JP5038263B2 - Sheet peeling apparatus and peeling method - Google Patents

Description

  The present invention relates to a sheet peeling apparatus and a peeling method, and more particularly to a sheet peeling apparatus and a peeling method for peeling an adhesive sheet affixed to an adherend such as a semiconductor wafer via a peeling tape.

A semiconductor wafer (hereinafter simply referred to as a “wafer”) has a protective adhesive sheet attached to its circuit surface, and the adhesive sheet is peeled off after various processes such as back grinding. An example of such an adhesive sheet peeling apparatus is disclosed in Patent Document 1. In the same document, the process of peeling the adhesive sheet from the wafer is performed by winding the peeling tape and the adhesive sheet while affixing the peeling tape to the adhesive sheet and then relatively moving the peeling tape and the wafer. Is called.
JP 2005-175253 A

  By the way, recently, since the diameter of the wafer tends to increase, the size of the adhesive sheet increases accordingly. For this reason, when peeling an adhesive sheet, a big peeling force is needed and the force required for the said relative movement will also increase. Therefore, when peeling is performed as in Patent Document 1, it is necessary to widen the width of the peeling tape so that the peeling tape has durability against the peeling force. For this reason, there is an inconvenience that the running cost of the peeling tape corresponding to the wide width increases. Here, if multiple types of stripping tapes with different widths are prepared and the stripping tape is replaced according to the change in the wafer diameter, the cost of the stripping tape can be suppressed to some extent, but the versatility is only reduced. In addition, the work load required for replacement increases.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and the purpose thereof is a sheet that can improve versatility for various wafer diameters, and can reduce cost and work load. It is providing the peeling apparatus and the peeling method.

In order to achieve the above object, the present invention includes a supporting means for supporting an adherend to which an adhesive sheet is affixed, and a first and a second means provided to be movable relative to the supporting means while holding the adhesive sheet. A second peeling head; and a control means for controlling operations of the support means, the first peeling head, and the second peeling head,
The control means adopts a configuration in which the adhesive sheet is peeled from the adherend by alternately moving the first peeling head and the second peeling head relative to the support means.

  Further, a configuration may be adopted in which, while any one of the first and second peeling heads performs a peeling operation, the other peeling heads perform a preliminary peeling operation.

Furthermore, the peeling method of the present invention includes a step of supporting the adherend to which the adhesive sheet is attached via a supporting means,
Holding the adhesive sheet with the first and second peeling heads;
A method is employed in which the first peeling head and the second peeling head are alternately moved relative to the supporting means to peel the adhesive sheet from the adherend.

  Furthermore, it is preferable to adopt a method in which one of the first and second peeling heads performs a preliminary peeling operation while any one of the peeling heads performs the peeling operation.

  According to the present invention, the adhesive sheet is peeled off from the adherend by the relative movement of the first and second peeling heads alternately with respect to the support means. Can be shared. Thereby, it is possible to reduce the force required for peeling in the respective peeling heads and to withstand peeling without increasing the width of the peeling tape even when the diameter of the wafer is increased. As a result, while reducing the running cost of the peeling tape, the number of types of peeling tapes with different widths can be reduced as much as possible, not only the versatility can be improved, but also the work load such as replacement can be omitted. It becomes.

Moreover, it is suppressed that the adhesive of the said adhesive sheet remains in the adherend after the adhesive sheet was peeled off by performing the preliminary | backup peeling operation | movement by the 1st and 2nd peeling head. can do.
In addition, that a peeling head hold | maintains an adhesive sheet includes the case where an adhesive sheet is indirectly hold | maintained through the tape for peeling.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In the present specification and claims, the “peeling operation” means an operation of relatively moving the first or second peeling head and the support means in order to enlarge the peeling area of the adhesive sheet. The “peeling operation” means an operation that does not stop the relative movement.

  FIG. 1 is a schematic front view of a sheet peeling apparatus according to the embodiment. In this figure, a sheet peeling apparatus 10 is for strip-like peeling bonded to a table 11 as a supporting means for adsorbing and supporting a wafer W on its upper surface, and a protective adhesive sheet S affixed to the upper surface of the wafer W. The feeding means 12 for feeding out the tape PT, the cutting means 14 provided so as to be able to cut the peeling tape PT, the pressing means 15 for pressing the peeling tape PT against the adhesive sheet S, and the peeling tape PT. The first peeling head 17 capable of holding the adhesive sheet S, the second peeling head 18 provided on each of the left and right sides of the first peeling head 17 in FIG. 2, the table 11 and the first peeling head. 17 and a control means 20 for controlling the operation of the second peeling head 18. Here, the wafer W is integrated with the ring frame RF via the dicing tape DT.

  The table 11 has an upper surface formed as a suction surface for sucking the dicing tape DT. The table 11 is movable in the left-right direction in FIG. 1 via a linear motor 19 and a slider 19A provided in the lower part thereof.

  The feeding means 12 is rotatably supported by the frame F and supports a support shaft 21 that supports the wound peeling tape PT, a driving roller 22 that is rotatably provided via a motor M1, and the driving roller. And a pinch roller 23 that sandwiches the peeling tape PT between them. The frame F is provided so as to be movable in the vertical direction in FIG.

  The cutting means 14 includes a cutter blade 26, a cutting cylinder 27 that moves the cutter blade 26 in a direction orthogonal to the paper surface in FIG. 1, and a vertical cylinder 28 that moves the cutting cylinder 27 in the vertical direction in FIG. It is configured with. A tape guide plate 30 having a concave portion on the upper surface is provided below the cutter blade 26. The tape guide plate 30 is provided by a bush 31 so as to be movable in the left-right direction in FIG. 1 via a shaft 32, and is always urged to the left in FIG. 1 by a coil spring 33 provided on the outer peripheral side of the shaft 32. ing.

  The pressing means 15 includes a linear motion motor 35 and a pressure head 36 having a heater 36 </ b> A provided by the linear motion motor 35 so as to advance and retreat in the vertical direction. The pressing means 15 welds the peeling tape PT to the adhesive sheet S by pressing and heating the peeling tape PT fed to the upper surface side of the adhesive sheet S with the pressing head 36 by the first peeling head 17. And it is comprised so that both may be connected.

  The first peeling head 17 is constituted by a chuck capable of gripping the lead end region of the peeling tape PT. The first peeling head 17 is provided so as to be movable in the left-right direction in FIG. 1 via the linear motor 38, and is thereby movable relative to the table 11.

  Each of the second peeling heads 18 is constituted by a chuck capable of gripping the adhesive sheet S, and is provided so as to be movable in the left-right direction in FIG. 1 via the linear motor 40, thereby being movable relative to the table 11. It has become.

  The control means 20 is constituted by a personal computer, a sequencer or the like, and controls the overall operation of the sheet peeling apparatus 10. Accordingly, the first peeling head 17 and the second peeling head 18 can be alternately moved relative to the table 11 via the linear motor 19 and the linear motion motors 38 and 40.

  Next, the peeling method of the adhesive sheet S by the sheet peeling apparatus 10 will be described.

  First, it is assumed that the peeling tape PT pulled out from the support shaft 21 is cut by the cutter blade 26 on the tape guide plate 30 through the drive roller 22 and the pinch roller 23. Next, the adhesive sheet S is attached via a conveying means (not shown), and the wafer W integrated with the ring frame RF is attracted and held on the upper surface of the table 11 via the dicing tape DT.

  Next, the table 11 is conveyed via the linear motor 19, and the left end portion in FIG. 1 of the adhesive sheet S serving as the attachment position of the peeling tape PT is connected to the pressing head 36 via the pulse output from the linear motor 19. When it is confirmed that the position has reached directly below, the movement of the table 11 stops and enters a standby state.

  Next, the first peeling head 17 moves the tape guide plate 30 to the right via the linear motion motor 38 to grip the peeling tape PT, and moves to the left in the gripped state to move to the left. The tape PT is pulled out below the pressing head 36. Then, as shown in FIG. 1, the pressing head 36 heated by the heater 36 </ b> A is moved downward by the linear motion motor 35, and the peeling tape PT is pressed and applied to the adhesive sheet S while being heated. In this state, the peeling tape PT is cut by the cutter blade 26 on the tape guide plate 30 by operating the cylinders 27 and 28. Next, the linear motor 24 is operated to move the frame F upward. Thereafter, as shown in FIG. 3, through the linear motor 19 and the linear motor 19, the peeling tape PT attached to the adhesive sheet S and the table 11 are moved relative to each other in the horizontal direction in FIG. The first peeling head 17 and the table 11 are moved. Thereby, the adhesive sheet S is folded back on the wafer W, and the adhesive sheet S is peeled off from the outer edge on the left side in FIG. During this peeling operation, the table 11 is extremely low in speed so that the relative movement does not stop even when the movement of the first and second peeling heads 17 and 18 is stopped. The peeling heads 17 and 18 continue to move at a speed about one tenth of the moving speed, so that one of the first and second peeling heads 17 and 18 performs the peeling operation. During the process, the other peeling heads perform a preliminary peeling operation.

  As shown in FIG. 3, when the adhesive sheet S is peeled off by a predetermined amount, the movement of the first peeling head 17 is stopped. And after moving each 2nd peeling head 18 toward the peeled adhesive sheet S via the linear motor 40, as shown in FIG. Hold it. From this state, as shown in FIG. 4, the second peeling head 18 on the right side in the figure is moved toward the lower side in the figure via the peeling operation, that is, the linear motor 40. As a result, the adhesive sheet S in the area A1 which is the periphery gripped by the second peeling head 18 on the right side is peeled from the wafer W.

  Next, after the movement of the second peeling head 18 on the right side is stopped, as shown in FIG. 5, the second peeling head 18 on the left side in FIG. Similarly to the case, the adhesive sheet S in the region A2 is peeled off from the wafer W.

  Next, after the movement of the second peeling head 18 on the left side is stopped, the first peeling head 17 is peeled off via the linear motor 38 to peel the adhesive sheet S in the region A3 from the wafer W ( (See FIG. 6). Thereafter, the operation of the first peeling head 17 is switched to the preliminary peeling operation before the folding position of the region A3 and the folding positions of the regions A1 and A2 are located on the same straight line.

Then, as described above, the cycle is repeated with one cycle of alternately performing the second peeling head 18 on the right side, the second peeling head 18 on the left side, and the first peeling head 17 in this order. Thus, the peeling heads 17 and 18 are moved via the linear motors 38 and 40, respectively.
When the peeling of the adhesive sheet S is completed, the wafer W is transported to the next process by a transporting unit (not shown), and the peeling tape PT is collected by a collecting unit (not shown), and then the frame F and the first and second peeling heads 17. , 18 return to the initial position, the same operation as described above is repeated.

Therefore, according to such embodiment, it can peel by sharing the area | regions A1-A3 from which the adhesive sheet S peels by the 1st and 2nd peeling heads 17 and 18. FIG. Thereby, it is possible to reduce the load generated on each of the peeling heads 17 and 18 during peeling, and it is possible to reduce the pulling force on the peeling tape PT held by the first peeling head 17. . As a result, even if the adhesive force of the adhesive sheet S increases due to the increase in the diameter of the wafer W, it becomes possible to cope without increasing the width of the peeling tape PT. Reduction can be achieved. In addition, the peeling tape PT having a small width can be used for wafers W having various diameters, and versatility can be improved.
Further, since the table 11 performs the preliminary peeling operation by maintaining the relative movement during the peeling operation, it becomes possible to prevent the adhesive from remaining in a streak form on the wafer W from which the adhesive sheet S has been peeled off. .

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.
Therefore, the description limited to the shape disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded one part or all part is included in this invention.

  For example, the peeling tape PT is further affixed to both the left and right sides of the peeling tape PT shown in FIG. 2, and the second peeling head 18 holds the adhesive sheet S via the peeling tape PT. Also good.

  Further, the adherend in the present invention is not limited to a semiconductor wafer, and other adherends such as a glass plate, a steel plate, or a resin plate can also be targeted. It may be a wafer or a compound wafer.

  Furthermore, the linear motion motors 24, 35, 38, 40 may be replaced with displacement means such as an air cylinder or a hydraulic cylinder.

  Further, the peeling operation and the preliminary peeling operation of the left and right second peeling heads 18 may be performed at the same timing. According to this, compared with the case where peeling operation | movement etc. are performed at different timing like the said embodiment, the time required for peeling of the adhesive sheet S can be shortened.

  Further, the number of the second peeling heads 18 is not limited to the number as long as the peeling operation can be alternately repeated with the first peeling head, and may be one or three or more.

  Further, at least one of the first and second peeling heads 17 and 18 and the table 11 may be configured to move relative to each other.

The schematic front view of the sheet peeling apparatus which concerns on embodiment. The top view which abbreviate | omitted the one part structure of FIG. The schematic front view of the peeling initial stage of an adhesive sheet. FIG. 4 is an explanatory plan view of a stage where the peeling of the adhesive sheet is advanced from FIG. 3. FIG. 5 is an explanatory plan view of a stage where the peeling of the adhesive sheet is advanced from FIG. 4. FIG. 6 is an explanatory plan view of a stage where the peeling of the adhesive sheet is advanced from FIG. 5.

Explanation of symbols

10 Sheet peeling device 11 Table (support means)
17 First Peeling Head 18 Second Peeling Head 20 Control Unit PT Peeling Tape S Adhesive Sheet W Semiconductor Wafer (Substrate)

Claims (2)

A support means for supporting an adherend to which an adhesive sheet is affixed; first and second peeling heads that are provided to be movable relative to the support means while holding the adhesive sheet; and the support means; Control means for controlling the operation of the first peeling head and the second peeling head;
The control means peels the adhesive sheet from the adherend by alternately moving the first peeling head and the second peeling head relative to the support means. . A step of supporting the adherend to which the adhesive sheet is affixed via a support means;
Holding the adhesive sheet with the first and second peeling heads;
And a step of peeling the adhesive sheet from the adherend by alternately moving the first peeling head and the second peeling head relative to the support means.

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