KR101451896B1 - Embossed mold system - Google Patents

Abstract

The present invention discloses a relief mold system for treating a portion to be removed on a substrate with a relief mold and removing the chip separated by a relief mold, wherein the relief mold system is manufactured by embossing the transferred substrate with an air suction force A vacuum chuck having a cushion on a surface on which the substrate is placed; And a pick-up module installed on the vacuum chuck to pick up and remove chips separated by the relief mold.

Description

EMBOSSED MOLD SYSTEM

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a positive mold forming system, and more particularly, to a positive mold system for treating a portion to be removed on a substrate with a positive mold and removing a chip separated by a positive mold.

Normally, the embossed mold means a die formed by embossing blades so as to cut more precisely and safely the functional film and double-sided tape of a precise and complicated shape that is cut into the existing wood and mold.

Generally, the embossed metal mold is generally produced by etching a thin steel plate of 0.6 mm to 3 mm in accordance with the shape and then CNC precision machining. Regarding the above-mentioned embossed mold, Japanese Patent No. 10-607906 has been disclosed.

The above-mentioned embossed mold is easy to install, easy to use, can be applied to all presses, is excellent in precision and is suitable for processing precision products, .

Due to the above-mentioned advantages, the relief mold has been applied to various fields such as a flexible printed circuit board, a double-sided tape, a packing material, an insulator, a precision processing material, a liquid crystal display device and a protective film.

The embossed mold is formed with a blade having a specific pattern for processing the product to perform cutting on the substrate.

The chip separated from the substrate by the positive mold must be removed from the substrate by a post-treatment process.

However, the conventional post-treatment process is a method of removing the chips by hand by hand, which results in poor workability.

In order to improve the workability of the post-treatment process, an automated facility for removing the chip from the substrate has been attempted, but the chip has not been effectively removed, leading to substrate failure.

Therefore, it is necessary to develop a system capable of effectively removing chips on the embossed metal substrate.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and it is an object of the present invention to provide an automated relief mold system capable of removing a chip cut by a relief mold.

It is another object of the present invention to provide a relief mold system capable of fixing a relief-shaped substrate with a vacuum chuck and simultaneously removing a large number of chips from the substrate with probes having an air suction force.

In order to solve the above problems, a relief mold system according to the present invention comprises: a vacuum chuck having a cushion on a surface on which a substrate is mounted, And a pick-up module installed on the vacuum chuck to pick up and remove chips separated by the relief mold.

Here, the vacuum chuck may have suction holes formed in a uniform distribution on a surface on which the substrate is placed, and the suction holes may be formed through the cushion.

The cushion may be formed of a flat plate made of rubber or synthetic resin.

The pick-up module includes a plurality of probes formed with an air inlet for providing an air suction force, and the chip can be removed from the substrate by sucking the chip through the air inlet by the air suction force.

The pick-up module is configured to reciprocate between an upper portion of the substrate and a designated waste area for collecting the chip, and the chip may be collected in the waste area after being removed from the substrate by the pick-up module.

The pick-up module includes a plurality of probes having an air inlet for providing an air suction force, and the chip is sucked into the air inlet by the air suction force to remove the chip from the substrate, As shown in FIG.

The inspection apparatus may further include an inspection apparatus that optically performs chip removal defect inspection on the substrate when the substrate transferred on the vacuum chuck and separated from the chip is transferred.

The inspection apparatus can optically perform the chip removal defect inspection as light transmission or reflection while moving the light source.

The relief mold system according to the present invention includes: a take-up roller for supplying the wound substrate; And a relief mold module for embossing the substrate to be supplied, wherein the relief mold module includes an upper mold roller constituting an upper mold and a lower mold roller constituting a lower mold, And may be formed on at least one of the mold roller and the lower mold roller.

Meanwhile, a vacuum chuck according to the present invention is a vacuum chuck having a structure in which a substrate, which is processed by a positive metal mold, is then fixed by an air suction force and has a cushion on a surface on which the substrate is mounted; And first and second waste areas are set on both sides of a direction in which the substrate is transferred to the vacuum chuck, and between the first waste area and the vacuum chuck, and between the second waste area and the vacuum chuck, And first and second pick-up modules for collecting the chips separated by the relief mold from the substrate on the vacuum chuck and collecting the collected chips in the first and second waste areas, respectively, wherein the first and second And the pickup modules are alternately driven on the vacuum chuck.

Here, the first and second pick-up modules include a plurality of probes having an air inlet for providing an air suction force, the plurality of probes being installed at the ends of the vacuum chuck, An air inlet is provided for sucking the chips to the ends of the probes, and the chips can be removed from the substrate upon ascending and descending.

The first and second pick-up modules maintain the provision of the air suction force during the transfer from the descending time point of the position where the vacuum chuck is disposed to the first and second disposal areas, And the air suction force is released at the upper portion of the first and second waste areas to collect the chips.

In addition, the relief mold system according to the present invention is a system for disposing a relief mold having a structure that is disposed at a position spaced apart from each other and which has a convex mold on the surface on which the substrate is placed, 1 and a second vacuum chuck; And a waste area is set between the first and second vacuum chucks, and the first and second vacuum chuck phases are reciprocally driven, and the chips separated by the positive mold are transferred to the first and second vacuum chucks And a pick-up module for removing the substrate from the substrate and collecting the substrate in the waste area.

Therefore, according to the present invention, an automated relief-type mold system can be constructed, and the chip cut by the relief mold can be automatically removed, thereby improving workability.

In addition, according to the present invention, it is possible to fix a substrate having a relief shape with a vacuum chuck and remove a large number of chips from the substrate simultaneously with probes having an air suction force, thereby improving workability.

In addition, according to the present invention, the pickup module can be configured for two vacuum chucks, thereby reducing the number of parts, thereby reducing the manufacturing cost required to construct the system.

1 is a schematic view showing an example of a relief mold system according to the present invention;
2 is a cross-sectional view showing an example of a relief mold module for explaining a relief mold method;
FIG. 3 is a partial perspective view of a substrate for comparing the state before and after the embossing of the die, with the chip removed. FIG.
4 is a schematic diagram showing a side structure of a picked-up module constructed in the first embodiment in a lowered state;
FIG. 5 is a schematic diagram illustrating a method of picking up a chip by picking up and lowering the pick-up module of FIG. 4;
6 is a schematic diagram showing a side structure of a picked-up module constructed in the second embodiment in the lowered state;
7 is a schematic diagram illustrating a method of picking up a chip by the pickup module of FIG. 6;
8 and 9 are planar layouts illustrating another embodiment of a relief mold system in accordance with the present invention.
FIGS. 10 to 12 are planar layouts illustrating still another embodiment of a relief mold system according to the present invention. FIG.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, it should be understood that the following embodiments are provided so that those skilled in the art will be able to fully understand the present invention, and that various modifications may be made without departing from the scope of the present invention. It is not.

The present invention discloses a system for removing a chip after cutting an object such as a flexible printed circuit board, a double-sided tape, a packing material, an insulator, a precision processing material, a liquid crystal display device, and a protective film into a relief mold.

The relief mold module according to the present invention may be composed of either a flat plate or a rotary, but it is exemplified that the relief mold module is constituted for a rotary.

Referring to FIG. 1, the relief mold system according to the present invention includes a take-up roller 10, a relief mold module, a pick-up module 20, a vacuum chuck 22 and an inspection device 26.

The take-up roller 10 feeds the wound substrate 12 and the wound substrate 12 is wound on the take-up roller 10 and is made of a flexible material which can be supplied by the rotation of the take- .

The winding roller 10 is exemplified as an example for constituting the embodiment according to the present invention, and a substrate feeding device for continuously feeding the substrates, which are difficult to wind, to the positive mold module one by one.

The embossing mold module includes an upper mold roller 14 constituting an upper mold and a lower mold roller 16 constituting a lower mold. The cut surface on which the blade is formed is connected to an upper mold roller 14 and the lower mold roller 16, as shown in Fig.

With reference to Fig. 2, an exemplary configuration of the relief mold module will be described.

The relief mold module according to the present invention has a rotary structure and a cutting face formed with an embossed blade 30 on the upper mold roller 14 is formed. The lower mold roller 16 is illustrated as having a plane for support.

However, the lower mold roller 16 of the relief mold module can also be constructed with the blade 30 having a relief-shaped cutting surface, in which case the relief mold can be applied to both sides of the substrate 12. [

The substrate 12 can be used with the structure in which the film 40 and the release paper 42 are combined together and the embodiment according to the present invention can be applied to the case where the film 40 is applied to the blade of the cutting face of the upper mold roller 14 As shown in FIG.

Here, the film 40 may be a flexible printed circuit board, a double-sided tape, a packing material, an insulator, a precision processing material, a liquid crystal display device, a protective film, or the like. The film 40 means a film which needs to be peeled off from the substrate 12, for example, in the case of a printed circuit board, the upper insulation on the conductive film, the wiring for processing the film in the form of a coating film or the layout, can do.

As shown in FIG. 3A, the film 40 of the substrate 12 is subjected to an embossing die for cutting into a specific pattern P1, and after the embossing is performed, the cut chips corresponding to the specific pattern P1 are separated A cutting region P2 may be formed as shown in FIG. 3 (b).

That is, the substrate 12 is supplied interposed between the upper mold roller 14 and the lower mold roller 16, and is rotated by the blade 30 of the cutting face of the upper mold roller 14 to be rotated, Is cut and discharged.

In the relief mold module, the relief-shaped substrate 12 is discharged without removing the chips cut in the specific pattern P1.

The chips present on the substrate 12 as described above may be removed from the substrate 12 as described below by the pick-up module 20.

In the embodiment of the present invention, the inspection device 26 may be further disposed at a position where the substrate 12 on which chips are separated passes through the pickup module 20 and the inspection device 26 is transferred And optically performing a chip removal defect inspection on the substrate 12. [

The inspection device 26 can optically perform chip removal defect inspection as light transmission or reflection while moving the light source.

The inspection device 26 may include a light emitting portion (not shown) and a light receiving sensor (not shown), and the light emitted from the light emitting portion may be reflected on the surface of the substrate 12 and then received by the light receiving sensor .

Light reflected by the inspection device 26 corresponding to the state where the chip on the substrate 12 is removed and the chip not removed is sensed by the light receiving sensor and the inspection device detects the light reflected by the substrate 12) can be judged.

Meanwhile, the vacuum chuck 22 may be configured to fix the transferred substrate 12 after being processed into a positive metal mold by an air suction force, and a cushion 24 is provided on the upper surface on which the substrate 12 is seated. .

The cushion 24 may be formed of a flat plate made of rubber or a synthetic resin and may have physical damage that may occur when the substrate 12 is fixed to the upper portion and physical damage that may be caused by driving the pickup module 20 As shown in FIG.

It is preferable that the vacuum chuck 22 be formed with the suction holes 23 in a uniform distribution on the surface on which the substrate 12 is placed and the suction holes 23 are formed through the cushion 24.

The pick-up module 20 is installed on the upper portion of the vacuum chuck 22, and has a configuration for picking up and removing chips separated by a positive-type metal mold.

The pick-up module 20 may include a first embodiment for picking up and removing chips as shown in FIGS. 4 and 5, or a second embodiment for picking up and removing chips as shown in FIGS. 6 and 7.

First, the configuration and driving method of the pickup module 20 will be described with reference to FIGS. 4 and 5. FIG.

The pickup module 20 may be provided with a plurality of probes 50 formed with the air inlet 52 and may be provided with an air suction force through the air inlet 52.

At this time, the substrate 12 is held on the vacuum chuck 22 by suction by the vacuum suction force provided to the suction port 23 of the vacuum chuck 22.

The area of the substrate 12 on which the upper mold roller 14 is rotated by one rotation to perform the positive embossing can be defined as one frame and the substrate 12 can be supplied on the upper side of the vacuum chuck 22 have.

When the substrate 12 is fixed to the upper portion of the vacuum chuck 22 by the vacuum suction force, the pick-up module 20 descends as shown in FIG.

As shown in FIG. 4, the pick-up module 20 is provided with air suction through the air inlet 52 while the chip 44 is separated from the substrate 12 by an affixed mold at the end of the probe 50, do.

At this time, the air suction force may be provided by a known air pump (not shown), and the air pump may provide air suction force and vacuum suction force to the vacuum chuck 22 and the pickup module 20 at the same pressure or different pressure can do.

When the pick-up module 20 is lifted and lowered, the probe 50 is also lifted and lowered. As a result, the chip 44 attracted to the end of the probe 50 is removed from the substrate 12, .

The pick-up module 20 may be configured to reciprocate between a top of the substrate 12 fixed to the vacuum chuck 22 and a designated waste area to collect the chips 44, And then transferred from the substrate 12 to be collected in the waste area.

6 and 7, the pickup module 20 according to the present invention may be configured as a second embodiment.

The pick-up module 2 shown in FIGS. 6 and 7 includes a plurality of probes 50 having an air inlet 52 for providing an air suction force as shown in FIGS. 4 and 5, And may be configured to be sucked into the suction port 52 to be removed from the substrate 12 and to discharge the chips 44 along the air suction port 52.

At this time, the air inlet 52 is preferably configured to have a diameter large enough to allow the chip 44 to be sucked in and discharged.

6, the pick-up module 20 descends to come in contact with the substrate 12, and then provides an air suction force to the air inlet 52.

The chip 44 on the substrate 12 can be removed on the substrate 12 by the air suction force and discharged along the air inlet 52 as shown in FIG.

As described above, since the relief mold system according to the present invention can be provided, the chip cut by the relief mold can be automatically removed, and the workability can be improved.

Further, the embossed mold substrate can be fixed with a vacuum chuck, and a large number of chips can be simultaneously removed from the substrate with probes having an air suction force, so that workability can be improved.

8 and 9, the pick-up modules 20a and 20b may be disposed and driven on both sides of the vacuum chuck 22, as shown in FIG.

4 and 5, the vacuum chuck 22 has a structure in which the transferred substrate 12 is machined into a positive metal mold and fixed with an air suction force and has a cushion on the surface on which the substrate 12 is placed .

The pick-up modules 20a and 20b can be configured to reciprocate between the vacuum chuck 22 and the waste areas 20c and 20d with the same configuration as the embodiment of FIGS. An apparatus for collecting chips 44 removed on the substrate 12 by the pickup modules 20a and 20b may be configured in the discarded areas 20c and 20d.

The pickup module 20a is configured to reciprocate between the vacuum chuck 22 and the discarded area 20c and the pickup module 20b is configured to reciprocate between the vacuum chuck 22 and the discarded area 20d. The pick-up modules 20a and 20b may be configured to be alternately driven on the vacuum chuck 22.

8, when the pick-up module 20a is driven to a position for disposing the picked-up chips 44 located in the discarded area 20c, the pick- Picks up the chips 44 on the substrate 12.

Thereafter, when the pickup module 20b is driven into the discarded area 20d, the pick-up module 20a is driven onto the vacuum chuck 22. At this time, another substrate 12, which is an embossed metal mold, is transferred onto the vacuum chuck 22.

9, when the pick-up module 20a picks up the chips 44 of the substrate 12 transferred on the vacuum chuck 22, the pick-up module 20b picks up the picked chips 44 And discarded in the discarded area 20d.

At this time, the pick-up modules 20a and 20b are provided at the lowered position on the vacuum chuck 22 to the air suction port 52 to suck the chips 44 at the ends of the probes 50 and to move the chips 44 The chips 44 can be removed from the substrate 12.

The pick-up modules 20a and 20b descend on the vacuum chuck 22 to pick up the chips 44 and then lift and maintain the provision of air suction force during transfer to the waste areas 20c and 20d. Therefore, the pick-up modules 20a and 20b can keep the chips 44 adsorbed to the ends of the probes 50 during transfer from the vacuum chuck 22 to the waste areas 22c and 22d, The chips 44 can be collected in the waste areas 22c and 22d by releasing the air suction force above the areas 22c and 22d.

8 and 9, a balance between the transfer speed of the substrate 12 and the removal rate of the chips 44 can be achieved when the relief mold of the substrate 12 is made at a high speed, And as a result, the chips 44 on the substrate 12 can be smoothly removed.

In addition, the embodiment according to the present invention may be configured to include vacuum chucks 22a and 22b and a pickup module 20 for reciprocally driving the vacuum chucks 22a and 22b as shown in FIGS. The pick-up module 20 may have the same configuration as that of the embodiment of FIGS. 4 and 5. FIG.

That is, the vacuum chucks 22a and 22b are disposed at a spaced apart position. Each of the vacuum chucks 22a and 22b is processed into a positive metal mold, and then the transferred substrate 12 is fixed by an air suction force. Structure.

A waste area 20e may be set in the space between the vacuum chucks 22a and 22b and a device for collecting the chips 44 removed from the substrate 12 is configured in the waste area 20e .

The pick-up module 20 reciprocates on the vacuum chucks 22a and 22b and the chips 44 separated from the substrate 12 by the relief mold are mounted on the vacuum chucks 22a and 22b And can be collected in the discarded area 20e.

11, the pick-up module 20 is moved on the vacuum chuck 22a as shown in FIG. 11 and is separated from the waste area 20e as shown in FIG. 10. Then, the pickup module 20 separates the substrate 12 transferred on the vacuum chuck 22a And the pickup module 20 is then transported onto the discarded area 20e as shown in FIG. 10 to pick up the chips 44 that have been picked up.

12, the pick-up module 20 can move over the vacuum chuck 22b to pick up the separated chips 44 on the substrate 12 transferred on the vacuum chuck 22b, The module 20 is transferred onto the discarded area 20e as shown in FIG. 1 to collect picked-up chips 44. FIG.

As described above, the pick-up module 20 can perform pickup and collection of the chips 44 while sequentially reciprocating the vacuum chucks 22a and 22b.

The pick-up module 20 is provided with an air suction port 52 at a lowered position on the vacuum chucks 22a and 22b to attract chips 44 to the ends of the probes 50 and to move the chips 44 The chips 44 can be removed from the substrate 12 because the substrate is lifted and lowered in the adsorbed state.

The pickup module 20 then descends on the vacuum chucks 22a and 22b to pick up the chips 44 and then lifts up and maintains the provision of the air suction force during transfer to the disposal area 20e. Therefore, the pick-up module 20 can keep the chips 44 adsorbed to the ends of the probes 50 during transfer from the vacuum chucks 22a, 22b to the discarded area 22e, The chips 44 can be collected in the discarded area 22e by releasing the air suction force at the upper part.

As the embodiment according to the present invention is configured as shown in FIGS. 10 to 12, the number of parts constituting the system can be reduced, thereby reducing the manufacturing cost.

10: take-up roller 12:
14: upper mold roller 16: lower mold roller
20: pickup module 22: vacuum chuck
26: Inspection device

Claims (13)

A take-up roller for supplying the wound substrate;
A relief mold module for embossing the substrate to be supplied;
A vacuum chuck having a cushion on a surface on which the substrate is mounted, the substrate being processed by a positive mold and then fixed by an air suction force;
A pickup module installed on the vacuum chuck to pick up and remove chips separated by the relief mold; And
And an inspection device optically performing chip removal failure inspection on the substrate when the substrate transferred on the vacuum chuck and separated from the chip is transferred,
Wherein the relief mold module includes an upper mold roller constituting an upper mold and a lower mold roller constituting a lower mold,
Wherein a cutting surface formed with a blade is formed on at least one of the upper mold roller and the lower mold roller,
Wherein the pick-up module includes a plurality of probes having an air inlet for providing an air suction force, and the chip is sucked to the air inlet by the air suction force to remove the chip from the substrate.
The method according to claim 1,
Wherein the vacuum chuck is formed with suction holes uniformly distributed on a surface on which the substrate is mounted, and the suction hole is formed through the cushion.
The method according to claim 1,
Wherein the cushion is made of a flat plate made of rubber or synthetic resin.
delete The method according to claim 1,
Wherein the pick-up module is configured to reciprocate between an upper portion of the substrate and a designated waste area to collect the chip, the chip being removed from the substrate by the pick-up module and collected in the waste area. system.
The method according to claim 1,
Wherein the pick-up module includes a plurality of probes formed with an air inlet for providing an air suction force, the chip is sucked into the air inlet by the air suction force to remove the chip from the substrate, And the molten metal is discharged.
delete The method according to claim 1,
Wherein the inspection apparatus optically performs the chip removal defect inspection as light transmission or reflection while moving the light source.
delete 6. The method of claim 5,
Wherein the waste area includes first and second waste areas respectively set on both sides of a direction in which the substrate of the vacuum chuck is conveyed,
Wherein the pick-up module includes first and second pick-up modules,
Wherein the first and second pick-up modules reciprocate between the first discarded region and the vacuum chuck and between the second discarded region and the vacuum chuck, Removing them from the substrate and collecting them in the first and second waste areas respectively,
Wherein the first and second pick-up modules are alternately driven on the vacuum chuck.
11. The method of claim 10,
Wherein the first and second pick-up modules include a plurality of probes having an air inlet port provided at an end thereof for providing an air suction force, wherein the first and second pick-up modules move up and down at a position where the vacuum chuck is disposed, Wherein the chips are adsorbed to the ends of the probes, and the chips are removed from the substrate upon ascending and descending.
12. The method of claim 11,
Wherein the first and second pick-up modules maintain the provision of the air suction force during the transfer from the descending time point of the position where the vacuum chuck is disposed to the first and second disposal areas, And collecting said chips by releasing said air suction force above said first and second waste areas. delete

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