CN106971959A - Sheet-adhesion device and adhesion method and adhesive sheet material - Google Patents

Sheet-adhesion device and adhesion method and adhesive sheet material Download PDF

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Publication number
CN106971959A
CN106971959A CN201610829021.3A CN201610829021A CN106971959A CN 106971959 A CN106971959 A CN 106971959A CN 201610829021 A CN201610829021 A CN 201610829021A CN 106971959 A CN106971959 A CN 106971959A
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CN
China
Prior art keywords
otch
adhesive sheet
unit
material piece
stripping
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Granted
Application number
CN201610829021.3A
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Chinese (zh)
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CN106971959B (en
Inventor
上道厚史
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Lintec Corp
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Lintec Corp
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Publication of CN106971959A publication Critical patent/CN106971959A/en
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Publication of CN106971959B publication Critical patent/CN106971959B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185—Joining of semiconductor bodies for junction formation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
    • H01L21/44—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/38 - H01L21/428
    • H01L21/447—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/38 - H01L21/428 involving the application of pressure, e.g. thermo-compression bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/7806—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Adhesive Tapes (AREA)

Abstract

Sheet-adhesion device (10) has：Extract unit (20) out, it extracts material piece (RS) out, the material piece (RS) by set insertion stripping film (RL) temporary bond former adhesive sheet (AS) and not insertion stripping film (RL) ring-type the first otch (CU1) and the first otch (CU1) inner side formed adhesive sheet (AS1), and formed unnecessary (US) in the outside of the first otch (CU1), and the second otch (CU2) of the non-annularity provided with insertion unnecessary (US)；Stripping unit (30), material piece (RS) is bent and peels off adhesive sheet (AS1) from stripping film (RL) by it；Unit (40) is pressed, adhesive sheet (AS1) is pressed and sticked in adherend (WF) by it；Detection unit (50), it detects the test section that the part comprising the second otch (CU2) of material piece (RS) is bent and manifested by using stripping unit (30), extracts testing result of the unit (20) based on detection unit (50) out and intermittently extract material piece (RS) out.

Description

Sheet-adhesion device and adhesion method and adhesive sheet material
Technical field
The present invention relates to sheet-adhesion device and adhesion method and adhesive sheet material.
Background technology
At present it is known that there is following sheet-adhesion device, by detect adhesive sheet and be repeated material piece extraction and The so-called intermitten stopped, adhesive sheet is extracted out one by one and sticked in adherend (referring for example to document 1：Day This JP 2005-116928 publications).
But, document 1 record existing sheet-adhesion device in, in order to detect material piece formation adhesive sheet with The thin border of unnecessary, it is necessary to use special and expensive detection unit.
The content of the invention
It is an object of the invention to provide a kind of sheet-adhesion device and adhesion method and adhesive sheet material, spy is not used Different and expensive detection unit, can reliably carry out the intermitten of material piece.
To achieve these goals, sheet-adhesion device of the invention be repeated intermitten and by the viscous of regulation shape Contact pin is sticked in adherend, wherein, have：Extract unit out, it extracts material piece out, and the material piece is by setting ring-type First otch and the adhesive sheet that the regulation shape is formed in the inner side of first otch, and formed in the outside of first otch Unnecessary, and the second otch provided with the insertion ring-type of unnecessary or non-annularity, the first otch insertion is in banding Stripping film described in the former adhesive sheet of the banding of temporary bond and not insertion in the one side of stripping film；Stripping unit, it is by the material Tablet bends and peels off the adhesive sheet of the regulation shape from the stripping film；Unit is pressed, it is by the rule being stripped The adhesive sheet of setting shape is pressed and sticked in adherend；Detection unit, it using the stripping unit to making the material The test section that the part comprising second otch of piece bends and manifested is detected that the extraction unit is based on the inspection The testing result for surveying unit intermittently extracts the material piece out.
On the other hand, sheet-adhesion method of the invention, is repeated intermitten and glues the adhesive sheet of regulation shape It is attached in adherend, wherein, with following process：Extract process out, material piece is extracted out, the material piece is by setting ring-type The first otch and the adhesive sheet of the regulation shape is formed in the inner side of first otch, and in the outside shape of first otch Into unnecessary, and the second otch provided with the insertion ring-type of unnecessary or non-annularity, the first otch insertion is in banding Stripping film one side on temporary bond banding former adhesive sheet and not insertion described in stripping film；Stripping process, utilizes stripping Unit bends the material piece, peels off the adhesive sheet of the regulation shape from the stripping film；Process is adhered to, by stripping The adhesive sheet of the regulation shape is pressed and sticked in the adherend, and implements to extract process out, to utilizing the stripping The test section appeared when the part comprising second otch of the material piece is bent from unit is detected, based on the inspection Result is surveyed intermittently to extract the material piece out.
In addition, the adhesive sheet material of the present invention, has the former adhesive sheet of banding in a face temporary bond of the stripping film of banding, Wherein, by setting the first otch of the ring-type of stripping film described in former adhesive sheet described in insertion and not insertion in first otch Inner side can form the adhesive sheet of regulation shape and can form unnecessary in the outside of first otch, and insertion is set this is more The ring-type of remaining piece or the second otch of non-annularity, so as to when the part comprising second otch is bent, make test section to show Expose.
The present invention more than, detects the detection manifested when the part comprising the second otch of material piece is bent Portion, is intermittently extracted material piece out based on the testing result, so special and expensive detection unit is not used, can be reliably Carry out the intermitten of material piece.
Brief description of the drawings
Fig. 1 is the side view of the sheet-adhesion device of an embodiment of the present invention；
Fig. 2 is Fig. 1 AA-AA sections BB direction views, is the action specification figure of sheet-adhesion device；
Fig. 3 is the action specification figure of the sheet-adhesion device of the variation of the present invention.
Embodiment
Hereinafter, based on brief description of the drawings one embodiment of the present invention.
In addition, the X-axis, Y-axis, Z axis in present embodiment are relation orthogonal respectively, X-axis and Y-axis are set in regulation plane Axle, Z axis is set to the axle orthogonal with the regulation plane.In addition, in the present embodiment, from Fig. 1 parallel with Y-axis with In the case of representing direction on the basis of the situation that front direction is observed, " on " be Z axis arrow mark direction, " under " be its phase Opposite direction, " left side " is the arrow mark direction of X-axis, and " right side " is its opposite direction, and " preceding " is the front in Fig. 1 parallel with Y-axis Direction, " rear " is its opposite direction.
In Fig. 1, sheet-adhesion device 10 is repeated intermitten and the adhesive sheet AS1 of regulation shape is sticked into work For on semiconductor wafer (hereinafter also referred to as " chip ") WF of adherend, wherein, have：Extract out unit 20, its using as The material piece RS of adhesive sheet material is extracted out, and material piece RS is by setting the first otch CU1 of ring-type in first otch CU1 Inner side form the adhesive sheet AS1 of regulation shape and form unnecessary US in first otch CU1 outside, and insertion is set Second otch CU2 of the U-shaped of the non-annularity of the unnecessary US and stripping film RL, stripping of the first otch CU1 insertions in banding The former adhesive sheet AS and not insertion stripping film of the banding of the D layers of composition of base material BS and adhesive A of a face temporary bond from piece RL RL；As the peel plate 30 of stripping unit, material piece RS is bent and shells the adhesive sheet AS1 of regulation shape from stripping film RL by it From；As the pressing roller 40 of pressing unit, the adhesive sheet AS1 of the regulation shape of stripping is pressed and sticked on wafer W F by it； Optical sensor and pinch as the detection unit 50 (reference picture 2) such as unit, it is to the bending section 31 by using peel plate 30 by material What the tablet RS part comprising the second otch CU2 bent and appeared is detected as the through hole DH of test section；Supporting is single Member 60, it supports wafer W F and relatively moves wafer W F and pressing roller 40.
Extracting unit 20 out has：Backing roll 21, its supporting material piece RS；Guide roller 22, its guiding material piece RS；Driven roller 24, it as the rotary electric machine 23 of driving equipment by being driven；Pinch roll 25, it is sandwiched by the stripping film RL with unnecessary US Between driven roller 24；Recycling roll 26, it reclaims the stripping film RL with unnecessary US, extracts the entirety of unit 20 out and is supported in frame On frame 27.
Detection unit 50 is configured in the accommodating groove 32 of peel plate 30 is formed at as illustrated in fig. 2.
Bearing unit 60 has platform 62, and it is supported by the sliding block 61A of the linear electric machine 61 as driving equipment, with passing through The adsorbable holding wafer W F of the decompressing unit (not shown) such as drawdown pump and vacuum syringe bearing-surface 62A.
In sheet-adhesion device 10 more than, to the adhesive sheet AS1 orders sticked on wafer W F are illustrated.
First, as shown in figure 1, relative to the sheet-adhesion device 10 configured each part in the state of initial position, behaviour Author is provided with after material piece RS, is opened via the automatic operating of input block input (not shown) such as guidance panel and PC The signal of beginning, then extract the driving rotary electric machine 23 of unit 20 out, material piece RS extracted out.Afterwards, if passing through the bending of peel plate 30 Portion 31 bends the material piece RS part comprising the second otch CU2, then as illustrated in fig. 2, the interior of the second otch CU2 is laterally pressed The side of pressure roller 40 is protruded, and forms protuberance DT, and show through hole DH in material piece RS.If moreover, the detection of detection unit 50 is passed through Through hole DH outer rim, then extract out unit 20 stop operating motor 23 driving and as holding state, adhesive sheet AS1 configurations are existed Adhere to ready position.
Afterwards, by the transport unit (not shown) such as human hand or multi-joint manipulator and conveyer belt, wafer W F is positioned in On the bearing-surface 62A of platform 62 in initial position, then bearing unit 60 drives decompressing unit (not shown), and wafer W F is adsorbed After holding, linear electric machine 61 is driven, the left direction of platform 62 is moved.Then, optical sensor and pinch picture unit etc. are not shown Detection unit detect wafer W F reach assigned position, then extract out unit 20 driving rotary electric machine 23, coordinate platform 62 movement Speed and material piece RS is extracted out.Moreover, adhesive sheet AS1 is peeled off from stripping film RL by bending section 31 and is passed through pressing roller 40 Press and stick on wafer W F.After adhesive sheet AS1 is integrally sticked on wafer W F, extract unit 20 out and also continue to driving turn Dynamic motor 23, if detection unit 50 detects next through hole DH, extracts unit 20 out and stops operating the driving of motor 23, again As holding state.
If adhesive sheet AS1 is completed to wafer W F adhesion, bearing unit 60 is by linear electric machine 61 and decompression (not shown) After the driving of unit stops, transport unit (not shown) transports wafer W F to subsequent processing.Moreover, bearing unit 60 drives Linear electric machine 61, makes platform 62 revert to initial position, and above-mentioned same action is repeated afterwards.
Embodiment as according to more than, is detected when the material piece RS part comprising the second otch CU2 is bent The through hole DH shown, material piece RS is intermittently extracted out based on the testing result, so special and expensive detection list is not used Member 50, can reliably carry out the intermitten of material piece.
More than, by above-mentioned record disclose for implement the present invention it is optimal constitute, method etc., but the invention is not restricted to This.That is, the present invention is mainly especially illustrated and illustrated to specific embodiment, but does not depart from the technology think of of the present invention Think of the scope of purpose, those skilled in the art can be to above-mentioned embodiment, and in shape, material, quantity, other are detailed Various modifications are carried out in composition.In addition, the record for defining shape, material etc. disclosed above is to be readily appreciated that the present invention And exemplary record, the present invention is not limited, so some or all limits of the restriction except these shapes, material etc. The record based on title of part outside fixed is comprising in the present invention.
For example, as material piece, the face temporary bond employed in the stripping film RL of banding has the former adhesive sheet of banding In the case of AS composition, it is possible to have in first, second otch CU1, CU2 of material piece formation otch unit 70.Cut Mouth unit 70 has：Cutting roller 74, it is as shown in double dot dash line in Fig. 1, positioned at the base material BS sides of material piece, by being used as drive The rotary electric machine 71 of dynamic equipment is driven in rotation, and provided with the first cutter 72 and the second cutter 73, first cutting The formation insertion original adhesive sheet AS of knife 72 and not insertion stripping film RL the first otch CU1, the second cutter 73 formation insertion original are viscous Contact pin AS and stripping film RL the second otch CU2；Roller 75 is born in cutting, and material piece is sandwiched there between and relative with cutting roller 74 by it Configuration.
In addition, otch unit 70 can also utilize laser cutting machine, heat-cutting machine, gas cutting machine, compression water cutting machine Deng forming first, second otch CU1, CU2 in material piece.
As the second otch, it can both use as shown in solid in Fig. 3 right figure, from unnecessary US outer rim to extraction The second linear otch CU20 that the opposite direction in direction obliquely extends, it would however also be possible to employ two point is drawn in such as Fig. 3 right figure Shown in line after unnecessary US outer rim extends along the direction orthogonal with extraction direction to inner side, towards after extraction direction Second otch CU21 of the L-shaped of side.It is shown in solid in such as Fig. 3 left figure in the case where employing the second otch CU20, detection The through hole DH1 that the protuberance DT1 of the detection triangle of unit 50 is peeled off specific length and manifested by peel plate 30, is being employed In the case of second otch CU21, as shown in double dot dash line in Fig. 3 left figure, as long as detection unit 50 is detected quadrangle The protuberance DT2 through hole DH2 that are peeled off specific length by peel plate 30 and manifested.
, can be using V-arrangement, U shape etc. as the shape of the second otch.
Second otch can be the otch of ring-type, in this case, test section both can be that will include to be somebody's turn to do by stripping unit The material piece part bending of second otch, can also by the through hole peeled off the inboard portion of the second otch and manifested For the inboard portion for the second otch peeled off from material piece.In addition, the inboard portion of the second otch both can be single by peeling off Removed, can also be removed in the state of material piece by removing unit (not shown) before member bending.
As shown in double dot dash line in Fig. 2, the inspection of the formation of auxiliary test section can be set in the bending section 31 of peel plate 30 Survey portion forms auxiliary unit 80.Test section formation auxiliary unit 80 can also utilize the spray attachment of gas, the extrusion based on pin, stripping The complementary projection such as vibration of plate 30 DT stripping.
Stripping unit can also be made up of pole and roller etc..
Pressing unit both can use pressing component using pole, sheet material, rubber, resin, sponge etc., can also pass through gas Adhesive sheet AS1 is pressed against in adherend by body spray attachment.
Test section can both use protuberance, and detection unit 50 can also be as shown in double dot dash line in Fig. 1, and being arranged on can Detect the position of the outer rim of protuberance.Test section be protuberance in the case of, the second otch in the same manner as the first otch CU1, Insertion original adhesive sheet AS and not insertion stripping film RL.
Detection unit 50 can also be the sensor of the contact-types such as limit switch.
Bearing unit 60 can also be to utilize the fixture unit such as mechanical clamp and fixture cylinder, Coulomb force, bonding agent, adhesion The composition of the supporting adherend such as agent, magnetic force, Bernoulli Jacob's absorption.
The position of platform 62 can both be fixed and move sheet-adhesion device 10 by bearing unit 60, can also make platform 62 and The both sides of sheet-adhesion device 10 move.
Relative to sheet-adhesion device 10, in the case of making wafer W F relative movements using other devices, can not also have There is bearing unit 60.
In addition, adhesive sheet AS1 of the invention and material, species, shape of adherend etc. are not particularly limited.For example, viscous Contact pin AS1 both can be polygon, the other shapes such as circular, ellipse, triangle and quadrangle, or pressure sensitivity is bonded Property, the bonding way such as thermal sensation cementability, in the case where employing the adhesive sheet AS1 of thermal sensation cementability, as long as will using setting The proper method bonding of the heating unit of the heated sides such as appropriate winding heater, the heating tube of adhesive sheet heating etc.. In addition, such adhesive sheet AS1 can also be that for example only the individual layer of bond layer is constituted, had between base material and bond layer The composition in intermediate layer, above base material there is more than three layers of the composition such as cap layer, base material can be peeled off from bond layer The composition of so-called double-sided adhesive sheet, double-sided adhesive sheet can also for intermediate layer with single or multiple lift composition, do not have The composition of the single or multiple lift of interbed.In addition, as adherend, for example can be by food, plastic holding device, semiconductor silicon wafer And the information memory substrate such as semiconductor wafer, circuit substrate, the CD such as compound semiconductor wafer, glass plate, steel plate, pottery, Part and article of any form such as plank or resin plate etc. also serve as object.In addition, by adhesive sheet AS1 change functionally, use Pronunciation on way, for example can be by information storage label, decoration label, screening glass, cutting belt, die bonding film, engagement Any sheet material, film, the bands of arbitrary shape such as band, accumulation layer formation resin sheet etc. stick to as described above arbitrary glued On body.
As base material and bond layer, be not particularly limited, base material such as the stationery as good quality paper, glassine paper, coated paper, The lamination paper of the thermoplastic resin such as ethene, polyester fiber are gathered on these stationery upper stratas (such as polyethylene terephthalate, poly- (ethylene naphthalate)), it is polyolefin (such as polypropylene, polyethylene), polyvinyl chloride, polyvinylidene chloride, polystyrene, poly- The fibers such as the plastics such as carbonic ester, vinyl alcohol, polyurethane, allyl resin, Triafol T, cellulosic triacetate, glassine paper Rubber, timber, metal, pottery, glass, the stone materials such as element, natural rubber and silicon rubber etc. are constituted, the thickness with 1 μm~100mm Degree, bond layer is made up of the bonding agent of propylene class, rubber-like, silicone, the thickness with 1 μm~5mm.In addition, these bases The thickness of material and bond layer be both referred to common technical knowledge be above-mentioned example thickness more than, or the thickness of example with Under.
As long as the unit and process of the present invention can play the action to said units and specification, function or process, Then without limiting, moreover, the construct and work of the simple embodiment being not exclusively limited to shown in above-mentioned embodiment Sequence.As long as example, material piece is is bent and peels off the adhesive sheet for providing shape from stripping film by stripping unit, then with reference to application Common technical knowledge originally, as long as in its technical scope, then without limiting and (omitting to other units and the explanation of process).
In addition, the driver element and driving equipment in above-mentioned embodiment can not only use rotary electric machine, direct acting motor, line The electrical equipments such as property motor, single shaft mechanical arm, multi-joint mechanical arm, cylinder, oil hydraulic cylinder, without the actuator such as bar cylinder and rotating cylinder Deng, but also can be using the composition for directly or indirectly combining the said equipment (also with the repetition of embodiment example).

Claims (3)

1. a kind of sheet-adhesion device, it is repeated intermitten and the adhesive sheet of regulation shape is sticked into adherend On, it is characterised in that have：
Extract unit out, it extracts material piece out, and the material piece is by setting the first otch of ring-type in first otch Side forms the adhesive sheet of the regulation shape, and forms in the outside of first otch unnecessary, and this is unnecessary provided with insertion The ring-type of piece or the second otch of non-annularity, the band of the first otch insertion temporary bond in the one side of the stripping film of banding Stripping film described in the former adhesive sheet of shape and not insertion；
Stripping unit, the material piece is bent and peels off the adhesive sheet of the regulation shape from the stripping film by it；
Unit is pressed, the adhesive sheet for the regulation shape being stripped is pressed and sticked in adherend by it；
Detection unit, it is shown to bending the part comprising second otch of the material piece using the stripping unit The test section exposed detected,
The extraction testing result of the unit based on the detection unit intermittently extracts the material piece out.
2. a kind of sheet-adhesion method, it is repeated intermitten and the adhesive sheet of regulation shape is sticked into adherend On, it is characterised in that with following process：
Extract process out, material piece is extracted out, the material piece is by setting the first otch of ring-type in the inner side of first otch The adhesive sheet of the regulation shape is formed, and forms in the outside of first otch unnecessary, and provided with insertion this unnecessary Ring-type or non-annularity the second otch, the banding of the first otch insertion temporary bond in the one side of the stripping film of banding Former adhesive sheet and not insertion described in stripping film；
Stripping process, is bent the material piece using stripping unit, from the stripping film by it is described regulation shape adhesive sheet Peel off；
Process is adhered to, the adhesive sheet of the regulation shape of stripping is pressed and sticked in the adherend,
And implement to extract process out, to using the stripping unit that the part comprising second otch of the material piece is curved The test section appeared during folding is detected, is intermittently extracted the material piece out based on the testing result.
3. a kind of adhesive sheet material, has the former adhesive sheet of banding in a face temporary bond of the stripping film of banding, it is characterised in that
By setting the first otch of the ring-type of stripping film described in former adhesive sheet described in insertion and not insertion in first otch Inner side can form the adhesive sheet of regulation shape and can form unnecessary in the outside of first otch, and insertion is set this is more The ring-type of remaining piece or the second otch of non-annularity, so as to when the part comprising second otch is bent, make test section to show Expose.
CN201610829021.3A 2015-09-30 2016-09-18 Sheet adhesion device and adhesion method, and adhesive sheet material Active CN106971959B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-192622 2015-09-30
JP2015192622A JP6543152B2 (en) 2015-09-30 2015-09-30 Sheet sticking apparatus, sticking method, and adhesive sheet material

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CN106971959A true CN106971959A (en) 2017-07-21
CN106971959B CN106971959B (en) 2021-11-02

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JP (1) JP6543152B2 (en)
KR (1) KR102490155B1 (en)
CN (1) CN106971959B (en)
TW (1) TWI713138B (en)

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JP2020057745A (en) * 2018-10-04 2020-04-09 リンテック株式会社 Unnecessary sheet removal device and unnecessary sheet removal method
KR102597491B1 (en) 2022-07-05 2023-11-06 정연태 manufacturing tool for mixing pad

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