JP5856389B2 - Sticking device and sticking method - Google Patents

Description

  The present invention relates to a sticking device and a sticking method.

2. Description of the Related Art Conventionally, there has been used an apparatus for manufacturing chips by dicing a semiconductor wafer (hereinafter referred to as “wafer”) attached to a first tape, and then transferring these chips to a second tape (for example, Patent Documents). 1).
In the apparatus described in Patent Document 1, a wafer is attached to a first frame via a first UV tape, and a chip is manufactured by dicing the wafer. Next, after expanding the chip interval by the stretch ring, the second UV tape with the second frame attached is attached to the main surface of the chip, and the first UV tape is peeled off and conveyed to a subsequent process such as a pickup process.

JP 11-67697 A

  However, in the apparatus described in Patent Document 1, when the second UV tape is attached to the main surface of the chip attached to the first UV tape, there is no chip in the region outside the outer periphery of the wafer. And the second UV tape may adhere to each other. In the state where the first UV tape and the second UV tape are adhered, when the first UV tape is peeled off, the first UV tape is not peeled off from the second UV tape, and the wafer is damaged.

  The objective of this invention is providing the sticking apparatus and sticking method which can be stuck on a 2nd adhesive sheet, without damaging the wafer affixed on the 1st adhesive sheet.

In order to achieve the above object, the sticking device of the present invention sticks the second surface of the plate-like member having the first surface stuck to one surface of the first adhesive sheet to one surface of the second adhesive sheet. A sticking device for sticking the plate-like member to the second adhesive sheet, comprising: a first sheet support means for supporting the plate-like member via the first adhesive sheet; and the first sheet support means. A second sheet supporting means capable of disposing one surface of the second adhesive sheet facing the second surface of the supported plate-like member; and a contact surface capable of contacting the other surface of the first adhesive sheet. A contact means having, a pressing means for attaching the second adhesive sheet to the plate-like member by relatively approaching the plate-like member and the second adhesive sheet, and the first adhesive sheet and the second adhesive sheet. said first adhesive Sea by inserting the anti-adhesion member from outside the area the plate-like member between And an adhesion prevention means for preventing the adhesion of the second adhesive sheet and the adhesion prevention means, along a plurality of anti-adhesion member, a plurality of anti-adhesion member in the surface direction of the plate-like member And a drive device to be moved, and the tip of the adhesion preventing member is attached to the tip of the other adhesion preventing member so as to be disposed so as to surround the plate-like member in the outer region. Is adopted.

At this time, in the sticking device of the present invention, the plate-like member is divided into a plurality of chips, or formed so as to be divided into a plurality of chips, and the first sheet support means and the contact means Each of the chips separated by pulling the first adhesive sheet by relative movement, or an expanding means provided so that the interval between the chips can be separated. It is preferable.
Furthermore, in the sticking device of the present invention, the pressing means includes a pressing roller that presses the second adhesive sheet, and the pressing roller has a flat shape, the surface shape of the plate member, or the interval. It is preferable to have the convex part formed in the same shape as the surface shape of the plate-shaped member expanded.

On the other hand, in the sticking method of the present invention, the plate-like member is obtained by sticking the second surface of the plate-like member having the first surface stuck to one surface of the first adhesive sheet to the one surface of the second adhesive sheet. Is attached to the second adhesive sheet, the step of supporting the plate-like member via the first adhesive sheet, and the second adhesive sheet on the second surface of the supported plate-like member A step of opposingly arranging the one surface, a step of bringing a contact surface into contact with the other surface of the first adhesive sheet, and moving a plurality of adhesion preventing members along the surface direction of the plate-like member, wherein the distal end portion of the anti-adhesion member by causing butted to the tip portion of the other of the anti-adhesion member, the plate the plate Oite the region outside the member between the first adhesive sheet and the second adhesive sheet placing so as to surround the Jo member, and said plate-like member and the second adhesive sheet It employs a configuration that includes a step of sticking a second adhesive sheet to the plate-shaped member by pairs approach, the.

  According to the present invention as described above, when the second adhesive sheet is stuck to the plate-like member, the adhesion preventing means is inserted into the region outside the plate-like member between the first adhesive sheet and the second adhesive sheet. Therefore, adhesion between the first adhesive sheet and the second adhesive sheet can be prevented in the region outside the plate-like member. Therefore, for example, when the first adhesive sheet attached to the plate-like member is peeled, the plate-like member can be prevented from being damaged.

Further, if the first sheet support means and the contact means interact with each other so that the interval between the chips can be expanded, the step of increasing the chip interval can be omitted in the subsequent step. .
Furthermore, if a pressing roller having a convex portion corresponding to the surface shape of the plate-like member or the surface shape of the plate-like member having an increased interval is employed, for example, a through hole is provided inside the plate-like member. When such a plate-shaped member is employed, it is possible to prevent the first adhesive sheet and the second adhesive sheet from being bonded through the through hole.

The side view of the sticking device concerning one embodiment of the present invention. The partial top view of the said sticking apparatus. (A), (B), (C) is operation | movement explanatory drawing of a sticking apparatus. (D), (E), (F) is operation | movement explanatory drawing of a sticking apparatus.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
Further, in the present embodiment, unless otherwise specified, terms indicating directions such as “up”, “down”, “left”, and “right” are used with reference to FIG.
In FIG. 1, the attaching device 1 includes a second surface W2 of a wafer W as a plate-like member having a first surface W1 attached to one surface (upper surface) of the first adhesive sheet S1, and one of the second adhesive sheets S2. A first sheet support means 2 for supporting the wafer W via the first adhesive sheet S1 and a first sheet support. The second sheet supporting means 3 capable of disposing one surface (lower surface) of the second adhesive sheet S2 opposite to the second surface W2 of the wafer W supported by the means 2, and the other surface (lower surface) of the first adhesive sheet S1. The contact means 4 having an abutment surface 41 capable of abutting on the wafer W, the pressing means 5 for adhering the second adhesive sheet S2 to the wafer W by relatively approaching the wafer W and the second adhesive sheet S2, and the first Adhesion prevention hand for preventing adhesion between the adhesive sheet S1 and the second adhesive sheet S2 Includes a 6, a first sheet supporting means 2 and the expanded section 7 of the abutment means 4 provided to be relatively movable.

An adhesive layer AD1 is provided on one surface of the first adhesive sheet S1, and a wafer W and a first ring frame RL1 as a frame member are attached to the adhesive layer AD1. Here, a circuit (not shown) is formed on the second surface W2 of the wafer W.
An adhesive layer AD2 is provided on one surface of the second adhesive sheet S2, and a second ring frame RL2 is attached to the adhesive layer AD2.

The first sheet support means 2 includes a support plate 21, a linear motor 22 that is a driving device provided on the lower surface of the support plate 21, and a substantially L-shaped presser plate provided on the output shaft 23 of the linear motor 22. The member 24 is supported by the expanding means 7.
The second sheet support means 3 includes a support plate 31, a linear motor 32 as a driving device provided on the upper surface of the support plate 31, and a substantially L-shaped presser provided on the output shaft 33 of the linear motor 32. And a member 34, and is supported by a conveying means such as an articulated robot which is a driving device (not shown).

  The abutting means 4 includes a suction table 42 having a circular shape in plan view provided on the upper surface of the flange portion 4B above the support frame 4A. The upper surface of the suction table 42 constitutes a contact surface 41 that contacts the first adhesive sheet S1, and the first adhesion is achieved by sucking air from the contact surface 41 by suction means such as a decompression pump or a vacuum ejector (not shown). The sheet S1 is provided so as to be sucked and held.

The pressing means 5 includes a linear motor 51 that is a driving device extending in the left-right direction, an air cylinder 53 that is a driving device provided on a slider 52 of the linear motor 51, and a support portion 54 that is moved up and down by the air cylinder 53. And a pressing roller 56 rotatably supported by a support shaft 55 that is supported by the support portion 54 and extends in the front-rear direction (the direction orthogonal to the paper surface).
A convex portion 57 formed of an elastic member is provided on the outer peripheral surface of the pressing roller 56. The convex portion 57 has a circular shape developed in a plane, and is set to have the same shape as the planar shape of the wafer W whose interval is widened.

The adhesion preventing means 6 includes a linear motor 61 that is a driving device extending in the left-right direction, and a plate member 63 as an adhesion preventing member provided on the slider 62 of the linear motor 61. The plate member 63 has one end supported by the slider 62 and the other end bent in an obliquely upward direction, and is continuously formed at the other end of the support 631. And a semi-annular main body 632 that opens to the wafer W side. The plate member 63 is set so that an annulus formed by attaching the front end portion 633 of the main body portion 632 fits between the outer edge of the wafer W and the inner edge of the first ring frame RL1.
The expanding means 7 includes a linear motion motor 71 that is a drive device supported by the flange portion 4 </ b> B, and the support plate 21 is supported by the output shaft 72 of the linear motion motor 71.

The procedure for sticking the wafer W to the second adhesive sheet S2 in the sticking apparatus 1 will be described.
The wafer W is separated into a plurality of chips WA by a dicing process in a state where the wafer W is stuck to one surface of the first adhesive sheet S1.
First, as shown in FIG. 1, the wafer W integrated with the first ring frame RL <b> 1 is conveyed via the first adhesive sheet S <b> 1, and the first ring frame RL <b> 1 is driven by the left and right linear motors 22 to support the plate 21. And the pressing member 24 to be supported. On the other hand, the second adhesive sheet S2 affixed to the second ring frame RL2 is conveyed, and the second ring frame RL2 is sandwiched and supported by the support plate 31 and the pressing member 34 by driving the left and right linear motors 32.

Next, the first sheet support means 2 is moved downward by driving the linear motion motor 71 to bring the contact surface 41 into contact with the other surface of the first adhesive sheet S1, and the drive of the linear motion motor 71 is continued. Then, as shown in FIG. 3A, the first adhesive sheet S1 is pulled to widen the interval between the chips WA. When it is detected by a sensor (not shown) that the distance between the chips WA has reached a preset distance, the driving of the linear motor 71 is finished and the suction holding of the first adhesive sheet S1 is started by the suction table 42. .
Then, when the linear motor 61 is driven to bring the plate members 63 closer to each other and when it is detected by a sensor (not shown) that the tip portions 633 come into contact with each other, the driving of the linear motor 61 ends.

Next, as shown in FIG. 3B, it is detected by a sensor (not shown) that the second sheet supporting means 3 has been lowered to a preset position in the vicinity of the wafer W by driving a conveying means (not shown). Then, the driving of the conveying unit is finished.
Next, as shown in FIG. 3C, the pressure roller 56 is moved downward by driving the air cylinder 53, and the second adhesive sheet S <b> 2 is applied to the second surface W <b> 2 of the chip WA by a predetermined pressing force by the convex portion 57. Press. Thereafter, when the pressure roller 56 is moved rightward by driving the linear motor 51, the second adhesive sheet S2 is sequentially attached to the chip WA while the pressure roller 56 rotates clockwise. At this time, since the plate member 63 is inserted between the first adhesive sheet S1 and the second adhesive sheet S2 outside the outer periphery of the wafer W, the first adhesive sheet S1 and the second adhesive sheet S2 are bonded. Never do.

Then, as shown in FIG. 4E, the pressure roller 56 is moved upward by driving the air cylinder 53 to hold the second ring frame RF2 by the first sheet support means 2 and suck and hold the suction table 42. The operation of attaching the second adhesive sheet S2 to the wafer W is completed. Then, after the plate member 63 is moved away from the wafer W by driving the linear motor 61, it is integrated with the first and second ring frames RF1 and RF2 via the first and second adhesive sheets S1 and S2. The wafer W is transferred to a next process such as a pickup process (not shown) via a transfer means (not shown) and the second sheet support means 3.
In the present embodiment, after the plate member 63 is moved away from the wafer W by driving the linear motor 61, as shown in FIG. The means 3 is moved further upward, the chip WA is peeled off from the first adhesive sheet S1, and transferred to the second adhesive sheet S2. When the chip WA is completely peeled from the first adhesive sheet S1, the suction by the suction table 42 is stopped. Then, the wafer W attached to the second adhesive sheet S2 is transferred to a subsequent process such as a pickup process by a transfer means (not shown). Note that the adhesive strength of the first adhesive sheet S1 is weaker than the adhesive strength of the second adhesive sheet S2, or the adhesive AD1 whose adhesive strength is reduced by energy rays such as ultraviolet rays is adopted, and energy beam irradiation is performed in advance. It is good that the adhesive strength is weakened.

According to this embodiment, there are the following effects.
That is, when the second adhesive sheet S2 is affixed to the wafer W, the plate member 63 is inserted into a region outside the wafer W between the first adhesive sheet S1 and the second adhesive sheet S2. Adhesion between the first adhesive sheet S1 and the second adhesive sheet S2 can be prevented in the outer region. Thereby, for example, when the first adhesive sheet S1 attached to the wafer W is peeled off, the wafer W can be prevented from being damaged.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such restrictions is included in this invention.

For example, the first ring frame RL1 may be peeled off from the first adhesive sheet S1 after the wafer W is diced, and only the first adhesive sheet S1 may be supported by the first sheet support means 2. Further, the second sheet support means 3 may be configured to support only the second adhesive sheet S2 similarly to the first sheet support means 2.
Then, the wafer W is illustrated as being bonded to the first adhesive sheet S1 in a state of being separated into chips WA, but can be separated into chips WA by a laser (modified) ) State, it may be affixed to the first adhesive sheet S1. With such a configuration, the wafer W can be divided into chips WA by pulling the first adhesive sheet S <b> 1 by driving the expanding means 7.

Further, after the second adhesive sheet S2 is brought close to the first adhesive sheet S1, the first adhesive sheet S1 may be pulled to separate the chips WA.
With such a configuration, even when scraps or the like are generated when the chips WA are separated into pieces, the second adhesive sheet S2 covers the chips WA, so that the scraps and the like can be prevented from scattering.
Furthermore, although the convex portion 57 of the pressing roller 56 has a configuration in which the shape developed in a plane is the same shape as the surface shape of the wafer W, the shape may be larger than the surface shape of the wafer W.
Further, when the through hole is formed inside the plate-like member, the shape in which the convex portion 57 is developed in a plane is the same shape as the surface shape of the plate-like member in which the through hole is formed. It can prevent that 1st adhesive sheet S1 and 2nd adhesive sheet S2 adhere | attach through a through-hole.

The number of the first sheet support means 2 and the linear motion motor 71 is not limited to two, and may be three or more, or may be one.
Further, the number of the first sheet support means 2 and the linear motion motor 71 may be different. For example, the two first sheet support means 2 connected by the connecting member may be moved by the single linear motor 71.
Further, the plate-like member may be a wafer W that has not been diced.
In addition, the types and materials of the first and second adhesive sheets S1, S2 in the present invention are not particularly limited, for example, those having an intermediate layer between the base sheet and the adhesive layers AD1, AD2, Three or more layers, such as having other layers, may be used. Further, the first and second adhesive sheets S1 and S2 may be protective sheets, dicing tapes, die attach films, other arbitrary sheets, films, tapes, and the like, adhesive sheets having arbitrary uses and shapes. Examples of semiconductor wafers include silicon semiconductor wafers and compound semiconductor wafers, and the plate-like members include not only optical disks, glass plates, steel plates, resin plates, and other members, but also members and articles of any form. Can be targeted.
The pressing means 5 may employ a pressing member made of blade material, air spray, rubber, resin, sponge, or the like.
Further, the pressing means 5 and the adhesion preventing means 6 may be configured by other than those shown in the above embodiment. As long as the pressing means 5 can adhere an adhesive sheet to the plate-like member, the adhesion preventing means 6 The first adhesive sheet S1 and the second adhesive sheet S2 are not limited in any way as long as it can be prevented from adhering.
Alternatively, the second adhesive sheet S2 may be fixed and the wafer W may be moved and moved closer, or both the second adhesive sheet S2 and the wafer W may be moved and moved closer.
Further, the first sheet support means 2 may be fixed, and the contact means 4 may be moved to expand, or both the first sheet support means 2 and the contact means 4 may be moved to expand. .

  The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 1 ... Pasting apparatus 2 ... 1st sheet support means 3 ... 2nd sheet support means 4 ... Contact means 5 ... Press means 6 ... Adhesion prevention means 41 ... Contact surface 56 ... Press roller 63 ... Plate member (adhesion prevention member)
RL1 ... 1st ring frame (frame member)
S1 ... first adhesive sheet S2 ... second adhesive sheet W ... wafer (plate-like member)
WA ... Chip W1 ... First surface W2 ... Second surface

Claims (4)

The second surface of the plate-like member having the first surface attached to one surface of the first adhesive sheet is attached to one surface of the second adhesive sheet, and the plate-like member is attached to the second adhesive sheet. A sticking device,
First sheet support means for supporting the plate-like member via the first adhesive sheet;
Second sheet support means capable of disposing one surface of the second adhesive sheet opposite to the second surface of the plate-like member supported by the first sheet support means;
A contact means having a contact surface capable of contacting the other surface of the first adhesive sheet;
A pressing means for adhering the second adhesive sheet to the plate member by relatively approaching the plate member and the second adhesive sheet;
Anti-adhesive to prevent adhesion of the first adhesive sheet and the second adhesive sheet and the said first adhesive sheet by inserting the anti-adhesion member from outside the area the plate-like member second adhesive sheet between the and means, the,
The adhesion preventing means includes a plurality of adhesion preventing members and a driving device that moves the plurality of adhesion preventing members along the surface direction of the plate-like member, and the other end of the adhesion preventing member is prevented from adhering to the other. The sticking device is provided so as to be arranged so as to surround the plate-like member in the outer region by being attached to the tip of the member . The plate-like member is singulated into a plurality of chips, or formed so as to be singulated into a plurality of chips,
The first sheet supporting means and the abutting means are moved relative to each other to pull the first adhesive sheet to separate the chips, or the intervals between the chips that can be separated. 2. The sticking device according to claim 1, further comprising an expanding means provided so as to be expandable. The pressing means includes a pressing roller that presses the second adhesive sheet,
The pressing roller has a convex portion formed in a flat shape, the surface shape of the plate-like member or the same shape as the surface shape of the plate-like member having an increased interval. Claim | item 1 or the sticking apparatus of Claim 2. The second surface of the plate-like member having the first surface attached to one surface of the first adhesive sheet is attached to one surface of the second adhesive sheet, and the plate-like member is attached to the second adhesive sheet. A sticking method,
Supporting the plate-like member via the first adhesive sheet;
Placing one surface of the second adhesive sheet opposite to the second surface of the supported plate-like member;
Contacting the contact surface with the other surface of the first adhesive sheet;
The plurality of adhesion preventing members are moved along the surface direction of the plate-like member, and the tip of the adhesion preventing member is attached to the tip of the other adhesion preventing member, whereby the first adhesive sheet and the second adhesive sheet placing so as to surround the Oite the plate member in the region outside the said plate-like member between the adhesive sheet,
Attaching the second adhesive sheet to the plate-like member by relatively approaching the plate-like member and the second adhesive sheet.

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