JP2797985B2 - Substrate press system - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board transfer device for mounting electronic components and a board press system using the same.

[0002]

2. Description of the Related Art Generally, as a device for transferring articles having a smooth surface and no air permeability, such as glass and cardboard boxes,
Various devices having a suction pad have been proposed and put into practical use. In this type of transfer device, since the article to be transferred is held by the suction pad by reducing the pressure in the closed space formed by the suction pad and the article to be transferred, the article to be transferred is formed of, for example, a porous member. A porous body such as a substrate having a plurality of through-holes for mounting a filter element and an electronic component could not be held by suction because the pressure in the closed space could not be sufficiently reduced.

[0003] Therefore, when transferring these porous bodies, a technique of holding and transporting them by hand or transporting them by a conveyor or the like has been adopted. However, it is difficult to hold the substrate with a hand due to its shape, and when the substrate is transported by a conveyor or the like, the positioning operation becomes complicated. A transfer device has been put to practical use in which a suction portion is formed and the suctioned portion is suction-held and transferred.

[0004] On the other hand, as processing for a substrate, there is a drilling processing by punching or a punching processing of an outer edge.
Usually, these operations are manually performed by operating a press device. However, since the working conditions are not so good and the fixing rate of the humans is low, there has been a great demand for automation.

[0005]

By the way, in order to automate the press working of the substrate, it is conceivable to transfer the substrate to the press working device by the transfer device. However, in this transfer device, in order to hold the substrate by suction, It is necessary to form a sucked portion that does not have air permeability to the substrate, and there is a problem that a circuit cannot be formed in that portion and the entire substrate cannot be effectively used. It is also conceivable to form an unnecessary portion on the substrate in advance, form a portion to be sucked in the unnecessary portion, and remove the portion to be sucked in the final step of processing the substrate, but the transfer of the final product is complicated. Problem. In addition, if the suction pad is not correctly sucked to the suctioned part, the substrate may drop or shift during the transfer, and the transfer device may be complicated due to the positioning of the suction pad with respect to the substrate. However, there is a problem that the transfer time becomes longer.

Further, when a plurality of types of substrates are mixed-produced, it is difficult to form a suctioned portion at the same position. Therefore, it is necessary to change the transfer position of the suction pad every time the type of substrate is changed. Therefore, an expensive transfer means having a control means and the like is required. An object of the present invention is to provide a substrate press system can be minimized automated pressing against board.

[0007]

A substrate press according to claim 1 is provided.
The supply system holds the board with a plurality of through holes for mounting electronic components , while holding the board by suction holding means.
Substrate transfer device for transferring from Deployment to processing station
Installed in the processing station,
Transferred to the positioning pin on the lower die.
Pressed substrates are processed to produce product substrates
Press device, and after pressing the substrate, press device
The product board held by the upper mold is received from below and
Means for transferring the product to the outside of the
After the punching, the outer peripheral portion of the substrate remaining on the lower die of the press
Remove the core from the positioning pin and out of the press
And a sun discharging means for discharging .

[0008] Here, as described in claim 2, the suction holding
The holding means includes a hollow housing having an open end, and a housing.
Is provided over the entire circumference of the end face on the opening side of the
A suction unit having a suction pad closely adhered in a shape,
Pressure reducing means for reducing the pressure in the housing,
Internal pressure, the opening area of the suction pad, and the airflow resistance of the board.
Set the suction force determined by the above to be larger than the weight of the substrate
Is preferred.

Furthermore, as according to claim 3, be set to 2 to 3 times the total opening area of the through-hole side of the substrate facing the opening area of the suction pad to the suction pad, as claimed in claim 4, wherein to, the provision of the pressurized air supplying means for supplying pressurized air into the housing, as claimed in claim 5, provided with a conveyor for transferring the substrate to the supply station, the supply station, is transported by conveyor Front positioning means for abutting the front end of the substrate to position the front end of the substrate at the supply station; and pressing the substrate against the supply station by pressing laterally on both side edges of the substrate positioned by the front positioning means. Providing a side positioning means for positioning in the left-right direction is a preferred embodiment.

[0010] According to a sixth aspect of the present invention, there is provided a product transporter.
A brush is provided on the step to clean the lower surface of the upper die of the press device.
Or as described in claim 7, a plurality of
Product part, and position the product part of the board on the lower die sequentially.
And press it to the product section with a press device.
May be applied.

[0011] Further, according to claim 8, a sun discharging device is provided.
As a step, a pair of upper and lower rollers are provided in the front side in the discharge direction of the cutting sun in a direction orthogonal to the discharge direction, and the upper roller is disposed more forward than the lower roller in the substrate discharge direction. With the front part of the drafting sun interposed between them, the drafting sun is held upward and inclined backward, so that the drafting sun is pulled out from the positioning pin, and in this state, the upper and lower rollers are rotated to discharge the drafting sun out of the lower mold. It is preferable to use one .

[0012]

In the substrate press system according to the present invention,
Processing station from supply station by substrate transfer device
The substrate is transferred to the
Since the press processing is performed by the placement, the supply of the substrate to the press device can be automated. Also press
The product substrate obtained by processing and the punch
The upper die and the lower die are held respectively, and the product substrate is
And the punching sun is pressed by the pressing device
Since it is discharged to the outside, product boards and punches from the press
It is possible to automate the discharge of sun.

Further, the suction force determined by the internal pressure of the housing, the opening area of the suction pad, and the airflow resistance of the substrate is:
When the weight is set to be larger than the weight of the substrate, it is possible to hold the substrate directly on the suction pad by depressurizing the inside of the housing by the decompression means and bringing the suction pad into close contact with the permeable portion of the substrate. Become.

[0014] facing the suction pad an opening area of the suction pad
If the total opening area of the through hole of the substrate on the side to be set is set to be two to three times, it is possible to obtain a sufficient suction force without increasing the size of the decompression means. Also, if a pressurized air supply means for supplying pressurized air is provided in the housing, the internal pressure of the housing can be quickly increased by supplying pressurized air into the housing when the substrate is separated from the suction pad. Thus, the substrate can be smoothly separated.

When the substrate is transferred to the supply station by the conveyor, a front positioning means for abutting the front end of the substrate transferred on the conveyor to position the front end of the substrate at the supply station; Pressed from both sides to both side edges of the substrate positioned by the positioning means,
By providing the side positioning means for positioning the substrate in the left-right direction with respect to the supply station, it becomes possible to position the substrate substantially accurately with respect to the supply station.

[0016] Also, the product transfer means, providing a brush for cleaning the underside of the upper die of the press apparatus, it is possible to clean the upper mold in conjunction with the movement of the product transfer means.

Further, a plurality of product parts are formed on one substrate, the product parts of the substrate are sequentially positioned and mounted on the lower die by a substrate transfer device, and the product parts are pressed by a press device. In this case, it is possible to efficiently perform press working on a plurality of substrates.

[0018] The acid discharge means, provided on the front side of the discharge direction of the vent Sun toward the pair of upper and lower rollers in the discharge direction and the orthogonal direction, the upper rollers of the lower roller of the discharging direction of the substrate than It is possible to use the one placed on the front side.In this case, the front part of the draw sun is sandwiched between the upper and lower rollers, and the draw sun is held upward and inclined backward, so that the draw sun is pulled out from the positioning pin. In this state, the upper and lower rollers are rotated to discharge the lower mold.

[0019]

Embodiments of the present invention will be described below with reference to the drawings. As shown in FIGS. 1 to 3, the substrate press system 1 includes a press device 10 that presses a material substrate 2, a substrate supply device 20 that supplies the material substrate 2 to the press device 10, The apparatus includes a substrate discharging device 50 for discharging the product substrate 3 obtained by the processing to the outside of the press device 10 and a sun discharging device 70 for feeding the punched sand 4 left after the punching of the product substrate 3 to the waste material stocker 71. I have.

As shown in FIGS. 2, 5, and 6, the material substrate 2 is formed of a general flat printed circuit board. The material substrate 2 has a plurality of through holes 5 for mounting electronic components. Each product substrate 2 is formed with two product parts 6 each composed of two sets of wiring groups, and is configured such that two product substrates 3 are punched from one material substrate 2 and corresponds to the punching sun 4. Six positioning holes 7 are formed in the outer peripheral portion of the material substrate 2 to be formed, and a sucked portion 8 having no through hole 5 is formed. However, as the material substrate 2, a substrate in which the number of product parts other than two is formed on one material substrate may be used.

As shown in FIGS. 1 and 3, the press device 10 has a general configuration having an upper die 11 and a lower die 12, and a plurality of positioning pins 13 project from the lower die 12. The material substrate 2 is formed, and the positioning holes 7 are
And is positioned and mounted on the lower mold 12. In this press apparatus 10, a press process for punching the product substrate 3 is performed on the material substrate 2. When the die is opened after the press process, the product substrate 3 is held by the upper die 11, and the punching sun 4 is moved to the lower die. 12. In this embodiment, 1
Since two product substrates 3 are punched from the material substrate 2, the first half and the second half of the material substrate 2 are sequentially positioned and mounted on the lower mold 12 and subjected to press working. Press work is performed twice on the material substrate 2.

The substrate supply device 20 includes a transfer device 21, a conveyor 25, and a substrate transfer device 30, and is configured as follows. The transfer device 21, as shown in FIG.
This is for transferring the material substrates 2 one by one from the substrate stocker 22 on which the plurality of material substrates 2 are stacked to the upstream end of the conveyor 25. It is of a general configuration for transferring by suction and holding. In the transfer device 21, the position of the suction pad 23 needs to be controlled because the suctioned portion 8 is held and transferred by the suction pad 23, and the transport speed is reduced accordingly.
Since the press device 10 performs two press workings on one material substrate 2, the cycle time of the press working is not adversely affected.

As shown in FIGS. 3 and 4, the conveyer 25 is a belt conveyer having a general configuration having two belts 26 arranged side by side at an interval on the left and right. The downstream end of the conveyer 25 is a supply station. Material substrate 2 placed on S1
Is transferred to the supply station S1 by the conveyor 25.

The conveyor 25 is provided at the supply station S1.
The front positioning means 27, which is a plate-shaped member that abuts on the front end of the material substrate 2 carried in and positions the material substrate 2 in the front-rear direction, and the receiving plate 28a arranged on one side with air Pressing means 28 composed of a cylinder or an electromagnetic solenoid
b. The side positioning means 28 for pressing the material substrate 2 from the side to the receiving plate 28a side to position the material substrate 2 in the left-right direction.
The material substrate 2 is positioned with respect to the supply station S1 by both positioning means 27 and 28. The conveyor 25 and both positioning means 27, 28
May be omitted, and the material substrate 2 may be directly positioned and mounted on the supply station S1 by the transfer device 21.

The substrate transfer device 30 includes a supply station S
1. The suction holding means 40 for sucking and holding the material substrate 2 conveyed to the work 1 and the suction unit 41 of the suction holding means 40 are transferred to the supply station S1 and the processing station S2 on the lower die 12 of the press device 10. Transfer means.

The transfer means has a gate-shaped movable frame 32 movable in the front-rear direction.
Is driven so as to be position-controllable via a drive mechanism (not shown). The movable frame 32 is provided with elevating means 33 including an air cylinder or an electromagnetic solenoid.
Is provided with an arm member 34 extending forward, and the suction unit 41 is fixed to the front end of the arm member 34.

As shown in FIGS. 5 and 6, the suction holding means 40 includes a suction unit 41 comprising a housing 42 and a suction pad 43, and a pressure reducing means 4 for reducing the pressure in the housing 42.
4 and pressurized air supply means 45 for supplying pressurized air into the housing 42.

[0028] The housing 42 of the suction unit 41 is constituted by a hollow casing of the lower end opening, the suction pad 43 of a synthetic rubber material or the like having an excellent and elasticity airtightness at the lower end surface of the housing 42 is Wataru the entire circumference It is provided.

The air suction port 44a of the pressure reducing means 44 is opened into the housing 42 through the vacuum passage 34a in the unillustrated hose arm member 34, the middle portion of the pressure reduction passage extending from the pressure reducing means 44 in housing 42 Is the pressure reducing switching valve 46
Is interposed. However, a hose having one end connected to the pressure reducing means 44 is provided, and the other end of the hose is connected to the housing 42.
May be connected directly.

The pressurized air supply port 45a of the pressure air supply means 45
Is opened into the housing 42 via a pressurized air supply hose 47,
A pressurization switching valve 48 is provided at an intermediate part of the pressurized air supply passage leading to the pressure passage.

The suction holding means 40 sucks and holds the material substrate 2 on which the plurality of through holes 5 for mounting electronic components are formed. Therefore, the internal pressure of the housing 42, the opening area of the suction pad 43, The suction force determined by the airflow resistance is set to be larger than the weight of the material substrate 2 to be sucked and held. The opening area of the suction pad 43 is set to be two to three times the total opening area of the through holes 5 of the material substrate 2 on the side facing the suction pad 43 , and the setting of the pressure reducing means 44 is switched to change the internal pressure of the housing 42. Is adjusted so that the material substrates 2 having different ventilation resistances and different weights can be easily attracted and held.

When the substrate 2 is to be sucked and held by the suction unit 41, the pressure switching valve 48 is closed, and the air suction port 44a is opened in the housing 42 through the pressure reduction switching valve 46. While the air in the housing 42 is sucked by the suction pad 43, the suction pad 43 is brought into close contact with the surface of the material substrate 2, or conversely, the suction pad 43 is brought into close contact with the surface of the material substrate 2. The valve 48 is closed, and the air suction port 44a is opened in the housing 42 via the pressure reducing switching valve 46, thereby sucking the air in the housing 42 and holding the material substrate 2 by the suction unit 41. .

On the other hand, when disconnecting the material substrate 2 holding suction from the suction unit 41, as well as air opening in the housing 42 by switching the vacuum switching valve 46 switches the pressure pressure switching valve 48, the pressure in the housing 42 By supplying air to increase the internal pressure of the housing 42, the material substrate 2
Is separated from the suction unit 41.

[0034] Here, briefly explained the test results of the adsorption retention test conducted with the suction holding means 40, sets the opening area of the suction pad 43 5625mm ² (length 70 mm, width 75 mm), the vacuum When the degree of decompression by the means 44 is maintained in a negative pressure state of 2000 to 3000 mmAq, the through hole 5 having a diameter of 0.2 to 5.0 mm becomes 1 m ^2.
Nos. 45,000 to 70000 per substrate No. shown in Table 1 were formed. It was possible to reliably hold the material substrates 1 to 4 by suction.

[0035]

[Table 1]

[0036] However, the suction pad 43 by changing the opening area, is also possible to change the suction force, for example, in the case of adsorbing relatively lightweight material substrate, the opening area 26
25mm ² (length 75mm, width 35mm) or 750m
A suction pad of m ² (length 75 mm, width 10 mm) may be used. When the weight is relatively large or when the material substrate is bent or warped, the opening area is 10,000
A suction pad of mm ² (length 100 mm, width 100 mm) may be used.

Next, a description will be given of a substrate discharge device 50. As shown in FIGS. 1 and 3, the substrate discharging device 50 includes a substrate discharging unit 51, a conveyor 52, and a suction holding unit 53. The substrate discharging means 51 will be described. As shown in FIGS. 3 and 7, a receiving plate 55 for receiving the product substrate 3 held on the lower surface of the upper die 11 of the press device 10 from below is provided. Upper die 1 at the end
A brush 56 for cleaning the lower surface of the first die 1 is provided to be tiltable via tilting means 57, and the receiving plate 55 extends along the guide rail 58 below the upper die 11 and above the upstream end of the conveyor 52 by the transfer means. Is moved back and forth. The receiving plate 55
Has a size capable of accommodating the product substrate 3, is provided in a gentle downward slope, and the product substrate 3 placed on the receiving plate 55 is positioned above the upstream end of the conveyor 52. It is transferred onto the conveyor 52 by the inertia force when the movement is stopped. However, the receiving board 55 may be tilted in a downwardly inclined shape at the upstream end of the conveyor 52, and the product substrate 3 placed on the receiving board 55 may be transferred onto the conveyor 52.

The conveyor 52 is, as shown in FIG.
In a belt conveyor having a general configuration, a stopper 59 is provided at the downstream end, and the product substrate 3 placed on the upstream end of the conveyor 52 is transferred to the downstream end of the conveyor 52, and the conveyor 59 is moved by the stopper 59. At the downstream end.

As shown in FIGS. 1 and 3, the suction holding means 53 has the same construction as the suction holding means 40 described above. In the direction, and is moved up and down by the elevating means 62. Then, the product substrate 3 held at the downstream end of the conveyor 52 is sucked and held by the suction unit 60, and
Transported above the stocker 63 for
3 will be stacked.

Next, a description will be given of San discharge device 70. As shown in FIGS. 1, 3, and 8, the sun discharging device 70 includes a sun discharging means 72 and a sun feeding means 73. The sun discharging means 72 is for feeding the frame-shaped cutting sun 4 remaining after the two product substrates 3 are extracted from the material substrate 2 to the outside of the press device 10. A pair of upper and lower rollers 74, 75, and a position switching means 76 for switching the position of the lower roller 75 between a position in contact with the upper roller 74 and a position rotated downward.
And a rotating means 77 for rotating the upper roller 74 and the lower roller 75 in mutually opposite directions.

The upper roller 74 is disposed on the front side of the lower roller 75, and when the product substrate 3 is punched from the latter half of the material substrate 2 by the press device 10, the former half of the product substrate 3 is divided into upper and lower rollers 74, 75. Material board 2 attached between
The punching sun 4 remaining after punching the latter half of the roller is positioned and mounted on the lower die 12 with the positioning pin 7 fitted in the positioning hole 7. Is rotated upward, and the upper and lower rollers 74 and 75 are rotated.
When the front half of the drafting sun 4 is held between the upper and lower rollers 75, the drafting sun 4 is held in an upwardly inclined shape as shown in FIG. 14 because the upper roller 74 is disposed on the front side of the lower roller 75. Then, the positioning hole 7 is pulled out from the positioning pin 13.

The sun feeding means 73 includes a pair of upper and lower rollers 80 and 81 disposed in front of the sun discharging means 72, and a rotating means 82 for rotating the rollers 80 and 81.
The extracted sun 4 discharged from the sun discharge means 72 is fed into the waste stocker 71 through the space between the upper and lower rollers 80 and 81. Reference numeral 83 denotes a guide member for guiding the withdrawn sun 4 discharged from the sun discharging means 72 to the sun feeding means 73.

Next, a description of the operation of the substrate press system 1. The material substrates 2 stacked on the substrate stocker 22 are first taken out one by one from the upper side by the transfer device 21 and transferred onto the conveyor 25, and then transferred to the supply station S1 by the conveyor 25 as shown in FIG. Then, at the supply station S1, both positioning means 2
Positioned by 7, 28. The transfer device 21, the conveyor 25, and both positioning means 27 and 28 repeat this operation at a predetermined timing.

Next, material substrate 2 positioned in the supply station S1, as shown in FIG. 9, the transfer by the transfer means the first half is held by suction by the suction unit 41 to the lower die 12 on the press apparatus 10 Then, the positioning holes 7 are fitted into positioning pins 13 formed in the lower
The first half of the material substrate 2 is positioned and mounted on the substrate 2. Then, in a state where the suction unit 41 is retracted, the pressing device 10 performs press working on the first half of the material substrate 2. At this time, as shown in FIG. After the pressing of the material substrate 2 to the first half is completed or before the completion, or before the completion, the second half of the material substrate 2 is sucked and held, and after the pressing of the first half is completed, FIG. As shown in the figure, the latter half of the material substrate 2 is transferred to the lower die 12 for positioning and placement, and as shown in FIG. 13, a new material substrate 2 positioned at the supply station S1 is suction-held and transferred. Will be. In the substrate transfer device 30, this operation is repeated to
Are sequentially positioned and mounted on the press device 10.
In the state where the rear half of the material substrate 2 is transferred onto the lower mold 12 and positioned and mounted, the front half of the material substrate 2 is inserted between the upper and lower rollers 74 and 75.

On the other hand, as shown in FIG. 10, by performing press working with respect to the first half portion of the raw material substrate 2, the product substrate 3 punched from the material substrate 2, as shown in FIG. 11, after having opened the mold It is once held on the lower surface of the mold 11 and transferred onto the receiving plate 55 transferred below the upper mold 11. Then, as shown in FIG. 12, after being transported above the conveyor 52 together with the receiving plate 55, placed on the conveyor 52 and transported out of the press device 10, suction is performed by the suction unit 60 at the downstream end of the conveyor 52. It is held and transported above the stocker 63 by the transport means 61 together with the suction unit 60, and is stacked on the stocker 63. In the substrate discharge device 50, the same operation is performed on the product substrate 3 punched from the latter half of the material substrate 2, and this operation is repeated to sequentially stack the product substrates 3 on the stocker. The receiving plate 55 is moved from below the upper die 11 to the conveyor 52 side.
Is transferred, the brush 56 is raised by the tilting means 57, and the lower surface of the upper mold 11 is cleaned.

[0046] In addition, after from one material substrate 2 were punched out two of the product substrate 3, unplug San 4 remaining on the lower die 12
14 is held between the upper and lower rollers 74 and 75 in the vicinity of the front, and is held in an inclined shape ascending rearward as shown in FIG.
4 and 75 and between the rollers 80 and 81, and is fed into the waste material stocker 71. In the sun discharge device 70, this operation is repeated each time two product substrates 3 are punched from one material substrate 2.

[0047] Thus, in the substrate pressing system 1, to automate the operation of supplying the material substrate 2 to the press apparatus 10, the transfer operations of the product substrate 3 to the stocker 63, and a discharge working punching San 4 It becomes possible.
In this embodiment, a substrate press system 1 having a press device 10 for punching a product substrate 3 from a material substrate 2 is described.
Although the present invention has been applied to the present invention, the present invention can be similarly applied to a substrate press system provided with a press device for performing a boring process or the like on the material substrate 2.

[0048]

According to the substrate press system of the present invention, the supply of the substrate to the press device and the supply of the substrate from the press device are performed.
Automated discharge of product boards and blanks
Becomes Also, the positioning holes of the board are
To position the board on the lower mold.
However, the substrate is transferred while being held by suction.
Pre-positioning the substrate at the feeding station
Easily and without complicating the configuration of the substrate transfer device.
In addition, it is possible to position and place the substrate on the lower mold reliably.
Become.

As the suction holding means, as described in claim 2
With such a configuration , the substrate can be directly suction-held by the suction pad without being affected by the suction position. Therefore, it is not necessary to form a sucked portion having no air permeability on the substrate, and the entire substrate can be effectively used, and the degree of freedom in designing the substrate increases.

Further, since it is not necessary to accurately position the suction pad with respect to the substrate, the structure for controlling the position of the suction pad can be simplified, and the structure of the transfer means can be greatly simplified. In addition, the transfer time can be shortened and workability can be greatly improved. In addition, even when a plurality of types of substrates are mixed-produced, the substrates can be reliably suction-held and transferred without being affected by the size or shape of the substrates.

[0051] Here, setting 2-3 times the total opening area of the side of the substrate hole facing the opening area of the suction pad to the suction pad, without increasing the size of the pressure reducing means to obtain a sufficient attraction force It becomes possible. In addition, when the pressurized air supply means for supplying pressurized air is provided in the housing, when the substrate is separated from the suction pad, the pressurized air is supplied into the housing so that the substrate can be separated smoothly. It becomes possible.

When the substrate is transferred to the supply station by the conveyor, the front positioning means and the side positioning means having a simple structure are provided so that the substrate can be positioned almost accurately with respect to the supply station. Becomes possible. Further, the product transfer means, providing a brush for cleaning the underside of the upper die of the press apparatus, it is possible to clean the upper mold in conjunction with the movement of the product transfer means.

[0053] Furthermore, by forming a plurality of product portions with respect to one substrate, the product of the substrate by sequentially positioning placed into the lower die on the substrate transfer device, the press by the press device relative to the product portion When processing is performed, it is possible to efficiently perform press processing on a plurality of substrates.

Further , when the sun discharging means is provided, it is possible to automate the discharge processing of the extracted sun. As the sun discharging means, a means having a pair of upper and lower rollers can be adopted. With the pair of upper and lower rollers, the extracting operation of the extracting sun from the positioning pin and the discharging of the extracting sun out of the lower mold are performed. The operation can be performed.

[Brief description of the drawings]

FIG. 1 is a perspective view of the overall configuration of a substrate press system.

2A is a plan view of a material substrate, FIG. 2B is a plan view of a product substrate, and FIG.

FIG. 3 is an overall configuration diagram of a substrate press system.

FIG. 4 is a plan view of a supply station.

FIG. 5 is an overall configuration diagram of a suction holding device.

FIG. 6 is a longitudinal sectional view of the vicinity of the housing.

FIG. 7 is a perspective view of a substrate discharging unit.

FIG. 8 is a perspective view of a sun discharging device.

FIG. 9 is an explanatory view of the operation of the substrate press system when setting the first half of the material substrate.

FIG. 10 is an explanatory view of the operation of the substrate press system at the time of pressing the material substrate into the first half.

FIG. 11 is an explanatory view of the operation of the substrate press system when discharging a product substrate.

FIG. 12 is an explanatory view of the operation of the substrate press system when setting the latter half of the material substrate.

FIG. 13 is an explanatory view of the operation of the substrate press system at the time of press working on the latter half of the material substrate.

FIG. 14 is an explanatory view of the operation of the substrate press system at the time of discharging the uncut sun.

[Explanation of symbols]

S1 Supply Station S2 Processing Station 1 Substrate Press System 2 Material Substrate 3 Product Substrate 4 Punching Sun 5 Through Hole 6 Product Part 7 Positioning Hole 8 Adsorbed Part 10 Pressing Device 11 Upper Die 12 Lower Die 13 Positioning Pin 20 Substrate Feeder 21 Transfer Loading device 22 Substrate stocker 23 Suction pad 25 Conveyor 26 Belt 27 Positioning means 28 Side positioning means 28a Receiving plate 28b Pressing means 30 Substrate transfer device 32 Movable frame 33 Elevating means 34 Arm member 34a Decompression passage 40 Suction holding means 41 Suction unit 42 Housing 43 Suction pad 44 Decompression means 44a Air suction port 45 Pressurized air supply means 45a Air supply port 46 Decompression switching valve 47 Pressurized air supply hose 48 Pressure switching valve 50 Substrate discharging device 51 Substrate discharging means 52 Conveyor 5 Suction holding means 55 Receiving plate 56 Brush 57 Tilting means 58 Guide rail 59 Stopper 60 Suction unit 61 Transfer means 62 Elevating means 63 Stocker 70 Sun discharging device 71 Waste material stocker 72 Sun discharging means 73 Sun feeding means 74 Roller 75 Roller 76 Position switching means 77 rotating means 80 roller 81 roller 82 rotating means 83 guide member

────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification symbol FI B23P 19/00 302 B23P 19/00 302Q (56) References JP-A-4-365579 (JP, A) JP-A-5-235594 (JP, A) JP-A-59-156694 (JP, A) JP-A-5-104345 (JP, A) JP-A-4-280500 (JP, A) JP-A-5-104163 (JP, A) 1979-124885 (JP, U) JP-A 56-38481 (JP, U) JP-A 63-81070 (JP-A 2-4783) The contents of the specification and drawings attached to the application form Photographed microfilm (JP, U) (58) Field surveyed (Int. Cl. ⁶ , DB name) H05K 13/00

Claims (8)

(57) [Claims] 1. A supply station which holds a substrate having a plurality of through-holes for mounting electronic components while holding the substrate by suction holding means.
Substrate transfer device for transferring from Deployment to processing station
If, installed in the processing station, the substrate transfer device
Transferred and set on the positioning pins of the lower mold
A press that manufactures a product substrate by pressing the substrate
And less device, after punching of the substrate, held by the upper die of the press
Product board received from below and transferred out of the press
Product transfer means, and after punching of the substrate, remained on the lower die of the press device
Pull out the cutting sun at the outer periphery of the board from the positioning pin.
A substrate press system , comprising: a sun discharging means for discharging the press outside the press device . 2. The suction holding device according to claim 1, wherein the suction holding unit has a hollow one end opening.
Over the entire periphery of the housing and the open end face of the housing.
And a suction pad that is provided in a substantially airtight manner on the substrate.
And a pressure reducing unit for reducing the pressure inside the housing.
Means, the internal pressure of the housing and the opening of the suction pad.
The adsorption force determined by the area and the airflow resistance of the substrate
2. The substrate press plate according to claim 1, wherein the substrate press plate is set to be larger than the weight.
Stem. 3. The suction pad has an opening area corresponding to that of the suction pad .
3. The substrate press cis according to claim 2 , wherein the total opening area of the through holes of the substrate on the side facing is set to be two to three times.
Tem. 4. A pressurized air supply means for supplying pressurized air in a housing is provided.
A substrate press system according to item 1. 5. A conveyer for transferring a substrate to a supply station, wherein the supply station abuts against a front end of the substrate conveyed by the conveyer and positions the front end of the substrate to the supply station. , Is pressed from both sides to both side edges of the substrate positioned by the front positioning means,
The substrate press system according to any one of claims 1 to 4 , further comprising side positioning means for positioning the substrate in the left-right direction with respect to the supply station.
M 6. A product transfer means, according to claim, characterized in that a brush for cleaning the underside of the upper die of the press 1
The substrate press system according to any one of claims 1 to 5 . 7. A method of forming a plurality of product parts on one substrate, positioning and mounting the product parts of the substrate on a lower die in sequence, and performing press working on the product parts by a press device. The substrate press system according to any one of claims 1 to 6 , characterized in that: 8. As a sun discharging means, a pair of upper and lower rollers are provided in front of the drawing sun discharging direction in a direction orthogonal to the discharging direction, and the upper roller is located forward of the lower roller in the substrate discharging direction. The upper part of the pulling sun is sandwiched between the upper and lower rollers, and the pulling sun is held upward and inclined rearward, so that the pulling sun is pulled out from the positioning pin. any of claims 1 to 7, characterized in that discharging into the lower die outside the 1
Substrate press system according to Item .