JP2013197117A - Sheet pasting device and pasting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To paste an adhesive sheet by cutting that so as to be placed within the inner side than an outer edge of a workpiece.SOLUTION: A sheet pasting device 1 pasting an adhesive sheet AS equipped with elasticity on one surface of a workpiece WF includes: inside supporting means 2 for supporting the workpiece WF from the other surface side; outside supporting means 3 provided so as to surround the inside supporting means 2, having a pasted surface 34 on which the adhesive sheet AS is pasted; supplying means 4 for supplying the adhesive sheet AS so as to oppose to the one surface of the supported workpiece WF and the pasted surface 34 of the outside supporting means 3; pressing means 5 for pressing and pasting the adhesive sheet AS on the one surface of the workpiece WF and the pasted surface 34 of the outside supporting means 3; energizing means 6 for energizing a non-pasting area AS1 between the one surface of the workpiece WF and the outside supporting means 3 on the pasted adhesive sheet AS in a surface outward direction; and cutting means 7 for cutting the adhesive sheet AS expanded by energizing, along the outer edge of the workpiece WF.

Description

  The present invention relates to a sheet sticking apparatus and a sticking method for sticking an adhesive sheet to an adherend.

Conventionally, in a semiconductor manufacturing process, an adhesive sheet such as a protective sheet, a mounting sheet, a dicing tape, or a die bonding tape is attached to the surface of a semiconductor wafer (hereinafter simply referred to as “wafer”) as an adherend. A sticking device is known (see, for example, Patent Document 1).
The sheet sticking apparatus described in Patent Document 1 includes a chuck table for holding a wafer, a sticking roller for sticking a belt-like adhesive sheet to the held wafer, and a cutter blade for cutting the adhesive sheet, and sticking the adhesive sheet Is cut along the outer edge of the wafer with a cutter blade.

JP 2004-47976 A

  However, in the conventional sheet sticking apparatus as described in Patent Document 1, as shown in FIG. 3A, the adhesive sheet AS attached to the surface WA, which is one surface of the wafer WF, is removed by the cutter blade CU. After cutting along the outer edge of the wafer WF, if the back surface WB, which is the other surface, is ground, the adhesive sheet AS protrudes from the outer edge of the ground wafer WF as indicated by an arrow in FIG. For this reason, when another adhesive sheet such as a dicing tape is attached to the ground back surface WB, the adhesive sheet AS protruding from the outer edge is attached to the other adhesive sheet, and the adhesive sheet AS is peeled off from the wafer WF. There is an inconvenience that peeling becomes impossible.

  An object of the present invention is to provide a sheet sticking apparatus and a sticking method capable of cutting and sticking an adhesive sheet so as to be inside the outer edge of an adherend.

  The sheet sticking device of the present invention is a sheet sticking device for sticking a stretchable adhesive sheet on one surface of an adherend, and has an inner surface having a support surface for supporting the adherend from the other surface side. A support means, an outer support means provided around the inner support means and having a surface to which the adhesive sheet is attached; one surface of an adherend supported by the support surface; and the outer support means. A supply means for supplying the adhesive sheet so as to oppose the adherend surface; a pressing means for pressing and adhering the adhesive sheet to one face of the adherend and the adherend surface of the outer support means; A biasing means for biasing a non-sticking area between one surface of the adherend and a sticking surface of the outer support means in the adhesive sheet stuck by the pressing means in an out-of-plane direction of the non-sticking area. And an extended contact energized by the energizing means. Characterized in that it comprises a cutting means for cutting along the sheet edge of the adherend.

It is preferable that the sheet sticking device of the present invention includes a contracting unit that contracts the adhesive sheet cut by the cutting unit.
In the sheet sticking device of the present invention, it is preferable that the urging means includes suction means for sucking a non-sticking area of the adhesive sheet in an out-of-plane direction of the non-sticking area.
Moreover, it is preferable that the sheet sticking apparatus of the present invention includes a holding unit that holds a non-sticking region of the adhesive sheet in a state where the adhesive sheet is biased by the biasing unit.

  On the other hand, the sheet affixing method of the present invention is a sheet affixing method for affixing an adhesive sheet having elasticity to one surface of an adherend, and one surface of the adherend supported from the other surface side The adhesive sheet is supplied so as to oppose the application surface of the outer support means surrounding the adherend, and the adhesive sheet is pressed against one surface of the adherend and the application surface of the outer support means. The non-sticking area between one surface of the adherend and the sticking surface of the outer support means in the stuck adhesive sheet is urged in the out-of-plane direction of the non-sticking area. The adhesive sheet extended by the force is cut along the outer edge of the adherend.

  According to the present invention as described above, since the adhesive sheet is cut along the outer edge of the adherend in a state where the non-sticking region of the adhesive sheet is stretched, the adhesive sheet after cutting is cut by its elastic restoring action. Shrink. Therefore, the adhesive sheet can be cut and pasted so as to fit inside the outer edge of the adherend.

In the present invention, if the contraction means is provided, the contraction of the adhesive sheet can be promoted, so that the adhesive sheet can be reliably stored inside the outer edge of the adherend.
Further, if suction means is provided, impurities such as dust can be sucked while urging the adhesive sheet by suction. For this reason, the risk that impurities are mixed between the adherend and the adhesive sheet can be reduced as much as possible.
Furthermore, if the holding means is provided, the non-sticking area of the adhesive sheet can be held in a state where the adhesive sheet is urged, so that the state where the adhesive sheet is stretched by the urging can be reliably maintained. .

The partial cross section side view of the sheet sticking apparatus which concerns on one Embodiment of this invention. (A)-(C) are operation | movement explanatory drawings of a sheet sticking apparatus. (A) And (B) is explanatory drawing of a prior art example.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In the present embodiment, without giving a reference figure, for example, when showing directions such as up, down, left, right, near side, and back, all of FIG. 1 is viewed from a normal direction. , And the top, bottom, left, and right directions are directions parallel to the paper surface, and the front and back directions are directions orthogonal to the paper surface.

  In FIG. 1, a sheet sticking device 1 is a device for sticking an adhesive sheet AS having elasticity to a surface WA which is one surface of a wafer WF. Here, the adhesive sheet AS is configured by laminating an adhesive layer AD on one surface of the base sheet BS.

  The sheet sticking apparatus 1 is provided so as to surround the inner support means 2 having a support surface 21 that supports the wafer WF from the back surface WB side, which is the other face of the wafer WF, and the adhesive sheet AS is attached. An outer support means 3 having an adherend surface 34, a supply means 4 for supplying the adhesive sheet AS so as to face the surface WA of the wafer WF supported on the support surface 21 and the adherend surface 34 of the outer support means 3, The pressing means 5 that presses and adheres the adhesive sheet AS to the surface WA of the wafer WF and the adherend surface 34 of the outer support means 3, and the surface WA and outer support means of the wafer WF in the adhesive sheet AS attached by the pressing means 5 The non-sticking area AS1 between the three sticking surfaces 34 and the non-sticking area AS1 in an out-of-plane direction; And a cutting means 7 for cutting along the outer edge of the wafer WF. Here, the out-of-plane direction is a direction excluding the direction above the surface WA of the wafer WF and toward the center axis CO of the wafer WF in the out-of-plane direction of the non-stick area AS1.

  The inner support means 2 includes a table 22 having a support surface 21 and a linear motion motor 24 as a drive device that supports the table 22 with an output shaft 23.

  The outer support means 3 includes a bottom surface portion 31, a side wall portion 32 that rises from the outer edge of the bottom surface portion 31, and a concave portion 33 that opens upward. The linear motion motor 24 is supported on the bottom surface of the concave portion 33, and the side wall portion 32 The table 22 is arranged with a predetermined gap. The upper surface of the side wall 32 is a surface to be bonded 34 parallel to the support surface 21 of the table 22. Further, the side wall portion 32 is provided with an inclined surface 35 that is inclined from the adherend surface 34 toward the bottom surface of the recess 33. The adherend surface 34 and the inclined surface 35 are subjected to non-adhesion treatment such as fluororesin coating and rough surface treatment so that the adhesive sheet AS can be peeled off.

  The supply means 4 is driven and bonded by a support roller 41 that winds and supports the adhesive sheet AS, a guide roller 42 that guides the adhesive sheet AS drawn from the support roller 41, and a rotation motor 43A as a drive device. A drive roller 43 that feeds out the sheet AS, a pinch roller 44 that sandwiches the adhesive sheet AS between the drive rollers 43, two guide rollers 45 that guide an unnecessary sheet US generated by cutting the adhesive sheet AS, and a drive device A pinch that sandwiches the adhesive sheet AS between the drive roller 47 and the collection roller 46 that is driven by the rotation motor 46A and collects the unnecessary sheet US, the drive roller 47 that is driven by the rotation motor 47A as a drive device, and the drive roller 47. And a roller 48. The rollers 41 to 44 are supported by a supply side frame 4 </ b> A provided on the left side with respect to the outer support means 3, and the rollers 45 and 46 are supported by a collection side frame 4 </ b> B provided on the right side with respect to the outer support means 3. Has been. On the other hand, the rollers 47 and 48 are supported by a slider 49A of a linear motor 49 as a driving device so as to be movable in the left-right direction.

  The pressing unit 5 is a linear motion motor 53 as a driving device supported by the slider 49B of the linear motor 49, a frame 51 supported by the output shaft 53A of the linear motion motor 53, and a frame 51 that is rotatably supported. And a pressing roller 52. The pressing roller 52 is formed of an elastic member such as rubber or resin, or an inelastic member such as metal.

  The biasing means 6 includes a suction portion 66 such as a porous body provided in an annular shape along the inclined surface 35, a suction hole 65 provided in the side wall portion 32, and communicating with the space SP in the recess 33, and a pipe 62. A suction means 61 such as a decompression pump or a vacuum ejector connected to the suction hole 65 via a suction pipe, and a suction means 67 such as a decompression pump or a vacuum ejector connected to the suction portion 66 via a pipe 63 are provided. The suction means 67 and the suction part 66 constitute a holding means.

  The cutting means 7 includes an articulated robot 71 as a driving device provided behind the outer support means 3 and the linear motor 49, and a cutting blade 72 provided at the tip of the articulated robot 71. Yes. The articulated robot 71 is a so-called six-axis robot having joints that can rotate at six locations, and the cutting blade 72 can be displaced at any position and at any angle within the work range of the articulated robot 71. ing.

Hereinafter, operation | movement of the sheet sticking apparatus 1 is demonstrated.
First, the adhesive sheet AS is set as shown in FIG. Next, when the wafer WF is placed on the table 22 by a transfer means (not shown), the inner support means 2 drives the linear motion motor 24 so that the surface WA of the wafer WF and the adherend surface 34 of the outer support means 3 are the same plane. Adjust so that it is inside. Next, after the pressing means 5 drives the linear motor 53 and the linear motor 49 to lower the pressing roller 52, the adhesive sheet AS is moved from the position indicated by the solid line to the position indicated by the two-dot chain line in FIG. The adhesive sheet AS is sequentially pressed and pasted on the surface 34 to be pasted and the surface WA of the wafer WF by moving the upper side while rolling. The adhesive sheet AS is stuck so as to completely close the recess 33.

  After pasting the adhesive sheet AS, the biasing means 6 drives the suction means 61, and the space SP in the recess 33 is decompressed as shown in FIG. The non-sticking area AS1 is expanded by energizing the area AS1 in the out-of-plane direction. Further, the urging means 6 drives the suction means 67 to attract and hold the non-sticking area AS1 on the inclined surface 35, so that the non-sticking area AS1 is maintained in an expanded state.

  In this state, the cutting means 7 drives the articulated robot 71, and as shown in FIG. 2B, the cutting blade 72 is pierced into the non-stick area AS1 of the adhesive sheet AS, and the adhesive sheet is aligned along the outer edge of the wafer WF. Cut AS. At this time, as shown in FIG. 2B, the adhesive sheet AS may be cut at a position outside the outer edge of the wafer WF, or may be cut by bringing the cutting blade 72 into contact with the outer edge of the wafer WF. Good. By cutting the adhesive sheet AS so that the cutting blade 72 does not contact the wafer WF, the cutting blade 72 can be prevented from coming into contact with the adherend, and the wafer WF can be prevented from being damaged. Can do.

  The cut adhesive sheet AS contracts as shown in FIG. 2C due to its own elastic restoring force. Then, the biasing means 6 stops the suction means 61 and 67, and stops the decompression in the space SP and the suction holding of the non-sticking area AS1. Then, the wafer WF with the adhesive sheet AS attached is carried out by a transfer device (not shown) and sent to a subsequent process such as back grinding.

  Next, after the pressing unit 5 drives the linear motor 53 and raises the pressing roller 52, the supply unit 4 drives the rotation motor 47A and the linear motor 49, and the slider 49A is moved to the left while rotating the driving roller 47. Move in the direction. Thereby, the unnecessary sheet US cut along the outer edge of the wafer WF and pasted on the adherend surface 34 is peeled off from the adherend surface 34 by the drive roller 47.

  Then, the supply means 4 drives the linear motor 49 and the rotation motor 46A, moves the slider 49A to the right while stopping the rotation of the drive roller 47, winds up the unnecessary sheet US by the collection roller 46, and presses it. The means 5 drives the linear motor 49 and moves the pressing roller 52 in the right direction. In synchronism with this movement, the supply means 4 drives the rotation motor 43A and feeds the unused portion of the adhesive sheet AS from the support roller 41, whereby the adhesive layer AD of the adhesive sheet AS is disposed above the support surface 21. Supply with the sides facing each other. Thereafter, the next wafer WF is supported by the inner support means 2. Thereafter, the same operation as described above is repeated.

According to the present embodiment as described above, the following effects are obtained.
That is, since the adhesive sheet AS is cut along the outer edge of the wafer WF in a state where the non-stick area AS1 of the adhesive sheet AS is extended, the cut adhesive sheet AS is contracted by its elastic restoring action. Therefore, the adhesive sheet AS can be cut and pasted so as to fit inside the outer edge of the wafer WF.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such restrictions is included in this invention.

For example, when a heat-shrinkable one is employed as the adhesive sheet AS, a shrinking means 8 for further shrinking the adhesive sheet AS may be provided as shown by a two-dot chain line in FIG. The contraction means 8 includes a hot air supply means 81 having heating means such as a heater, a discharge heater, an infrared heater, a switching valve 82 provided in the middle of the pipe 63, a hot air supply means 81, and a switching valve 82. The hot air supply means 81 is configured to be able to spray hot air onto the adhesive sheet AS via the pipe 83, the switching valve 82, the pipe 63, and the suction portion 66. In this case, after the cutting means 7 cuts the adhesive sheet AS, the urging means 6 stops the suction means 61 and 67, and the contraction means 8 switches the switching valve so that the hot air supply means 81 and the pipe 63 communicate with each other. While switching 82, the warm air supply means 81 is driven to blow warm air on the adhesive sheet AS. Thereby, the part which protruded from the surface WA of the wafer WF in the adhesive sheet AS can be contracted, and the adhesive sheet AS can be reliably stored inside the outer edge of the wafer WF. In the case where the adhesive sheet AS can be shrunk by cooling, the shrinking means 8 may be constituted by a cold air supply means instead of the hot air supply means 81, and cold air may be blown to the adhesive sheet AS. Examples of the cool air supply means include a Peltier element and a cooling fan.
Further, when an adhesive sheet AS that can be shrunk by energy rays such as ultraviolet rays and microwaves is adopted, instead of the hot air supply means 81, an energy ray irradiating means capable of irradiating energy rays such as ultraviolet rays and microwaves is used. The contraction means 8 may be configured.

  Further, as the urging means 6, a pressing member that presses the non-stick area AS1 downward may be provided above the adhesive sheet AS, and the non-stick area AS1 may be urged in the out-of-plane direction by the pressing member. . Furthermore, the non-sticking area AS1 of the adhesive sheet AS is pressed downward by the pressing member, and the linear motor 24 is driven to raise the table 22 so as to urge the non-sticking area AS1 in the out-of-plane direction. It may be. Further, the urging means 6 is not limited to urging the non-bonding area AS1 of the adhesive sheet AS downward or in the direction of the inclined surface 35, but in a direction away from the central axis CO of the wafer WF. It may be energized, it may be energized in a direction away from the central axis CO of the wafer WF in parallel with the surface WA of the wafer WF, or it may be energized downward and in a direction toward the central axis CO of the wafer WF. Also good.

  The pressing means 5 can employ a pressing member made of a blade material, rubber, resin, sponge, or the like, instead of the pressing roller 52, and can also be configured to be pressed by air spraying.

  Further, the adherend may be a glass plate, a steel plate, a resin plate, or the like other than the wafer WF. The wafer WF can be exemplified by a silicon semiconductor wafer, a compound semiconductor wafer, and the like. The adhesive sheet AS to be attached to such a semiconductor wafer is a protective sheet, a mounting sheet, a dicing tape, a die attach film, or any other sheet. , Films, tapes, etc., can be used for any purpose and shape.

Further, the type and material of the adhesive sheet AS are not particularly limited. For example, the adhesive sheet AS has three or more layers such as an intermediate layer provided between the base sheet BS and the adhesive layer AD, or other layers. The adhesive layer AD which does not have the base material sheet BS may be used.
Further, the adherend may be a substrate of an optical disk, and the adhesive sheet AS may have a resin layer constituting a recording layer. As described above, as an adherend, any form of member or article can be targeted.

  The drive device in the embodiment employs an electric device such as a rotation motor, a linear motion motor, a linear motor, a single-axis robot, and an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition, it is possible to adopt a combination of them directly or indirectly (some of them overlap with those exemplified in the embodiment).

  Furthermore, the adsorbing portion 66 constituting the holding means is not limited to a porous body, and can be constituted by other materials as long as the adhesive sheet AS can be adsorbed and held. For example, a suction hole is formed in the inclined surface 35. The suction holes may be formed in an annular shape or concentric shape along the inclined surface 35.

DESCRIPTION OF SYMBOLS 1 Sheet sticking apparatus 2 Inner support means 3 Outer support means 4 Supply means 5 Press means 6 Energizing means 7 Cutting means 8 Shrinking means 21 Support surface 34 Sticking surface 61 Suction means (holding means)
66 Adsorption part (holding means)
AS adhesive sheet AS1 non-sticking area WA surface (one side)
WB back side (the other side)
WF Wafer (Substrate)

Claims (5)

A sheet sticking device for sticking a stretchable adhesive sheet on one surface of an adherend,
Inner support means having a support surface for supporting the adherend from the other surface side;
An outer support means provided around the inner support means and having a surface to which the adhesive sheet is attached;
Supply means for supplying the adhesive sheet so as to oppose one surface of the adherend supported by the support surface and the adherend surface of the outer support means;
A pressing unit that presses and adheres the adhesive sheet to one surface of the adherend and a bonding surface of the outer support unit;
A biasing means for biasing a non-sticking area between one surface of the adherend and a sticking surface of the outer support means in the adhesive sheet stuck by the pressing means in an out-of-plane direction of the non-sticking area. When,
A sheet sticking apparatus, comprising: a cutting unit that cuts the adhesive sheet that is urged and extended by the urging unit along an outer edge of the adherend.   The sheet sticking apparatus according to claim 1, further comprising a contracting unit configured to contract the adhesive sheet cut by the cutting unit.   The sheet applying apparatus according to claim 1, wherein the urging unit includes a suction unit that sucks a non-adhesion region of the adhesive sheet in an out-of-plane direction of the non-adhesion region.   The sheet according to any one of claims 1 to 3, further comprising holding means for holding a non-sticking area of the adhesive sheet in a state where the adhesive sheet is biased by the biasing means. Pasting device. A sheet attaching method for attaching an adhesive sheet having elasticity to one surface of an adherend,
Supplying the adhesive sheet so as to oppose one surface of the adherend supported from the other surface side and the adherend surface of the outer support means surrounding the adherend;
Pressing and pasting the adhesive sheet to one surface of the adherend and the surface to be adhered of the outer support means,
Urging the non-sticking area between one surface of the adherend and the sticking surface of the outer support means in the sticking adhesive sheet in an out-of-plane direction of the non-sticking area;
A method for sticking a sheet, characterized in that an adhesive sheet that is biased and stretched is cut along an outer edge of the adherend.

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