JP5421747B2 - Sheet peeling apparatus and peeling method - Google Patents

Description

  The present invention relates to a sheet peeling apparatus and a peeling method, and more specifically, a sheet capable of sticking a peeling tape to an adhesive sheet attached to an adherend and peeling the adhesive sheet through the peeling tape. The present invention relates to a peeling apparatus and a peeling method.

  A semiconductor wafer (hereinafter, sometimes simply referred to as “wafer”) has a protective adhesive sheet attached to its circuit surface, and the adhesive sheet is peeled off after various processes such as back grinding. An example of such an adhesive sheet peeling apparatus is disclosed in Patent Document 1. In the same document, the step of peeling the adhesive sheet from the wafer is performed by relatively moving the peeling tape and the wafer after the peeling tape is attached to the adhesive sheet.

JP 2004-165570 A

  By the way, recently, since the diameter of the wafer tends to increase, the size of the adhesive sheet increases accordingly. For this reason, when peeling as in Patent Document 1, a large peeling force is required when peeling the adhesive sheet, and the peeling tape is extended or cut at the time of peeling, resulting in frequent inconvenience of peeling failure. is there.

[Object of invention]
The objective of this invention is providing the sheet peeling apparatus and peeling method which can prevent that the peeling defect of an adhesive sheet generate | occur | produces.

In order to achieve the above object, the present invention provides a sheet peeling apparatus for peeling an adhesive sheet attached to one surface of an adherend from the adherend via a peeling tape.
The adhesive sheet includes a base sheet and an adhesive layer provided on one surface of the base sheet,
Cutting means for forming cuts in the base material sheet or base material sheet and adhesive layer, feeding means for feeding out the peeling tape, sticking means for sticking the peeling tape to the adhesive sheet, adherend and peeling A moving means capable of peeling the adhesive sheet by relatively moving the tape,
It said cutting means, while the one end reaches the outer edge of the base sheet, by forming a notch and the other end positioned in the plane of the substrate sheet is controlled so as to divide the both sides of the cut, and adopts a configuration that, that are controlled so as to form a rotating separation promoting unit and the other end side of the incision as curved or bent shape.

Further, the present invention provides a sheet peeling apparatus for peeling an adhesive sheet affixed to one surface of an adherend from the adherend via a peeling tape,
The adhesive sheet includes a base sheet and an adhesive layer provided on one surface of the base sheet,
Cutting means for forming cuts in the base material sheet or base material sheet and adhesive layer, feeding means for feeding out the peeling tape, sticking means for sticking the peeling tape to the adhesive sheet, adherend and peeling A moving means capable of peeling the adhesive sheet by relatively moving the tape,
The cutting means is controlled such that one end reaches the outer edge of the base sheet, while the other end forms a cut located in the plane of the base sheet, so as to separate both sides sandwiching the cut,
A configuration in which a reinforcing tape attaching means for attaching a reinforcing tape to the other end side region of the notch is further provided.

Furthermore, the present invention provides a sheet peeling method for peeling an adhesive sheet affixed to one surface of an adherend from the adherend via a peeling tape.
The adhesive sheet includes a base sheet and an adhesive layer provided on one surface of the base sheet,
By forming a cut in the base sheet or the base sheet and the adhesive layer, one end of which reaches the outer edge of the base sheet, while the other end is located in the plane of the base sheet, both sides sandwiching the cut Dividing and forming the rotation peeling promoting portion with the other end side of the cut as a curved or bent shape; and
A step of feeding out the peeling tape;
A step of pasting the drawn-off peeling tape to the adhesive sheet;
The method of performing the process of peeling an adhesive sheet by making a to-be-adhered body and the peeling tape move relatively is taken.

Further, the present invention provides a sheet peeling method for peeling an adhesive sheet affixed to one surface of an adherend from the adherend via a peeling tape,
The adhesive sheet includes a base sheet and an adhesive layer provided on one surface of the base sheet,
By forming a cut in the base sheet or the base sheet and the adhesive layer, one end of which reaches the outer edge of the base sheet, while the other end is located in the plane of the base sheet, both sides sandwiching the cut A process of dividing;
After forming the notch, attaching a reinforcing tape to the other end side region of the notch,
A step of feeding out the peeling tape;
A step of pasting the drawn-off peeling tape to the adhesive sheet;
A method of performing a step of peeling the adhesive sheet by relatively moving the adherend and the peeling tape is also employed.

  According to the present invention, since the cut is formed in the adhesive sheet to form a plurality of sheet regions, the separation can be performed for each sheet region. Since each sheet region is made smaller than the entire adhesive sheet, it is possible to reduce the force required for peeling compared to the peeling of the entire adhesive sheet not having a cut. As a result, even if the adherend is a wafer having a large diameter, it is possible to prevent the peeling tape from extending or cutting, and to avoid occurrence of defective peeling.

  Further, when the rotation peeling promoting portion is formed, when the adherend and the peeling tape are relatively rotated to peel the other end side region of the cut, it is easy to perform peeling that proceeds along the rotation direction. Can do.

  Furthermore, when a reinforcing tape is attached, when the other end side region of the cut is peeled off, a crack is generated from the other end side to prevent the adhesive sheet from being separated, thereby preventing occurrence of poor peeling of the adhesive sheet. It becomes possible to do.

The schematic front view which carried out partial cross-sectional view of the sheet peeling apparatus which concerns on reference embodiment. The partial cross-sectional enlarged view of a cutting | disconnection means and its periphery. The longitudinal cross-sectional view of FIG. (A)-(C) are peeling operation explanatory drawings of an adhesive sheet. (A)-(E) are peeling operation explanatory drawing of the adhesive sheet which concerns on reference embodiment. Explanatory drawing of the adhesive sheet which concerns on 1st Embodiment. (A)-(C) are peeling operation | movement explanatory drawings of the adhesive sheet which concerns on 2nd Embodiment. (A)-(E) are peeling operation explanatory drawing of the adhesive sheet which concerns on 3rd Embodiment. (A) And (B) is peeling operation explanatory drawing of the adhesive sheet which concerns on 4th Embodiment.

Hereinafter, after description of a reference embodiment, an embodiment of the present invention will be described with reference to the drawings.
In this specification, unless otherwise specified, “up”, “down”, “left”, and “right”
FIG. 1 is used as a reference.

[ Reference embodiment]
1 to 4, the sheet peeling apparatus 10 includes a holding unit 11 that holds a wafer W as an adherend, a feeding unit 12 that feeds a strip-shaped peeling tape PT, and a circuit surface of the wafer W. The affixing means 14 for affixing the peeling tape PT to the adhesive sheet S affixed to the surface (upper surface) and the peeling tape PT affixed to the adhesive sheet S and the wafer W held by the holding means 11 are moved relative to each other. A moving means 15, a cutting means 16 capable of forming a cut in the adhesive sheet S attached to the wafer W, a joining tape attaching means 17 for attaching the joining tape LT to the adhesive sheet S, and a floating prevention means 18 are provided. It is configured. In this embodiment, the peeling tape PT is a heat-sensitive adhesive tape. The adhesive sheet S includes a base sheet B and an adhesive layer AD provided on one surface, that is, the lower surface of the base sheet B, and is attached to the upper surface of the wafer W via the adhesive layer AD. ing.

  The holding means 11 is composed of a table for adsorbing and holding the wafer W integrated with the ring frame RF on the upper surface from the dicing sheet DS side.

  The feeding means 12 supports a peeling tape PT that is supported and wound by a frame (not shown), a support shaft 21 that is rotatable via a motor M1, and a driving roller 22 that is rotatable via a motor M2. A pinch roller 23 that sandwiches the peeling tape PT between the drive roller 22, a plate-like guide member 25 that supports the peeling tape PT from below in FIG. A rotatable press roller 27 that sandwiches the PT and an elevating cylinder 28 that raises and lowers the press roller 27 are provided. The guide member 25 is provided so as to be movable in the left-right direction in FIG. 1 via the cylinder 29. As shown in FIG. 4A, the lead end region of the peeling tape PT sandwiched between the press rollers 27 will be described later. It can be guided to a position where it can be gripped by the chuck 41.

  The sticking means 14 includes a linear motion motor 31 and a pressing head 32 having a heater 32A provided by the linear motion motor 31 so as to advance and retract in the vertical direction. The affixing means 14 adheres the peeling tape PT to the adhesive sheet S by pressing and heating the peeling tape PT fed to the upper surface side of the adhesive sheet S with the pressing head 32 by a chuck 41 described later. It has become. A tape cutting means 34 is provided on the left side of the sticking means 14. The tape cutting means 34 includes a cutter blade 35, a tape receiving plate 36 provided on the lower side of the cutter blade 35 and having a concave portion on the upper surface, and a vertical cylinder 37 for moving the cutter blade 35 in the vertical direction. It comprises a cutting cylinder 38 for moving the cutter blade 35 in the direction perpendicular to the plane of the drawing in FIG.

  The moving means 15 includes a driving means 40 that movably supports the holding means 11 and a chuck 41 that is provided below the sticking means 14 and can hold the peeling tape PT with a holding member 41A. The driving means 40 is provided so as to be able to position the wafer W by moving the holding means 11 in the direction orthogonal to the paper surface in FIG. Here, the drive means 40 constitutes a positioning means and a rotation means. The chuck 41 is configured to be movable in the left-right direction in FIG. 1 via a driving device (not shown).

  As shown in FIGS. 2 and 3, the cutting means 16 supports a disk-shaped cutter blade 43 whose outer edge is a cutting blade, a rotation motor 44 that rotates the cutter blade 43, and a rotation motor 44. A possible interval holding means 45, an articulated robot 46 that supports the interval holding means 45 and moves the cutter blade 43, and a camera 47 are provided.

  The interval holding means 45 includes a sensor 53 as a detecting means provided on the lower surface side of the rotation motor 44, a linear motion motor 54 having an output shaft 54A connected to the rotation motor 44, and the linear motion motor 54. 2, a roller 57 that is provided on both left and right sides in FIG. 2 and that can roll on the adhesive sheet S, and a damper 59 that is provided on the upper surface of the frame 56. And. While the adhesive sheet S is being cut by the cutter blade 43, the sensor 53 is provided so as to be able to detect a vertical distance D1 between the reference surface 53A serving as the lower end surface and the upper surface of the wafer W. The vertical distance between the reference surface 53A of the sensor 53 and the rotation center position of the cutter blade 43 is kept constant as the distance D2. As shown in FIG. 3, the sensor 53 is provided at a position away from the rotation center of the cutter blade 43 by a distance D3 on the downstream side in the moving direction when the cutter blade 43 is cut. The linear motion motor 54 can move the output shaft 54 </ b> A up and down to raise and lower the sensor 53, the cutter blade 43, and the rotation motor 44. Further, the direct acting motor 54 is provided so that the moving direction and the moving amount of the output shaft 54A can be adjusted based on the detection result of the sensor 53. The damper 59 is detachably provided on the articulated robot 46 via the arm holder 60 and is provided so as to be able to absorb the vibration of the frame 56.

  The articulated robot 46 includes a base 62, an articulated arm 63 that can be rotated by position-controllable motors provided on the upper surface of the base 62, and the articulated arm. 63 is a so-called six-axis robot provided with a holding chuck 64 attached to the free end side of 63, and the holding chuck 64 can be moved in any position and in any direction within the work area. The holding chuck 64 includes a pair of chuck claws 64 </ b> A that can be separated from each other, and the chuck claws 64 </ b> A can be engaged with and disengaged from the arm holder 60.

  The camera 47 is provided so as to be able to recognize the position of the cutting edge of the cutter blade 43 by imaging the outer peripheral area of the rotating cutter blade 43, and the distance D4 from the rotation center position of the cutter blade 43 to the cutting edge (see FIG. 3). Can be measured.

  The reinforcing tape affixing means 17 is a supply means 72 that can be folded and peeled off by the peel plate 70 in the middle of feeding the strip-shaped release sheet RL, and the reinforcing tape LT temporarily attached to the release sheet RL can be peeled and supplied one by one. The pressing means 73 is configured to press and stick the reinforcing tape LT supplied from the supplying means 72. The pressing means 73 includes a suction head 75 capable of sucking and holding the reinforcing tape LT with the lower surface serving as a suction surface, and a linear motion motor 76 that moves the suction head 75 up and down.

  The levitation preventing means 18 includes an arm holder 67 having the same configuration as the arm holder 60, and a plate-like pressing member 68 that is connected to the arm holder 67 and can be positioned along the notch C. The joint claw 46A of the joint robot 46 can be engaged / disengaged.

  Next, the cutting method and peeling method of the adhesive sheet S in the sheet peeling apparatus 10 will be described with reference to FIGS.

  First, the peeling tape PT is pulled out from the support shaft 21, passed between the drive roller 22 and the pinch roller 23, sandwiched between the press roller 27 and the guide member 25, and the lead end side protrudes from the tip of the guide member 25. Is done. Then, the adhesive sheet S is pasted via a conveying means (not shown), and the wafer W integrated with the ring frame RF is attracted and held on the upper surface of the holding means 11 via the dicing sheet DS. Next, the articulated robot 46 is operated so that the cutter blade 43 is positioned on the front side of the camera 47. In this state, while rotating the cutter blade 43 by operating the rotation motor 44, the cutting edge of the cutter blade 43 is imaged by the camera 47, and the distance D4 is measured and stored in a control means (not shown).

  Next, when the cut C as shown in FIG. 5A is formed in the adhesive sheet S, the outer edge of the base material sheet B that becomes the cutting start position of the cut C by the operation of the articulated robot 46 (the right end in the figure). The cutter blade 43 is moved to the edge. Thereafter, the articulated robot 46 is operated to move the cutter blade 43 in the direction substantially parallel to the upper surface of the base sheet B and to the left in FIG. At this time, each roller 57 rolls on the adhesive sheet S, and the rotation motor 44 is operated to rotate the cutter blade 43. Then, before the cutter blade 43 reaches the outer edge (left end edge in the figure) of the base sheet B, the movement of the cutter blade 43 by the articulated robot 46 is stopped. As a result, a notch C is formed in which only one end (the right end in the figure) reaches the outer edge of the base sheet B, and the other end P of the notch C does not reach the outer edge of the base sheet B. Will come to be located. By forming the cut C, a plurality of first sheet areas S1 (sheet areas located in the lower part of the figure) and second sheet areas S2 (sheet areas located in the upper part of the figure) sandwiching the cuts C are provided. Sheet region is formed.

Here, during the cutting of the adhesive sheet S, the vertical distance D between the lowermost edge of the cutter blade 43 and the upper surface of the wafer W is adjusted in real time based on the detection result of the sensor 53.
Specifically, while the adhesive sheet S is being cut, the sensor 53 always detects the distance D1, and the detection result of the distance D1 and the distance D2 and the distance D4 use the control means (not shown) to The distance D is obtained from the equation (1).
D = D1 + D2-D4 (1)
Further, the control means obtains the time during which the lowermost edge of the cutter blade 43 passes after the sensor 53 passes, based on the moving speed in the cutting direction of the cutter blade 43 by the articulated robot 46 and the distance D3. Then, the linear motion motor 54 is controlled to be displaced so that the distance D becomes a predetermined distance at the timing when the obtained time has elapsed after the sensor 53 passes, and the cutter blade 43 is displaced. Note that the predetermined distance is input in advance to a control means (not shown) by the operator. Thereby, the distance D is maintained at a predetermined distance in the entire area of the cut C. The cut C may have a depth that does not divide the base sheet B so that the cutting edge of the cutter blade 43 does not contact the upper surface of the wafer W, or may have a depth that divides the base sheet B. The depth reaching the adhesive layer AD may be sufficient.

Note that the predetermined distance may be set to “0” or minus several μm only at the right end in FIG. 5A of the notch C that is the initial site of peeling of the adhesive sheet S. In such a setting, the cutting edge of the cutter blade 43 comes into contact with the upper surface of the wafer W when cutting the right end of the cutting C in the same figure, and the cutting C is performed in all the thickness directions of both the base material sheet B and the adhesive layer AD. And a cut C having a depth reaching the wafer W is formed. Thereby, in the initial stage of peeling of the first sheet region S1, the edge cutting with the adjacent second sheet region S2 can be reliably performed through the cut C, and the sheet regions S1 and S2 can be prevented from being peeled off simultaneously. .

  After the formation of the cut C is completed, the articulated robot 46 is operated to retract the cutter blade 43 to a predetermined position, and the holding chuck 64 is detached from the arm holder 60 and connected to the arm holder 67 of the anti-lifting means 66.

  Next, as shown in FIG. 4A, the guide member 25 is advanced in the right direction in the figure via the cylinder 29, and at the same time, the motor M2 is operated to rotate the driving roller 22 to release the peeling tape PT. To pay out. As a result, the guide member 25 and the lead end side of the peeling tape PT are positioned between the gripping members 41 </ b> A of the chuck 41. When the press roller 27 is retracted upward and the guide member 25 is retracted, the peeling tape PT is left between the gripping members 41A and is gripped by the operation of the chuck 41. Thereafter, the chuck 41 is moved to a position indicated by a two-dot chain line in FIG. 4A by a driving device (not shown), the peeling tape PT is pulled out, and the peeling tape PT is peeled so as to face the adhesive sheet S below the pressing head 32. The tape PT is positioned.

  Next, as shown in FIG. 4B, when the pressing head 32 is moved downward by the linear motor 31, the peeling tape PT is pressed down, and the peeling tape PT is heated by the heater 31A to be the first. Adhere to the sheet region S1. Thereafter, the peeling tape PT is sandwiched between the press roller 27 and the guide member 25, and the cylinders 37 and 38 are operated to cut the peeling tape PT with the cutter blade 35 on the tape receiving plate 36.

  Thereafter, by the operation of the articulated robot 46, the pressing member 68 is placed on the second sheet region S2 so that the pressing member 68 is positioned along the notch C as shown by a two-dot chain line in FIG. Make contact.

  Thereafter, as shown in FIG. 4C and FIG. 5B, the driving means 40 and the like so that the peeling tape PT attached to the first sheet region S1 and the wafer W are relatively moved in the opposite direction. By moving the chuck 41 and the holding means 11 via the first sheet region, the separation of the first sheet region S1 proceeds. At this time, even if the base sheet B and the adhesive layer AD in each of the sheet regions S1 and S2 are connected without being completely separated in the cut C, the pressing member 68 is pressing the second sheet region S2. Thus, the second sheet region S2 can be prevented from lifting up following the first sheet region S1.

  Then, as shown in FIG. 5B, after the first sheet region S1 is peeled to the other end P of the cut C, the progress of the peeling is stopped. Next, by the operation of the articulated robot 46, the floating prevention means 66 is retracted from the second sheet region S2. Next, the holding means 11 is rotated by the driving means 40 around the other end P as the rotation center, and the wafer W is rotated 360 ° to peel off the adhesive sheet S around the other end P (FIGS. 5C and 5C). D)). Thereafter, as shown in FIG. 5E, the chuck 41 and the holding means 11 are moved via the driving means 40 so that the peeling tape PT and the wafer W are relatively moved in the opposite directions. The second sheet region S2 is peeled through the peeling tape P and the peeled first sheet region S1.

  After the peeling of the adhesive sheet S is completed, the peeled adhesive sheet S and the peeling tape PT attached thereto are collected by a collecting means (not shown). Further, the wafer W is transferred to the next process by a transfer means (not shown). Then, after the holding means 11 and the chuck 41 are returned to the initial positions, and the holding chuck 64 in the multi-joint robot 46 is changed from the floating prevention means 66 to the cutter blade 43 and the like, the same operation as described above is repeated.

Therefore, according to such a reference embodiment, the adhesive sheet S is divided into two parts to reduce the size.
It can peel for every sheet | seat area | region S1 and 2nd sheet | seat area | region S2. Thereby, compared with the case where the adhesive sheet S that is not divided is peeled off, the tensile force generated in the peeling tape PT at the time of peeling can be reduced, and the peeling failure caused by the extending or cutting of the peeling tape PT. Can be prevented.

Next, a description will be given implementation of the invention. In the following description, each embodiment uses the same sheet peeling apparatus 10 as the reference embodiment, and changes the formation position of the cut C and / or the peeling method of the adhesive sheet S. Therefore, the same reference numerals are used for the same or equivalent components as in the above-described reference embodiment, and overlapping descriptions or similar descriptions are omitted or simplified.

[ First Embodiment]
In FIG. 6, in the first embodiment, after forming the cut C as in the reference embodiment, the gap between the other end P of the cut C and the left end of the adhesive sheet S is stopped just below the suction head 75. The holding means 11 is moved by the driving means 40. Next, when the suction head 75 is moved downward by the linear motion motor 76, the reinforcing tape LT is stuck between the other end P and the left end of the adhesive sheet S. After sticking the reinforcing tape LT, the same as in the first embodiment. The adhesive sheet S is peeled off. According to the present embodiment, when the periphery of the other end P of the notch C is peeled, a crack is generated from the other end P and the adhesive sheet is divided, thereby preventing the occurrence of defective peeling of the adhesive sheet S. It becomes possible.

[ Second Embodiment]
In FIG. 7, in the second embodiment, a cut C is formed as in the reference embodiment, and after the first sheet region S1 is peeled to the vicinity of the other end P, the progress of the peeling is stopped. Thereafter, the holding unit 11 is moved by the driving unit 40 so that the gap between the other end P of the notch C and the left end of the adhesive sheet S stops just below the suction head 75. Next, the reinforcing tape LT is applied to the first sheet region S1 and the second sheet region S2 across the notch C by the operation of the linear motor 76. Next, as shown in FIG. 7C, the chuck 41 and the holding unit 11 are moved via the driving unit 40 and the like so that the peeling tape PT and the wafer W are relatively moved in the opposite directions. According to this embodiment, it is possible to perform the peeling by omitting the step of rotating the holding means 11.

[ Third Embodiment]
In FIG. 8, in 3rd Embodiment, the intersection E is provided in the other end P side of the notch C, and the rotation peeling promotion part C1 bent in the diagonally lower left direction in FIG. 8 (A) is formed. In the same embodiment, when the periphery of the other end P of the adhesive sheet S is peeled off, the center P0 of the rotational movement of the holding means 11 is set to the intersection point E. Otherwise, the adhesive sheet S is peeled off as in the reference embodiment. (See FIGS. 8B to 8E). According to the present embodiment, since the rotation peeling promoting portion C1 is formed, the peeling region gradually expands when the periphery of the other end P of the cut C is peeled by the rotation of the holding means 11. Therefore, it can suppress that peeling resistance becomes large rapidly, and it can prevent that the adhesive sheet S is divided | segmented by a crack arising from the other end P. In addition, you may comprise the rotation peeling promotion part C1 by a curve other than a straight line.

[ Fourth Embodiment]
9A, in the fourth embodiment, in addition to the notch C similar to that of the third embodiment, an auxiliary notch CA extending in the vertical direction in the figure is formed. Both ends of the auxiliary cut CA do not reach the outer edge of the adhesive sheet S, and form a rotation peeling promotion part CA1 having the same shape as the rotation peeling promotion part C1 of the third embodiment. For peeling off the adhesive sheet S, the chuck 41 and the holding means 11 are moved via the driving means 40 and the like so that the peeling tape PT and the wafer W are relatively moved in the opposite directions in the direction of the arrow in FIG. Thereby, each sheet | seat area | region divided by the notch | incision C and auxiliary | assistant incision CA can be made to peel in the state connected in series. In addition, you may comprise the rotation peeling promotion part C1 by a curve, as FIG. 9 (B) shows. Even in this case, it is possible to prevent the adhesive sheet S from being divided, as in the fourth embodiment, by forming the rotation peeling promoting portions C1 and CA1.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.
Therefore, the description limited to the shape disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded one part or all part is included in this invention.

The cut C number formation, the formation position and shape, as long as only one end reaches the outer edge of the adhesive sheet S, Ru etc. Various modification may be to the curve.

  Furthermore, the adherend in the present invention is not limited to a semiconductor wafer, and other adherends such as a glass plate, a steel plate, or a resin plate can also be targeted. It may be a wafer or a compound wafer.

  Further, the cutter blade 43 can be variously changed in design, and a cutter blade or the like whose plane shape forms a sharp angle may be used.

  Further, the holding means 11 is provided so as to be movable in the surface direction of the adhesive sheet S, and the holding means 11 is moved in a state where the operation of the articulated robot 46 is stopped until the cutter blade 43 reaches the end position from the cutting start position. The cutter blade 43 and the wafer W may be moved relative to each other, or the adhesive sheet S may be cut by simultaneously operating the articulated robot 46 and moving the holding means 11.

Moreover, the peeling operation | movement of the adhesive sheet S may stop the operation | movement of the chuck | zipper 41 and may move the holding means 11 as long as peeling can be performed as mentioned above, and conversely, the operation | movement of the holding means 11 is stopped, The chuck 41 may be moved.
Further, a pressure-sensitive adhesive tape may be adopted as the peeling tape PT.
Further, the tape cutting means 34 for cutting the peeling tape PT is not an essential requirement.
Further, the levitation preventing means 18 may be constituted by blown air, and another adjacent sheet region may be pressed to the wafer W side through the notch C.

DESCRIPTION OF SYMBOLS 10 Sheet peeling apparatus 12 Feeding means 14 Sticking means 15 Moving means 16 Cutting means 17 Reinforcing tape sticking means 18 Lift prevention means 40 Driving means (positioning means, rotating means)
AD adhesive layer B base material sheet C cut C1, CA1 rotation peeling promotion part CN corner part LT reinforcing tape PT peeling tape S adhesive sheet S1 to S4 1st to 4th sheet area (sheet area)
W Semiconductor wafer (adherence)

Claims (4)

In the sheet peeling apparatus for peeling the adhesive sheet attached to one surface of the adherend from the adherend via the peeling tape,
The adhesive sheet includes a base sheet and an adhesive layer provided on one surface of the base sheet,
Cutting means for forming cuts in the base material sheet or base material sheet and adhesive layer, feeding means for feeding out the peeling tape, sticking means for sticking the peeling tape to the adhesive sheet, adherend and peeling A moving means capable of peeling the adhesive sheet by relatively moving the tape,
It said cutting means, while the one end reaches the outer edge of the base sheet, by forming a notch and the other end positioned in the plane of the substrate sheet is controlled so as to divide the both sides of the cut, and the sheet peeling apparatus according to claim Rukoto is controlled so as to form a rotating separation promoting unit and the other end side of the incision as curved or bent shape. In the sheet peeling apparatus for peeling the adhesive sheet attached to one surface of the adherend from the adherend via the peeling tape,
The adhesive sheet includes a base sheet and an adhesive layer provided on one surface of the base sheet,
Cutting means for forming cuts in the base material sheet or base material sheet and adhesive layer, feeding means for feeding out the peeling tape, sticking means for sticking the peeling tape to the adhesive sheet, adherend and peeling A moving means capable of peeling the adhesive sheet by relatively moving the tape,
The cutting means is controlled such that one end reaches the outer edge of the base sheet, while the other end forms a cut located in the plane of the base sheet, so as to separate both sides sandwiching the cut,
The sheet peeling apparatus according to claim 1, further comprising reinforcing tape applying means for applying a reinforcing tape to the other end side region of the cut . In the sheet peeling method of peeling the adhesive sheet affixed to one surface of the adherend from the adherend via the peeling tape,
The adhesive sheet includes a base sheet and an adhesive layer provided on one surface of the base sheet,
By forming a cut in the base sheet or the base sheet and the adhesive layer, one end of which reaches the outer edge of the base sheet, while the other end is located in the plane of the base sheet, both sides sandwiching the cut Dividing and forming the rotation peeling promoting portion with the other end side of the cut as a curved or bent shape; and
A step of feeding out the peeling tape;
A step of pasting the drawn-off peeling tape to the adhesive sheet;
The sheet peeling method characterized by performing the process of peeling an adhesive sheet by making a to-be-adhered body and the peeling tape move relatively. In the sheet peeling method of peeling the adhesive sheet affixed to one surface of the adherend from the adherend via the peeling tape,
The adhesive sheet includes a base sheet and an adhesive layer provided on one surface of the base sheet,
By forming a cut in the base sheet or the base sheet and the adhesive layer, one end of which reaches the outer edge of the base sheet, while the other end is located in the plane of the base sheet, both sides sandwiching the cut A process of dividing;
After forming the notch, attaching a reinforcing tape to the other end side region of the notch,
A step of feeding out the peeling tape;
A step of pasting the drawn-off peeling tape to the adhesive sheet;
The sheet peeling method characterized by performing the process of peeling an adhesive sheet by making a to-be-adhered body and the peeling tape move relatively.

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