WO2017018580A1

WO2017018580A1 - Embossing mold apparatus and method for preparing product by means of same

Info

Publication number: WO2017018580A1
Application number: PCT/KR2015/008750
Authority: WO
Inventors: 류기택; 박형근
Original assignee: (주)파인테크
Priority date: 2015-07-30
Filing date: 2015-08-21
Publication date: 2017-02-02
Also published as: KR101577299B1

Abstract

The present invention relates to an embossing mold apparatus and a method for preparing a product by means of same. The method comprises the steps of: forming holes on a processed layer, which belongs in a processed film having an adhesive layer formed on the bottom side of the processed layer and comprising a release paper layer adhered to the bottom side of the processed layer, by means of a mold portion; forming an adhesion on the position which corresponds to the holes to be formed on the processed layer; laminating a chip removing release film with the processed layer; and separating the chip removing release film and the processed film from each other, wherein chips are removed by means of the chip removing release film. Therefore, defects can be prevented and a product can be mass produced quickly and efficiently by means of the simple structure.

Description

Embossed mold apparatus and manufacturing method using the same

The present invention relates to an embossed mold apparatus and a method for manufacturing a product using the same. More particularly, the embossed mold apparatus and a product using the embossed mold apparatus enable mass production of the product quickly and efficiently while eliminating defects by a simple configuration. It relates to a manufacturing method.

Conventionally, flexible printed circuit boards, double-sided tapes, packing materials, insulators, precision processing materials, liquid crystal displays, and protective films have been cut into dies and molds, but the integration of electronic components is improved, resulting in miniaturization and compactness of the entire apparatus. The embossed mold is designed to cut these products more precisely and stably.

Such an embossed mold is a mold using a blade formed by embossing, and is typically produced by CNC precision machining after etching a thin steel sheet from 0.6mm to 3mm according to the shape.

Embossed molds are easy to mount, easy to use, can be applied to all presses, and are highly suitable for machining precision products.They do not have adhesive components attached to the punch and can remove chips at the same time. There are advantages.

Embossed molds have been applied to various fields such as flexible printed circuit boards, double-sided tapes, packing materials, insulators, precision processing materials, liquid crystal displays, and protective films due to the aforementioned advantages.

The embossed mold processes the workpiece into blades with a specific pattern, in which chips are cut by the blades, which remain in the workpiece or are attached to the blade.

In the related art, the chip cut by the blade is manually removed by the operator, and this operation takes a considerable amount of time, and in the case of a small chip, the chip is not easily seen by the operator. Occurred.

In addition, when chips remain on the embossed mold, cutting defects on the workpieces followed by the remaining chips are generated, and these cutting defects result in problems leading to product defects.

In view of the above, the "Punching Device for Electronic Parts with a Guard" of JP-A-5-104163, the "Perforating System" of JP-A-11-70500, and the present applicant And the like, such as "embossed mold system" of the registered Patent No. 10-1451896.

However, the above-mentioned prior arts all have a whole device, which requires a considerable cost for designing a mold, an air pipe, and the like, as well as the entire device.

Particularly, these prior arts employ an operation mechanism that protrudes the pin to eject the chip and then sucks the discharged chip back into the air to remove the chip. However, such an operation mechanism can reduce the incidence of defective products. Although preferable, the process delay according to the operation sequence is inevitable, and this process delay naturally has a problem that acts as a factor that lowers the yield.

In order to improve the above problems, a method using a method of removing chips, which are by-products of processing the workpiece, is applied by using a separate member having an attachment ability such as a release tape.

However, in the removal method by such a separate member, when the adhesive force is increased, the workpiece and the adhesive layer having the adhesive force are not separated from each other, and there is a fear that a defect such as the workpiece is torn in the process of separating the workpiece from the release tape. It becomes bigger.

In addition, in the removal method by such a separate member, when the adhesion is lowered, a problem arises in that the chips are not separated from the release tape.

[Preceding technical literature]

[Patent Documents]

Japanese Patent Laid-Open No. 5-104163

Japanese Laid-Open Patent Publication No. 11-70500

Patent Registration No. 10-1451896

The present invention has been invented to improve the above problems, to provide a relief mold apparatus and a method for manufacturing a product using the same to enable mass production of products quickly and efficiently while eliminating defects by a simple configuration will be.

In addition, the present invention provides an embossed mold apparatus and a method of manufacturing a product using the same to reduce the cost of the complex mold design cost and time, thereby simplifying the entire apparatus, thereby improving efficiency through cost reduction due to initial installation and construction. It is to provide.

In order to achieve the above object, the present invention is to form a hole by using a mold portion in the processed layer of the processed film comprising a release layer is formed on the bottom surface of the processing layer and the adhesive layer is adhered to the bottom surface of the processing layer. Process, forming an adhesive or a pressure-sensitive adhesive at a position corresponding to the hole to be formed in the processing layer, laminating the release film for chip removal with the processing layer, the release film for chip removal and the processing layer Including a process of separating from each other, the chip may provide a method for manufacturing a product using an embossed mold apparatus, characterized in that the chip is removed by the release film for chip removal.

Here, the adhesive or the adhesive is characterized in that formed by printing on the release film for chip removal.

At this time, the adhesive or the pressure-sensitive adhesive is characterized in that it is formed by printing on the processed layer.

And, the adhesive or the pressure-sensitive adhesive is characterized in that printed on all or part of the position corresponding to the hole.

And, the adhesive or the adhesive is characterized in that hot air drying or UV curing.

Then, after the adhesive formed on the release film for chip removal is hot air dried, the release film for chip removal and the processed layer are laminated.

The adhesive formed on the chip removing mold release film is UV cured after the chip removing mold release film and the processing layer are laminated.

The pressure-sensitive adhesive formed on the chip removing release film may be UV-cured before or after the chip removing release film and the processing layer are laminated.

The adhesive or the pressure-sensitive adhesive formed on the chip removing release film is hot-air dried before the chip removing release film and the processed layer are laminated.

The adhesiveness of the adhesive or the adhesiveness of the adhesive may be expressed by hot air drying or UV curing after the adhesive or the adhesive is formed on the release film for chip removal.

The process of forming the adhesive or the adhesive may be performed by printing the adhesive or the adhesive at a position corresponding to the hole on the release film for chip removal.

In addition, the process of forming the adhesive or pressure-sensitive adhesive, the adhesive or the pressure-sensitive adhesive is formed over the entire surface of the release film for chip removal, the adhesive or the pressure-sensitive adhesive formed on the remaining portion except for the portion where the hole is to be formed It is characterized by made by removing the adhesiveness or adhesion of.

On the other hand, the present invention is a mold portion including an embossed mold for forming a hole in the processed layer of the processed film comprising an adhesive layer is formed on the bottom surface of the processing layer and the bottom surface of the processing layer is adhered, and chip removal A printing portion for forming an adhesive or an adhesive at a position corresponding to the hole on a release film for a dragon, and a lamination portion for laminating the release film for chip removal on which the adhesive or the adhesive is formed with the processing layer; The generated chip may be provided with an embossed mold apparatus, characterized in that the chip is removed by the adhesive or the adhesive formed on the release film for chip removal.

According to the present invention having the above configuration, the following effects can be achieved.

First, the present invention is to form a hole in the processing layer using a mold portion including an embossed mold, by removing a plurality of chips generated by the formation of the hole by the release film for chip removal given adhesive or tack, Since it is possible to produce a high-quality product without the occurrence of defects, it is possible to provide a reliable device to the producer and to deliver a reliable product to the consumer.

In particular, the present invention eliminates any complex driving mechanisms that cause unnecessary process delays, compared to most related prior arts including the applicant's prior applications, thereby enabling rapid and efficient mass production by reducing TAG time.

In addition, the present invention by preparing only the mold portion having a blade formed with a basic specific pattern, to significantly reduce the consumption and waste of time and cost due to the complex and huge mold design to provide a conventional embossed mold apparatus and system Can be.

In addition, the present invention in the manufacture of a flexible printed circuit board, double-sided tape, packing material, insulator, precision processing material, etc., as chips and fine powder generated due to the fine hole is scattered, adversely affecting the breathing in the workers in the workplace It will be able to prevent any problem that harms health in the long term.

That is, the present invention immediately attaches and removes chips and fine powders generated by the hole processing of the mold part by using adhesiveness or adhesiveness imparted to the release film for chip removal, to prioritize the health of the worker and to create a pleasant working environment. It becomes possible.

1 is a perspective view schematically showing that a hole is drilled and chips are generated by using an embossed mold apparatus according to an embodiment of the present invention.

Figure 2 is a conceptual diagram showing the overall structure of the embossed mold apparatus according to an embodiment of the present invention

3 is an enlarged cross-sectional conceptual view of part A of FIG. 2;

Figure 4 is a perspective view showing a state in which the adhesive or the adhesive is printed on the release film or processed layer for chip removal by the printing unit of the embossed mold apparatus according to an embodiment of the present invention

5 is an enlarged cross-sectional conceptual view of part B of FIG. 2;

6 is a schematic enlarged cross-sectional view of part C of FIG.

7 is a conceptual diagram showing the overall structure of an embossed mold apparatus according to a first modification of the present invention;

8 is a conceptual diagram showing the overall structure of an embossed mold apparatus according to a second modification of the present invention;

9 is a conceptual diagram showing the overall structure of an embossed mold apparatus according to a third modification of the present invention

10 is a conceptual diagram schematically showing a process of removing the adhesive force or adhesive force by using a remover on the adhesive or adhesive formed on the release film for chip removal according to another embodiment of the present invention.

Advantages and features of the present invention, and methods for achieving them will be apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings.

However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms.

In this specification, the embodiments are provided so that the disclosure of the present invention may be completed and the scope of the present invention may be completely provided to those skilled in the art.

And the present invention is only defined by the scope of the claims.

Thus, in some embodiments, well known components, well known operations and well known techniques are not described in detail in order to avoid obscuring the present invention.

In addition, the same reference numerals throughout the specification refer to the same components, and the terminology (discussed) used herein is for the purpose of describing the embodiments are not intended to limit the invention.

As used herein, the singular forms "a", "an" and "the" include plural unless the context clearly dictates otherwise, and the elements and acts referred to as 'comprises' or 'do' not exclude the presence or addition of one or more other components and acts. .

Unless otherwise defined, all terms (including technical and scientific terms) used in the present specification may be used in a sense that can be commonly understood by those skilled in the art.

In addition, the terms defined in the commonly used dictionary are not ideally or excessively interpreted unless they are defined.

Hereinafter, with reference to the accompanying drawings will be described a preferred embodiment of the present invention.

For reference, FIG. 1 is a perspective view schematically showing that a hole is drilled and chips are generated by using an embossed mold apparatus according to an embodiment of the present invention. FIG. 1 (a) shows a state before a drilling operation, and FIG. 1 (b) is a diagram showing a state after the drilling operation.

And, Figure 2 is a conceptual diagram showing the overall structure of the embossed mold apparatus according to an embodiment of the present invention.

3 is an enlarged cross-sectional conceptual view of part A of FIG. 2, and FIG. 4 illustrates a state in which an adhesive or an adhesive is printed on a release film for chip removal by a printing unit of an embossed mold apparatus according to an exemplary embodiment of the present disclosure. 5 is a perspective view of a portion B enlarged cross-sectional view of FIG. 2, and FIG. 6 is a view illustrating a portion C enlarged cross-sectional view of FIG. 2.

1 and 2, a blade 22 having a specific pattern is formed to form a hole 11 having a specific shape only in the processing layer 10 of the processing film M supplied as a processing object. It can be seen that the structure including the mold portion 20.

First, referring to FIG. 1, as shown in FIG. 1A, the hole corresponding part 11 ′ at a position corresponding to the hole 11 to be formed on the processing layer 10 may be formed using the mold part illustrated in FIG. 2. 20 to form a hole 11 while generating the chip 12 as shown in FIG.

Here, the processing film M includes a processing layer 10, an adhesive layer 72 formed on the bottom of the processing layer 10, and a release paper layer 70 to which the bottom of the processing layer 10 is adhered.

At this time, the chips 12 having a specific shape generated from each of the holes 11 of a specific shape by using the adhesive 31a or the adhesive 31b printed on the release film 30 for chip removal supplied in a specific direction. All can be removed.

In addition, the chips 12 having a specific shape generated from each of the holes 11 of a specific shape are removed using the chip removal release film 30 supplied in a specific direction, the adhesive 31a or the adhesive 31b. May be applied to a method of printing on the processed layer 10.

In addition, the processing layer 10 from which the chips 12 are removed is produced in the form of a product P applicable to various fields.

Such products P may include, for example, flexible printed circuit boards, double-sided tapes, packing materials, insulators, precision processing materials, stickers, and the like.

Therefore, in the present invention, the hole 11 is formed in the processing layer 10 which is the object to be processed using the mold part 20, and the plurality of chips 12 generated according to the formation of the hole 11 are adhesive or By removing all by the chip removal release film 30 provided with tackiness, it is possible to produce a high-quality product (P) without the occurrence of defects, it is possible to provide a reliable device to the producer and a reliable product to the consumer Guidance will be possible.

In particular, the present invention will be able to reduce the TAG time to achieve a rapid and efficient mass production by omitting a complex drive mechanism that causes unnecessary process delay compared to the prior art described above.

In addition, the present invention prepares only the mold part 20 having the blade 22 having a basic specific pattern, thereby providing a complex and huge mold design in order to provide a conventional embossed mold apparatus and system. The consumption and waste can be greatly reduced.

In addition, the present invention is adversely affected when breathing to the workers in the workplace due to the scattering of chips and fine powder generated by the minute hole processing in manufacturing such as a flexible printed circuit board, double-sided tape, packing material, insulator, precision processing material, etc. It will be able to prevent any problems that can affect the health and long-term health.

That is, the present invention immediately removes the chips 12 and the fine powder generated by processing the holes 11 of the mold part 20 by using the adhesiveness or adhesiveness applied to the release film 30 for chip removal. By doing so, it is possible to create a pleasant work environment by giving priority to the health of the worker.

The present invention can be applied to the above embodiments, and of course, the following various embodiments are also applicable.

First, the embossed mold apparatus according to an embodiment of the present invention will be described in more detail. It can be understood that the mold includes the mold part 20, the print part 40, and the lamination part 60.

The mold part 20 includes an embossed mold 20 for forming a plurality of holes 11 in the processed layer 10 to be supplied as the object to be processed. Hereinafter, the mold part and the embossed mold have the same reference numeral '20'. 'Is used.

The printing part 40 is for printing the adhesive 31a or adhesive 31b including the position corresponding to each of the holes 11 on the chip | tip release film 30 for chip removal.

The printing unit 40 may be applied to a screen printing machine, an offset printing machine, a gravure printing machine, and the like.

The lamination part 60 is comprised of a pair of rollers as shown, and the above-mentioned release film 30 for chip removal printed with the adhesive 31a or the adhesive 31b together with the processing layer 10 as long as it was mentioned above. By supplying between a pair of rollers, the process layer 10 and the release film 30 for chip | tip removal mutually laminate.

Therefore, the chips 12 generated from each of the holes 11 are completely removed using the adhesive 31a or the adhesive 31b applied to the release film 30 for chip removal supplied in a specific direction.

On the other hand, the mold unit 20 is lowered from the upper side of the lower fixed mold 20d and the lower fixed mold 20d supporting the processing layer 10 supplied in one direction, the upper blade 22 is provided on the lower surface A structure including the moving mold 20u can be applied.

The mold part 20 is not limited to the illustrated structure, and of course, the press mold as shown, as well as a rotary rotary die mold can also be applied.

Meanwhile, the present invention is a so-called half-knife operation, that is, half cutting, applied to the production of a product such as a flexible printed circuit board, a double-sided tape, a packing material, an insulator, a precision processing material, a sticker, and the like as shown in FIGS. Therefore, it can be applied to the manufacturing process for forming the hole 11 in the processed layer (10).

That is, the various kinds of products as described above, which are the objects of the vanishing work, are formed on the release paper layer 70, that is, the adhesive layer 72 is formed on the bottom surface of the processing layer 10, and the mold part (only) is formed on the processing layer 10. Hole processing by the hole 11 is made 20.

First, referring to FIGS. 1 to 6, the processed film M includes a release paper layer 70 having an adhesive layer 72 formed on a bottom surface of the processed layer 10 to which the bottom surface of the processed layer 10 is adhered. do.

Here, the lamination unit 60 is laminated with the processing layer 10 transferred through the mold unit 20 and the release film 30 for chip removal transferred through the printing unit 40.

At this time, the printing unit 40 is as described above is provided so that the adhesive 31a or the adhesive 31b can be accurately and precisely applied to the position corresponding to the hole (11).

In other words, it can be seen that the direction in which the chip removing release film 30 is supplied is opposite to the direction in which the processing layer 10 passing through the mold part 20 is supplied.

Therefore, the chip removing mold release film 30 passing through the printing part 40 and the processing layer 10 passing through the mold part 20 are laminated together by the lamination part 60, and the holes 11 of a specific pattern are laminated. Are formed only in the processing layer 10.

Here, it can be seen that the release paper layer 70 is provided separately from the chip removing release film 30 to which the adhesive 31a or the adhesive 31b is applied and is integrally supplied with the processing layer 10.

At this time, the adhesive force of the adhesive 31a or the adhesive 31b will be described later, but when the release film 30 for chip removal and the processing layer 10 are laminated together by the lamination part 60 as shown in FIG. It is preferable that the adhesion force of the adhesive layer 72 is larger so that each of the chips 12 formed as the portion 20 can be detached from the adhesive layer 72 and attached to and removed from the release film 30 for chip removal.

In addition, the present invention, together with the printing unit 40, at least one guide roller 80 for guiding the main doll film passed through the printing unit 40 toward the processing layer 10 side passing through the mold unit 20 It may be further provided.

Therefore, the processing layer 10 and the chip release film 30 for passing through the mold part 20 are separated from each other while being discharged through the guide roller 80.

Here, it is preferable that the adhesiveness and adhesiveness of the adhesive 31a and the adhesive 31b are expressed after the adhesive 31a or the adhesive 31b is printed on the release film 30 for chip removal.

This is because when adhesiveness or adhesiveness is expressed before printing the adhesive 31a or the adhesive 31b, the printing work becomes difficult because the adhesive 31a or the adhesive 31b adheres to the printing portion 40.

Therefore, it is preferable that the adhesive or adhesiveness is expressed by hot air drying or UV curing described later after the adhesive 31a or the adhesive 31b is printed on the release film 30 for chip removal.

In other words, the adhesive 31a or the adhesive 31b is one that can exhibit adhesiveness or tackiness by hot air drying or UV curing.

On the other hand, the present invention, so that the adhesive (31a) which is a material that generates the adhesive force by heat as shown in Figure 7, so that the adhesive 31a can be dried by hot air, the printing portion 40 and the guide roller 80 It may be further provided with a hot air dryer (51) disposed between.

In addition, the present invention is disposed between the printing portion 40 and the guide roller 80 so that the adhesive 31a can be cured by UV irradiation so that the adhesive 31a, which is a UV curable material, can be applied as shown in FIG. 8. It may be further provided with a UV curing machine 52.

Therefore, it can be seen that the adhesive 31a is printed on the release film 30 for chip removal guided by the guide roller 80 and transferred to the lamination part 60.

In addition, when the adhesive 31b is applied to the release film 30 for chip removal, the present invention is guided to the guide roller 80 as shown in FIG. 9 and the release film 30 for chip removal transferred to the lamination part 60 side. Of course, the adhesive 31b should be printed.

Meanwhile, referring back to the embodiment shown in FIGS. 7 to 9 along with FIG. 2, the present invention is discharged through the mold part 20 to form a processed layer 10 having holes 11 and chips 12 formed therein. The chip removing mold release film 30 to which each of the chips 12 is attached is passed through the guide roller 80, and the chip removing mold release film 30 to which the product P and the chip 12 are attached (see FIG. 6). Separator (not shown) may be further provided to be separated in the form of.

Here, although not specifically shown, the separation layer for separating the processing layer 10 from the chip removal release film 30 to which the chip 12 is attached in a state of being adsorbed by forming a negative pressure on the surface of the product (P). It may be provided in the form of a suction plate or a negative pressure chamber, the processing layer 10 and the chip release film 30 is attached to each of the processing layer 10 and the chip 12 is formed with a hole 11 discharged through the guide roller 80 It may be a worker who separates by hand manually.

A method of manufacturing the product P using the embossed mold apparatus according to various embodiments of the present invention as described above will be described in more detail below with reference to FIGS. 1 to 9.

According to the present invention, the chip 12 generated from each of the holes 11 formed in the plurality of holes 11 formed in the processing layer 10 as the object to be processed by the mold part 20 is a release film 30 for chip removal having adhesiveness or adhesiveness. To remove all of them.

Here, it can be seen that the blade 22 having a specific pattern corresponding to each of the holes 11 having a specific shape is formed in the mold part 20.

At this time, the mold part 20 is disposed to be capable of lifting up and down on the upper side of the processing layer 10 to form the hole 11 by pressing the processing layer 10.

As described above, the half knife operation illustrated in FIGS. 2 to 9 may include a process of separating and pressing and printing and laminating largely.

For reference, the processing film M includes a processing layer 10 having an adhesive layer 72 formed on a bottom surface thereof, and a release paper layer 70 on which a bottom surface of the processing layer 10 adheres.

First, a process of forming the holes 11 by pressing the processing layer 10 with the mold part 20 is performed.

Thereafter, a process of printing the adhesive 31a or the adhesive 31b including a position corresponding to each of the holes 11 on the chip removing release film 30 is performed.

Next, the process of laminating | stacking the release film 30 for chip | tip removal in which the adhesive 31a or the adhesive 31b was printed with the process layer 10 is performed.

Subsequently, a process of separating the chip removing release film 30 and the processing layer 10 from each other is performed.

Therefore, the chips 12 are attached to and removed from the adhesive 31a or the adhesive 31b printed on the release film 30 for chip removal.

Here, the direction in which the processing layer 10 is transferred and the direction in which the chip removing release film 30 is transferred are opposite to each other until the process of laminating the processing layer 10 is performed.

In addition, holes 11 of a specific pattern should be formed only in the processing layer 10 as shown in FIG. 5 according to the action of the blade 22 of the mold part 20.

Therefore, it can be seen that the release paper layer 70 is provided separately from the chip removing release film 30 to which the adhesive 31a or the adhesive 31b is applied and is integrally supplied together with the processing layer 10 in one direction.

In addition, as mentioned above, the adhesive force of the adhesive 31a or the adhesive 31b should be larger than the adhesive force of the adhesive layer 72 so that the adhesion removal of the chip 12 can be made reliably.

The adhesive 31a or the adhesive 31b may be printed including a position corresponding to the holes 11 of a specific pattern, but as shown in FIG. 4 (a), the holes 11 are removed from the release film 30 for chip removal. It may be printed on all of the hole forming portions 11 'at positions corresponding to the respective holes, or may be printed only on a part of the hole forming portions 11' at positions corresponding to the holes 11, as shown in FIG.

In addition, the adhesive 31a or the adhesive 31b may be formed in the hole in the processed layer 10 of the processed film M as shown in FIG. 4 (c) in order to reduce mold design and manufacturing cost and to prevent waste of raw materials. 11) may be printed on all of the hole forming portions 11 'corresponding to each position, or may be printed only on a part of the hole forming portions 11' corresponding to each of the holes 11 as shown in FIG. 4 (d). Of course.

On the other hand, when the adhesive 31a is printed on the surface of the chip removing release film 30, it is necessary to perform hot air drying as shown in FIG. 7 or UV curing as shown in FIG. 8 according to the property of the adhesive 31a. .

In addition, after the adhesive 31b is printed on the surface of the chip removing release film 30, it is preferable that the adhesive force is expressed by hot air drying and UV curing as described above, and the adhesive 31b is formed as shown in FIG. 9. The printed chip removing release film 30 is laminated with the processing layer 10 by the lamination part 60, and then presses the processing layer 10 by using the mold part 20.

Here, since the pressure sensitive adhesive 31b is made of a removable material, hot air drying and UV curing may be performed before or after laminating the processing layer 10 and the release film 30 for chip removal.

Meanwhile, the adhesive 31a or the adhesive 31b may be printed over the entire surface of the chip removing release film 30, and as shown in FIG. 10 (a), over the entire surface of the chip removing release film 30. Among the printed adhesive 31a or the adhesive 31b, the adhesive 31a or the adhesive 31b printed on the remaining portions except for the portion where the holes 11 of a specific pattern are to be formed is shown in FIG. 10 (b) or FIG. 10. It may be removed using a remover 32 provided separately (c).

That is, the remover does not leave the adhesive 31a or the adhesive 31b until the unnecessary portion of the adhesive 31a or the adhesive 31b as shown in FIG. 10 (b), and the adhesive corresponding to the exact position of each of the holes 11. It can remove, leaving only 31a or adhesive 31b.

In addition, the remover 32 is a material that removes the adhesive force or adhesive force of the adhesive 31a or the adhesive 31b to a portion where the adhesive 31a or the adhesive 31b is unnecessary, as shown in FIG. 10 (c). Material such as) may be applied.

Although the application of the remover 32 is not particularly shown, the adhesive 31a or the adhesive 31b may be removed in a precise printing manner using equipment such as the printing unit 40.

Therefore, the chip release film 30 for removing the adhesive 31a or the adhesive 31b with the remover 32 or the adhesive layer or the adhesive force from which the adhesive layer is removed and the processing layer 10 are laminated together by the lamination unit 60. will be.

As described above, the printing of the adhesive 31a, the adhesive 31b, the removing agent 32, or the like may be performed by appropriately selecting any one of screen printing, offset printing, and gravure printing.

Here, the adhesive 31a may be any one or a combination of one or more of A, B, C, and D.

At this time, the pressure-sensitive adhesive 31b may be any one or a combination of one, b, c, d.

In addition, the remover 32 may be any one or a combination of one or more of I, II, III, and IV.

As described above, it can be seen that the present invention has a basic technical idea to provide an embossed mold apparatus and a method of manufacturing a product using the same, which allow mass production of products quickly and efficiently while eliminating defects by a simple configuration. have.

In addition, many modifications and applications are possible to those skilled in the art within the scope of the basic technical idea of the present invention.

Claims

Forming a hole in the processed layer by using a mold part of the processed film including a release paper layer on which an adhesive layer is formed on the bottom of the processed layer and the bottom of the processed layer is adhered;

Forming an adhesive or an adhesive at a position corresponding to the hole to be formed in the processing layer;

Laminating the release film for chip removal with the processing layer;

And separating the chip release film and the processed layer from each other,

And the chip is removed by the release film for chip removal.
The method according to claim 1,

Said adhesive or said adhesive is formed by printing on said release film for chip removal, The manufacturing method of the product using the embossed metal mold | die apparatus characterized by the above-mentioned.
The method according to claim 1,

Said adhesive or said adhesive is formed by printing on said processed layer, The manufacturing method of the product using the embossed metal mold | die apparatus characterized by the above-mentioned.
The method according to claim 1,

The adhesive or the pressure-sensitive adhesive is printed on all or part of the position corresponding to the hole manufacturing method of the product using the embossed mold apparatus.
The method according to claim 1,

The adhesive or the adhesive is a hot air drying or UV curing method for producing a product using an embossed mold apparatus, characterized in that the curing.
The method according to claim 5,

And after the adhesive formed on the chip removing mold release film is hot air dried, the chip removing mold release film and the processing layer are laminated to each other.
The method according to claim 5,

And the adhesive formed on the chip removing mold release film is UV cured after the chip removing mold release film and the processing layer are laminated to each other.
The method according to claim 1,

And the pressure-sensitive adhesive formed on the chip removing mold release film is UV cured before or after the chip removing mold release film and the processing layer are laminated.
The method according to claim 1,

The adhesive or the pressure-sensitive adhesive formed on the release film for chip removal, hot air drying before the release film for chip removal and the processing layer is laminated, the manufacturing method of the product using the embossed mold apparatus.
The method according to claim 1,

Adhesiveness by the adhesive or adhesiveness by the pressure-sensitive adhesive is produced by the hot air drying or UV curing after the adhesive or pressure-sensitive adhesive is formed on the release film for chip removal. Way.
The method according to claim 1,

Forming the adhesive or pressure-sensitive adhesive,

And printing the adhesive or the pressure-sensitive adhesive at a position corresponding to the hole on the release film for chip removal.
The method according to claim 1,

Forming the adhesive or pressure-sensitive adhesive,

Forming the adhesive or the adhesive over the entire surface of the chip removing release film, and then removing the adhesive or adhesiveness of the adhesive or the adhesive formed on the remaining portions except for the portion where the hole is to be formed. The manufacturing method of the product using the embossed metal mold | die apparatus made into.
A mold part including an embossed mold for forming a hole in the processed layer of the processed film including a release paper layer on which an adhesive layer is formed on the bottom of the processed layer and the bottom of the processed layer is adhered;

A printing portion for forming an adhesive or an adhesive at a position corresponding to the hole on the release film for chip removal;

A lamination part for laminating the release film for chip removal on which the adhesive or the adhesive is formed, with the processing layer;

The chip generated from the hole is embossed mold apparatus, characterized in that removed by the adhesive or the adhesive formed on the release film for chip removal.