JP5564409B2 - Sheet peeling apparatus and peeling method - Google Patents

Description

  The present invention relates to a sheet peeling apparatus and a peeling method. More specifically, the present invention relates to a sheet peeling method in which a peeling tape is bonded to an adhesive sheet affixed to an adherend, and the adhesive sheet can be peeled through the peeling tape. The present invention relates to an apparatus and a peeling method.

  In the process of processing a semiconductor wafer (hereinafter sometimes simply referred to as “wafer”), a protective adhesive sheet is attached to the circuit surface of the wafer, and various processes such as backside grinding are performed. After being mounted on the ring frame, the adhesive sheet is peeled off before dicing. An example of such an adhesive sheet peeling apparatus is disclosed in Patent Document 1. In the same document, the step of peeling the adhesive sheet from the wafer is performed by applying the peeling tape along the outer edge of the adhesive sheet with a pressing head and then moving the peeling tape relative to the wafer.

JP 2007-36111 A

  However, in patent document 1, the area | region to which peeling force is first provided with the peeling tape in an adhesive sheet becomes a sticking area | region of the peeling tape along the outer edge of an adhesive sheet. Therefore, the initial width of peeling is a predetermined width (adhesion width of the peeling tape to the adhesive sheet), which is performed over a wide range at a time, and the peeling of the adhesive sheet becomes very heavy and the peeling tape comes off from the adhesive sheet. Inconveniences such as peeling failure or peeling of the adhesive sheet itself.

[Object of invention]
The objective of this invention is providing the sheet peeling apparatus and peeling method which can avoid the peeling defect in the initial stage which peels an adhesive sheet.

In order to achieve the above object, the present invention is a sheet peeling apparatus for peeling an adhesive sheet attached to an adherend surface of an adherend through a peeling tape,
Feeding means for feeding out the peeling tape, sticking means for sticking one end side of the peeling tape to the adhesive sheet, and the adherend and the peeling tape can be moved relative to each other to peel the adhesive sheet from the adherend. Equipped with various moving means,
A pre-peeling means for forming a pre-peel region on the adhesive sheet from the intersection of the side edge of the peel tape and the outer edge of the adhesive sheet by twisting the peeling tape with the one end side affixed to the adhesive sheet , Is adopted.

  In the present invention, the preliminary peeling means is provided such that the preliminary peeling region can be formed such that the width direction of the peeling tape at the preliminary peeling region forming position is inclined with respect to the adherend surface. It is preferable to adopt such a configuration.

Further, it is preferable that the moving means is provided so as to be relatively movable during the peeling of the adhesive sheet while the preliminary peeling means is maintained in a state where the width direction of the peeling tape is inclined with respect to the adherend surface. Is adopted.

Furthermore, the peeling method of the present invention is a sheet peeling method for peeling the adhesive sheet attached to the adherend surface of the adherend through a peeling tape,
A step of feeding out the peeling tape;
Attaching one end of a peeling tape to the adhesive sheet;
A step of performing preliminary peeling by forming a preliminary peeling region on the adhesive sheet from the intersection of the side edge of the peeling tape and the outer edge of the adhesive sheet by twisting the peeling tape with the one end side stuck to the adhesive sheet When,
A step of relatively moving the supporting means and the peeling tape to peel the adhesive sheet from the adherend.

  According to the present invention, in order to prepare for peeling of the adhesive sheet, the preliminary peeling area is formed on the adhesive sheet by the preliminary peeling means so that the initial peeling is not performed over a wide range at a time. Is extremely heavy, and it is possible to avoid a peeling failure in which the peeling tape is detached from the adhesive sheet at the initial stage of peeling the adhesive sheet or the peeling tape itself is cut. In addition, since the preliminary peeling area starts to be formed from the point where the side edge of the peeling tape and the outer edge of the adhesive sheet intersect, it is prevented that the preliminary peeling area is formed in a wide range at the same time. The same peeling failure as described above can be avoided.

The schematic front view of the sheet peeling apparatus which concerns on embodiment. (A) And (B) is explanatory drawing of the operation | movement which forms a preliminary | backup peeling area | region in an adhesive sheet. (A)-(C) is sticking operation explanatory drawing of the peeling tape, (D) is peeling operation explanatory drawing of an adhesive sheet. Explanatory drawing of the operation | movement which forms a preliminary | backup peeling area | region in an adhesive sheet.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  1 to 4, the sheet peeling apparatus 10 includes a support unit 11 that holds a wafer W as an adherend on which an adhesive sheet S is attached to a circuit surface (upper surface in FIG. 1) serving as an adherend surface, The feeding means 12 for feeding out the peeling tape PT, the sticking means 13 for sticking the peeling tape PT to the outer edge side of the adhesive sheet S, and the peeling tape PT stuck to the adhesive sheet S and the support means 11 are relatively moved. By moving the moving means 15 and the peeling tape PT, one end of which is affixed to the adhesive sheet S, from the crossing position P between the side edge PT2 of the peeling tape PT and the outer edge S1 of the adhesive sheet S to the adhesive sheet S A preliminary peeling means 16 for forming the preliminary peeling area S2 and a control means 17 for controlling the operations of the means 11 to 16 are provided. The peeling tape PT employs a heat-sensitive adhesive tape. Further, the adhesive sheet S in the present embodiment has an adhesive layer on one surface of the base material sheet, and is adhered to the wafer W via this adhesive layer.

  The support means 11 is disposed inside the opening of the ring frame RF, and is integrated with the ring frame RF from the opposite surface (lower surface in FIG. 1) side of the circuit surface via the dicing sheet DS, and is attached to the circuit surface. It consists of a table that sucks and holds the wafer W to which S is attached on the upper surface in FIG.

  The feeding means 12 includes a support shaft 18 that supports a peeling tape PT that is supported and wound by a frame (not shown) so that the peeling tape PT can be fed, a driving roller 20 that can rotate via a motor M1 as a driving device, A pinch roller 21 that sandwiches the peeling tape PT with the drive roller 20, a plate-shaped guide member 23 that supports the peeling tape PT from below in FIG. 1, and the peeling tape PT is sandwiched between the guide member 23. A rotatable press roller 25 and an elevating cylinder 26 as a driving device for elevating and lowering the press roller 25 are provided. The guide member 23 is provided so as to be movable in the left-right direction in FIG. 1 via a cylinder 27 as a drive device, and as shown in FIG. 3A, the lead end of the peeling tape PT sandwiched between press rollers 25. The region can be guided to a position where it can be gripped by a chuck 47 described later.

  The affixing means 13 includes a linear motion motor 49 as a drive device, and a pressing head 50 having a heater 50 </ b> A provided by the linear motion motor 49 so as to advance and retreat. The affixing means 13 adheres the peeling tape PT to the adhesive sheet S by pressing and heating the peeling tape PT fed to the upper surface side of the adhesive sheet S with the pressing head 50 by a chuck 47 described later. It has become. On the left side of the sticking means 13 in FIG. 1, the cutter blade 53, the tape receiving plate 54 having a recess provided below the cutter blade 53, and the cutter blade 53 are moved in the direction orthogonal to the paper surface in FIG. A tape cutting means 52 comprising a cutting cylinder 55 as a driving device to be driven and an upper and lower cylinder 56 as a driving device is provided.

  The moving means 15 is a linear motion motor 44 as a drive device for moving the support means 11 in the left-right direction in FIG. 1 and its slider 45, and a drive device capable of gripping the peeling tape PT with a gripping member 47A. A chuck 47 and an articulated robot 48 as a driving device for supporting the chuck 47 are provided. The articulated robot 48 can be exemplified by a six-axis robot, for example, and is configured to be able to move the chuck 47 in any position and any direction within the work area.

  The preliminary peeling means 16 comprises an articulated robot 48 that constitutes the moving means 15. Accordingly, the articulated robot 48 rotates the chuck 47 that holds the peeling tape PT in the direction of the arrow in FIGS. 2A and 2B, so that the width direction PT 1 of the peeling tape PT is relative to the upper surface of the wafer W. It can be in a tilted state. Further, the moving means 15 moves the chuck 47 and the supporting means 11 in the horizontal direction in FIG. 1 while maintaining the state in which the articulated robot 48 tilts the width direction PT1 of the peeling tape PT with respect to the upper surface of the wafer W. It becomes possible.

  The control means 17 can be constituted by a sequencer, a personal computer or the like. The control means 17 is connected to an input means (not shown) composed of an operation panel and the like, and the operating conditions and data of each of the driving devices can be input by this input means. Further, the control means 17 has a function of determining conditions such as an operation direction, an operation amount, and an operation speed of each driving device and controlling them.

  Next, the peeling method of the adhesive sheet S by the sheet peeling apparatus 10 will be described.

  First, after the peeling tape PT is pulled out from the support shaft 18 and passed between the drive roller 20 and the pinch roller 21, the lead end side of the peeling tape PT protrudes from the tip of the guide member 23, and the press The peeling tape PT is sandwiched between the roller 25 and the guide member 23.

  Then, when the wafer W, which is integrated with the ring frame RF on the upper surface of the support means 11 and has the adhesive sheet S attached to the circuit surface, is supported via a conveying means (not shown), the adhesive sheet S in FIG. The linear motor 44 moves the support means 11 so that the right outer edge position stops just below the pressing head 50.

  Next, as shown in FIG. 3A, the guide member 23 is advanced in the right direction in the drawing via the cylinder 27, and at the same time, the motor M1 is operated to rotate the driving roller 20 to release the peeling tape PT. To pay out. Thereby, the guide member 23 and the lead end side of the peeling tape PT are positioned between the gripping members 47 </ b> A of the chuck 47. When the press roller 25 is retracted upward and the guide member 23 is retracted, the peeling tape PT is left between the gripping members 47A and is gripped by the operation of the chuck 47. Thereafter, the multi-joint robot 48 moves the chuck 47 to the position indicated by the two-dot chain line in FIG. 3A to pull out the peeling tape PT, and peels the peeling tape so as to face the adhesive sheet S below the pressing head 50. The tape PT is positioned.

  Next, as shown in FIG. 3B, when the pressing head 50 is moved downward by the linear motion motor 49, the peeling tape PT is pressed down and comes into contact with the adhesive sheet S, and the peeling tape PT becomes a heater. It is heated by 50A and adheres to the adhesive sheet S. Thereafter, the peeling tape PT is sandwiched between the press roller 25 and the guide member 23, and the cylinders 55 and 56 are operated to cut the peeling tape PT with the cutter blade 53 on the tape receiving plate 54 (see FIG. 3C). ). Thereby, one end side of the peeling tape PT is affixed to the adhesive sheet S, and a state in which the other end side of the peeling tape PT is held by the chuck 47 is formed.

  After cutting off the peeling tape PT, the articulated robot 48 rotates the chuck 47 in the direction of the arrow as shown in FIG. 2, FIG. 3C, and FIG. The chuck 47 is rotationally moved in the direction in which the other end side of the tape PT rotates in a plane perpendicular to the axis from the one end side to the other end side of the peeling tape PT. That is, the articulated robot 48 twists the peeling tape PT to form the preliminary peeling region S2 on the adhesive sheet S from the intersection position P between the side edge PT2 of the peeling tape PT and the outer edge S1 of the adhesive sheet S. Perform preliminary stripping. As a result, the width direction PT1 of the peeling tape PT positioned on the outer edge S1 of the adhesive sheet S is inclined with respect to the adherend surface of the wafer W1, and the preliminary peeling region S2 is formed from the intersection position P. FIG. As shown by the lattice pattern, a preliminary peeling region S2 having a substantially triangular shape in plan view is formed from the intersection position P toward the surface of the adhesive sheet S. As described above, since the preliminary peeling region S2 starts to be formed from the point where the side edge PT2 of the peeling tape PT and the outer edge S1 of the adhesive sheet S intersect with each other, in the formation of the preliminary peeling region S2, the peeling is performed. It is possible to prevent a wide range from being performed at once.

  After the preliminary peeling region S2 is formed from the side edge PT2 side of the peeling tape PT, the chuck 47 is rotated in the opposite direction by the articulated robot 48, and also from the other side edge PT2 side of the peeling tape PT. Similarly to the above, the preliminary peeling region S2 is formed on the adhesive sheet S. As a result, an adhesive region S3 having a V-shape in plan view indicated by the hatched pattern in the figure is formed between the preliminary peeling regions S2 formed at two locations indicated by the lattice pattern in FIG. Thereafter, the orientation of the chuck 47 and the release sheet PT is returned to the state immediately after cutting the release tape PT, and then the chuck 47 is moved leftward and the support means 11 is moved rightward as shown in FIG. The adhesive sheet S is peeled from the wafer W by being moved. In the initial stage of peeling, the two preliminary peeling regions S2 have already been peeled, so that almost no force is required for peeling. Therefore, it becomes possible to perform peeling from the vertex V1 of the V-shape of the adhesive region S3, that is, from the point, and it is possible to prevent the initial region of the peeling from being formed in a wide range at one time. It is very heavy, and it is possible to avoid a peeling failure in which the peeling tape PT is detached from the adhesive sheet S in the initial stage of peeling the adhesive sheet S or the peeling tape PT itself is cut.

  It should be noted that after the preliminary peeling region S2 is formed in at least one of the two intersecting positions P, adhesion is performed while maintaining the state where the width direction PT1 of the peeling tape PT is inclined with respect to the adherend surface of the wafer W1. The chuck 47 may be moved leftward in FIG. 3 in order to peel the sheet S.

  When the peeling of the adhesive sheet S is finished, the wafer W is transported to the next process by a transporting unit (not shown), and the adhesive sheet S and the peeling tape PT attached thereto are collected by a collecting unit (not shown). Then, after the support unit 11 and the chuck 47 are returned to the initial positions, the same operation as described above is repeated.

  Therefore, according to such an embodiment, it is possible to form the preliminary peeling region S2 on the adhesive sheet S by the articulated robot 48 so that the initial peeling is not performed at once in a wide range in preparation for the peeling of the adhesive sheet S. it can. As a result, the force applied to the peeling tape PT at the beginning of the peeling of the adhesive sheet S can be reduced, and the peeling tape PT is better prevented from being cut off or detached from the adhesive sheet S. Thus, the adhesive sheet S can be stably peeled off.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.
Therefore, the description limited to the shape disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded one part or all part is included in this invention.

For example, the adherend in the present invention is not limited to a semiconductor wafer, and other adherends such as a glass plate, a steel plate, or a resin plate can also be targeted. It may be a semiconductor wafer or a compound semiconductor wafer.
Furthermore, the peeling tape PT may employ a pressure-sensitive adhesive tape in addition to the heat-sensitive adhesive tape.
Moreover, in the said embodiment, it forms so that the adhesion area | region S3 which makes V shape in planar view may be formed between the preliminary | backup peeling area | regions S2 formed in two places, and the adhesive sheet S may be peeled from the vertex V1 of the said V shape. However, even if the V-shaped adhesion area S3 is not formed by the preliminary peeling area S2, it is sufficient if the beginning of peeling is equal to or smaller than the bonding width of the peeling tape PT to the adhesive sheet S.

  Furthermore, as for the operation when peeling the adhesive sheet S, the operation of the chuck 47 may be stopped, the support means 11 may be moved, and the operation of the support means 11 may be performed as long as the peeling can be performed as in the above embodiment. It may be controlled by the control means 17 to stop and move the chuck 47.

  The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single-axis robot, and an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 10 Sheet peeling apparatus 12 Feeding means 13 Pasting means 15 Moving means 16 Preliminary peeling means PT peeling tape PT2 side edge S Adhesive sheet S1 Outer edge W Semiconductor wafer (adhered body)

Claims (2)

A sheet peeling device for peeling an adhesive sheet attached to an adherend surface of an adherend through a peeling tape,
Feeding means for feeding out the peeling tape, sticking means for sticking one end side of the peeling tape to the adhesive sheet, and the adherend and the peeling tape can be moved relative to each other to peel the adhesive sheet from the adherend. Equipped with various moving means,
A pre-peeling means for forming a pre-peel region on the adhesive sheet from the intersection of the side edge of the peel tape and the outer edge of the adhesive sheet by twisting the peeling tape with the one end side affixed to the adhesive sheet The sheet peeling apparatus characterized by the above-mentioned. A sheet peeling method for peeling an adhesive sheet attached to an adherend surface of an adherend through a peeling tape,
A step of feeding out the peeling tape;
Attaching one end of a peeling tape to the adhesive sheet;
A step of performing preliminary peeling by forming a preliminary peeling region on the adhesive sheet from the intersection of the side edge of the peeling tape and the outer edge of the adhesive sheet by twisting the peeling tape with the one end side stuck to the adhesive sheet When,
And a step of separating the adhesive sheet from the adherend by relatively moving the supporting means and the peeling tape.

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