure generator by the switching device. A clearance was provided to return the negative pressure groove to atmospheric pressure.It is characterized by that.
[0005]
A component mounter according to a second aspect of the present invention includes the component supply device according to the first aspect.
[0006]
A component supply method according to a third aspect of the present invention is a component supply method in a component mounter that mounts a component held at a component supply position on a mounting position on a substrate.
Hold the parts from the parts container,
Place the held part on the suction belt that holds the part by suction operation,
Move the suction belt to transfer the parts placed above to the parts supply position,
It is characterized by having that.
[0007]
  A component mounting method according to a fourth aspect of the present invention is a component mounting method in a component mounting machine for mounting a component held at a component supply position to a mounting position on a substrate.
  Hold the parts from the parts container,
  Place the held parts on the suction belt at the transfer start position,
A negative pressure groove formed through a sealing member along the extending direction of the suction belt below the suction belt from the conveyance start position to the component supply position, wherein the component is placed on the suction belt. Holding the above-mentioned components in the suction operation by the negative pressure groove connected to the negative pressure generating device that generates a negative pressure to suck the
Move the suction belt to transfer the held parts to the parts supply position,
In order to facilitate separation of the component transferred to the component supply position from the suction belt, a separation component corresponding to the component arranged at the component supply position in the negative pressure groove when the component is detached. The negative pressure groove for use is cut off from the negative pressure generating device so that the negative pressure action by the negative pressure generating device is not affected.
By eliminating the negative pressure action, the negative pressure groove for the separation part is returned to the atmospheric pressure by a gap provided between the suction belt and the seal member in the negative pressure groove for the separation part. Release the suction hold of
Hold the component at the component supply position and mount it at the mounting position.
It is characterized by havingAnd
[0008]
DETAILED DESCRIPTION OF THE INVENTION
A component supply apparatus, a component mounter, a component supply method, and a component mounting method according to an embodiment of the present invention will be described below with reference to the drawings. In addition, the same code | symbol is attached | subjected about the same component in each figure. The component supply method is executed by the component supply device, the component mounter includes the component supply device, and the component mounting method is executed by the component mounter. Is.
[0009]
As illustrated in FIGS. 1 to 4, the component mounter 100 according to the present embodiment includes a component supply device 200 and a component holding and conveying device 300.
As shown in FIG. 1, the component holding / conveying device 300 is roughly divided into a substrate conveying device 301, an XY table 302, and a component holding device 303, all of which have a known configuration. Therefore, the description about these is abbreviated. The substrate transport device 301 transports the unmounted substrate 8 from the previous process of the mounting process onto the XY table 302 along the X direction, and moves the mounted board 8 to the subsequent process of the mounting process along the X direction. It is a device that conveys. The component holding device 303 holds the main body 305 fixed to the base plate 304 of the component holding and conveying device 300 and the components to be mounted on the substrate 8 and mounts on the substrate 8 as shown in FIGS. A mounting head 306 having a nozzle 309 and movable along the periphery of the main body 305 is provided. The component is held by the nozzle 309 at the component supply position 307 and mounted on the mounting position 308 on the substrate 8. Since the mounting head 306 moves around the fixed main body 305 as described above, in the present embodiment, the positions corresponding to the component supply position 307 and the mounting position 308 in the mounting head 306 are set in advance. Position. Therefore, the XY table 302 holds the substrate 8 and positions the substrate 8 on the substrate 8 so that the mounting position 308 on the substrate 8 on which the component is to be mounted and the position corresponding to the mounting position 308 in the mounting head 306 coincide with each other. , Move in the Y direction.
[0010]
The component supply apparatus 200 includes a plurality of component supply cassettes 3 that are detachably mounted on the mounting table 201 and the pedestal 204, and components that are characteristic components in the present embodiment. And a rearrangement device 203. The component rearrangement device 203 is disposed between the component supply cassette 3 and the component holding device 303, holds the component from the component supply cassette 3, and conveys the component to the component supply position 307. As shown in FIGS. 1 and 3, in this embodiment, each of the component supply cassette groups 205 includes two component supply cassette groups 205 and 206 each having a plurality of component supply cassettes 3 arranged side by side. On the pedestal 204 for the component rearrangement device 203, it is installed adjacent to the component holding and conveying device 300, and the other component supply cassette group 206 is adjacent to the component holding and conveying device 300 with the component rearranging device 203 interposed therebetween. Installed. Moreover, in this embodiment, each component supply cassette group 205,206 can mutually replace the installation place.
[0011]
The component rearrangement device 203 is mounted on rails 202 and 202 laid along the X direction which is the arrangement direction of the component supply cassette 3 on a pedestal 204 installed adjacent to the base plate 304 of the component holding and conveying device 300. It is installed on the engaged table 207 and is slid on the rail 202 when the table 207 is driven by the moving device 208 provided in the component rearrangement device 203. The one component supply cassette group 205 can also slide on the rails 202, 202 along the rail 202.
Such a component rearrangement device 203 includes a transfer device 211 and a component transport device 221.
The transfer device 211 includes a feed lever driving device 213 and a nozzle unit 214. The feed lever driving device 213 presses the feed lever 251 provided in the component supply portion of the component supply cassette 3, and in this embodiment, the air cylinder 212 is used as a drive source. On the other hand, the feed lever 251 has a ratchet mechanism. When the feed lever 251 is pushed down by the feed lever driving device 213, the component supply cassette 3 feeds the wound component temporary fixing tape to the tape. The parts 252 adhering to are supplied to the part selection position 253 one by one. The nozzle unit 214 has nozzles 215 in the I direction shown in the figure corresponding to the Z direction, which is the vertical direction, and in the II direction corresponding to the Y direction perpendicular to the I direction and the X direction, which is the arrangement direction of the component supply cassettes 3. And a mechanism capable of automatically selecting the nozzle 215 suitable for the component 252 to be held. Such a nozzle 215 moves in the I direction at the component selection position 253 and holds the component 252. Then, the nozzle unit 214 moves in the II direction and places the held component 252 at the conveyance start position 223 on the placement member 222 in the component rearrangement apparatus 203.
[0012]
The component conveying device 221 moves the mounting member 222, the supply-side reel 225 around which the mounting member 222 is wound, the take-up reel 224 that winds the mounting member 222, and the mounting member 222. A motor 226 as a drive source and a separation assist mechanism 261 are provided.
The mounting member 222 in the present embodiment is an adhesive tape on which the mounting surface on which the component 252 is mounted has adhesiveness, and the above described between the two pulleys 227a and 227b disposed along the II direction. It is stretched along the II direction. As shown in FIG. 6, feed holes 222a are formed at regular intervals in the extending direction at the side edges in the width direction perpendicular to the extending direction of the mounting member 222. The protrusions formed on the pulleys 227a and 227b engage with each other, and the pulley 227b is driven by the motor 226 via the timing belt, so that the mounting member 222 moves in the II direction.
[0013]
As shown in FIG. 5, the detachment assist mechanism 261 includes a pressing bar 262, a swing plate 264, and a protrusion pin 263, and is provided in the component holding device 303 by a pressing mechanism 321 that can be moved up and down in the vertical direction. When the 262 is pressed, the swing plate 264 swings around the pivot 265, reaches the conveyance end position 228, that is, the component supply position 307, and moves the component 252 held by the nozzle 309 to the back side of the mounting member 222. Is pushed up by the push-up pin 263 toward the nozzle 309. The push bar 262 and the push-up pin 263 are both restored to their original states by springs 266 and 267.
[0014]
The component conveying device 221 configured as described above operates as follows. That is, the placement member 222 sent out from the supply-side reel 225 moves to the conveyance start position 223 after engaging with the pulley 227a. At the transfer start position 223, the component 252 is placed on the placement member 222 by the nozzle 215. The mounting member 222 is moved in the II direction by a certain amount by the motor 226 so that the next component 252 can be mounted each time the component 252 is mounted. In this way, at least one component 252 is placed on the placement member 222. The mounted component 252 is transferred to the transfer end position 228 by the transfer of the mounting member 222 by the motor 226. As shown in FIG. 3, the table 207 is transferred with or after the conveyance of the component 252 to the conveyance end position 228 so that the conveyance end position 228 in the component conveyance device 221 and the component supply position 307 in the component holding device 303 coincide with each other. The entire component rearrangement device 203 is guided by the rails 202 and 202 and moved in the X direction. Note that the nozzle 309 of the mounting head 306 holds the component 252 conveyed to the conveyance end position 228 by the component conveying device 221 in a state where the conveyance end position 228 and the component supply position 307 coincide with each other due to the movement. . When a plurality of components 252 are placed on the placement member 222, the component conveying device 221 moves the placement member 222 while winding the placement member 222 on the take-up reel 224. The plurality of components 252 placed on the placement member 222 are sequentially conveyed to the conveyance end position 228. Therefore, the nozzle 309 sequentially holds the components 252.
[0015]
As described above, in this embodiment, the mounting member 222 is an adhesive tape, but the adhesive tape can be configured as shown in FIG. That is, adhesive regions 231 to 233 having different adhesive forces in the width direction of the mounting member 222 are formed along the extending direction of the mounting member 222 with the center line 222b of the mounting member 222 as the axis of symmetry. For example, the adhesive region 231 has the weakest adhesive force in the three adhesive regions, and is located in the central portion including the center line 222b. The adhesive region 233 has the strongest adhesive force in the three adhesive regions, and is located at the side edge portion of the placement member 222 in the width direction. The adhesive region 232 has a medium adhesive force in the three adhesive regions, and is located between the adhesive region 231 and the adhesive region 233 in the width direction of the mounting member 222. By providing a plurality of types of regions having different adhesive forces as described above, the mounting member 222 can stably hold each of various components 234 to 236 having different sizes and weights as illustrated. In addition, the component holding force of the mounting member 222 is set to be smaller than the holding force of the nozzle 309 in the component holding device 303 due to suction, for example, and larger than the external force due to acceleration, inertial force, or the like applied to the component during conveyance by the mounting member 222. Is done. In addition, the said adhesion area | region is not limited to the above-mentioned three types, Moreover, the position is not limited to the above-mentioned arrangement | positioning. In FIG. 7, for the sake of convenience, the thickness of the adhesive regions 231 to 233 is shown to be larger than the thickness of the base material of the adhesive tape. Thinner than.
[0016]
Further, without providing the supply reel 225 and the take-up reel 224, the mounting member 222 may be configured as an endless belt and used many times.
Further, before the component 252 is first placed on the placement member 222 at the conveyance start position 223, the placement member 222 stretched between the conveyance start position 223 and the conveyance end position 228 is wasted. In order to avoid this, a predetermined amount of the mounting member 222 may be sequentially rewound onto the supply-side reel 225 and used without waste.
[0017]
In the present embodiment, as described above and as shown in FIGS. 1 and 3, the component supply cassette 3 is the only means for providing the component 252 to the component rearrangement device 203, but the present invention is not limited to this. Is not to be done. That is, as shown in FIG. 8, the parts supply cassette 3 or sticks 280, which are commonly called sticks, can supply parts 252 one by one along a slide-like part supply path, or in a frame arranged in a grid. A plurality of trays 281 and the like in which components 252 are housed can be used alone or in combination. Note that the tray 281 is movable in the XY directions.
In this manner, by using the stick 280 and the tray 281, parts 252 having different types, shapes, and sizes can be prepared. In this case, by using the above-mentioned adhesive tape having the plurality of adhesive regions 231 to 233 as the mounting member 222, the parts 252 having different shapes and sizes can be mounted more efficiently.
[0018]
The operation of the component mounter 100 of the present embodiment configured as described above will be described below. As shown in FIG. 9, the board transfer device 301, the XY table 302, the component holding device 303, and the component rearrangement device 203 are connected to a control device 110 provided in the component mounter 100 and perform operation control.
Any one of the component supply cassette 3 or the component supply cassette groups 205 and 206 for providing the component 252 to be mounted on the substrate 8 or the stick 280 and the tray 281 in addition to the component supply cassette groups 205 and 206 as shown in FIG. Install one or both. Note that the control device 110 of the component mounter 100 includes the component supply cassette 3, the types of components accommodated in the stick 280 and the tray 281, and the types of components 252 mounted on the substrate 8 according to the mounting information. The number is recognized in advance.
In this state, for example, when receiving a component from the component supply cassette group 206, the control device 110 first stores the component 252-1 to be mounted on the board 8 based on the mounting information. The component rearrangement device 203 is moved in the X direction so that the component selection position 253 in the supply cassette 3 and the nozzle 215 provided in the component rearrangement device 203 are disposed at the same position. After the movement of the component rearrangement device 203 is completed, the feed lever 251 provided in the component supply cassette 3 is pushed down by the feed lever driving device 213 provided in the component rearrangement device 203, and one of the components accommodated in the component supply cassette 3 is pressed. One part 252-1 is sent out to the part selection position 253. Next, the nozzle unit 214 provided in the component rearrangement device 203 is driven, and the component 252-1 is selected at the component selection position 253 by the nozzle 215 adapted to the component 252-1 sent to the component selection position 253. For example, by adsorbing. Further, the nozzle unit 214 is driven to move the nozzle 215 holding the component 252-1 in the II direction to the conveyance start position 223, and then the component 252-1 is placed on the mounting member 222 at the conveyance start position 223. Place. In this embodiment, since the mounting member 222 is an adhesive tape, the component 252-1 is adhered and held on the mounting member 222. After the placement, the component conveying device 221 moves the placement member 222 while winding it on the take-up reel 224 so that the next component can be placed on the placement member 222.
When the component is mounted on the substrate 8 by the nozzle 309 of the mounting head 306 every time the component is mounted on the mounting member 222, the component 252-is transferred by the transfer of the mounting member 222. 1 is transported to the transport end position 228. On the other hand, when a plurality of components are arranged on the mounting member 222 in advance, the above operations are repeated, so that the components 252-2 and 252 are sequentially arranged from the component supply cassette 3 corresponding to the component 252 to be mounted based on the mounting information. -3, 252-4, ... are placed on the placement member 222. In the following description, a case where a plurality of components 252 are placed on the placement member 222 is taken as an example.
Further, when the stick 280 and the tray 281 are further provided, as in the case of the component supply cassette group 206 described above, the components are sequentially held by the nozzles 215 from the corresponding stick 280 and tray 281 based on the mounting information. Are sequentially placed on the placement member 222. In particular, when receiving components from the tray 281, as described above, it is possible to provide components of various sizes, so even when components 252 of various sizes are sequentially mounted on the substrate 8. Depending on the mounting order, components 252 of various sizes can be arranged on the mounting member 222. In the case of the tray 281, since the components are arranged in a grid, the necessary components are positioned at the component selection position 253 so that the nozzle 215 of the nozzle unit 214 can hold the component at the component selection position 253. The tray 281 moves in the X and Y directions.
[0019]
In this way, the component rearrangement device 203 in which the components 252-1, 252-2, 253-3,... Are arranged on the mounting member 222 according to the mounting order is positioned at the head of the arranged components 252. After transporting the component 252-1 to be transported to the transport end position 228 or while transporting it, the transport end position 228 corresponds to the component supply position 307 for the nozzle 309 of the mounting head 306 along the rail 202 in the X direction. Moved to. Therefore, the component 252-1 positioned at the head is positioned at the component supply position 307 and can be sucked and held by the nozzle 309 of the mounting head 306.
[0020]
The XY table 302 is moved by the control device 110 so that the component 252-1 is mounted at the mounting position 308 on the substrate 8. Simultaneously with or before and after the movement of the XY table 302, the nozzle 309 of the mounting head 306 holds the component 252-1 by suction, for example, and then moves the mounting head 306 to the mounting position 308. The component 252-1 is mounted. Further, when the nozzle 309 of the mounting head 306 holds the component 252-1, the depressing mechanism 321 provided in the mounting head 306 operates the separation assisting mechanism 261 provided in the component rearrangement device 203 to remove the component from the mounting member 222. It is preferable to assist the detachment of the part 252-1.
After the component 252-1 is removed from the placement member 222 in this way, the component rearrangement device 203 winds the placement member 222 with the take-up side reel 224, whereby the component to be mounted next. A certain component 252-2 is transported to the transport end position 228. Therefore, the component 252-2 is positioned at the component supply position 307 and can be held by the nozzle 309 of the mounting head 306. Thereafter, similarly to the case of the component 252-1 described above, the component 252-2 is mounted at the mounting position 308 where the component 252-2 is to be mounted. In the same manner, the components 252-3, 252-4,... Are sequentially mounted in the same manner in the mounting positions 308 corresponding to the respective components.
When all the components 252 to be mounted on one substrate 8 can be placed on the mounting member 222, the substrate 8 is transported when the mounting of all the components 252 on the mounting member 222 is completed. The component 301 is transported to the next process by the device 301, and the component rearrangement device 203 places the component 252 again on the placement member 222 from the component supply cassette 3 or the like in the order of mounting. On the other hand, there are many components 252 to be mounted on one substrate 8 with respect to the length from the transfer start position 223 to the transfer end position 228 in the mounting member 222, and all the components 252 to be mounted are on the mounting member 222. If the component rearrangement device 203 places the components 252 again in the order of mounting on the placement member 222 from the component supply cassette 3 or the like again, the component rearrangement device 203 again carries the transfer end position in the component rearrangement device 203. The component mounting is repeated by making 228 correspond to the component supply position 307 in the apparatus head 306. These operations are repeated until component mounting on one board 8 is completed.
[0021]
Thus, according to the component mounting machine 100 of the present embodiment, by providing the component rearrangement device 203, not only the component supply cassette 3 but also the components 252 stored in the tray 281 and the like are included in the component rearrangement device 203. It can be held by the nozzle 215 and conveyed to the component supply position 307. Therefore, flexible component mounting that is not trapped by the configuration of the component storage body that stores components is possible.
[0022]
Furthermore, by providing the component rearrangement device 203, for example, even if the components 252 have different shapes, they can be arranged on the mounting member 222 in the order of mounting, and flexible component mounting that is not captured by the form of the components 252. Is possible. In addition, for example, when mounting each component having a different shape, conventionally, it took time to replace the component supply cassette, for example. However, as described above, it is not captured by the configuration of the component storage body that stores the component. Since the components 252 can be arranged on the placement member 222 in the order of mounting by the nozzle 215 of the component rearrangement device 203, the respective components 252 are continuously placed from the placement member 222 to the component supply position 307. The component 252 can be supplied, and the time required for mounting can be shortened as compared with the prior art.
[0023]
Also, since the nozzle 215 of the component rearrangement device 203 has only to arrange the component supply cassette 3 or the like that stores the components necessary for mounting at the component selection position 253 that holds the components, as shown in FIG. There is no need to arrange a large number of component supply cassettes 3 along the X direction shown. Therefore, according to the present embodiment, it is possible to provide a component mounter having a short length in the X direction, that is, the conveyance direction of the substrate 8.
[0024]
In the above-described embodiment, the mounting member 222 in the component rearrangement device 203 is extended in the Y direction as shown in FIG. 1, for example. However, the present invention is not limited to this. It may be extended.
Further, from the viewpoint of enabling flexible component mounting that is not caught by the shape of the component storage body such as the component supply cassette 3 or the tray 281, the component rearrangement device 203 does not have to be provided with the mounting member 222. Good. In this case, the component is held by the nozzle 215 in the component rearrangement device 203, and the component held by the nozzle 215 is directly transferred to the component supply position 307 by moving the component rearrangement device 203 and the nozzle 215. It becomes the operation to do. The component rearrangement device 203 needs to be provided with a transfer device having a structure for performing such an operation.
[0025]
In the above-described embodiment, the adhesive tape has been described as an example of the mounting member 222. However, as described below, as illustrated in FIGS. 10 and 11, the component 252 is adsorbed by negative pressure as the mounting member 222. A possible suction belt 401 can also be used. In this case, the component rearrangement device 1203 in this example corresponding to the component rearrangement device 203 is newly provided with a negative pressure generator 402, and the component transport device 1221 of the component rearrangement device 1203 has a component A switching device 403 that switches between adsorption and non-adsorption is newly provided. The component rearrangement device 1203 in this example is different from the above-described component rearrangement device 203 only in the configuration and operation described below, and the basic configuration and operation thereof are the above-described component rearrangement device 203. There is no difference.
[0026]
Further, the component 252 can be sucked and held on the suction belt 401 from the above-described conveyance start position 223 where the component 252 is placed on the suction belt 401 to the component supply position 307 where the component is held by the nozzle 309. In the component conveying device 1221, a negative pressure groove 404 is formed below the suction belt 401 along the extending direction of the suction belt 401. The negative pressure generating device 402 is connected to the negative pressure groove 404. Further, an airtight seal is provided between the suction belt 401 and the negative pressure groove 404 so as to maintain the negative pressure in the negative pressure groove 404 corresponding to both edge portions of the suction belt 401 in the width direction. A member 405 is provided along the extending direction of the suction belt 401. The suction belt 401 is provided with suction holes 406 at substantially regular intervals along the extending direction at a substantially central portion in the width direction. Therefore, the negative pressure generating device 402 generates a negative pressure in the negative pressure groove 404, and the component 252 is placed on the suction hole 406 so that the component 252 is sucked and held on the suction belt 401. The control device 110 controls the movement of the nozzle unit 214 of the transfer device 211 in the component rearrangement device 1203 in the II direction, and the component 252 held by the nozzle 215 of the nozzle unit 214 is attached to the suction belt 401. It is placed corresponding to the suction hole 406. As described in the above embodiment, the pulley 227b may be driven by the motor 226. However, as shown in FIG. 10, the pulley 227b is driven via a timing belt 408 by a separately provided driving motor 407. May be.
[0027]
As shown in FIGS. 10 and 12, the switching device 403 includes a shielding member 409 and a driving cylinder 410 that drives the shielding member 409. Since the component 252 that has reached the component supply position 307 must be sucked by the nozzle 309 of the mounting head 306, the mounting head 306 is used to suck the component 252 located at the component supply position 307 by the operation control of the control device 110. At the same time that the nozzle 309 is lowered, the driving cylinder 410 is operated and the shielding member 409 is raised. As a result, the negative pressure groove 404-1 for the separation component corresponding to the component 252 disposed at the component supply position 307 is blocked from the negative pressure groove 404, and the suction operation by the negative pressure generator 402 is moved to the component supply position 307. It does not act on the arranged part 252. Therefore, the atmospheric pressure in the negative pressure groove 404-1 for the separation part returns to the atmospheric pressure due to a leak from a slight gap between the suction belt 401 and the airtightness securing seal 405. Note that when the component 252 is adsorbed by the nozzle 309 of the mounting head 306 and the nozzle 309 starts to rise, the driving cylinder 410 operates and the shielding member 409 is lowered. Accordingly, the negative pressure groove 404-1 for the separation component is again brought into a negative pressure state by the negative pressure generator 402. When a plurality of components 252 are adsorbed on the adsorption belt 401, such an operation is repeated and the components 252 are sequentially mounted on the substrate 8 by the mounting head 306.
[0028]
【The invention's effect】
As described above in detail, according to the component supply device of the first aspect and the component supply method of the third aspect of the present invention, the component rearrangement device is provided, the component is adsorbed on the adsorption belt, and the adsorbed component is the substrate. For example, various parts having different shapes and sizes can be arranged in advance on the suction belt. Therefore, it is possible to supply a flexible component that is not captured by the shape of the component storage body and that is not captured by the shape or size of the component.
[0029]
Further, according to the component mounting machine of the second aspect of the present invention and the component mounting method of the fourth aspect of the present invention, the component supply apparatus of the first aspect and the component supply method of the second aspect are provided on the suction belt. Since the components adsorbed on the substrate are conveyed to the component supply position and used for mounting on the substrate, various components having different shapes and sizes, for example, can be arranged in advance on the adsorption belt. Therefore, it is possible to perform flexible component mounting that is not caught in the form of the component storage body, and it is possible to continuously mount the various components arranged on the suction belt, and to shorten the time required for mounting compared to the conventional case. it can.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a configuration of a component mounter having a component supply apparatus according to an embodiment of the present invention.
FIG. 2 is a side view of FIG.
FIG. 3 is a plan view of FIG. 1;
FIG. 4 is a side view of the component supply apparatus shown in FIG.
FIG. 5 is a diagram illustrating a configuration of a separation assisting device provided in the component rearrangement device illustrated in FIG.
6 is a plan view showing an example of a placement member provided in the component rearrangement apparatus shown in FIG. 1. FIG.
7 is a cross-sectional view of FIG. 6. FIG.
FIG. 8 is a perspective view showing the configuration of another embodiment of the component mounter shown in FIG. 1;
FIG. 9 is a block diagram of the component mounter shown in FIG. 1;
FIG. 10 is a side view of the component transport apparatus when a suction belt is used as a mounting member in the component supply apparatus shown in FIG. 1;
11 is a plan view of the component conveying apparatus shown in FIG.
12 is a cross-sectional view taken along the line III-III shown in FIG.
FIG. 13 is a plan view showing a configuration of a conventional component mounter.
[Explanation of symbols]
3 ... parts supply cassette,
100: Component mounting machine, 110: Control device,
200 ... part supply device, 203 ... part rearrangement device,
208 ... mobile device,
211 ... Transfer device, 221 ... Part conveyance device, 222 ... Placement member,
224... Take-up reel, 225. Supply reel,
253 ... part selection position, 261 ... separation assist device, 281 ... tray,
300 ... component holding and conveying device, 303 ... component holding device,
307 ... Part supply position
401 ... Adsorption belt, 402 ... Negative pressure generator, 403 ... Switching device,
404 ... negative pressure groove,
1203: Component rearrangement device, 1221: Component conveyance device.

Claims

In the component supply device (200) provided in the component mounter (100) for mounting the component held at the component supply position (307) to the mounting position on the substrate,
A transfer device that holds and holds a component from the component storage body (3, 280, 281) on a suction belt (401) that holds the component in a suction operation at a transfer start position (223) ( 211),
A negative pressure generator (402) for generating a negative pressure to adsorb the parts on the adsorption belt;
A negative pressure groove provided with the suction belt and formed along the extending direction of the suction belt below the suction belt from at least the conveyance start position to the component supply position and connected to the negative pressure generator ( and 404), a seal member provided along the extending direction of the suction belt (405) between the suction belt and the negative pressure groove, the suction belt the adsorbed components above Symbol suction belt A component conveying device (1221) that moves and conveys the component to the component supply position, and a component adsorbed by the adsorption belt, so that the component can be separated from the adsorption belt at the component supply position. Sometimes the negative pressure groove (404-1) corresponding to the part disposed at the part supply position among the negative pressure grooves is cut off from the negative pressure generator and the negative pressure generator is used. Switching device for not reach the a pressure effect and (403), a component rearranging device having a (1203),
With
In the release part negative pressure groove, between the suction belt and the seal member, the release part negative pressure groove is disconnected from the negative pressure generator by the switching device. A component supply device having a gap for returning a negative pressure groove to atmospheric pressure .

The component supply device according to claim 1, further comprising a moving device (208) for moving the transfer device so that the transfer device can hold the component from the component storage body .

A component mounter comprising the component supply device according to claim 1.

In the component mounting method in the component mounter (100) for mounting the component held at the component supply position (307) to the mounting position on the substrate,
  Hold the parts from the parts container (3,280,281),
  The held parts are placed on the suction belt (401) at the conveyance start position,
  A negative pressure groove formed through a sealing member along the extending direction of the suction belt below the suction belt from the conveyance start position to the component supply position, wherein the component is placed on the suction belt. Holding the above-mentioned components in the suction operation by the negative pressure groove connected to the negative pressure generating device that generates a negative pressure to suck the
  Move the suction belt to transfer the held parts to the parts supply position,
  In order to facilitate separation of the component transferred to the component supply position from the suction belt, a separation component corresponding to the component arranged at the component supply position in the negative pressure groove when the component is detached. The negative pressure groove for use is cut off from the negative pressure generating device so that the negative pressure action by the negative pressure generating device is not affected.
  By eliminating the negative pressure action, the negative pressure groove for the separation part is returned to the atmospheric pressure by a gap provided between the suction belt and the seal member in the negative pressure groove for the separation part. Release the suction hold of
  Hold the component at the component supply position and mount it at the mounting position.
A component mounting method characterized by comprising: