TW201738997A - Sheet adhesion device and adhesion method and adhesive sheet material - Google Patents
Sheet adhesion device and adhesion method and adhesive sheet material Download PDFInfo
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- TW201738997A TW201738997A TW105120980A TW105120980A TW201738997A TW 201738997 A TW201738997 A TW 201738997A TW 105120980 A TW105120980 A TW 105120980A TW 105120980 A TW105120980 A TW 105120980A TW 201738997 A TW201738997 A TW 201738997A
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- Prior art keywords
- sheet
- notch
- peeling
- adhesive
- adhesive sheet
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- 239000000853 adhesive Substances 0.000 title claims abstract description 87
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 84
- 238000000034 method Methods 0.000 title claims description 10
- 239000000463 material Substances 0.000 title claims description 9
- 238000001514 detection method Methods 0.000 claims abstract description 18
- 238000003825 pressing Methods 0.000 claims abstract description 11
- 230000000149 penetrating effect Effects 0.000 claims abstract description 8
- 125000002015 acyclic group Chemical group 0.000 claims description 3
- 238000005096 rolling process Methods 0.000 claims description 3
- 238000000926 separation method Methods 0.000 abstract 2
- 239000010410 layer Substances 0.000 description 10
- 239000000758 substrate Substances 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 239000012790 adhesive layer Substances 0.000 description 6
- -1 polyethylene Polymers 0.000 description 6
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 229920000298 Cellophane Polymers 0.000 description 2
- 230000006837 decompression Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- SENMPMXZMGNQAG-UHFFFAOYSA-N 3,4-dihydro-2,5-benzodioxocine-1,6-dione Chemical compound O=C1OCCOC(=O)C2=CC=CC=C12 SENMPMXZMGNQAG-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229920001747 Cellulose diacetate Polymers 0.000 description 1
- 229920002284 Cellulose triacetate Polymers 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/185—Joining of semiconductor bodies for junction formation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
- H01L21/44—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/38 - H01L21/428
- H01L21/447—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/38 - H01L21/428 involving the application of pressure, e.g. thermo-compression bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/7806—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Adhesive Tapes (AREA)
Abstract
Description
本發明是關於薄片黏貼裝置及黏貼方法與黏著薄片料捲。 The present invention relates to a sheet sticking device and a pasting method and an adhesive sheet roll.
以往，檢測黏著薄片藉著重複料捲的送出與停止的所謂間歇動作將黏著薄片逐片送出黏貼於黏附體的薄片黏貼裝置已為人所熟知(例如，參閱文獻1：日本特開2005-116928號公報)。 In the past, it has been known to detect an adhesive sheet by a so-called intermittent action of repeating the feeding and stopping of the roll, and the adhesive sheet is fed one by one to the sheet sticking device adhered to the adhesive body (for example, see Document 1: Japanese Patent Laid-Open No. 2005-116928) Bulletin).
但是，如文獻1記載的習知的薄片黏貼裝置中，為了檢測形成於料捲的黏著薄片與無用薄片的細微邊界，會有不得不採用特殊且昂貴的檢測手段的問題。 However, in the conventional sheet sticking apparatus described in Document 1, in order to detect the fine boundary between the adhesive sheet formed on the roll and the unnecessary sheet, there is a problem that a special and expensive detecting means has to be employed.
本發明的目的提供一種無須採用特殊且昂貴的檢測手段，可確實進行料捲的間歇動作的薄片黏貼裝置及黏貼方法與黏著薄片料捲。 SUMMARY OF THE INVENTION An object of the present invention is to provide a sheet sticking apparatus, an adhesive method, and an adhesive sheet roll which can perform an intermittent operation of a roll without using a special and expensive detecting means.
為達成上述目的，本發明的薄片黏貼裝置是重複間歇動作將預定形狀的黏著薄片黏貼於黏附體的薄片黏貼裝 置，採用具備：設有貫穿暫時黏著於帶狀剝離薄片之一方的面的帶狀原黏著薄片且不貫穿上述剝離薄片的環狀的第1缺口，藉此在該第1缺口的內側形成有上述預定形狀的黏著薄片，並在該第1缺口的外側形成有無用薄片，送出設有貫穿該無用薄片之環狀或非環狀的第2缺口的料捲的送料手段；將上述料捲回折，從上述剝離薄片剝離上述預定形狀的黏著薄片的剝離手段；及將剝離後的上述預定形狀的黏著薄片推壓於黏附體黏貼的推壓手段，並具備檢測藉上述剝離手段將包括上述料捲的上述第2缺口的部份回折而露出的檢測部的檢測手段，上述送料手段是根據上述檢測手段的檢測結果間歇送出上述料捲的構成。 In order to achieve the above object, the sheet sticking device of the present invention is a sheet sticking device in which a predetermined shape of an adhesive sheet is adhered to an adhesive body by repeating an intermittent action. The first notch having an annular original adhesive sheet that is temporarily adhered to one of the strip-shaped peeling sheets and not penetrating the peeling sheet is provided, and the inside of the first notch is formed inside. The adhesive sheet of the predetermined shape is formed with a non-use sheet on the outer side of the first notch, and a feeding means for feeding a roll having a ring-shaped or non-annular second notch through the unnecessary sheet is fed out; a peeling means for peeling off the adhesive sheet of the predetermined shape from the peeling sheet; and a pressing means for pressing the peeled adhesive sheet of the predetermined shape against the adhesive body, and having the detection means including the above-mentioned roll by the peeling means The detecting means of the detecting portion, wherein the portion of the second notch is folded back and exposed, the feeding means is configured to intermittently feed the roll according to the detection result of the detecting means.
另一方面，本發明的薄片黏貼方法是重複間歇動作將預定形狀的黏著薄片黏貼於黏附體的薄片黏貼方法，採用包括：設有貫穿暫時黏著於帶狀剝離薄片之一方的面的帶狀原黏著薄片且不貫穿上述剝離薄片的環狀的第1缺口，藉此在該第1缺口的內側形成有上述預定形狀的黏著薄片，並在該第1缺口的外側形成有無用薄片，送出設有貫穿該無用薄片之環狀或非環狀的第2缺口的料捲的步驟；以剝離手段將上述料捲回折，從上述剝離薄片剝離上述預定形狀的黏著薄片的步驟；及將剝離後的上述預定形狀的黏著薄片推壓於上述黏附體黏貼的步驟，實施檢測以上述剝離手段將包括上述料捲的上述第2缺口的部份回折時露出的檢測部，根據該檢測結果間歇送出上述料捲的步驟的構成。 On the other hand, the sheet sticking method of the present invention is a sheet sticking method in which an adhesive sheet of a predetermined shape is adhered to an adhesive body by repeating an intermittent operation, and includes a strip-shaped original having a surface that is temporarily adhered to one side of the strip-shaped peeling sheet. Adhesive sheet is adhered to the annular first notch of the peeling sheet, whereby an adhesive sheet having the predetermined shape is formed inside the first notch, and a unnecessary sheet is formed on the outer side of the first notch, and is sent out. a step of piercing the roll of the annular or non-annular second notch of the unnecessary sheet; folding the material roll back by the peeling means, peeling the adhesive sheet of the predetermined shape from the release sheet; and removing the peeled sheet a step of applying a predetermined shape of the adhesive sheet to the adhesive body, and detecting a portion where the portion of the second notch including the roll is folded back by the peeling means, and intermittently feeding the roll according to the detection result The composition of the steps.
又，本發明的薄片黏著薄片料捲是將帶狀的原黏著薄片暫時黏著於帶狀剝離薄片之一方的面的黏著薄片料捲，採用設有貫穿上述原黏著薄片且不貫穿上述剝離薄片的環狀的第1缺口，藉此構成可在該第1缺口的內側形成預定形狀的黏著薄片並可在該第1缺口的外側形成無用薄片，設有貫穿該無用薄片之環狀或非環狀的第2缺口，藉此構成將包括該第2缺口的部份回折時可使檢測部露出。 Further, the sheet-adhesive sheet roll of the present invention is an adhesive sheet roll in which a strip-shaped original adhesive sheet is temporarily adhered to one side of a strip-shaped release sheet, and is provided to penetrate the original adhesive sheet and not penetrate the peeling sheet. The annular first notch forms an adhesive sheet having a predetermined shape inside the first notch, and forms an unnecessary sheet on the outer side of the first notch, and is provided with a ring-shaped or acyclic shape penetrating the unnecessary sheet. The second notch is configured to expose the detecting portion when the portion including the second notch is folded back.
根據如上述的本發明，由於檢測將包括料捲的第2缺口的部份回折時露出的檢測部，根據該檢測結果間歇送出料捲，因此無須採用特殊且昂貴的檢測手段，即可確實進行料捲的間歇動作。 According to the invention as described above, since the detecting portion which is exposed when the portion including the second notch of the roll is folded back is detected, the roll is intermittently fed based on the detection result, so that it is possible to carry out the test without using a special and expensive detecting means. Intermittent action of the roll.
10‧‧‧薄片黏貼裝置 10‧‧‧Sheet Adhesive Device
20‧‧‧送料手段 20‧‧‧Feeding means
21‧‧‧支撐輥 21‧‧‧Support roller
22‧‧‧導輥 22‧‧‧guide roller
23‧‧‧轉動式馬達 23‧‧‧Rotary motor
24‧‧‧驅動輥 24‧‧‧Drive roller
25‧‧‧夾送輥 25‧‧‧Pinch roller
26‧‧‧回收輥 26‧‧‧Recycling roller
27‧‧‧框體 27‧‧‧ frame
30‧‧‧剝離板 30‧‧‧ peeling board
31‧‧‧彎曲部 31‧‧‧Bend
40‧‧‧推壓輥 40‧‧‧Pushing roller
50‧‧‧檢測手段 50‧‧‧Detection means
60‧‧‧支撐手段 60‧‧‧Support means
61‧‧‧線性馬達 61‧‧‧Linear motor
61A‧‧‧滑軌 61A‧‧‧rails
62‧‧‧工作台 62‧‧‧Workbench
62A‧‧‧支撐面 62A‧‧‧Support surface
70‧‧‧切口手段 70‧‧‧cutting means
71‧‧‧轉動式馬達 71‧‧‧Rotary motor
72‧‧‧第1刀刃 72‧‧‧1st blade
73‧‧‧第2刀刃 73‧‧‧2nd blade
74‧‧‧滾壓成形軋輥 74‧‧‧Rolling roll
75‧‧‧承模輥 75‧‧‧Model roll
80‧‧‧檢測部形成輔助手段 80‧‧‧Detection department forms an auxiliary means
AD‧‧‧黏著片 AD‧‧‧Adhesive tablets
AS‧‧‧原黏著薄片 AS‧‧‧ original adhesive sheet
AS1‧‧‧黏著薄片 AS1‧‧‧ adhesive sheet
BS‧‧‧基材 BS‧‧‧Substrate
CU‧‧‧缺口 CU‧‧‧ gap
RS‧‧‧料捲 RS‧‧‧ rolls
US‧‧‧無用薄片 US‧‧‧Useless sheets
WF‧‧‧晶圓 WF‧‧‧ wafer
第1圖為本發明之一實施形態相關的薄片黏貼裝置的側視圖。 Fig. 1 is a side view of a sheet sticking device according to an embodiment of the present invention.
第2圖為第1圖的AA-AA剖面BB箭頭方向視圖薄片黏貼裝置的動作說明圖。 Fig. 2 is an operation explanatory view of the sheet sticking apparatus in the BB arrow direction view of the AA-AA cross section of Fig. 1.
第3圖為本發明之變形例相關的薄片黏貼裝置的動作說明圖。 Fig. 3 is an operation explanatory view of a sheet sticking apparatus according to a modification of the present invention.
以下，根據圖示說明本發明之一實施形態。 Hereinafter, an embodiment of the present invention will be described based on the drawings.
再者，本實施形態的X軸、Y軸、Z軸為分別正交的關係，X軸及Y軸為預定平面內的軸，Z軸是與上述預定 平面正交的軸。並且，本實施形態是以從與Y軸平行的第1圖中跟前方向顯示的場合為基準，表示方向的場合，「上」為Z軸的箭頭顯示方向「下」為其相反方向，「左」為X軸的箭頭顯示方向「右」為其相反方向，「前」是與Y軸平行的第1圖中跟前方向「後」為其相反方向。 Further, in the present embodiment, the X-axis, the Y-axis, and the Z-axis are orthogonal to each other, and the X-axis and the Y-axis are axes in a predetermined plane, and the Z-axis is the same as the above-mentioned predetermined Plane orthogonal axes. Further, in the present embodiment, when the direction is indicated from the case where the image is displayed in the front direction in the first direction parallel to the Y-axis, the direction in which the "upper" is the Z-axis is "downward" and the direction is opposite. The arrow for the X-axis indicates that the direction "Right" is the opposite direction, and the "Front" is the direction opposite to the Y-axis in the first figure.
第1圖中，薄片黏貼裝置10是重覆間歇動作黏貼在以預定形狀的黏著薄片AS1為黏附體的半導體晶圓(以下，有僅稱「晶圓」的場合)WF的薄片黏貼裝置，具備：設有貫穿暫時黏著於帶狀剝離薄片RL的一方的面的基材BS及黏著劑AD層所構成的帶狀的原黏著薄片AS且不貫穿剝離薄片RL的環狀的第1缺口CU1，藉此在該第1缺口CU1的內側形成預定形狀的黏接薄片AS1，並在該第1缺口CU1的外側形成無用薄片US，送出貫穿該無用薄片US及剝離薄片RL之非環狀的U字型第2缺口CU2的作為黏著薄片料捲RS的料捲的送料手段20；將料捲RS回折，從剝離薄片RL剝離預定形狀的黏著薄片AS1的作為玻璃手段的剝離板30；將剝離後預定形狀的黏著薄片AS1推壓於晶圓WF黏貼的作為推壓手段的推壓輥40；檢測以剝離板30的彎曲部31將包括料捲RS的第2缺口CU2的部份回折而露出作為檢測部的貫穿孔DH的光學感測器或攝影手段等的檢測手段50(參閱第2圖)；及支撐晶圓WF，使得該晶圓WF與推壓輥40相對移動的支撐手段60。 In the first embodiment, the sheet-adhesive device 10 is a sheet-adhesive device in which a semiconductor wafer (hereinafter, simply referred to as a "wafer") WF which is adhered to a predetermined shape of the adhesive sheet AS1 as an adherend is repeatedly provided. a ring-shaped first notch CU1 that penetrates the strip-shaped original adhesive sheet AS formed by temporarily adhering to one surface of the strip-shaped peeling sheet RL and the adhesive AD layer, and does not penetrate the peeling sheet RL. Thereby, an adhesive sheet AS1 having a predetermined shape is formed inside the first notch CU1, and an unnecessary sheet US is formed outside the first notch CU1, and an acyclic U-shaped penetrating the unnecessary sheet US and the peeling sheet RL is fed. a feeding means 20 for a roll of the adhesive sheet roll RS of the second notch CU2; a peeling plate 30 which is a glass means for peeling off the roll RS from the peeling sheet RL; The shape of the adhesive sheet AS1 is pressed against the pressing roller 40 as a pressing means by the wafer WF; the detection of the portion of the second notch CU2 including the roll RS by the curved portion 31 of the peeling plate 30 is exposed and detected as a detection Optical sensing of the through hole DH of the portion Or photographic means such as detecting means 50 (see FIG. 2); and a supporting wafer WF, WF so that the wafer 40 and the pressing roller 60 moves relative to the support means.
送料手段20，具備：支撐料捲RS的支撐輥21；引導料捲RS的驅動滾22；藉著作為驅動機器的轉動式馬達23而驅動的驅動輥24；在與驅動輥24之間夾著附帶無用薄片US的剝離薄片RL的夾送輥25；及回收附帶無用薄片US的剝離薄片RL的回收輥26，其整體為框體27所支撐。 The feeding means 20 includes: a support roller 21 that supports the coil RS; a drive roller 22 that guides the coil RS; a drive roller 24 that is driven by a rotary motor 23 that drives the machine; and a drive roller 24 that is sandwiched between the drive roller 24 The pinch roller 25 with the release sheet RL of the unnecessary sheet US; and the recovery roller 26 for recovering the release sheet RL with the unnecessary sheet US are supported by the frame body 27 as a whole.
檢測手段50是如第2圖表示，配置在形成於剝離板30的收容槽32內。支撐手段60具備工作台62，該工作台具有被支撐在作為驅動機器的線性馬達61的滑軌61A，藉減壓泵或真空噴射器等未圖示的減壓手段吸附保持著晶圓WF的支撐面62A。 The detecting means 50 is disposed in the housing groove 32 formed in the peeling plate 30 as shown in Fig. 2 . The support means 60 includes a table 62 having a slide rail 61A supported by a linear motor 61 as a drive device, and holding and holding the wafer WF by a decompression means (not shown) such as a pressure reducing pump or a vacuum ejector. Support surface 62A.
以上的薄片黏貼裝置10中，說明在晶圓WF黏貼黏著薄片AS1的順序。 In the above-described sheet bonding apparatus 10, the order in which the adhesive sheet AS1 is adhered to the wafer WF will be described.
首先，如第1圖表示，各構件相對於配置在初期位置的狀態的薄片黏貼裝置10，在作業員設定料捲RS之後，透過操作面板或個人電腦等未圖示的輸入手段輸入開始自動運轉的訊號時，送料手段20驅動轉動式馬達23，送出料捲RS。之後，藉著剝離板30的彎曲部31將料捲RS的第2缺口CU2回折時，如第2圖表示，第2缺口CU2的內側朝向推壓輥40側突出，形成突出部DT，並使貫穿孔DH露出於料捲RS。並且，檢測手段50一旦檢測出貫穿孔DH的外緣時，送料手段20停止轉動式馬達23的驅動成為待機狀態，將黏著薄片AS1配置在準備黏貼位置。 First, as shown in Fig. 1, the sheet sticking device 10 in the state in which the respective members are placed in the initial position is automatically input by the input means (not shown) such as an operation panel or a personal computer after the worker sets the roll RS. At the time of the signal, the feeding means 20 drives the rotary motor 23 to feed the roll RS. Then, when the second notch CU2 of the roll RS is folded back by the curved portion 31 of the peeling plate 30, as shown in Fig. 2, the inside of the second notch CU2 protrudes toward the pressing roller 40 side, and the protruding portion DT is formed and The through hole DH is exposed to the coil RS. When the detection means 50 detects the outer edge of the through hole DH, the feeding means 20 stops the driving of the rotary motor 23 to a standby state, and arranges the adhesive sheet AS1 at the position to be pasted.
隨後，以手動或多關節機器人或帶式輸送機等未圖示 的搬運手段，在位於初期位置的工作台62的支撐面62A上載放晶圓WF時，支撐手段60驅動未圖示的減壓手段，吸附保持晶圓WF之後，驅動線性馬達61，將工作台62朝向左方移動。接著，晶圓WF到達預定位置一旦被光學感測器或攝影手段等未圖示的檢測手段檢測時，送料手段20驅動轉動式馬達23，配合工作台62的移動速度送出料捲RS。並且，黏著薄片AS1被以彎曲部31一邊從剝離薄片RL剝離，並藉著推壓輥40推壓而黏貼於晶圓WF。黏著薄片AS1整體被黏貼於晶圓WF之後，送料手段20仍持續地驅動轉動式馬達23，使檢測手段50一旦檢測下一個貫穿孔DH時，送料手段20停止轉動式馬達23的驅動，再度成為待機狀態。 Subsequently, manual or multi-joint robots or belt conveyors are not shown. When the wafer WF is placed on the support surface 62A of the table 62 located at the initial position, the support means 60 drives a pressure reducing means (not shown), and after sucking and holding the wafer WF, the linear motor 61 is driven to move the table. 62 moves to the left. Next, when the wafer WF reaches a predetermined position and is detected by a detecting means (not shown) such as an optical sensor or a photographing means, the feeding means 20 drives the rotary motor 23 to feed the roll RS in accordance with the moving speed of the table 62. Further, the adhesive sheet AS1 is peeled off from the release sheet RL by the curved portion 31, and is pressed against the wafer WF by being pressed by the pressing roller 40. After the entire adhesive sheet AS1 is adhered to the wafer WF, the feeding means 20 continues to drive the rotary motor 23, and when the detecting means 50 detects the next through hole DH, the feeding means 20 stops the driving of the rotary motor 23, and becomes again standby mode.
黏著薄片AS1對晶圓WF的黏貼結束時，在支撐手段60停止線性馬達61及未圖示的減壓手段的驅動之後，未圖示的搬運手段將晶圓WF搬運至下一步驟。並且，支撐手段60驅動線性馬達61，使工作台62恢復至初期位置，以後重複上述相同的動作。 When the adhesion of the adhesive sheet AS1 to the wafer WF is completed, after the support means 60 stops the driving of the linear motor 61 and the decompression means (not shown), the conveyance means (not shown) conveys the wafer WF to the next step. Further, the supporting means 60 drives the linear motor 61 to return the table 62 to the initial position, and thereafter repeats the same operation as described above.
根據如以上的實施形態，檢測將包括料捲RS的第2缺口CU2的部份回折時露出的貫穿孔DH，根據該檢測結果間歇送出料捲RS，不需以特殊且昂貴的檢測手段50，即可進行料捲的間歇動作。 According to the above embodiment, the through hole DH exposed when the portion of the second notch CU2 including the roll RS is folded back is detected, and the roll RS is intermittently fed based on the detection result, without using a special and expensive detecting means 50. The intermittent operation of the rolls can be performed.
如以上說明，用於實施本發明之最佳的構成、方法等雖已在上述記載所揭示，但本發明不限於此。亦即，本發明主要是有關特定的實施形態特別加以圖示，並加以說 明，但是在不脫離本發明的技術性思想及目的的範圍內，該業界皆可對以上記載的實施形態，在形狀、材質、數量、其他的詳細的構成中，施以種種的變形。又，限定上述所揭示的形狀、材質等的記載是為容易進行本發明的理解而加以例示性記載，由於對本發明不加以限定，因此除形狀、材質等限定的一部份或全部之限定外的構件名稱的記載皆為本發明所涵蓋。 As described above, the best configuration, method, and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited thereto. That is, the present invention is mainly illustrated with respect to specific embodiments, and is said to be However, the above-described embodiments can be variously modified in terms of shape, material, number, and other detailed configurations without departing from the technical spirit and object of the present invention. In addition, the description of the shape, the material, and the like described above is exemplarily described for the purpose of facilitating the understanding of the present invention, and the present invention is not limited thereto, and therefore, except for a part or all of the limitation of the shape, the material, and the like. The description of the component names is covered by the present invention.
例如，作為料捲採用將帶狀的原黏接薄片AS暫時黏接於帶狀的剝離薄片RL的一方的面的場合，也可具備在該料捲形成第1、第2缺口CU1、CU2的切口手段70。切口手段70可例示有具備：如第1圖中以兩點虛線表示，位在料捲的基材BS側，形成被作為驅動機器的轉動式馬達71旋轉驅動，並貫穿原黏著薄片AS且不貫穿剝離薄片之第1缺口CU1的第1刀刃72，並設有形成貫穿原黏著薄片AS及剝離薄片RL之第2缺口CU2的第2刀刃73的滾壓成形軋輥74，及將料捲夾於其間與滾壓成形軋輥74相對配置的承模輥75的構成。 For example, when the strip-shaped original bonding sheet AS is temporarily bonded to one surface of the strip-shaped peeling sheet RL as the roll, the first and second notches CU1 and CU2 may be formed in the roll. The slit means 70. The slit means 70 is exemplified as follows: in the first drawing, it is indicated by a two-dotted broken line, and is positioned on the side of the substrate BS of the roll, and is formed to be rotationally driven by the rotary motor 71 as a drive machine, and penetrates through the original adhesive sheet AS. The first cutting edge 72 of the first notch CU1 that penetrates the peeling sheet is provided with a roll forming roll 74 that forms a second cutting edge 73 that penetrates the second notch CU2 of the original adhesive sheet AS and the release sheet RL, and the roll is clamped to The configuration of the receiving roll 75 disposed opposite to the roll forming roll 74 therebetween.
並且，切口手段70也可以雷射刀、熱式刀、空氣刀、壓縮水刀等在料捲形成第1缺口、第2缺口CU1、CU2。 Further, the slit means 70 may form the first notch and the second notches CU1, CU2 in the roll by a laser blade, a hot knife, an air knife, a compressed water blade or the like.
作為第2缺口是如第3圖的右圖中以實線表示，也可採用從無用薄片US的外緣朝送出方向的相反方向斜向延伸的直線型的第2缺口CU20，也可採用如同右圖中兩點虛線表示從無用薄片US的外緣沿著與送出方向正交的方 向朝內側延伸之後，朝送出方向後側的L字型的第2缺口21。採用第2缺口CU20的場合，如第3圖的左圖中以實線表示，檢測手段50檢測以剝離板30將三角形的突出部DT1剝離預定長度後露出的貫穿孔DH1，採用第2缺口CU21的場合，如同左圖中以兩點虛線表示，檢測手段50檢測以剝離板30將四角形的突出部DT2剝離預定長度後露出的貫穿孔DH2即可。 The second notch is indicated by a solid line in the right diagram of Fig. 3, and a linear second notch CU20 extending obliquely from the outer edge of the unnecessary sheet US in the opposite direction to the feeding direction may be used. The two-dotted dotted line in the right figure indicates the square from the outer edge of the unnecessary sheet US along the direction orthogonal to the feeding direction. After extending inward, the L-shaped second notch 21 on the rear side in the delivery direction is directed. When the second notch CU20 is used, as shown by the solid line in the left diagram of FIG. 3, the detecting means 50 detects the through hole DH1 which is formed by peeling the triangular protruding portion DT1 by the peeling plate 30 by a predetermined length, and adopts the second notch CU21. In the case of the left side, the detection means 50 detects the through hole DH2 which is formed by peeling the rectangular protruding portion DT2 by a predetermined length by the peeling plate 30.
作為第2缺口的形狀，也可採用V字型、字型等。 As the shape of the second notch, a V-shape can also be used. Fonts, etc.
第2缺口也可以是環形的缺口，此時，檢測部也可藉著剝離手段將包括該第2缺口的料捲部份回折，剝離第2缺口的內側部份後露出的貫穿孔，也可以是從料捲剝離後的第2缺口的內側部份。再者，第2缺口的內側部份也可在藉剝離手段回折之前以未圖示的除去手段除去，也可以料捲的狀態除去。 The second notch may be a ring-shaped notch. In this case, the detecting portion may fold the portion of the roll including the second notch by a peeling means, and peel the through hole exposed by the inner portion of the second notch. It is the inner part of the second notch after peeling from the roll. Further, the inner portion of the second notch may be removed by a removal means (not shown) before being folded back by the peeling means, or may be removed in a state of being wound.
如第2圖中以兩點虛線表示，也可以在剝離板30的彎曲部31設置輔助檢測部的形成的檢測部形成輔助手段80。檢測部形成輔助手段80也可以空氣的噴射、藉著銷的推出、剝離板30的振動等輔助突出部DT的剝離。 As shown in FIG. 2 by a two-dot chain line, the detecting portion forming assisting means 80 for forming the auxiliary detecting portion may be provided in the curved portion 31 of the peeling plate 30. The detecting portion forming assisting means 80 may facilitate the peeling of the protruding portion DT by the ejection of air, the pushing out of the pin, and the vibration of the peeling plate 30.
剝離手段也可以圓棒或輥等構成。 The peeling means can also be constituted by a round bar or a roller.
推壓手段也可以採用圓棒、刃片材、橡膠、樹脂、海綿等的推壓構件，藉噴氣將黏著薄片AS1推壓於黏附體的構成。 The pressing means may be a pressing member such as a round bar, a blade, a rubber, a resin, or a sponge, and the adhesive sheet AS1 is pressed against the adherend by a jet.
檢測部也可以採用突出部，檢測手段50也可以如第1圖中以兩點虛線表示，將突出部的外緣設置在可檢測的 位置。檢測部為突出部的場合，第2缺口與第1缺口CU1同樣，也可以是貫穿原黏著薄片AS且不貫穿剝離薄片RL。 The detecting portion may also adopt a protruding portion, and the detecting means 50 may also be represented by a two-dotted broken line in FIG. 1 and the outer edge of the protruding portion is set to be detectable. position. When the detecting portion is a protruding portion, the second notch may penetrate the original adhesive sheet AS and does not penetrate the peeling sheet RL, similarly to the first notch CU1.
檢測手段50也可以是限位開關等的接觸型的感測器。 The detecting means 50 may be a contact type sensor such as a limit switch.
支撐手段60也可以機械夾頭或卡盤缸等的夾頭手段、庫倫力、接著劑、黏著劑、磁力、伯努利吸附等支撐黏附體的構成。 The supporting means 60 may be constituted by a chucking means such as a mechanical chuck or a chuck cylinder, a Coulomb force, an adhesive, an adhesive, a magnetic force, or a Bernoulli adsorption supporting body.
支撐手段60也可以是預先固定工作台62的位置移動薄片黏貼裝置10，也可以移動工作台62及薄片黏貼裝置10的雙方。 The supporting means 60 may be a position moving sheet bonding device 10 in which the table 62 is fixed in advance, or both the table 62 and the sheet bonding apparatus 10 may be moved.
相對於薄片黏貼裝置10以其他裝置相對移動經緣WF的場合，也可不設置支撐手段60。 When the warp WF is relatively moved relative to the sheet bonding apparatus 10 by another apparatus, the supporting means 60 may not be provided.
又，本發明的黏著薄片AS1及黏附體的材質、種別、形狀等，尤其不加以限定。例如，黏著薄片AS1也可以是圓形、橢圓形、三角形或四角形等的多角形、其他的形狀，可以是感壓黏著性、感熱黏著性等黏著的形態，採用感熱黏著性的黏著薄片AS1的場合，只要以設置將該黏著薄片加熱的適當的線圈加熱器或加熱管等的加熱側等之加熱手段的適當方法黏著即可。又，如此的黏著薄片AS1也可以是例如僅黏著劑層的單層；在基材與黏著劑層之間具有中間層；在基材的上面具有覆蓋層等的3層以上；並且也可有如將基材從黏著劑層剝離的所謂雙面黏著薄片，雙面黏著薄片也可以是具有單層或複數層的中間 層，或不具中間層的單層或複數層。又，作為黏附體是例如可以食品、樹脂容器、矽半導體晶圓或化合物半導體晶圓等的半導體晶圓、電路基板、光碟等的資訊記錄基板、玻璃板、鋼板、陶器、木板或樹脂板等、任意形態的構件或物品等為對象。並且，將黏著薄片AS1轉換成功能性、用途性的理解方法，例如可將資訊記載用標籤、裝飾用標籤、保護片、基板切片膠帶、黏晶薄膜、黏晶帶、記錄層形成樹脂片等的任意形狀的任意薄片、薄膜、膠帶等黏貼在如上述任意的黏附體。 Moreover, the material, type, shape, and the like of the adhesive sheet AS1 and the adherend of the present invention are not particularly limited. For example, the adhesive sheet AS1 may have a polygonal shape such as a circular shape, an elliptical shape, a triangular shape or a square shape, or the like, and may be an adhesive form such as pressure-sensitive adhesiveness or heat-sensitive adhesiveness, and a heat-sensitive adhesive sheet AS1 is used. In this case, it is sufficient to adhere it by a suitable method such as a heating means such as a suitable coil heater or a heating tube for heating the adhesive sheet. Further, such an adhesive sheet AS1 may be, for example, a single layer of only an adhesive layer; an intermediate layer between the substrate and the adhesive layer; and three or more layers of a cover layer or the like on the upper surface of the substrate; A so-called double-sided adhesive sheet that peels the substrate from the adhesive layer, and the double-sided adhesive sheet may also have a single layer or a plurality of layers. A layer, or a single layer or a plurality of layers without an intermediate layer. Further, the adhesive body is, for example, a semiconductor wafer such as a food, a resin container, a bismuth semiconductor wafer or a compound semiconductor wafer, an information recording substrate such as a circuit board or a compact disc, a glass plate, a steel plate, a ceramic plate, a wood board, or a resin plate. Any member or article of any form is an object. In addition, the adhesive sheet AS1 can be converted into a functional and versatile understanding method, and for example, a label for information recording, a label for decoration, a protective sheet, a substrate chip tape, a die-bonding film, a die bond tape, a recording layer, a resin sheet, and the like can be used. Any sheet, film, tape, or the like of any shape is adhered to any of the above-mentioned adherends.
基材及黏著劑層尤其不加以限制，基材是以例如優質紙、玻璃紙、銅板紙等的紙類、在該等紙類層疊聚乙烯等熱塑性樹脂的層壓紙、聚酯(例如聚對苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯)、聚烯烴(例如聚丙烯、聚乙烯)、聚氯乙烯、聚偏二氯乙烯、聚苯乙烯、聚碳酸酯、聚乙烯醇、聚氨酯、丙烯酸系樹脂等的塑膠、纖維素三乙酸酯、纖維素二乙酸酯、玻璃紙等的纖維素、天然橡膠或矽膠等的橡膠、木材、金屬、陶器、玻璃、石材等構成，可例示具有1μm~100mm的厚度，黏著劑層是以丙烯酸系、橡膠系、矽系的黏著劑所構成，可例示具有1μm~5mm的厚度。並且，該等基材及黏著劑層的厚度也可對照技術常識為上述例示的厚度以上，也可以例示的厚度以下。 The substrate and the adhesive layer are not particularly limited, and the substrate is a paper such as high-quality paper, cellophane, or copper paper, laminated paper of a thermoplastic resin such as polyethylene laminated on the paper, or polyester (for example, a pair of polyethylene) Ethylene phthalate, polyethylene naphthalate), polyolefin (eg polypropylene, polyethylene), polyvinyl chloride, polyvinylidene chloride, polystyrene, polycarbonate, polyvinyl alcohol Plastics such as polyurethane, acrylic resin, cellulose such as cellulose triacetate, cellulose diacetate, and cellophane, rubber such as natural rubber or silicone, wood, metal, pottery, glass, and stone. The thickness of the adhesive layer is 1 μm to 100 mm, and the adhesive layer is made of an acrylic, rubber or lanthanum adhesive, and has a thickness of 1 μm to 5 mm. Further, the thickness of the base material and the pressure-sensitive adhesive layer may be equal to or greater than the thickness exemplified above, or may be exemplified as the thickness.
本發明的手段及步驟為只要可實現該等手段及步驟說明的動作、功能或步驟即不加以任何的限定，更遑論對上 述實施形態表示的單純之一實施形態的構成物或步驟的任何限定。例如，剝離手段只要是將料捲回折，從剝離薄片剝離預定形狀的黏著薄片，與申請當初的技術常識對照，只要在其技術範圍內則不加以任何的限定(省略針對其他的手段及步驟的說明)。 The means and steps of the present invention are not limited as long as the actions, functions or steps described in the means and steps can be implemented, let alone Any limitation of the constituents or steps of one embodiment of the embodiment shown in the embodiment. For example, the peeling means is not limited to the technical scope of the application as long as the material roll is folded back, and the adhesive sheet of a predetermined shape is peeled off from the peeling sheet, and the other means and steps are omitted. Description).
又，上述實施形態的驅動手段或驅動機器除了可採用轉動式馬達、直動式馬達、線性馬達、單軸機器人、多關節機器人等的電動機器、汽缸、液壓缸、無負載液壓缸及旋轉式液壓缸等的致動器等之外，並可採用直接或間接組合該等的驅動機器(也有與實施形態例示的重複)。 Further, the driving means or the driving device of the above-described embodiment may be a motor, a cylinder, a hydraulic cylinder, an unloaded hydraulic cylinder, and a rotary type, such as a rotary motor, a direct-acting motor, a linear motor, a single-axis robot, or a multi-joint robot. In addition to actuators such as hydraulic cylinders, it is also possible to combine these driving devices directly or indirectly (again, overlapping with the embodiments).
10‧‧‧薄片黏貼裝置 10‧‧‧Sheet Adhesive Device
20‧‧‧送料手段 20‧‧‧Feeding means
21‧‧‧支撐輥 21‧‧‧Support roller
22‧‧‧導輥 22‧‧‧guide roller
23‧‧‧轉動式馬達 23‧‧‧Rotary motor
24‧‧‧驅動輥 24‧‧‧Drive roller
25‧‧‧夾送輥 25‧‧‧Pinch roller
26‧‧‧回收輥 26‧‧‧Recycling roller
27‧‧‧框體 27‧‧‧ frame
30‧‧‧剝離板 30‧‧‧ peeling board
31‧‧‧彎曲部 31‧‧‧Bend
40‧‧‧推壓輥 40‧‧‧Pushing roller
50‧‧‧檢測手段 50‧‧‧Detection means
60‧‧‧支撐手段 60‧‧‧Support means
61‧‧‧線性馬達 61‧‧‧Linear motor
61A‧‧‧滑軌 61A‧‧‧rails
62‧‧‧工作台 62‧‧‧Workbench
62A‧‧‧支撐面 62A‧‧‧Support surface
70‧‧‧切口手段 70‧‧‧cutting means
71‧‧‧轉動式馬達 71‧‧‧Rotary motor
72‧‧‧第1刀刃 72‧‧‧1st blade
73‧‧‧第2刀刃 73‧‧‧2nd blade
74‧‧‧滾壓成形軋輥 74‧‧‧Rolling roll
75‧‧‧承模輥 75‧‧‧Model roll
AD‧‧‧黏著劑 AD‧‧‧Adhesive
AS‧‧‧原黏著薄片 AS‧‧‧ original adhesive sheet
AS1‧‧‧黏著薄片 AS1‧‧‧ adhesive sheet
BS‧‧‧基材 BS‧‧‧Substrate
CU1‧‧‧第1缺口 CU1‧‧‧1st gap
CU2‧‧‧第2缺口 CU2‧‧‧ 2nd gap
DT‧‧‧突出部 DT‧‧‧Jump
RL‧‧‧剝離薄片 RL‧‧‧ peeling sheet
RS‧‧‧料捲 RS‧‧‧ rolls
US‧‧‧無用薄片 US‧‧‧Useless sheets
WF‧‧‧晶圓 WF‧‧‧ wafer
Claims (3)
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| Application Number | Priority Date | Filing Date | Title |
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| JP2015-192622 | 2015-09-30 | ||
| JP2015192622A JP6543152B2 (en) | 2015-09-30 | 2015-09-30 | Sheet sticking apparatus, sticking method, and adhesive sheet material |
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| Publication Number | Publication Date |
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| TW201738997A true TW201738997A (en) | 2017-11-01 |
| TWI713138B TWI713138B (en) | 2020-12-11 |
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| JP (1) | JP6543152B2 (en) |
| KR (1) | KR102490155B1 (en) |
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| JP2020057745A (en) * | 2018-10-04 | 2020-04-09 | リンテック株式会社 | Unnecessary sheet removal device and unnecessary sheet removal method |
| KR102597491B1 (en) | 2022-07-05 | 2023-11-06 | 정연태 | manufacturing tool for mixing pad |
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| CN85101569A (en) * | 1985-04-01 | 1987-01-10 | 欧文斯-伊利诺衣公司 | The method and apparatus of winding plastic label on the container |
| JPS6225035A (en) * | 1985-07-26 | 1987-02-03 | Asahi Chem Ind Co Ltd | Cutting laminate device with turning shoe |
| JPH08217037A (en) * | 1995-02-17 | 1996-08-27 | Tec Corp | Device for peeling off label |
| JP3602786B2 (en) * | 2000-11-10 | 2004-12-15 | 東亜機工株式会社 | Label sticking method and label sticking device |
| JP2002205718A (en) * | 2000-12-28 | 2002-07-23 | Nisca Corp | Label feeding apparatus and label feeding method |
| JP2002274518A (en) * | 2001-03-15 | 2002-09-25 | Sansei Seiki Kk | Single drum type labeler used for both thermo-sensitive label and tack label |
| CN1496815A (en) * | 2002-10-11 | 2004-05-19 | 琳得科株式会社 | Laminated device |
| JP4444619B2 (en) * | 2003-10-10 | 2010-03-31 | リンテック株式会社 | MOUNTING DEVICE AND MOUNTING METHOD |
| CN100493920C (en) * | 2004-08-09 | 2009-06-03 | 精工爱普生株式会社 | Label peeling mechanism and label printer |
| JP4880293B2 (en) * | 2005-11-24 | 2012-02-22 | リンテック株式会社 | Sheet sticking device and sticking method |
| JP4129051B2 (en) * | 2006-09-14 | 2008-07-30 | 株式会社アイアンドディ | Adhesive sheet pasting device |
| JP4361103B2 (en) * | 2006-10-17 | 2009-11-11 | 日東電工株式会社 | Optical member laminating method and apparatus using the same |
| US7999362B2 (en) * | 2008-01-25 | 2011-08-16 | Infineon Technologies Ag | Method and apparatus for making semiconductor devices including a foil |
| JP5542583B2 (en) * | 2010-08-26 | 2014-07-09 | リンテック株式会社 | Sheet sticking device and sticking method |
| JP5572045B2 (en) * | 2010-09-09 | 2014-08-13 | リンテック株式会社 | Sheet sticking device and sticking method |
| JP2013074104A (en) * | 2011-09-28 | 2013-04-22 | Lintec Corp | Sheet sticking apparatus and sticking method, and sheet manufacturing apparatus and manufacturing method |
| JP6054616B2 (en) * | 2012-03-22 | 2016-12-27 | リンテック株式会社 | Sheet manufacturing apparatus and manufacturing method, and sheet sticking apparatus |
| JP5945493B2 (en) * | 2012-10-31 | 2016-07-05 | リンテック株式会社 | Sheet sticking device and sticking method |
| JP6054466B2 (en) * | 2015-05-15 | 2016-12-27 | リンテック株式会社 | Sheet manufacturing equipment |
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| KR20170038652A (en) | 2017-04-07 |
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| JP6543152B2 (en) | 2019-07-10 |
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