JP2011114275A - Sheet-peeling apparatus and peeling method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent occurrence of failures, in peeling of a bonding sheet. <P>SOLUTION: A sheet-peeling apparatus 10 peels a bonding sheet S pasted on one surface of a wafer W from the wafer W via a peeling tape PT. The bonding sheet S includes a base material sheet and an adhesive layer formed on one surface of the base material sheet. The bonding sheet S has a cut having one end reaching an outer edge of the base material sheet. The sheet-peeling apparatus 10 includes an unreeling means 12 for unreeling the peeling tape PT; a pasting means 14 for pasting the peeling tape PT to the bonding sheet S; and a moving means 15; capable of peeling the bonding sheet S by relatively making the wafer W and the peeling tape PT move. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a sheet peeling apparatus and a peeling method, and more specifically, a sheet capable of sticking a peeling tape to an adhesive sheet attached to an adherend and peeling the adhesive sheet through the peeling tape. The present invention relates to a peeling apparatus and a peeling method.

  A semiconductor wafer (hereinafter, sometimes simply referred to as “wafer”) has a protective adhesive sheet attached to its circuit surface, and the adhesive sheet is peeled off after various processes such as back grinding. An example of such an adhesive sheet peeling apparatus is disclosed in Patent Document 1. In the same document, the step of peeling the adhesive sheet from the wafer is performed by relatively moving the peeling tape and the wafer after the peeling tape is attached to the adhesive sheet.

JP 2004-165570 A

  By the way, recently, since the diameter of the wafer tends to increase, the size of the adhesive sheet increases accordingly. For this reason, when peeling as in Patent Document 1, a large peeling force is required when peeling the adhesive sheet, and the peeling tape is extended or cut at the time of peeling, resulting in frequent inconvenience of peeling failure. is there.

[Object of invention]
The objective of this invention is providing the sheet peeling apparatus and peeling method which can prevent that the peeling defect of an adhesive sheet generate | occur | produces.

In order to achieve the above object, the present invention provides a sheet peeling apparatus for peeling an adhesive sheet attached to one surface of an adherend from the adherend via a peeling tape.
The adhesive sheet includes a base sheet and an adhesive layer provided on one surface of the base sheet, and a notch that reaches only one end is formed on the outer edge of the base sheet and is peeled as a plurality of sheet regions. Is possible,
A configuration comprising: a feeding means for feeding out the peeling tape; a sticking means for sticking the peeling tape to the adhesive sheet; and a moving means capable of peeling the adhesive sheet by relatively moving the adherend and the peeling tape. Is adopted.

  In this invention, you may take the structure of further providing the reinforcement tape sticking means which sticks a reinforcement tape to the other end side area | region of the said notch | incision.

  In addition, a configuration in which a detection unit that detects the incision is provided, and the position at which the peeling tape is applied by the application unit can be determined based on the detection result of the detection unit is preferably employed.

  Further, the moving means performs the primary peeling that performs the relative movement in the first direction, and then performs the secondary peeling that performs the relative movement in a second direction different from the first direction to peel the adhesive sheet. It is possible to adopt a configuration of performing.

Further, the present invention provides a sheet peeling apparatus for peeling an adhesive sheet affixed to one surface of an adherend from the adherend via a peeling tape,
The adhesive sheet is provided with a base sheet and an adhesive layer provided on one surface of the base sheet, and incisions are formed in the surface of the adhesive sheet so as to be peeled as a plurality of sheet regions.
A feeding means for feeding out the peeling tape;
An affixing means for affixing a peeling tape to the adhesive sheet;
A configuration is adopted in which a moving means capable of peeling the adhesive sheet by relatively moving the adherend and the peeling tape is provided.

  Furthermore, it is preferable to employ a configuration in which the sheet further includes an anti-floating means capable of restricting other divided sheets adjacent to the divided sheet to be peeled off through the cut.

  Further, it is preferable to further include a positioning unit capable of adjusting and positioning the relative position between the adherend and the attaching unit in a plane parallel to one surface of the adherend.

  Furthermore, you may take the structure of further providing the rotation means to relatively rotate the said to-be-adhered body and the peeling tape affixed on the adhesive sheet.

Further, the peeling method of the present invention is a sheet peeling method for peeling an adhesive sheet attached to one surface of an adherend from the adherend via a peeling tape.
The adhesive sheet includes a base sheet and an adhesive layer provided on one surface of the base sheet, and a notch that reaches only one end is formed on the outer edge of the base sheet and is peeled as a plurality of sheet regions. Is possible,
A step of pasting the drawn-off peeling tape to the adhesive sheet;
The method of performing the process of peeling an adhesive sheet by making a to-be-adhered body and the peeling tape move relatively is taken.

  Furthermore, you may employ | adopt the method of performing the process of sticking a reinforcement tape to the other end side area | region of a notch | cutting before performing the said peeling process.

Further, the peeling method of the present invention is a sheet peeling method for peeling an adhesive sheet attached to one surface of an adherend from the adherend via a peeling tape.
The adhesive sheet is provided with a base sheet and an adhesive layer provided on one surface of the base sheet, and incisions are formed in the surface of the adhesive sheet so as to be peeled as a plurality of sheet regions.
A step of pasting the drawn-off peeling tape to the adhesive sheet;
The method of performing the process of peeling an adhesive sheet by making a to-be-adhered body and the peeling tape move relatively is taken.

  Further, the adhesive sheet is pressed in a state where the other sheet area is pressed against the adherend side so as to regulate the other sheet area adjacent to the sheet area to be peeled off through the notch. It is good to peel off.

  According to the present invention, since the adhesive sheet formed as a plurality of sheet regions by cutting is formed, the sheet regions can be separated. Since each sheet region is made smaller than the entire adhesive sheet, it is possible to reduce the force required for peeling compared to the peeling of the entire adhesive sheet not having a cut. As a result, even if the adherend is a wafer having a large diameter, it is possible to prevent the peeling tape from extending or cutting, and to avoid occurrence of defective peeling.

  Furthermore, when a reinforcing tape is attached, when the other end side region of the cut is peeled off, a crack is generated from the other end side to prevent the adhesive sheet from being separated, thereby preventing occurrence of poor peeling of the adhesive sheet. It becomes possible to do.

  Moreover, when determining the application position of the peeling tape based on the detection result of the cut, the application position can be easily and quickly adjusted to a position suitable for peeling, and the initial peeling of the adhesive sheet can be performed more smoothly. It becomes possible.

  Furthermore, when primary peeling and secondary peeling with different peeling directions are possible, for example, after peeling in a direction in which a peeling stake is easily formed on the adhesive sheet in the initial stage of peeling, after the initial stage of peeling, by divided peeling It is possible to perform peeling in a direction in which the force required for peeling is reduced.

  Furthermore, when a floating prevention means is provided, when any one of the sheet areas is peeled off, the sheet sheet is cut by an uncut portion of the base sheet or the adhesive layer, or by re-adhesion of the adhesive layer. It is possible to reliably prevent other sheet regions adjacent to each other from being followed and peeled off.

  Further, when the relative position between the adherend and the pasting unit is adjusted by the positioning unit to enable positioning, the pasting position of the peeling tape can be arbitrarily set according to the cut formation position.

  Furthermore, by making the adherend and the peeling tape relatively rotatable by the positioning means, it is possible to change the advancing direction of peeling during peeling of the adhesive sheet.

The schematic front view which carried out partial cross section view of the sheet peeling apparatus concerning each embodiment. (A)-(C) are peeling operation explanatory drawings of an adhesive sheet. (A)-(E) are peeling operation explanatory drawings of the adhesive sheet concerning a 1st embodiment. Explanatory drawing of the adhesive sheet which concerns on 2nd Embodiment. (A)-(C) are peeling operation | movement explanatory drawings of the adhesive sheet which concerns on 3rd Embodiment. (A)-(E) are peeling operation | movement explanatory drawings of the adhesive sheet which concerns on 4th Embodiment. (A) And (B) is peeling operation explanatory drawing of the adhesive sheet which concerns on 5th Embodiment. Explanatory drawing of the adhesive sheet which concerns on 6th Embodiment. Explanatory drawing of the adhesive sheet which concerns on 7th Embodiment. (A)-(C) are peeling operation | movement explanatory drawings of the adhesive sheet which concerns on 8th Embodiment. (A) And (B) is peeling operation explanatory drawing of the adhesive sheet which concerns on 9th Embodiment. (A)-(C) are peeling operation | movement explanatory drawings of the adhesive sheet which concerns on 10th Embodiment. Explanatory drawing of the adhesive sheet which concerns on a 1st modification. (A)-(C) are peeling operation explanatory drawing of the adhesive sheet which concerns on a 2nd modification.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In this specification, “upper”, “lower”, “left”, and “right” are used with reference to FIG. 1 unless otherwise specified.

[First Embodiment]
1 to 3, the sheet peeling apparatus 10 includes a holding unit 11 that holds a wafer W as an adherend, a feeding unit 12 that feeds a strip-shaped peeling tape PT, and a circuit surface of the wafer W. The affixing means 14 for affixing the peeling tape PT to the adhesive sheet S affixed to the surface (upper surface) and the peeling tape PT affixed to the adhesive sheet S and the wafer W held by the holding means 11 are moved relative to each other. The moving means 15, the floating prevention means 16 which can be located on the upper surface side of the adhesive sheet S, and the connecting tape applying means 17 for attaching the connecting tape LT to the adhesive sheet S are provided. In this embodiment, the peeling tape PT is a heat-sensitive adhesive tape. The adhesive sheet S includes a base sheet B and an adhesive layer AD provided on one surface, that is, the lower surface of the base sheet B, and is attached to the upper surface of the wafer W via the adhesive layer AD. ing. The adhesive sheet S has a cut C (see FIG. 3). In the present embodiment, the adhesive sheet S has a notch C that passes through the center of the adhesive sheet S, and only one end thereof reaches the outer edge of the base sheet B, and the first sheet region S1 (same as above) It can be peeled off as a plurality of sheet areas consisting of a sheet area located in the lower part of the figure and a second sheet area S2 (a sheet area located in the upper part of the figure).

  The holding means 11 is composed of a table for adsorbing and holding the wafer W integrated with the ring frame RF on the upper surface from the dicing sheet DS side. A detection unit (not shown) is provided above the holding unit 11. The detecting means detects the cut C formed in the adhesive sheet S, and controls the driving of the driving means 40 described later based on the detection result, and the function of determining the attaching position of the peeling tape PT by the attaching means 14. And.

  The feeding means 12 supports a peeling tape PT that is supported and wound by a frame (not shown), a support shaft 21 that is rotatable via a motor M1, and a driving roller 22 that is rotatable via a motor M2. A pinch roller 23 that sandwiches the peeling tape PT between the drive roller 22, a plate-like guide member 25 that supports the peeling tape PT from below in FIG. A rotatable press roller 27 that sandwiches the PT and an elevating cylinder 28 that raises and lowers the press roller 27 are provided. The guide member 25 is provided so as to be movable in the left-right direction in FIG. 1 via the cylinder 29. As shown in FIG. 2A, the lead end region of the peeling tape PT sandwiched between the press rollers 27 will be described later. It can be guided to a position where it can be gripped by the chuck 41.

  The sticking means 14 includes a linear motion motor 31 and a pressing head 32 having a heater 32A provided by the linear motion motor 31 so as to advance and retract in the vertical direction. The affixing means 14 adheres the peeling tape PT to the adhesive sheet S by pressing and heating the peeling tape PT fed to the upper surface side of the adhesive sheet S with the pressing head 32 by a chuck 41 described later. It has become. A tape cutting means 34 is provided on the left side of the sticking means 14. The tape cutting means 34 includes a cutter blade 35, a tape receiving plate 36 provided on the lower side of the cutter blade 35 and having a concave portion on the upper surface, and a vertical cylinder 37 for moving the cutter blade 35 in the vertical direction. It comprises a cutting cylinder 38 for moving the cutter blade 35 in the direction perpendicular to the plane of the drawing in FIG.

  The moving means 15 includes a driving means 40 that movably supports the holding means 11 and a chuck 41 that is provided below the sticking means 14 and can hold the peeling tape PT with a holding member 41A. The driving means 40 is provided so as to be able to position the wafer W by moving the holding means 11 in the direction orthogonal to the paper surface in FIG. Here, the drive means 40 constitutes a positioning means and a rotation means. The chuck 41 is configured to be movable in the left-right direction in FIG. 1 via a driving device (not shown).

  The levitation preventing means 16 is supported so as to be movable via an articulated robot 46. The articulated robot 46 includes a base 62, an articulated arm 63 that can be rotated by a position-controllable motor provided on the upper surface of the base 62, and the articulated arm. 63 is a so-called six-axis robot provided with a holding chuck 64 attached to the free end side of 63, and the holding chuck 64 can be moved in any position and in any direction within the work area. The holding chuck 64 includes a pair of chuck claws 64 </ b> A that can be separated from each other, and the chuck claws 64 </ b> A can be engaged with and disengaged from the arm holder 60.

  The levitation preventing means 16 includes an arm holder 67 that can be engaged with and disengaged from the holding chuck 64, and a plate-shaped pressing member 68 that is connected to the arm holder 67 and that can be positioned along the notch C. The robot 46 can be engaged and disengaged by a chuck claw 64A.

  The reinforcing tape affixing means 17 is a supply means 72 that can be folded and peeled off by the peel plate 70 in the middle of feeding the strip-shaped release sheet RL, and the reinforcing tape LT temporarily attached to the release sheet RL can be peeled and supplied one by one. The pressing means 73 is configured to press and stick the reinforcing tape LT supplied from the supplying means 72. The pressing means 73 includes a suction head 75 capable of sucking and holding the reinforcing tape LT with the lower surface serving as a suction surface, and a linear motion motor 76 that moves the suction head 75 up and down.

  Next, the peeling method of the adhesive sheet S in the sheet peeling apparatus 10 is demonstrated using FIG.3 and FIG.4 also.

  First, the peeling tape PT is pulled out from the support shaft 21, passed between the drive roller 22 and the pinch roller 23, sandwiched between the press roller 27 and the guide member 25, and the lead end side protrudes from the tip of the guide member 25. Is done. Then, the adhesive sheet S is pasted via a conveying means (not shown), and the wafer W integrated with the ring frame RF is attracted and held on the upper surface of the holding means 11 via the dicing sheet DS. Here, a cut C is formed in the adhesive sheet S in advance, and the adhesive sheet S is provided so as to be peelable by the cut C as first and second sheet regions S1 and S2.

  Then, the notch C is detected by the above-described detection means (not shown) to determine the application position of the peeling tape PT, and the application position, that is, the right outer edge position of the first sheet region S1 in the adhesive sheet S in FIG. The holding means 11 is moved and positioned by the driving means 40 so as to stop immediately below the position.

  Next, as shown in FIG. 2A, the guide member 25 is advanced to the right in the figure via the cylinder 29, and at the same time, the motor M2 is operated to rotate the driving roller 22 to release the peeling tape PT. To pay out. As a result, the guide member 25 and the lead end side of the peeling tape PT are positioned between the gripping members 41 </ b> A of the chuck 41. When the press roller 27 is retracted upward and the guide member 25 is retracted, the peeling tape PT is left between the gripping members 41A and is gripped by the operation of the chuck 41. Thereafter, the chuck 41 is moved to a position indicated by a two-dot chain line in FIG. 2A by a driving device (not shown), the peeling tape PT is pulled out, and the peeling tape PT is peeled so as to face the adhesive sheet S below the pressing head 32. The tape PT is positioned.

  Next, as shown in FIG. 2 (B), when the pressing head 32 is moved downward by the linear motor 31, the peeling tape PT is pushed down, and the peeling tape PT is heated by the heater 31A to be the first. Adhere to the sheet region S1. Thereafter, the peeling tape PT is sandwiched between the press roller 27 and the guide member 25, and the cylinders 37 and 38 are operated to cut the peeling tape PT with the cutter blade 35 on the tape receiving plate 36.

  Thereafter, by the operation of the articulated robot 46, the pressing member 68 is placed on the second divided sheet S2 so that the pressing member 68 is positioned along the notch C as shown by a two-dot chain line in FIG. Make contact.

  Thereafter, as shown in FIGS. 2C and 3B, the driving means 40 and the like so that the peeling tape PT attached to the first sheet region S1 and the wafer W relatively move in opposite directions. By moving the chuck 41 and the holding means 11 via the first sheet region, the separation of the first sheet region S1 proceeds. At this time, even if the base sheet B and the adhesive layer AD in each of the sheet regions S1 and S2 are connected without being completely separated in the cut C, the pressing member 68 is pressing the second sheet region S2. Thus, the second sheet region S2 can be prevented from lifting up following the first sheet region S1.

  Then, as shown in FIG. 5B, after the first sheet region S1 is peeled to the other end P of the cut C, the progress of the peeling is stopped. Next, by the operation of the articulated robot 46, the floating prevention means 66 is retracted from the second sheet region S2. Next, the holding means 11 is rotated by the driving means 40 around the other end P as the rotation center, and the wafer W is rotated 360 ° to peel off the adhesive sheet S around the other end P (FIGS. 5C and 5C). D)). Thereafter, as shown in FIG. 5E, the chuck 41 and the holding means 11 are moved via the driving means 40 so that the peeling tape PT and the wafer W are relatively moved in the opposite directions. The second sheet region S2 is peeled through the peeling tape P and the peeled first sheet region S1.

  After the peeling of the adhesive sheet S is completed, the peeled adhesive sheet S and the peeling tape PT attached thereto are collected by a collecting means (not shown). Further, the wafer W is transferred to the next process by a transfer means (not shown). Then, after the holding means 11 and the chuck 41 are returned to the initial positions, and the holding chuck 64 in the multi-joint robot 46 is changed from the floating prevention means 66 to the cutter blade 43 and the like, the same operation as described above is repeated.

  Therefore, according to such 1st Embodiment, it can peel for every 1st sheet | seat area | region S1 and 2nd sheet | seat area | region S2 which divided the adhesive sheet S into two and reduced in size. Thereby, compared with the case where the adhesive sheet S that is not divided is peeled off, the tensile force generated in the peeling tape PT at the time of peeling can be reduced, and the peeling failure caused by the extending or cutting of the peeling tape PT. Can be prevented.

  Next, other embodiments of the present invention will be described. In the following description, each embodiment uses the same sheet peeling apparatus 10 as in the first embodiment, and changes the formation position of the cut C and / or the peeling method of the adhesive sheet S. Therefore, the same reference numerals are used for the same or equivalent components as those in the first embodiment, and overlapping descriptions or similar descriptions are omitted or simplified.

[Second Embodiment]
In FIG. 4, in the second embodiment, the adhesive sheet S in which the cuts C are formed is the object to be peeled as in the first embodiment, and the wafer W integrated with the ring frame RF is removed as in the first embodiment. After the suction means is held on the upper surface of the holding means 11, the holding means 11 is moved by the driving means 40 so that the gap between the other end P of the cut C and the left end of the adhesive sheet S stops just below the suction head 75. Next, when the suction head 75 is moved downward by the linear motion motor 76, the reinforcing tape LT is stuck between the other end P and the left end of the adhesive sheet S. After sticking the reinforcing tape LT, the same as in the first embodiment. The adhesive sheet S is peeled off. According to the present embodiment, when the periphery of the other end P of the notch C is peeled, a crack is generated from the other end P and the adhesive sheet is divided, thereby preventing the occurrence of defective peeling of the adhesive sheet S. It becomes possible.

[Third Embodiment]
In FIG. 5, in the third embodiment, the adhesive sheet S in which the cuts C are formed is the object to be peeled as in the first embodiment, and the wafer W integrated with the ring frame RF is removed as in the first embodiment. After the first sheet region S1 is peeled to the vicinity of the other end P by adsorbing and holding on the upper surface of the holding means 11, the progress of the peeling is stopped. Thereafter, the holding unit 11 is moved by the driving unit 40 so that the gap between the other end P of the notch C and the left end of the adhesive sheet S stops just below the suction head 75. Next, the reinforcing tape LT is applied to the first sheet region S1 and the second sheet region S2 across the notch C by the operation of the linear motor 76. Next, as shown in FIG. 5C, the chuck 41 and the holding unit 11 are moved via the driving unit 40 and the like so that the peeling tape PT and the wafer W relatively move in the opposite directions. According to this embodiment, it is possible to perform the peeling by omitting the step of rotating the holding means 11.

[Fourth Embodiment]
In FIG. 6, in the fourth embodiment, the adhesive sheet S in which the intersection E is provided on the other end P side of the notch C and the rotation separation promoting portion C <b> 1 that is bent obliquely in the lower left direction in FIG. Be targeted. In the embodiment, when the periphery of the other end P of the adhesive sheet S is peeled off, the center P0 of the rotational movement of the holding means 11 is set to the intersection point E, and other than that, the peeling of the adhesive sheet S is the same as in the first embodiment. Is performed (see FIGS. 6B to 6E). According to the present embodiment, since the rotation peeling promoting portion C1 is formed, the peeling region gradually expands when the periphery of the other end P of the cut C is peeled by the rotation of the holding means 11. Therefore, it can suppress that peeling resistance becomes large rapidly, and it can prevent that the adhesive sheet S is divided | segmented by a crack arising from the other end P. In addition, you may comprise the rotation peeling promotion part C1 by a curve other than a straight line.

[Fifth Embodiment]
7A, in the fifth embodiment, an auxiliary notch CA extending in the vertical direction in the figure is formed in addition to the notch C similar to that of the fourth embodiment. Both ends of the auxiliary cut CA do not reach the outer edge of the adhesive sheet S, and are formed with a rotation peeling promotion part CA1 having the same shape as the rotation peeling promotion part C1 of the fourth embodiment. For peeling off the adhesive sheet S, the chuck 41 and the holding means 11 are moved via the driving means 40 and the like so that the peeling tape PT and the wafer W are relatively moved in the opposite directions in the direction of the arrow in FIG. Thereby, each sheet | seat area | region divided by the notch | incision C and auxiliary | assistant incision CA can be made to peel in the state connected in series. In addition, you may comprise the rotation peeling promotion part C1 by a curve, as FIG. 7 (B) shows. Even in this case, it is possible to prevent the adhesive sheet S from being divided, as in the fourth embodiment, by forming the rotation peeling promotion portions C1 and CA1.

[Sixth Embodiment]
In FIG. 8, in the sixth embodiment, a cut C is formed as in the first embodiment, and a peeling tape PT is affixed to a corner CN where the cut C and the outer edge of the first sheet region S1 intersect. To do. Thereby, the peeling force in the initial stage of peeling can be reduced, and peeling failure can be prevented more effectively.

[Seventh Embodiment]
In FIG. 9, in the seventh embodiment, the cut C is formed in a spiral shape, one end of the cut C reaches the outer edge of the adhesive sheet S, and the other end P of the cut C is near the in-plane center of the adhesive sheet S. It is formed to become. To peel off the adhesive sheet S, the peeling tape PT is cut and pasted between one end of the C and the outer edge of the adhesive sheet S, and then the peeling tape PT and the wafer W are relatively opposite to each other in the direction of the arrow in FIG. The chuck 41 and the holding unit 11 are moved via the driving unit 40 and the like so as to move.

[Eighth Embodiment]
In FIG. 10, in the eighth embodiment, the cut C is formed in a V shape in plan view having a bent portion C <b> 1, is formed so as to be within the surface of the adhesive sheet S, and the first cut across the cut C. The sheet area S1 and the second sheet area S2 are detachable. Two chucks 41 for holding the peeling tape PT are provided. Then, as shown in FIG. 10A, the peeling tape PT held by these chucks 41 is bonded to the first and second sheet regions S1 and S2. Next, after the floating prevention means 66 is moved onto the second sheet region S2, as shown in FIG. 10B, the peeling tape PT attached to the first sheet region S1 and the wafer W are moved in opposite directions. Move relative to. Next, the floating prevention means 66 is retracted from the holding means 11 and the peeling tape PT and the wafer W are relatively moved in the opposite directions in the direction of the arrow in FIG. Stripping of S1 and S2 is performed.

[Ninth Embodiment]
In FIG. 11, in the ninth embodiment, first, a peeling tape PT is applied to the first sheet region S1, and after the first sheet region S1 is peeled to each end of the cut C, the second sheet region S2 is removed. A peeling tape PT is pasted in the vicinity of the bent portion C1. Then, the peeling tape PT and the wafer W are relatively moved in the opposite directions in the direction of the arrow in FIG. 11B, and the first and second sheet regions S1 and S2 are peeled off.

[Tenth embodiment]
In FIG. 12, in the tenth embodiment, first, the release tape PT is attached to the left end side of the second sheet region S2, and then the release of the release tape PT by the chuck 41 is released, and the right end of the first sheet region S1 is released. Adhere the release tape PT on the side. Next, after the first sheet region S1 is peeled to a position where the respective peeling tapes PT overlap, both the two peeling tapes PT are held by the chuck 41 (see FIG. 12B). Then, the peeling tape PT and the wafer W are relatively moved in the opposite directions in the direction of the arrow in FIG. 12C to peel off the first and second sheet regions S1 and S2.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.
Therefore, the description limited to the shape disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded one part or all part is included in this invention.

  As long as only one end reaches the outer edge of the adhesive sheet S, the number of the cuts C formed, the forming position, and the shape can be variously changed such as a curved shape. For example, as shown in FIG. 13 (A), two cuts C may be formed, and one end of each of the cuts C may be the same as the left end of the adhesive sheet S in the figure. In this case, as shown in FIG. 13 (B), first, the first and third sheet regions S1 and S3 are cut in the direction of the arrow in the drawing and peeled to the vicinity of the other end P of FIG. As shown in FIG. 1, the first and third sheet regions S1 and S3 are peeled in the direction of the arrows in the drawing. Thereafter, as shown in FIG. 13D, the second sheet region S2 is also peeled off, and the first to third sheet regions S1 to S3 are moved relative to the wafer W in the opposite direction to peel off the adhesive sheet S. Do.

  Further, as shown in FIG. 14, the length of the cut C may be set shorter than the radius of the base sheet B in the right region of the adhesive sheet S in the figure. At this time, as shown in FIG. 5A, the peeling tape PT is attached to the first and second sheet regions S1 and S2 sandwiching the cut C and including the corner portion CN. Driving means 40 so that the peeling tape PT and the wafer W move relative to each other in a direction in which the peeling tape PT is separated from the notch C in a plan view, that is, in the arrow direction (first direction) in FIGS. Primary peeling is performed by moving the chuck 41 and the holding means 11 through the like. After the adhesive sheet S is peeled to the vicinity of the other end P of the cut C by this primary peeling, the relative movement direction of the peeling tape PT and the wafer W is parallel to the cut C as shown in FIG. That is, the secondary peeling which peels by changing to the left-right direction (2nd direction) in the figure is performed, and the adhesive sheet S is peeled completely. According to this, it is possible to reduce peeling resistance by primary peeling at the beginning of peeling and prevent peeling failure. In secondary peeling, peeling can be performed in a direction in which the force required for peeling is reduced. In the case of performing the peeling shown in the figure, two chucks 41 for gripping the peeling tape PT and two driving devices (not shown) for driving the chucks may be provided.

  Furthermore, the adherend in the present invention is not limited to a semiconductor wafer, and other adherends such as a glass plate, a steel plate, or a resin plate can also be targeted. It may be a wafer or a compound wafer.

Moreover, the peeling operation | movement of the adhesive sheet S may stop the operation | movement of the chuck | zipper 41 and may move the holding means 11 as long as peeling can be performed as mentioned above, and conversely, the operation | movement of the holding means 11 is stopped, The chuck 41 may be moved.
Further, a pressure-sensitive adhesive tape may be adopted as the peeling tape PT.
Further, the tape cutting means 34 for cutting the peeling tape PT is not an essential requirement.
Further, the levitation preventing means 16 may be constituted by blown air, and another adjacent divided sheet may be pressed to the wafer W side through the notch C.

DESCRIPTION OF SYMBOLS 10 Sheet peeling apparatus 12 Feeding means 14 Sticking means 15 Moving means 16 Lift prevention means 17 Reinforcement tape sticking means AD Adhesive layer B Base material sheet C Cut CN Corner part LT Reinforcement tape PT Stripping tape S Adhesive sheet W Semiconductor wafer Kimono)

Claims (12)

In the sheet peeling apparatus for peeling the adhesive sheet attached to one surface of the adherend from the adherend via the peeling tape,
The adhesive sheet includes a base sheet and an adhesive layer provided on one surface of the base sheet, and a notch that reaches only one end is formed on the outer edge of the base sheet and is peeled as a plurality of sheet regions. Is possible,
A feeding means for feeding the peeling tape; a sticking means for sticking the peeling tape to the adhesive sheet; and a moving means capable of peeling the adhesive sheet by relatively moving the adherend and the peeling tape. A sheet peeling apparatus.   The sheet peeling apparatus according to claim 1, further comprising a reinforcing tape attaching unit that attaches a reinforcing tape to the other end side region of the cut.   The sheet peeling apparatus according to claim 1 or 2, further comprising a detection unit that detects the cut and provided so that a sticking position of the peeling tape by the sticking unit can be determined based on a detection result of the detection unit. .   The moving means performs primary peeling that performs the relative movement in the first direction, and then peels the adhesive sheet by performing secondary peeling that performs the relative movement in a second direction different from the first direction. The sheet peeling apparatus according to any one of claims 1 to 3. In the sheet peeling apparatus for peeling the adhesive sheet attached to one surface of the adherend from the adherend via the peeling tape,
The adhesive sheet is provided with a base sheet and an adhesive layer provided on one surface of the base sheet, and incisions are formed in the surface of the adhesive sheet so as to be peeled as a plurality of sheet regions.
A feeding means for feeding out the peeling tape;
An affixing means for affixing a peeling tape to the adhesive sheet;
A sheet peeling apparatus comprising: a moving means capable of peeling an adhesive sheet by relatively moving an adherend and a peeling tape.   6. The method according to any one of claims 1 to 5, further comprising an anti-floating means capable of restricting other divided sheets adjacent to the separated sheet to be separated from the separated sheet with the cut. Sheet peeling device.   7. The positioning apparatus according to claim 1, further comprising positioning means capable of positioning by adjusting a relative position between the adherend and the attaching means in a plane parallel to one surface of the adherend. The sheet peeling apparatus in any one.   The sheet peeling apparatus according to any one of claims 1 to 7, further comprising a rotating means for relatively rotating the adherend and the peeling tape attached to the adhesive sheet. In the sheet peeling method of peeling the adhesive sheet affixed to one surface of the adherend from the adherend via the peeling tape,
The adhesive sheet includes a base sheet and an adhesive layer provided on one surface of the base sheet, and a notch that reaches only one end is formed on the outer edge of the base sheet and is peeled as a plurality of sheet regions. Is possible,
A step of pasting the drawn-off peeling tape to the adhesive sheet;
The sheet peeling method characterized by performing the process of peeling an adhesive sheet by making a to-be-adhered body and the peeling tape move relatively.   The sheet peeling method according to claim 9, wherein a step of applying a reinforcing tape to the other end side region of the cut is performed before the step of peeling. In the sheet peeling method of peeling the adhesive sheet affixed to one surface of the adherend from the adherend via the peeling tape,
The adhesive sheet is provided with a base sheet and an adhesive layer provided on one surface of the base sheet, and incisions are formed in the surface of the adhesive sheet so as to be peeled as a plurality of sheet regions.
A step of pasting the drawn-off peeling tape to the adhesive sheet;
The sheet peeling method characterized by performing the process of peeling an adhesive sheet by making a to-be-adhered body and the peeling tape move relatively.   The adhesive sheet is peeled in a state where the other sheet area is pressed against the adherend side so as to restrict the other sheet area adjacent to the peeled sheet area from being accompanied by the notch. The sheet peeling method according to claim 9, 10 or 11.

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