JP2021141096A - Sheet peeling method and sheet peeling device - Google Patents

Sheet peeling method and sheet peeling device Download PDF

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JP2021141096A
JP2021141096A JP2020034740A JP2020034740A JP2021141096A JP 2021141096 A JP2021141096 A JP 2021141096A JP 2020034740 A JP2020034740 A JP 2020034740A JP 2020034740 A JP2020034740 A JP 2020034740A JP 2021141096 A JP2021141096 A JP 2021141096A
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peeling
adhesive sheet
adherend
sheet
restoring force
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JP7463131B2 (en
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拓 根本
Taku Nemoto
拓 根本
桜子 田村
Sakurako Tamura
桜子 田村
康介 福嶋
Kosuke Fukushima
康介 福嶋
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Lintec Corp
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Lintec Corp
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Priority to TW110106023A priority patent/TW202139278A/en
Priority to KR1020210024180A priority patent/KR20210111166A/en
Publication of JP2021141096A publication Critical patent/JP2021141096A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H29/00—Delivering or advancing articles from machines; Advancing articles to or into piles
    • B65H29/54—Article strippers, e.g. for stripping from advancing elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H41/00—Machines for separating superposed webs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/50—Auxiliary process performed during handling process
    • B65H2301/51—Modifying a characteristic of handled material
    • B65H2301/511—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning
    • B65H2301/5112—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning removing material from outer surface
    • B65H2301/51122—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning removing material from outer surface peeling layer of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/10—Handled articles or webs
    • B65H2701/17—Nature of material
    • B65H2701/172—Composite material
    • B65H2701/1726—Composite material including detachable components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

To provide a sheet peeling method and sheet peeling device, capable of minimizing the possibility of an adherend coming off from support means and thus breakage occurring.SOLUTION: A sheet peeling method, which is a method for peeling an adhesive sheet AS bonded to an adherend WK from the adherend WK, executes the following two steps: an elastic restoration force reduction of reducing elastic restoration force of a peeling start part AS1 of the adhesive sheet AS and a peeling step of relatively moving the peeling start part AS1 with the elastic restoration force reduced and the adherend WK, thereby peeling the adhesive sheet from the adherend WK.SELECTED DRAWING: Figure 1

Description

本発明は、シート剥離方法およびシート剥離装置に関する。 The present invention relates to a sheet peeling method and a sheet peeling device.

被着体に貼付された接着シートの剥離開始部を保持し、当該剥離開始部と被着体とを相対移動させて当該被着体から接着シートを剥離するシート剥離方法が知られている（例えば、特許文献１参照）。 A sheet peeling method is known in which a peeling start portion of an adhesive sheet attached to an adherend is held, and the peeling start portion and the adherend are relatively moved to peel the adhesive sheet from the adherend (a sheet peeling method). For example, see Patent Document 1).

特開平１１−１６８６２号公報Japanese Unexamined Patent Publication No. 11-16862

特許文献１に記載されたシート剥離方法では、保護シートＦ（接着シート）の弾性復元力が大きくなると、半導体ウエハＷ（被着体）から剥離した直後の接着シートの折り曲げ部ＡＳＲ（本願の図１（Ｃ）参照）の円弧半径が大きくなる。すると、接着シートが被着体をテーブル２０３（支持手段）から持ち上げようとする力（支持手段における接着シートの支持面から離間する方向であって、当該支持面に直交する方向の力成分）が大きくなり、当該被着体が支持手段から外れて破損する可能性がある。 In the sheet peeling method described in Patent Document 1, when the elastic restoring force of the protective sheet F (adhesive sheet) becomes large, the bent portion ASR of the adhesive sheet immediately after peeling from the semiconductor wafer W (adhesive body) (the figure of the present application). 1 (Refer to C)) The arc radius becomes large. Then, the force that the adhesive sheet tries to lift the adherend from the table 203 (supporting means) (the force component in the direction away from the supporting surface of the adhesive sheet in the supporting means and in the direction orthogonal to the supporting surface) is applied. The adherend may become large and the adherend may come off the supporting means and be damaged.

本発明目的は、被着体が支持手段から外れて破損する可能性を極力低減することができるシート剥離方法およびシート剥離装置を提供することにある。 An object of the present invention is to provide a sheet peeling method and a sheet peeling device capable of reducing the possibility that the adherend is detached from the supporting means and damaged as much as possible.

本発明は、請求項に記載した構成を採用した。 The present invention has adopted the configuration described in the claims.

本発明によれば、接着シートの弾性復元力を低下させるので、接着シートの折り曲げ部の円弧半径が大きくなることが抑制され、当該接着シートが被着体を支持手段から持ち上げようとする力が大きくならなくなり、被着体が支持手段から外れて破損する可能性を極力低減することができる。 According to the present invention, since the elastic restoring force of the adhesive sheet is reduced, it is suppressed that the arc radius of the bent portion of the adhesive sheet becomes large, and the force of the adhesive sheet to lift the adherend from the supporting means is exerted. It does not become large, and the possibility that the adherend comes off from the supporting means and is damaged can be reduced as much as possible.

（Ａ）〜（Ｃ）は、本発明の一実施形態に係るシート剥離装置の説明図。（Ｄ）、（Ｅ）は、本発明の変形例の説明図。(A)-(C) are explanatory views of the sheet peeling apparatus which concerns on one Embodiment of this invention. (D) and (E) are explanatory views of a modification of the present invention.

以下、本発明の一実施形態を図１に基づいて説明する。
なお、本実施形態におけるＸ軸、Ｙ軸、Ｚ軸は、それぞれが直交する関係にあり、Ｘ軸およびＹ軸は、所定平面内の軸とし、Ｚ軸は、前記所定平面に直交する軸とする。さらに、本実施形態では、Ｙ軸と平行な図１（Ａ）の手前方向から観た場合を基準とし、方向を示した場合、「上」がＺ軸の矢印方向で「下」がその逆方向、「左」がＸ軸の矢印方向で「右」がその逆方向、「前」がＹ軸と平行な図１（Ａ）中手前方向で「後」がその逆方向とする。 Hereinafter, an embodiment of the present invention will be described with reference to FIG.
The X-axis, Y-axis, and Z-axis in the present embodiment are orthogonal to each other, the X-axis and the Y-axis are axes in a predetermined plane, and the Z-axis is an axis orthogonal to the predetermined plane. do. Further, in the present embodiment, when viewed from the front direction of FIG. 1 (A) parallel to the Y axis, when the direction is shown, "up" is the arrow direction of the Z axis and "down" is the opposite. The direction, "left" is the direction of the arrow on the X-axis, "right" is the opposite direction, "front" is the middle front direction parallel to the Y-axis, and "rear" is the opposite direction.

本発明のシート剥離装置ＥＡは、被着体ＷＫに貼付された接着シートＡＳを当該被着体ＷＫから剥離する装置であって、接着シートＡＳの剥離開始部ＡＳ１の弾性復元力を低下させる弾性復元力低下手段１０と、弾性復元力を低下させた剥離開始部ＡＳ１と被着体ＷＫとを相対移動させ、被着体ＷＫから接着シートＡＳを剥離する剥離手段２０とを備え、被着体ＷＫを支持する支持手段３０の近傍に配置されている。 The sheet peeling device EA of the present invention is a device that peels the adhesive sheet AS attached to the adherend WK from the adherend WK, and has elasticity that reduces the elastic restoring force of the peeling start portion AS1 of the adhesive sheet AS. An adherend is provided with a restoring force reducing means 10 and a peeling means 20 for peeling the adhesive sheet AS from the adherend WK by relatively moving the peeling start portion AS1 having reduced elastic restoring force and the adherend WK. It is arranged in the vicinity of the support means 30 that supports the WK.

弾性復元力低下手段１０は、接着シートＡＳの厚みを部分的に薄くすることで当該接着シートＡＳの弾性復元力を低下させる弾性復元力低下手段１０Ａが採用されている。このような弾性復元力低下手段１０Ａは、複数のアームによって構成され、その作業範囲内において、作業部である先端アーム１１Ａで支持したものを何れの位置、何れの角度にでも変位可能な駆動機器としての所謂多関節ロボット１１と、先端アーム１１Ａに支持された切断部材としての切断刃１２とを備えている。 As the elastic restoring force reducing means 10, the elastic restoring force reducing means 10A that reduces the elastic restoring force of the adhesive sheet AS by partially reducing the thickness of the adhesive sheet AS is adopted. Such an elastic restoring force reducing means 10A is a drive device that is composed of a plurality of arms and can displace what is supported by the tip arm 11A, which is a working portion, at any position and any angle within the working range. The so-called articulated robot 11 and the cutting blade 12 as a cutting member supported by the tip arm 11A are provided.

剥離手段２０は、感熱接着性の剥離用テープＰＴを繰り出す繰出手段２１と、接着シートＡＳに剥離用テープＰＴを押圧して貼付する押圧手段２２と、剥離用テープＰＴを所定長さに切断する切断手段２３と、駆動機器としてのリニアモータ２４とを備えている。
繰出手段２１は、剥離用テープＰＴを支持する支持ローラ２１Ａと、剥離用テープＰＴを案内するガイドローラ２１Ｂと、駆動機器としてのリニアモータ２１Ｃのスライダ２１Ｄに支持されたスライドプレート２１Ｅと、駆動機器としての直動モータ２１Ｆの出力軸２１Ｇに回転可能に支持された押圧部材としての押えローラ２１Ｈと、一対の把持爪２１Ｊを有する保持手段であって駆動機器としてのチャックシリンダ２１Ｋとを備えている。
押圧手段２２は、駆動機器としての直動モータ２２Ａと、直動モータ２２Ａの出力軸２２Ｂに支持されたコイルヒータやヒートパイプの加熱側等の加熱手段２２Ｃと、加熱手段２２Ｃに支持された押圧部材としての押圧ヘッド２２Ｄとを備えている。
切断手段２３は、駆動機器としての直動モータ２３Ａと、直動モータ２３Ａの出力軸２３Ｂに支持された切断部材としての切断刃２３Ｃとを備えている。 The peeling means 20 cuts the heat-sensitive adhesive peeling tape PT, the feeding means 21, the pressing means 22 for pressing and attaching the peeling tape PT to the adhesive sheet AS, and the peeling tape PT to a predetermined length. It includes a cutting means 23 and a linear motor 24 as a driving device.
The feeding means 21 includes a support roller 21A that supports the release tape PT, a guide roller 21B that guides the release tape PT, a slide plate 21E supported by a slider 21D of the linear motor 21C as a drive device, and a drive device. The presser roller 21H as a pressing member rotatably supported by the output shaft 21G of the linear motor 21F, and the chuck cylinder 21K which is a holding means having a pair of gripping claws 21J and as a driving device. ..
The pressing means 22 includes a linear motor 22A as a drive device, a heating means 22C such as a coil heater supported by the output shaft 22B of the linear motor 22A and a heating side of a heat pipe, and a pressing means supported by the heating means 22C. It includes a pressing head 22D as a member.
The cutting means 23 includes a linear motion motor 23A as a drive device and a cutting blade 23C as a cutting member supported by the output shaft 23B of the linear motion motor 23A.

支持手段３０は、リニアモータ２４のスライダ２４Ａに支持され、減圧ポンプや真空エジェクタ等の図示しない減圧手段（保持手段）によって吸着保持が可能な支持面３１Ａを有するテーブル３１とを備えている。 The support means 30 includes a table 31 that is supported by the slider 24A of the linear motor 24 and has a support surface 31A that can be sucked and held by a decompression means (holding means) (not shown) such as a decompression pump or a vacuum ejector.

以上のシート剥離装置ＥＡの動作を説明する。
先ず、図１（Ａ）中実線で示す初期位置に各部材が配置されたシート剥離装置ＥＡに対し、当該シート剥離装置ＥＡの使用者（以下、単に「使用者」という）が同図のように剥離用テープＰＴをセットした後、図示しない操作パネルやパーソナルコンピュータ等の操作手段を介して自動運転開始の信号を入力する。次いで、使用者または、多関節ロボットやベルトコンベア等の図示しない搬送手段が、図１中実線で示すように、接着シートＡＳが貼付された被着体ＷＫを支持面３１Ａ上に載置すると、支持手段３０が図示しない減圧手段を駆動し、支持面３１Ａでの被着体ＷＫの吸着保持を開始する。 The operation of the above sheet peeling device EA will be described.
First, with respect to the sheet peeling device EA in which each member is arranged at the initial position shown by the solid line in FIG. 1 (A), the user of the sheet peeling device EA (hereinafter, simply referred to as “user”) is as shown in the figure. After setting the peeling tape PT in, a signal for starting automatic operation is input via an operation means such as an operation panel or a personal computer (not shown). Next, when the user or a transport means (not shown) such as an articulated robot or a belt conveyor places the adherend WK to which the adhesive sheet AS is attached on the support surface 31A as shown by the solid line in FIG. The support means 30 drives a decompression means (not shown) to start adsorbing and holding the adherend WK on the support surface 31A.

その後、弾性復元力低下手段１０が多関節ロボット１１を駆動し、図１（Ａ）中二点鎖線で示すように、切断刃１２で被着体ＷＫに達することのない切込ＣＵ（図１（Ｂ）参照）を接着シートＡＳに形成することで、当該接着シートＡＳの厚みを部分的に薄くし、当該接着シートＡＳの弾性復元力を低下させる（弾性復元力低下工程）。本実施形態の場合、弾性復元力低下手段１０は、図１（Ｂ）に示すように、接着シートＡＳの剥離方向（以下、単に「剥離方向」ともいう）に直交する方向と平行な方向に延びる切込ＣＵを、接着シートＡＳの剥離方向に複数形成する。 After that, the elastic restoring force reducing means 10 drives the articulated robot 11, and as shown by the two-point chain line in FIG. 1A, the cutting blade 12 does not reach the adherend WK (FIG. 1). By forming (see (B)) on the adhesive sheet AS, the thickness of the adhesive sheet AS is partially reduced, and the elastic restoring force of the adhesive sheet AS is reduced (elastic restoring force lowering step). In the case of the present embodiment, as shown in FIG. 1 (B), the elastic restoring force reducing means 10 is in a direction parallel to the direction orthogonal to the peeling direction of the adhesive sheet AS (hereinafter, also simply referred to as “peeling direction”). A plurality of extending notch CUs are formed in the peeling direction of the adhesive sheet AS.

次に、剥離手段２０がリニアモータ２４を駆動し、テーブル３１を右方に移動させ、接着シートＡＳの右端部が押圧ヘッド２２Ｄの直下に位置すると、リニアモータ２４の駆動を停止する。そして、剥離手段２０がリニアモータ２１Ｃを駆動し、図１（Ａ）中二点鎖線で示すように、スライドプレート２１Ｅを右方に移動させ、一対の把持爪２１Ｊ間に剥離用テープＰＴを繰り出す。次いで、剥離手段２０が直動モータ２１Ｆおよびリニアモータ２１Ｃを駆動し、押えローラ２１Ｈを上方に退避させるとともに、スライドプレート２１Ｅを初期位置に復帰させた後、チャックシリンダ２１Ｋを駆動し、把持爪２１Ｊで剥離用テープＰＴを把持する。その後、剥離手段２０が直動モータ２２Ａおよび加熱手段２２Ｃを駆動し、加熱された押圧ヘッド２２Ｄを下降させ、図１（Ｃ）に示すように、当該押圧ヘッド２２Ｄで剥離用テープＰＴを接着シートＡＳの右端部に押圧して貼付することで、剥離開始部ＡＳ１を保持する。 Next, the peeling means 20 drives the linear motor 24 to move the table 31 to the right, and when the right end of the adhesive sheet AS is located directly below the pressing head 22D, the driving of the linear motor 24 is stopped. Then, the peeling means 20 drives the linear motor 21C, moves the slide plate 21E to the right as shown by the alternate long and short dash line in FIG. 1 (A), and feeds out the peeling tape PT between the pair of gripping claws 21J. .. Next, the peeling means 20 drives the linear motor 21F and the linear motor 21C to retract the pressing roller 21H upward, and after returning the slide plate 21E to the initial position, drives the chuck cylinder 21K to drive the gripping claw 21J. Hold the peeling tape PT with. After that, the peeling means 20 drives the linear motion motor 22A and the heating means 22C to lower the heated pressing head 22D, and as shown in FIG. 1C, the peeling tape PT is attached to the adhesive sheet by the pressing head 22D. By pressing and attaching to the right end portion of the AS, the peeling start portion AS1 is held.

次に、剥離手段２０が直動モータ２１Ｆを駆動し、押えローラ２１Ｈを初期位置に復帰させた後、直動モータ２３Ａを駆動し、図１（Ｃ）に示すように、切断刃２３Ｃを下降させて剥離用テープＰＴを切断する。そして、剥離手段２０が直動モータ２２Ａ、２３Ａを駆動し、押圧ヘッド２２Ｄおよび切断刃２３Ｃを初期位置に復帰させた後、リニアモータ２４を駆動し、図１（Ｃ）中二点鎖線に示すように、テーブル３１を右方に移動させ、被着体ＷＫから接着シートＡＳを剥離する（剥離工程）。この際、切込ＣＵが形成されていない接着シートＡＳの場合、図１（Ｃ）中二点鎖線で示すように、折り曲げ部ＡＳＲは、円弧半径の大きな折り曲げ部ＡＳＲ１となるが、切込ＣＵによって弾性復元力が低下した接着シートＡＳでは、折り曲げ部ＡＳＲ１に比べて円弧半径の小さな折り曲げ部ＡＳＲ２となる。 Next, the peeling means 20 drives the linear motion motor 21F to return the pressing roller 21H to the initial position, and then drives the linear motion motor 23A to lower the cutting blade 23C as shown in FIG. 1 (C). And cut the peeling tape PT. Then, the peeling means 20 drives the linear motors 22A and 23A to return the pressing head 22D and the cutting blade 23C to the initial positions, and then drives the linear motor 24, which is shown by the alternate long and short dash line in FIG. 1 (C). As described above, the table 31 is moved to the right to peel off the adhesive sheet AS from the adherend WK (peeling step). At this time, in the case of the adhesive sheet AS in which the notch CU is not formed, the bent portion ASR is the bent portion ASR1 having a large arc radius, as shown by the alternate long and short dash line in FIG. 1 (C). In the adhesive sheet AS whose elastic restoring force is reduced due to this, the bent portion ASR2 has a smaller arc radius than the bent portion ASR1.

被着体ＷＫから接着シートＡＳ全体が剥離されると、剥離手段２０がリニアモータ２４の駆動を停止した後、支持手段３０が図示しない減圧手段の駆動を停止し、支持面３１Ａでの被着体ＷＫの吸着保持を解除する。次いで、剥離手段２０がチャックシリンダ２１Ｋを駆動し、把持爪２１Ｊを初期位置に復帰させて剥離用テープＰＴの把持を解除し、剥離した接着シートＡＳを回収する箱や袋等の図示しない回収手段や使用者に接着シートＡＳを受け渡す。その後、使用者または図示しない搬送手段が被着体ＷＫを次工程に搬送した後、各手段がそれぞれの駆動機器を駆動し、それぞれの部材を初期位置に復帰させ、以降上記同様の動作が繰り返される。 When the entire adhesive sheet AS is peeled from the adherend WK, the peeling means 20 stops driving the linear motor 24, then the supporting means 30 stops driving the decompression means (not shown), and the adhesion is made on the support surface 31A. Release the adsorption retention of the body WK. Next, the peeling means 20 drives the chuck cylinder 21K to return the gripping claw 21J to the initial position to release the gripping of the peeling tape PT, and a collecting means (not shown) such as a box or a bag for collecting the peeled adhesive sheet AS. And hand over the adhesive sheet AS to the user. After that, after the user or the conveying means (not shown) conveys the adherend WK to the next step, each means drives each driving device, returns each member to the initial position, and thereafter the same operation is repeated. Is done.

以上のような実施形態によれば、接着シートＡＳの弾性復元力を低下させるので、接着シートＡＳの折り曲げ部ＡＳＲの円弧半径が大きくなることが抑制され、当該接着シートＡＳが被着体ＷＫを支持手段３０から持ち上げようとする力が大きくならなくなり、被着体ＷＫが支持手段３０から外れて破損する可能性を極力低減することができる。 According to the above embodiment, since the elastic restoring force of the adhesive sheet AS is reduced, it is suppressed that the arc radius of the bent portion ASR of the adhesive sheet AS becomes large, and the adhesive sheet AS makes the adherend WK. The force for lifting from the support means 30 does not increase, and the possibility that the adherend WK comes off from the support means 30 and is damaged can be reduced as much as possible.

以上のように、本発明を実施するための最良の構成、方法等は、前記記載で開示されているが、本発明は、これに限定されるものではない。すなわち、本発明は、主に特定の実施形態に関して特に図示され、かつ説明されているが、本発明の技術的思想および目的の範囲から逸脱することなく、以上述べた実施形態に対し、形状、材質、数量、その他の詳細な構成において、当業者が様々な変形を加えることができるものである。また、上記に開示した形状、材質などを限定した記載は、本発明の理解を容易にするために例示的に記載したものであり、本発明を限定するものではないから、それらの形状、材質などの限定の一部もしくは全部の限定を外した部材の名称での記載は、本発明に含まれる。 As described above, the best configuration, method, etc. for carrying out the present invention are disclosed in the above description, but the present invention is not limited thereto. That is, although the present invention is particularly illustrated and described primarily with respect to specific embodiments, the shape, with respect to the embodiments described above, without departing from the scope of the technical ideas and objectives of the present invention. Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. Further, the description limiting the shape, material, etc. disclosed above is merely an example for facilitating the understanding of the present invention, and does not limit the present invention. Therefore, those shapes, materials, etc. The description by the name of the member excluding some or all of the restrictions such as the above is included in the present invention.

例えば、弾性復元力低下手段１０は、図１（Ｄ）に示すように、切断刃２３Ｃで接着シートＡＳに溝ＤＣを形成する構成が採用されてもよく、このような溝ＤＣは、例えば、同図に示すような断面視Ｖ字形状でもよいし、その他Ｕ字形状、コ字形状等、どのような形状でもよいし、同図の二点鎖線で示すように、溝ＤＣの上部が連接していてもよい。
弾性復元力低下手段１０は、剥離方向に直交する方向と平行でない方向に延びる切込ＣＵや溝ＤＣを形成してもよいし、互いに平行な、または、互いに並行でない切込ＣＵや溝ＤＣを、接着シートＡＳの剥離方向に複数形成してもよいし、互いに交差するように複数の切込ＣＵや溝ＤＣを形成してもよいし、接着シートＡＳ全体に切込ＣＵや溝ＤＣを形成してもよいし、剥離用テープＰＴが貼付された接着シートＡＳに切込ＣＵや溝ＤＣを形成してもよいし、接着シートＡＳの所定の部分に切込ＣＵや溝ＤＣを形成してもよいし、単数の切込ＣＵや溝ＤＣを形成してもよいし、図１（Ｂ）に示すように、被着体ＷＫの外縁に達する切込ＣＵや溝ＤＣを形成してもよいし、被着体ＷＫの外縁に達することのない切込ＣＵや溝ＤＣを形成してもよいし、切込ＣＵや溝ＤＣは、直線、湾曲線、屈曲線、波線、円環状の線、多角環状の線等、どのような形状であってもよい。
弾性復元力低下手段１０は、図１（Ｅ）に示すように、接着シートＡＳを全体的に薄くすることで当該接着シートＡＳの弾性復元力を低下させる弾性復元力低下手段１０Ｂが採用されてもよい。このような弾性復元力低下手段１０Ｂは、例えば、駆動機器としての回動モータ１３の出力軸１３Ａに支持されたグラインダ、砥石、やすり、サンドペーパ等の研削手段１４を備えた構成が例示できる。なお、弾性復元力低下手段１０Ｂは、例えば、研削手段１４で接着シートＡＳを部分的に薄くすることで当該接着シートＡＳの弾性復元力を低下させてもよい。
弾性復元力低下手段１０は、接着シートＡＳを全体的または部分的に柔らかくすることで当該接着シートＡＳの弾性復元力を低下させるものでもよく、例えば、接着シートＡＳが加熱や冷却によって柔らかくなって弾性復元力が低下するものの場合、接着シートＡＳに熱風や熱湯等を付与したり、冷却風や冷水等を付与したりして当該接着シートの弾性復元力を低下させてもよいし、接着シートＡＳがマイクロ波、Ｘ線、ガンマ線、紫外線、可視光線、赤外線等のエネルギー線の付与や、薬液の付与等で柔らかくなり、弾性復元力が低下するものの場合、接着シートＡＳにエネルギー線を付与したり、薬液を付与したりすることで当該接着シートＡＳの弾性復元力を低下させてもよく、熱風、熱湯、冷却風、冷水、エネルギー線または薬液等は、接着シートＡＳの全体に付与したり、接着シートＡＳの所定の部分に付与したりして、接着シートＡＳを全体的または部分的に柔らかくしてもよい。
弾性復元力低下手段１０は、切込ＣＵの形成、溝ＤＣの形成、接着シートＡＳの研削、熱風や熱湯の付与、冷却風や冷水の付与、エネルギー線の付与、薬液の付与等、それらのうち少なくとも２つを接着シートＡＳに施すことによって当該接着シートＡＳの弾性復元力を低下させてもよいし、被着体ＷＫに貼付される前の接着シートＡＳの弾性復元力を低下させてもよい。 For example, as shown in FIG. 1D, the elastic restoring force reducing means 10 may adopt a configuration in which a groove DC is formed in the adhesive sheet AS by the cutting blade 23C, and such a groove DC may be, for example, It may have a V-shaped cross section as shown in the figure, or any other shape such as a U-shape or a U-shape, and as shown by the alternate long and short dash line in the figure, the upper part of the groove DC is connected. You may be doing it.
The elastic restoring force reducing means 10 may form a notch CU or groove DC extending in a direction not parallel to the direction orthogonal to the peeling direction, or may form a notch CU or groove DC parallel to or not parallel to each other. , A plurality of notches CU and grooves DC may be formed in the peeling direction of the adhesive sheet AS, a plurality of notch CUs and grooves DC may be formed so as to intersect each other, and a plurality of notch CUs and grooves DC may be formed in the entire adhesive sheet AS. Alternatively, a cut CU or a groove DC may be formed on the adhesive sheet AS to which the peeling tape PT is attached, or a cut CU or a groove DC may be formed on a predetermined portion of the adhesive sheet AS. Alternatively, a single notch CU or groove DC may be formed, or as shown in FIG. 1 (B), a notch CU or groove DC reaching the outer edge of the adherend WK may be formed. However, a cut CU or groove DC that does not reach the outer edge of the adherend WK may be formed, and the cut CU or groove DC may be a straight line, a curved line, a bent line, a wavy line, or an annular line. It may have any shape such as a polygonal annular line.
As shown in FIG. 1 (E), the elastic restoring force reducing means 10 adopts the elastic restoring force reducing means 10B that reduces the elastic restoring force of the adhesive sheet AS by thinning the adhesive sheet AS as a whole. May be good. Such an elastic restoring force reducing means 10B can be exemplified by a configuration including, for example, a grinding means 14 such as a grinder, a grindstone, a file, and a sandpaper supported by an output shaft 13A of a rotating motor 13 as a driving device. The elastic restoring force reducing force 10B may reduce the elastic restoring force of the adhesive sheet AS by partially thinning the adhesive sheet AS by, for example, the grinding means 14.
The elastic restoring force reducing means 10 may reduce the elastic restoring force of the adhesive sheet AS by softening the adhesive sheet AS as a whole or partially. For example, the adhesive sheet AS is softened by heating or cooling. If the elastic restoring force is reduced, the adhesive sheet AS may be provided with hot air, hot water, or the like, or cooling air, cold water, or the like may be applied to reduce the elastic restoring force of the adhesive sheet. If the AS becomes soft due to the application of energy rays such as microwaves, X-rays, gamma rays, ultraviolet rays, visible rays, and infrared rays, or the application of a chemical solution, and the elastic restoring force decreases, the energy rays are applied to the adhesive sheet AS. Alternatively, the elastic restoring force of the adhesive sheet AS may be reduced by applying a chemical solution, and hot air, hot water, cooling air, cold water, energy rays, a chemical solution, etc. may be applied to the entire adhesive sheet AS. , The adhesive sheet AS may be applied to a predetermined portion of the adhesive sheet AS to soften the adhesive sheet AS in whole or in part.
The elastic restoring force reducing means 10 includes forming a cut CU, forming a groove DC, grinding an adhesive sheet AS, applying hot air or hot water, applying cooling air or cold water, applying energy rays, applying a chemical solution, and the like. The elastic restoring force of the adhesive sheet AS may be reduced by applying at least two of them to the adhesive sheet AS, or the elastic restoring force of the adhesive sheet AS before being attached to the adherend WK may be reduced. good.

剥離手段２０は、例えば、チャックシリンダ２１Ｋを支持するスライダを有する駆動機器としてのリニアモータを採用し、テーブル３１を移動させずにまたは移動させつつ、チャックシリンダ２１Ｋを移動させることで、剥離開始部ＡＳ１と被着体ＷＫとを相対移動させてもよいし、多関節ロボット等の駆動機器でチャックシリンダ２１Ｋとテーブル３１とを相対移動させてもよいし、作業者が剥離開始部ＡＳ１と被着体ＷＫとを相対移動させてもよいし、切込ＣＵが形成された位置に剥離用テープＰＴを貼付してもよいし、切込ＣＵが形成されていない位置に剥離用テープＰＴを貼付してもよいし、剥離用テープＰＴを用いることなく、弾性復元力を低下させた剥離開始部ＡＳ１を吸着パッドやチャックシリンダ等の保持手段で直接保持して当該剥離開始部ＡＳ１と被着体ＷＫとを相対移動させてもよい。
剥離用テープＰＴは、感圧接着性の剥離用テープＰＴが採用されてもよい。なお、感圧接着性の剥離用テープＰＴが採用された場合、剥離手段２０は、加熱手段２２Ｃが備わっていてもよいし、備わっていなくてもよい。
押圧手段２２は、放電加熱器、マイクロ波照射装置、温風吹付装置等の加熱手段を採用してもよいし、加熱手段に代えてまたは併用して、押圧ヘッド２２Ｄを振動させる超音波振動装置やバイブレータ等の振動手段を採用してもよい。 The peeling means 20 employs, for example, a linear motor as a drive device having a slider that supports the chuck cylinder 21K, and moves the chuck cylinder 21K without or while moving the table 31 to move the peeling start portion. The AS1 and the adherend WK may be relatively moved, or the chuck cylinder 21K and the table 31 may be relatively moved by a drive device such as an articulated robot, or the operator may move the peeling start portion AS1 and the adherend. The body WK may be moved relative to the body WK, the release tape PT may be attached to the position where the notch CU is formed, or the release tape PT may be attached to the position where the notch CU is not formed. Alternatively, the peeling start portion AS1 having a reduced elastic restoring force is directly held by a holding means such as a suction pad or a chuck cylinder without using the peeling tape PT, and the peeling start portion AS1 and the adherend WK may be held. And may be moved relative to each other.
As the peeling tape PT, a pressure-sensitive adhesive peeling tape PT may be adopted. When the pressure-sensitive adhesive peeling tape PT is adopted, the peeling means 20 may or may not be provided with the heating means 22C.
The pressing means 22 may employ a heating means such as a discharge heater, a microwave irradiation device, a warm air blowing device, or an ultrasonic vibration device that vibrates the pressing head 22D in place of or in combination with the heating means. Or a vibrating means such as a vibrator may be adopted.

支持手段３０は、図示しない減圧手段が備わっていなくてもよいし、本発明のシート剥離装置ＥＡに備わっていてもよいし、備わっていなくてもよい。 The support means 30 may or may not be provided with a decompression means (not shown), or may or may not be provided in the sheet peeling device EA of the present invention.

シート剥離装置ＥＡは、被着体ＷＫを研削して当該被着体ＷＫの厚みを薄くする研削手段が備わっていてもよいし、ダイシングテープやエキスパンドテープ等の他の接着シートを介して被着体ＷＫとフレーム部材とを一体化する一体化手段が備わっていてもよい。
フレーム部材は、環状のものや、環状でない（外周が繋がっていない）もの、円形、楕円形、三角形以上の多角形、その他の形状であってもよい。 The sheet peeling device EA may be provided with a grinding means for grinding the adherend WK to reduce the thickness of the adherend WK, or may be adhered via another adhesive sheet such as dicing tape or expanding tape. An integration means for integrating the body WK and the frame member may be provided.
The frame member may have an annular shape, a non-annular shape (the outer circumferences are not connected), a circular shape, an elliptical shape, a polygonal shape having a triangle or more, and other shapes.

本発明における手段および工程は、それら手段および工程について説明した動作、機能または工程を果たすことができる限りなんら限定されることはなく、まして、前記実施形態で示した単なる一実施形態の構成物や工程に全く限定されることはない。例えば、剥離工程は、被着体から接着シートを剥離する工程であればどのような工程でもよく、出願当初の技術常識に照らし合わせてその技術範囲内のものであればなんら限定されることはない（その他の手段および工程も同じ）。 The means and processes in the present invention are not limited as long as they can perform the operations, functions or processes described for the means and processes, much less the components of the mere embodiment shown in the above-described embodiment. It is not limited to the process at all. For example, the peeling step may be any step as long as it is a step of peeling the adhesive sheet from the adherend, and is not limited as long as it is within the technical range in light of the common general technical knowledge at the time of filing. None (same for other means and processes).

接着シートＡＳ、剥離用テープＰＴおよび被着体ＷＫの材質、種別、形状等は、特に限定されることはない。例えば、接着シートＡＳおよび被着体ＷＫは、円形、楕円形、三角形や四角形等の多角形、その他の形状であってもよいし、接着シートＡＳは、感圧接着性、感熱接着性等の接着形態のものであってもよい。また、このような接着シートＡＳは、例えば、接着剤層だけの単層のもの、基材と接着剤層との間に中間層を有するもの、基材の上面にカバー層を有する等３層以上のもの、更には、基材を接着剤層から剥離することのできる所謂両面接着シートのようなものであってもよく、両面接着シートは、単層又は複層の中間層を有するものや、中間層のない単層又は複層のものであってよい。また、被着体ＷＫとしては、例えば、食品、樹脂容器、シリコン半導体ウエハや化合物半導体ウエハ等の半導体ウエハ、回路基板、光ディスク等の情報記録基板、ガラス板、鋼板、陶器、木板または樹脂等の単体物であってもよいし、それら２つ以上で形成された複合物であってもよく、任意の形態の部材や物品なども対象とすることができる。なお、接着シートＡＳは、機能的、用途的な読み方に換え、例えば、情報記載用ラベル、装飾用ラベル、保護シート、ダイシングテープ、ダイアタッチフィルム、ダイボンディングテープ、記録層形成樹脂シート等の任意のシート、フィルム、テープ等でもよい。 The materials, types, shapes, etc. of the adhesive sheet AS, the peeling tape PT, and the adherend WK are not particularly limited. For example, the adhesive sheet AS and the adherend WK may have a circular shape, an elliptical shape, a polygonal shape such as a triangle or a quadrangle, or other shapes, and the adhesive sheet AS may have pressure-sensitive adhesiveness, heat-sensitive adhesiveness, or the like. It may be in an adhesive form. Further, such an adhesive sheet AS has three layers, for example, a single layer having only an adhesive layer, a material having an intermediate layer between the base material and the adhesive layer, and a cover layer on the upper surface of the base material. Further, it may be a so-called double-sided adhesive sheet capable of peeling the base material from the adhesive layer, and the double-sided adhesive sheet may have a single layer or a multi-layer intermediate layer. , It may be a single layer or a multi-layer without an intermediate layer. The adherend WK includes, for example, foods, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, circuit substrates, information recording substrates such as optical disks, glass plates, steel plates, pottery, wood plates or resins. It may be a single product, or a composite product formed of two or more of them, and any form of a member or an article can be targeted. The adhesive sheet AS can be read in a functional and versatile manner, for example, an information description label, a decorative label, a protective sheet, a dicing tape, a die attach film, a die bonding tape, a recording layer forming resin sheet, or the like. Sheets, films, tapes, etc. may be used.

前記実施形態における駆動機器は、回動モータ、直動モータ、リニアモータ、単軸ロボット、２軸または３軸以上の関節を備えた多関節ロボット等の電動機器、エアシリンダ、油圧シリンダ、ロッドレスシリンダおよびロータリシリンダ等のアクチュエータ等を採用することができる上、それらを直接的又は間接的に組み合せたものを採用することもできる。
前記実施形態において、ローラ等の回転部材が採用されている場合、当該回転部材を回転駆動させる駆動機器を備えてもよいし、回転部材の表面や回転部材自体をゴムや樹脂等の変形可能な部材で構成してもよいし、回転部材の表面や回転部材自体を変形しない部材で構成してもよいし、ローラの代わりに回転するまたは回転しないシャフトやブレード等の他の部材を採用してもよいし、押圧ローラや押圧ヘッド等の押圧手段や押圧部材といった被押圧物を押圧するものが採用されている場合、上記で例示したものに代えてまたは併用して、ローラ、丸棒、ブレード材、ゴム、樹脂、スポンジ等の部材を採用したり、大気やガス等の気体の吹き付けにより押圧する構成を採用したりしてもよいし、押圧するものをゴムや樹脂等の変形可能な部材で構成してもよいし、変形しない部材で構成してもよいし、支持（保持）手段や支持（保持）部材等の被支持部材（被保持部材）を支持（保持）するものが採用されている場合、メカチャックやチャックシリンダ等の把持手段、クーロン力、接着剤（接着シート、接着テープ）、粘着剤（粘着シート、粘着テープ）、磁力、ベルヌーイ吸着、吸引吸着、駆動機器等で被支持部材を支持（保持）する構成を採用してもよいし、切断手段や切断部材等の被切断部材を切断または、被切断部材に切込や切断線を形成するものが採用されている場合、上記で例示したものに代えてまたは併用して、カッター刃、レーザカッタ、イオンビーム、火力、熱、水圧、電熱線、気体や液体等の吹付け等で切断するものを採用したり、適宜な駆動機器を組み合わせたもので切断するものを移動させて切断するようにしたりしてもよい。 The drive device in the above embodiment is an electric device such as a rotary motor, a linear motor, a linear motor, a single-axis robot, an articulated robot having two or three or more axes of joints, an air cylinder, a hydraulic cylinder, and a rodless. In addition to being able to employ actuators such as cylinders and rotary cylinders, it is also possible to adopt a combination of these directly or indirectly.
In the above embodiment, when a rotating member such as a roller is adopted, a driving device for rotationally driving the rotating member may be provided, or the surface of the rotating member or the rotating member itself can be deformed by rubber, resin, or the like. It may be composed of a member, the surface of the rotating member or the rotating member itself may be composed of a member that does not deform, or another member such as a shaft or a blade that rotates or does not rotate may be adopted instead of the roller. Alternatively, when a pressing means such as a pressing roller or a pressing head or a pressing member that presses a pressed object is adopted, a roller, a round bar, or a blade may be used in place of or in combination with the above-exemplified one. A member such as a material, rubber, resin, or sponge may be adopted, or a structure that presses by blowing a gas such as air or gas may be adopted, or a deformable member such as rubber or resin may be adopted. It may be composed of a member that does not deform, or a member that supports (holds) a supported member (held member) such as a supporting (holding) means or a supporting (holding) member. If so, it is covered with a gripping means such as a mechanical chuck or chuck cylinder, Coulomb force, adhesive (adhesive sheet, adhesive tape), adhesive (adhesive sheet, adhesive tape), magnetic force, Bernoulli suction, suction suction, drive equipment, etc. A configuration in which the support member is supported (held) may be adopted, or when a member to be cut such as a cutting means or a cutting member is cut, or a member having a cut or a cutting line is formed in the member to be cut. , In place of or in combination with the ones exemplified above, adopt one that cuts with a cutter blade, laser cutter, ion beam, thermal power, heat, hydraulic pressure, heating wire, spraying gas, liquid, etc., or as appropriate. It is also possible to move what is to be cut by combining various drive devices to cut.

ＥＡ…シート剥離装置
１０…弾性復元力低下手段
２０…剥離手段
ＡＳ…接着シート
ＡＳ１…剥離開始部
ＷＫ…被着体 EA ... Sheet peeling device 10 ... Elastic restoring force reducing means 20 ... Peeling means AS ... Adhesive sheet AS1 ... Peeling start part WK ... Adhesive body

Claims (3)

被着体に貼付された接着シートを当該被着体から剥離するシート剥離方法であって、
前記接着シートの剥離開始部の弾性復元力を低下させる弾性復元力低下工程と、
前記弾性復元力を低下させた前記剥離開始部と前記被着体とを相対移動させ、前記被着体から前記接着シートを剥離する剥離工程とを実施することを特徴とするシート剥離方法。 A sheet peeling method for peeling an adhesive sheet attached to an adherend from the adherend.
An elastic restoring force reducing step of reducing the elastic restoring force of the peeling start portion of the adhesive sheet, and a step of reducing the elastic restoring force.
A sheet peeling method characterized by carrying out a peeling step of peeling the adhesive sheet from the adherend by relatively moving the peeling start portion and the adherend having reduced elastic restoring force. 前記弾性復元力低下工程では、前記接着シートの厚みを全体的または部分的に薄くすることで当該接着シートの弾性復元力を低下させることを特徴とする請求項１に記載のシート剥離方法。 The sheet peeling method according to claim 1, wherein in the step of reducing the elastic restoring force, the elastic restoring force of the adhesive sheet is reduced by reducing the thickness of the adhesive sheet as a whole or partially. 被着体に貼付された接着シートを当該被着体から剥離するシート剥離装置であって、
前記接着シートの剥離開始部の弾性復元力を低下させる弾性復元力低下手段と、
前記弾性復元力を低下させた前記剥離開始部と前記被着体とを相対移動させ、前記被着体から前記接着シートを剥離する剥離手段とを備えていることを特徴とするシート剥離装置。 A sheet peeling device that peels an adhesive sheet attached to an adherend from the adherend.
An elastic restoring force reducing means for reducing the elastic restoring force at the peeling start portion of the adhesive sheet,
A sheet peeling device comprising: a peeling means for peeling the adhesive sheet from the adherend by relatively moving the peeling start portion and the adherend having reduced elastic restoring force.
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