JP3213154U - Sheet peeling device - Google Patents

Abstract

There is provided a sheet peeling apparatus capable of preventing a peeling ability per unit time from being significantly reduced. A support means 20 for supporting a semiconductor wafer WF having an adhesive sheet AS attached thereto, a peeling means 30 for peeling the adhesive sheet AS from a semiconductor wafer WF supported by the support means 20, and a support means 20 are cleaned. The cleaning unit 40 includes a moving unit 50 that moves the support unit 20 between the peeling unit 30 and the cleaning unit 40. The support unit 20 includes a plurality of units. [Selection] Figure 1

Description

  The present invention relates to a sheet peeling apparatus.

  2. Description of the Related Art Conventionally, a sheet peeling apparatus that peels an adhesive sheet affixed to a semiconductor wafer (hereinafter also simply referred to as “wafer”) is known (see, for example, Patent Document 1).

JP 2012-64850 A

  However, in the conventional sheet peeling apparatus as described in Patent Document 1, when the cleaning means for cleaning the support surface of the support means 11 (support means) is provided, the next cleaning is completed until the cleaning by the cleaning means is completed. Since the wafer W (wafer) cannot be set on the support surface, there arises a disadvantage that the peeling ability for peeling the adhesive sheet S (adhesive sheet) from the wafer per unit time is greatly reduced.

  The objective of this invention is providing the sheet peeling apparatus which can prevent that the peeling capability per unit time falls significantly.

  The present invention employs the structure described in the claims.

  According to the present invention, since the support means is composed of a plurality, the operation of cleaning the other support means by the cleaning means is performed during the operation of peeling the adhesive sheet from the wafer supported by the one support means by the peeling means. Therefore, it is possible to prevent the peeling ability per unit time from greatly decreasing.

The side view of the sheet peeling apparatus which concerns on one Embodiment of this invention. (A), (B) is operation | movement explanatory drawing of a sheet peeling apparatus.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In this embodiment, the X axis, the Y axis, and the Z axis are orthogonal to each other, the X axis and the Y axis are axes in a predetermined plane, and the Z axis is an axis that is orthogonal to the predetermined plane. To do. Further, in the present embodiment, when viewed from the front side of FIG. 1 parallel to the Y axis, and when the direction is indicated without designating the figure, “up” is the arrow direction of the Z axis and “down” Is the opposite direction, “left” is the arrow direction of the X axis, “right” is the opposite direction, “front” is the front direction in FIG. 1 parallel to the Y axis, and “rear” is the opposite direction.

  The sheet peeling apparatus 10 cleans the support means 20 that supports the wafer WF to which the adhesive sheet AS is attached, the peeling means 30 that peels the adhesive sheet AS from the wafer WF supported by the support means 20, and the support means 20. A cleaning unit 40 and a moving unit 50 that moves the support unit 20 between the peeling unit 30 and the cleaning unit 40 are provided.

The support means 20 includes a plurality of first support means 21 and second support means 22.
The first support means 21 includes a first support table 21A whose upper surface is a support surface 21B, and decompression means (not shown) such as a decompression pump and a vacuum ejector that apply an adsorption force to the support surface 21B.
The second support means 22 includes a second support table 22A whose upper surface is a support surface 22B, and decompression means (not shown) such as a decompression pump and a vacuum ejector for applying an adsorption force to the support surface 22B.

  The peeling means 30 is rotatably supported by a support roller 31 that supports the strip-like peeling adhesive sheet ASR, a guide roller 32 that guides the peeling adhesive sheet ASR, and an output shaft 33A of a linear motion motor 33 as a drive device. The peeling roller 34 and a driving roller 35 driven by a rotating motor 35A as a driving device are sandwiched between a pinch roller 36 that sandwiches a peeling adhesive sheet ASR and a rotating motor 37A as a driving device, and the peeling roller 34 is driven. And a collecting roller 37 for collecting the adhesive sheet ASR for use.

  The cleaning means 40 includes a suction case 41 having a suction port 41A formed on the lower surface, and decompression means (not shown) such as a decompression pump and a vacuum ejector that apply suction force to the suction port 41A, and includes first and second support means. The support surfaces 21B and 22B of 21 and 22 are cleaned.

The moving unit 50 includes a first moving unit 51 that moves the first supporting unit 21 and a second moving unit 52 that moves the second supporting unit 22.
The first moving means 51 is supported by the first X-axis linear motor 51A as a driving device, the first Z-axis linear motor 51C as a driving device supported by the slider 51B, and the slider 51D, and is supported by the first supporting means 21. The second moving means 52 that supports the first support means 21 from the front side of the first support means 21 includes a second X-axis linear motor 52A as a drive device. The second support means 22 includes a second Z-axis linear motor 52C as a driving device supported by the slider 52B, and a second support arm 52E supported by the slider 52D and supporting the second support means 22. The second support means 22 is supported from the rear side.

The operation of the above sheet peeling apparatus 10 will be described.
First, with respect to the sheet peeling apparatus 10 in which each member is waiting at the initial position indicated by a solid line in FIG. 1, a user of the sheet peeling apparatus 10 (hereinafter simply referred to as “user”) holds the peeling adhesive sheet ASR. After setting as shown in the figure, an automatic operation start signal is input via an operation means (not shown) such as an operation panel or a personal computer. Next, as shown in FIG. 1, when a user or a transport unit (not shown) such as a driving device or a conveyor places the wafer WF with the adhesive sheet AS on the first support table 21 </ b> A, the support unit 20 is not shown. The decompression unit is driven to start holding the wafer WF by suction on the support surface 21B. Thereafter, the sheet peeling apparatus 10 of the present embodiment performs a “peeling operation” for peeling the adhesive sheet AS from the wafer WF supported by the first support table 21A, and a “cleaning operation for cleaning the support surface 22B of the second support table 22A. ”At the same time. That is, when the suction and holding of the wafer WF on the first support table 21A is started, the moving unit 50 drives the first X-axis linear motor 51A and the second Z-axis linear motor 52C and moves the first support table 21A to the left. While moving, the second support table 22A is lowered.

  Next, the first support table 21A moves to the left, and the left end portion of the adhesive sheet AS attached to the wafer WF reaches just below the lowermost end portion of the peeling roller 34, as indicated by the solid line in FIG. Then, the moving unit 50 stops driving the first X-axis linear motor 51A. Then, after the peeling means 30 drives the linear motor 33 and lowers the peeling roller 34 to attach the peeling adhesive sheet ASR to the left end portion of the adhesive sheet AS, the moving means 50 and the peeling means 30 are moved to the first X-axis linear. The motor 51A and the rotation motors 35A and 37A are driven, and the peeling adhesive sheet ASR is recovered in accordance with the moving speed of moving the first support table 21A to the left as shown by a two-dot chain line in FIG. The roller 37 is wound up, and the adhesive sheet AS is peeled off from the wafer WF. Next, when the entire adhesive sheet AS is peeled from the wafer WF, the peeling means 30 drives the linear motor 33 to return the peeling roller 34 to the initial position, and then stops driving the rotation motors 35A and 37A. . Thereafter, when the first support table 21A reaches the initial position of the second support table 22A, the moving means 50 stops driving the first X-axis linear motor 51A and the decompression means (not shown), and then the user or the transport (not shown) The means holds the wafer WF and transports the wafer WF to the next process.

  On the other hand, when the second support table 22A is lowered and the support surface 22B reaches a predetermined distance below the lower surface of the suction case 41, the moving means 50 stops driving the second Z-axis linear motor 52C, and then the second X-axis. The linear motor 52A is driven to move the second support table 22A to the right. Next, when the second support table 22A reaches a predetermined position in the lower left of the suction case 41, the cleaning unit 40 drives a decompression unit (not shown) and starts suction at the suction port 41A. After that, when the second support table 22A continues to move to the right, dust such as dust and dust existing on the support surface 22B is removed by the cleaning means 40 as shown in FIG. The support surface 22B is cleaned. When the cleaning of the entire support surface 22B is completed, the cleaning unit 40 stops driving the decompression unit (not shown), and when the second support table 22A reaches a predetermined position below the initial position of the first support table 21A, the moving unit 50 stops the driving of the second X-axis linear motor 52A. Next, the moving means 50 drives the second Z-axis linear motor 52C to place the second support table 22A at the initial position of the first support table 21A.

  After the peeling operation and the cleaning operation are performed at the same time as described above, the user or a conveying means (not shown) places the wafer WF with the adhesive sheet AS on the second support table 22A. As shown in FIG. 2 (B), the second support table 22A returns to the initial position by the same peeling operation as described above, and the first support table 21A returns to the initial position by the same cleaning operation as described above. Thereafter, the same operation as described above is repeated.

  According to the sheet peeling apparatus 10 as described above, since the support means 20 is configured in plural, the second support is performed during the operation of peeling the adhesive sheet AS from the wafer WF supported by the first support means 21 by the peeling means 30. Since the operation of cleaning the support surface 22B of the means 22 by the cleaning means 40 can be performed, it is possible to prevent the peeling ability per unit time from being significantly lowered.

  The means and steps in the present invention are not limited in any way as long as the operations, functions, or steps described for the means and steps can be performed. The process is not limited at all. For example, as long as the peeling means can peel the adhesive sheet from the semiconductor wafer supported by the supporting means, it is not limited in any way as long as it is within the technical scope in light of the technical common sense at the beginning of the application. No (other means and processes are the same).

  The support means 20 may be configured to support the wafer WF to which the adhesive sheet AS is attached by a gripping means such as a mechanical chuck or a chuck cylinder, a Coulomb force, an adhesive, an adhesive, a magnetic force, Bernoulli adsorption, a driving device, etc. It may be composed of a plurality of three or more bodies such as a third support means and a fourth support means. In this case, three or more support means 20 can be moved between the peeling means 30 and the cleaning means 40. A moving means may be employed.

  The peeling means 30 may be configured such that the peeling roller 34 does not move up and down, or holds the adhesive sheet AS with a gripping means such as a mechanical chuck or a chuck cylinder, coulomb force, magnetic force, suction suction, Bernoulli suction, driving equipment, etc. Alternatively, the sheet peeling adhesive sheet ASR may be attached to the adhesive sheet AS, and tension may be applied to the sheet peeling adhesive sheet ASR to peel the adhesive sheet AS from the wafer WF. Alternatively, the adhesive sheet AS may be peeled off from the wafer WF by moving itself (peeling means 30) without moving or moving the support means 20.

  The cleaning means 40 may be configured to clean parts other than the support surfaces 21B and 22B of the first and second support means 21 and 22 such as the side surfaces and the lower surface of the first and second support tables 21A and 22A, The dust on the support surfaces 21B and 22B is blown off by a pressurizing means such as a pressure pump and a turbine, or an adhesive member such as an adhesive sheet or an adhesive sheet is adhered on the support surfaces 21B and 22B. Dust is transferred to the adhering member, the dust on the support surfaces 21B and 22B is swept away with a sweeping member such as a brush member or a brush-like member, the support surfaces 21B and 22B are washed with water or detergent, The support surfaces 21B and 22B may be cleaned by appropriately combining them.

  The moving means 50 raises the first support table 21 </ b> A (second support table 22 </ b> A) while lowering or lowering the peeling roller 34 when the peeling adhesive sheet ASR is stuck to the left end portion of the adhesive sheet AS. Alternatively, both the peeling roller 34 and the first support table 21A (second support table 22A) may not be raised and lowered.

  When the peeling operation and the cleaning operation are simultaneously performed, the sheet peeling apparatus 10 starts the movement of the second support table 22A in accordance with the timing at which the holding and holding of the wafer WF is started on the support surface 21B, or the wafer WF. The movement of the second support table 22A is started in accordance with the timing when the left end portion of the adhesive sheet AS affixed to the bottom reaches the bottom end of the peeling roller 34 and the driving of the first X-axis linear motor 51A is stopped. If the cleaning operation of the supporting surface of the other supporting means can be performed during the peeling operation for peeling the adhesive sheet AS from the wafer WF supported by one supporting means, the peeling operation may be performed at any timing. The completion of the cleaning operation and the completion of the cleaning operation may be the same timing, the cleaning operation may be completed before the peeling operation is completed, or after the peeling operation is completed The cleaning operation may be completed, and the initial positions of the first and second support tables 21A and 22A may not be the positions shown in the above embodiment, or may be arranged upside down or arranged horizontally. Alternatively, the adhesive sheet AS attached to the lower surface or side surface of the wafer WF may be peeled off.

  The material, type, shape, and the like of the adhesive sheet AS, the peeling adhesive sheet ASR, and the wafer WF in the present invention are not particularly limited. For example, the adhesive sheet AS, the peeling adhesive sheet ASR, and the wafer WF may have, for example, a circular shape, an elliptical shape, a polygonal shape such as a triangular shape or a quadrangular shape, or other shapes. The adhesive sheet ASR may be in the form of adhesive such as pressure-sensitive adhesiveness, heat-sensitive adhesiveness, etc., and when heat-sensitive adhesiveness is adopted, it can be heated by a heating means such as a coil heater or the heating side of a heat pipe. What is necessary is just to heat and adhere | attach. Further, the adhesive sheet AS and the peeling adhesive sheet ASR are, for example, a single layer having only an adhesive layer, an adhesive layer having an intermediate layer between the base material and the adhesive layer, and a cover layer on the upper surface of the base material. 3 or more layers, or a so-called double-sided adhesive sheet that can peel the substrate from the adhesive layer. It may have an intermediate layer, or may have a single layer or multiple layers without an intermediate layer. The wafer WF may be, for example, a semiconductor wafer such as a silicon semiconductor wafer or a compound semiconductor wafer, or a semiconductor chip. Note that the adhesive sheet AS may be replaced with a functional or application reading, for example, any sheet such as a protective sheet, a dicing tape, a die attach film, a die bonding tape, a recording layer forming resin sheet, a film, a tape, or the like. .

The drive device in the embodiment employs an electric device such as a rotation motor, a linear motion motor, a linear motor, a single-axis robot, and an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition, a combination of them directly or indirectly can be adopted.
In the above-described embodiment, when a rotating member such as a roller is employed, a driving device that rotationally drives the rotating member may be provided, or the surface of the rotating member or the rotating member itself can be deformed with rubber, resin, or the like. It may be constituted by a member, or may be constituted by a member that does not deform the surface of the rotating member or the rotating member itself, or a member that presses a pressed object such as a pressing means such as a peeling roller or a pressing head or a pressing member. When employed, instead of or in combination with those exemplified above, a member such as a roller, round bar, blade material, rubber, resin, sponge, etc. is employed, or pressure is applied by blowing a gas such as air or gas. You may employ | adopt the structure to perform, and what to press may be comprised with a deformable member, such as rubber | gum and resin, and may be comprised with the member which does not deform | transform.

DESCRIPTION OF SYMBOLS 10 ... Sheet peeling apparatus 20 ... Support means 21B, 22B ... Support surface 30 ... Peeling means 40 ... Cleaning means 50 ... Moving means AS ... Adhesive sheet WF ... Semiconductor wafer

Claims (1)

A support means for supporting the semiconductor wafer to which the adhesive sheet is affixed;
Peeling means for peeling the adhesive sheet from the semiconductor wafer supported by the supporting means;
Cleaning means for cleaning the support means;
Moving means for moving the support means between the peeling means and the cleaning means,
The sheet peeling apparatus according to claim 1, wherein the support means includes a plurality of support means.